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Optoelectronic Devices Product Assurance Guideline

for Space Applicationfor Space Application.A BA. Bensoussan

Thales Alenia Space, France

Prof. M. VanziUniversity of Cagliari, Sardinia, Italy

4 - 8 October, 2010ICSO 2010, RHODES ISLAND, GREECE.

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Content

Optoelectronics Handbook

Optoelectronics in satellite payloadsIndustrialization concerns and Quality constraintsQuality Assurance tools to be builtMulti-partnership build up : an Optoelectronic and Reliability ad-hoc working group synergy.Conclusion

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O t l t i i t llitOptoelectronics in satellite payloadspayloads.

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Optoelectronic innovative payloads : interests and impacts.

Applications & requirements expressed for Telecom & RF Sensing payloads.

Optical technologies and Photonic payload sub-system concepts including :

Optical TMTC & data handling networking

Optical backplane and high-speed interconnects

Optically-controlled active antennas (OCA) as for example multi-Beam Ka broadband mission (flexibility)

Opto-microwave re-configurable repeaters (ORR)

Optical generation & mixing of microwave signals

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Photonic sub-system concepts for Telecom repeaters


Photonic sub-system concepts for Telecom repeaters

Optical distribution of reference oscillators & LO’s

Optical generation of high-frequency LO : Ka, Q and V bands

Optical frequency-conversion (down-conversion, up-conversion)

Optical distribution / switching of microwave signals

Optical TMTC networking and data handling

Optical backplane & interconnects for digital processorsp p g p

Optical routing (flexible interconnects) in digital processors

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Photonic sub-system concepts for Telecom antennas


Photonic sub-system concepts for Telecom antennas

Optical distribution / collection of control & telemetry signals

Optical distribution of LO in heterodyne analogue beam-forming

Optical analogue beam-forming networks

Optical backplane & interconnects in digital LF processorsp p g p

Optical sampling and transmission of signals in new antenna architectures

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Opto-microwave re-configurable repeater (ORR) - Generic


Opto microwave re configurable repeater (ORR) Generic ORR architectural concept, demonstrator & enabling technologies.

optical generation & distribution of centralised LO’s

optical frequency-mixing to perform down frequency conversion (from Ka to C)

i l i f h l hi h l i ( boptical cross-connection of µ-wave channels to achieve channel routing (e. g. by MOEMS switches)

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Advantage of such a flexible Opto-microwave re-


Advantage of such a flexible Opto microwave reconfigurable repeater (ORR).

System based on LO’s transferred on optical carriers andSystem based on LO’s transferred on optical carriers and delivered to modulator-based electro-optical mixers.

exceed the capabilities of equivalent microwave implementations.at identical system functionality and scale,

• it may bring drastic mass savings,y g g ,• very low loss of optical fibers compared to copper wires, • full RF isolation and suppression of EMC/EMI issues, • and above all could grow up to larger connectivity (10’s of beams)

Other benefits arise from transparency to RF frequency bands and new

and above all, could grow up to larger connectivity (10 s of beams) and cross-connect a large number of channels.

Other benefits arise from transparency to RF frequency bands and new functions routing like WDM (Wavelength Division Multiplexing).

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Demonstrator of a Opto-microwave re-configurable repeater


Demonstrator of a Opto microwave re configurable repeater (ORR).

1 Optical LO generation & distribution

2 Electro-optical frequency-mixer

3 Optical distribution &3 Optical distribution & cross-connection

4 Microwave optoelectronic receiversoptoelectronic receivers

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Optoelectronic innovative payloads.


Optoelectronic innovative payloads.Optoelectronic system architectures are potentially attractive and innovative solutions for Space hardware equipments in telecommunications.

System re-configurability, flexibility, complex multiple spot-beam coverage based on frequency reuse will take the large advantage of optoelectronic thanks to the following benefits :

drastic mass savings

exceed the capabilities of equivalent microwave implementations,

grow up to larger connectivity (10’s of beams)

cross-connect a large number of channels

new functions routing like WDMnew functions routing like WDM

The demonstrators phase is engaged.

