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Managing for Quality in the Electronics Industry
Sean Kelly
Motorola Inc.
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Greetings Greetings from Arizonafrom Arizona
Motorola Computer GroupTempe, Arizona, USA
Saguaro Saguaro CactusCactus
Grand Grand Canyon Canyon
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Introduction… What is Product Quality?
ProductQuality
Defect Rate
Reliability
Ease of UseServiceability
Look and Feel
Availability
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Introduction… What is Product Quality?
ProductQuality
Defect Rate
Reliability
Ease of UseServiceability
Look and Feel
Availability
All of these attributes contribute to the overall quality experience
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Introduction
• This presentation will explore the reliability, availability and defect rate attributes of product quality – What the attributes mean – How they are measured– How they impact the product performance and the
customer
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Introduction
• This presentation will also cover some of the methods and tools that product developers and manufacturers use to ensure desirable quality results.
MTBF
HA
SPC
DFMMTTR
ELF
ALT
RedundancySix Sigma
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Agenda
• Reliability• Availability• Quality (Defect Level) Time
Monthly Failure
Rate
0.01
0.1
1
10
100
1000
1,000 10,000 100,000 1,000,000MTBF
MT
TR
0.99 0.999 0.9999 0.99999 0.999999Total Defects Per Unit (TDU)
0.00
0.04
0.08
0.12
0.16
0.20
Time
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Product Focus
Computer SystemsPrinted
Circuit Assemblies
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Reliability & Availability
Defect Prevention and Elimination
Quality Life Cycle of a Product
Useful LifeIntegration, Deployment& Early Life
Supplied Materials &
Parts
ManufactureDesignEnd of Service
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Product Reliability
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Product Reliability• Reliability is an expression of the probability
that a part or system will function without failure in a defined environment for a designated period of time.– Example: Computer system X operating at 25 degrees C
has a 99% likelihood of functioning for a year without failure.
• Reliability Objective: Design and manufacture product that will continue to function with minimal failures for the intended life of the product
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Product Reliability Metrics
• Failure Rate– Commonly expressed as % per month or % per year
• Mean Time Between Failures– Reciprocal of failure rate; Usually expressed in hours
• Mean Time To Failure– Typically used for non-repairable product
Number of FailuresUnits x Time
=
Units x TimeNumber of Failures
MTBF =
(Time to Failure)Units
MTTF =
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Product Reliability Metrics - Examples• Failure Rate
= Number of Failures = 24 failures = 2.4% per year
( Units x Time ) 1000 units x 1 yr
• Mean Time Between FailuresMTBF = ( Units x Time ) = 1000 x 8760 hrs = 365000 hours
Number of Failures 24 failures
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Product Failure Rate Over Time: Early Life Failures and the Bathtub Curve
Time
Monthly Failure
Rate
Early Life Failures
Steady State
Wear-out
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Product Failure Rate Over Time: Early Life Failures and the Bathtub Curve
Time
Monthly Failure
Rate
Inherent Failure Rate Latent Defects
Early Life Failures
Steady State
Wear-out
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Product Return Rate Trend
Months Since Product Shipment
% Returned
Per Month
Early Life Failures and Possible
Design or Materials Problems Exposed
Escaping Defects,
Integration and
Application Problems
Stable Operating
Period
Wear-out Phase is well beyond this time
scale
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Product Field Return Trends
Time
Cu
mu
lati
ve
% R
etu
rns
Ob
se
rve
d M
TB
F
Cumulative Returns Observed MTBF
In general, after the initial ramp-up, return rate continues to drop throughout the first several years after product shipment
Observed MTBF increases with time
Return Rate decreases with time
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Predicting Product Reliability
• Reliability Predicted using models– Based on expected reliability of the components used in
the higher level product
• Demonstrated via ALT (Accelerated Life Testing)– Stress test a sample of the product
• Actual or Observed– Track field failure and returns data– Compare new designs to similar existing designs
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Accelerated Life Test (ALT)
• ALT is a process by which products are subjected to increased stress factors for controlled time periods– Temperature
– Vibration
– Humidity
– Voltage
– Power, etc.
• Multiple years of normal product life are compressed into a several week period.
• ALT testing enables a product developer to simulate potential product field-failure modes.
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ALT
• ALT may expose:– Hardware failures - True defects (repairable)– Design Failures - Failures due to design problems– Component Failures - Failures due to component
deficiencies– Integration Failures - Failures resulting from integration
with other products
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Accelerated Life Test (ALT)Example Test Process
A functional test is conducted between test phases
End
Thermal Shock Cycle
+85C/-40C time soak
No power applied
Random Vibration
6G’s RMS 20-2000 Hertz random time horizontal
time vertical
Temperature Cycle continuous time cycles
–20C to +75COr T of 95C
Power Soak Cycle
75C/85% RH
Functional Test
45C/85% RH
Start
Acceptance Test
0C 4.75 & 5.25 VDC
50C 4.75 & 5.25 VDC
45C/85% RH
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Environmental DVT (Design Validation Test)
• The purpose of Environmental Design Validation Testing (DVT) is to validate the hardware design and manufacturing process by stressing the product in various environmental conditions.
