GaAs, MMIC, I/Q, Downconverter, 20 GHz to 28 GHz
Data Sheet HMC977
Rev. D Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.Tel: 781.329.4700 ©2019 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com
FEATURES Conversion gain: 14 dB typical Image rejection: 21 dBc typical at 20 GHz to 26.5 GHz 2× LO to RF isolation: 45 dB typical at 20 GHz to 26.5 GHz Noise figure: 2.5 dB typical at 20 GHz to 26.5 GHz Input IP3: 1 dBm typical at 20 GHz to 26.5 GHz LO drive range: 2 dBm to 6 dBm 24-lead 4 mm × 4 mm LFCSP
APPLICATIONS Point to point and point to multipoint radios Military radar, electronic warfare (EW), and electronic
intelligence (ELINT) Satellite communications
FUNCTIONAL BLOCK DIAGRAM
13
1
3
4
2
7
NIC
NIC
VDRF
VDLO2
5
6
VDLO1
NIC GND
14 IF1
15 NIC
16 IF2
17 GND
18 NIC
NIC
8LO
9GND
10NIC
11NIC
1219
NIC
NIC
20NIC
21NIC
22NIC
23RF
24GND
×2
21858-001
HMC977
Figure 1.
GENERAL DESCRIPTION The HMC977 is a compact, gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), inphase and quadrature (I/Q) downconverter in a leadless, RoHS compliant, surface-mount technology (SMT) package. This device provides a small signal conversion gain of 14 dB with a noise figure of 2.5 dB and 21 dBc of image rejection. The HMC977 utilizes a low noise amplifier (LNA) followed by an image reject mixer which is driven by an active 2× multiplier. The image reject
mixer eliminates the need for a filter following the LNA and removes thermal noise at the image frequency. I and Q mixer outputs are provided and an external 90° hybrid is required to select the required sideband. The HMC977 is a much smaller alternative to hybrid style image reject mixer downconverter assemblies and is compatible with surface-mount manufacturing techniques.
HMC977 Data Sheet
Rev. D | Page 2 of 20
TABLE OF CONTENTS Features .............................................................................................. 1 Applications ....................................................................................... 1 Functional Block Diagram .............................................................. 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 3
Electrical Specifications ............................................................... 3 Absolute Maximum Ratings ............................................................ 4
Thermal Resistance ...................................................................... 4 ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5 Interface Schematics..................................................................... 6
Typical Performance Characteristics ............................................. 7 Data Taken as IRM with External 90° Hybrid at the IF Ports, IF = 1000 MHz, Upper Sideband ............................................... 7 Quadrature Channel Data Taken Without 90° Hybrid at the IF Ports, IF = 1000 MHz, Upper Sideband ............................... 9
Data Taken as IRM with External 90° Hybrid at the IF Ports, IF = 1000 MHz, Lower Sideband ............................................. 10 Data Taken as IRM with External 90° Hybrid at the IF Ports, IF = 2000 MHz, Upper Sideband ............................................. 11 Data Taken as IRM with External 90° Hybrid at the IF Ports, IF = 2000 MHz, Lower Sideband ............................................. 12 Data Taken as IRM with External 90° Hybrid at the IF Ports, IF = 3300 MHz, Upper Sideband ............................................. 13 Data Taken as IRM with External 90° Hybrid at the IF Ports, IF = 3300 MHz, Lower Sideband ............................................. 14 Spurious Performance ............................................................... 15
Theory of Operation ...................................................................... 16 Applications Information .............................................................. 17
Evaluation PCB ........................................................................... 18 Layout .......................................................................................... 19
Outline Dimensions ....................................................................... 20 Ordering Guide .......................................................................... 20
REVISION HISTORY This Hittite Microwave Products data sheet has been reformatted to meet the styles and standards of Analog Devices, Inc. 11/2019—v02.0815 to Rev. D Updated Format .................................................................. Universal Changed HMC977LP4E to HMC977 .............................. Universal Changes to Figure 1 .......................................................................... 1 Changes to the Electrical Specifications Section .......................... 3
Added Figure 2; Renumbered Sequentially ................................... 5 Changes to M × N Spurious Outputs, IF = 1000 MHz Section .................................................................. 15 Added Theory of Operation Section ........................................... 16 Added Applications Information Section ................................... 17 Changes to Figure 52 ...................................................................... 17 Change to Table 6 ........................................................................... 18 Added Figure 54 ............................................................................. 19
Data Sheet HMC977
Rev. D | Page 3 of 20
SPECIFICATIONS ELECTRICAL SPECIFICATIONS 20 GHz to 26.5 GHz
TA = 25°C, IF = 1000 MHz, local oscillator (LO) = 6 dBm, drain bias voltage (VDD) = VDLO1 = VDLO2 = VDRF = 3.5 V dc, upper sideband. All measurements performed as downconverter with upper sideband selected and external 90° hybrid at the IF ports, unless otherwise noted.
