Yaesu Ft 2500m Technical Supplement

FTIZ^SOOMMil-Spec 2-m FM Tkansceiver

Technical Supplement

YAESU MUSEN CO., LTD.C.P.O. Box 1500, Tokyo, JapanYAESU U.S.A.17210 Edwards Rd., Cerritos, California 90203U.S.A.YAESU EUROPE B.V.Snipweg 3. U18DN Schiphol, The NetherlandsYAESU UK LTD.Unit 2, Maple Grove Business CentreLawrence Rd., Hounslow, Middlesex TW4 6DR, UK

n

ContentsI. General InformationIntroduction

. .1,-lSpecifications . . . . .].-2ChipComponentlnformation ....L-3CircuitDescription . , . .'1,-7

Block Diagram .1_-11

InterconnectionDiagram ...1-13

ExplodedView&MiscellaneousParts ...L-15

II. ServicingCase Disassembly & PCB AccessLCD & Control Unit AccessLithium Backup Battery ReplacementPanel Lamp Replacement9600 Baud Packet ModificationChannel Display-Only Mode

. . .2-'1,2-l2-'t

2-1.

,-1

2-4

Alignment.. .....2-5PLL & Transmitter 2-6PLL VCV (Varactor Control Voltage) . . . 2-6PLLReferenceFrequency

. . . . .2-7TrqnsmitterOutput

..2-7TiansmitterDeai.ation

. . . . . .2-7Receiver 2-gInterstageTransformers

......2-8S-MeterCalibration

. .2-BScannerCenterStop.

......2-BSquelch

....2-B

III. Board Units (Schematics, Layout & Parts List)VCOUnit. ...3A-LMAINUnit. . .38-LMIC UnitCNTLUnit . ..3D-LDISPLAYUnit. ....3E-1,

IV. Optional Board Units (Schematics, Layout & Parts)FRC-5 DTMF Paging Unit . . 4A-'t_FTS-L7A CTCSS Tone Squelch Unit . . . .48-1-MH-26csyMicrophone . . . .4Cllv{IJ-z7 AsI Microphone . . 4D-7

Cut out the label at the right and placeit behind the clear plastic window inthe spine of the manual binder.

FT-2500MTechnical Supplement

V'Introduction

The FT-2500M is Yaesu's new successor to thefamous FT-2400H, the industry's first amateurtransceiver designed to meet rugged U'S' mili-tary specifications for shock and vibration (MIL-SPEC 810-C). The FT-2500M is upgraded with anew front panel and control knob layout, andadditional operator features.

Selectable power output of 5,25 or 50 wattswithout the need of forced air cooling is possibledue to the large heatsink surface area of the com-partmentalized one-piece diecast chassis. Back-lighting for the large LCD (display) and knobs ism-anually adjustable, or automatically controlledby a photosensor, and the less-used buttons havea flip-down protective cover. The thirty-one tun-able memories can each be programmed with a4-character channel name, which can thenbe dis-played in place of frequency, as desired.

Each memory offers complete programmabil-ity and scanning functions, such as independenttx/ rx frequencies, independent repeater offsetand CTCSS tone, prografiunable scan limits, se-lectable scan resume modes and memorY skiP,priority monitoring and a l-touch instant-recall

CALL channel. Channel steps are user-selectablefrom 5 to 50 kHz, and Automatic Repeater Shiftcan set standard repeater shifts when you tune toa repeater subband. A1750-Hz tone generator isincluded in European versions. A 39-tone Pro-grammable CTCSS encoder is built in as stand-ard, and the FTS-17ACTCSS unit canbe installedto provide tone squelched private channels and aCTCSS paging bell feature to sound a pagingalert tone when the tone squelch opens.

DTMF (Dual-Tone, Multi-Frequency) -basedselective calling and private paging capabilitiescan be easily added with the optional FRC-6,controlled entirely from the front panel. You canselect any of 999 3-digit ID codes for your trans-ceiver, and then have your receiver stay quietuntil your code is received (frorn any standardDTMF-equipped transceiver). When a call is re-ceived, the FT-2500M displays the caller's code,and a pagingbeeper canbe set to sound and evento respond to the call automatically. Seven DTMFcode memories store your ID plus those of sixother frequently-called stations or grouPs youwish to monitor.

FT-2500M Technical Supplement1-1

Specifications

GeneralFrequency Range: t44-146 or 148 MHz T>; or 144-146 MHz or 1.40-174MHz Rx ,_____,Channel Steps: 5,10,L2.5,I5,20,25 & 50 kHzFrequency Stability: < +10 ppm (-20" to +60'C)Mode of Emission: G3E (F3)Antenna Impedance: 50 ohms, unbalancedSupply voltage: 13.8 VDC +10"/", negative groundCurrent Consumption (typical): Rx: 600 mA, Tx hr/mid/low:12/9/5AOperating T"*p. Range: -20o to +60" CCase Size (WHD): 160 x 50 x 180 mm (w/o knobs)Weight: 1.5 kg (3.31b.)Transmitter \-/OutputPower (high/mid /\ow): 50/25/5WModulation Type: Variable ReactanceMaximumDeviation: t5 kHzSpurious Radiation: less than -60 dBMicrophone Impedance: 2kQ

\vReceiverCircuit Type: Double Conversion SuperheterodyneIFs: 21.4}l4'}lz & 455 kHzSensitivity (for 12dB SINAD): better than 0.2 pVSelectivity (-6/-60 dB): 12/30kHzIF Rejection: better than 70 dBImage Rejection: better than 70 dBMaximum AF Output: 3.5 W into 4 ohms @10% THDSpecifications are subject to change without notice or obligation.

FT-2500M Technical Supplement

t-

1-2

rThe diagrams below indicate some of thedistinguishing features of common chip com-ponents.

Capacitors

l\>.1 \

Tantalum Capacitors

Resistors

p Component Information

Type RMC 1/10W 1/16WMarking* I00,222,47 3"" "

llt--lTen unit One

-@

Q

INDICATED

1255t0

LETTERS

tl!aTOo Examples i100 : 10O

222 : 2.2kO473 :47kQ

(Unit I mm)Type L w T

3216

2125

r 608

3.2

2.0

t.6

t.61.25

0.8

0.45-0.600.35-0.500.65-0.95

Type L w T

t /t01 /16

2.0

t.61.25

0.8

0 .45

0.450 0 r0"I 1 l0'2 2 td3 3 td4 4 t05 5 10'6 6 td7 7 10'B B tCII I td


\-------_

Chip Component InformationReplacing Chip Comp onents

Chip components are installed at the factoryby a series of robots. The first one places a spotof adhesive resin at the location where eachpart is to be installed, and later robots handleand place parts using vacutun suction.

For single-sided boards, solder paste is ap-plied and the board is then baked to harden theresin and flow the solder. For double-sidedboards, no solder paste is applied, but theboard is baked (or exposed to ultra-violet light)to cure the resin before dip soldering.

In our laboratories and service shops, smallquantities of chip components are mountedmanually by applying a spot of resin, placingthem with tweezers, and then soldering byvery small dual streams of hot air (withoutphysical contact during soldering). We removeparts by first removing solder using a vacuurnsuction iron, which applies a light, steady vac-uum at the iron tip, and then breaking theadhesive with tweezers.

The special vacuum soldering/desolderingequipment is recommended if you expect to doa lot of chip replacements. Otherwise, it isusually possible to remove and replace chipcomponents with only a tapered, temperature-controlled soldering iron, a set of tweezers andbraided copper solder wick. Soldering irontemperature should be less than 280'C (536"F).

Precautions for Chip ReplacementX Do not disconnect a chip forcefully, or the

foil pattern may peel off the board.X Never re-use a chip component. Dispose of

all removed chip components immediatelyto avoid mixing with new parts.

X Limit soldering time to 3 seconds or less toavoid damaging the component and board.

Remouing Chrp Comp onents3 Remove the solder at each joint, one joint at

a time, using solder wick whetted withnon-acidic flux as shown below. Avoid ap-plying pressure, and do not attempt to re-move the tinning from the chip's electrode.

Grasp the chip on both sides with tweezers,and gently twist the tweezers back andforth (to break the adhesive bond) whilealternately heating each electrode. Be care-ful to avoid peeling the foil traces from theboard. Dispose of the chip when removed.

D After removing the chip, use the copperbraid and soldering iron to which away anyexcess solder and smooth the land for in-stallation of the replacement part.

tr

1-4FT-2500M Technical Supplement

Chip Component InformationInstall a Replacement Chip

As thevalue of some chip components is not\__ indicated on the body of the chip, be careful to

get the right part for replacement.D Apply a small amount of solder to the land

on one side where the chip is to be installed.Avoid too much solder, which may causebridging (shorting to other parts).

\=\

fl Hold the chip with tweezers in the desiredposition, and apply the soldering iron witha motion line that indicated by the arrow inthe diagram below. Do not apply heat formore than 3 seconds.

tl Remove the tweezers andtrode on the other side indescribed.

solder the elec-the manner just


Notes


Circuit DescriptonReceioe Signal Path

Incoming RF from the antenna jack is deliv-ered to the Main Unit and passed through a low-pass filter and a I/+-wave antenna switchingnetwork consisting of coils L1003 & Ll-004, ca-pacitors C1003 & C1004, and diodes D1001 &D1025. Signals within the frequency range of thetransceiver are then passed through a varactor-tuned bandpass filter consisting of T1001/T1002before RF amplification by Q1001 (3SK131). Theamplified RF is then bandpass filtered again byvaractor-tuned resonators T1,003/T1004, to en-sure pure in-band input to 1st mixerQ1002/Q1003 (2SK302GR x 2).

Buffered output from the VCO Unit is ampli-fied by Q1005 (25C2759) and lowpass filtered byLL009 and C1.042/C1043, to provide a pure 1stlocal signal between LL8.6 and 152.6MH.2 to the1st mixer. The 21.4-MHz 'l.st mixer product ispassed through dual monolithic crystal filterXF1001 & XF1002 (t7.5 kHz BW) to strip away allbut the desired signal, which is then amplified byQ1004 (25C2714Y).

The amplified 1st IF signal is applied to FM IFsubsystem IC Q1008 (MC3372ML), which con-tains the 2nd mixer, 2nd local oscillator, limiteramplifier, noise amplifie1, S-meter amplifier andsquelch gates. A 2nd local signal is generatedfrom 21.855 MHz crystal XL001, which producesthe 455 kHz 2nd IF when mixed with the 1st IFsignal within Q1008. The 2nd IF is passedthrough ceramic filter CF1001 to strip away un-wanted mixer products, and then applied to thelimiter amp in Q1008, which removes amplitudevariations in the 455 kHz IF before detection ofthe speechby ceramic discriminator CD1001.

Detected audio is delivered from Q1008 to theCNTL Unit, where it passes through buffer am-plifier Q2018 (2sc2712cR) and audio gateQ2002(DTC114EK) before de-emphasis, and high-passfiltering by Q2001-2 (NJM29O2Mj/4). Anotheraudio muting gate, Q2003 (DTC114EK), passesthe signal, which is then combined with beeperaudio originating from the microprocessorthrough Beeper volume trimrner VR2001. Thelevel of the combined receiver and beeper audioon the CNTL Unit is set by VOL potentiometerVR3002 on the DISP Unit and is then retumed theMain Unit for amplification by Q1023

(TDA2003H) up to 2 watts for the optional head-phone jack or 8-ohm loudspeaker.

Squelch ControlThe squelch circuit consists of noise amplifier

Q1007 (2S'C2712GR) and a highpass filter andsquelch trigger within Q1008 on the MAIN Unit,and control circuitry within microprocessorQ2006 (SC418082CFU) on the CNTL Unit.

