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From Technologies to Market
Status of the Power Electronics Industry
2017
SampleJuly 2017
Sour
ce: G
reen
Tec
hMed
ia
2
REPORT OBJECTIVES
• Assess the market for wafers, devices, modules and inverters
• Understand the market dynamics for the whole power electronics industry
• Identify the key drivers that will shape the market in the future
• Understand the main technological challenges to overcome and the solutionsdeveloped so far
• Provide a clear overview of the EV/HEV industry
• Identify business opportunities in power electronics
• Present data ranking the power electronics industry leaders, describing supply chainconsolidation, the latest M&A activity and future trends in the power playerlandscape
©2017 | www.yole.fr | Status of the Power Electronics Industry 2017 | Sample
3
REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology
©2017 | www.yole.fr | Status of the Power Electronics Industry 2017 | Sample
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REPORT METHODOLOGY
Technology analysis methodology Information collection
©2017 | www.yole.fr | Status of the Power Electronics Industry 2017 | Sample
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TABLE OF CONTENTS
• What we saw, what we missed 4
• Executive summary 9
• Power electronics basic concepts 31
• Power electronics market 44
• Global power electronics market
• IGBT market
• Power MOSFET market
• Power IC market
• Wafer level market
• Inverter market
• High power vs. low power
• Power electronics drivers and evolution 78
• Power density vs. efficiency
• Thermal management challenges
• Technology analysis 90
• Wide band gap material
• SiC
• GaN
• Power packaging evolutions
• Double side cooling
• Synergies with advanced packaging
• Toward more integration in power electronics
• Power stack
• Film capacitors
• Electric and hybrid cars 159
• Market & forecasts
• Technology evolution
• Supply chain
• Players landscape 186
• Semiconductor company ranking
• Company profiles
• M&A
• Chinese companies emerging
• Conclusions 248
©2017 | www.yole.fr | Status of the Power Electronics Industry 2017 | Sample
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Biography & contact
ABOUT THE AUTHORS
Mattin GraoTxapartegi, Market & Technology Analyst, Power Electronics
Jonathan Liao, Senior Analyst, Power Electronics & Business Development Manager
Mattin Grao Txapartegi is a Technology & Market Analyst | Power Electronics at Yole Développement (Yole). He is engaged in many custom studies and reports dedicated
to the evolution of inverters architecture and passive components, from capacitors to protection devices. Get a deep understanding of the technology evolution, the
market trends and the strategies of each player are part of his mission at Yole. Indeed Mattin is daily driving technology and market scouting, roadmap definition, disruptive
technologies and market opportunities identification and competitive landscape analysis. Previously he acquired a comprehensive expertise in the design of power
converters for EV at Renault. As an engineer, Mattin is graduated from Grenoble INP (FR) with specialization in embedded systems for transportation. He has also an
advanced master in aeronautics from the Arts & Métiers ParisTech (FR).
Contact: [email protected]
Jonathan Liao is a Senior Analyst & Business Development Manager at Yole Développement (Yole). Jonathan is leading the quarterly power management market updates. In
addition, he performs technology & market reports for gate driver, discrete, module, compound semiconductors, and power management IC. Before joining Yole, Jonathan
served as a power electronics Sr. Analyst at IHS Markit. Within a global semiconductor business ecosystem, financial analyses and power management scouting were part of
his mission. Prior to IHS, he was a product engineer at Microchip Technology Inc. During this period, Jonathan gained a strong expertise in analog & mixed signal devices.
Jonathan Liao earned his Master of Science (AZ, North America) and graduated with a Bachelor of Science (PA, North America).
Contact: [email protected]
©2017 | www.yole.fr | Status of the Power Electronics Industry 2017 | Sample
Ana Villamor, Technology & Market Analyst, Power Electronics & Business Development Manager
Dr Ana Villamor serves as a Technology & Market Analyst | Power Electronics at Yole Développement. She is involved in many custom studies and reports focused on
emerging power electronics technologies at Yole Développement, including device technology and reliability analysis (MOSFET, IGBT, HEMT, etc.). Previously Ana was
involved in a high-added value collaboration related to the robustness enhancement of SJ Power MOSFETs, within the CNM research center for the leading power
electronic company ON Semiconductor. During this partnership and after two years as Silicon Development Engineer, she acquired a relevant technical expertise and a
deep knowledge of the power electronic industry. Ana is author and co-author of several papers as well as a patent. She holds an Electronics Engineering degree completed
by a Master in micro and nano electronics, both from Universitat Autonoma de Barcelona (SP).
