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MSD P11207 Test Plan 1/5/11 Pass/Fail Criteria and Engineering Method Eng. Spec Specification Description Passing Value Tolerance Unit Method ES1 Data Rate of the Wireless Transmission ≥ 40 N/A kbps Test ES2 Bit Error Rate at 100 m Distance ≤ 0.5 N/A % Demonstration ES3 Operates Within Unlicensed RF Band Yes N/A Boolean Test ES4 Number of Frequency Channels ≥ 7 N/A Count Demonstration ES5 Number of Communicating Points ≥ 2 N/A Count Demonstration ES6 Use of a Protocol with techniques to allow coexistence Yes N/A Boolean Observation ES7 Total Module Power Consumption < 0.33 N/A W Demonstration ES8 Length of the PCB 90 0.5 mm Test ES9 Width of the PCB 70 1.0 mm Test ES10 Height of the PCB < 30 N/A mm Test ES11 Mass of the PCB < 300 N/A g Test ES12 Compliance with FCC and IEEE Standards Yes N/A Boolean Demonstration ES13 RoHS Compliance Yes N/A Boolean Observation ES14 Withstandable Temperature [0, 65] N/A °C Observation ES15 Unit Cost < 75 N/A $ Analysis ES16 Uses Open Source Yes N/A Boolean Demonstration

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MSD P11207 Test Plan 1/5/11

Pass/Fail Criteria and Engineering Method

Eng. Spec Specification Description Passing Value Tolerance Unit Method

ES1 Data Rate of the Wireless Transmission ≥ 40 N/A kbps Test

ES2 Bit Error Rate at 100 m Distance ≤ 0.5 N/A % Demonstration

ES3 Operates Within Unlicensed RF Band Yes N/A Boolean Test

ES4 Number of Frequency Channels ≥ 7 N/A Count Demonstration

ES5 Number of Communicating Points ≥ 2 N/A Count Demonstration

ES6 Use of a Protocol with techniques to allow coexistence Yes N/A Boolean Observation

ES7 Total Module Power Consumption < 0.33 N/A W Demonstration

ES8 Length of the PCB 90 0.5 mm TestES9 Width of the PCB 70 1.0 mm Test

ES10 Height of the PCB < 30 N/A mm TestES11 Mass of the PCB < 300 N/A g Test

ES12 Compliance with FCC and IEEE Standards Yes N/A Boolean Demonstration

ES13 RoHS Compliance Yes N/A Boolean ObservationES14 Withstandable Temperature [0, 65] N/A °C ObservationES15 Unit Cost < 75 N/A $ AnalysisES16 Uses Open Source Software Yes N/A Boolean DemonstrationES17 Meet All Interface Specifications Yes N/A Boolean Multiple

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MSD P11207 Test Plan 1/5/11

Required Equipment and Availability

Equipment # Equipment Description Model or Specifications Quantity Needed

Location Available

1 Mid Range RF Module - 4 To Be Assembled1/7/2011

2 Texas Instruments CC Debuggers - 2 11207 Locker3 PC running Windows XP, Vista or Seven 2 11207 Locker4 Texas Instruments Smart RF Studio (Software) Version 7 2 TI Website5 Laser Measure Tool (or Measuring wheel) Until 30m 1 TBD6 Spectrum Analyzer HPE4411B 1 EE Lab 32417 USB Cable Type A to Type B 2 11207 Locker8 SMA cable Male to Female 1 EE Lab 32419 Oscilloscope Probes P2220 Probe 2 11207 Locker

10 Oscilloscope HP54602B 1 EE Labs11 Electronic Scale Milligram accuracy 1 ME Labs12 Digital Caliper Cen-Tech 6” Digital Caliper 1 11207 Locker13 Lab Power Supply HP E3030A 1 EE Labs

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MSD P11207 Test Plan 1/5/11

Test T1: Verify Data Rate

Objective

Engineering Specs Tested: ES1

This test will verify the data rate of the communication link at a transmission distance of 100 meters marginal, 200 meters ideal.

