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GaAs, MMIC, I/Q, Downconverter, 20 GHz to 28 GHz Data Sheet HMC977 Rev. D Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2019 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com FEATURES Conversion gain: 14 dB typical Image rejection: 21 dBc typical at 20 GHz to 26.5 GHz 2× LO to RF isolation: 45 dB typical at 20 GHz to 26.5 GHz Noise figure: 2.5 dB typical at 20 GHz to 26.5 GHz Input IP3: 1 dBm typical at 20 GHz to 26.5 GHz LO drive range: 2 dBm to 6 dBm 24-lead 4 mm × 4 mm LFCSP APPLICATIONS Point to point and point to multipoint radios Military radar, electronic warfare (EW), and electronic intelligence (ELINT) Satellite communications FUNCTIONAL BLOCK DIAGRAM 13 1 3 4 2 7 NIC NIC VDRF VDLO2 5 6 VDLO1 NIC GND 14 IF1 15 NIC 16 IF2 17 GND 18 NIC NIC 8 LO 9 GND 10 NIC 11 NIC 12 19 NIC NIC 20 NIC 21 NIC 22 NIC 23 RF 24 GND ×2 21858-001 HMC977 Figure 1. GENERAL DESCRIPTION The HMC977 is a compact, gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), inphase and quadrature (I/Q) downconverter in a leadless, RoHS compliant, surface-mount technology (SMT) package. This device provides a small signal conversion gain of 14 dB with a noise figure of 2.5 dB and 21 dBc of image rejection. The HMC977 utilizes a low noise amplifier (LNA) followed by an image reject mixer which is driven by an active 2× multiplier. The image reject mixer eliminates the need for a filter following the LNA and removes thermal noise at the image frequency. I and Q mixer outputs are provided and an external 90° hybrid is required to select the required sideband. The HMC977 is a much smaller alternative to hybrid style image reject mixer downconverter assemblies and is compatible with surface-mount manufacturing techniques.

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  • GaAs, MMIC, I/Q, Downconverter, 20 GHz to 28 GHz

    Data Sheet HMC977

    Rev. D Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.

    One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.Tel: 781.329.4700 ©2019 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com

    FEATURES Conversion gain: 14 dB typical Image rejection: 21 dBc typical at 20 GHz to 26.5 GHz 2× LO to RF isolation: 45 dB typical at 20 GHz to 26.5 GHz Noise figure: 2.5 dB typical at 20 GHz to 26.5 GHz Input IP3: 1 dBm typical at 20 GHz to 26.5 GHz LO drive range: 2 dBm to 6 dBm 24-lead 4 mm × 4 mm LFCSP

    APPLICATIONS Point to point and point to multipoint radios Military radar, electronic warfare (EW), and electronic

    intelligence (ELINT) Satellite communications

    FUNCTIONAL BLOCK DIAGRAM

    13

    1

    3

    4

    2

    7

    NIC

    NIC

    VDRF

    VDLO2

    5

    6

    VDLO1

    NIC GND

    14 IF1

    15 NIC

    16 IF2

    17 GND

    18 NIC

    NIC

    8LO

    9GND

    10NIC

    11NIC

    1219

    NIC

    NIC

    20NIC

    21NIC

    22NIC

    23RF

    24GND

    ×2

    21858-001

    HMC977

    Figure 1.

    GENERAL DESCRIPTION The HMC977 is a compact, gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), inphase and quadrature (I/Q) downconverter in a leadless, RoHS compliant, surface-mount technology (SMT) package. This device provides a small signal conversion gain of 14 dB with a noise figure of 2.5 dB and 21 dBc of image rejection. The HMC977 utilizes a low noise amplifier (LNA) followed by an image reject mixer which is driven by an active 2× multiplier. The image reject

    mixer eliminates the need for a filter following the LNA and removes thermal noise at the image frequency. I and Q mixer outputs are provided and an external 90° hybrid is required to select the required sideband. The HMC977 is a much smaller alternative to hybrid style image reject mixer downconverter assemblies and is compatible with surface-mount manufacturing techniques.

    https://form.analog.com/Form_Pages/feedback/documentfeedback.aspx?doc=HMC977.pdf&product=HMC977&rev=Dhttp://www.analog.com/en/content/technical_support_page/fca.htmlhttp://www.analog.com/https://www.analog.com/?doc=HMC977.pdfhttps://www.analog.com/HMC977?doc=HMC977.pdf

