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America’s Flexible Hybrid Electronics Manufacturing Institute
FLEXIBLE HYBRID ELECTRONICS
TECHNOLOGIES AS THE FOUNDATION
FOR A CONNECTED WORLD
JASON MARSH
DIRECTOR OF TECHNOLOGY
IMAPS POLYMER SYMPOSIUM – APRIL 25, 2016
Network Status and Growth Plans
FHE MII
Flex. Hybrid Elec.
San Jose, CA
ESTABLISHED INSTITUTES
America Makes
Additive Mfg.
Youngstown, OH
Power America
Electronics
Raleigh, NC
LIFT
Light/Modern Metals
Detroit, MI
IACMI
Adv. Composites
Knoxville, TN
AIM Photonics
Albany & Rochester, NYDMDII
Digital Mfg.
Chicago, IL
Smart Mfg.
for Energy
EfficiencyProj. Award TBD
INSTITUTES IN COMPETITION/DEVELOPMENT
Revolutionary
Fibers & TextilesProj. Award:
April ‘16
Topic
TBA
NNMI NETWORK
Focus: Combining the entrepreneurial & innovative
culture of Silicon Valley with a national network of
regional & technology nodes to commercialize FHE
technology through manufacturing advancements in
integrated printing & packaging, system design tools,
materials scale-up, thinned device processing, and
reliability testing & modeling.
NextFlex: America’s Flexible Hybrid Electronics Manufacturing Institute
Catalyzing a robust and innovative
manufacturing ecosystem at the intersection
of the electronics and high performance
printing industries.
BY THE NUMBERS
4
Established 28 August 2015
Lead FlexTech Alliance
Hub Location San Jose, California
Proposal Contributors 145+ in 27 states
Federal Funding $75 million over 5 years
Committed Matching $96 million
Government Agencies Engaged 17 DOD & OGAs
FHE VISION
NextFlex Roadmap Structure
Device Integration & Packaging
Materials
Printed Flexible Components & Microfluidics
Modelling & Design
Standard, Test & Reliability
Time
Device/Platform Requirements
• Strong End-User Participation
• Result in Key Tangible Deliverables
for the Institute
• Demonstrate potential of FHE
technology
Manufacturing Capabilities
• Prioritized by TPD Needs
• Result in new/matured
processes, manufacturing and
design tools, etc.
• Develop FHE manufacturing
infrastructure
Human Monitoring
Asset Monitoring
Integrated Array Antennas
Soft Robotics
Demonstrator X
Key features:
#1
#2
#Y
Demonstrator 1
Key features:
#1
#2
#X
Device/Platform
RequirementsFHE Manufacturing
Capabilities
Founding Members
Corporate Academic/Non-Profit Federal Government
Tier 2
Tier 1
Tier 3
Tier 2
Observer
Tier 3
Associations
Economic
Development
State/Local Government
Tier 1
DUAL USE
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Full Spectra Au-M1-S1 with ssweat09262014
DI Water0.1 uM Orexin-A
1 uM Orexin-A10 uM Orexin-A100 uM Orexin-A
500 uM Orexin-A1000 uM Orexin-A
Impe
da
nce
(o
hm
)
Frequency (Hz)
Credits en Masse• DuPont• Georgia Tech• Binghamton• GE Global Research• ARL• AFRL• Army RDECOM• SRI• PARC• Purdue• HP Enterprise
• NIST• UTRC• American Semi• Uniqarta• Thinfilm• Infratab• Applied Materials• ARM• Semios• MC10• BWRC
• Optemec• MIT• Stanford• Western Michigan• Flex• Sensor Films• Mulbauer• Universal Instruments• Indium
Flexible Hybrid Electronics
technology is the key enabling
platform for wide-scale IOT device deployment
What Are All These IOT Devices?
• Machine to Machine
• Environmental
• Asset• Human
• IOT Moniker – Credited to Kevin Ashton in 1999• IPv4 (66.147.252.109) – 4.3 Bn• IPv6 (2600:1404:17:18b::19ff) - 3.4×1038
• 13.4 Bn connected devices in 2015• Gartner Estimates a 30% YoY Growth (to 6.4Bn)• 40 Bn connected devices predicted by 2020
(Cisco)
Why does all this matter?
Why? Our Time Domain World• When we have gone from manual operation in many process to
automation we have relied too heavily on the time domain…
IOT is about Efficiency• Significant waste can be eliminated by operating in a “need” domain
IOT Edge Requirements
• Robust ROI
• Product Lifecycle Considerations
• Unobtrusive Form Factor
Why FHE?