Contact: [email protected]
8
GLOBAL POWER ELECTRONICS MARKETS
2016-2022
Power device markets &
forecast 2016-2022
IGBT
MOSFET
Power IC
Silicon wafers
GaN & SiC devices
Inverter
Etc.
©2017 | www.yole.fr | Status of the Power Electronics Industry 2017 | Sample
9
IGBT MARKET
Evolution of the IGBT market by application between 2016 and 2022 (in $)
The largest markets for IGBTs in 2016 were: industrial motor drives and EV/HEV.
Yole Développement – July 2017
“Others” category integrates mainly induction heating,
medical, oil & gas, other industrial applications…
©2017 | www.yole.fr | Status of the Power Electronics Industry 2017 | Sample
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INVERTER MARKET
Inverter market and drivers by application
The overall inverter market in 2016 exceeded $XX billion
Andothers…
Drivers for inverter innovation
Drivers for application growth
Size reduction
Weight reduction
Efficiency improvement
Cost reduction
• Increase of CO2 emission taxes
• Demand and regulations for clean energy generation
• Need for mass transportation
• Need for efficient transportation
• Regulation on energy efficiency
• Data center and data storage market increase
• Utility grid stress increasing due to the use of clean energy
Depending on applications
Wind turbines$XX B
PV inverter$XXB
Motor drives
$XX B
Rail traction$XX B
UPS$XX B
EV/HEV$XX B
Inverter markets in 2016
* Growth from 2015
+21% *
+24%
-2%
-16%
+6%
+7%
©2017 | www.yole.fr | Status of the Power Electronics Industry 2017 | Sample
11
TECHNOLOGY TRENDS
Deep focus on key aspects of the power packaging, high temperature, integration, etc
Power packaging
High temperature
film capacitors
Power stacks
Wafer level
packaging
SiC & GaN
…
©2017 | www.yole.fr | Status of the Power Electronics Industry 2017 | Sample
12©2017 | www.yole.fr | Status of the Power Electronics Industry 2017 | Sample
POWER PACKAGING TECHNOLOGIES ROADMAPS
Both materials and design are evolving in the power module.
2016 2020 2025 and beyond
Standard
baseplateBaseplate
Pin-fin baseplateXXX
XXX?
TIMThermal
grease
Direct cooling
with no TIM?
Substrate
DBC Lead frame
Si3N4 AMB
XXXX
Die attach
Tin soldering XXXX Silver paste or film sintering
XXX
Encapsulation
Silicone gel or epoxy Epoxy resin
XXX or XXX -
high temperature
New materials and
processes such as
parylene coating.
Interconnections
Aluminum
wire bonding
Ribbon
bonding
Copper wire
bonding
Topside
bonding
XXX
Substrate-attach
Tin soldering
XXX or XXX
Solder with metal mesh
No baseplate?
XXX Direct-cooled
baseplate PCMXXX
Other direct-
cooled baseplates
13
PLAYERS LANDSCAPE
Company positioning
Players positioning
Market leaders
Technology leaders
©2017 | www.yole.fr | Status of the Power Electronics Industry 2017 | Sample
14
ADVANCED PACKAGING PLATFORMS
WLP: different levels and technologies
Fan-out WLP is a more flexible solution than
Fan-in.
• There are two main types of Wafer Level Packaging: Fan-In WLP (FIWLP, also known as Wafer Level Chip ScalePackaging,WLCSP) and Fan-Out WLP (FOWLP).
• FIWLP is quasi-equivalent to Flip-Chip Ball Grid Array (FC BGA), except that there is an intermediate layer for FCBGA.
PCB
Chip
“Fan-in” WLCSP
PCB
Chip
“Fan-Out” WLP
PCB
Chip
FC-BGA
With Fan-In solutions, ball
grid array is implemented
below the chip, with
nothing beyond the die
surface.
Fan-Out solutions are
more flexible as the
balls can be “larger”
than the chip.