  • HMC977 Data Sheet

    Rev. D | Page 2 of 20

    TABLE OF CONTENTS Features .............................................................................................. 1 Applications ....................................................................................... 1 Functional Block Diagram .............................................................. 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 3

    Electrical Specifications ............................................................... 3 Absolute Maximum Ratings ............................................................ 4

    Thermal Resistance ...................................................................... 4 ESD Caution .................................................................................. 4

    Pin Configuration and Function Descriptions ............................. 5 Interface Schematics..................................................................... 6

    Typical Performance Characteristics ............................................. 7 Data Taken as IRM with External 90° Hybrid at the IF Ports, IF = 1000 MHz, Upper Sideband ............................................... 7 Quadrature Channel Data Taken Without 90° Hybrid at the IF Ports, IF = 1000 MHz, Upper Sideband ............................... 9

    Data Taken as IRM with External 90° Hybrid at the IF Ports, IF = 1000 MHz, Lower Sideband ............................................. 10 Data Taken as IRM with External 90° Hybrid at the IF Ports, IF = 2000 MHz, Upper Sideband ............................................. 11 Data Taken as IRM with External 90° Hybrid at the IF Ports, IF = 2000 MHz, Lower Sideband ............................................. 12 Data Taken as IRM with External 90° Hybrid at the IF Ports, IF = 3300 MHz, Upper Sideband ............................................. 13 Data Taken as IRM with External 90° Hybrid at the IF Ports, IF = 3300 MHz, Lower Sideband ............................................. 14 Spurious Performance ............................................................... 15

    Theory of Operation ...................................................................... 16 Applications Information .............................................................. 17

    Evaluation PCB ........................................................................... 18 Layout .......................................................................................... 19

    Outline Dimensions ....................................................................... 20 Ordering Guide .......................................................................... 20

    REVISION HISTORY This Hittite Microwave Products data sheet has been reformatted to meet the styles and standards of Analog Devices, Inc. 11/2019—v02.0815 to Rev. D Updated Format .................................................................. Universal Changed HMC977LP4E to HMC977 .............................. Universal Changes to Figure 1 .......................................................................... 1 Changes to the Electrical Specifications Section .......................... 3

    Added Figure 2; Renumbered Sequentially ................................... 5 Changes to M × N Spurious Outputs, IF = 1000 MHz Section .................................................................. 15 Added Theory of Operation Section ........................................... 16 Added Applications Information Section ................................... 17 Changes to Figure 52 ...................................................................... 17 Change to Table 6 ........................................................................... 18 Added Figure 54 ............................................................................. 19

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • Data Sheet HMC977

    Rev. D | Page 3 of 20

    SPECIFICATIONS ELECTRICAL SPECIFICATIONS 20 GHz to 26.5 GHz

    TA = 25°C, IF = 1000 MHz, local oscillator (LO) = 6 dBm, drain bias voltage (VDD) = VDLO1 = VDLO2 = VDRF = 3.5 V dc, upper sideband. All measurements performed as downconverter with upper sideband selected and external 90° hybrid at the IF ports, unless otherwise noted.

    Table 1. Parameter Test Conditions/Comments Min Typ Max Units FREQUENCY RANGE

    RF 20 26.5 GHz LO 8.3 15 GHz IF DC 3.5 GHz

    LO DRIVE RANGE 2 6 dBm CONVERSION GAIN (AS IMAGE REJECT

    MIXER (IRM)) 11 14 dB

    NOISE FIGURE 2.5 dB IMAGE REJECTION 21 dBc INPUT POWER FOR 1 dB COMPRESSION (P1dB) −8 dBm ISOLATION

    2× LO to RF 35 45 dB 2× LO to IF 20 dB

    INPUT THIRD-ORDER INTERCEPT (IP3) 1 dBm AMPLITUDE BALANCE Data taken without external 90° hybrid at the IF ports 0.3 dB PHASE BALANCE Data taken without external 90° hybrid at the IF ports 17 Degree SUPPLY VOLTAGE No power sequence is required 3.325 3.5 3.675 V TOTAL SUPPLY CURRENT 170 210 mA

