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  • Optoelectronic Devices Product Assurance Guideline

    for Space Applicationfor Space Application.A BA. Bensoussan

    Thales Alenia Space, France

    Prof. M. VanziUniversity of Cagliari, Sardinia, Italy

    4 - 8 October, 2010ICSO 2010, RHODES ISLAND, GREECE.

    1 ICSO 2010

  • Content

    Optoelectronics Handbook

    Optoelectronics in satellite payloadsIndustrialization concerns and Quality constraintsQuality Assurance tools to be builtMulti-partnership build up : an Optoelectronic and Reliability ad-hoc working group synergy.Conclusion

    2 ICSO 2010

  • O t l t i i t llitOptoelectronics in satellite payloadspayloads.

    3 ICSO 2010

  • Optoelectronic innovative payloads : interests and impacts.

    Applications & requirements expressed for Telecom & RF Sensing payloads.

    Optical technologies and Photonic payload sub-system concepts including :

    Optical TMTC & data handling networking

    Optical backplane and high-speed interconnects

    Optically-controlled active antennas (OCA) as for example multi-Beam Ka broadband mission (flexibility)

    Opto-microwave re-configurable repeaters (ORR)

    Optical generation & mixing of microwave signals

    4 ICSO 2010

  • Photonic sub-system concepts for Telecom repeaters

    Optoelectronic innovative payloads : interests and impacts.

    Photonic sub-system concepts for Telecom repeaters

    Optical distribution of reference oscillators & LOs

    Optical generation of high-frequency LO : Ka, Q and V bands

    Optical frequency-conversion (down-conversion, up-conversion)

    Optical distribution / switching of microwave signals

    Optical TMTC networking and data handling

    Optical backplane & interconnects for digital processorsp p g p

    Optical routing (flexible interconnects) in digital processors

    5 ICSO 2010

  • Photonic sub-system concepts for Telecom antennas

    Optoelectronic innovative payloads : interests and impacts.

    Photonic sub-system concepts for Telecom antennas

    Optical distribution / collection of control & telemetry signals

    Optical distribution of LO in heterodyne analogue beam-forming

    Optical analogue beam-forming networks

    Optical backplane & interconnects in digital LF processorsp p g p

    Optical sampling and transmission of signals in new antenna architectures

    6 ICSO 2010

  • Opto-microwave re-configurable repeater (ORR) - Generic

    Optoelectronic innovative payloads : interests and impacts.

    Opto microwave re configurable repeater (ORR) Generic ORR architectural concept, demonstrator & enabling technologies.

    optical generation & distribution of centralised LOs

    optical frequency-mixing to perform down frequency conversion (from Ka to C)

    i l i f h l hi h l i ( boptical cross-connection of -wave channels to achieve channel routing (e. g. by MOEMS switches)

    7 ICSO 2010

  • Advantage of such a flexible Opto-microwave re-

    Optoelectronic innovative payloads : interests and impacts.

    Advantage of such a flexible Opto microwave reconfigurable repeater (ORR).

    System based on LOs transferred on optical carriers andSystem based on LOs transferred on optical carriers and delivered to modulator-based electro-optical mixers.

    exceed the capabilities of equivalent microwave implementations.at identical system functionality and scale,

    it may bring drastic mass savings,y g g , very low loss of optical fibers compared to copper wires, full RF isolation and suppression of EMC/EMI issues, and above all could grow up to larger connectivity (10s of beams)

    Other benefits arise from transparency to RF frequency bands and new

    and above all, could grow up to larger connectivity (10 s of beams) and cross-connect a large number of channels.

    Other benefits arise from transparency to RF frequency bands and new functions routing like WDM (Wavelength Division Multiplexing).

    8 ICSO 2010

  • Demonstrator of a Opto-microwave re-configurable repeater

    Optoelectronic innovative payloads : interests and impacts.

    Demonstrator of a Opto microwave re configurable repeater (ORR).

    1 Optical LO generation & distribution

    2 Electro-optical frequency-mixer

    3 Optical distribution &3 Optical distribution & cross-connection

    4 Microwave optoelectronic receiversoptoelectronic receivers

    9 ICSO 2010

  • Optoelectronic innovative payloads.

    Optoelectronic innovative payloads : interests and impacts.

    Optoelectronic innovative payloads.Optoelectronic system architectures are potentially attractive and innovative solutions for Space hardware equipments in telecommunications.

    System re-configurability, flexibility, complex multiple spot-beam coverage based on frequency reuse will take the large advantage of optoelectronic thanks to the following benefits :

    drastic mass savings

    exceed the capabilities of equivalent microwave implementations,

    grow up to larger connectivity (10s of beams)

    cross-connect a large number of channels

    new functions routing like WDMnew functions routing like WDM

    The demonstrators phase is engaged.

