디스플레이 장비 및 진공패키징 기술 - cbucc. · PDF filefpd equip.fpd equip. 디스플레이 장비 및 진공패키징 기술 권 상 직 경원대학교 전기전자공학부

FPD EQUIP.FPD EQUIP.FPD EQUIP.
2002. 4. 4.
2002. 4. 4.

1
DISPLAY CLASS
LCD
Non Emissive Display
Light Valve
PDP
Electronic Information Displays
CRT Flat Panel Display Projection
EmissiveDisplay
Cathode Ray Tube
VFD ELD LEDFED OLED ECD DMD
DC Type AC Type Hybrid Type

2
TFT-LCD panel (, )
LCD Panel
TFT
PCB
TCP
LDI
Backlight UnitChassis
DISPLAY

3
A C P D P C ell
Barrier Rib
(Front Glass Substrate)
Sustain Electrode
Dielectric LayerProtection Layer(MgO)
Dielectric Layer
Bus Electrode
Under Layer
Phosphor(R,G,B) Address Electrode
(Back Glass Substrate)
Plasma
UVPhosphor(R,G,B)
Front Glass Substrate[*]
Visible Light Address Electrode
Back Glass Substrate
Sustain Electrode
Dielectric Layer
Protection Layer(MgO)
Dielectric Layer
Visible Light
Bus Electrode
Under Layer
Barrier rib
[*] : 90o

4
Flat-panel, M atrix-addressable FE D
Holland et al. (1987)
SpacerTransparentConductor(+500V)
Phosphor Dot ElectronsEmitter
(non-conductive)Baseplate
Insulator
Faceplate

5
OLED
C ETL
A
R
EML
G B
HTL
S
Barium Oxide
N2
Anode(ITO) Substrate
CathodeSealing canister
Organic Layer
Adhesives

6
TFT-Array Photolithography Etching Assembly
DISPLAY

7
(Cleaning)
Brush Scrubbing
Water Jet Spray ,
PRS-2000(PR Stripper), IPA
HF CVD
DI Water
Rinse
air knife spin dry
Dry ,
,
Plasma
Dry

8
Etching() Dry Etching Wet Etching
Plasma Etching
Reactive Ion Etching
Etching slow fast
Uniformity
a-Si, SiN, Ta Al, Mo, Cr, ITO
Etchant HCL, SF6, CF4 8.3
Etch Profile Non-isotropic Isotropic
Taper Etch
Etching Process
Al, Mo H3PO4 + HNO3 + (CH3COOH) 30~50
Cr HF + HNO3
ITO HCL + HNO3 + FeCl3 30~50

9
* ADI: after development inspection* ACI: after cleaning inspection*AOI: Automated Optical Inspection
I-V , 4-Point Probe
, Ellipsometer, Nanospec,
4-Point Probe
Pattern
Pattern , , CD, SEM
-Step
Pattern AOI( pattern )
TFT , Cs,
DC Tester System,
Open-short test

10
Alignment Layer Print
Alignment Layer Print
(T

11
Rubbing
Rubbing Strength (R.S.) = N l {1 + 2 r (R/60) / V}
N: Rubbing l : Rubbing Depth(mm)R: Roller r.p.m.r: Roller (mm)V: Rable (mm/sec)
Stage
Roller
Rubbing (CF )
Rubbing (TFT-Array )
6 Oclock

12
(b) (a)
Color Filter Color Filter
Spacer
Solvent
N2 Gas
Spacer Spray

13
Seal Print (Screen MASK )
TFT-Array
Screen Mask
TFT-Array
Seal
Sealant

14
VacuumPump
V
V
N2
LCD Cell
Chamber
N2

15
Spacer
Short
End Seal(uv sealant)
Seal
Seal
Seal
Seal & Cell-gap Control

16
inverter
Lamp
AG/AR coating
TAC:
TAC:
TFT-LCD backlight
Back Light Unit
Conventional CCFL

17
E dge lighting type
24 C C FL optical elem ents
light guide plate
diffusers
collim ators
reflectors
D irect lighting type
8 (20 ) C C FLs optical elem ents
LG P edge lighting type

18
Flat Fluorescent Lam p(FFL)
Flat Lamp

19
C old C athode Flat Lam p
spacer
Diamond film(Diamond FEAs)
Anode (ITO)
Mo cathode line (rows)
Mo gate line (columns)
ANODE PLATE
electrons
Phosphordot
CATHODE PLATE
Conductive ball
Cathode addressing line (ITO, row)
ACF
ITO
Phosphor layers
Glass
Diamond FEA
Cathode