    26.5 GHz to 28 GHz

    TA = 25°C, IF = 1000 MHz, LO = 6 dBm, VDD = VDLO1 = VDLO2 = VDRF = 3.5 V dc, upper sideband. All measurements performed as downconverter with upper sideband selected and external 90° hybrid at the IF ports, unless otherwise noted

    Table 2. Parameter Test Conditions/Comments Min Typ Max Units FREQUENCY RANGE

    RF 26.5 28 GHz LO 11.5 15.7 GHz IF DC 3.5 GHz

    LO DRIVE RANGE 2 6 dBm CONVERSION GAIN (AS IRM) 11 14 dB NOISE FIGURE 3 dB IMAGE REJECTION 20 dBc INPUT P1dB −7 dBm ISOLATION

    2× LO to RF 34 39 dB 2× LO to IF 30 dB

    INPUT IP3 3 dBm AMPLITUDE BALANCE Data taken without external 90° hybrid at the IF ports 0.3 dB PHASE BALANCE Data taken without external 90° hybrid at the IF ports 12 Degree SUPPLY VOLTAGE No power sequence is required 3.325 3.5 3.675 V TOTAL SUPPLY CURRENT 170 210 mA

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • HMC977 Data Sheet

    Rev. D | Page 4 of 20

    ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating RF Input Power 2 dBm LO Drive 10 dBm VDD 5.0 V Continuous Power Dissipation (PDISS), TA =

    85°C (Derates 17.7 mW/°C Above 85°C)1 1.6 W

    Temperature Junction (Channel), TJ 175°C Peak Reflow (Moisture Sensitivity Level 1,

    MSL12) 260°C

    Storage Range −65°C to +150°C Operating Range −40°C to +85°C

    Electrostatic Discharge (ESD) Sensitivity Human Body Model (HBM) Class 1A (250 V)

    1 PDISS is a theoretical number calculated by (TJ − 85°C)/θJC. 2 Based on IPC/JEDEC J-STD-20 MSL classifications.

    Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.

    THERMAL RESISTANCE Thermal resistance is directly linked to printed circuit board (PCB) design and operating environment. Close attention to PCB thermal design is required.

    θJC is the channel to case thermal resistance, channel to bottom of package.

    Table 4. Thermal Resistance Package Type1 θJC Unit HCP-24-2 56.3 °C/W 1 Thermal impedance simulated values are based on a JEDEC 2S2P test board

    with 4 mm × 4 mm thermal vias. Refer to JEDEC standard JESD51-2 for additional information.

    ESD CAUTION

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • Data Sheet HMC977

    Rev. D | Page 5 of 20

    PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

    NICNIC

    VDRFVDLO2VDLO1

    NIC GNDIF1NICIF2GNDNIC

    NOTES1. NIC = NOT INTERNALLY CONNECTED. DO NOT CONNECT TO THIS PIN.

    2. EPAD. THE EPAD MUST BE CONNECTED TO GND.

    NIC LO

    GND NI

    CNI

    CNI

    CNI

    CNI

    CNI

    CNI

    CRFG

    ND

    21858-102

    21

    3456

    181716151413

    8 9 10 117 1220 1921222324

    HMC977TOP VIEW

    Figure 2. Pin Configuration

    Table 5. Pin Function Descriptions Pin No. Mnemonic Description 1, 2, 6, 7, 10 to 12,

    15, 18 to 22 NIC Not Internally Connected. These pins are not connected internally.

    3 VDRF Power Supply for the RF Low Noise Amplifier. See Figure 3 for the interface schematic. 4 VDLO2 Power Supply for the Second Stage LO Amplifier. See Figure 4 for the interface schematic. 5 VDLO1 Power Supply for the First Stage LO Amplifier. See Figure 5 for the interface schematic. 8 LO Local Oscillator. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the interface schematic. 9, 13, 17, 24 GND Ground Connect. Connect these pins to RF and dc ground. See Figure 7 for the interface schematic. 14 IF1 First Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to

    dc, block this pin externally using a series capacitor with a value chosen to pass the necessary IF frequency range. For operation to dc, this pin must not source or sink more than 3 mA of current or device nonfunctionality or device failure may result. See Figure 8 for the interface schematic.