• Cheap
• Widely deployable
• Adaptable to novel form factors
• Single use possible (“aka” disposable)
Flexible, Stretchable, Conformable
16
IMPACT
• Novel Form
Factors
• Light-weight,
rugged
• Low-cost
approaches
through new
manufacturing
• Enabling novel-
sensing
capabilities
UNCLASSIFIED APPROVED FOR PUBLIC RELEASE
Flexible
ubiquitous
Sensors
DOD EXAMPLESWarfighters
Wearable Soldier
Sensing, Performance
and Training
Distributed
media
WHY? Flexible Hybrid Electronics For DoD
With Parallel Commercial Applications
IOT Systems
• Minimally
• Sensor
• Power
• Transceiver
Sensors• Chemical
• Liquid• Gas• Bio Analytes
• Thermal• Mechanical• Optical• EM Radiation
Power• FHE Requirements
• <0.010 Inches• 300mAh• 1.5-3.6V• -20dC-+60dC• 1” Bend Radius• 5 Year Stability• 6’ Drop• Cheap• Disposable (REACH, RoHS, etc)
3 volts
35 mAh
-30 to +80
Datalink Strategies• NFC/RFID (ISO 13157)
• Bluetooth (802.15+BTSIG)
• WiFi (802.11)
• GPRS/4G (802.16m/LTE-A)
• Micro Radio• Swarm Communications
Datalink TechnologyAspect NFC Bluetooth Bluetooth Low Energy
Tag requires power No Yes Yes
Cost of Tag $0.10 USD $5.00 USD $5.00 USD
RFID compatible ISO 18000-3 Active Active
Standardisation body ISO/IEC Bluetooth SIG Bluetooth SIG
Network standard ISO 13157 etc.IEEE 802.15.1 (no longer
maintained)
IEEE 802.15.1 (no longer
maintained)
Network type Point-to-point WPAN WPAN
Cryptography Not with RFID Available Available
Range < 20 cm ~100 m (class 1) ~50 m
Frequency 13.56 MHz 2.4–2.5 GHz 2.4–2.5 GHz
Bit rate 424 kbit/s 2.1 Mbit/s 1 Mbit/s
Set-up time < 0.1 s < 6 s < 0.006 s
Current consumption < 15mA (read) Varies with class< 15 mA (read and
transmit)
• Duty Cycle
• Standby Protocol
• Baud Rate
• Connectivity Distance
Mercier Radio ~1-3M Connectivity
Frequency 2.4 GHz
Standby Consumption 39.7pW @ 0.8V
Power at 1bps 78pW
Technology 18µm CMOS
BitPower 38pJ/bit @ 5 Mbps
FHE Datalink Solutions
FHE: A Really Easy Package
The Problem with Pure PE• Unimpressive Mobility @ Operating Temp• VT Shift• It works in Display?
• 2x10-9
Duty Cycle
• Amorphous Silicon/Metal Oxides• Polymer• Carbon Nanotubes/Graphene (promising mobility)
The “H” in FHE
• 15 micron die
• 30 – 300 micron bond pitch
• Die attach connections for 24 SOA- 100 by 2018
• What happens when the Si bends?
Why is this so hard?
Temp, Temp, Temp
Printing (& Curing)
• Aerosol Jet
• Digital
• Extrusion
• Screen
• Rotogravure
Printing• Aerosol Jet• Digital• Extrusion• Screen• Rotogravure
Photo Courtesy UMass Amherst
Display Production Capability
• AMAT Cluster Machines
• Over 900 of these installed worldwide• Entry price $5M• Operating cost $500k/month• Vacuum deposition & CVD
Can’t Live with Low Temp?
• Flexible Glass (500˚C)
• Flexible Ceramics (1000˚C)
Thinning• Carrier Bond
• Edge Trim to Eliminate Bevel
• Mechanical Grind
• CMP
• Plasma
• Bumping
0
100
200
300
400
500
600
700
800
775 µm Wafer 50 µm Wafer 15 µm Wafer
Photo Courtesy On Semi
Singulation
• Dicing & Edge Cleanup
• Plasma Singulation
• Femtosecond Laser Photo Courtesy PlasmaTherm
Die Handling
Integration
• Conductive Adhesive
• Solder
• ACF/ACP
• Thermo-Compression
• TLPS Materials
• Direct Print
Photo Courtesy EMD
Photo Courtesy NScript
Integration @ 50µm
Photos Courtesy Georgia Tech
Differentiating from Subtractive
Edge, Core, Fog and Cloud• Core: the cloud computing side
will suffer from latency, expensive
infrastructure and an absurd
number of startups that struggle to
articulate what their actual product
is
• Edge: challenges from accuracy,
security and interoperability
• Perishable observation window
Issues For Smarter Devices• Pin count, bond pitch
• Power consumption, thermal management
• Device value and reliability requirements
• Signal integrity for additive materials
How do we solve these challenges?
NextFlex HQ Layout Draft
Integration
Area
Class 10,000Te
st
an
d
Me
as
ure
me
nt
La
b –
Cla
ss
10
,00
0
Seminar, Training and
Workforce Development
Mechanical
Lab
Wearables
Lab
Product
Display
Design
Lab
Materials
Registry
Library
Cubicles
Partner
Area
Pa
rtn
er
Are
a
Pa
rtn
er
Are
a
Pa
rtn
er
Are
a
Conf
Room
Board
Room
Ship
Receive
Break Room
Lunch
Room
Screen
Exp
Printing and Additive
Processing Area
Class 10,000
Lo
bb
y
