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Intel 32nm TechnologyIntel 32nm Technology
Mark Bohr Intel Senior Fellow
Logic Technology Development
Feb. 10, 2009
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Risk Factors
• Today’s presentations contain forward-looking statements. All statements made that are not historical facts are subject to a number of risks and uncertainties, and actual results may differ materially. Please refer to our most recent Earnings Release and our most recent Form 10-Q or 10-K filing for more information on the risk factors that could cause actual results to differ.
• If we use any non-GAAP financial measures during the presentations, you will find on our website, intc.com, the required reconciliation to the most directly comparable GAAP financial measure.
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Key Messages
• Intel has developed a 32nm logic technology with industry-leading features
• Intel is first to demonstrate working 32nm processors
• Intel’s 32nm process is on track for production readiness in Q4 ’09
• Both CPU and SoC versions of this 32nm process will be available
• Intel’s strength as an integrated device manufacturer allows us to continue to deliver new generations of advanced process technology on a 2 year cadence
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Intel Logic Technology Development
Process Name P1264 P1266 P1268 P1270 P1272
Lithography 65nm 45nm 32nm 22nm 16nm
1st Production 2005 2007 2009 2011 2013
Manufacturing
Development
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45nm High-k + Metal Gate Transistors
Revolutionary transistor technology for
improved performance and lower leakage
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45nm Microprocessor Products
45nm production ramp has been the fastest yet
Twice as fast as the 65nm ramp in its first year
Single Core
6 Core
Dual Core
8 Core
Quad Core
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Intel Logic Technology Evolution
Process Name P1264 P1266 P1268 P1270 P1272
Lithography 65nm 45nm 32nm 22nm 16nm
1st Production 2005 2007 2009 2011 2013
Manufacturing
Development
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32nm Technology
• 2nd generation high-k + metal gate transistors
• Immersion lithography on critical layers
• 9 copper + low-k interconnect layers
• ~70% dimension scaling from 45nm generation
• Pb-free and halogen-free packages
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32nm Transistors
• 2nd generation high-k + metal gate
−
0.9nm equivalent oxide thickness high-k (scaled from 1.0 nm on 45nm)
−
Replacement Metal Gate process flow
−
30nm gate length
−
4th generation strained silicon
• >22% performance increase
• Tightest reported gate pitch
• Highest reported drive currents
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Transistor Pitch Scaling
Transistor gate pitch continues to scale 0.7x every 2 years
Tightest gate pitch of all reported 32nm technologies
100
1000
1995 2000 2005 2010
Gate Pitch (nm)
0.7x every 2 years
32nm Generation112.5 nm Pitch
PitchPitchPitch
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32nm Transistor Performance
32nm provides improved performance or reduced leakage
Highest drive current of all reported 32nm technologies
1
10
100
1000
0.6 0.8 1.0 1.2 1.4 1.6 1.8ION (mA/um)
I OFF
(nA
/um
)
1.0 VIntel
45nmIntel
32nm
1
10
100
1000
0.8 1.0 1.2 1.4 1.6 1.8 2.0ION (mA/um)
I OFF
(nA
/um
)
1.0 VIntel
45nmIntel
32nm
Better Better
+14% +22%
>5x>10x
NMOS PMOS
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SRAM Cell Size Scaling
Transistor density doubles every 2 years
Moore’s Law continues!
0.1
1
10
1995 2000 2005 2010
Cell Area (um2)
0.5x every 2 years
32nm Generation0.171 um2 Cell
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32nm SRAM Test Chip
• 0.171 um2 cell
• 291 Mbit
• >1.9 billion transistors
• 4 GHz operation
• First demonstrated Sep ’07
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Rapid Yield Improvement
Defect Density(log scale)
2002 2003 2004 2005 2006 2007 2008 2009 20102002 2003 2004 2005 2006 2007 2008 2009 20102002 2003 2004 2005 2006 2007 2008 2009 2010
90 nm 65 nm 45 nm 32 nm
32nm yield improvement on track for Q4 ’09 production
2 yearHigher Chip Yield
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32nm Manufacturing Fabs
D1D Oregon - Now D1C Oregon - 4Q 2009
Fab 11X New Mexico - 2010Fab 32 Arizona - 2010
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System Integration
High Performance
Logic
Memory
Analog Graphics
Low Power Logic
Power Regulator
I/O I/O
I/O
Analog
High Perf. Logic
GraphicsLow Power
Logic
Power Reg.