Table 1. Parameter Test Conditions/Comments Min Typ Max Units FREQUENCY RANGE
RF 20 26.5 GHz LO 8.3 15 GHz IF DC 3.5 GHz
LO DRIVE RANGE 2 6 dBm CONVERSION GAIN (AS IMAGE REJECT
MIXER (IRM)) 11 14 dB
NOISE FIGURE 2.5 dB IMAGE REJECTION 21 dBc INPUT POWER FOR 1 dB COMPRESSION (P1dB) −8 dBm ISOLATION
2× LO to RF 35 45 dB 2× LO to IF 20 dB
INPUT THIRD-ORDER INTERCEPT (IP3) 1 dBm AMPLITUDE BALANCE Data taken without external 90° hybrid at the IF ports 0.3 dB PHASE BALANCE Data taken without external 90° hybrid at the IF ports 17 Degree SUPPLY VOLTAGE No power sequence is required 3.325 3.5 3.675 V TOTAL SUPPLY CURRENT 170 210 mA
26.5 GHz to 28 GHz
TA = 25°C, IF = 1000 MHz, LO = 6 dBm, VDD = VDLO1 = VDLO2 = VDRF = 3.5 V dc, upper sideband. All measurements performed as downconverter with upper sideband selected and external 90° hybrid at the IF ports, unless otherwise noted
Table 2. Parameter Test Conditions/Comments Min Typ Max Units FREQUENCY RANGE
RF 26.5 28 GHz LO 11.5 15.7 GHz IF DC 3.5 GHz
LO DRIVE RANGE 2 6 dBm CONVERSION GAIN (AS IRM) 11 14 dB NOISE FIGURE 3 dB IMAGE REJECTION 20 dBc INPUT P1dB −7 dBm ISOLATION
2× LO to RF 34 39 dB 2× LO to IF 30 dB
INPUT IP3 3 dBm AMPLITUDE BALANCE Data taken without external 90° hybrid at the IF ports 0.3 dB PHASE BALANCE Data taken without external 90° hybrid at the IF ports 12 Degree SUPPLY VOLTAGE No power sequence is required 3.325 3.5 3.675 V TOTAL SUPPLY CURRENT 170 210 mA
HMC977 Data Sheet
Rev. D | Page 4 of 20
ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating RF Input Power 2 dBm LO Drive 10 dBm VDD 5.0 V Continuous Power Dissipation (PDISS), TA =
85°C (Derates 17.7 mW/°C Above 85°C)1 1.6 W
Temperature Junction (Channel), TJ 175°C Peak Reflow (Moisture Sensitivity Level 1,
MSL12) 260°C
Storage Range −65°C to +150°C Operating Range −40°C to +85°C
Electrostatic Discharge (ESD) Sensitivity Human Body Model (HBM) Class 1A (250 V)
1 PDISS is a theoretical number calculated by (TJ − 85°C)/θJC. 2 Based on IPC/JEDEC J-STD-20 MSL classifications.
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
THERMAL RESISTANCE Thermal resistance is directly linked to printed circuit board (PCB) design and operating environment. Close attention to PCB thermal design is required.
θJC is the channel to case thermal resistance, channel to bottom of package.