Equipment Required

2 laptop computers running Windows2 copies of TI SmartRF Flash Programmer1 copy of Tera Term 4.681 copy of MidRange1DataRateTest.exeFirmwares CC1111DataRateTestModuleA.hex and CC1111DataRateTestModuleB.hexTest File: TestFile.dat2 USB cables (Type A to Type B)1 TI CC Debuggers2 Mid-Range RF modulesLaser Measure Tool (or measuring wheel)

Location

Gordon Field House Track (RIT Campus)

Procedure

Note: All the files needed during this procedure can be found on the Edge website of Project 11207, under MSD II/Test Plan/ Test Plan Files

1. Install Smart RF Flash Programmer on both computers2. Install on Tera Term 4.68 on laptop A, on other one copy the software: MidRange1DataRateTest.exe3. Connect each module to respective laptop via USB cable (for 5V power supply)4. Connect each module to respective laptop via CC Debugger (for data communication)5. On both computers, run TI Smart RF Flash Programmer:

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MSD P11207 Test Plan 1/5/11

Figure 1: Smart RF Flash Programmer

a. In the System on Chip Window, select your device, which should have the Chip Type CC1111b. In the section Flash image, Select for one of the module the file “CC1111DataRateTestModuleA.hex”c. For the other one, select “CC1111DataRateTestModuleB.hex”d. In the section actions, select “Erase, Program and Verify” on both computerse. Click on “Perform actions”f. Close Flash Programmer on both computers and unplug the CC Debuggersg. Reset each board.

6. Place laptops 100 meters apart, 1 meter from the ground, with a clear line of sight7. Power on laptop “A” (Transmitter), and run Tera Term, and open the COM port corresponding to the RF Board

Figure 2: Tera Term

- Go to « Setup/Serial Port » and select the following configuration for the Baud Rate, Parity, Stop and Flow control sections.

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MSD P11207 Test Plan 1/5/11

Figure 3: Tera Term Configuration

8. Power on laptop “B” (Receiver), and run the custom script: MidRange1DataRateTest.exea. Type the correct Port COM

Figure 4: Custom Software

9. On laptop A, on Tera Term, Select the test file under “File/Send File…”

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MSD P11207 Test Plan 1/5/11

Figure 5: Tera Term Send file

10. Wait for the transmission to be completed

Figure 6: Sent File Status

11. On laptop B, Wait for the results to be displayed on the screen and record it

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MSD P11207 Test Plan 1/5/11

Figure 7: Results

12. Repeat the process 4 other times and calculated the average bit rate, and record it.

Results

Date: ______________________ Engineer Initials: __________________

Pass / Fail Criteria: Data Rate more than or equal to 40kbps at 100m.

Observed Data Rate: _________________ kbps Result: Pass / Fail

Observed Data Rate at 200 m: _________________ kbps

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MSD P11207 Test Plan 1/5/11

Test T2: Verify Range of the Transmission

Objective

Engineering Specs Tested: ES2

This test will verify the reliability of the communication link at a transmission distance of 100 meters marginal, 200 meters ideal.

Equipment Required

2 laptop computers running Windows2 copies of TI SmartRF Studio software2 copies of TI SmartRF Flash Programmer2 USB cables (Type A to Type B)2 TI CC Debuggers2 Mid-Range RF modulesLaser Measure Tool (or measuring wheel)

Location

Gordon Field House Track (RIT Campus)

Procedure

Note: All the files needed during this procedure can be found on the Edge website of Project 11207, under MSD II/Test Plan/ Test Plan Files

1. Place laptops 100 meters apart, 1 meter from the ground, with a clear line of sight2. Connect each module to respective laptop via USB cable (for 5V power supply)3. Connect each module to respective laptop via CC Debugger (for data communication)4. On both computers, run TI Smart RF Flash Programmer:

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MSD P11207 Test Plan 1/5/11

Figure 8: Smart RF Flash Programmer

a. In the System on Chip Window, select your device, which should have the Chip Type CC1111b. In the section Flash image, Select the file “Range_Test.hex”c. In the section actions, select “Erase, Program and Verify”d. Click on “Perform actions”e. Close Flash Programmerf. Repeat with the second module

5. Power on laptop “A” (Transmitter), and run Texas Instruments SmartRF Studio 7 software.

Figure 9: Smart RF Studio First Window

a. Select CC1111

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MSD P11207 Test Plan 1/5/11

Figure 10: Smart RF Studio TX Window

b. In the new window, Select “Expert Mode”c. Select the Field “Packet TX” in the bottom of the windowd. Open file configuration “Range_Test_TX_Configuration.srfs” (File/Open Cfg)

6. Power on laptop “B” (Receiver), and run also Texas Instruments Smart RF Studio.a. Select CC1111b. In the new window, Select “Expert Mode”c. Select the Field “Packet TX” in the bottom of the windowd. Open file configuration “Range_Test_RX_Configuration.srfs” (File/Open Cfg)e. In the field Dump Data to file, Click on the button “…” and select a desired path to create a file which we will

name “TestRange.txt”