When no carrier is received, noise at the out-put of the detector stage in Q1008 is amplifiedbyQ1007 and highpass filtered by the noise ampsection of Q1008, and then rectified by D1012 toprovide a DC control voltage for the squelchswitching section within Q1008. With no carrier,pin 14 of Q1008 is high. This signal is inverted byQ1006 (lMHs) and delivered to BUSY pin 15 ofmain microprocessor Q2006 on the CNTLUnit asthe Scan Stop signal, which causes the BUSY indi-cation on the display when the squelch is open.This signal also causes the microprocessor to cutreceiver audio in two places on the CNTL Unitmentioned already: opening audio mute gateQ2002, and pulling the audio line to ground justbefore the audio amplifier at Q2003, thus silenc-ing the receiver while no signal is being received,and during transmission.

When a carrier appears at the discriminator,noise is removed from the output, causing pin 1,4of Q1008 to go low. This signals the microproces-sor to activate the BUSY indicator through LCDdriver Q3001 (LC7582E). The microprocessorthen checks for CTCSS tone detection from theFTS-17A Tone Squelch Unit (if installed), and forDigital Code Squelch information (if the FRC-6Pager Unit is installed). If not transmitting andtone squelch is not activated, or if the receivedtone mitches that programmed, the microproces-sor switches Q2002 and Q2003 to allow audio topass to the amplifier and loudspeaker.Center-Stop Scanning

To ensure that scanning stops at the center of adetected signal, discriminator output from pin 9of Q1008 is also delivered to comparator circuitQ2001 (NJM2902-3/+ & -a/+) on the CNTL Unit,which compares the discrirninator output to apreset DC level. The output of the comparatorconnects to the Scan Stop line, preventing thereceived signal from signalling the microproces-sor to stop scanning until the signal has been


Circuit Descriptiontuned to its peak level, preset by Center-Stoptrimmer VR2007.

Transmit Signal PathSpeech input from the microphone is deliv-

ered via the Mic (]ack) Unit and DISPLAY Unit tothe CNTL Unit, where it passed through MicMute switch D2003 (DAP202K) for amplificationand pre-emphasis by Q2007-1 (NJM2902M-1/4).To prevent over-deviation, the audio is processedby IDC (instantaneous deviation control) stageQ2007-2/a, and then lowpass filtered by Q2007-3/t&. -41+(N,naz9o2M) before delivery to the modula-tor on the VCO Unit.

If a CTCSS tone is enabled for transmission,the subaudible tone from microprocessor Q2006on the CNTL Unit is lowpass filtered by Q2001,-tand mixed with the IDC-processed speech audio.Also, DTMF tones generated by the FRC-6 op-tion(if installed) or directly from the microproces-soq, are applied to the transmit audio chain at theinput of the IDC stage. The microprocessor alsodisables microphone at Mic Mute switch D2003.

The modulating audio is delivered to diodeD305 (1SV214) on the VCO Unit, frequencymodulating the PLL carrier up to + 5 kHz fromthe unmodulated carrier at the transmitting fre-quency. The modulated signal from transmitterVCO Q303 (2SC3356) is buffered by Q305(2SC2759) and delivered to the Main Unit foramplification by Q1.01.2 (2SC2759), Q1011(MMBR951L) and Q1010 (2SC20s3). The lowlevel transmit signal is then finally amplified byPA module Q1009 (M67781L) up to 50 watts.Harmonic spurious radiation in the final outputis suppressed by a 3-pole lowpass filter on theMain Unit, and the transmit signal then passesthrough 1/+-w av e antenna switch D1 0 1 6 ( U M 94 1 5)before delivery to the antenna.Automatic Tiansmit Power Control

RF power output from the final amplifier issampled by CL064 and rectified by DL01.7(1SS97). The resulting DC is passedbyhigh/me-dium/low power controller Q1017 (FMS1) andtransmit inhibit gate Q1018 (lMX1) to AutomaticPower Controller Q1019 (2581143S) whichregulates supply voltage to transmitter RF ampli-fiers Q1009 and Q1010, so as to maintain stablehigh, medium or.low output power under vary-ing antenna loading conditions.

Spurious SuppressionGeneration of spurious products by the trans-

mitter is minimized by the fundamental carrierfrequency being equal to the final transmittingfrequency, modulated directly in the transmitVCO. Additional harmonic suppression is pro-vided by a 3-pole lowpass filter consisting ofLL002, LL013, LL01,4 and C1002, CL061, C1.063,C1065-C1067, and C1I64, resulting in more than50 dB harmonic suppression (for transmittingfrequencies in the amateur band) prior to deliv-ery to the antenna.

PLL Erequency SynthesizerPLL circuitry on the Main Unit consists of

prescaler Q1025 (MC12O22SLAD) and PLL sub-system IC Q1024 (MC1451 s9F2),which containsa reference oscillator / divider, serial-to-paralleldata latch, programmable divider and a phasecomparator. Stability is obtained by a regulated5-V supply to Q1024 and temperature compen-sating capacitors associated with L2.8-MHz fre-quency reference crystal X1002.

Receiver VCO Q301 (2SC3356) on the VCOUnit oscillates between 118.6 and 152.6 accordingto the programmed receiving frequency. TheVCO ouput is buffered by Q305 (2SC2759) onthe VCO Unit, and then retumed to the MAINUnit where a sample of the output is buffered byQ1028 (2S,C2714Y) for application to prescaler/-swallow counter Q1025. There the VCO signal isdivided by 64 or 65, according to a control signalfrom the data latch section of Q1024,before beingapplied to the programmable divider section ofthe PLL chip.

The data latch section of Q1024 also receivesserial dividing data from microprocessor Q2006on the CNTL Unit, which causes the predividedVCO signal to be further divided by 23,720

-30,520 in the programmable divider section, de-pending upon the desired receive frequency, soas to produce a S-kHz or 6.25-kHz derivative ofthe current VCO frequency. Meanwhile, the refer-ence divider section of Q1024 divides the 12.8-MHz crystal reference by 2560 (or 2048) toproduce the S-kHz (or 6.25-kHz) loop reference(respectively).

The 5-kHz (or 6.25-kHz) signal from the pro-grammable divider (derived from the VCO) andthat derived from the crystal are applied to the


t Descriptionphase detector section of Q1.024, which producesa dual 5-V pulsed output with pulse durationdepending on the phase difference between theinput signals. This pulse train is converted to DCby charge pump Q1026/QI027 (lMXs /lMZ2),lowpass filtered, and then fed back to varactorsD301 and D302 (1T363 x 2) on the VCO Unit.

Changes in the level of the DC voltage appliedto D30L/D302 affect the reactance in the tankcircuit of VCO Q301, changing the oscillating fre-quency according to the phase difference be-tween the signals derived from the VCO and thecrystal reference oscillator. The VCO is thusphase-locked to the crystal reference oscillator.

The output of receiver VCO Q301, after buffer-irg by Q305, is delivered to the Main Unit foramplification by Q1005 before application to the1st mixer, as described previously.

Transmitter VCO Q303 (2SC3356) oscillatesbetween 140 and 174MHz according to the pro-grammed transmit frequency. The remainder ofthe PLL circuitry is shared with the receiver.However, the dividing data from the micro-processor is such that the VCO frequency is at theactual transmit frequency (rather than offset forIFs, as in the receiving case). Also, the transmitterVCO is modulated by the filtered speech audioapplied to modulating varactor D305, as de-scribed previously.Transmit Inhibit

When the transmit PLL is unlocked pin 7 ofPLL chip Q1024 goes to a logic low, tuming onQ1020 (DTA143EK) and tuming off half of Q1018.This unlock signal produces a low impedance atthe base of the other half of Q1018, which thenturns off Automatic Power Controller Q1019 todisable the supply voltage to transmitter RF am-

plifiers Q1009 and Q1010, disabling the transmit-ter.

Mis cell ane ous Cir cuitsPower-On Sequencing I Panel Lamps

Pressing the POWER switch on the DISP Unitturns onQ2017 (DTC114EK) on the CNTL Unit,applying 5 volts from regulator Q2012 (L7805)via 9-volt regulator Q1013 (AN6541 ) and the 13.8-V supply line to the base of Q2016 (2581140S).This pulls RESET pn75 of microprocessor Q2006low, causing PO pin 66 to go high. The PO linethen pulls the base of Q2017 (DTC114EK) low,lighting the pilot lamps via Q2005 (25C2712GR)and Q2004 (2SB1143S). Lamp brightness is con-trolled by CdS photosensor CS3001, which pro-vides an input to microprocessor Q2006, pn 49.An pulsed DC ouput is then applied to the inte-grator circuit formedby C2015 and M021, whichproduces a DC bias proportional to the pulsetrain input, which is then applied to the base ofQ200s (2S,C2712GR), and Q2004 (2SB1143S),controlling voltage to the panel and displaylamps.

P u sh-Tb -Talk Tr an s mit Ac t ia at i o nThe PTT switch on the microphone is connec-

ted to pn 44 of microprocessor Q2006, so thatwhen the switch is closed pn69 (tx/rx) goes low.This signal is delivered to power bus controllerQ1021 (lMHs) on the MAIN Unit, which thendisables the receiver by disabling the 9-V supplybus at QI022 (DTA143EK) to the front end, IF,discriminator and receiver VCO circuitry. At thesame time, Q1015 (2581143S) activates thetransmit 9-V supply line to enable the transmit-ter.

1-9


Notes


t-I

01 02825C27 1 LY

BUFF

01025MC 1 2022SLAD

PRE SCALER IC

uM94 1 5T/R ANT SW

Qro052SC2759

BUFF

cFt001cF\v455E455KHz

VCO_UN I TF3152101A

MArN-UNtT 73427000

+--!---------- TX

RX

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[_


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PAGER_UN I TFRC-6(oPT r 0N)

01007FIL AMP

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T,/R SW02003

DTC 1 1 4EKAF MUTE

I i I r,lrc uure

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RESET CIRCUIT

cNTL-UN I T a34261C1

r-DATA

Block Diagram

MICrl/1'----l---\_l

DISP_UNIT '34261

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1-11

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5V

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8P

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5V

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saL2GND

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GND

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J3002

Interconnection Diagram

MIC_UNITF3426 1 03

ACC

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5V

UP

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JPl 501

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I

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J2006

Screw ListRE F. YAESU P,/N Descr i otion otv.O u00306001 PAN HEAD SCREW M3X6 i@ u06408007 SCREW OM4 X BB 2@ u20206001 BIND]NG HEAD SCREW M2.6 X 6 2@ u20306001 BINDiNG HEAD SCREW M3 X 6 1o u20306002 BINDING HEAD SCREW M3 X 6Ni 2@ u20306007 BINDING HEAD SCBEW M3 X 68 8o u20308001 BINDING HEAD SCREW M3 X 8 2@ u20308002 BINDING HEAD SCREW M3 X 8Ni Io u30206001 FLAT HEAD SCREW M2.6 X 6 o@ u30306007 FLATHEAD SCREW M3X68 1o u43206001 TAPTITE SCREW M2.6 X 6 1CA u43306001 TAPTITE SCREW M3X6 4@ u51425007 HEX SOCKET HEAD BOLT I,t4 X 25B 2

@)(

DISPLAY Unit

P1 090677

CNTL Unit

RUBBER KNOB

TS206352AWIRE ASS'Y (2Pcs)

R3520140RU BBER

R35201 808RUBBER KNOB


R3520200APANEL

WINDOW

R3520 1 20RUBBER KNOB ASS'Y

R3520RUBBER KNOB

R3520 1

SPEAKER

)@\

6\

Basic AccessoriesYAESU P,/N Descr i ption Otv.Q0000008 FUSE 15A 2r9018615A DC CABLE I806517500 OPERATING MANUAL 1


RUBBER KNOB ASS'Y

DISPLAY Unit

CNTL Uni

RUBBER KNOB

T9206352AWIRE ASS'Y (2pcs)

Exploded \

R3806750CASE TO;

rti

r9206000cWIRE ASS'Y

R3520140RU BBER


ASS'Y (2pcs)

R3520RUBBER KNOB

R3520 1RUBBER KNOB

R3520 1

T9206082WIRE ASS'Y

M 4090067SPEAKER

R3520100RUBBER KNOB ASS'Y

Exploded View & Miscellaneous Parts

P 1 090352CONNECTOR

R490081 1CHASSI S

P 1 090654CONNECTOR

Jvatt'r unirIVCO Unit

TWIRE ASS'Y

R3806730,CASE

BOTTOM

Non-designated parts are availableonly as part of a designated assembly.