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Environmental DVT (Design Validation Test) Example Test Process
Sinusoidal Vibration
16G’s RMS 5-12000Hz
Horizontal &Vertical
Thermal Shock Cycle
+85C/-40C No Power
AcceptanceTest
at Ambient Temperature to Verify Product
Prior to Testing
End
Test at Ambient Temperature
to Verify Thermal Shock and Sinusoidal Vibration Did
Not Cause Defects
Temperature Cycle
Continuous 2-Hour Cycles
5o of Datasheet
Temperatures
Power Cycle with Temperature
Cycles and Voltage Margins
Verify Product Initializes on Each
Power Cycle
Voltage Margins with Temperature Cycles
3.3v/3.4v/3.3v/3.2v Cycles5v/5.2v/5v/4.8v Cycles
12v/12.6v/11.4v Cycles-5C/+55C Cycles
Start
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Other Tests: Compliance, Regulatory, Safety, Packaging, etc.
• Drop Tests (Packaging)• Radiated & Conducted Emissions• Electrostatic Discharge Immunity (ESD)• Surge• Voltage Dips and Interruptions • Safety
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Product Availability
• Probability that a product is operational at a given time
High Availability High Availability Five 9’s Five 9’s 99.999% 99.999%
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Product Availability Metrics
(Time to Repair)Number of Failures
MTTR =
Availability = 1 - Unavailability
MTBFMTBF + MTTR
Availability =
Under steady-state conditions:
Where:
The product is either available or unavailable:
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Product Availability Calculation
0.01
0.1
1
10
100
1000
1,000 10,000 100,000 1,000,000MTBF
MT
TR
0.99 0.999 0.9999 0.99999 0.999999
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Availability: 5 Nines Examples
0.01
0.1
1
10
100
1000
1,000 10,000 100,000 1,000,000MTBF
MT
TR
0.99 0.999 0.9999 0.99999 0.999999
8760 Hours
5.26 Minutes (0.0876 Hours)
438000 Hours (2%/yr)
4.38 Hours
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Availability From An End-User Perspective• Probability that a product is available for use
when the user wants to use the product• Availability is often dependent on both the
end-user product and the service provider– Example: Each of these factors contributes to cell phone
availability from the end-user perspective• Cellular phone is functional• User has a charged battery• Network coverage exists • Network is functional
NetworkNetwork
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Design for Increased AvailabilityEnd-User Consumer Product• Increase reliability (MTBF) and reduce latent defects• Provide a back-up for common failure modes
– Battery back-up in plug-in alarm clock for power outages
• Provide fast repair or replacement– Cellular phone failure
• Slower: Send in for repair and return. • Faster: Delivery of replacement phone.• Even Faster: On-site spare.
– Flat tire• Slower: Call for tow service.• Faster: Replace flat tire with spare.• Even Faster: Tire that indicates failure, but does not go flat
right away.
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Availability From A System Perspective
• Percentage of time a system is available for use• Key factors
– Failure Rate of each system module
– Impact of a module failure on the overall system
• Single point of failure causes system level failure– Time to repair or replace faulty product determines downtime
• Module failure causes loss of certain functions– May be able to continue to use
• Module failure does not result in system level failure– Redundancy and fault resiliency
– Time to Repair or Restore full system functionality
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Design for Increased AvailabilitySystem Product• Use redundancy within the system so a single module failure will
not cause a system failure; all system components have back-ups
3 redundant power supplies (2+1)
3 redundant cooling fans (2+1)
2 redundant storage drives
Sets of redundant process boards
Hot swap Hot swap capabilitycapability
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Design for Increased AvailabilitySystem Product
• Allow for very rapid return to service– Software fault management
• Software manages system resources to work around faulty module and to restore operation to the replacement module
– Hot swap replacement• System remains functional during replacement
operation– Redundant system as standby
• Hot standby with immediate switchover
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Product Selection For Availability
• Determine application requirements– Impact of a failure during operation
• Service options– Attended vs. remote site
• For example, office vs. mountain top product location– Cost and time of service vs. cost of other designed in
robustness options
• Select products and suppliers that can hit the quality, reliability and availability requirements
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Product Quality
• Objective:
Design, manufacture
and deliver defect
free product that
meets defined
specifications and
customer
requirements
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Manufacturing QualityDefinitions
• Unit– The item produced or processed.