    16 IF2 Second Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc, block this pin externally using a series capacitor with a value chosen to pass the necessary IF frequency range. For operation to dc, this pin must not source or sink more than 3 mA of current or device nonfunctionality or device failure may result. See Figure 8 for the interface schematic.

    23 RF Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω. See Figure 9 for the interface schematic.

    EPAD Exposed Pad. The EPAD must be connected to GND.

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • HMC977 Data Sheet

    Rev. D | Page 6 of 20

    INTERFACE SCHEMATICS VDRF

    21858-044

    Figure 3. VDRF Interface Schematic

    VDLO2

    21858-045

    Figure 4. VDLO2 Interface Schematic

    VDLO1

    21858-046

    Figure 5. VDLO1 Interface Schematic

    LO 21858-047

    Figure 6. LO Interface Schematic

    GND

    21858-048

    Figure 7. GND Interface Schematic

    IF1, IF2

    21858-049

    Figure 8. IF1 and IF2 Interface Schematic

    RF 21858-050

    Figure 9. RF Interface Schematic

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • Data Sheet HMC977

    Rev. D | Page 7 of 20

    TYPICAL PERFORMANCE CHARACTERISTICS DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 1000 MHz, UPPER SIDEBAND

    25

    020 21 2322 24 25 26 27 28

    CONV

    ERSI

    ON

    GAI

    N (d

    B)

    RF FREQUENCY (GHz)

    5

    10

    15

    20

    +85°C+25°C–40°C

    21858-002

    Figure 10. Conversion Gain vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    0

    –50

    IMAG

    E RE

    JECT

    ION

    (dBc

    )

    +85°C+25°C–40°C

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    –40

    –30

    –20

    –10

    21858-003

    Figure 11. Image Rejection vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    0

    –2510 11 12 13 14 15 16

    LO R

    ETUR

    N LO

    SS (d

    B)

    LO FREQUENCY (GHz)

    –20

    –15

    –10

    –5

    +85°C+25°C–40°C

    21858-004

    Figure 12. LO Return Loss vs. LO Frequency Over Temperature, LO Drive = 6 dBm

    25

    020 21 2322 24 25 26 27 28

    CONV

    ERSI

    ON

    GAI

    N (d

    B)

    RF FREQUENCY (GHz)

    5

    10

    15

    20

    2dBm4dBm6dBm8dBm

    21858-005

    Figure 13. Conversion Gain vs. RF Frequency at Various LO Drives

    0

    –30

    RF R

    ETU

    RN L

    OSS

    (dB)

    –25

    –20

    –15

    –10

    –5

    +85°C+25°C–40°C

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz) 21

    858-006

    Figure 14. RF Return Loss vs. RF Frequency Over Temperature, LO Frequency = 24 GHz

    0

    –150 1 2 3 4

    IF R

    ETU

    RN L

    OSS

    (dB)

    IF FREQUENCY (GHz)

    –12

    –9

    –6

    –3

    IF1IF2

    21858-007

    Figure 15. IF Return Loss vs. IF Frequency, LO Frequency = 24 GHz, LO Drive = 6 dBm, Data Taken Without External 90° Hybrid

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • HMC977 Data Sheet

    Rev. D | Page 8 of 20

    20

    –50

    RF T

    O IF

    AND

    LO

    TO

    IF IS

    OLA

    TIO

    N (d

    B)(d

    B)

    RF/IF2RF/IF12LO/IF12LO/IF2

    –40

    –30

    –20

    –10

    0

    10

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz) 21

    858-008

    Figure 16. RF to IF and LO to IF Isolation vs. RF Frequency, LO Drive = 6 dBm, Data Taken Without External 90° Hybrid

    0

    –16

    INPU

    T P1

    dB (d

    Bm)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    +85°C+25°C–40°C

    –14

    –12

    –10

    –8

    –6

    –4

    –2

    21858-009

    Figure 17. Input P1dB vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    15

    –15

    INPU

    T IP

    3 (d

    Bm)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    –10

    –5

    0

    5

    10

    2dBm4dBm6dBm8dBm

    21858-010

    Figure 18. Input IP3 vs. RF Frequency at Various LO Drives

    0

    –80

    LO T

    O R

    F IS

    OLA

    TIO

    N (d

    B)