Case Disassembly and PCB AccessLCD

s Control Unit Access3 To access the Control Unit and Display Unit

first remove the VOL, SQL and dial knobs bygently pulling them outward.

Next remove two screws from each side of thetop cover and one from the rear. Tilt the rear ofthe cover upward, then slide it out from thechassis. Note that the single rear screw is dif-ferent from the other four, be sure to reinstall itin the correct location. Be careful not to lose theplastic plug covering the cable entrance cutoutin the chassis.

Remove the two hex bolts from the front panelusing a 3.5 mm hexagonal driver, then gentlyloosen the front panel.Remove the two flat ribbon cables by using asmall screwdriver or fingemail to slide therelease clamps forward on both sides of thecable connector. After releasing both cables,gently separate the front panel from the mainchassis and place it on a soft surface to preventthe clear display from marring.

a

Lithium Backup Battery ReplacementThe lithiumbackup battery should not require

servicing for a period of several years, howeveq,to replace the cell, order Yaesu P/N Q9000552.O First note the location and tab polarity of

8T2001, mounted over the CNTL Unit micro-processor. To remove the old cell, carefullyunsolder each terminal from the CNTL UnitPCB and lift it free.

Dispose of lithium batteries according to regula-tions in your area, and ensure small children can-not play with or accidentally ingest thebattery.

O Mount the replacement cell similarly, observ-ing proper polarity when installing it. Next,place the plastic insulating seal (P/NR8118690) on top of the cellbypeelingbackthecover to expose the adhesive backing, thenpressing it in place.

Panel Lamp ReplacementThe LCD and controls are illuminatedby four

10-V incandescent miniature lamps. If these re-quire replacement, they canbe ordered fromyourYaesu dealer (P/N Q1000083).fl First remove the front panel as previously de-

scribed. Note the location of the four lamps, asindicated below.

f: W/Spaceri: W/O Spacer

fl To remove a failed lamp, use a low wattagesoldering iron and forceps to unsolder andfree each lead, then gently lift the bulb out ofthe hole.

o

tr


Modification for 9600-Baud PacketNo/e: The two lamps on either side of the LCD

use plastic spacers, be careful not to lose thesewhen removing the bulb, and insert them againwhen instailing a new bulb.fl Install replacement bulbs in the reverse man-

ne4, then reassemble the transceiver case.Modification for 9600-Baud Packet

Operation at high data rates requires specialinterfacing since the FT-2500M bandwidth andpre- and de-emphasis circuitry are not optimizedfor this mode of operation.

If you want to use your FT-2500M with a9600-baud Packet TNC, the following modificationshould enable better performance at this higherdata rate. Howeveq, throughput performance at9600 baud is not guaranteed.

QTY. Part Comments2 pc. 0-O chip resistor *Read notice at below right.1 pc. 1O-kA chip resistor You may have to experiment

with this value for optimumaudio input level.

2 pc. lengths of wire Use stranded #22 AWG,approx. 5 cm in length.

Fig. 2 RX Audio Component Location

If you arenot confident at surfacemount soldering,do not attempt the modification, and contact yourYaesu dealer for assistance.

fl Remove the top cover as described on the pre-vious page to expose the CNTL Unit. Refer toFig. 1 to familiarize yourself with the part lo-cations.

Fig. 3 TX Audio Component Location

Locate the unused pad beneath connectorJ2004, labeled C (Fig. 2). Install a 0-O chipresistor* across at this location, and a wire tothe pad just to the left labeled DISC. Thismakes the connection for de-emphasized dis-criminator audio output for decoding.

2 pc. 1-pF tantalumchip capacitor

lf your TNC model does nothave a capacitive-coupled audioinpuVoutput, see the notice be-

low

If you choose to perform this modification,you will need a low-wattage soldering iron,tweezers and the following components:

J

N'6iiCeL.

2-2

Fig. 1 Modification Component Location


D Next locate the set of pads labeled MOD (c &R), above connector J2008 (fig. 3). Solder a10-kO chip resistor across pad R, and a 0-Qchip resistor* across pad C, and a wire lead tothe adjacent pad. Pre-emphasized audio is fedto the transmitter here.

D Note the small plastic plug in the chassis cut-out at the rear left corner of the CNTL Unitcompartment. Remove this plug, then run theleads from your TNC through this cut-out andsolder them to the appropriate leads on theCNTL Unit. Be sure to insulate any splicedleads with heat-shrink tubing or electricaltape.

Fig. 4 TNC DATA IN/OUT Lead Connections

Modification for 9600-Baud Packet0 After checking all connections for integrity,

replace the top cover and tighten all screws.This completes the modification.While this modification should work with mostunits, experimentation with audio input and out-put leoel may be necessary before optimum per-formance is obtained.

03022

Ff-2500M Technical Supplement2-3

Channel Display-Only ModeYou can use this feature when you need very simple operation: only stored memories can be

selected, and are displayed as "!1.!-1. l, .-t,..." instead of the channel frequency or alphanumericname display. L:rdicators for preoiously stored settings such as repeater shift and tone squelch arestill displayed, although they cannot be changed. Only the settings listed below can be changedas describedX High/Mi d./Low TX power and locking function: ,tt" ffil t@=@l to toggleX Volume & Squelch: same as beforeX Channel Selection: DIAL knob or microphone UP/DWN keysX Paging function selection: toggle @ ,o select paging modeX Paging code memory selection: press @= @ and rotate DIAL knob to selectX CALL channel instant recall: pt"tt 6tlD to toggleX Priority channel recall:press (EHfl to toggle

After programming memories, you can activate Channel Display-Only operation by turningthe trans'ceirier off, thin pressing ind holding th" @ & gg, keys together-while powering onagain. Repeat this step to return the transceiver to normal.

Channel Display-Only Mode


AlignmentThe FT-2500M has been carefully aligned at

the factory for the specified performance acrossthe amateur band. Realignment should thereforenot be necessary except in the event of a compo-nent failure. A11 component replacement andservice should be performed only by an autho-ized Yaesu representative, or the warranty pol-icy maybe voided.

The following procedures cover the some-times critical and tedious adjustments that arenot normally required once the transceiver hasleft the factory. However, if damage occurs andsome parts are replaced, realignment may be re-quired. If a sudden problem occurs during nor-mal operation, it is likely due to componentfailure; realignment should not be done until af-ter the faulty component has been replaced.

We recommend that servicing be performedonly by authorized Yaesu service technicianswho are experienced with the circuitry and fully

equipped for repair and alignment. Therefore, ifa fault is suspected, contact the dealer fromwhom the transceiver was purchased for instruc-tions regarding repair. Authorized Yaesu servicetechnicians realign all circuits and make com-plete performance checks to ensure compliancewith factory specifications after replacing anyfaulty components.

Those who do undertake any of the followingalignments are cautioned to proceed at their ownrisk. Problems caused by unauthorized attemptsat realignment are not covered by the warrantypolicy. Also, Yaesu must reserve the right tochange circuits and alignment procedures in theinterest of improved performance, without noti-fyit g owners.

Under no circumstances should any align-ment be attempted unless the normal functionand operation of the transceiver are clearly un-derstood, the cause of the malfunction has been

Case Disassembly

n

D

Make sure the transceiver is off. Remove thetwo screws from each side of the top and bot-tom covers, then loosen the two rear screws.Next remove the top and bottom covers, theCNTL Unit is now accessible from the top ofthe chassis.To expose the Main Unit PCB on the bottom ofthe transceiver chassis, remove the 5 screwsaffixing the shield cover plate, and remove thecover.

MAIN Unit

VCO Unit

DISPLAY Unit

CNTL Unit_

MIC Unit


clearly pinpointed and any faulty componentsreplaced, and the need for realignment deter-mined to be absolutely necessary.

The following test equipment (and thoroughfamiliarity with its correct use) is necessary forcomplete realignment. Correction of problemscaused by misalignment resulting from use ofimproper test equipment is not covered underthe warranty policy. While most steps do notrequire all of the equipment listed, the interac-tions of some adjustments may require that morecomplex adjustments be performed afterwards.Do not attempt to perform only a single stepunless it is clearly isolated electrically from allother steps. Have all test equipment ready beforebeginning, and follow all of the steps in a sectionin the order presented.

Re quir e d T e st E quipmenttr RF Signal Generator with calibrated output

level at 200MHzD Deviation Meter (linear detector)D AF MillivoltmeterD SINAD MeterD Inline Wattmeter with 5% accuracy at 200

MHzD Regulated DC Power Supply: adjustable from

10 to 17 VDC, 15An 50-C) RF Dummy Load: 100W at 200 MHz ,D Frequency Counter: + 0.1ppm accuracy at 200

MHzO AF Signal Generatortr DC Voltmeter: high impedanceD VHF Sampling CouplerD AF Dummy Load: 8 Q,5W

Alignment Prep ar ation s Pre c autionsA 50-O dummy load and inline wattmeter

must be connected to the main antenna jack in allprocedures that call for transmission, exceptwhere specified otherwise. Correct alignment isnot possible with an antenna.

After completing one step, read the followingstep to determine whether the same test equip-ment will be required. If not, remove the testequipment (except dummy load and wattmete{,if connected) before proceeding.

Correct alignment requires that the ambienttemperaturebe the same as that of the transceiverand test equipment, and that this temperature beheld constant between 20o and 30' C (68'

- 86 'F).

When the transceiver is brought into the shopfrom hot or cold air it should be allowed sometime for thermal equalization with the environ-ment before alignment.

If possible, alignments should be made withoscillator shields and circuit boards firmly af-fixed in place. Also, the test equipment must bethoroughly warmed up before beginning.Note: Signal levels in dB referred to in this proce-dure are based on 0 dBp = 0.5 pV(closed circuit).

PLL E TransmitterSet up the test equipment as shown for trans-

mitter alignment. Maintain the supply voltage at13.8V DC for allsteps.

PLL & Tlansmitter Alignment Setup

PLL VCV (Varactor Control Voltage)D Connect the positive lead of the DC voltmeter

to the test point VCV on the Main Unit, asindicated in the figure, and the negative leadto chassis ground.

Sampl ingCoupler

VCV Test Point


vAlignment

PLL & tansmitter Alignment Points

D Set the transceiver to the 174.000 MHz*, andadjust coilL303 on the VCO Unit for 7.5 V onthe voltmeter.*For transceiaer aersions without extended receiaecapability, tune to 146.000 MHz and adjust L303for 1.8 V on the aoltmeter.

D Next tune to 146.000 M}{4key the transmittetand adjust L304 for 1.8 V on the voltmeter.

PLL Reference F re quencyD With the wattmeter, dummy load and fre-

quency counter connected to the antenna jack,and while tuned to 146.000 MH4 key thetransmitter and adjust TC1001 on the MainUnit, if necessary, so the counter frequency iswithin 100 Hz of 146.000 MHz.

Tiansmitter OutputD Preset trimmer potentiometers VR2003,

VR2004 and VR2005 fully clockwise.O Vfhile tuned to 146.000 MHz, press the LoW

button on the panel to select high, mid- andthen low power while adjusting the corre-sponding trimpot for the transmitter Poweroutput levels listed in the table:

Panel PowerSelection

Adjustment Power Output

High vR2005 50+5W

Mid vR2003 25+1W

Low vR2004 5+1W

Transmitter Deaiation

D \tVhile tuned to 146.000 MHz, adjust the AFgenerator level for 50 mV output @ l kHz tothe MtC jack.

O Key the transmitter and adjust VR2002 on theCNTL Unit for + 4.5kHz deviation on the de-viation meter (within 100 Hz),


rReceiaerSet up the test equipment as shown below for

receiver alignment.

Receiver Alignment Setup

Int er st ag e Tr ansfo r mer sD Connect the DC voltmeter between J1003 pin

7 and chassis ground.O Modulate the RF signal generator with t3.5

kHz deviation of a 1-kHz tone.tr Adjust T1001

- TL004, & T1006 on the Main

Unit for maximum voltage on the meter, thenonce again for optimum SINAD (at least -7dBp for 12 dB SINAD).