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MSD P11207 Test Plan 1/5/11

Figure 11: Smart RF Studio RX Window

f. Click on the Start Button7. On laptop “A” start the transmission of the packets by clicking on the button “Start”

Figure 12: Start Button

8. Run the transmission until all the packets are sent (Total number indicated in the field: “Packet Count”)9. When the transmission is done, on laptop B run the Program “ExtractBER” and follow the instructions to display the

calculated BER from the file “TestRange.txt” previously created.10. Record the BER and repeat steps 1-9 with a distance of 200 meters

Results

Date: __________________ Engineer Initials: __________

Pass / Fail Criteria: Bit Error Rate must be less than or equal to 0.5% at 100m

Observed Bit Error Rate (BER) at 100 m: _________________ % Result: Pass / Fail

Observed Bit Error Rate (BER) at 200 m: _________________ %

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MSD P11207 Test Plan 1/5/11

Test T3: Verify Frequency Complies with FCC

Objective

Engineering Specs Tested: ES3, ES12

This test verifies the proper transmission power and frequencies according to FCC regulations. The transmission should fall between 902 MHz and 928 MHz (part of the allowed ISM band), and the total transmitted power should be below TBD.

Equipment Required

1 laptop computer running Windows1 copy of TI SmartRF Studio software1 USB cable (Type A to Type B)1 TI CC Debugger1 Mid-Range RF module1 spectrum analyzer

Location

Electrical Engineering Research Lab (09-3241)

Procedure1. Connect module to spectrum analyzer through SMA cable2. Power on spectrum analyzer3. Power on laptop, run SmartRF Studio4. Set the module to simple transmit mode (TX)5. Measure lower limit of transmitted spectrum, record below6. Measure upper limit of transmitted spectrum, record below7. Measure total transmitted power, record below

Results

Date: __________________ Engineer Initials: __________

Pass / Fail Criteria: 99% of transmitted power must be between 902 MHz and 928 MHz Total transmitted power in this range must be below TBD Watts.

Observed Minimum Frequency: _________________ MHz Result: Pass / Fail

Observed Maxiumum Frequency: _________________ MHz Result: Pass / Fail

Total Transmitted RF Power: _________________ W Result: Pass / Fail

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MSD P11207 Test Plan 1/5/11

Test T4: Verify Coexistence of Communication Between Channels

Objective:

Engineering Specs Tested: ES4

The objective of this test is to demonstrate the use of different channels simultaneously. Fifteen channels of communication will be observed in this test.

Equipment required:

- 2 laptop computers running Windows- 2 copies of TI SmartRF Studio software- 2 copies of TI SmartRF Flash Programmer- 2 USB cables (Type A to Type B)- 2 TI CC Debuggers- 2 Mid-Range RF modules

Location:

- EE Lab

Procedure:

13. Place laptops 5 meters apart on a reliable surface and at equal height.14. Connect each module to respective laptop via USB cable (for 5V power supply)15. Connect each module to respective laptop via CC Debugger (for data communication)16. On both computers, run TI Smart RF Flash Programmer:

Figure 13: Smart RF Flash Programmer

a. In the System on Chip Window, select your device, which should have the Chip Type CC1111b. In the section Flash image, Select the file “Channel1_Test.hex”c. In the section actions, select “Erase, Program and Verify”d. Click on “Perform actions”e. Close Flash Programmer

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MSD P11207 Test Plan 1/5/11

f. Repeat with the second module and run with additional channel (“Channel#_Test.hex”).g. Ensure each module sends and receives data without error with their respective frequencies.h. Repeat until all channels are in use. When switching channels, check only adjacent channels for coexistence

due to limited materials.

Results:

Date: __________________ Engineer Initials: __________

Pass / Fail Criteria for Number of Coexisting Channels: The number of functional coexisting channels must be at least 7.

Number of Functional Channels Tested: _____________________ Result: Pass / Fail

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MSD P11207 Test Plan 1/5/11

Test T5: Power Consumption of the module

Objective

Engineering Specs Tested: ES7

This test will measure the current consumption of the module.