    –70

    –60

    –50

    –40

    –30

    –20

    –102LO/RFLO/RF

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz) 21

    858-011

    Figure 19. LO to RF Isolation vs. RF Frequency LO Drive = 6 dBm, Data Taken Without External 90° Hybrid

    15

    –15

    INPU

    T IP

    3 (d

    Bm)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    +85°C+25°C–40°C

    –10

    –5

    0

    5

    10

    21858-012

    Figure 20. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    8

    6

    4

    2

    00.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

    NOIS

    E FI

    GU

    RE (d

    B)

    IF FREQUENCY (GHz) 21858-013

    Figure 21. Noise Figure vs. IF Frequency, LO Frequency = 10 GHz, LO Drive = 6 dBm, Data Taken Without External 90° Hybrid

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • Data Sheet HMC977

    Rev. D | Page 9 of 20

    QUADRATURE CHANNEL DATA TAKEN WITHOUT 90° HYBRID AT THE IF PORTS, IF = 1000 MHZ, UPPER SIDEBAND

    6

    0

    NOIS

    E FI

    GU

    RE (d

    B)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    +85°C+25°C–40°C

    1

    2

    3

    4

    5

    21858-014

    Figure 22. Noise Figure vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    2.0

    –2.0

    –1.0

    0.5

    1.5

    0

    –1.5

    –0.5

    1.0

    AMPL

    ITUD

    E BA

    LANC

    E (d

    B)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    2dBm4dBm6dBm

    21858-015

    Figure 23. Amplitude Balance vs. RF Frequency at Various LO Drives

    RESP

    ONS

    E (d

    B)

    0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0IF FREQUENCY (GHz)

    20

    –20

    –15

    –10

    –5

    0

    5

    10

    15

    CONVERSION GAINRETURN LOSS

    21858-016

    Figure 24. Conversion Gain and Return Loss Over IF Bandwidth

    35

    –5

    PHAS

    E B

    ALA

    NCE

    (Deg

    rees

    )

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    2dBm4dBm6dBm

    0

    5

    10

    15

    20

    25

    30

    21858-017

    Figure 25. Phase Balance vs. RF Frequency at Various LO Drives

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • HMC977 Data Sheet

    Rev. D | Page 10 of 20

    DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 1000 MHz, LOWER SIDEBAND 25

    0

    CONV

    ERSI

    ON

    GAI

    N (d

    B)

    5

    10

    15

    20

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    +85°C+25°C–40°C

    21858-018

    Figure 26. Conversion Gain vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    0

    –60

    IMAG

    E RE

    JECT

    ION

    (dBc

    )

    –50

    –40

    –30

    –20

    –10

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    +85°C+25°C–40°C

    21858-019

    Figure 27. Image Rejection vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    15

    –15

    INPU

    T IP

    3 (d

    Bm)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    –10

    –5

    0

    5

    10

    +85°C+25°C–40°C

    21858-020

    Figure 28. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    25

    0

    CONV

    ERSI

    ON

    GAI

    N (d

    B)

    5

    10

    15

    20

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    2dBm4dBm6dBm8dBm

    21858-021

    Figure 29. Conversion Gain vs. RF Frequency at Various LO Drives

    0

    –16

    INPU

    T P1

    dB (d

    Bm)

    –14

    –12

    –10

    –8

    –6

    –4

    –2

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    +85°C+25°C–40°C

    21858-022

    Figure 30. Input P1dB vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    15

    –15

    INPU

    T IP

    3 (d

    Bm)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    –10

    –5

    0

    5

    10

    2dBm4dBm6dBm8dBm

    21858-023

    Figure 31. Input IP3 vs. RF Frequency at Various LO Drives

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • Data Sheet HMC977

    Rev. D | Page 11 of 20

    DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 2000 MHz, UPPER SIDEBAND 25

    0

    CONV

    ERSI

    ON

    GAI

    N (d

    B)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    +85°C+25°C–40°C

    5

    10

    15

    20

    21858-024

    Figure 32. Conversion Gain vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    0

    –60

    IMAG

    E RE

    JECT

    ION

    (dBc

    )

    –50

    –40

    –30

    –20

    –10

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    +85°C+25°C–40°C

    21858-025

    Figure 33. Image Rejection vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    25

