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SERC nano Fabrication, Processing and Characterisation (SnFPC) System Overview Thermal Field Emission Scanning Electron Microscope (FEG-SEM) JEOL JSM-7600F JEOL JSM-7600F FEG-SEM combines an electron column with semi-in-lens detectors and an in-the- lens Schottky field emission gun, delivering ultrahigh resolution combined with a wide range of probe currents (1 pA to ≥ 200 nA). In addition to a highly stable probe current, upper and lower Electron Microscope (FEG-SEM) JEOL JSM7600F •Ultrahigh resolution for fine surface morphology of nanostructures (secondary electron image resolution 1.0nm at 15kV). •Built-in r-filter enabling user selectable mixture of secondary electron (SE) and backscattered electron (BSE) images. •Gentle Beam mode (GB) for accelerating voltage (kV) top-surface imaging, reduced beam damage and charge suppression allows examination of charging specimens without additional coating (fig.1) •New LABe detector allows imaging of specimens at extremely low accelerating voltage (kV) with high Typical Applications Key Features Morphology analysis Fracture studies Thickness of coatings Cross sectional analysis Defects\Contaminations analysis Process characterization (such as NanoImprint Lithography) and etc. highly stable probe current, upper and lower secondary-electron detectors, it is also equipped with a retractable low-angle backscattered detector (LABe), a scanning transmission electron detector (STEM) and Oxford EDS\EBSD system, making it ideal in materials characterization for compositional and structural analysis. FEG FEG-SEM JSM7600F SEM JSM7600F Fig.1 Fig.2 For enquiries, please contact: Institute of Materials Research and Engineering (IMRE) 3 Research Link, Singapore 117602 | Tel: (65) 6874 8111 | Fax: (65) 6872 0785 Email: [email protected] | Website: www.imre.a-star.edu.sg/rnd/snfc.asp Thermal Field Emission Scanning SnFPC/081/300912 extremely low accelerating voltage (kV) with high spatial resolution (fig.2). •STEM detector allows both bright-field and dark-field imaging of thin, electron transparent samples with sub 0.8 nm resolution (fig.3 &4). •EDS/EBSD capabilities – AZtecSynergy system (Oxford AZtec energy/AZtec HKL) with X-MAX50 silicon drift detector; high counts rate allows Nanoanalysis, Mapping, Crystal Orientation (fig 5 to 8). Fig.4 Fig. 3 Fig. 5 Fig. 6 Fig. 8

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Page 1: Thermal Field Emission Scanning Electron Microscope (FEG ... · PDF fileSERC nanoFabrication, Processing and Characterisation (SnFPC) System Overview Thermal Field Emission Scanning

SERC nano Fabrication, Processing and Characterisation (SnFPC)

System Overview

Thermal Field Emission Scanning Electron

Microscope (FEG-SEM) JEOL JSM-7600F

JEOL JSM-7600F FEG-SEM combines an electron

column with semi-in-lens detectors and an in-the-

lens Schottky field emission gun, delivering

ultrahigh resolution combined with a wide range of

probe currents (1 pA to ≥ 200 nA). In addition to a

highly stable probe current, upper and lower

Therm

al F

ield

Em

issio

n S

cannin

g E

lectr

on M

icro

scope (

FE

G-S

EM

) JE

OL J

SM

7600F

•Ultrahigh resolution for fine surface morphology of

nanostructures (secondary electron image resolution

1.0nm at 15kV).

•Built-in r-filter enabling user selectable mixture of

secondary electron (SE) and backscattered electron

(BSE) images.

•Gentle Beam mode (GB) for accelerating voltage (kV)

top-surface imaging, reduced beam damage and

charge suppression allows examination of charging

specimens without additional coating (fig.1)

•New LABe detector allows imaging of specimens at

extremely low accelerating voltage (kV) with high

Typical Applications

Key Features

�Morphology analysis

�Fracture studies

�Thickness of coatings

�Cross sectional analysis

�Defects\Contaminations analysis

�Process characterization (such as

NanoImprint Lithography) and etc.

highly stable probe current, upper and lower

secondary-electron detectors, it is also equipped

with a retractable low-angle backscattered detector

(LABe), a scanning transmission electron detector

(STEM) and Oxford EDS\EBSD system, making it

ideal in materials characterization for compositional

and structural analysis.

FEGFEG--SEM JSM7600FSEM JSM7600F

Fig.1 Fig.2

For enquiries, please contact:

Institute of Materials Research and Engineering (IMRE) 3 Research Link, Singapore 117602 | Tel: (65) 6874 8111 | Fax: (65) 6872 0785

Email: [email protected] | Website: www.imre.a-star.edu.sg/rnd/snfc.asp

Therm

al F

ield

Em

issio

n S

cannin

g E

lectr

on M

icro

scope (

FE

GS

nF

PC

/081/3

00912

extremely low accelerating voltage (kV) with high

spatial resolution (fig.2).

•STEM detector allows both bright-field and dark-field

imaging of thin, electron transparent samples with sub

0.8 nm resolution (fig.3 &4).

•EDS/EBSD capabilities – AZtecSynergy system

(Oxford AZtec energy/AZtec HKL) with X-MAX50

silicon drift detector; high counts rate allows

Nanoanalysis, Mapping, Crystal Orientation (fig 5 to 8).

Fig.4Fig. 3

Fig. 5 Fig. 6

Fig. 8