Th i d t i li ti h t b d fi d d i iti t d th t tThe industrialization phase must be defined and initiated as the next step.

The Optoelectronic parts qualification methodology for space application must be prepared and built

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must be prepared and built.


I d t i li tiIndustrialization concerns and Quality constraintsand Quality constraints.

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Industrialization concerns and Quality constraints.

WE ARE FACING TO

THE DIVERSITY AND COMPLEXITY OF PRODUCTS AND FUNCTIONS

HIGH TECHNOLOGY LEVEL PRODUCTS (f i l t iHIGH TECHNOLOGY LEVEL PRODUCTS (from micro-electronics,

Quantum Physics, Photonics, interaction light with matter (2D and 3D)),

RAPID EVOLUTION OF THE TECHNOLOGIES AND PRODUCTS

CONSTRAINTS AND STRESS ENVIRONMENTS (Thermal managementCONSTRAINTS AND STRESS ENVIRONMENTS (Thermal management,

radiation, vacuum, mechanical including vibration and acceleration, …)

BUILT AND DESIGN INNOVATIVE APPLICATIONS (new functions for new

concepts, risk management, quality control and proof, design forconcepts, risk management, quality control and proof, design for

performance and long term lifetime, …)

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Industrialization concerns and Quality constraints.

How to define a pragmatic well balanced approach ?

For what purpose ?

Which level of integration ?Which level of integration ?

On which parameters ?

How to define stress conditions ?

Who will be responsible to implement ?p p

Which methodology?

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Level 1 Basic Light Generation Functions :For what purpose : Diversity and complexity of products

Optoelectronic emitters : Lasers, VCELS, electroluminescent and superluminescent diodes.

Level 1 Basic Light Receiver functions : Optoelectronic receivers (Photodiodes, PIN diodes, Avalanche PD, Travelling-wave photodiodes (TWPD).

Level 1 Basic Light Management Functions : Splitters, polarisers, filters, mixers, isolators, couplers, gratings, 2D and 3D Micro-Opto-Electro-Mechanical Systems (MOEMS) (Optical Cross-connects (OXC), Tilting mirror arrays), Switches (micromirrors, micro-shutters), Electro-optical modulators.

Level 1 Passive Light transport :Level 1 Passive Light transport :Optical fibers (single mode, multi-modes, Polarization Maintaining, with Brag Grating, …), Optical connectors (single or multifibers).

Level 2 Generic functions for Light Amp Atten or Splitting :Level 2 Generic functions for Light Amp., Atten., or Splitting :Semiconductor Optical Amplifiers (SOA), Tunable Optical Filters (such as Fabry-Perot), Variable Optical Amplifier (VOA), Variable Gain Equalizer, Erbium-Doped Fiber Amplifiers (EDFA), Erbium-Doped Waveguide Amplifiers (EDWA), Adaptive Optics (MOEMS deformable mirrors), Sensors, Diffraction grating MOEMS.

Level 2 or 3 Complex Optoelectronic functions:Transceivers modules, 3-D MOEMS cross-connect switches, Reconfigurable Optical

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Add-Drop Multiplexer (ROADM), Tunable Laser Multiplexers (TLM), Optical Power Monitor arrays, Gyroscopes.

Which level of integration to address : High Tech product

3 LEVELS OF COMPLEXITY

FACE TO

l ifi ti ith t t 3HIGH TECHNOLOGY LEVEL PRODUCTS : classification with respect to 3 LEVELS of complexity. We need to define an interactive option testing (basic purpose is to not duplicate testing from one level to another for

t d lit ti i ti )cost and quality optimization).

Main proposed pragmatic approach:

Corresponding industrialization, manufacturing, screening and qualification methodologies must be organized and adapted to each Level considered

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What to address : High Tech product

LEVEL 1 ELEMENTS :

Are basic optoelectronic elements used stand alone in a package orready to be assembled into higher complex optoelectronic functionsready to be assembled into higher complex optoelectronic functions(level 2 or 3)

Main proposed pragmatic approach :

Known materials and constructional analysis, Industrialization, manufacturing, screening and g gqualification methodologies must refer to stress test able to discriminate direct impact on intrinsic

f f th l tperformance of the element.