Table 4. Thermal Resistance Package Type1 θJC Unit HCP-24-2 56.3 °C/W 1 Thermal impedance simulated values are based on a JEDEC 2S2P test board
with 4 mm × 4 mm thermal vias. Refer to JEDEC standard JESD51-2 for additional information.
ESD CAUTION
Data Sheet HMC977
Rev. D | Page 5 of 20
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NICNIC
VDRFVDLO2VDLO1
NIC GNDIF1NICIF2GNDNIC
NOTES1. NIC = NOT INTERNALLY CONNECTED. DO NOT CONNECT TO THIS PIN.
2. EPAD. THE EPAD MUST BE CONNECTED TO GND.
NIC LO
GND NI
CNI
CNI
CNI
CNI
CNI
CNI
CRFG
ND
21858-102
21
3456
181716151413
8 9 10 117 1220 1921222324
HMC977TOP VIEW
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions Pin No. Mnemonic Description 1, 2, 6, 7, 10 to 12,
15, 18 to 22 NIC Not Internally Connected. These pins are not connected internally.
3 VDRF Power Supply for the RF Low Noise Amplifier. See Figure 3 for the interface schematic. 4 VDLO2 Power Supply for the Second Stage LO Amplifier. See Figure 4 for the interface schematic. 5 VDLO1 Power Supply for the First Stage LO Amplifier. See Figure 5 for the interface schematic. 8 LO Local Oscillator. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the interface schematic. 9, 13, 17, 24 GND Ground Connect. Connect these pins to RF and dc ground. See Figure 7 for the interface schematic. 14 IF1 First Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to
dc, block this pin externally using a series capacitor with a value chosen to pass the necessary IF frequency range. For operation to dc, this pin must not source or sink more than 3 mA of current or device nonfunctionality or device failure may result. See Figure 8 for the interface schematic.
16 IF2 Second Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc, block this pin externally using a series capacitor with a value chosen to pass the necessary IF frequency range. For operation to dc, this pin must not source or sink more than 3 mA of current or device nonfunctionality or device failure may result. See Figure 8 for the interface schematic.
23 RF Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω. See Figure 9 for the interface schematic.
EPAD Exposed Pad. The EPAD must be connected to GND.
HMC977 Data Sheet
Rev. D | Page 6 of 20
INTERFACE SCHEMATICS VDRF
21858-044
Figure 3. VDRF Interface Schematic
VDLO2
21858-045
Figure 4. VDLO2 Interface Schematic
VDLO1
21858-046
Figure 5. VDLO1 Interface Schematic
LO 21858-047
Figure 6. LO Interface Schematic
GND
21858-048
Figure 7. GND Interface Schematic
IF1, IF2
21858-049
Figure 8. IF1 and IF2 Interface Schematic
RF 21858-050
Figure 9. RF Interface Schematic
Data Sheet HMC977
Rev. D | Page 7 of 20
TYPICAL PERFORMANCE CHARACTERISTICS DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 1000 MHz, UPPER SIDEBAND
25
020 21 2322 24 25 26 27 28
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
5
10
15
20
+85°C+25°C–40°C
21858-002
Figure 10. Conversion Gain vs. RF Frequency Over Temperature, LO Drive = 6 dBm
0
–50
IMAG
E RE
JECT
ION
(dBc
)
+85°C+25°C–40°C
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
–40
–30
–20
–10
21858-003
Figure 11. Image Rejection vs. RF Frequency Over Temperature, LO Drive = 6 dBm
0
–2510 11 12 13 14 15 16
LO R
ETUR
N LO
SS (d
B)
LO FREQUENCY (GHz)
–20
–15
–10
–5
+85°C+25°C–40°C
21858-004
Figure 12. LO Return Loss vs. LO Frequency Over Temperature, LO Drive = 6 dBm
25