    Th i d t i li ti h t b d fi d d i iti t d th t tThe industrialization phase must be defined and initiated as the next step.

    The Optoelectronic parts qualification methodology for space application must be prepared and built

    10 ICSO 2010

    must be prepared and built.

  • Optoelectronics Handbook

    I d t i li tiIndustrialization concerns and Quality constraintsand Quality constraints.

    11 ICSO 2010

  • Industrialization concerns and Quality constraints.

    WE ARE FACING TO

    THE DIVERSITY AND COMPLEXITY OF PRODUCTS AND FUNCTIONS

    HIGH TECHNOLOGY LEVEL PRODUCTS (f i l t iHIGH TECHNOLOGY LEVEL PRODUCTS (from micro-electronics,

    Quantum Physics, Photonics, interaction light with matter (2D and 3D)),

    RAPID EVOLUTION OF THE TECHNOLOGIES AND PRODUCTS

    CONSTRAINTS AND STRESS ENVIRONMENTS (Thermal managementCONSTRAINTS AND STRESS ENVIRONMENTS (Thermal management,

    radiation, vacuum, mechanical including vibration and acceleration, )

    BUILT AND DESIGN INNOVATIVE APPLICATIONS (new functions for new

    concepts, risk management, quality control and proof, design forconcepts, risk management, quality control and proof, design for

    performance and long term lifetime, )

    12 ICSO 2010

  • Industrialization concerns and Quality constraints.

    How to define a pragmatic well balanced approach ?

    For what purpose ?

    Which level of integration ?Which level of integration ?

    On which parameters ?

    How to define stress conditions ?

    Who will be responsible to implement ?p p

    Which methodology?

    13 ICSO 2010

  • Level 1 Basic Light Generation Functions :For what purpose : Diversity and complexity of products

    Optoelectronic emitters : Lasers, VCELS, electroluminescent and superluminescent diodes.

    Level 1 Basic Light Receiver functions : Optoelectronic receivers (Photodiodes, PIN diodes, Avalanche PD, Travelling-wave photodiodes (TWPD).

    Level 1 Basic Light Management Functions : Splitters, polarisers, filters, mixers, isolators, couplers, gratings, 2D and 3D Micro-Opto-Electro-Mechanical Systems (MOEMS) (Optical Cross-connects (OXC), Tilting mirror arrays), Switches (micromirrors, micro-shutters), Electro-optical modulators.

    Level 1 Passive Light transport :Level 1 Passive Light transport :Optical fibers (single mode, multi-modes, Polarization Maintaining, with Brag Grating, ), Optical connectors (single or multifibers).

    Level 2 Generic functions for Light Amp Atten or Splitting :Level 2 Generic functions for Light Amp., Atten., or Splitting :Semiconductor Optical Amplifiers (SOA), Tunable Optical Filters (such as Fabry-Perot), Variable Optical Amplifier (VOA), Variable Gain Equalizer, Erbium-Doped Fiber Amplifiers (EDFA), Erbium-Doped Waveguide Amplifiers (EDWA), Adaptive Optics (MOEMS deformable mirrors), Sensors, Diffraction grating MOEMS.

    Level 2 or 3 Complex Optoelectronic functions:Transceivers modules, 3-D MOEMS cross-connect switches, Reconfigurable Optical

    14 ICSO 2010Add-Drop Multiplexer (ROADM), Tunable Laser Multiplexers (TLM), Optical Power Monitor arrays, Gyroscopes.

  • Which level of integration to address : High Tech product

    3 LEVELS OF COMPLEXITY

    FACE TO

    l ifi ti ith t t 3HIGH TECHNOLOGY LEVEL PRODUCTS : classification with respect to 3 LEVELS of complexity. We need to define an interactive option testing (basic purpose is to not duplicate testing from one level to another for

    t d lit ti i ti )cost and quality optimization).

    Main proposed pragmatic approach:

    Corresponding industrialization, manufacturing, screening and qualification methodologies must be organized and adapted to each Level considered

    15 ICSO 2010

  • What to address : High Tech product

    LEVEL 1 ELEMENTS :

    Are basic optoelectronic elements used stand alone in a package orready to be assembled into higher complex optoelectronic functionsready to be assembled into higher complex optoelectronic functions(level 2 or 3)

    Main proposed pragmatic approach :

    Known materials and constructional analysis, Industrialization, manufacturing, screening and g gqualification methodologies must refer to stress test able to discriminate direct impact on intrinsic

    f f th l tperformance of the element.