S-Meter CalibrationD \tVhile tuned to 146.000 MHz,inject a +25 dBp

RF signal modulated with 13.5 kHz deviationof a L-kHz tone, and adjust VR2006 on theCNTL Unit so that all S-meter segments arejust on.

Scanner Center StopI Connect the DC voltmeter (3-V range) be-

tween TP2002 (+) and TP2001(-) on the CNTLUnit.

tr Withboth the transceiver and signal generatortune to 146.000 MH4 set the SQL control fullycounter-clockwise (the "ausy" indicatorshould be on). Lrject 20 dBp RF modulatedwith t3.5 kHz deviation of al-kHz tone, andadjust VM007 on the CNTL Unit for 0 V on thevoltmeter.

SquelchD Preset the SQL control to the L0 o'clock posi-

tion. At the center of the band, tune the RFsignal generator to the same frequency, and setthe generator level to -L2 dBp.

fl Tum VR1001 clockwise until the squelch justcloses, and then counter-clockwise veryslightly so that it just opens.

Receiver Alignment Points

T1001

T1002

T1003

r1004

r1 006

J1003 PinT

vR 1001

vR2007

rP2001 ( -

)

rP2002 ( + )

vR2006


VCO Unit

chiponly sidecomponent side

Emitter 1Basel I eritt"r2

Collstorl I Collector2Base 2

rvus (Hs)(os04)

t-ttlttr-{ IllllL']t.]'"fr'"'

,lrfi.-l1"'.* L*--J II I zzk I I-il----il-

2sc2759 (u22)(0305)2sc3356 (R24)(o301.303)

DTCI24EK (25)(0302)

NOTE:BESISTOR VALUES AFE !N O. !/IOW ;CAPACIToF VALUES AFE lN rF. sov :O CAPACITOR VALUES ARE TANTALUU ;INDUCIOR VALUES A8E ]N HUNLESS OTHEFVISE N''ED.

VCO_UNIT F3152101A

To MAIN Unit (Ss Prg6 3&1)

FT-2500M Technical Supplement3A-1

REF. DESCRI PT I ON

VCO lJnitVALUE I'lV TOL. l'lF'GR'S DESIG YAESU P/N VERS.

*** VCO UNIT *xx

PCB t.Iith Components

Printed Circuit Board

C 0301 CHIP CAP. SpF 50VC 0302 CHIP CAP. 10pF 50VC 0303 CHIP CAP. 18pF 50VC 0304 CHIP CAP. 15pF 50VC 0305 CHIP CAP. lpF 50VC 0306 AL. ELECTR0. CAP. 47uF 16VC 0307 CHIP CAP. 0.001uF 50VC 0308 CHIP CAP. lpF 50VC 0309 CHIP CAP. 6pF 50VC 0310 CHIP CAP. 15pF 50VC 0311 CHIP 0AP. 18pF 50VC 0312 CHIP CAP. 22pF 50VC 0313 CHIP CAP. 0.001uF 50VC 0314 CHIP CAP. 0.001uF 50VC 0315 CHIP CAP. 2pF 50VC 0316 CHIP CAP. 0.001uF 50VC 0317 CHIP CAP. 10pF 50VC 0318 CHIP CAP. 0.001uF 50VC 0319 CHIP CAP. 4pF 50VC 0320 CHIP CAP. 0.001uF 50VC 0321 CHIP CAP. 0.001uF 50VC 0322 CHIP CAP. 0.001uF 50VD O3O1 DIODED O3OZ DIODED O3O3 DIODED O3O4 DIODED O3O5 DIODE

L O3O1 M. RFCL O3O2 M. RFCL 0303 C0rLL O3O4 COILL 0305 M. R['CL 0306 l'l. RFC

Q O3O1 TRANSISTORQ O3O2 TRANSISTORQ O3O3 TRANSISTOEQ O3O4 TRANSISTORQ O3O5 TRANSISTOR

R O3O1 CHIP RES.R O3O2 CHIP RES.R O3O3 CHIP BES.R O3O4 CHIP BES.R O3O5 CHIP RES.R 0306 CHIP RES.R O3O7 CHIP RES.

BCKCHCHCHCHBBCKBCHBCHBBB

unl,/ 5%t/r}w 5%1/10W 5%r/llvt 5%1/10W 5%r/tlw 5%ur}lil 5%

GRI'{4OCHO5OC5OPTGRll4OCHlOODSOPTGRl'{4OCHlBOJsOPTGRl.,l4OCHl5OJ5OPTGRl'{4OCKOlOCSOPT16V470l',16X7TR2GRM4OBlO2l'lSOPTGBl'l4OCKOlOCSOPTGRM4OCHO6ODsOPTGRl'{4OCHl5OJ5OPTGRl'l4OCHlSOJ5OPTGRM4OCH2ZOJSOPTGRM4OBlO2l'lSOPTGAl'{4OBlO2l'lSOPTGRl',l4OCKO2OC5OPTGRI'14OBlOzMSOPTGRM4OCHlOODsOPTGRM4OBlOzMSOPTGRl'{4OCHO4OCSOPTGRM4OBlO2llSOPTGRI.{4OBlO2l'{5OPTGRI.14OBlO2l.l5OPT

1T363-01-T0841T363-01-T0841T363-01-T0841T363-01-T0841SVZ14 TPH

LALO3NA4RTKLALO3NA4RTKs7-T2 R12-K868Cs?-T2 812-K8688FLC3ZT-2R2KFLC3?T-2ft2K

2SC3356-T2B H24DTC124EK T972SC3356-T2B R24Il'{H5 T1O825C2759-T2B U22

RMC1/1OT 273JRMCl/1OT 273JHMCI/TOT 222JRl{Cl/1OT 1OlJRMC1/1OT 273JRI'{C1/lOT 273JRMC1/1OT 1O2J

c41305001

F3152101A

K22170206K22I7OZIIK22170217KZ2I70215KZZ|T0202K46120006K22170805K22170202K22t70207K22t70Zt5KZ2t10Zt7K22t702tsK22170805K22170805K22170243K22i70805KZ2r702tlK22170805K22r70205K22r70805K22170805K22170805

G2070rr4G2070n4G2070fi4G2070n4G2070356

L1 190203L1 19020310190 168L0 1 90 1691169020711690207

G3333567DG3070034G3333567DG3070027G332?597B

J24205273J24205273J24205222J24205101J24205273J24205273J24205t02

CHCHCHCHCK

4.?uH4.?uH

2.ZuH2.ZuH

27K27K2.2K10027K27K1K

3A-3FT-2500M Technical Supplement

VCO UnitRBF. DESCRIPTION VALUE lllv TOL. I'IFGR'S DESIG YAESU P/N VERS.

R O3O8 CHIP RES.R O3O9 CHIP RES.R O31O

,CHIP RES.

R 0311 CHIP RES.R 0312 CHIP RES.

TPO301 TP-HTPO3O2 TP-HTPO3O3 TP_HTPO3O4 TP_HTPO305 TP-H

SHIELD CASE

3.3K10K2201.5KzZK

r/nw 5%L/t}lw 5%r/nw 5%vnl!/- 5%r/nw 5%

Rl'{Cl/1OT 332JRMCl/1OT 1O3JHMCT/IOT 22IJRMC1/1OT 152JRMC1/1OT Z23J

l',lK-i0160l'{K-10160MK-10160},tK-10160l'{K-10160

J24205332J24245r03J2420522tJ24205t52JZ4Z05ZZ3

Q5000037Q500003785000037Q5000037Q5000037

R01362408


\/V-,:O1008 Pin 2

\/V,;:01008 Pin 8 455kHz

MAIN-UNIT F3/-27OOO

D1016 Lrol3uts4ls Loo22l30

- 9.0d8lr

12v

Rl\::;O1008 Pin 7 455kHz

\/V,,:01008 Pin I lkHz

ru:i Tn_;"'"F*Fl Hzooss"

-

3.8V

l88gSec l2ptSecA1024 Pin 12

\/V::O1024 Pin 2

-

3.0V

01024 Pin 15, 16

t8t;;16-+ +"

.t E'?3,

v \r_ 2.gv01008 Pin 11

-0v01024 Pin 1 ,9.0V 0v (7.0V)

,+

4.8v -

IJrmi I

POi9!TBT ai--- 1cr

Ff-2500M Technical Supplement

MAIN_UNIT

olol6 Lr0l3uu9415 L0022130

-9.0d8!12V

(6.0v) i

J:-

-11 0dBm

ct0a0

- 13.odBm

6q)

i

ilI-

T3Tt9+

c1042 RJ05A22e CH 1AO

lvco uN rT

(5 4v) '

0v (8.0v)0.5V: PLL UNLOCK

9.ov ov (7.0v)

+':b1022

Rr 099 n! 100a.2K 9.2K

I

84va---1 --1

-9

To CNTL Unit J2007(See Pase 3D-1)

To CNTL Unit J2008(Soe Page 3D-l )

a4:lHJ

0.

MAIN Unit

-9 0dB! 4.9vl2v

,tI

I r r006I LAO221 1 t

klYI

c0.

3.8v:soL cLosESOL OPEN

- 13.odBm

1

;

EiI

+

I -.rl5

ht$o23I5

R1 054.100,c'0s2Zze CH-tF

LI 020 C1077

;d _13l5l5

|.,

L10LOO2I

-26 odBm (-13.0d8m)

a a.v u"tt3a?%L l.+v

(e.4v)

-;l3i*

1 SSt A40V: PLL LOCK3-7V: PLL UNLocK

DTAI 43EK

2.4v8.4v (0v)(1.5v: pLL

*! :

:: i

I

?t--.tl I

cli3,01 0?E

41024 0!cl a5t 5aF2 B

T:''

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i

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8.4v

'=

-i

i

I ' L+-!+ot o28

25C271 1\I

3+#+"+

f-oo

-9

To CNTL Unit J2007(See Page 3D-l)

u: 115 mMHz, 10dss (MoD f=1kHz, oEV=3.5kHz)TX: 145.mMHz, mW (conneaeu o s SQ dummy to6d)

RX (rx)N0TEIFESIST0n VALUE9 ARE lN !. l/lOW ICAPACITOR VALUES

FE IN IF. 6OV I0 CAPIC|TOR VTLUES ARE TIXIALUI !INDUCTOR VALUES ANE IN HUNLEAS OTHERryIGE NOTEO.

To GNTL Unit J2008(See Pase 3D-1)

3B-1

M67781 L(o1009)

aV4

t(.,,,lnput

AN6541(o10 r3)

ffiY'\\,.,*",| \ co,,..ro,, arou,(o1010)

Base

2s81143S(o1orb.ior9)


41

I(lll- output\ crornd

t'c13)

:,

:,.,'il. ::-11. . ']; .-,-rn.

Em tttet' lo lector

,t1Farc10)

::,1,

,r'i-.1

+,t-'

'ir,

'?.

. ..i.. .ir:--i .i!:.i.r::

:.,)tt.t .: :\,." :

MAIN lJnit

'- -- *:i rlrill:l

r. ;t::.1

ira..:

1.,i.-lii: irr J rif

-i

fl,.

::!i'.

component side

3B-3

MAIN ljnit

.!i= r'.:.:i: l:-:::ri, ti-r:: h::_; rlltirl-1::1i::::.1- 4

_ooz\e6,*5-orEd:z Z2sAzE=i

tsod+dcr'JTo CNTL Unit J2008(See Page 3D-3)

To CNTL Unit J2007(See Page 3D-3)

3B-4

(\Il'* --r:=I:Fl=IlF-l: ;!

-)FIE:"d",-+:ttttt.:,,l,..'..i.:.,.t '"ft t NOg: s ;= HF E 8.,0,,il atottEilEi !l ;-E lL 1c1077

R'o4e IJ'l cr ozs I Im -E

'q:;T I I::ffi-fl"-H fi= [ ,,, ,, , ,,,,,,, ,!