Memory
Discrete SoC
System integration will continue, using key elements such as the AtomTM core, to realize improved
performance and power in a smaller form factor
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32nm SoC Process
45 nm 32 nm 22 nm
Process: P1266 P1266.8 P1268 P1269 P1270 P1271
Products: CPU SoC CPU SoC CPU SoC
Intel is developing both CPU and SoC versions of each process generation, to provide transistors, interconnects and other device features optimized for each product line
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Integrated Device Manufacturer Advantage
PackagingMasks
Process
Design Tools
Product
Manufacturing
Design for Manufacturing
Co-Optimized Process+Product
Rapid Yield Learning
Early Product Ramp
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Summary
• Intel has developed a 32nm logic technology with industry-leading features
• Intel is first to demonstrate working 32nm processors
• Intel’s 32nm process is on track for production readiness in Q4 ’09
• Both CPU and SoC versions of this 32nm process will be available
• Intel’s strength as an integrated device manufacturer allows us to continue to deliver new generations of advanced process technology on a 2 year cadence
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RiskRisk FactorsFactorsThe above statements and any others in this document that refer to plans and expectations for the first quarter, the year and the future are forward-looking statements that involve a number of risks and uncertainties. Many factors could affect Intel’s actual results, and variances from Intel’s current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could cause actual results to differ materially from the corporation’s expectations. Current uncertainty in global economic conditions pose a risk to the overall economy as consumers and businesses may defer purchases in response to tighter credit and negative financial news, which could negatively affect product demand and other related matters. Consequently, demand could be different from Intel's expectations due to factors including changes in business and economic conditions, including conditions in the credit market that could affect consumer confidence; customer acceptance of Intel’s and competitors’ products; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast. Revenue and the gross margin percentage are affected by the timing of new Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel’s response to such actions; Intel’s ability to respond quickly to technological developments and to incorporate new features into its products; and the availability of sufficient supply of components from suppliers to meet demand. The gross margin percentage could vary significantly from expectations based on changes in revenue levels; capacity utilization; excess or obsolete inventory; product mix and pricing; variations in inventory valuation, including variations related to the timing of qualifying products for sale; manufacturing yields; changes in unit costs; impairments of long-lived assets, including manufacturing, assembly/test and intangible assets; and the timing and execution of the manufacturing ramp and associated costs, including start-up costs. Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and profits. The tax rate expectation is based on current tax law and current expected income. The tax rate may be affected by the jurisdictions in which profits are determined to be earned and taxed; changes in the estimates of credits, benefits and deductions; the resolution of issues arising from tax audits with various tax authorities , including payment of interest and penalties; and the ability to realize deferred tax assets. The recent financial crisis affecting the banking system and financial markets and the going concern threats to investment banks and other financial institutions have resulted in a tightening in the credit markets, a reduced level of liquidity in many financial markets, and extreme volatility in fixed income, credit and equity markets. There could be a number of follow-on effects from the credit crisis on Intel’s business, including insolvency of key suppliers resulting in product delays; inability of customers to obtain credit to finance purchases of our products and/or customer insolvencies; counterparty failures negatively impacting our treasury operations; increased expense or inability to obtain short-term financing of Intel’s operations from the issuance of commercial paper; and increased impairments from the inability of investee companies to obtain financing. Gains or losses from equity securities and interest and other could also vary from expectations depending on gains or losses realized on the sale or exchange of securities; gains or losses from equity method investments; impairment charges related to debt securities as well as equity and other investments; interest rates; cash balances; and changes in fair value of derivative instruments. The current volatility in the financial markets and overall economic uncertainty increases the risk that the actual amounts realized in the future on our debt and equity investments will differ significantly from the fair values currently assigned to them. The majority of our non-marketable equity investment portfolio balance is concentrated in companies in the flash memory market segment, and declines in this market segment or changes in management’s plans with respect to our investments in this market segment could result in significant impairment charges, impacting restructuring charges as well as gains /losses on equity investments and interest and other. Intel's results could be impacted by adverse economic, social, political and physical/infrastructure conditions in the countries in which Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates. Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust and other issues, such as the litigation and regulatory matters described in Intel's SEC reports. .
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