T. Yoda et al., assignors to ShinkoElectric Industries Co., Ltd.,Naganoken, and C. Uyemura & Co.Ltd., Osaka, both of Japan
A method of nickel or nickel alloyelectroplating a conductor partiallymasked with an organic polymericresist layer comprising dipping theconductor partially masked withan organic polymeric resist layer inan electroplating bath comprising awater-soluble cobalt salt in a concentration of 5 to 40 gIL on thebasis of nickel ion equivalent andan electrically conductive salt containing at least one cation selectedfrom the group consisting ofan ammonium ion, magnesium ion, calcium ion, aluminum ion, and barium ion in a concentration of 150 to500 gIL, said electrical conductive
salt substantially not containing asodium ion and a potassium ion ascations, and the electroplating bathhaving a pH of 3.5 to 4; and applying a current using the conductoras a cathode; whereby a portion ofthe conductor other than the areamasked with the resist layer isformed with a nickel or nickelcobalt alloy plating film withoutfloating or peeling of the resistlayer.
SELECTIVE COPPER DEPOSlnONMETHODUS. Patent 5,985,125. Nov. 16, 1999J.J. Kim, assignor to LG SemiconCo., Ltd., Cheongju, Rep. of Korea
A selective copper depositionmethod for forming a wiring.
PLAnNG WORKPIECE HOLDER
US. Patent 5,985,126. Nov. 16, 1999M.C. Bleck et al., assignors to Semitool Inc., Kalispell, Mont.
A semiconductor plating systemworkpiece support having workpiece engaging electrodes with distal contact part and dielectric cover.
TREAnNG PAINT SPRAYBOOTHWATERUS. Patent 5,985,154. Nov. 16, 1999H.E. Agree, assignors toBetzDearborn Inc., Trevose, Pa.
A method for detackifying anddispersing solventborne paints inpaint spraybooth water comprising adding an effective amount ofan aqueous composition comprising a water-soluble cationic polymer having a molecular weight of1,000 to 600,000, a nonionic sur-
RECOVERY ENGINEERING & SALES COMPANYP.O. Box 297, Arvada, Colorado 80001-0297Phone: (303) 292-5702 • Fax: (303) 292-5717
www.reasco.com
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Requirements
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