3 3n'ro'1'ffi r*r3l jn-=

;'T:.F,fi H:lH -,...;T-+ E.pT tr H" ffi.roer ttlnrogzIl a ^l*- E *c1082 n oJgT fl-llRloss,;sf, cH3 E

^'iod" 3 atl *,or= nTr*,*,LL--JI Ll:=J IE lft O]nnf rr-n :.S;E ., *.-H*ffi;-ffi,*,ro

,l;:,

r\.

lE

.:

l;

ctlrc:o

J]

\ti,::,in

ii,:nF'

Pin 16 -

a"-\Kd

tarrri(o1ooMC145'(o102

Base 2Collecto. 1 | e.''ITTL, L I IlJrq

Ll t] L-]Emitter 1 | Cott"

Bas9 I

Drain Source

3sK131 (v12)(o1001)

rMXl (x1)(o1o t B)

Emifter CommonB6se 1 I 8"."

Coilsror r

FMsl (s1)(o1017)

*r Fdox=

F-

t33o>iid@tdi6i

;;@N90

flnIltI IlL] L-Anode 1 Anod

1 ss272 (A'1 )o1072)

C6thodo

ftllt.tIAL I t_.1

Anode N.C.o2cz5.'1Y (5.1

( D 1014)

To CNTL Unit J2008(See Page 3D-3)To CNTL Unit J2007(See Pase 3D-3)

Gate 2 Gate I

tr16/,

. :::

11 rosT-17

chip-only side

Pin 16 -,:

Gate 2

Pin 1

MC3372ML(oi oo8)MC1451 58F2L(o 1 024)

Gate 1

\r'n8

25K3O2GR (TG)(o1002,1 oo3)

Base 2

Basel I eriner2

Collectorl I Collector2Emitter 1

tMXs (X5)(o1026)

Bass EmitterDTAl43EK (3C)(or 02o, r 022)

Anode 1 Anode 21SS184 (83)(D1020)

\pin4\Pinl

MC'I2022SLADR2(o1025)

Emitter 1Bme| | r.itt"r2

Collectorl I Cott"ctor2Base 2

tMH5 (H5)(o 1 006,1 021 )

Base 2

Beel I erittu.2

Collctorl I Collectd2Emitter 1

tMzz Q2)@1027)

Bas6 Emitter2sc2712GR (LG)(o1007)2sc27l4Y (oY)(o 1 004.1 028)2sc275S (u22)(oroob.r o12)MMBR951 (72)(orol r )

Cathode l.Arcde 2

l-ltLtlrlilL-I U

Drain Source

3sKr31 (v12)(o1001)

Collactor I Emittsr 2

Emitterl I Cottector2Basa 1

tMXl (xl)(o1018)Emifter Common

Basol I Base2

Cor*ror r uorrocor 2

FMSl (S1)(o1 01 7)

tss272 (A1)(f_1022)C6thode

nIIItttt+ ItttL]UAnods N.C.02c25.1Y (5.1)(otot+)

Anode 1 Cathode 2155226 (C3)

( D 1012)

Base 2

I

chip-only side


REF. DESCRI PT I ON

MAIN UnitVALUE I,{V TOL. MFGR'S DESIG YAESU P/N VERS.

c 1001c 1002c 1003c 1004c 1005c 1006c 1007c 1008c 1010c 1011c 1012c 1013c i014c 1015c 1016c 1017C 1O1Bc 1019c 1020c 1021c 1023c 1025c 1028c 1029c 1030c 1031c 1032c 1033c 1034c 1035c 1036c 1037c 1038c 1039c 1040c 1041c t042c 1043c 1045c 1046c 1047C 1O4Bc 1049c 1050c 1051c 1053c 1054c 1055c 1056

{.*{. MAIN UNIT *{*PCB t{ith Components (I,{/VCO UNIT, }tl/0 IC M677B1L)Printed Circuit Board

cP479200r

F3427000

K22275809K222752t7K22r7022tK22t102nK22170805K22170204K22170805K22t70205K22r702rgK22170805K22170805K22170805K22r70805K22170805K22170805K22t70805K22t70203K22170805K22t70203K22fi4205K22170805K22170805K22I70Bt7K22t70817K22170805K22t702rrK22r702fiK22170209K22t70Bt7K2Zt708t7K22I7OBT7K22170805K22170805K22170805K22170227K22170805K22r70221K22t702llK78160027K46 1 20004K221408 I 1K22I70Bt7KZ2I7ABI7K22170809K22170805K22170225K46 1 20004K22t7023rK22I4OBII

CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.TANTALU}'I CHIP CAP.AL. ELECTRO. CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.CHIP CAP.AL. ELECTRO. CAP.CHIP CAP.CHIP CAP.

0.00luF 500V15pF 500V27pF 50V10pF 50V0.00luF 50V3pP 50V0.00luF 50V4pF 50V22pF 50V0.001uF 50V0.00luF 50V0.001uF 50V0.00luF 50V0.00luF 50V0.001uF 50V0.00luF 50VlpF 50V0.001uF 50VZpF 50V4pF 50V0.001uF 50V0.00luF 50V0.01uF 50V0.01uF 50V0.001uF 50V10pF 50V10pF 50V8pF 50V0.01uF 50V0.01uF 50V0.01uF 50V0.001uF 50V0.001uF 50V0.001uF 50V47pF 50V0.001uF 50V27pF 50V10pF 50V0" 22uF 35V10uF 16V0. iuF 25U0.01uF 50V0.01uF 50V0.0022uF 50V0.00luF 50V39pF 50V10uF 16V6BpF 50V0.1uF 25U

lll5RCHCHCHBCJB

CHclIB

BB

BBB

B

CKBCKCHBBBB

B

CHCHCHBB

BB

BBCHB

CHCH

GRM42-zli5R1O2K5OOPTGRM42-ZCH 1 SOJSOOPTGRM4OCH2TOJ5OPTGRM4OCHlOODsOPTGRl''l4OBlOZl'1SOPTGRM4OCJO3OC5OPTGRl,l4OBlO2l',lsOPTGR|'14OCHO4OC5OPTGRM4OCH22OJsOPTGRM4OBlO2l'l5OPTGRM4OBlO2M5OPTGRl"l4OBlOz}lsOPTGRM4OBlOzMSOPTGRll4OBlO2l',l5OPTGRM4OBlO2l',lSOPTGRM4OBlO2l'lSOPTGRM4OCKO2OCSOPTGRl'l4OBlO2MSOPTGRl'{4OCKO2OCSOPTGRl'{4OCHO4OCSOPTGRl'{4OBlO2M5OPTGRl'l4OBlO2},l5OPTGRM4OBlO3l45OPTGRI{4OBlO3MSOPTGR}'l4OBlOzl''lSOPTGRM4OCHlOOD5OPTGRl.,t4OCHlOODSOPTGRM4OCHOSOD5OPTGRl',l4OBlO3MSOPTORM4OBlO3l'15OPTGRl'{4OBlO3l',lSOPTGR}l4OBlOzl'lSOPTGRl'l4OBlOZ},lSOPTGRl44OBlO2MSOPTGRM4OCH4TOJsOPTGRl,l40BlO2M5OPTGRM4OCH2TOJSOPTGRM4OCHlOOD5OPTTBSVA1V224M1-BR16V100M4X?TR2GRM4OB1O4ll25PTGRM4OBlO3l,l5OPTGRM4OBlO3l,l5OPTGRM4OB222M5OPTGR}'l4OBlO2l'1SOPTGRM4OCH39OJsOPT16V100l'14X7TR2GR}{4OCH6SOJ5OPTGRl''l4OB1O4|125PT

BBB

B

BCH

CHB

3B-5FT-2500M Technical Supplement

MAIN UnitREF. DESCRIPTION VALUE }l|V TOL. l'lFGR'S DESIG YAESU P/N VERS.

C 1057 CHIP CAP.C 1O5B CHIP CAP.C 1059 CHIP CAP.C 1060 CHIP CAP.C 1061 CHIP CAP.C 1063 CHIP CAP.C 1064 CHIP CAP.C 1065 CHIP CAP.C 1066 CHIP CAP.C 1067 CHIP CAP.C 1068 CHIP CAP.C 1069 AL. ELECTRO. CAP.C 1O7O CHIP CAP.C iO71 AL. ELECTBO. CAP.C IO72 CHIP CAP.C 1074 CHIP CAP.C 1075 CHIP CAP.C 1076 CHIP CAP.C TO77 CHIP CAP.C 1O7B CHIP CAP.C 1O8O CHIP CAP.C 1081 CHIP CAP.C 1OB2 CHIP CAP.C 1083 CHIP CAP.C 1OB4 AL. ELECTRO. CAP.C 1085 CHIP CAP.C 1086 CHIP CAP.C 1087 CHIP CAP.C 1089 CHIP CAP.C 1O9O CHIP CAP.C 1091 TANTALU}{ CAP.C 1092 CHIP CAP.C 1093 CHIP CAP.C 1094 AL. ELECTRO. CAP.C 1095 CHIP CAP.C 1096 AL. ELECTRO. CAP.C 1097 CHIP CAP.C 1098 TANTALUM CAP.C 1099 CHIP CAP.C 11OO CHIP CAP.C 1101 AL. ELECTRO. CAP.C 1105 CHIP CAP.C 1106 CHIP CAP.C 1107 AL. ELECTRO. CAP.C 11OB TANTALUI"I CAP.C 1109 CHIP CAP.C 1110 CHIP CAP.C 1111 CHIP CAP.C 1112 CHIP CAP.C 1113 AL. ELECTRO. CAP.C 1114 CHIP CAP.C 1115 CHIP CAP.C 1116 CHIP CAP.C 1117 AL. ELECTRO. CAP.C 1118 AL. ELECTRO. CAP.

GRM4OB1O4l'{z5PTGRl'l4OCHB2OJ5OPTGRM4OBlO3l'{SOPTGRM4OBlOzMSOPTGRll42-2CH33OJ5OOPTGRl.,l42-zCH15OJ5OOPTGRI',|4OCKOlOC5OPTGHM42-2CH220J500PTGRl',l4OCHOTODSOPTGRl'142-zCH lOOD5OOPTGRl',l4OBlO2M5OPT16V100M4X7TR2GRM4OBlO2M5OPT16V100M4X7TR2GRl',l4OBlOzMSOPTGRM4OCHl20JSOPTGRM4OBlO2l'{SOPTGRl'{4OCH33OJ5OPTGRl'{4OCHl2OJSOPTGRI'|4OBlO2MSOPTGEM4OCH4TOJ5OPTGRl'l4OCHlOlJSOPTGB}{4OCH22OJSOPTGRl,l4OBlO2l'{5OPTRE3-16V1Ozl'{SGRM4OBlO3l'{SOPTGRM4OBlO2MSOPTGRM4OBlO2M5OPTGRM4OBlO2MSOPTGRM4OBlO2l'l5OPTTPDNlClOOl'{SSGRM4OBlO2l'lSOPTGRM4OBlO2M5OPT16V100M4X7TR2GRM4OBlO2l{SOPT16V100M4X7TR2GRM4OBlO2l'lSOPTTPDNlVR4Tl'{BSGRl"l4OBlO3M5OPTGRM4OBlO3MSOPT10\/101l'lsx1 1TR5GRl',l4OBlO3MsOPTGRM4OBlO3l'15OPT5OV2R2M4X7TR2TPDNlEO iOI'IBSGRl',l4OBlO2MSOPTGRM4OCHlOlJ5OPTGRM4OBlO4t',t25PTGRM4OBlOZl',tSOPTRC2-16V470M-T34GRl'l4OBlO2M5OPTGRM4OBlO2M5OPTGRlt4OBlO4}'l25PTRE2-16V471l'|RE3-16V10zl'ts

0. lut'BZpF0.0luF0. 00luF33pFtspFlpF22pF7pF1OpF0. 00luF10uF0. 00luF1OuF0. 00luF1ZPF0. 00luF33pF1ZpF0.00luF47pFi00pF22pF0. 00luF1000uF0. 01uF0. 00luF0. 001uF0.00luF0.00luF10uF0.00luF0.00luF1OuF0.00luF10uF0.00iuF0. 47uF0.0luF0.0luF10OuF0. 0luF0. 0luF2.ZuF1uF0.00luF10OpF0. 1uF0.00luF47uF0. 00luF0.00luF0. 1uF470uF1000uF

25V BsOV CHsOV BsOV B5OOV CHSOOV CHsOV CKsOOV CHsOV CHSOOV CH5OV B16VsOV B16VsOV B5OV CHsOV BsOV CHsOV CH5OV B5OV CHsOV CHsOV CH5OV B16V5OV B50v B5OV B5OV B5OV B16VsOV BsOV B16VsOV B16V5OV B35VsOV B5OV B10vsOV BsOV B50v25UsOV BsOV CH25V B5OV B16VsOV B5OV B25y B,16V16V

KzzI4OBTIK22170233K22I7OBT7K22170805K22275225K22275217K22170242K2227522rK22t70208K22Z75ZI3K22170805K46120004K22170805K46120004K22170805K22r70213K22170805K22t70223K22r702t3K22170805K22170227K22170235K22r702t9K22170805K40 129067K22t708t7K22170805K22170805K22170805K22170805K76 1200 1 IK22170805K22170805K46 120004K22170805K46 120004K22t70805K76 160019KZ2I70817K22t70Br7K46100004KZ2l70Br7K2217OBITK46 1 7003 1K76 140013K22t70805K22t70235K2214081 IK22170805K46120010K22170805K22170805K22I408tIK40 1 29049K40 I 29067

38-6fT-2500M Technical Supplement

MAIN UnitREF. DESCRI PTION VALUE lllv TOL. MFGR'S DESIG YAESU P/N VERS.

