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MIPI Beyond Mobile
Industrial Computer-on-Module Case
Study
Nikola Nenadić, pygmyTITAN
“Industrial Mobile” Market • Non-consumer applications of mobile technology • Potential to disrupt a number of industries • Medical, robotics, instrumentation, retail, logistics &
transportation, emerging markets (VR/AR, IoT, drones) • People are already doing it…
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www.happymed.com www.mobisante.com www.imageholders.com www.oscium.com
Market Forecasts by 2020
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Benefits of Mobile Technology • Driven by smartphone form factor • Low power, small form factor • Latest ARM processor architectures • Superior video processing with hardware acceleration • Integrated signal processing capability • Integrated radio (cellular, Wi-Fi, BT) • Advanced power management
• Pervasive technology (over 2 billion devices) • Rich mobile software application ecosystem
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The Most Popular Invention in History
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Telephone
1.6BTelevision1.26B
Mobile Application Space is Huge
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AppleAppStore–2millionapplica?onsasofJune2016
ARM Landscape is Changing • Mobile ARM market consolidation is in progress • A number of suppliers left the mobile market recently
(TI, Nvidia, Broadcom, Marvell, Intel)
• Only pure play mobile suppliers stay in the game (Qualcomm, Samsung, MediaTek, HiSilicon)
• Disproportion: $400B1 mobile vs. $25B2 embedded • Budgets for innovation in mobile are much bigger • Reduced supply of high-end ARM platforms for
embedded ! Growing pressure to employ consumer mobile
SoCs in embedded applications
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1)Globalrevenuefromsmartphonesalesin2016,GfK;2)EmbeddedBoardsandIntegratedcomputersystemsmarketsizein2018,VDCResearch,2016
Key Obstacle for Industrial Mobile
• Pure play mobile suppliers are focused on a small number of high volume customers
• Embedded systems market is highly fragmented, with thousands of different clients and applications
• Mobile components are short-lived, driven by consumer market dynamics
! Mobile technology stays inaccessible for embedded developers
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Lesson from the Past – Industrial PC
• In the early 90’s technology landscape was similar • There were 18 manufacturers of x86 processors • IBM PC’s commercial success accelerated
development and consolidated the market • Latest innovations were becoming cheap • Pressure to use commercial PC technology
in industrial applications was rising • 1992 – PC/104 Consortium • 2005 – COM Express (PICMG) • $3.5B1 market today
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1)IMSResearch,2011
Consumer vs. Industrial Applications
Consumer Products:
• Fast time to market
• Large volumes • No customization • Price pressure • Short product lifetime
Industrial Devices:
• Slower adoption rate, regulatory approvals
• Low and medium volumes • Tailored solutions • Relaxed price margins • Expected longevity
(> 5 years) • Multi-vendor sourcing
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Mobile Computer-on-Module • Smartphone electronics packed in a component • Open architecture • Standardized form factor and pinout ! Solves longevity issue, enables multi-vendor sourcing
• Modular approach – reduced complexity & risk • Building products on mainstream mobile technology ! Compatibility & continuous access to the latest innovations
• Standardization of interfaces inside smartphones makes mobile COM possible ! Key role of MIPI Alliance
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Mobile Form Factor
• Smartphone main boards takes approx. the same area • High level of integration, small thickness
• Power consumption: up to 3 W
• Mobile COMs can be made small and thin, enabling smartphone-like industrial mobile devices
• Heat dissipation, EMC/EMI, RF shielding
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How We Did It
• PCB area: 21.6 cm2
• Total thickness: 5 mm • Integrated heat spreader, EMC/EMI and RF shielding
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Mobile COM Module Pinout • Mobile by its nature: based on MIPI interfaces • No power hungry/legacy industrial PC interfaces
(Ethernet, PCIe, SATA)
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Widely used mobile interfaces: • MIPI Display Serial Interface
(DSI + LCD control) • MIPI Camera Serial Interface (CSI + CCI) • Universal File Storage (UFS + card signals) • HSIC
Smartphone external interfaces: • USB 2.0 / USB 3.0 • HDMI
Integrated radio: • Cellular • Wi-Fi • Bluetooth, NFC
Legacy mobile interfaces: • SD Card, SDIO
Audio, sensors and control: • Audio (MIPI SLIMbus/MIPI SoundWire/I2S) • MIPI I3C, VGI
High-Performance: • MIPI UniPort-M or M-PCIe?
Embedded Interfaces: • UART, SPI, I2C, GPIO
Auxiliary Interfaces: • SIM card, JTAG, boot selection,
power management, system management
Mobile COM System Block Diagram
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Mobile vs. PC COMs
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Feature IndustrialMobile IndustrialPC
CPUarchitecture: dominantlyARM dominantlyx86
Boardsize: 12.5–25cm2 45–90cm2
Powerconsump?on: <3W 6-55W
Integratedradio: " #
Ba]erypowermanag.: " #
So^ware: Android/Linux Windows/Linux
Totalsystemprice: low high
Mechanical and Thermal Considerations • Connector solution ! Low mating height ! High density ! 250-400 signal pins
• Mobile use cases ! Constrained space inside device ! Power dissipation ! Mechanical robustness ! Low weight
• Maintenance and servicing ! Easy module replacement ! Easy device upgrade
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Anexample–pygmyTITANsolu?on
Mobile COM Ecosystem Challenges
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• Industrial Mobile ecosystem do not exist today • The idea is to take components and know-how
directly from consumer mobile • Ease technology transfer by implementing mobile
standards without any changes • SoCs, ICs, displays, cameras, sensors,
mechanical components suppliers – should have no extra effort
• Unified Industrial Mobile software architecture is needed to ensure compatibility and enable re-usage of commercial mobile applications
The Winner is Clear
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Software and Security • Android is the winner of platform wars • Embedded Android variant is needed
for Industrial Mobile to succeed • Part of AOSP or middleware extension? • Plug and play functionality, dynamic driver loading
• Mobile and IoT applications – security is key concern! • Security Architecture should be
integral part of COM platform specification • Hardware root of trust, secure boot, Trusted Zone
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Conclusions & Recommendations • Open architecture COM module standards facilitate
usage of mobile technology in industrial sector • Mobile is enabling technology for a number of
non-consumer applications with high-growth potential • Mobile industry is positioned well to capture significant
part of the industrial market in the future
• PICMG led the effort for the Industrial PC • MIPI Alliance should lead it for the Industrial Mobile • Mobile computing module standard,
security architecture, and embedded Android
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