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Presented By: Roshan Mani 11ECTEC047 B.Tech. VIII Sem E.C.E. Deptt. GCET Bikaner 7-May-15 1 Roshan Mani

Flexible Electronics

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Page 1: Flexible Electronics

Presented By:

Roshan Mani

11ECTEC047

B.Tech. VIII Sem

E.C.E. Deptt.

GCET Bikaner

7-May-15 1Roshan Mani

Page 2: Flexible Electronics

OUTLINE

Introduction

Basic OLED Structure

Materials for flexible electronics

Technologies involved in processing

Technologies for Flexible Displays

Degree of flexibility

Applications

Advantages and Limitations

Conclusion

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INTRODUCTION

Ever evolving advances in thin-filmmaterials and devices have fueled many ofthe developments in the field of flexibleelectronics.

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Basic OLED structure

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Materials for Flexible Electronics

A generic large-area electronic structure is composed of :

Substrate

Back-plane

Front-plane

Encapsulation

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SubstratesFlexible substrates that are to serve as drop-in replacements for plate glass substrates must meet many requirements:

Optical properties

Surface roughness

Thermal and thermo-mechanical properties

Chemical properties

Mechanical properties

Electrical and magnetic properties

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Backplane electronicsBackplanes provide or collect power and signal to or from front-planes. Backplanes may be passive or active.

Silicon Thin-Film Transistors

Organic Thin-Film Transistors

Materials for Interconnects and Contacts

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Backplane Electronics

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Front plane technologiesFront plane carry the specific optoelectronic application.

Liquid Crystal Displays

Electro-phoretic Displays

Organic Light-Emitting Displays

Sensors

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TECHNOLOGIES AND INTEGRATION PROCESSES

Any manufacturable device has four essential characteristics:

Superior and pre-specified performance, with reproducibility, uniformity, and reliability

High yield to acceptable tolerance

Simulations exist for both reverse engineering during development and right-first-time design

Proven adequate in-service lifetime.

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FABRICATION TECHNOLOGY FOR FLEXIBLE ELECTRONICS

Fabrication on sheets by Batch Processing..

On a rigid carrier, facing up and loose;

In a tensioning frame, facing up or down;

In a frame, facing down and loose

Fabrication On Web by roll-to-roll Processing

Additive Printing

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Batch and roll to roll fabrication

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Degree of flexibilityFlexibility can mean many different properties to

manufacturers and users.

Degree of flexibility is given by ε = d/2r.

Bendable or rollable

Permanently shaped

Elastically stretchable

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Examples…

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APPLICATIONS

Holistic system design

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Health Care

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Other applications

Automotive Industries

Displays and Human- machine interaction

Energy management and mobile devices

Wireless systems

Electronics Embedded in the living environment

Electronics for hostile environment etc..,

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ADVANTAGES AND LIMITATIONSAdvantages: Size and weight Self luminous Low cost & easy fabrication Increased circuitry density Bounadaries of design and packaging Shape or to flex during its use Wide Viewing Angle

Limitations:

Lifetime Manufacturing Water Battery

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CONCLUSION

Based on the current socio-economic trends, weoutlined some of the most likely technological futureneeds and discussed the potential exploits of thin-filmflexible electronics in various market sectors.

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