C 1119 CHIP CAP.C 1120 CHIP CAP.C TI2I CHIP CAP.C IT\Z CHIP CAP.C 1123 AL. ELECTRO. CAP.C 1125 CHIP CAP.C 1126 CHIP CAP.C 1128 CHIP CAP.C 1129 CHIP CAP.C 1130 CHIP CAP.C 1131 CHIP CAP.C 1132 CHIP CAP.C 1133 CHIP CAP.C 1134 CHIP CAP.C 1i35 CHIP CAP.C 1136 AL. ELECTRO. CAP.C 1137 CHIP CAP.C 1138 CHIP CAP.C 1139 CERAMIC CAP.C 1140 CHIP CAP.C 1141 TANTALUM CAP.C IT42 CERAI,|IC CAP.C 1143 CERAMIC CAP.C TI44 CHIP CAP.C 1145 CHIP CAP.C 1146 CHIP CAP.C 1150 CHIP CAP.C 1155 CHIP CAP.C 1157 CHIP CAP.C 1158 CHIP CAP.C 1159 CHIP CAP.C 1160 CHIP CAP.C 1161 AL. ELECTRO. CAP.C 1164 CHIP CAP.C 1165 CHIP CAP.C 1166 CHIP CAP.C 1170 CHIP CAP.C 1171 CHIP CAP.C TT72 CHIP CAP.

CDlOO1 CERAMIC DISC

CF1OOl CERAMIC FILTER

D 1OO1 DIODED 1OO2 DIODED 1OO3 DIODED 1OO4 DIODED 1OO5 DIODED 1006 DIODED 1OO7 DIODED 1OO8 DIODED 1OO9 DIODED 1O1O DIODED 1012 DIODE

0.0luF0. luF0. 01uF0. 022uF47uF33pF39pF0. 01uF0. 00luF0. 01uF0. luF10pF0.00luF0. 00luF0. 01uF1OuF0. luF0. luF0. 047uF0. 001uF2.ZuF0. 022uF0. 01SuF0.00luF0.00luF22pF33pF0.00luF18pF0.033uF0. luF0. luF0. 47uF4pF12pF3pF6BpF0.00luF0.0luF

sOV Bz'u BsOV B5OV B16V5OV CH5OV CH5OV BsOV B5OV B25U BsOV CHsOV BsOV B5OV B16V25U B25V B25U XsOV B16V25U X25V XsOV BsOV BsOV CHsOV CH5OV BsOV CH25V B25V B25V B50vSOOV CHsOV CHsOV CJ5OV CHsOV B50v B

K22r70Bt7K2214081 IK22t70Bt7K22t70BZrK46 1 20006K22r70223K22170225K22t70Br7K22170805K22I7OBI7K22I4OBTIK2ZL702tlK22170805K22170805K22I7OBT7K46120004K22r40BnK221408 1 iK19149021K22170805K76120015K19 149017K19 1490 15K22t70805K22170805K22170219K22r70223K22170805K22t702t7K221408 10K22t40BlIK221408 1 1K46 170016K22275207K22r702t3K22t70204K22t70231K22170805K22t70Bt7

H7900 180

H3900200

G2090337G2090033G2070356G2070356G2070356G2070356G2070356G2070356G2070356G2070356G2070003

GRM4OBlO3M5OPTGRM4OB1O4M25PTGR},{4OBlO3MSOPTGRl'{4OB223l'l5()PT16V470}'16X7TR2GRl''l4OCH33OJSOPTGRM4OCH39OJ5OPTGRM4OBlO3M5OPTGRl'{4OBlO2l'lSOPTGRM4OBlO3l-{SOPTGRl''l4OB1O4t'l25PTGRM4OCHlOOD5OPTGRM4OBlO2M5OPTGRI'{4OBlO2MSOPTGRl'l4OBlO3l',lSOPT16V100l''l4X7TR2GRl'l4OB1O4l{25PTGRM4OB1O4M25PTUATO8X473K-L45AEGRM4OBlO2I,l5OPTTPDNlC2R2l48SUATO6X223K-L45AEUATO6X 153K-L45AEGRl'l4OBlO2},lSOPTGRM4OBlO2l45OPTGRM4OCH22OJSOPTGRl,l4OCH33OJ5OPTGRI'l4OBlOzM5OPTGR}{4OCHlBOJSOPTGRM4OB333t'l25PTGRl'{4OB1O4l'l25PTGR}44OB1O4l',I25PT5OVR4?M5X1 1TR5GRt'{42-2CHO4OC5OOPTGRM4OCHl2OJ5()PTGRl'l4OCJO3OCSOPTGRll4OCH6SOJSOPTGRl'l4OBlO2llSOPTGRl"l4OBlO3l'tS()PT

CDB455C7

cF l,ll455E

t"lI3O8l'lI3011SV214 TPH1SV214 TPH1SV214 TPH1SV214 TPH1SV214 TPH1SV214 TPH1SVz14 TPH1SV214 TPH155226 TE85R

FT-2500M Technical Supplement3B-7

BEF" DBSCRIPTION VALUE }llv TOL. }'IFGR'S DESIG YAESU P/N VERS.D 1014D 1015D 1016D 1017D 1O1BD 1019D 1020D t022D 1025

J 1001J 1002J 1003J 1004L 1002L 1003L 1004L 1005L 1006L 1OOBL 1009L 1010L TOI?L 1013L 1014L 1015L 1016L 1018L 1019L 1020L 1021L IO22L 1023L IO24

Q 1001Q 1002Q 1003Q 1004Q 1005Q 1006Q 1007Q 1008Q 1009Q i010Q 1011Q 1012Q 1013Q 1015Q 1017Q 1018Q 1019Q i020Q 1021

DIODESURGE ABSORBERDIODODIODEDIODEDIODEDIODEDIODEDIODE

CONNECTORCONNECTORCONNECTORCONNECTOR

COI LCOI LCOILl'{. RFCCOI LM. RFCCOILM. RFCl'1. RFCCOI LCOI LCOI LCOI LCOILCOILCOI LCOILCOI LM. RF'Cl'l. RFC

FETFETFETTRANS I STORTRANSISTORTRANSISTORTRANS I STORICICTRANSI STORTRANSISTORTRANS I STORICTRANSISTORTRANSISTORTRANSISTORTRANSISTORTRANS I STORTRANSISTOR

O2CZ5,lY TEBSRP6KE1Bu}'lg4151SS971SS27OTJ1SS27OTJ1SS184 TEB5R1SS272 TEBSRMI 3OB

B3B-EHr MsA-1068-142040I MSA- 1068-072040SC25-Ozl{S

2.5T5.5D1.2U8l{ R1.5T3.5DO.6UEI'\I R3.5T3.sDO.6UEll{ RLALO2KBR33K5.5T3.sDO.6UEl.l RLALO2KRR4Tl'15.5T3.5DO.6UEl{ RLALO3KHlO2KLALO4NA4RTK3.5T5. ODl.zuEl'l R2.5T5. ODl.zUEW RB.5T4. ODO. BUEl'il R8.5T4.0D0. BUElll R1.5T3.sDO.6UEW R4.5T3.5DO.BuBlll B2.5T3. ODO.6uEvll R4.5T3.sDO.6UE}{ R3.5T3.sDO.6UEI1I RLALO2KRR22l'|LALO2NAR22}4

3SK131-T2B V122SK3O2GR TEBsR2SK3OzGR TEB5RzSC2714YTEB5R25C2759-T2B U22Il',lHs T1OB2SC27T\GR TEBsRl'1C3372}4L}'1677B1LZSC2053l'{MBRg51LT125C2759-r2B U224N65412SB1 143SF'l',lsl T14BIMXl T1102SB1 143SDTA143EK T146IMHS T1O8

G2070062Q9000534G2090425G20901 1BG2060004G2060004G2070009G2070048G2090337

P0090667P0090787P0090833P0090621

L002212910021359A100218184L1 19035410021705AL1 190352100217054L1 190390L1 i9009510022130L0022r3r10020751410020751410021359A1002067941002181 1A10020679ALOO21B1BAL1 190342Lt190275

G48013178G3803027GG3803027GG3327r47YG3327597BG3070027c3327r27GG1091108G109 1642G3320530G3070056G33275978G1091 146G321 14305G3070008G3070024G321 14305G3070010G3070027

0. 33uH

0.47uH

1mH

4.7uH

0.22uH0.22uH


MAIN UnitREF. DESCRI PT I ON VALUE liv TOL. MFGR'S DESIG YAESU P/N VERS.

Q 1022Q 1023Q 1024Q 1025Q 1026Q 1027Q 1028

R 1001R 1002R 1003R 1004R 1005R 1006R 1007B 1OOBR 1009R 1010R 1011R 1012B 1014R 1015R 1016R 1017R iOlBR 1019R 1020R 1021R" t022R 1023t" t0z4R 1025R 1026H t0z7R 1028R 1030R 1031R 1032R 1033R 1034R 1035R 1036R 1037R 1038R 1039R 1040R 1041R 1042R 1043R 1044R 1045E 1046R 1O4BR 1049R 1050

2.2!12.2M150K22KlBK22K474701002.2M2.2|1471K

100820100K220220iK100151K

4.7K27470100K4.1K470KB2OK470K4.7K390K4.7K10K4.7KB. 2K1. BK220821K10K1K3.3K330T.2K100

TRANSISTORICICICTBANS I STORTRANSI STORTRANS I STOR

CHIP RBS.CHIP RES.CHIP RES.CHIP RES.CHIP BES.CHIP RES.CHIP RES.CHIP ROS.CHIP RES.CHIP BES.CHIP RES.CHIP RES.CHIP BES.CHIP RES.CHIP RES.CHIP RES.CHIP RES.CHIP RES.CHIP RES.CHIP RES.CHIP RES.CHIP RES.CHIP BOS.CHIP RES.CHIP RES.CHIP RES.CHIP RES.CHIP RES.CHIP RES.CHIP RES.CHIP ROS.CHIP RES.CHIP RES.CHIP BES.CHIP RES.CHIP RES.CHIP RES.CHIP RES.CHIP RES.METAL FILM RES.CHIP RES.CHIP BES.CHIP RES.CHIP RES.CHIP RES.CHIP RES.CHIP RES.