20
A C P D P Front GlassFront Glass
ITO ElectrodesITO Electrodes
BUS ElectrodesBUS Electrodes Reflection LayerReflection Layer
Rear GlassRear Glass
Address ElectrodesAddress Electrodes
Seal : 150mSeal : 150m
Gas FillingGas Filling
Tip-offTip-off
Insulation LayerInsulation Layer
MgO Protection LayerMgO Protection Layer
Barier RibsBarier Ribs
Phosphor ScreenPhosphor Screen
PumpingPumping{TMPTMP
GAS
Tip-Off UnitPDPPanel
PDP

21
squeeze
screen
suspaste
clearanceattack angle
pressurespueezing velocity
screen

22
(B arrier)

23
Patterning of Transparent Anode Metals
Formation of Emissive Layers(Charge Transport Layers)
Deposition of Cathode Metals
Patterning of Cathode Metals
Encapsulation
Connection of Driving circuit with display panel
Treatment(Cleaning) of ITO/Substrate
OLED

24
Organics : Vacuum deposition
Thin Film Formation
Maskstockchamber
Mask change/alignmentchamber
Loading chamber
EV1 EV2
EV3 Unload chamber
1. In-line Type - Easy to install more chamber - Easy maintenance
2. Cluster Type - Easy back and forth process - Parallel process

25
Wet Cleaner Stripper PR Spin Coater PR CoatingDry Etcher SPUTTER PECVD Photo Aligner LCDGlass Cutter Screen Printer PDPVacuum Sealing PDP, FED
ELD In-Line OLED
DISPLAY

26
-step , Nanospec. Ellipsometer 4-Point Probe HallMeasurement ,
UV-Spectrophotometer ,
AFM XRD

27
,,PL PDPCL CRT, FED, VFD
EL OLEDAutomatic ProberSystem All FPD
DC Test System
Open-Short Tester CD SEM AutomaticInspection System
LCDLaser Repair LCD
EMI DP

28
: $400/ ( : < $100/) : 15% ( : > 50%)
40~60 HDTV
5~15
PDPPDP / FEDFED2005 65 / 27 : 40%
: 450 500C
: 15 24 Poor Throughput Poor Vacuum Level (tip-off) outgassing
MgO
MgO CrackGlass

29
FE D
: (10 torr) : R , G , B
Front GlassFront Glass
ITO ITO
FEA FEA
: 200m : 200m
Seal-offSeal-off
FED

30
Too Long Time !!(24 hours)
Front GlassFront Glass
ITO ITO
BUS BUS
Address Address
: 150m : 150m
Gas FillingGas Filling
Tip-offTip-off
MgO MgO
{
GASPURIFICATION
400C
300C
FRIT CYCLEin AIR / N2
TIPOFF
AGING
MOUNTING
TE
MP.
TIMEACTIVATIONINSITU -PUMPING
GASINTRO-DUCTION
BAKING (MgOActivation)
PDP / cycle
TMPTMP
GAS
Tip-Off UnitPDP/FEDPanel
PDP

31
Thus,
Pressure Ratio Conductance RatioP4/P2 C1/Ctot C1/C3 = 9.410-3/3.010-6 = 3.1103
This means that, even though P2 will be 1.010-6 torr, P4 will be at least 3.010-3 torr.
40 (1,016mm)
C1 C2 P3
P4P2
P1
C3
35 (903mm)20 (508mm
)

32
He/Ne/Xe
Differential pumping
pumpingSealing
He/Ne/Xe
Differential pumping
Gas Fill / Hole-off
- 10-7 torr 350C 5
PDP/FED : 350C
: 3
PDP/FED : 350C
: 3
Frit No bubble & No crackSoda-lime Compatible
Frit No bubble & No crackSoda-lime Compatible
Flat Disk NEG
Flat Disk NEG
PDP Tubeless / Local Gas Filling
2
PDP Tubeless / Local Gas Filling
2
SOLUTIONS

33
(a) S ide-V iew and (b) Front-V iew
a
bDate : 2000. 4. 19.First for the World

34
Compariaion of the Sealing Temperature Cycles
102 4 6 8 20
400
300
200
100
500Conv

Documents

디스플레이 장비 및 진공패키징 기술 - cbucc. · PDF filefpd equip.fpd equip. 디스플레이 장비 및 진공패키징 기술 권 상 직 경원대학교 전기전자공학부