    0

    CONV

    ERSI

    ON

    GAI

    N (d

    B)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    5

    10

    15

    20

    2dBm4dBm6dBm8dBm

    21858-026

    Figure 34. Conversion Gain vs. RF Frequency at Various LO Drives

    15

    –15

    INPU

    T IP

    3 (d

    Bm)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    –10

    –5

    0

    5

    10

    +85°C+25°C–40°C

    21858-027

    Figure 35. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    15

    –15

    INPU

    T IP

    3 (d

    Bm)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    –10

    –5

    0

    5

    10

    2dBm4dBm6dBm8dBm

    21858-028

    Figure 36. Input IP3 vs. RF Frequency at Various LO Drives

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • HMC977 Data Sheet

    Rev. D | Page 12 of 20

    DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 2000 MHz, LOWER SIDEBAND 25

    0

    CONV

    ERSI

    ON

    GAI

    N (d

    B)

    5

    10

    15

    20

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    +85°C+25°C–40°C

    21858-029

    Figure 37. Conversion Gain vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    0

    –50

    IMAG

    E RE

    JECT

    ION

    (dBc

    )

    –40

    –30

    –20

    –10

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    +85°C+25°C–40°C

    21858-030

    Figure 38. Image Rejection vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    25

    0

    CONV

    ERSI

    ON

    GAI

    N (d

    B)

    5

    10

    15

    20

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    2dBm4dBm6dBm8dBm

    21858-031

    Figure 39. Conversion Gain vs. RF Frequency at Various LO Drives

    15

    –15

    INPU

    T IP

    3 (d

    Bm)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    –10

    –5

    0

    5

    10

    +85°C+25°C–40°C

    21858-032

    Figure 40. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    15

    –15

    INPU

    T IP

    3 (d

    Bm)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    –10

    –5

    0

    5

    10

    2dBm4dBm6dBm8dBm

    21858-033

    Figure 41. Input IP3 vs. RF Frequency at Various LO Drives

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • Data Sheet HMC977

    Rev. D | Page 13 of 20

    DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 3300 MHz, UPPER SIDEBAND 25

    0

    CONV

    ERSI

    ON

    GAI

    N (d

    B)

    5

    10

    15

    20

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    +85°C+25°C–40°C

    21858-034

    Figure 42. Conversion Gain vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    0

    –50

    IMAG

    E RE

    JECT

    ION

    (dBc

    )

    +85°C+25°C–40°C

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    –40

    –30

    –20

    –10

    21858-035

    Figure 43. Image Rejection vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    25

    0

    CONV

    ERSI

    ON

    GAI

    N (d

    B)

    5

    10

    15

    20

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    2dBm4dBm6dBm8dBm

    21858-036

    Figure 44. Conversion Gain vs. RF Frequency at Various LO Drives

    15

    –15

    INPU

    T IP

    3 (d

    Bm)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    +85°C+25°C–40°C

    –10

    –5

    0

    5

    10

    21858-037

    Figure 45. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    15

    –15

    INPU

    T IP

    3 (d

    Bm)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    –10

    –5

    0

    5

    10

    2dBm4dBm6dBm8dBm

    21858-038

    Figure 46. Input IP3 vs. RF Frequency at Various LO Drives

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • HMC977 Data Sheet

    Rev. D | Page 14 of 20

    DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 3300 MHz, LOWER SIDEBAND 25

    0

    CONV

    ERSI

    ON

    GAI

    N (d

    B)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    +85°C+25°C–40°C

    5

    10

    15

    20

    21858-039

    Figure 47. Conversion Gain vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    0

    –50

    IMAG

    E RE

    JECT

    ION

    (dBc

    )

    +85°C+25°C–40°C

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    –40

    –30

    –20

    –10

    21858-040

    Figure 48. Image Rejection vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    25

    0

    CONV

    ERSI

    ON

    GAI

    N (d

    B)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    5

    10

    15

    20

    2dBm4dBm6dBm8dBm

    21858-041

    Figure 49. Conversion Gain vs. RF Frequency at Various LO Drives

    15

    –15

    INPU

    T IP

    3 (d

    Bm)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    +85°C+25°C–40°C

    –10

    –5

    0

    5

    10

    21858-042

    Figure 50. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm

    15

    –15

    INPU

    T IP

    3 (d

    Bm)