1/10W 5%1/10W 5%vt}ld 5%1/10W 5%r/r}l'/r 5%1/10W 5%1/10W 5%1/10W 5%unlw 5%1/10W 5%r/t}ld 5%1/10W 5%r/l}vt 5%unl[. 5%unl./. 5%ut}lvJ 5%t/l}vt 5%t/r}vt 5%1/10W 5%t/t}vt 5%ut}lil 5%vt}l[' 5%r/l}w 5%r/t}vt 5%r/wt 5%r/nw 5%r/rlld 5%vnlil 5%ut}l'i' 5%vt}lf. 5%ul}If' 5%t/nv{ 5%unltt 5%r/t}w 5%r/t}ltl/, 5%unlw 5%1/10W 5%vnlyi, 5%1/10W 5%ll{ 5%r/rllyi, 5%1/10W 5%1/i0l.l 5%1/10W 5%1/10W 5%1/10W 5%r/nw 5%

DTA143EK T146TDA2OO3HMC145158F21l'{C120225LADR2IllXS TlOBIMZz TlOBzSC2714YTEB5R

RMCl/1OT 225JRI'{C1/lOT 225JRMCl/10T 154JRl'lCl/10T 223JRMCl/1OT 1B3JRMCl/1OT 223JRMC1/1OT 47OJRI-{CI/IOT 471JRMCl/1OT lOlJRI'{CI/IOT 225JRMC1/1OT 225JRl'{Cl/1OT 47OJRl'{Cl/1OT lOZJRI'{CI/IOT 1OOJRl',lCl/10T 000JRMC1/1OT B21JRl'{Cl/1OT 1O4JftMCr/r}T 22tJRMCl/1OT 221JRMCl/1OT 1OzJRl',lCl/10T 101JRMCl/1OT 15OJRMCl/1OT 1OzJRMC1/1OT 472JRMC1/1OT ZTOJRMC1/1OT 471JRMC1/1OT 1O4JRtrcl/r0T 47zJRMC1/1OT 474JRMCl/1OT 824JRMC1/1OT 474JRl'lCl/lOT 472JRMC1/1OT 394JftMCI/IOT 472JRMCl/1OT 1O3JftMct/r0T 472JRl'lCl/lOT B22JRMCl/1OT 182JRMCl/1OT 22iJERG- 1SJ82OPRl',lCl/1OT 1OzJRl'{Cl/1OT 1O3JRMCl/10T 102JRMCl/1OT 332JRMC1/1OT 331JRI'{CI/IOT 122JRl'{Cl/10T 101J

G3070010G10908 15G109 I 105G1091 103G3070028G3070060G33Z7t47Y

J24205225J24205225J24205154J24205223J24205t83J24205223J24205470J24205471J24205101J24205225J24205225J24205470J24205t02J24205 I 00J24205000J24205821J24205t04J2420522rJ24205221J24205t02J24205 1 0 1J24205t50J24205102J24205472J24205270J2420547rJ24205t04J24205472J24205474J24205824J24205474J24205472J24205394J24205472J24205t03J24205472J24205822J24205182J24205221J22309029J24205102J24205103J24205t02J?,4205332J24205331J24205t22J24205r0t


REF. DESCRI PTION VALUB tllv TOL. MFGR'S DESIG YAESU P/N VERS.R 1051 CHIP RES.R 1052 CHIP RES.R 1053 CHIP RES.R 1054 CHIP RES.R 1055 CHIP RES.R 1056 CHIP RES.R 1057 CHIP RES.B 1O5B CHIP RES.R 1059 CHIP RES.R 1061 CHIP RES.R 1062 CHIP RES.R 1064 CHIP RES.R 1067 CHIP RES.R iO6B CHIP RES.R 1069 CHIP RES.R 1O7O CHIP ftES.R 1071 CHIP RES.R, IO72 CHIP RES.R 1073 CHIP RES.R 1074 CHIP RES.R 1075 CHIP RES.R 1076 CHIP BES.E TO77 CHIP RES.R 1082 CHIP BES.R 1083 CHIP RES.R 1OB4 CHIP RES.R 1OB5 CHIP RES.R 1086 CHIP RES.R 1087 CHIP RES.R 1OBB CHIP RES.R 1089 CHIP RES.R 1O9O CHIP RES.R 1091 CHIP RES.R 1092 CHIP RBS.R 1093 CHIP RES.R 1094 CHIP RES.R 1095 CHIP BES.R 1096 CHIP RES.R 1097 CHIP RES.R 1098 CHIP RES.R 1099 CHIP RES.R 11OO CHIP RES.R 1101 CHIP RES.R 1102 CHIP RES.R 1103 CHIP RES.R 1104 CHIP RES.R 1105 CHIP BES.R 1106 CHIP RES.R 1110 CHIP RES.R 1111 CHIP RES.R 1112 CHIP ROS.R 1115 CHIP RES.R 1117 CHIP RES.R 1118 CHIP RES.R 1120 CHIP RES.

2202.2K470564.7K1K22010022022K2.2K100K3302.2K22K1. BK1.5K2.21

560101

10K47474.7K10K15K4.7K102201K5605605604.7K5602.2M1K56B.2K8.2K47010010K2.2K10015471501K22K1006801. 8K

r/nw 5%vt}ld 5%urll'/. 5%r/nw 5%unlfl 5%r/r1vt 5%r/t}vt 5%unlil 5%vnl[- 5%1/10W 5%ut}l',l, 5%ut}l'{i, 5%r/4w 5%vnlil 5%unlvi, 5%ur}ltft 5%t/t}vt 5%ll{ 5%r/nw 5%r/nw ffiun:[. 5%ll{ 5%unl[. 5%vnl[. 5%r/t}w 5%r/tllfi, 5%utlvt 5%ut}l'/t 5%1/10W 5%r/nw 5%vr}:N 5%r/r}ld 5%r/tll,/. 5%1/10W 5%unl'd 5%t/l}lw 5"/,r/nvt 5%ul1ltt 5%ut}lil 5%r/nw 5%vn1,/ 5%vn:il 5%unl'i. 5%vnl,rr 5%unl'/ 5%vr}1il 5%vnl[- 5%unl'i- 5%vl}:il 5%1/10W 5%ur}lw 5%1,/nw 5%r/t}ld 5%1/10W 5%unlvJ 5%

RMC1/10T 221JHMCT/IOT ZZ\JRl,lCl/10T 471JRl''lCl/10T 560JRMCI/L}T 472JRl'{Cl/1OT 1OzJRr{c1l10T 221JRI'{CI/IOT lOlJHMCI/IOT 22TJRMC1/10T 223JRMCt/t}r 222JRMCl/1OT 1O4JHMCI/4 331JATPRMCI/IOT 222JRMC1/1OT 223JRMCl/1OT 1BzJRl'{Cl/1OT 152JRl'{Cl zRzJTEBMCl/1OT 1ROJRl'{Cl/1OT 56lJRMC1/1OT 1OOJRMCl 1ROJTERI'{CI/IOT 1O3JRMCl/10T 470JRMCl/10T 470JRMCI/IOT 472JR},lCl/10T 103JRl'{Cl/1OT 153JHMCI/TOT 472JRMC1/10T 100JRMCI/IOT 22IJRl'lCl/1OT 1O2JRI'{CI/IOT 561JRl',tCl/1OT 56lJRMC1/1OT 56lJRMCT/IOT 472JRMC1/1OT 561JnMu/I}T 225JRI'{Cl/lOT 102JRl"lCl/10T 560JRMC1/1OT B22JRMC1/1OT 822JRMCl/1OT 471JEMCl/l0T 101JRMCl/1OT 1O3JHMCr/rlT 2Z2JRl'lCl/10T 101JRl',lCl/10T 150JRl'{Cl/10T 470JRMC1/1OT 151JRMCl/1OT 1OzJRI'{CI/IOT 223JRMCl/10T 101JRMC1/1OT 681JRMCl/1OT 1BzJ

J2420522tJ24205222J2420547rJ24205560J24205472J24205r02J2420522tJ24205r01J2420522tJ24205223J24205222J24205r04JZ424533rJ24205222J24205223J24205r82J24205t52J24305229J24205010J2420556tJ24205100J24305010J24205103J24205470J24205470J24205472J24205103J24205t53J24205472J24205100J2420522rJ24205r02J24205561J2420556tJ2420556tJ24205472J2420556rJ24205225J24205nZJ24205560J24205822J24205822J2420547rJ24Z05ntJ24205103J24205222J2420510rJ24205150J24205470J2420515tJ24205n2J24205223J24205t0rJ24205681J24205t82


MAIN UnitREF. DBSCRI PT I ON VALUE l,llv TOL. l'lFGR'S DESIG YAESU P/N VERS.

II

R 1121 CHIP RES.H TI22 CHIP RES.R 1123 CHIP RDS.H II24 CHIP RES.R 1126 CHIP BES.R 1128 CHIP RES.B 1129 CHIP RES.R 1130 CHIP RES.

T 1OO1 COILT 1OO2 COILT 1OO3 COILT 1004 COrLT 1OO5 COILT 1006 COIL

TClOOl TRIl',ll'{EB CAP.

VR1OO1 POT.

1OO1 XTAL1002 XTAL

XFlOO1 XTAL

47KzZK04710K1K6.8680

r/r}w 5%r/t}ld 5%vrllil 5%unlil 5%r/nw 5%vt}ltt 5%r/t}l[J 5%r/r}w 5%

RI{C1/lOT 473JRMCl/1OT 223JRMCl/10T 000JRMCl/10T 470JRl'lCl/1OT 1OSJRMCl/1OT 1OzJRl',lCl/lOT 6RBJRMC1/10T 681J

160l'{ R12-K905X160M R12-K907Xi60l'l R12*K908X160t'l R12-K906X456DB-10072r.4t1

TZO3R2OOER

EVN-DXAAO3B54

21l'l1sBU

J24205473J24205223J24205000J24205470J24205t03J24205102J24205689J2420568 1

1002205310022055L002205410022056L0 190173L002znr

K91000071

J5 1 783503

H0 1030 15H0102801

H1 102095

R0135790AB0 137 1 60R3129530

X

X

20pF

50K

21. 855MHz12. 800MHz

SHIELD CASELEAF SPRINGXTAL H0LDER (Zpcs)


Notes


To DISPLAY Unit JP3001(See Page 3E-3)

MIC lJnit

chiponly sideconnector side

z

e.a='gl-gO-+O>do

=6" lYzsLo9floJdd

!lrtrtrf II03001 Pin 55 57kHz

A,/N

CALL

PAGE

TONE

RPT

L0w

MHz

REV

F/W

D./MR

POWER

To CNTL Unit J2005(See Pase 3D-1)

-J10\\Ur6[O

To CNTL Unit J2005(See Page 3D-l )

A,/N

CALL

PAGE

TONE

RPT

t0w

MHz

REV

F/W

D,/MR

POWER

VE-oF>==>r>FzoJz

=-.uzJ4d\\uaoco

To CNTL i(ser Ps|-

dofDfo[

DISPLAY Unit

To CNTL Unit J2006(see Pag go-t)

=*"=. .t5.

-".9&oFU-ZL>>zOg2L-LZ-

o ul- o@ ulz Jo >t- >

mTE!RESISTffi VILUES ARE lt{ o.l/10Y icfAc tTm Y[uEs ffiE tN rF. 50V imctPAClToR VALUES AFE TAITILUX rlxBucTm vtluEs IRE tx HULESE OTHEilIEE MTED.

znl.

tlTo MIC Unit JP150l

(See Pag 3C)

DISPLAY UnitREF. DESCRI PTiON VALUE l\lv TOL. l'lFGR'S DESIG YAESU P/N VERS.