    For example : Endurance stress tests (vacuum gazFor example : Endurance stress tests (vacuum, gaz or ionic contaminant, radiation stress, biasing steady state DC or pulsed) may modify and degrade

    16 ICSO 2010main optical performances.

  • LEVEL 2 MODULE FUNCTIONS :What to address : High Tech product (contd)

    LEVEL 2 MODULE FUNCTIONS :

    Are assembled optoelectronic elements in a simple function (in asemi-complex packaged module ) used in a multi chip package andready to be used at subsystem or system level into higher complexoptoelectronic functions (level 3)

    Main proposed pragmatic approach :Known materials and constructional analysis, design, industrialization, manufacturing, screening

    Main proposed pragmatic approach :

    g g gand qualification methodologies must refer to stress test able to discriminate direct impact on f ti lit d f f th i lfunctionality and performance of the semi-complex product.

    For example : Mechanical & Environment stress tests at assembly and package level.

    17 ICSO 2010

  • LEVEL 3 PRODUCTS & SUB-SYSTEMS :What to address : High Tech product (contd)

    LEVEL 3 PRODUCTS & SUB-SYSTEMS :

    Are assembled optoelectronic sub-systems in a complex function(named Complex MCM module) used in a multi chip package and

    d t b d t t l l i t t l t i b dready to be used at system level into optoelectronic basedequipments hardware (level 3).

    Main proposed pragmatic approach :Industrialization, manufacturing, screening and qualification methodologies must refer to stress test

    p p p g pp

    gable to consolidate full High-Reliability space hardware guarantees.

    For example : Mechanical & Environment stress tests at system leveltests at system level.

    18 ICSO 2010

  • Which relevant parameters and characteristics to address ?

    To increase the performance and reliability of the system under design, MIL-HDBK-1547 defines rules to use Electrical, Electronic, Electromagnetic, Opticaland Mechanical parts Such products are considered aging sensitive whenand Mechanical parts. Such products are considered aging sensitive, whenthey are subjected to gradual shortening over their useful life. On MOEMS forexample, aging mechanisms include the following:

    Loss of hermeticity,

    Stress relaxation

    Loss of Torque,

    Loss of Spring Tension

    Molecular cross-linking

    AnnealingStress relaxation,

    Oxidation and Corrosion,

    Outgassing

    Loss of Spring Tension,

    Electro migration,

    Parameters drifts

    Annealing

    Moisture absorption

    Radiation effectsOutgassing,

    Cold flow and Creep,

    Loss of adhesion,

    Parameters driftsCurrent Leakage,

    Optical performancechange (lasing power, ,

    Radiation effects

    Through put

    Actuation speedLoss of adhesion,

    Embrittlement (includingthermal) and Hardening,

    change (lasing power, ,losses, ...)

    Breakdown Voltage,

    Forward degradation.

    Actuation speed

    19 ICSO 2010

    Forward degradation.

  • How to define constraints and stress environments

    Design considerations (maximum rating and derating)Design considerations (maximum rating and derating)

    Handling and assembly ability and controls (where are the li it ?)limits ?)

    Humidity and salt atmosphere before launch

    Acceleration, vibration and shocks during launch

    Pressure and temperature : during launch rapidPressure and temperature : during launch rapid depressurization and from room temperature to 120C in few minutes (freezing, outgassing, )few minutes (freezing, outgassing, )

    in flight constraintsMi itMicrogravity

    Vacuum (and optical contaminants)

    Radiation20 ICSO 2010

    Radiation

    Extreme Temperatures (thermal cycling)

  • Who will implement ?

    P R O C E S S / P R O D U C T C A P A B I L I T I E S A N D P E R F O R M A N C E S

    P R O C E S S / P R O D U C TD E S I G N R U L E S A N D I N D U S T R I A L I S A T I O NI N D U S T R I A L I S A T I O N

    P R O C E S S / P R O D U C T M A N U F A C T U R I N G ?MANUFACTURER END USERs TEST HOUSEsM A N U F A C T U R I N G ?