Equipment Required

2 laptop computers running Windows2 copies of TI SmartRF Studio software2 copies of TI SmartRF Flash Programmer2 USB cables (Type A to Type B)2 TI CC Debuggers2 Mid-Range RF modules1 External Power Supply1 Oscilloscope1 Oscilloscope ProbePrototype boardResistor 10Ω

Location

EE Lab

Procedure:

Figure 14: Measurement Setup

The current consumption varies rapidly and to estimate the maximal current consumption, the current is measured with an oscilloscope voltage probe over a 10Ω resistor in series with the power supply. The use of the resistor and oscilloscope allows measurement of the current consumption as a function of time, and is therefore necessary to calculate battery life time.

This method also gives a visual representation of the current consumption during active and sleep mode of the device.

Note: This measurement method may influence the result because of the voltage drop over the resistor and the stray (cable) resistance. Ideally the measurement setup should have been verified with a high precision amperemeter. However the accuracy will be defined by other factors and a higher accuracy here would not affect the final results. The results are also read manually from the oscilloscope, which will also influence on the accuracy.

Note: All the files needed during this procedure can be found on the Edge website of Project 11207, under MSD II/Test Plan/ Test Plan Files

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MSD P11207 Test Plan 1/5/11

1. Place laptops 5 meters apart on a table, with a clear line of sight2. Configure the power supply to provide 3.3V with a minimum current of 500mA. Don’t turn it on yet.3. Create the circuit corresponding to the schematic in figure 1 and connect module A to the power supply and the

oscilloscope as indicated.4. Connect module A to laptop A using the CC Debugger (for data communication)5. Turn on the Power supply6. Connect module B to laptop B using the USB cable (for power supply)7. Connect also module B to laptop B via CC Debugger (for data communication)8. On both computers, run TI Smart RF Flash Programmer:

a. In the System on Chip Window, select your device, which should have the Chip Type CC1111b. In the section Flash image, Select the file “Power_Test.hex”c. In the section actions, select “Erase, Program and Verify”d. Click on “Perform actions”e. Close Flash Programmerf. Repeat with the second module

9. Power on laptop “A” (Transmitter), and run Texas Instruments SmartRF Studio 7 software.

Figure 15: Smart RF Studio First Window

a. Select CC1111

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MSD P11207 Test Plan 1/5/11

Figure 16: Smart RF Studio TX Window

b. In the new window, Select “Expert Mode”c. Select the Field “Packet TX” in the bottom of the windowd. Open file configuration “Power_TX_Configuration.srfs” (File/Open Cfg)

10. Power on laptop “B” (Receiver), and run also Texas Instruments Smart RF Studio.a. Select CC1111b. In the new window, Select “Expert Mode”c. Select the Field “Packet TX” in the bottom of the windowd. Open file configuration “Power_RX_Configuration.srfs” (File/Open Cfg)

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MSD P11207 Test Plan 1/5/11

Figure 17: Smart RF Studio RX Window

e. Click on the Start Button11. On laptop “A” start the transmission of the packets by clicking on the button “Start”

Figure 18: Start Button

12. Record the power consumption during transmission on the oscilloscope 13. Zoom on one of the sequence during which the transceiver is sending a packet and record the maximum value of

current Im14. Record the exact value of the voltage V m15. Calculate the maximum power consumption Pm=V m∗Im and record it.

16. Repeat Steps 1 to 15 with Module A as the receiver (Open “Power_RX_Configuration.srfs”) and module B as the transceiver (Open “Power_TX_Configuration.srfs”) to calculate the maximum power consumption during the reception.

Results

Date: __________________ Engineer Initials: __________

Pass / Fail Criteria: Power consumption less than 0.33 W

Measured Power Voltage during transmission: __________________

Maximum Measured Current Consumption during transmission:_____________

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MSD P11207 Test Plan 1/5/11

Maximum Power Consumption during transmission: ________________ Result: Pass / Fail

Measured Power Voltage during reception: __________________

Maximum Measured Current Consumption during reception:_____________

Maximum Power Consumption during reception: ________________ Result: Pass / Fail

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MSD P11207 Test Plan 1/5/11

Test T6: Verify Mass of Populated RF Board

Objective:

Engineering Specs Tested: ES11

This test will demonstrate that the populated PCB will be light weight. The module will be measured by using an electronic scale.

Equipment required:

Electronic Scale 1 Mid Range RF Module

Location

- EE Lab

Procedure:

1. Tare Electronic scale.2. Place RF Board on Electronic scale.3. Observe Mass from the scale.

Results

Date: __________________ Engineer Initials: __________

Pass / Fail Criteria for Length of the PCB: The mass of the PCB must not exceed 300g.