50v50v25U16V50v25y

10v10v10\/10v

*** DISPLAY UNIT **.1.

PCB }rlith Components (W/O t lCHf GUIDE(Zpcs), NYL0N RIVET)Printed Circuit Board

0.0luF0.0luF0. luF

CAP. 3.3uF6B0pF0. luF

100K100K10K10K2.2t415t5ooJJ5647K

GR}'14OBlO3l'1SOPTGB},14OBlO3M5OPTGRM4OB1O4}125PTTEMSVAlC335l'{-BRGRl,l39B68 lt'l5OPTGRl'l4OBlO4t'l25PT

P2137-01

FTD_10262A8 (SP-28)

cs1367001

F3426102

K22170817K2ZI70Bt7K2214081 1K7Bl2002lK22t74807K22t408rr

G9090056

G6090086A

P1090653P1090653

Q1000083Q1000083Q1000083Q1000083

G1091496

J24205104J2420st04J24205103J24205 103J24205225J24205150J24205 150J24205330J24205560J24185473

N5090080N5090080N5090080Q9000626N5090080N5090080N5090080N5090062N5090062N5090080N5090080N5090080

J60800202J60800201

R3516440

C 3OO1 CHIP CAP.C 3OO2 CHIP CAP.C 3OO3 CHIP CAP.C 3OO5 TANTALUM CHIPC 3013 CHIP CAP.C 3014 CHIP CAP.

CS3OO1 CDS

DS3OO1 LCD

J 3OO1 CONNECTORJ 3OO2 CONNECTORPL3OO1 LAMPPL3OO2 LAMPPL3OO3 LAllPPL3OO4 LAMP

Q 3OO1 IC

R 3OO1 CHIP RES.R 3OO2 CHIP RES.R 3OO3 CHIP RES.R 3OO4 CHIP RES.R 3OO5 CHIP RES.R 3006 CHIP RES.R 3OO7 CHIP RES.B 3OO8 CHIP RES.R 3OO9 CHIP RES.R 3015 CHIP RES.

3OO1 TACT S!\IITCH3OO2 TACT SI\IITCH3OO3 TACT SI'.IITCH3OO4 BOTARY CODE Sl,ll3OO5 TACT Sl,\lITCH3006 TACT SlrllTCH3OO7 TACT SI1IITCH3OO8 TACT Sl\lITCH3OO9 TACT SIIIITCH3O1O TACT Sl,\IITCH3011 TACT SllllTCH3012 TACT Sl1lITCH

VR3OOl POT.VR3O02 POT.

LAl',lP GUIDE

00 6200 187 032 80000 6200 187 032 800

BA

20K20K

1/10W 5%r/tllil 5%unlil 5%unlfi 5%r/nw 5%vnlf/, 5%r/r}ld 5%un:ff 5%unlil 5'/"r/r6lil 5%

10-60T3F10-60T3F10-60T3F10-60T3F

LC75B2E

RMC1/1OT 1O4JRMCl/1OT 1O4JRl'lCl/1OT 1O3JRl'lCl/1OT 1O3JRI'{CI/IOT 225JRl,lCl/1OT 1sOJRMC1/1OT 15OJRMCl/1OT 33OJRMCl/10T 560JRMC1/16 473JATP

SKHHDUSKHHDUSKHHDUEVQ-lllP9F 1524BSKHHDUSKHHDUSKHHDUSKHHAPSKHHAPSKHHDUSKHHDUSKHHDU

EVU-F2JFK1B24EVU-P2JFKlA24

FT-2500M Technical Supplement3E-5

DISPLAY UnitREF. DESCRIPTION VALUD l{V TOL. MT'GR'S DESIG YAESU P/N VERS.

LCD HOLDERLIGHT GUIDELIGHT GUIDEREFLECTORSHEET (A)SHEET

LED SPACER (Zpcs)LED SPACERNYLON RIVET

R35164504R3520070R3520080R71396704R7140070R7149850

LH-5-3 56000236LH-5-9 56000242NRP-380 56000314

FT-2500M Technical Supplement3E-6

\._. i.ouT3. cs5. 027. D09.D2I]. GND13. tN

FRC-6 DTMF Paging lJnit (option)

solder side

N.C+5Vo3BITH-ozcp

connector side

Pin 20\

cM8880srT-2(o101)

NoTE IRESISTER VALUES ARE lI o.l./10Y ICAPACITOR VALUES ARE lll rF. SoV :O}CAPACITOA VALUES ARE TANTALUU ;INDIJCTOR VALUES ARE IN H

EqB:N

ci-tlooFOGF

il{OND

D2DO

D2ESOUT

RS0R/T

I lllltFss nTHFRftsF NnTFn- II UNLESS oTHRU|SE NoTEO.L_____ ____J

l":lo'tt6


FRC-6 DTMF Paging UnitREF. DBSCRI PT I ON VALUE l'lv TOL. l',lFGR'S DESIG. YAESU P/N VERS.

(option)

xx* FRC-6 xl.x


C 0101 CHIP CAP. 0.01uFC 0102 CHIP CAP. 0.1uFC 0103 CHIP CAP. 0.1uFC 0104 CHIP CAP. 0.1uFC 0105 CHIP CAP. 33pFC 0106 CHIP CAP. 33pFC 0107 TANTALUI'I CHIP CAP. 3.3uFC 0108 CHIP CAP. 100pFC 0109 CHIP CAP. 100pFC 0110 CHIP CAP. 100pFC 0111 CHIP CAP. 100pFP O1O1 CONNECTOR

Q O1O1 IC

R O1O1 CHIP RES.R O1O2 CHIP RES.R O1O4 CHIP RES.R 0106 CHIP RES.R O1O7 CHIP RES.

VRO101 POT.

X O1O1 XTAL

RUBBBR SPONGE

100K100K100K3.3K10K

47K

5OV B25U F25U F25y F'5OV CH5OV CH10v5OV CHsOV CH5OV CHsOV CH

GR[,{4OBlO3l'{SOPTGRt'{4OF 1O4225PTGR}{4OF 1 O4225PTGRll4OFlO4Z25PTGRl'14OCH33OJsOPTGRl'l4OCH33OJ5OPTTEl'lSVAlA33511-8RGRl',l4OCHlOlJSOPTGRl',l4OCHlOlJ5OPTGRM4OCHlO lJ5OPTGRl'{4OCHlOlJSOPT

52022-t4t0

Cl'{888OSI T-2

RMCl/1OT 1O4JRl4Cl/10T 104JRMCl/1OT 1O4JRMCl/1OT 332JRl'lCl/1OT 1O3J

EVt'|- 1 USX3OBQ447KB

3. 579545MH2

F32ZB101A

K221708t7K22141005K22141005K?Zr41005K22r70223K22r70223K78100015K22t70235K22170235K22170235K22r70235

P1090705

G1091344

J24205r04J24205104J24205104J24205332J24205103

J5 1 789473

H0 1 03055

R7139760

1/10l\I1/10l\l1/10l'l1/10l.l1/1Oli


FTS-l7A CTCSS Tone Squelch Unit (option)

F L.t,t aW26-66OFFFF"j *--

=Ym

2 qf b;o ooF o

connector side

i;iiMX365LH(otot )

solder side

ON

ii ii-.!J-{j-!A.Pin4 { lf einltE'.t rt

'i lE'i lr

Pin g 1-l/r Pin'.mrrrf

Anode 1 Anode 2

tss3ol (83)(D1ol )

Cathode 1,2

NOTE IRESISTER VALUES ARE ll{ o.l/l6v ICAPACITOR VALUES ARE IN TF. sOV :ff)CAPACIToR VALUES ARE TANTALUI I

UNLESS OTHERWISE NOTEO.

106 4.7 6.3YR103 DtOt330K lSS30t

c r,x36sLH

I CABt (I-a 4 lurT 3R'Tls,+ +u^

9 CPUS TOIIE7 TSTB TSOI5 0TA T53 CLOCT( TOETI ONO

lo8

6

1

2


L

FTS-l7A CTCSS Tone Squelch UnitREF. DESCRIPTION VALUE

(option)WV TOL. MF'GR'S DESIG. YAESU P/N VERS.


C 0101 CHIP CAP. 220pFC 0102 CHIP CAP. 220pFC 0i03 CHIP CAP. 0.1uFC 0104 TANTALUI'I CHIP CAP. luFC 0105 TANTALUM CHIP CAP. 0.47uFC 0106 TANTALUI4 CHIP CAP. 4.?uFC 0107 CHIP CAP. 0.001uFC 0108 CHIP CAP. 0.1uFCOO1Ol CERAI'IIC OSC

D O1O1 DIODE

P O1O1 CONNOCTOR

Q 0101 rc

R OiOl CHIP RES.R O1O2 CHIP RES.R O1O3 CHIP BES.R O1O4 CHIP RES.

VROlO1 POT.

*** FTS_ITA *cxx

50v50v25U16V25U6.3V50v25Y

lI'lHz

GR}{39B221l'l5OPTGRl'l39B221M5OPTGRl''14OBlO4l'l25PTF95 1C I 05MftAAF 1Q2F 95IE4?4I'{RAAF1Q2F95OJ475MSAAF 1Q2GRl'l39B1O2M5OPTGRM4OB1O4l'l25PT

CSB1OOOJ2zlT

1SS3O1 TE85R

52022-nn

l'lx365LH

RMC1/16 1O5JATP

Rl',lC1/16 334JATPRMC1/16 BZzJATP

EVM- 1 USX3OBQ44ZKB

F3220 1 0 I

K2Zt7480IKZ2t74B0tK221408fiK78 120013K7B 1400 1 2K78080002K22t74809K22I4OBTT

H7900550

G2070086

P1090624

G1090897

J24185105J24185225J24185334J24185822

J51789473

R7130200

BBB

BB

1M

2.2t1330K8. 2K

47K

1/16lrl1/16l'{1/16l{1/16l\l

SPONGE

49,-2FT-2500M Technical Supplement

\MIC I

L-

MH-26c8J Microphone (accessory)

s8100367cURL CORD W,/PLUG

SpecificationsMicropone Impedance: 2.0kQOperating Temperature Range: -10C- +60CVoltage Requirement: 1.1V- 10V

1. Call Button2. N.C.3. PTT Button4. Mic Tx Audio5. GND6. +5v Dc7. Up Button8. Down Button

VALUE l.lv TOL. l.,lF'GR'S DESIG YAESU P/N VERS.REF. DESCRI PT I ON

0. 068 l/

SI I ET,D

x** MH-26GBJ {,x(*

MIC ELEMENTTACT S}rlITCH (3pcs)

El'1-78SKHHLN

M3290007N5090036

I

FT-2500M Technical Supplement4C

t^5su.=-, @I@@@@@@@--,A@__a_9(9

hJ-

MH-27A8J Microphone (accessory)

s8100227cURL coRD w/PLUG

SpecificationsMicropone Impedance: 1.5kOOperating Temperatwe Range:

-10C- +60CVoltage Requirement: 4.8V- 5.2V

ililll[illll"lll12345678

=E1.D/MR&PButton2. N.C.3. PTT Buttm4. MicTx Ar.dio5. GND6. +5v DC7. Up Button8. Doln Button

/--].i.;i;-\[4,@o

c10 cl I1000p x4

c2 c333p xl

FT-2500M Technical Supplement4D-1

MH-27A8J Microphone (accessory)REF. DESCR I PT ION VALUE }IV TOL. l',tFGR'S DESIG YAESU P/N VERS.

*** MH-Z7ABJ ***

D OOO1 LEDD OOOS LEDD OOO4 LEDD OOO5 LEDD 0006 LEDD OOOT LED

SELl 123RSLM-13Dl{SLM-13Dl{SLM_13Dl'|SLM-13DI{SLI'{-13DI'|

876 1 18G1876120Y18761 19G1T006P70F0001

G2090576G2070326G2070326G2070326G2070326G2070326

s8100307s8100308s8100309M3290021

I,{AIN UNIT ASS'YKEYBOARD UNIT ASS'YSWITCH UNIT ASS'Yl.,tIC ELEMENT

4D-2FT-2500M Technical Supplement

, \:...-II

UFi

Copyright C),1994Yaesu Musen Co., Ltd.All right reserved.

Printed in Japan.

YAE! SfIPerformance without compromise.sM

No portion of this manual Umay be reproducedwithout the permission ofYaesu Musen Co., Ltd.

E06519000 (408o-AY)

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Yaesu Ft 2500m Technical Supplement