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Page 1: Thermal Field Emission Scanning Electron Microscope (FEG ... · PDF fileSERC nanoFabrication, Processing and Characterisation (SnFPC) System Overview Thermal Field Emission Scanning

SERC nano Fabrication, Processing and Characterisation (SnFPC)

System Overview

Thermal Field Emission Scanning Electron

Microscope (FEG-SEM) JEOL JSM-7600F

JEOL JSM-7600F FEG-SEM combines an electron

column with semi-in-lens detectors and an in-the-

lens Schottky field emission gun, delivering

ultrahigh resolution combined with a wide range of

probe currents (1 pA to ≥ 200 nA). In addition to a

highly stable probe current, upper and lower

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•Ultrahigh resolution for fine surface morphology of

nanostructures (secondary electron image resolution

1.0nm at 15kV).

•Built-in r-filter enabling user selectable mixture of

secondary electron (SE) and backscattered electron

(BSE) images.

•Gentle Beam mode (GB) for accelerating voltage (kV)

top-surface imaging, reduced beam damage and

charge suppression allows examination of charging

specimens without additional coating (fig.1)

•New LABe detector allows imaging of specimens at

extremely low accelerating voltage (kV) with high

Typical Applications

Key Features

�Morphology analysis

�Fracture studies

�Thickness of coatings

�Cross sectional analysis

�Defects\Contaminations analysis

�Process characterization (such as

NanoImprint Lithography) and etc.

highly stable probe current, upper and lower

secondary-electron detectors, it is also equipped

with a retractable low-angle backscattered detector

(LABe), a scanning transmission electron detector

(STEM) and Oxford EDS\EBSD system, making it

ideal in materials characterization for compositional

and structural analysis.

FEGFEG--SEM JSM7600FSEM JSM7600F

Fig.1 Fig.2

For enquiries, please contact:

Institute of Materials Research and Engineering (IMRE) 3 Research Link, Singapore 117602 | Tel: (65) 6874 8111 | Fax: (65) 6872 0785

Email: [email protected] | Website: www.imre.a-star.edu.sg/rnd/snfc.asp

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extremely low accelerating voltage (kV) with high

spatial resolution (fig.2).

•STEM detector allows both bright-field and dark-field

imaging of thin, electron transparent samples with sub

0.8 nm resolution (fig.3 &4).

•EDS/EBSD capabilities – AZtecSynergy system

(Oxford AZtec energy/AZtec HKL) with X-MAX50

silicon drift detector; high counts rate allows

Nanoanalysis, Mapping, Crystal Orientation (fig 5 to 8).

Fig.4Fig. 3

Fig. 5 Fig. 6

Fig. 8

Recommended