©2017 | www.yole.fr | Status of the Power Electronics Industry 2017 | Sample
15
GAN & SIC APPLICATIONS STATUS
Today and tomorrow
applications for SiC and
GaN devices
©2017 | www.yole.fr | Status of the Power Electronics Industry 2017 | Sample
16
FOCUS ON EV/HEV
Market, technology needs and supply chain
©2017 | www.yole.fr | Status of the Power Electronics Industry 2017 | Sample
17
PLAYERS LANDSCAPE
Market shares, company profiles, M&A, Chinese companies
Emerging Chinese
semiconductor companies
discussion
M&A
Company profiles
Market shares
IGBT
MOSFET
Power IC
EV/HEV
Etc.
Power semiconductor
ranking
©2017 | www.yole.fr | Status of the Power Electronics Industry 2017 | Sample
18
RELATED REPORTS
Discover more related reports within our bundles here.
©2017 | www.yole.fr | Status of the Power Electronics Industry 2017 | Sample
The power electronics sectors continue to expand their presence almost everywhere. Renewable energies and e-mobility, including electric and hybrid vehicles (EV/HEVs), are especially boosting this market. Both the solar and EV/HEV converter markets grew by over 20% between 2015 and 2016. At the semiconductor level, the power semiconductor market grew by 3.8% compared to 2015. This year, Yole Développement has enlarged its power semiconductor market analysis to all types of power integrated circuits (ICs) including power management ICs, linear regulators and switching regulators, representing a total market of $28B. Among all the different types of power devices including thyristors, MOSFETs, IGBTs and power ICs, IGBTs made the greatest progress, with around 8% growth.
Yole Développement’s decision to start analyzing the power IC market evolution closely is part of an effort to cover the whole power spectrum of this market. We now encompass the complete range from low power, low voltage, highly integrated power management ICs in mobile phones to more robust, high power IGCT modules used in trains.
The report also covers the fast-emerging wide band gap (WBG) semiconductor market, identifying today and tomorrow’s leading silicon carbide (SiC) and gallium nitride (GaN) players and the key technological details. ‘Status of Power Electronics Industry 2017’ describes the evolution and forecasts the future of the power inverter, power device and silicon wafer markets.
STATUS OF THE POWER ELECTRONICS INDUSTRY 2017 Market & Technology report - July 2017
SOLAR AND ELECTRIC VEHICLE POWER CONVERTER MARKETS GREW SPECTACULARLY – BY MORE THAN 20% – LAST YEAR, DRIVING GROWTH IN THE EXPANDING IGBT MARKET
Power devices fuel and enable industry mega trends reaching almost US$35B in 2022.
WHAT’S NEW• Update of the power converter,
power device and wafer markets and forecasts up to 2022 in $
• A complete chapter about the EV/HEV market, technological innovations and the supply chain
• Technology analysis update and future trends
• Analysis of the power IC market and player market shares, for the first time
• Analysis of the latest M&A activity• Updates on business opportunities
in power electronics• Power electronics player ranking
and landscape analysis for 2016
KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• The power electronics
semiconductor market reached $28B in 2016
• The IGBT market grew 8% from 2015 to 2016. In 2017, IGBTs are expecting spectacular growth, higher than 10%
• Solar and EV/HEV power converter markets have again increased by over 20% in 2016, driving the growth of the power electronics market
• Several innovations have been introduced into power packaging by various manufacturers, such as overmolded double sided-cooling modules or new interconnection technologies
• The Committee on Foreign Investment in the U.S. (CFIUS) blocked the acquisition of Wolfspeed by Infineon, the semiconductor global market leader
• Chinese companies are trying to acquire know-how in IGBT and power MOSFET manufacturing through mergers and acquisitions
(Yole Développement, July 2017)
2016-2022 market size for power devices
0
5
10
15
20
25
30
35
2016 2017 2018 2019 2020 2021 2022
Rev
enue
s in
US$
B
Power IC Power modules Discretes
HIGHER POWER DENSITIES AND GREATER INTEGRATION ARE TODAY THE KEY GOALS FOR SUCCESSFUL POWER PRODUCTS
Power devices fuel and enable industry mega trends reaching almost US$35B in 2022. Today, much power device novelty comes from a new family of WBG semiconductors, SiC and GaN. This report rapidly summarizes SiC and GaN’s latest status, explaining the value they
add and the challenges that remain before they become common in systems. But besides WBG devices, many other innovations are also emerging, as in power module packaging. Needs for higher power density and more highly integrated products have made some
Focus on the Chinese semiconductor market: local vs. external suppliers shares
(Yole Développement, June 2017)
STATUS OF THE POWER ELECTRONICS INDUSTRY 2017
IN 2016, ON SEMICONDUCTOR PURCHASED FAIRCHILD, LINEAR TECHNOLOGY WAS BOUGHT BY ANALOG DEVICES AND RENESAS COMPLETED ITS ACQUISITION OF INTERSIL. WHO WILL BE NEXT?