020 21 2322 24 25 26 27 28
CONV
ERSI
ON
GAI
N (d
B)
RF FREQUENCY (GHz)
5
10
15
20
2dBm4dBm6dBm8dBm
21858-005
Figure 13. Conversion Gain vs. RF Frequency at Various LO Drives
0
–30
RF R
ETU
RN L
OSS
(dB)
–25
–20
–15
–10
–5
+85°C+25°C–40°C
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz) 21
858-006
Figure 14. RF Return Loss vs. RF Frequency Over Temperature, LO Frequency = 24 GHz
0
–150 1 2 3 4
IF R
ETU
RN L
OSS
(dB)
IF FREQUENCY (GHz)
–12
–9
–6
–3
IF1IF2
21858-007
Figure 15. IF Return Loss vs. IF Frequency, LO Frequency = 24 GHz, LO Drive = 6 dBm, Data Taken Without External 90° Hybrid
HMC977 Data Sheet
Rev. D | Page 8 of 20
20
–50
RF T
O IF
AND
LO
TO
IF IS
OLA
TIO
N (d
B)(d
B)
RF/IF2RF/IF12LO/IF12LO/IF2
–40
–30
–20
–10
0
10
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz) 21
858-008
Figure 16. RF to IF and LO to IF Isolation vs. RF Frequency, LO Drive = 6 dBm, Data Taken Without External 90° Hybrid
0
–16
INPU
T P1
dB (d
Bm)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
+85°C+25°C–40°C
–14
–12
–10
–8
–6
–4
–2
21858-009
Figure 17. Input P1dB vs. RF Frequency Over Temperature, LO Drive = 6 dBm
15
–15
INPU
T IP
3 (d
Bm)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
–10
–5
0
5
10
2dBm4dBm6dBm8dBm
21858-010
Figure 18. Input IP3 vs. RF Frequency at Various LO Drives
0
–80
LO T
O R
F IS
OLA
TIO
N (d
B)
–70
–60
–50
–40
–30
–20
–102LO/RFLO/RF
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz) 21
858-011
Figure 19. LO to RF Isolation vs. RF Frequency LO Drive = 6 dBm, Data Taken Without External 90° Hybrid
15
–15
INPU
T IP
3 (d
Bm)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
+85°C+25°C–40°C
–10
–5
0
5
10
21858-012
Figure 20. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
8
6
4
2
00.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
NOIS
E FI
GU
RE (d
B)
IF FREQUENCY (GHz) 21858-013
Figure 21. Noise Figure vs. IF Frequency, LO Frequency = 10 GHz, LO Drive = 6 dBm, Data Taken Without External 90° Hybrid
Data Sheet HMC977
Rev. D | Page 9 of 20
QUADRATURE CHANNEL DATA TAKEN WITHOUT 90° HYBRID AT THE IF PORTS, IF = 1000 MHZ, UPPER SIDEBAND
6
0
NOIS
E FI
GU
RE (d
B)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
+85°C+25°C–40°C
1
2
3
4
5
21858-014
Figure 22. Noise Figure vs. RF Frequency Over Temperature, LO Drive = 6 dBm
2.0
–2.0
–1.0
0.5
1.5
0
–1.5
–0.5
1.0
AMPL
ITUD
E BA
LANC
E (d
B)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
2dBm4dBm6dBm
21858-015
Figure 23. Amplitude Balance vs. RF Frequency at Various LO Drives
RESP
ONS
E (d
B)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0IF FREQUENCY (GHz)
20
–20
–15
–10
–5
0
5
10
15
CONVERSION GAINRETURN LOSS
21858-016
Figure 24. Conversion Gain and Return Loss Over IF Bandwidth
35
–5
PHAS
E B
ALA
NCE
(Deg
rees
)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
2dBm4dBm6dBm
0
5
10
15
20
25
30
21858-017
Figure 25. Phase Balance vs. RF Frequency at Various LO Drives
HMC977 Data Sheet
Rev. D | Page 10 of 20
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 1000 MHz, LOWER SIDEBAND 25
0
CONV
ERSI
ON
GAI
N (d
B)
5
10
15
20
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
+85°C+25°C–40°C
21858-018
Figure 26. Conversion Gain vs. RF Frequency Over Temperature, LO Drive = 6 dBm
0
–60
IMAG
E RE
JECT
ION
(dBc
)
–50
–40
–30
–20
–10
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
+85°C+25°C–40°C
21858-019