For example : Endurance stress tests (vacuum gazFor example : Endurance stress tests (vacuum, gaz or ionic contaminant, radiation stress, biasing steady state DC or pulsed) may modify and degrade

16© ICSO 2010main optical performances.

LEVEL 2 MODULE FUNCTIONS :What to address : High Tech product (cont’d)

LEVEL 2 MODULE FUNCTIONS :

Are assembled optoelectronic elements in a simple function (in asemi-complex packaged module ) used in a multi chip package andready to be used at subsystem or system level into higher complexoptoelectronic functions (level 3)

Main proposed pragmatic approach :Known materials and constructional analysis, design, industrialization, manufacturing, screening

Main proposed pragmatic approach :

g g gand qualification methodologies must refer to stress test able to discriminate direct impact on f ti lit d f f th i lfunctionality and performance of the semi-complex product.

For example : Mechanical & Environment stress tests at assembly and package level.

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LEVEL 3 PRODUCTS & SUB-SYSTEMS :What to address : High Tech product (cont’d)

LEVEL 3 PRODUCTS & SUB-SYSTEMS :

Are assembled optoelectronic sub-systems in a complex function(named Complex MCM module) used in a multi chip package and

d t b d t t l l i t t l t i b dready to be used at system level into optoelectronic basedequipments hardware (level 3).

Main proposed pragmatic approach :Industrialization, manufacturing, screening and qualification methodologies must refer to stress test

p p p g pp

gable to consolidate full High-Reliability space hardware guarantees.

For example : Mechanical & Environment stress tests at system leveltests at system level.

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Which relevant parameters and characteristics to address ?

To increase the performance and reliability of the system under design, MIL-HDBK-1547 defines rules to use Electrical, Electronic, Electromagnetic, Opticaland Mechanical parts Such products are considered aging sensitive whenand Mechanical parts. Such products are considered aging sensitive, whenthey are subjected to gradual shortening over their useful life. On MOEMS forexample, aging mechanisms include the following:

Loss of hermeticity,

Stress relaxation

Loss of Torque,

Loss of Spring Tension

Molecular cross-linking

AnnealingStress relaxation,

Oxidation and Corrosion,

Outgassing

Loss of Spring Tension,

Electro migration,

Parameters drifts

Annealing

Moisture absorption

Radiation effectsOutgassing,

Cold flow and Creep,

Loss of adhesion,

Parameters driftsCurrent Leakage,

Optical performancechange (lasing power, λ,

Radiation effects

Through put

Actuation speedLoss of adhesion,

Embrittlement (includingthermal) and Hardening,

change (lasing power, λ,losses, ...)

Breakdown Voltage,

Forward degradation.

Actuation speed

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Forward degradation.

How to define constraints and stress environments

Design considerations (maximum rating and derating)Design considerations (maximum rating and derating)

Handling and assembly ability and controls (where are the li it ?)limits ?)

Humidity and salt atmosphere before launch

Acceleration, vibration and shocks during launch

Pressure and temperature : during launch rapidPressure and temperature : during launch rapid depressurization and from room temperature to –120°C in few minutes (freezing, outgassing, …)few minutes (freezing, outgassing, …)

in flight constraintsMi itMicrogravity

Vacuum (and optical contaminants)

Radiation20© ICSO 2010

Radiation

Extreme Temperatures (thermal cycling)

Who will implement ?

P R O C E S S / P R O D U C T C A P A B I L I T I E S A N D P E R F O R M A N C E S

P R O C E S S / P R O D U C TD E S I G N R U L E S A N D I N D U S T R I A L I S A T I O NI N D U S T R I A L I S A T I O N

P R O C E S S / P R O D U C T M A N U F A C T U R I N G ?MANUFACTURER’ END USER’s TEST HOUSE’sM A N U F A C T U R I N G ?

