| AMD Embedded Solutions Platform Launch | Embargoed until 12:01 a.m. Monday, April 26, 20101

Helping Drive Down Power, Footprint and Costs for High-Performance x86 Embedded SystemsBuddy Broeker, Director, AMD Embedded SolutionsAMD Confidential | Embargoed until 12:01 a.m. Monday, April 26, 2010

| AMD Embedded Solutions Platform Launch | Embargoed until 12:01 a.m. Monday, April 26, 20102

Why AMD Embedded Solutions?

X86 Delivers Direct Connect Architecture Delivers

•Well-established software & tools and ecosystem

• Broad knowledge base among developers

• Support for multiple operating systems

• Efficient design & development cycles

• Fast time-to-market

• Enterprise-class performance

• 64-bit capability

• Full functionality

•High-performance graphics support

•High-performance memory with low latency

•High I/O throughput

• RAS features, including ECC

• Low power, strong performance-per-watt

| AMD Embedded Solutions Platform Launch | Embargoed until 12:01 a.m. Monday, April 26, 20103

2003 2005 20072004 2006 2008 2009 2010

AMD Continues to Advance x86 for Embedded Systems

High-performanceAMD Geode™ NX based on AMD-K7™ architecture

Introduction of AMD64 technology into embedded markets with AMD Opteron™ processor

Addition of AMD Turion™ and AMD Sempron™ processors

Addition of graphics and chipset optionsfor comprehensive embedded solution

Ball Grid Array (BGA) packaging introduced to meet

customer demand

Today: 2 new complete-solution

platforms

The AMD Geode™processor

AMD has increased performance and features, driven down power, area, and price barriers for x86 in embedded

| AMD Embedded Solutions Platform Launch | Embargoed until 12:01 a.m. Monday, April 26, 20104

Today’s New Complete PlatformsImproves performance and choice,

maintains low power

• 25W• Dual-Core• 2.2GHz• DDR3• HyperTransport™ 3

(HT3) technology

• 8W, 12W, 15W• Single- or Dual-

Core options• 1.0 – 1.5 GHz• DDR3• HT1 or HT3

ASB2 with BGA Package High-Performance AM3

• 65W• Quad-Core• 2.2GHz• DDR3• HT3

• 25W, 45W• Dual-Core• 2.0 – 2.8GHz• DDR2 or DDR3• HT3

• PCI Express® 2.0

• DDR3• HT3

• DirectX® 10.1• Full 1080p

resolution• Drive up to 4

displays• HDMI• UVD support

| AMD Embedded Solutions Platform Launch | Embargoed until 12:01 a.m. Monday, April 26, 20105

ASB2/785E BGA Platform Architecture

Display Cache

Gen 2

Gen 2

Dual DVI/HDMI orDisplay

Port

VGA

Two Independent

Display Controllers

Two Independent

Display Controllers

Fully Integrated Solution HDCP + Audio

Fully Integrated Solution HDCP + Audio

6X SATA 6GB/s

AudioIntegrated Ethernet MAC

14x USB 2.0

2x USB 1.1

SB850M

2x8 or 1x166 x1

LVDS

2 x1

HyperTransport™ 3 Technology

HyperTransport™ 3 Technology

| AMD Embedded Solutions Platform Launch | Embargoed until 12:01 a.m. Monday, April 26, 20106

Shrink the Design, Not the Performance

Packaging Direct ConnectArchitecture

ScalabilityEnterprise-class Features

• BGA and lidless options

• Low-z-height for small, compact form factors

• Small area footprint

• Reliability

• Low cost

• Fanless operation

• Multi-core design

• Low memory latency

• DDR3 memory

• High-performance I/O with HyperTransport™ 3.0 technology

• Consistent 64-bit capability

• ECC

• Virtualization

• Multiple power management/ reduction features

• Enhanced Virus Protection¹

• No compromise on application performance

• Socket-compatibility for easy design upgrade

• Easy migration path to higher performance

• Chipset & graphics compatibility

• Clear roadmap progression

¹As part of a comprehensive security program, AMD strongly recommends enabling Enhanced Virus Protection (EVP) and using up to date third party anti-virus software.

| AMD Embedded Solutions Platform Launch | Embargoed until 12:01 a.m. Monday, April 26, 20107

Ideal Applications

Point-of-sale (POS) &Kiosk Systems

Digital Signage

Ruggedized, Field, & Military Systems

Thin-clients

Gaming Machines

Industrial Controls

Small/Home Office to Enterprise Storage

Telecommunications& Networking

Medical Imaging

Single Board Computing (SBC)

| AMD Embedded Solutions Platform Launch | Embargoed until 12:01 a.m. Monday, April 26, 20108

Moving Embedded x86 Forward

• Integration of a new CPU core & the latest in graphics

• Improved overall platform performance with lower power compared to previous generation AMD platforms

• More form factor options with reduced footprint

• The technical features that matter, with an outstanding user experience

| AMD Embedded Solutions Platform Launch | Embargoed until 12:01 a.m. Monday, April 26, 20109

w

Strong Commitment

Long-term design support• Industry-standard longevity – planned 5+ years

• AMD has more than 30 years experience in embedded devices

Enterprise-class, high-performance platforms with embedded-specific features and power• No compromises on the system design

True innovation in x86 CPUs and graphics• Driving the capabilities of embedded systems forward

| AMD Embedded Solutions Platform Launch | Embargoed until 12:01 a.m. Monday, April 26, 201010

Forward-Looking Statement

This presentation contains forward-looking statements concerning AMD and technology partner product offerings which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," “strategy,” “roadmaps,” "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this presentation are based on current beliefs, assumptions and expectations, speak only as of the date of this presentation and involve risks and uncertainties that could cause actual results to differ materially from current expectations. With respect to AMD, risks include the possibility that Intel Corporation's pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities targeting AMD's business will prevent attainment of AMD's current plans; customers stop buying AMD’s products or materially reduce their operations or demand for its products; AMD will be unable to develop, launch and ramp new products and technologies in the volumes and mix required by the market and at mature yields on a timely basis; standards promulgated by open standards will be adopted at rates slower than currently projected, demand for computers and, in turn, demand for AMD’s products will be lower than currently expected; there will be unexpected variations in market growth and demand for AMD’s products and technologies in light of the product mix that it may have available at any particular time or a decline in demand; and AMD will be unable to maintain the level of investment in research and development that is required to remain competitive. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to the Annual Report on Form 10-K for the fiscal year ended December 26, 2009.

Trademark Attribution AMD, the AMD Arrow logo, AMD Athlon, AMD-K7, AMD Opteron, AMD Phenom,, AMD Sempron, AMD Turion, Geode, Radeon and combinations thereof are trademarks of Advanced Micro Devices, Inc.  HyperTransport is a licensed trademark of the HyperTransport Technology Consortium.  Microsoft, Windows, Windows Vista, and DirectX are registered trademarks of Microsoft Corporation in the United States and/or other jurisdictions. Other names are for informational purposes only and may be the trademarks of their respective owners.

 

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