After Infineon’s acquisition of International Rectifier, its revenues increased 20% in 2016 compared to 2015. In order to challenge Infineon’s increasing monopoly in the power electronics market, several major moves need to happen that will reshape the player landscape. This strategy is already being implemented by some companies, reflected by certain crucial acquisitions last year. For instance, to compete on operational scale and expand its product portfolio, ON Semiconductor acquired Fairchild in 2016. This move helped ON Semiconductor to gain additional power electronic products such as medium-to-high voltage Super Junction MOSFETs and MOSFET-based modules used in automotive ignition applications. ON Semiconductor has focused heavily on the automotive market in the last few years and the acquisition of Fairchild will help
increase its access to automotive customers. Another significant acquisition in 2016 was Analog Devices’ purchase of one of its main competitors, Linear Technology, which brought a wide range of power conversion products to its portfolio. Renesas, an important automotive semiconductor supplier, purchased Intersil to expand its reach into the industrial market space.
In this report Yole Développement analyzes the financial situation of some key players in the power electronics industry that could be next to be acquired or make bids. It analyzes financial data from 2016 in order to provide insights on how the competitive landscape may evolve over time.
We also focus on Asian companies. Among the global top 10 companies in the power discrete and module device market there is an overwhelming Japanese presence. Meanwhile, Chinese companies are trying hard to become integrated power device manufacturers. So far, IGBT manufacturer Dynex has become part of CRRC, and there are a few basic semiconductor manufacturers, but there is not yet a threat at the semiconductor level. Instead, China’s emerging semiconductor companies have foundry or packager business models. In order to acquire know-how China is trying to make acquisitions. However, the U.S. government and recently some European institutions are taking this risk more seriously and blocking the acquisition process when they think it’s necessary. In the 2017 report, all these subjects are discussed in order to bring readers the widest knowledge of the latest moves, and perspectives for the next couple of years.
traditional technologies and materials outdated. Package evolution is responding to stricter requirements at the system level, and as ever here the automotive industry is driving innovation and growth.
Therefore, Yole Développement has dedicated a whole chapter to the EV/HEV industry. The report gives electric cars market figures and Yole Développement’s forecasts through to 2022. It also explains the technological challenges and what innovations they drive, and describes the new players trying to enter this attractive market. At the power module level, over-molded double-side cooling modules are gaining interest, as well as new interconnection types in order to get rid of aluminum wire bonds. All these topics, together with integration issues, power stack products and high temperature component needs are briefly described in this extensive report, which focuses on the most attractive aspects of the power electronics industry.
Impact of power module design on the choice of packaging materials: an example of a double-side cooling design
(Yole Développement, July 2017)
Interconnections
Wire bonds Wire bond-free
Encapsulation
Epoxy Silicone gel
Substrate
Ceramics Lead frame
Other
Baseplate + Top-die attach
+ Spacers
Double-side cooling power module design
49%
43%
33%
39%
47%
35%
36%
51%
57%
67%
61%
53%
65%
64%
BJTs
IGBT Discretes
IGBT Modules
Mosfets
Power ICs
Rectifiers
Thyristors
China RoW
Find more details about
this report here:
MARKET & TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)ABB, Alpha and Omega Semiconductor (AOS), Amkor, Analog Devices, ASE Group, AT&S, BMW Group, Bosch, BYD, Continental, CRRC, Danfoss, Delphi, Denso, Dialog Semiconductor, Diodes Incorporated, DuPont Teijin Films, Dynex, EXAGAN, Fairchild, Fuji Electric, GaN Systems, General Electric, GeneSiC, Global Wafers, Goldwind, Hitachi, Huawei, Infineon, Intel, Intersil, Ixys, Kandi, Macmic, Maxim Integrated, Mediatek, Microsemi, Mitsubishi Electric, Nanium, Navitas, Nissan, NXP / Freescale, Okmetic, ON Semiconductor, Panasonic, Power Integrations, Qualcomm, Renault, Renesas, Rohm, Sanken, Semikron, Shindengen, ST Microelectronics, StarPower, STATSChipPAC, Sungrow, Tesla Motors, Topsil, Toray, Toshiba, Toyota, Transphorm, TSMC, USCi, Vishay, Volkswagen, Wolfspeed, etc.