Figure 27. Image Rejection vs. RF Frequency Over Temperature, LO Drive = 6 dBm
15
–15
INPU
T IP
3 (d
Bm)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
–10
–5
0
5
10
+85°C+25°C–40°C
21858-020
Figure 28. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
25
0
CONV
ERSI
ON
GAI
N (d
B)
5
10
15
20
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
2dBm4dBm6dBm8dBm
21858-021
Figure 29. Conversion Gain vs. RF Frequency at Various LO Drives
0
–16
INPU
T P1
dB (d
Bm)
–14
–12
–10
–8
–6
–4
–2
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
+85°C+25°C–40°C
21858-022
Figure 30. Input P1dB vs. RF Frequency Over Temperature, LO Drive = 6 dBm
15
–15
INPU
T IP
3 (d
Bm)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
–10
–5
0
5
10
2dBm4dBm6dBm8dBm
21858-023
Figure 31. Input IP3 vs. RF Frequency at Various LO Drives
Data Sheet HMC977
Rev. D | Page 11 of 20
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 2000 MHz, UPPER SIDEBAND 25
0
CONV
ERSI
ON
GAI
N (d
B)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
+85°C+25°C–40°C
5
10
15
20
21858-024
Figure 32. Conversion Gain vs. RF Frequency Over Temperature, LO Drive = 6 dBm
0
–60
IMAG
E RE
JECT
ION
(dBc
)
–50
–40
–30
–20
–10
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
+85°C+25°C–40°C
21858-025
Figure 33. Image Rejection vs. RF Frequency Over Temperature, LO Drive = 6 dBm
25
0
CONV
ERSI
ON
GAI
N (d
B)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
5
10
15
20
2dBm4dBm6dBm8dBm
21858-026
Figure 34. Conversion Gain vs. RF Frequency at Various LO Drives
15
–15
INPU
T IP
3 (d
Bm)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
–10
–5
0
5
10
+85°C+25°C–40°C
21858-027
Figure 35. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
15
–15
INPU
T IP
3 (d
Bm)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
–10
–5
0
5
10
2dBm4dBm6dBm8dBm
21858-028
Figure 36. Input IP3 vs. RF Frequency at Various LO Drives
HMC977 Data Sheet
Rev. D | Page 12 of 20
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 2000 MHz, LOWER SIDEBAND 25
0
CONV
ERSI
ON
GAI
N (d
B)
5
10
15
20
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
+85°C+25°C–40°C
21858-029
Figure 37. Conversion Gain vs. RF Frequency Over Temperature, LO Drive = 6 dBm
0
–50
IMAG
E RE
JECT
ION
(dBc
)
–40
–30
–20
–10
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
+85°C+25°C–40°C
21858-030
Figure 38. Image Rejection vs. RF Frequency Over Temperature, LO Drive = 6 dBm
25
0
CONV
ERSI
ON
GAI
N (d
B)
5
10
15
20
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
2dBm4dBm6dBm8dBm
21858-031
Figure 39. Conversion Gain vs. RF Frequency at Various LO Drives
15
–15
INPU
T IP
3 (d
Bm)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
–10
–5
0
5
10
+85°C+25°C–40°C
21858-032
Figure 40. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
15
–15
INPU
T IP
3 (d
Bm)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
–10
–5
0
5
10
2dBm4dBm6dBm8dBm
21858-033
Figure 41. Input IP3 vs. RF Frequency at Various LO Drives
Data Sheet HMC977
Rev. D | Page 13 of 20
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 3300 MHz, UPPER SIDEBAND 25
0
CONV
ERSI
ON
GAI
N (d
B)
5
10
15
20
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
+85°C+25°C–40°C
21858-034
Figure 42. Conversion Gain vs. RF Frequency Over Temperature, LO Drive = 6 dBm
0
–50
IMAG
E RE
JECT
ION
(dBc
)
+85°C+25°C–40°C