S C R E E N I N G A N D Q U A L I T Y C O N T R O L S

MANUFACTURER’s QMS

END USER s

QMS

TEST HOUSE s

QMS

P R O C E S S / P R O D U C T E V A L U A T I O N A N D

Q U A L I F I C A T I O N

P R O C E S S / P R O D U C T L O T Q U A L I T Y

C O N T R O L S

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Which screening, qualification and methodology

L1-QM01 : Characterisation and L e v e l 1 Q u a l . M e th o d o lo g y

L 1 Q M 0 1E L E M E N T

C H A R A C T E R IS A T IO N P E R F O R M A N C E

L e v e l 1 Q u a l .M e t h o d o l o g y

L 1 Q M 0 2

qualification

L1 QM02 : EnvironmentalElements

P E R F O R M A N C E Q U A L IF IC A T IO N T E S T

P R O G R A M

E L E M E N T E N V I R O N M E N T A L

Q U A L I F I C A T I O N T E S T P R O G R A M

L1-QM02 : Environmental qualification

L1 QM03 E d lifi i

ElementsL e v e l 1 Q u a l.M e th o d o lo g y

L 1 Q M 0 3E L E M E N T

L e v e l 2 Q u a l . M e t h o d o l o g y

L 2 Q M 0 1

L1-QM03 : Endurance qualificationE L E M E N T

E N D U R A N C E Q U A L IF IC A T IO N T E S T

P R O G R A M

L 2 Q M 0 1P A C K . F U N C T I O N

M E C H A N I C A L Q U A L I F I C A T I O N T E S T

P R O G R A ML e v e l 3 Q u a l . M e t h o d o lo g y

L2-QM01, 02 & 03: Packaging qualification

Modules

g yL 3 Q M 0 1 t o L 3 Q M 0 3

P R O D U C T S C R E E N IN G ,

Q U A L IF IC A T IO N A N D Q C I T E S T P R O G R A M

L3-QM01,02 & 03: Product qualificationSub-system

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Sub system


Quality assurance tools:MIL-STD test methods overview,TELCORDIATELCORDIAQualification methodology.gy

For definition of consolidatedFor definition of consolidatedEuropean Standards ECSS and ESCC

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Quality assurance tools for Micro-Opto-ElectronicsQuality assurance tools for Micro Opto ElectronicsEuropean Space agency• ECSS-Q-ST-60-05: Generic procurement requirements for hybrid microcircuits. • Generic specification ESCC-9010 : Monolithic Microwave Integrated Circuits (MMICs) JEDEC• JEDEC JESD49 Procurement Standard for Semiconductor Die Products IncludingJEDEC JESD49 Procurement Standard for Semiconductor Die Products Including

Known Good Die• JEP149 : Application Thermal Derating MethodologiesMILITARYMILITARY• MIL-PRF-19500, General Specification for Semiconductor Devices• MIL-PRF-38534, General Specification for Hybrid Microcircuits

MIL PRF 38535 G l S ifi ti f I t t d Ci it M f t i• MIL-PRF-38535, General Specification for Integrated Circuits Manufacturing • MIL-STD-883 Microelectronics Test Methods, and Procedures, • MIL-HDBK-781A: Handbook for reliability test methods, plans and environments for

engineering development qualification and productionengineering, development, qualification and production.OTHER• TELCORDIA GR-468-CORE : Generic Reliability Assurance for Optoelectronic Devices

used in Telecommunications Equipment

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used in Telecommunications Equipment

Qualification approach.

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M lti t hi b ildMulti-partnership build up :the Optoelectronic andthe Optoelectronic andReliability ad-hoc workingReliability ad hoc workinggroup synergy.

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There is a strong need for a Standards Quality assurance documents.

But prior to built such standards it has been presented during ISROSBut prior to built such standards it has been presented during ISROS 2009 and 2010 the need to elaborate a guideline document to synthesize the best practices and recommendations to design, test, industrialize,

f fuse, control, screen and qualify optoelectronic products for end-use in Space Application.

A tentative was initiated to work on a common document titled :

“PRODUCT ASSURANCE GUIDELINE FOR OPTOELECTRONIC DEVICES FOR SPACE APPLICATION”

Today, this initiative need to be enlarged and more deeply activatedToday, this initiative need to be enlarged and more deeply activated thanks to the effort of the existing community.