• Power Module Packaging: Material Market and Technology Trends 2017
• Power Integrated Circuit 2017 - Quarterly Update Q1, 2017
• Inverter Technology Trends and Market Expectations
July © 2017
From Technologies to Market
Power SiC 2017: Materials, Devices, and Applications
From Technologies to Market
RELATED REPORTSBenefit from our Bundle & Annual Subscription offers and access our analyses at the best available price and with great advantages
AUTHORSMattin Grao Txapartegi is a Technology & Market Analyst | Power Electronics at Yole Développement. He is engaged in many custom studies and repor ts dedicated to the evolution of inver ters architecture and passive components. He is daily driving technology and market scouting, roadmap def inition, disruptive technologies and market oppor tunities identif ication and competitive landscape analysis .Previously Mattin acquired a comprehensive exper tise at Renault .Mattin is graduated from Grenoble INP (FR) and has an advanced master from the Ar ts & Métiers ParisTech (FR).
Dr Ana Villamor serves as a Technology & Market Analyst | Power Electronics at Yole Développement. She is involved in many custom studies and repor ts focused on emerging power electronics technologies at Yole Développement, including Power MOSFET, IGBT, GaN and Power Packaging.Previously Ana was involved in a high-added value collaboration related to the robustness enhancement of SJ Power MOSFETs, within the CNM research center for the leading power electronic company ON Semiconductor. During this par tnership and af ter two years as Silicon Development Engineer, she acquired a relevant technical exper tise and a deep knowledge of the power electronic industry.Ana is author and co-author of several papers as well as a patent. She holds an Electronics Engineering degree completed by a Master in micro and nano electronics, both from Universitat Autonoma de Barcelona (SP).
Jonathan Liao is a Senior Analyst & Business Development Manager at Yole Développement. Jonathan is leading the quar terly power management market updates. In addition, he per forms technology & market repor ts for gate driver, discrete, module and compound semiconductors.Before joining Yole, Jonathan served as a power electronics Sr. Analyst at IHS Markit . Within a global semiconductor business ecosystem, f inancial analyses and power management scouting were par t of his mission. Jonathan Liao earned his Master of Science (AZ, USA) and graduated with a Bachelor of Science (PA, USA).