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
–40
–30
–20
–10
21858-035
Figure 43. Image Rejection vs. RF Frequency Over Temperature, LO Drive = 6 dBm
25
0
CONV
ERSI
ON
GAI
N (d
B)
5
10
15
20
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
2dBm4dBm6dBm8dBm
21858-036
Figure 44. Conversion Gain vs. RF Frequency at Various LO Drives
15
–15
INPU
T IP
3 (d
Bm)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
+85°C+25°C–40°C
–10
–5
0
5
10
21858-037
Figure 45. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
15
–15
INPU
T IP
3 (d
Bm)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
–10
–5
0
5
10
2dBm4dBm6dBm8dBm
21858-038
Figure 46. Input IP3 vs. RF Frequency at Various LO Drives
HMC977 Data Sheet
Rev. D | Page 14 of 20
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 3300 MHz, LOWER SIDEBAND 25
0
CONV
ERSI
ON
GAI
N (d
B)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
+85°C+25°C–40°C
5
10
15
20
21858-039
Figure 47. Conversion Gain vs. RF Frequency Over Temperature, LO Drive = 6 dBm
0
–50
IMAG
E RE
JECT
ION
(dBc
)
+85°C+25°C–40°C
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
–40
–30
–20
–10
21858-040
Figure 48. Image Rejection vs. RF Frequency Over Temperature, LO Drive = 6 dBm
25
0
CONV
ERSI
ON
GAI
N (d
B)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
5
10
15
20
2dBm4dBm6dBm8dBm
21858-041
Figure 49. Conversion Gain vs. RF Frequency at Various LO Drives
15
–15
INPU
T IP
3 (d
Bm)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
+85°C+25°C–40°C
–10
–5
0
5
10
21858-042
Figure 50. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
15
–15
INPU
T IP
3 (d
Bm)
20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)
–10
–5
0
5
10
2dBm4dBm6dBm8dBm
21858-043
Figure 51. Input IP3 vs. RF Frequency at Various LO Drives
Data Sheet HMC977
Rev. D | Page 15 of 20
SPURIOUS PERFORMANCE M × N Spurious Outputs, IF = 1000 MHz
RF = 24 GHz, and RF input power = −20 dBm. LO frequency = 11.5 GHz, and LO drive = 4 dBm. All values are in dBc below IF power level (RF − 2 × LO). Spur values are (M × RF) − (N × LO). N/A means not applicable.
N × LO 0 1 2 3 4
M × RF
0 N/A −22.6 −7.4 −28.8 −37.2
1 −20 −29.3 0 −33 −37.3
2 −72.6 −72.6 −57.6 −43.6 −51.6
3 N/A N/A −74.6 −74.6 −74.6
4 N/A N/A N/A N/A N/A
HMC977 Data Sheet
Rev. D | Page 16 of 20
THEORY OF OPERATION The HMC977 is a compact, GaAs, MMIC, I/Q downconverter in a leadless, RoHS compliant, SMT package. The device can be used as either an image reject mixer or a SSB upconverter. The mixer uses two standard, double balanced, mixer cells and a
90° hybrid. This device is a smaller alternative to a hybrid style image reject mixer and a SSB upconverter assembly. The HMC977 eliminates the need for wire bonding, allowing the use of the surface-mount manufacturing techniques.
Data Sheet HMC977
Rev. D | Page 17 of 20
APPLICATIONS INFORMATION Figure 52 shows the typical application circuit for the HMC977. To select the appropriate sideband, an external 90° hybrid coupler is needed. For applications not requiring operation to dc, use an off chip dc blocking capacitor. The common-mode voltage for each IF port is 0 V.
To select the lower sideband, connect the IF2 pin to the 90° port of the hybrid and the IF1 pin to the 0° port of the hybrid. To select the upper sideband (low side LO), connect the IF2 pin to the 0° port of the hybrid and the IF1 pin to the 90° port of the hybrid.