    S C R E E N I N G A N D Q U A L I T Y C O N T R O L S

    MANUFACTURERs QMS

    END USER s

    QMS

    TEST HOUSE s

    QMS

    P R O C E S S / P R O D U C T E V A L U A T I O N A N D

    Q U A L I F I C A T I O N

    P R O C E S S / P R O D U C T L O T Q U A L I T Y

    C O N T R O L S

    21 ICSO 2010

  • Which screening, qualification and methodology

    L1-QM01 : Characterisation and L e v e l 1 Q u a l . M e th o d o lo g y

    L 1 Q M 0 1E L E M E N T

    C H A R A C T E R IS A T IO N P E R F O R M A N C E

    L e v e l 1 Q u a l .M e t h o d o l o g y

    L 1 Q M 0 2

    qualification

    L1 QM02 : EnvironmentalElements

    P E R F O R M A N C E Q U A L IF IC A T IO N T E S T

    P R O G R A M

    E L E M E N T E N V I R O N M E N T A L

    Q U A L I F I C A T I O N T E S T P R O G R A M

    L1-QM02 : Environmental qualification

    L1 QM03 E d lifi i

    ElementsL e v e l 1 Q u a l.M e th o d o lo g y

    L 1 Q M 0 3E L E M E N T

    L e v e l 2 Q u a l . M e t h o d o l o g y

    L 2 Q M 0 1

    L1-QM03 : Endurance qualificationE L E M E N T

    E N D U R A N C E Q U A L IF IC A T IO N T E S T

    P R O G R A M

    L 2 Q M 0 1P A C K . F U N C T I O N

    M E C H A N I C A L Q U A L I F I C A T I O N T E S T

    P R O G R A ML e v e l 3 Q u a l . M e t h o d o lo g y

    L2-QM01, 02 & 03: Packaging qualification

    Modules

    g yL 3 Q M 0 1 t o L 3 Q M 0 3

    P R O D U C T S C R E E N IN G ,

    Q U A L IF IC A T IO N A N D Q C I T E S T P R O G R A M

    L3-QM01,02 & 03: Product qualificationSub-system

    22 ICSO 2010

    Sub system

  • Optoelectronics Handbook

    Quality assurance tools:MIL-STD test methods overview,TELCORDIATELCORDIAQualification methodology.gy

    For definition of consolidatedFor definition of consolidatedEuropean Standards ECSS and ESCC

    23 ICSO 2010

  • Optoelectronics Handbook

    Quality assurance tools for Micro-Opto-ElectronicsQuality assurance tools for Micro Opto ElectronicsEuropean Space agency ECSS-Q-ST-60-05: Generic procurement requirements for hybrid microcircuits. Generic specification ESCC-9010 : Monolithic Microwave Integrated Circuits (MMICs) JEDEC JEDEC JESD49 Procurement Standard for Semiconductor Die Products IncludingJEDEC JESD49 Procurement Standard for Semiconductor Die Products Including

    Known Good Die JEP149 : Application Thermal Derating MethodologiesMILITARYMILITARY MIL-PRF-19500, General Specification for Semiconductor Devices MIL-PRF-38534, General Specification for Hybrid Microcircuits

    MIL PRF 38535 G l S ifi ti f I t t d Ci it M f t i MIL-PRF-38535, General Specification for Integrated Circuits Manufacturing MIL-STD-883 Microelectronics Test Methods, and Procedures, MIL-HDBK-781A: Handbook for reliability test methods, plans and environments for

    engineering development qualification and productionengineering, development, qualification and production.OTHER TELCORDIA GR-468-CORE : Generic Reliability Assurance for Optoelectronic Devices

    used in Telecommunications Equipment

    24 ICSO 2010

    used in Telecommunications Equipment

  • Qualification approach.

    25 ICSO 2010

  • 26 ICSO 2010

  • Optoelectronics Handbook

    M lti t hi b ildMulti-partnership build up :the Optoelectronic andthe Optoelectronic andReliability ad-hoc workingReliability ad hoc workinggroup synergy.

    27 ICSO 2010

  • Optoelectronics Handbook

    There is a strong need for a Standards Quality assurance documents.

    But prior to built such standards it has been presented during ISROSBut prior to built such standards it has been presented during ISROS 2009 and 2010 the need to elaborate a guideline document to synthesize the best practices and recommendations to design, test, industrialize,

    f fuse, control, screen and qualify optoelectronic products for end-use in Space Application.

    A tentative was initiated to work on a common document titled :

    PRODUCT ASSURANCE GUIDELINE FOR OPTOELECTRONIC DEVICES FOR SPACE APPLICATION

    Today, this initiative need to be enlarged and more deeply activatedToday, this initiative need to be enlarged and more deeply activated thanks to the effort of the existing community.

    28 ICSO 2010

  • Optoelectronics Handbook

    AbstractThe guide is foreseen to be a high technical synthesis for :

    understanding the various aspects of Opto-Electronic devices

    b h i d S E i ibehaviors under Space Environment constraints

    Semiconductor material properties and device structures along with the final products (Emitters, Receivers, Opto-Electronic functions, passive Opto-Electronic functions)

    Performance and reliability aspects of Opto-Electronic devices.