Find all our reports on www.i-micronews.com
OBJECTIVES OF THE REPORT• Assess the market for wafers,
devices, modules and inverters • Understand the market
dynamics for the whole power electronics industry
• Identify the key drivers that will shape the market in the future
• Understand the main technological challenges to overcome and the solutions developed so far
• Provide a clear overview of the EV/HEV industry
• Identify business opportunities in power electronics
• Present data ranking the power electronics industry leaders, describing supply chain consolidation, the latest M&A activity and future trends in the power player landscape
Executive summary 9Power electronics market 44
> Global power electronics market - IGBT - Power MOSFET - Power IC > Wafer level market > Inverter market
Power electronics drivers and evolution 78
> Power density versus efficiency> Thermal management challenges
Technology analysis 90
> Wide band gap material (SiC and GaN)> Power packaging evolution - Double side cooling
- Synergies with advanced packaging> Towards more integration in power
electronics - Power stack - High temperature film capacitors
Electric and hybrid cars 159
> Market and forecasts> Technology evolution> Supply chain
Player landscape 186
> Semiconductor company ranking > Company profiles > M&A > Chinese companies emerging
Conclusions 248
TABLE OF CONTENTS (complete content on i-Micronews.com)
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− Status of the MEMS Industry 2017*
− MEMS & Sensors for Automotive 2017
− High End Inertial Sensors for Defense and Industrial Applications 2017*
− Magnetic Sensors Market and Technologies 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Sensing and Display for AR/VR/MR 2017
− MEMS Packaging 2017
− Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017
o RF DEVICES AND TECHNOLOGIES
− RF Front End Modules and Components for Cellphones 2017
− Advanced RF SiP for Cellphones 2017
− 5G and Beyond (Vol 1): Impact on RF Industry, from Infrastructure to Terminals
2017
− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals
2017
− RF Technologies for Automotive Applications 2017
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
o MANUFACTURING
− Glass Substrate Manufacturing 2017
− Equipment & Materials for Fan Out Technology 2017
− Equipment and Materials for 3D TSV Applications 2017
− Emerging Non Volatile Memories 2017*
o MEDTECH
− Status of the Microfluidics Industry 2017
− Solid State Medical Imaging 2017
− Connected Medical Devices: the Internet of Medical Things 2017
− Sensors for Medical Robotics 2017
− Artificial Organs: Market & Technology Analysis 2017
− Organs-on-a Chip 2017
o ADVANCED PACKAGING
− Advanced Substrates Overview 2017
− Status of the Advanced Packaging Industry 2017
− Fan Out Packaging: Market & Technology Trends 2017*
− 3D Business Update: Market & Technology Trends 2017*
− Advanced QFN: Market & Technology Trends 2017**
− Inspection and Metrology for Advanced Packaging Platform 2017**
− MEMS Packaging 2017
− Advanced Packaging for Memories 2017
− Advanced RF SiP for Cellphones 2017
− Power Packaging Market and Technology Trends 2017
− Embedded Die Packaging: Technologies and Markets Trends 2017
o IMAGING & OPTOELECTRONICS
− 3D Imaging & Sensing 2017
− Status of the CMOS Image Sensor Industry 2017*
− Camera Module for Consumer and Automotive Applications 2017*
− Uncooled Infrared Imaging Technology & Market Trends 2017*
− Solid State Medical Imaging 2017
o BATTERY AND ENERGY MANAGEMENT
− Status of Battery Industry for Stationary, Automotive and Consumer Applications
*2016 version still available / **To be confirmed
29©2017 | www.yole.fr | About Yole Développement
OUR 2017 REPORTS PLANNING (2/2)o POWER ELECTRONICS
− Status of Power Electronics Industry 2017*
− Silicon Power Mosfet: Market and Technology Trends 2017
− IGBT Market and Technology Trends 2017
− Power Packaging Market and Technology Trends 2017
− Power SiC 2017: Materials, Devices, and Applications*
− Power GaN 2017: Materials, Devices, and Applications*
− Materials Market Opportunities for Cellphone Thermal Management (Battery
Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017
− Gate Driver Market and Technology Trends 2017
− Power Management ICs Market Quarterly Update 2017
− Power Electronics for Electrical Aircraft, Rail and Buses 2017**
− Thermal Management for LED and Power 2017
o COMPOUND SEMICONDUCTORS
− Power SiC 2017: Materials, Devices, and Applications*
− Power GaN 2017: Materials, Devices, and Applications*
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals
2017
− Bulk GaN Substrate Market 2017
o DISPLAYS
− MicroLED Displays 2017
− Display for Augmented Reality, Virtual Reality and Mixed Reality 2017
− Quantum Dots for Display Applications 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Automotive Lighting 2017 - Technology, Industry and Market Trends
o SOLID STATE LIGHTING
− UV LEDs 2017 - Technology, Manufacturing and Application Trends*
− Horticultural Lighting 2017 - Technology, Industry and Market Trends
− Automotive Lighting 2017 - Technology, Industry and Market Trends*
− Active Imaging and Lidar 2017 (Vol 2) - IR Lighting**
− LED Lighting Module 2017 - Technology, Industry and Market Trends
− IR LEDs and Lasers - Technology Applications and Industry Trends 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− MicroLED Displays 2017
− CSP LED Lighting Module 2017
− LED Packaging 2017