×2 IF OUT
AUTOMATICGAIN
CONTROLBAND-PASSFILTER
COUPLER
RF20GHz TO 28GHz
LO8.3GHz TO 15.7GHz
21858-051
Figure 52. Typical Application Circuit
HMC977 Data Sheet
Rev. D | Page 18 of 20
EVALUATION PCB It is recommended to use RF circuit design techniques with the circuit board used in the application. Signal lines must have 50 Ω impedance, and the package ground leads and exposed paddle must be connected directly to the ground plane similar to that shown Figure 54. A sufficient number of via holes must be used to connect the top and bottom ground planes. The evaluation circuit board shown in Figure 53 is available from Analog Devices, Inc., upon request.
Table 6. List of Materials for Evaluation PCB 1316561 Item Description J1 PCB mount, Subminiature Version A (SMA), RF
connector, SRI J2, J3 PCB mount K connectors, SRI J5 to J8 DC pins C1, C4, C7 100 pF capacitors, 0402 package C2, C5, C8 10 nF capacitors, 0402 package C3, C6, C9 4.7 μF capacitors, Case A package U1 HMC977 PCB2 131653 evaluation board 1 Reference this number when ordering complete evaluation PCB. 2 Circuit board material: Rogers 4350.
J1
J2
J4
J3
U1
131653-1
LO
IF2
IF1
VDLO1VDRFVDL02 GND
RFIN
+
+
C1C2
C8
C3
C6
C9
J5 J6 J7 J8
H977XXXX
+
C5C4
C721858-052
Figure 53. Evaluation PCB
Data Sheet HMC977
Rev. D | Page 19 of 20
LAYOUT Solder the exposed pad on the underside of the HMC977 to a low thermal and electrical impedance ground plane. This pad is typically soldered to an exposed opening in the solder mask on the evaluation board. Connect these ground vias to all other ground layers on the evaluation board to maximize heat dissipation from the device package. Figure 54 shows the PCB land pattern footprint for the HMC977 evaluation board.
PAD SIZE0.026" × 0.010"
0.0197"[0.50]
0.178" SQUARE
0.006" MASK/METAL OVERLAP0.010" MIN MASK WIDTH
0.034"TYPICAL
VIA SPACING
0.010"TYPICAL VIA
0.010" REF
0.116"MASK
OPENING
PIN 1
GROUND PAD
SOLDERMASK
0.030"MASK OPENING 0.110" SQUARE
GROUND PAD
0.098" SQUARE MASK OPENING0.020 × 45° CHAMFER FOR PIN 1
21858-054
Figure 54. 131656-HMC977LP4E PCB Land Pattern Footprint
HMC977 Data Sheet
Rev. D | Page 20 of 20
OUTLINE DIMENSIONS
08-3
0-20
18-A
PKG
-000
000
0.50BSC
0.500.400.30
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-8.
BOTTOM VIEWTOP VIEW
4.104.00 SQ3.90
1.000.900.80 0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY0.08
PIN 1INDICATOR
1
24
712
13
18
19
6
0.300.250.18
0.20 MIN
2.952.80 SQ2.65
EXPOSEDPAD
PIN 1IND ICATO R AR E A OP TIO N S(SEE DETAIL A)
DETAIL A(JEDEC 95)
SEATINGPLANE
FOR PROPER CONNECTION OFTHE EXPOSED PAD, REFER TOTHE PIN CONFIGURATION ANDFUNCTION DESCRIPTIONSSECTION OF THIS DATA SHEET.
Figure 55. 24-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.90 mm Package Height (HCP-24-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range Package Description Lead Finish MSL Rating2
Package Option
HMC977LP4E −40°C to +85°C 24-Lead Lead Frame Chip Scale Package [LFCSP] 100% Matte Sn MSL1 HCP-24-2 HMC977LP4ETR −40°C to +85°C 24-Lead Lead Frame Chip Scale Package [LFCSP] 100% Matte Sn MSL1 HCP-24-2 131656-HMC977LP4E Evaluation Assembly Board 1 The models are RoHS complaint parts. 2 See the Absolute Maximum Ratings section.
©2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D21858-0-11/19(D)
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