    Failure mechanisms and analysis

    Q lit d lifi ti th d l i iQuality assurance and qualification methodologies overview.

    It will present in details Opto-Electronic device designs, packaging, d l t f t i i d t i li ti li ti t tdevelopment, manufacturing, industrializations, application uses, test and controls, screening sequences, qualification procedures and test methods, environment effects (Radiation, vacuum, thermal, mechanical, long term and end of life, ) and will help the reader to understand the means of developing suitable qualification plans and demonstrate high reliability equipment achievement using optoelectronic products.

    29 ICSO 2010

    y q p g p p

  • Optoelectronics Handbook

    Optoelectronics basic thematicOptoelectronics basic thematic

    30 ICSO 2010

  • Optoelectronics Handbook

    Optoelectronics transverse thematicOptoelectronics transverse thematic

    31 ICSO 2010

  • Basic thematic

    32 ICSO 2010Transverse thematic

  • Optoelectronics Handbook

    Product Assurance Guideline forProduct Assurance Guideline for Optoelectronics for Space Application

    Grand Chapter I Solid State physics for

    Grand Chapter IVOpto-Electronic Devices

    optoelectronics development for space

    Grand Chapter II Space environment

    constraints description

    Grand Chapter VFailure mechanisms and

    analysisconstraints description.

    Grand Chapter III

    analysis

    Grand Chapter IIIOpto-Electronic devices :

    technologies, main performances and reliability.

    Grand Chapter VIQuality Assurance Space

    Standards

    33 ICSO 2010

  • 34 ICSO 2010

  • Optoelectronics Handbook

    GOAL OF THE HANDBOOK

    The content of this handbook is composed of chapters written by the contributors acting as honorary, benefactor or active members.

    How to prepare this handbook ?How to prepare this handbook ?

    On a collaborative WIKI platform.

    35 ICSO 2010

  • Optoelectronics Handbook

    Multi-partnership build up : the Optoelectronic and Reliability yad-hoc working group synergy.

    E C MEnterprise Content Management : a collaborative platform open to all external partners.

    Secured URL web browser :https://www-ecm.thalesaleniaspace.fr/ecm

    36 ICSO 2010

  • What is Livelink?

    A secured tool to exchange and share information

    Exchange and share documentsAccess rights management

    Communicate/Diffuse an informationDiscussions and forumsAccess rights management

    Documentary process

    Supply and retrieve information

    Discussions and forums

    Collaborate within a project or an

    organisationanytime, anywhere

    Communication facilitiesEnhanced search engine

    organisationCommunities

    Manage and automate business g

    Maintain documentary spacesIndividual or shared workspaces

    processBusiness workflows

    37 ICSO 2010

  • Optoelectronics Handbook

    38 ICSO 2010

  • NEW !TWO FORUMS ARE NOW OPEN FOR CONTRIBUTING TO THIS COMMON APPROACH DEFINITION.

    39 ICSO 2010

  • NEW !TWO FORUMS ARE NOW OPEN FOR CONTRIBUTING TO THIS COMMON APPROACH DEFINITION.

    40 ICSO 2010

  • Optoelectronics Handbook

    Multi-partnership build up : the Optoelectronic and Reliability ad-hoc working group synergy.

    ContributorsContributors

    AGENCIES (5)20%

    MANUFACTURERS (4)

    Country contributionsFranceS20%

    SPACE INDUSTRIES (3)16%

    (4)16% 40%

    USA8%

    RESEARCH UNIVERSITIES (7)

    28%The NetherlandsLABORATORIES (5)

    20%

    28%

    United Kingdom

    The Netherlands4%

    United Kingdom8%Italy

    20%Spain

    4%Germany

    4%Belgium

    8%

    Japan4%

    41 ICSO 2010

  • C l i

    Optoelectronics Handbook

    Conclusion

    Optoelectronic innovative payloads : interests and impacts.Industrialization concerns and Quality constraints.Quality assurance tools:Quality assurance tools:

    3 levels (L1QM01, ) for basic elements to complex sub systemssub-systems.

    Multi-partnership build up synergy for the implementation f th O t l t i P d t A d tof the Optoelectronic Product Assurance document.

    42 ICSO 2010

  • For questions on EEE parts Standards and Qualification: [email protected]

    For question on Opto-electronics Reliability :[email protected]

    Or lets open the forum discussion and join the WEB link :

    https://www ecm thalesaleniaspace fr/ecmhttps://www-ecm.thalesaleniaspace.fr/ecm

    Thank you for your attention

    43 ICSO 2010