− Thermal Management for LED and Power 2017
PATENT ANALYSIS by Knowmade
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation
− Risk and Potential Targets 2017
− MEMS Microphone: Patent Landscape Analysis 2017
− MEMS Microphone: Knowles’ Patent Portfolio Analysis 2017
− Microbolometer: Patents Used in Products 2017
− Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017
− Micropumps: Patent Landscape Analysis 2017
− GaN Technology: Top-100 IP Profiles 2017
− MicroLEDs: Patent Landscape Analysis 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017
− Uncooled Infrared Imaging: Patent Landscape Analysis 2017
− 3D Monolithic Memory: Patent Landscape Analysis 2017
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.*2016 version still available / **To be confirmed
30©2017 | www.yole.fr | About Yole Développement
OUR 2016 PUBLISHED REPORTS LIST (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Gas Sensors Technology and Market 2016
− Status of the MEMs Industry 2016
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads 2016
− Sensors for Biometry and Recognition 2016
− Silicon Photonics 2016
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016
− Uncooled Infrared Imaging Technology & Market Trends 2016
− Imaging Technologies for Automotive 2016
− Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016
o MEDTECH
− BioMEMS 2016
− Point of Care Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− Embedded Die Packaging: Technology and Market Trends 2017
− 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016
− Fan-Out: Technologies and Market Trends 2016
− Fan-In Packaging: Business update 2016
− Status and Prospects for the Advanced Packaging Industry in China 2016
o MANUFACTURING
− Thin Wafer Processing and Dicing Equipment Market 2016
− Emerging Non Volatile Memories 2016
o COMPOUND SEMICONDUCTORS
− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
− Power SiC 2016: Materials, Devices, Modules, and Applications
o LED
− UV LED Technology, Manufacturing and Applications Trends 2016
− OLED for Lighting 2016 – Technology, Industry and Market Trends
− Automotive Lighting: Technology, Industry and Market Trends 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
− LED Packaging 2017: Market, Technology and Industry Landscape
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− Status of Power Electronics Industry 2016
− Passive Components Technologies and Market Trends for Power Electronics 2016
− Power SiC 2016: Materials, Devices, Modules, and Applications
− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends
− Inverter Technologies Trends & Market Expectations 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
o BATTERY AND ENERGY MANAGEMENT
− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016
− Stationary Storage and Automotive Li-ion Battery Packs 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
31©2017 | www.yole.fr | About Yole Développement
OUR 2016 PUBLISHED REPORTS LIST (2/2)
PATENT ANALYSIS by Knowmade
− Microbattery Patent Landscape Analysis
− Miniaturized Gas Sensors Patent Landscape Analysis
− 3D Cell Culture Technologies Patent Landscape
− Phosphors and QDs for LED Applications Patent Landscape
− TSV Stacked Memory Patent Landscape
− Fan-Out Wafer Level Packaging Patent Landscape Analysis
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 45 teardowns and reverse costing analysis and cost simulation tools published
in 2016.
MORE INFORMATION
o All the published reports from the Yole Group of Companies are available on our website
www.i-Micronews.com.
o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the
number of reports you are interested in and select the related offer. You then have up to 12
months to select the required reports from the Yole Développement, System Plus Consulting
and KnowMade offering. Pay once and receive the reports automatically (multi-user format).
Contact your sales team according to your location (see the last slide).
32©2017 | www.yole.fr | About Yole Développement
MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
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Events Webcasts
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to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility. They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
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for meeting in-person. Events
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Targeted audience
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Webcasts are a smart,
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Benefit from the i-Micronews.com
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Contacts: Camille Veyrier ([email protected]) and Clotilde Fabre ([email protected]), Marketing & Communication Project Managers.
33©2017 | www.yole.fr | About Yole Développement
CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected] - +33 4 72 83 01 80
o REPORT BUSINESS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected] - +49 15 123 544 182
• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Japan & Asia: Miho Othake, Account ManagerEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
o FINANCIAL SERVICES
• Jean-Christophe Eloy, CEO & PresidentEmail: [email protected] - +33 4 72 83 01 80
o GENERAL
• Public Relations: [email protected] - +33 4 72 83 01 89
• Email: [email protected] - +33 4 72 83 01 80
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