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VIth INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France
NMOS-based high gain amplifier for MAPS
Andrei Dorokhov Institut Pluridisciplinaire Hubert Curien (IPHC)
Strasbourg, France
VI th INTERNATIONAL MEETING ON FRONT END ELECTRONICS
FOR HIGH ENERGY, NUCLEAR, MEDICAL AND SPACE APPLICATIONSPerugia, Italy
17- 20 May 2006
e-mail address: [email protected] are available at
http://www-lepsi.in2p3.fr/~dorokhov/talks/Andrei_Dorokhov_FEE2006.ppt
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VIth INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France
Contents
Amplifiers for MAPS – requirements, constraints and limitations
Introduction to an improved amplifier schematics
Implementation of the amplifier in test structures of Mimosa15 chip
Tests with Fe55 and results
Summary and future plans
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VIth INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France
Amplifiers for MAPSAmplification is needed to decrease noise contribution from switching networks, like clamping or sampling.
in
outbias
bias
in
signal current
out
reset
cascode
in
vb
• PMOS transistors not allowed inside pixel -> signal decrease due to parasitic NWELL• but using PMOS transistor as a load would be the preferred choice to increase in-pixel amplifier gain…
load
gate
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VIth INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France
Amplifiers for MAPS
in
out
bias
signal current
• gds1 and gds2 << gm1, gm2 , gmb2
• so one need to increase gm1 and decrease gm2
and gmb2
• with decreasing gm2 we decrease DC current, and hence gm1 so there is a limiting contradiction for the gain/bandwidth of this schematic…
Due to gm2 there is unwanted dependency of Id on Uout , socan we reduce dependency of Id on Uout without changing gm2 ?
M1
M2
small signal Gain = Vout/Vin = gm1 /( gm2 +gmb2 +gds1
+gds2)
Id
?
As an example from simulation to be presented later:gm1=47 S gm2=4 S gmb2=0.9 S gds1=8 nS gds2=0.5 S
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VIth INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France
Improved load for the common source transistor
in
outbias
signal current
-> decouple the gate of the load transistor from the power supply with one additional NMOS transistor, used as a diodedue to the floating gate and parasitic gate-to-source capacitive coupling the AC voltage at the gate will follow to the output AC voltage -> • AC current and hence the load for the common source transistor decreases • load for DC is almost unchanged as DC voltage drop on additional NMOS transistor is small
gate
The AC gain should increase, while the DC operational point should not change!
Gain = Vout/Vin = gm1 /( gm2 +gmb2 +gds1
+gds2)
M1
M2
M3
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VIth INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France
New idea works - simulation with Spectre
b ia s g rid
p -sp ra y p-stop ring opening
bum p pa ds
n-type silic on n-type silic onp -typ e im p la nts+
n+-ntype
gmb2 +gds1 +gds2 become significant and limit the amplification, and also the gate is not perfectly decoupled -> still some fraction of gm2 exist…
AC gain is 8dB larger!
New schematic
Standard schematic
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VIth INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France
Test structures with new amplifier implemented in Mimosa15 chip
improved load with power on switch
low frequency-pass feedback correlated
double sampling circuit
common source transistor with power on switch
NWELL size is 4.25 m x 3.4 m, pixel pitch size 30 m x 30 m, pixel matrix: 4 columns x 15 rows
NWELL diode
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VIth INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France
Tests with Fe55 source, measurements
If gamma goes directly to the NWELL volume ( very small <<1% fraction of all gammas), all delivered charge will be collected by single pixel and this value used to determine conversion gain (mV/e) for the amplifiers
• 5.9 keV gammas create about 1640 e-h pairs in silicon • pixel amplitude is determined as the voltage difference between two successive time frames (correlated double sampling)• the time between two successive frames is 500 s (== integration time)• pixel readout time is 500 ns• measurements are performed at stabilized temperature of 20O
• common mode and pedestals are subtractedSingle pixel amplitudes distribution, superimposed for all 60 pixels, no amplitude cut is applied
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VIth INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France
Tests with Fe55 source, calibration
Each pixels is calibrated individually, example of calibration peak for pixel[0][7]
Events selection for the calibration peak amplitude distribution:1. S/N (seed pixel) > 5 2. S (seed pixel) > S (each of 8 pixels around seed pixel) 3. S/N < 10 for each of 8 pixels around seed4. S/N < 5 for each of readout pixels in the ring 5x5 around 3x3
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VIth INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France
Tests with Fe55 source, calibration
Distribution of calibration peaks for all pixels
• Conversion gain is about 74 V/e, including attenuation in source follower
• Calibration peak variation is about 2 %, this includes charge-to-voltage conversion in NWELL diode, amplifier gain, source follower gain variations
• Output voltage variation before CDS, due to process parameters variation (NWELL, amplifier transistors, source followers) is about 20 mV
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VIth INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France
Tests with Fe55 source, noise
Noise amplitude distribution for each pixel is fit to Gaussian, and sigma is taken as noise value for each pixel of 60
Noise value distribution for all pixels, average noise is about 7.5 e or 540 V at the column output
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VIth INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France
Tests with Fe55 source, charge collection
Seed pixel amplitude distribution for all pixels, the most probable value for the collected charge in the seed pixel is about 300 e, or 18 % of total charge
Events selection for the seed pixel:1. Border pixels are excluded2. S/N (seed pixel) > 5 3. S (seed pixel) > S (each of 8 pixels around seed pixel) 4. average {S (8 pixels around seed pixel)} > average {S (13
pixels around 3x3 cluster pixel)}
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VIth INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France
Tests with Fe55 source, charge collection in cluster of 3x3
Charge collection in 3x3 pixels cluster, the most probable value for the collected charge is about 950 e, or 58% of total charge
Events selection: same as for the seed amplitude distribution
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VIth INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France
Summary new resistive AC load, which uses only NMOS transistors, is proposed
NMOS based amplifier using new type of load and feedback is designed and simulated
the gain increases by factor of 2 in comparison to the gain of existing amplifier schematics, which use only NMOS transistors
in comparison to old schematic, the same gain can be achieved with smaller power consumption
the designed amplifier implemented in MAPS using AMS0.35 OPTO process and tested with Fe55 source
the tested MAPS has the following measured properties: • low noise, ~7.5 e (after CDS), and hence higher signal-to-noise ratio
• conversion gain is about 74 V/e
• gain variation due to process variation is about 2 %
• charge collection in seed pixel is 18 %
• charge collection in the cluster 3x3 is 58 %
the amplifier can be also used in schematics, where one need to save the space, cause it does not contain PMOS transistors (and hence PWELLs)
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VIth INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France
Future development plans
1. larger matrix and smaller pixel pitch size
2. amplifier optimization to use it in combination with clamping readout circuitry
3. 1 and 2 -> chip submission in June2006 in collaboration with DAPNIA/SEDI (CEA/Saclay)
4. test NMOS based high gain amplifier without feedback, different biasing -> more test structures…
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VIth INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France
Acknowledgements
This development work would not be possible without support of many people from CMOS sensors group at IPHC:
W. Dulinski and M. Winter – for encouraging me to improve the amplifier for MAPS and for the fruitful discussions, special thanks to W. Dulinski for making the layout for my four different amplifier designs of which actually only two worked (well…)
CAD specialists - C. Colledani, F. Guilloux, S. Heini, A. Himmi, Ch. Hu, O. Robert, I. Valin, for their help with Cadence,
Data acquisition, test and measurements specialists - G. Claus,M. Goffe, K. Jaaskelainen and M. Szelezniak for providing me test setup and acquisition software