    20 21 2322 24 25 26 27 28RF FREQUENCY (GHz)

    –10

    –5

    0

    5

    10

    2dBm4dBm6dBm8dBm

    21858-043

    Figure 51. Input IP3 vs. RF Frequency at Various LO Drives

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • Data Sheet HMC977

    Rev. D | Page 15 of 20

    SPURIOUS PERFORMANCE M × N Spurious Outputs, IF = 1000 MHz

    RF = 24 GHz, and RF input power = −20 dBm. LO frequency = 11.5 GHz, and LO drive = 4 dBm. All values are in dBc below IF power level (RF − 2 × LO). Spur values are (M × RF) − (N × LO). N/A means not applicable.

    N × LO 0 1 2 3 4

    M × RF

    0 N/A −22.6 −7.4 −28.8 −37.2 1 −20 −29.3 0 −33 −37.3

    2 −72.6 −72.6 −57.6 −43.6 −51.6

    3 N/A N/A −74.6 −74.6 −74.6

    4 N/A N/A N/A N/A N/A

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • HMC977 Data Sheet

    Rev. D | Page 16 of 20

    THEORY OF OPERATION The HMC977 is a compact, GaAs, MMIC, I/Q downconverter in a leadless, RoHS compliant, SMT package. The device can be used as either an image reject mixer or a SSB upconverter. The mixer uses two standard, double balanced, mixer cells and a

    90° hybrid. This device is a smaller alternative to a hybrid style image reject mixer and a SSB upconverter assembly. The HMC977 eliminates the need for wire bonding, allowing the use of the surface-mount manufacturing techniques.

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • Data Sheet HMC977

    Rev. D | Page 17 of 20

    APPLICATIONS INFORMATION Figure 52 shows the typical application circuit for the HMC977. To select the appropriate sideband, an external 90° hybrid coupler is needed. For applications not requiring operation to dc, use an off chip dc blocking capacitor. The common-mode voltage for each IF port is 0 V.

    To select the lower sideband, connect the IF2 pin to the 90° port of the hybrid and the IF1 pin to the 0° port of the hybrid. To select the upper sideband (low side LO), connect the IF2 pin to the 0° port of the hybrid and the IF1 pin to the 90° port of the hybrid.

    ×2 IF OUT

    AUTOMATICGAIN

    CONTROLBAND-PASSFILTERCOUPLER

    RF20GHz TO 28GHz

    LO8.3GHz TO 15.7GHz

    21858-051

    Figure 52. Typical Application Circuit

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • HMC977 Data Sheet

    Rev. D | Page 18 of 20

    EVALUATION PCB It is recommended to use RF circuit design techniques with the circuit board used in the application. Signal lines must have 50 Ω impedance, and the package ground leads and exposed paddle must be connected directly to the ground plane similar to that shown Figure 54. A sufficient number of via holes must be used to connect the top and bottom ground planes. The evaluation circuit board shown in Figure 53 is available from Analog Devices, Inc., upon request.

    Table 6. List of Materials for Evaluation PCB 1316561 Item Description J1 PCB mount, Subminiature Version A (SMA), RF

    connector, SRI J2, J3 PCB mount K connectors, SRI J5 to J8 DC pins C1, C4, C7 100 pF capacitors, 0402 package C2, C5, C8 10 nF capacitors, 0402 package C3, C6, C9 4.7 μF capacitors, Case A package U1 HMC977 PCB2 131653 evaluation board 1 Reference this number when ordering complete evaluation PCB. 2 Circuit board material: Rogers 4350.

    J1

    J2

    J4

    J3

    U1

    131653-1

    LO

    IF2

    IF1

    VDLO1VDRFVDL02 GND

    RFIN

    +

    +

    C1C2

    C8

    C3

    C6

    C9

    J5 J6 J7 J8

    H977XXXX

    +

    C5C4

    C721858-052

    Figure 53. Evaluation PCB

    https://www.analog.com/HMC977?doc=HMC977.pdf

  • Data Sheet HMC977

    Rev. D | Page 19 of 20

    LAYOUT Solder the exposed pad on the underside of the HMC977 to a low thermal and electrical impedance ground plane. This pad is typically soldered to an exposed opening in the solder mask on the evaluation board. Connect these ground vias to all other ground layers on the evaluation board to maximize heat dissipation from the device package. Figure 54 shows the PCB land pattern footprint for the HMC977 evaluation board.