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AbstractThe guide is foreseen to be a high technical synthesis for :

understanding the various aspects of Opto-Electronic devices

b h i d S E i ibehaviors under Space Environment constraints

Semiconductor material properties and device structures along with the final products (Emitters, Receivers, Opto-Electronic functions, passive Opto-Electronic functions)

Performance and reliability aspects of Opto-Electronic devices.

Failure mechanisms and analysis

Q lit d lifi ti th d l i iQuality assurance and qualification methodologies overview.

It will present in details Opto-Electronic device designs, packaging, d l t f t i i d t i li ti li ti t tdevelopment, manufacturing, industrializations, application uses, test and controls, screening sequences, qualification procedures and test methods, environment effects (Radiation, vacuum, thermal, mechanical, long term and end of life, …) and will help the reader to understand the means of developing suitable qualification plans and demonstrate high reliability equipment achievement using optoelectronic products.

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y q p g p p


Optoelectronics basic thematicOptoelectronics basic thematic

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Optoelectronics transverse thematicOptoelectronics transverse thematic

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Basic thematic

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Product Assurance Guideline forProduct Assurance Guideline for Optoelectronics for Space Application

Grand Chapter I Solid State physics for

Grand Chapter IVOpto-Electronic Devices

optoelectronics development for space

Grand Chapter II Space environment

constraints description

Grand Chapter VFailure mechanisms and

analysisconstraints description.

Grand Chapter III

analysis

Grand Chapter IIIOpto-Electronic devices :

technologies, main performances and reliability.

Grand Chapter VIQuality Assurance Space

Standards

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GOAL OF THE HANDBOOK

The content of this handbook is composed of chapters written by the contributors acting as honorary, benefactor or active members.

How to prepare this handbook ?How to prepare this handbook ?

On a collaborative WIKI platform.

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Multi-partnership build up : the Optoelectronic and Reliability yad-hoc working group synergy.

E C MEnterprise Content Management : a collaborative platform open to all external partners.

Secured URL web browser :https://www-ecm.thalesaleniaspace.fr/ecm

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What is Livelink?

A secured tool to exchange and share information

• Exchange and share documentsAccess rights management

• Communicate/Diffuse an informationDiscussions and forumsAccess rights management

Documentary process

• Supply and retrieve information

Discussions and forums

• Collaborate within a project or an

organisationanytime, anywhere

Communication facilitiesEnhanced search engine

organisationCommunities

• Manage and automate business g

• Maintain documentary spacesIndividual or shared workspaces

processBusiness workflows

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NEW !TWO FORUMS ARE NOW OPEN FOR CONTRIBUTING TO THIS COMMON APPROACH DEFINITION.

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NEW !TWO FORUMS ARE NOW OPEN FOR CONTRIBUTING TO THIS COMMON APPROACH DEFINITION.

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Multi-partnership build up : the Optoelectronic and Reliability ad-hoc working group synergy.

ContributorsContributors

AGENCIES (5)20%

MANUFACTURERS (4)

Country contributionsFranceS20%

SPACE INDUSTRIES (3)16%

(4)16% 40% USA

8%

RESEARCH UNIVERSITIES (7)

28%The NetherlandsLABORATORIES (5)

20%

28%

United Kingdom

The Netherlands4%

United Kingdom8%Italy

20%Spain

4%Germany

4%Belgium

8%

Japan4%

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C l i


Conclusion

Optoelectronic innovative payloads : interests and impacts.Industrialization concerns and Quality constraints.Quality assurance tools:Quality assurance tools:

3 levels (L1QM01, …) for basic elements to complex sub systemssub-systems.

Multi-partnership build up synergy for the implementation f th O t l t i P d t A d tof the Optoelectronic Product Assurance document.

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For questions on EEE parts Standards and Qualification: [email protected]

For question on Opto-electronics Reliability :[email protected]

Or let’s open the forum discussion and join the WEB link :

https://www ecm thalesaleniaspace fr/ecmhttps://www-ecm.thalesaleniaspace.fr/ecm

Thank you for your attention

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