Measured Mass of the PCB: _____________________ Result: Pass / Fail

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MSD P11207 Test Plan 1/5/11

Test T7: Measurement of the Dimensions of the Module

Objective:

Engineering Specs Tested: ES8, ES9, ES10

This test will verify that the dimensions are such that the module will be able to be inserted into the enclosure without difficulty. The measurements will be made with a digital caliper.

Equipment required:

A caliper 1 Mid Range RF Module

Location

EE Lab

Procedure:

1. Measure length of PCB with caliper.2. Measure width of PCB with caliper.3. Measure height of module with caliper including PCB and components.

Results

Date: __________________ Engineer Initials: __________

Pass / Fail Criteria for Length of the PCB: The length of the PCB must be 90 +/- 0.5mm.

Measured Length of the PCB: _____________________ Result: Pass / Fail

Pass / Fail Criteria for Width of the PCB: The width of the PCB must be 70 +/- 1.0mm.

Measured Width of the PCB: ______________________ Result: Pass / Fail

Pass / Fail Criteria for Height of the PCB: The height of the module must not exceed 30mm.

Measured Height of the Module: ______________________ Result: Pass / Fail

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MSD P11207 Test Plan 1/5/11

Test T8: Cost per Module

Objective:

Engineering Specs Tested: ES15

This test will verify the cost of the RF module to be below the target cost of $75 per unit.

Equipment Required

1 Laptop Computer

Location

EE Lab

Procedure:

1. Open Bill of Materials2. Sum all of the Materials for one module.

Results

Date: ____12/17/10______ Engineer Initials: ____TM____

Pass / Fail Criteria: The cost per module must not exceed $75.

Calculated Cost per Module:____$63_____ Result: Pass / Fail

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MSD P11207 Test Plan 1/5/11

Test T9: Verify Interface Specifications

Description:

Engineering Specs Tested: ES17

This test will verify that the PCB will be interchangeable with the other RF teams’ PCBs. To verify the locations of the connectors a caliper will be used to measure from the edges of the PCB to the connector locations.

Equipment required:

Caliper 1 RF Module

Location

- EE Lab

Procedure:

1. Measure distance of SMA connector from left edge of PCB (closest to SMA connector) with caliper2. Measure distance of SMA connector from top edge of PCB (closest to connectors) with caliper3. Measure distance of LED Bank from left edge of PCB (closest to SMA connector) with caliper4. Measure distance of LED Bank from top edge of PCB (closest to connectors) with caliper5. Measure distance of USB connector from left edge of PCB (closest to SMA connector) with caliper6. Measure distance of USB connector from top edge of PCB (closest to connectors) with caliper

Results

Date: __________________ Engineer Initials: __________

Pass / Fail Criteria:Measured Distance from edge of PCB to edge of SMA connector (cm):______From Left

Result: Pass / Fail

Pass / Fail Criteria:Measured Distance from edge of PCB to edge of LED Bank (cm):______From Left

Result: Pass / Fail

Pass / Fail Criteria:Measured Distance from edge of PCB to edge of USB connector (cm):______From Left

Result: Pass / Fail

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MSD P11207 Test Plan 1/5/11

Test T10: Temperature

Objective

Engineering Specs Tested: ES14

This test analyzes the reliability of the RF module across a range of operating. Due to time and equipment constraints of the project, reliable operation of the module will be estimated by the temperature rating of all included components. The use of properly rated components implies (within reasonable confidence) proper module operation.

Equipment Required

1 computer with Windows, Internet accessSpreadsheet software (such as Microsoft Excel)Test T10 component spreadsheet (file available at http://edge.rit.edu/content/P11207)

Location

Electrical Engineering Lab

Procedure1. Open an Internet browser window and navigate to https://edge.rit.edu/content/P11207/public/Home2. Log in, if required3. Click the “Test Plan” link under “MSD II”4. Click and download the “Test_T10.xls” spreadsheet file5. Open this document in Microsoft Excel or similar6. Listed are all components, and links their respective datasheets7. Click the first datasheet link, and find temperature specifications8. Record the minimum and maximum temperature ratings in the spreadsheet9. Check the appropriate columns, Temp Pass, Temp Fail according to the criteria below10. Repeat steps 7-9 for each listed item11. If all temperature ratings pass, test T10 is passed (mark below)12. The edited file should be saved and uploaded to the P11207 web page

Results

Date: __________________ Engineer Initials: __________

Pass / Fail Criteria: All module components must be rated for operation at:0 °C (or lower) to 65 °C (or higher) Result: Pass / Fail

Failed Components, If Any: ____________________________________________________________________________________________________________________________________________