    PAD SIZE0.026" × 0.010"

    0.0197"[0.50]

    0.178" SQUARE

    0.006" MASK/METAL OVERLAP0.010" MIN MASK WIDTH

    0.034"TYPICAL

    VIA SPACING

    0.010"TYPICAL VIA

    0.010" REF

    0.116"MASK

    OPENING

    PIN 1

    GROUND PAD

    SOLDERMASK

    0.030"MASK OPENING 0.110" SQUARE

    GROUND PAD

    0.098" SQUARE MASK OPENING0.020 × 45° CHAMFER FOR PIN 1

    21858-054

    Figure 54. 131656-HMC977LP4E PCB Land Pattern Footprint

    https://www.analog.com/HMC977?doc=HMC977.pdfhttps://www.analog.com/HMC977?doc=HMC977.pdf

  • HMC977 Data Sheet

    Rev. D | Page 20 of 20

    OUTLINE DIMENSIONS

    08-3

    0-20

    18-A

    PKG

    -000

    000

    0.50BSC

    0.500.400.30

    COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-8.

    BOTTOM VIEWTOP VIEW

    4.104.00 SQ3.90

    1.000.900.80 0.05 MAX0.02 NOM

    0.20 REF

    COPLANARITY0.08

    PIN 1INDICATOR

    1

    24

    712

    13

    18

    19

    6

    0.300.250.18

    0.20 MIN

    2.952.80 SQ2.65

    EXPOSEDPAD

    PIN 1IND ICATO R AR E A OP TIO N S(SEE DETAIL A)

    DETAIL A(JEDEC 95)

    SEATINGPLANE

    FOR PROPER CONNECTION OFTHE EXPOSED PAD, REFER TOTHE PIN CONFIGURATION ANDFUNCTION DESCRIPTIONSSECTION OF THIS DATA SHEET.

    Figure 55. 24-Lead Lead Frame Chip Scale Package [LFCSP]

    4 mm × 4 mm Body and 0.90 mm Package Height (HCP-24-2)

    Dimensions shown in millimeters

    ORDERING GUIDE

    Model1 Temperature Range Package Description Lead Finish MSL Rating2

    Package Option

    HMC977LP4E −40°C to +85°C 24-Lead Lead Frame Chip Scale Package [LFCSP] 100% Matte Sn MSL1 HCP-24-2 HMC977LP4ETR −40°C to +85°C 24-Lead Lead Frame Chip Scale Package [LFCSP] 100% Matte Sn MSL1 HCP-24-2 131656-HMC977LP4E Evaluation Assembly Board 1 The models are RoHS complaint parts. 2 See the Absolute Maximum Ratings section.

    ©2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D21858-0-11/19(D)

    https://www.analog.com/?doc=HMC977.pdfhttps://www.analog.com/HMC977?doc=HMC977.pdf

    FeaturesApplicationsFunctional Block DiagramGeneral DescriptionRevision HistorySpecificationsElectrical Specifications20 GHz to 26.5 GHz26.5 GHz to 28 GHz

    Absolute Maximum RatingsThermal ResistanceESD Caution

    Pin Configuration and Function DescriptionsInterface Schematics

    Typical Performance CharacteristicsData Taken as IRM with External 90° Hybrid at the IF Ports, IF = 1000 MHz, Upper SidebandQuadrature Channel Data Taken Without 90° Hybrid at the IF Ports, IF = 1000 MHz, Upper SidebandData Taken as IRM with External 90° Hybrid at the IF Ports, IF = 1000 MHz, Lower SidebandData Taken as IRM with External 90° Hybrid at the IF Ports, IF = 2000 MHz, Upper SidebandData Taken as IRM with External 90° Hybrid at the IF Ports, IF = 2000 MHz, Lower SidebandData Taken as IRM with External 90° Hybrid at the IF Ports, IF = 3300 MHz, Upper SidebandData Taken as IRM with External 90° Hybrid at the IF Ports, IF = 3300 MHz, Lower SidebandSpurious PerformanceM × N Spurious Outputs, IF = 1000 MHz

    Theory of OperationApplications InformationEvaluation PCBLayout

    Outline DimensionsOrdering Guide