• CTQ (Critical To Quality)– Characteristics which are key to the customer’s perception of
quality.
• Defect– An unacceptable variation of a quality characteristic from its
intended level.
• Opportunity– Any action in which the product, service, or information is
handled.– Any action performed or neglected during the creation of a unit
of work.
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Manufacturing Standards
• Examples of manufacturing quality standards – IPC-A-600 Acceptability of
Printed Boards– IPC-A-610 Acceptability of
Printed Board Assemblies– IPC R-700 Guidelines for
Modification, Rework and Repair of Printed Boards and Assemblies
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Manufacturing TestingPrinted Circuit Board Example
• In-Circuit Test (ICT), sometimes using a bed-of-nails fixture, tests the product for electrical properties.
– Shorts, Opens, Parts, etc.
• Functional Test is performed on the completed product assembly to verify the functional characteristics of the product.
– Use on-board or external diagnostics and relevant operating systems.– Intent is to simulate actual customer operation of the product as closely
as possible.
• Automated Optical Inspection (AOI) is used to verify all parts are on the board in the correct position.
– Supplements human inspection, which is not capable of detecting all defects
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Manufacturing Process: Delivered Defects
• No test or inspection is 100% effective in finding defects.– For example, a single visual inspection may only identify 70% of
the actual defects
• Multiple, successive visual inspections will find more defects, but this adds cost and time
• Delivered defects escape the test and inspection processes within the factory.
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Product Failure Rate Over Time: Early Life Failures and the Bathtub Curve
Time
Monthly Failure
Rate
Inherent Failure Rate Latent Defects
Early Life Failures
Steady State
Wear-outProportional to Manufacturing Defects
ELF Caused by Latent Defects
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Manufacturing Process
• Reducing the TDU in the entire manufacturing process will:– Reduce the cycle time per unit
• Less rework, test and inspection required– Reduce delivered defects– Reduce early life failure rate– Decrease warranty cost per unit
• Total Defects Per Unit (TDU or DPU)Total Number of Defects
Number of UnitsTDU =
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Design Process: Long-Term Reliability
• The greater the design margin, the lower the inherent failure rate.
• Electronic products, with superior design margin, built without defect, and operated within design limits…
will operate without failure
for many, many years
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Product Sigma, a Figure of Merit
• From DPMO, we can calculate Sigma for a product.– Sigma is a standardized method to measure and compare the
quality of any product or process, regardless of complexity.
• Defects Per Unit could be expected to be proportional to complexity of the unit
• Complexity is directly proportional to the number of opportunities to create a defect
• To normalize products of different complexity, use
Total Number of DefectsOpportunities Per Unit x Number of Units
DPMO = x 1,000,000
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Product Quality Metrics: TDU & DPMO
Total Defects Per Unit (TDU)
0.00
0.04
0.08
0.12
0.16
0.20
Time
Defects Per Million Opp. (DPMO)
0
5
10
15
20
25
Time
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Design For Manufacturability (DFM)
• Manufacturability is the ability to reproduce, identically and without waste, units of product so that they satisfy all of the customer’s physical and functional requirements.
• The greater the design margin, the lower the Total Defects Per Unit (TDU).
• Design margin is measured by Capability Index (Cp)
Maximum Allowable Range of CharacteristicNormal Variation of Process
Cp =
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Statistical Process Control (SPC)
• Process characteristics and outcomes contain variability over time.
• Statistical Process Control is used to– Track the process variation,– Determine the current amount of expected variation,– Identify when the variation exceeds statistical limits, – Provide insight into how to reduce the process variation, thus
increasing the process capability (Cp)
• SPC control charts show the tracked values and statistical limits– Goal is to stay inside the limits and to reduce the limits by
continuously decreasing variability
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Reduce the variation and center the process to eliminate defects
Need to center the process meanNeed to reduce
the process variation
Six Sigma process, centered on target
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SummaryQuality Life Cycle
Useful LifeIntegration, Deployment& Early Life
Reduce Variation for
Fewer Defects
ManufactureDesignEnd of Service
Have Fewer Escaping
and Latent Defects
Achieve Higher MTBF
and Availability
Longer Life with Lower
Cost
Create Reliable and Manufacturable
Designs
DFM SPCDVT HA MTTR6 ALT
Reliability & Availability
Defect Prevention and Elimination
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Summary
• Start with a Robust Design – Manufacturable (DFM)– Reliable (DVT, ALT, MTBF)– Repairable (MTTR)
• Control the variability in the factory (Cp, SPC)– Lower TDU
• Which results in…– Fewer latent defects & early life failures– Higher MTBF– Higher Availability
• High MTBF & Low MTTR High Availability– Lower costs and higher Customer Satisfaction
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