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HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 1
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Cross Cloud Interoperability with iPaaS and Serverless for Telco(SDN/NFV)
Krishna M Kumar & Sanil Kumar D.
Chief Architects, Cloud R&D
Huawei India
HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 2
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1. Background : Setting the context. 2. Cross Cloud, Hybrid Cloud and Challenges
3. Story of iPaaS
4. How iPaaS can help cross cloud
5. Telco Cloud (SDN/NFV) Requirements and Challenges
6. A glance at Serverless
7. iPaaS and Serverless : Architecture for SDN/NFV Telco Scenarios
8. Future is interesting!
HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 3
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• Cloud Interoperability is key for Hybrid Cloud
• Cloud strategy derives mainly from Cloud Management layer
• Cloud Management Layer : deploy, connect and manage user workloads
• iPaaS helps to integrate and connect application across multiple clouds
• Telco (SDN/NFV) has specific requirements/challenges connecting
multiple clouds
• iPaaS & Serverless can provide an architecture for Telco Cloud
HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 4
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Dynamic Cloud Technologies
HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 5
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1. Background : Setting the context.
2. Cross Cloud, Hybrid Cloud and Challenges 3. Story of iPaaS
4. How iPaaS can help cross cloud
5. Telco Cloud (SDN/NFV) Requirements and Challenges
6. A glance at Serverless
7. iPaaS and Serverless : Architecture for SDN/NFV Telco Scenarios
8. Future is interesting!
HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 6
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Application deploying techniques
Application debugging
Cross cloud test grid, benchmarking
Stateful application hosting
Global state registry or storage
Image distribution and caching
Cloud burst scenario (services across clouds)
Identifying the home location of the application Application Migration
Cross cloud deployment methods
Cross cloud multi tenant namespace address collision
Many Cross Cloud Challenges…
Key Solution Domain : How well we can connect the services across cross clouds
Cloud market place & Pricing
Resources, QoS and SLA
Dynamic Technologies: Edge, Fog, Serverless and more…
HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 7
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1. Background : Setting the context.
2. Cross Cloud, Hybrid Cloud and Challenges
3. Story of iPaaS 4. How iPaaS can help cross cloud
5. Telco Cloud (SDN/NFV) Requirements and Challenges
6. A glance at Serverless
7. iPaaS and Serverless : Architecture for SDN/NFV Telco Scenarios
8. Future is interesting!
HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 8
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What is PaaS ?
HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 9
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What is iPaaS?
Market Definition/Description (based Gartner Report)
An integration platform as a service (iPaaS) provides capabilities to enable subscribers (aka "tenants") to implement data, application, API and process integration projects spanning cloud-resident and on-premises endpoints.
This is achieved by developing, deploying, executing, managing and monitoring "integration flows" (aka "integration interfaces") — that is, integration applications bridging between multiple endpoints so that they can work together.
“Enterprise iPaaS” (as per Gartner Definition)
If iPaaS is designed:
to support enterprise-class integration projects (that is, projects requiring high availability, disaster recovery, security, service-level agreements [SLAs] and technical support from the provider)
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iPaaS to play a key role in cross clouds.
Courtesy: Gartner Magic Quandrant, 2017
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PaaS v. iPaaS v. SaaS
refers to one cloud based
toolset that enables developers to govern services.
PaaS focuses on one portion of a development project, rather than an
entire infrastructure
integration PaaS combines several platforms, utilizing the same benefits as PaaS at a broader scale
Also creates unique set of services across multiple cloud residents
software as a service (SaaS) uses a third party provider to host applications over
the internet
PaaS iPaaS SaaS
iPaaS vendors not only work toward integrating enterprise systems within the cloud, but also between public and private clouds, all while keeping costs in mind
HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 12
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1. Background : Setting the context.
2. Cross Cloud, Hybrid Cloud and Challenges
3. Story of iPaaS
4. How iPaaS can help cross cloud 5. Telco Cloud (SDN/NFV) Requirements and Challenges
6. A glance at Serverless
7. iPaaS and Serverless : Architecture for SDN/NFV Telco Scenarios
8. Future is interesting!
HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 13
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• Adapters/Connectors are already created and always up-to- date.
• Reliable infrastructure.
