快速創新的模組化設計

快速創新的模組化設計Licter Chang

Licter Chang

工廠自動化測試

半導體代理商技術支援

無線模組市場開發與技術支援

系統級封裝服務專案管理與行銷

Makerpro 社群顧問之一

挖悉 Licter

1. 新創產品設計與挑戰

2. 系統級封裝模組化設計

3. 模組化設計應用

4. 新興模組化設計平台

5. Q&A

Agenda





5. Q&A

Agenda

1980S 1990S 2000S 2010

x86 / Linux/Window

x86/ ARM/MIPS Linux/Window

x86/ ARM/MIPS Linux/Window/iOS/Android

x86/ ARM/MIPSLinux/Window/iOS/Android/RTOS/Embedded system

Consumer Product

1. 每個案子的出貨量相對少

2. 開發時間與資源也相對的少

3. 使用環境需要在還沒做樣品時後確認

4. 只要改版就是一次支出

創新產品出貨挑戰

So how can all these young companies

manage a supply chain like this in such a short

time?

創新產品出貨挑戰

1. 模組化設計可以減低開發時間

2. 重複使用開發模組節省開發成本

3. 採用模組縮短供應鏈

4. 使用環境需要在還沒做樣品時後確認

利用模組設計

From prototype to production in 4 months…

實際開發成果





5. Q&A

Agenda

Why SiP Module?

• Small Form Factor

• Fast Time-to-Market

• Pre-tested and Pre-Qualified

• Higher production efficiency & yield

• Re-usability

• Easy Logistic Management

Discrete COB Solution

SiP Module Solution

Define SiP Module

In

tr

o

d

u

ct

io

n

t

o

S

PI

1

2

“A System in Package (SiP) is a combination of one or more semiconductor devices plus

optionally passive components that define a certain functional block within a quasi-package

that is then, in turn, mounted onto the system’s main board assembly.”

Prismark:

Package Structure Can Be :

Stack Die

SBS (Side by side)

MCP (Multi-Chip Package)

PoP (Package on Package)

PiP (Package in Package)

Others…

2005/06

What is SiP Module?

4. Carrier:• Laminate (BT/FR4/FR5) Substrate

• LTCC (Ceremic) Substrate

• Leadframe

5. Shielding:• Metal Lids

• Conformal Shielding

6. Structure:• MCM side-by side structure (Single side assembly)

• 3D Cavity structure (Double side assembly)

• 3D Die Stacking structure

• Embedded structure

A fully functional subsystem which includes the

following features…

1. One or multiple ICs• CMOS

• BiCMOS

• GaAs

2. Components are incorporated:• R/L/C

• Filters (SAW/Balun/Band Pass)

• Memory: EEPROM / Flash

• Crystal

• Switch

3. Chip-level Interconnection:• Flip-Chip

• WLCSP

• Wire-bonding

What is SiP Module?A fully functional subsystem which includes the


1. One or multiple Ics Components are incorporated,

2. Chip-level Interconnection:• Flip-Chip

• WLCSP

• Wire-bonding



Shielding:• Metal Lids

• Conformal Shielding



Structure:• MCM side-by side structure (Single side assembly)

• 3D Cavity structure (Double side assembly)

• 3D Die Stacking structure

• Embedded structure

Where is SiP Module?

Tablets

Apple iPad Air• RF Front-end Module

• Dual Band PA Module

• Single Band PA Module

Wearable / IoT

Google Glass

• WLAN/BT Module

• WLAN/BT Module

Source: www.ifixit.com/

• BLE Module

Smartphones

Apple

iPhone6 Plus

• WLAN/BT Module

• Sensor Module

BlackBerry Z10

• uDCDC Converter Module

• Power Management Module

Samsung S5

• WLAN/BT Module

• RF Front-end Module

Moto 360 Nest Thermostat

• WLAN Module

• BLE Module





5. Q&A

Agenda

SiP Module in Nest Cam

iPhone 6

iPhone 6 Power Management

Display Module

iPhone 6

RF Front-End

Sensor ModuleSensor Module

iPhone 6

UI Module

(Audio/Haptic Driver)

UI Module

(NFC/Related)

iPhone 6 Power Management

RF Front-End

UI Module

(Audio/Haptic Driver)

Display Module

Sensor ModuleSensor Module

UI Module

(NFC/Related)

SiP Module in Apple Watch

http://www.chipworks.com/about-chipworks/overview/blog/apple-watch-and-ase-start-new-era-sip





5. Q&A

Agenda

模組平台的需求

1. 小尺寸,可堆疊與擴充的開發版

尺寸越小會越接近成品的機構,不可擴充就沒有搞頭啦!

2. 可直接執行與驗證的Firmware 與 APP

只出板子誰會知道怎麼用!?

3. 可以直接拿來量產

減少硬體開發時間

MtM Modules Development Kit

Connectivity

Accessories

Sensors

Ameba Development Kit

NuBrick

MediaTek LinkIt Series

Intel IoT Platform

Q & A

Technology

快速創新的模組化設計