• Citizen integrators can connect any software and create pipelines
• Manage all points of integration in one place.
• Visualization of all data streams in one place.
iPaaS Connectors for seamless cross cloud solutions…
Connectors
Integration
Objects
Map the object
fields
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1. Background : Setting the context.
2. Cross Cloud, Hybrid Cloud and Challenges
3. Story of iPaaS
4. How iPaaS can help cross cloud
5. Telco Cloud (SDN/NFV) Requirements and Challenges 6. A glance at Serverless
7. iPaaS and Serverless : Architecture for SDN/NFV Telco Scenarios
8. Future is interesting!
HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 15
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Telco Cloud (SDN/NFV) Requirements and Challenges
• Service Chaining
• Multi-vendor
Network Function
Virtualization
(NFV)
interoperability
• NFV
Interoperability
Testing Initiative /
standards
• Embracing Cloud
Technologies for
seamless service
deployments.
• Vendor lock-in.
Image Courtesy: SDXCentral
Service Chain? Network service chaining is a capability that
uses SDN to create a chain of network
services like firewalls, network address
translation [NAT], routing, Encryption, QoS,
Bandwidth, intrusion protection, edge
router, etc. in a virtual chain to automate
network connections to handle traffic flows
for in network connections.
Example : Video or VOIP session
Along with SDN and NFV together can use
the best available network resources and
help negotiate around network congestion
issues – all in an automated fashion.
•Why Service Chain:
•Construct a chain often built to support multiple applications, data sometimes passed through unnecessary network devices or servers and consumed extra bandwidth and CPU cycles.
•Not over provisioning as well as to meet future demands, a dynamic provisioning model within a VLAN, VXLAN or across those boundaries without a third party provider.
Organizations working on these standards: The Internet Engineering Task Force (IETF), European Telecommunications Standards Institute (ETSI) and Open Networking Foundation(ONF) - OpenFlow
HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 16
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1. Background : Setting the context.
2. Cross Cloud, Hybrid Cloud and Challenges
3. Story of iPaaS
4. How iPaaS can help cross cloud
5. Telco Cloud (SDN/NFV) Requirements and Challenges
6. A glance at Serverless 7. iPaaS and Serverless : Architecture for SDN/NFV Telco Scenarios
8. Future is interesting!
HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 17
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A glance at Serverless
So
me V
en
dor
Pro
duct
s
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1. Background : Setting the context.
2. Cross Cloud, Hybrid Cloud and Challenges
3. Story of iPaaS
4. How iPaaS can help cross cloud
5. Telco Cloud (SDN/NFV) Requirements and Challenges
6. A glance at Serverless
7. iPaaS and Serverless : Architecture for SDN/NFV Telco
Scenarios 8. Future is interesting!
HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 19
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iPaaS in Serverless Architecture : Exploring better interop and performance
This architecture provides : Seamless interop with iPaaS and Optimization with Serverless
3 Technologies working together:
Stage 1: iPaaS : Connector based interop
Stage 2: Serverless: Runtime gets them as events
Stage 3: PaaS: Gets it deployed in containers
HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 20
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1. Background : Setting the context.
2. Cross Cloud, Hybrid Cloud and Challenges
3. Story of iPaaS
4. How iPaaS can help cross cloud
5. Telco Cloud (SDN/NFV) Requirements and Challenges
6. A glance at Serverless
7. iPaaS and Serverless : Architecture , Usecases and more…
8. Future is interesting!
HISILICON SEMICONDUCTOR HUAWEI TECHNOLOGIES CO., LTD. Page 21
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A2A Market research prediction shows that iPaaS market will grow from USD 528 million in the year 2016 to around USD 3 billion by 2021 with Compound Annual growth rate of 41.5%.
Intelligent PaaS : Making predictive scheduling, resource managements and events. Integration of this kind of intelligence with iPaaS. (Intelligent iPaaS)
ML/AI: Machine Learning and Artificial Intelligence can make the cross cloud deployment, management and maintenance more adaptive , self healing and self optimizing
Changing IaaS Technologies: Distributed computing hardware modules and its granularity and impose specific requirements to cloud technologies. Adapting these to exploit the best of the hardware.
Thank you www.huawei.com
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