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UHF RFID Reader Presentation – AS3990
Design In presentation
Integrated Reader IC
Start 9:40
Thomas Luecker: Technical Marketing / Application
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General Block Diagram
AS3990 operation modes:
High performance for mid range application with VCO, Circulator, TXCO
Printer application:Internal PA, VCO, crystal, no Circulator
EPC Gen 2 Protocol Handling
SupplyRegulators
&
Refernces
MC
UIn
ter f
ace
AS3990
Directionalunit
1
CO
MN
_AC
OM
P_B
CO
MN
_B
2 3 5
VD
D_5
LFI
VS
S
6
VS
S
8
MIX_INP 7
MIX_INN 9
MIXS_IN 10
VS
N_M
I X
11
CB
I B
12
VD
D_M
IX
13
CB
V5
14
VD
D_T
XP
AB
15
VE
XT
16
VE
XT
2
17
27
RFOUTN_2 28
RFOUTN_1
20
RFOUTP_2 21
RFOUTP_1
VS
N_1
22
VS
N_2
23
VS
N_3
24
VS
N_4
25
VS
N_5
26
VS
N_D
29
32
RFOPX 33
RFONX
VS
N_R
FP
35
36
OSCO 37
OSCI
39 EN40 IRQ
41 IO042 IO143 IO244 IO345 IO446 IO547 IO648 IO7
49 CLSYS
50 CLK
51 VDD_IO
38 VDD_D18 VDD_RF19 VDD_B54 AGD
VS
N_A
55
EXT_IN 56
VS
N_C
P
57
59 VDD_A
VCO 60
63 VDD_LF
64
CO
MP
_A
EX
P_P
AD
65
CD
1
53
CD
2
52
34 VDD_RFP
4xC2xC
7xC
Micro controller
Oscillator& Timing
System
RSSI
AFE
Digitizer
DigitizerDouble Down-ConversionMixer
GainFilter
RF Out
24 Byte FIFO
EPC Gen 2 ProtocolHandling
CRC
GEN-2
Frame Gen
OAD 31
30OAD_258ADC
DAC 4
VOSCCP
61
62
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Register:
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Circulator: Leakage definition
-TxLeakage 1 : due to the poor isolation of
circulator
-TxLeakage 2 : due to the antenna
mismatching
-Tx and Rx needs to be separated in chip
�ground up RFID by austriamicrosystems
-LNA or active mixer can be saturated by the
strong TX signal.
-DC Offset can be caused by the self mixing.
-The received signal can suffer from significant
noise due to the phase noise of the TX leakage.
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Circulator Selection
What is a Circulator?
A 3 port passive ferrite device that passes
RF energy from one port to the next
Isolates Tx from Rx chain
What Specs are Important?
- Frequency 860-960 MHz
- Insertion Loss .2dB
- Rejection/Isolation 30dB
Recommended Suppliers
–Tyco MAFRIN0494 860-960 MHz (Wideband)
–Tyco MAFRIN0493 902-928 MHz ( US)
–Tyco MAFRIN0495 860-872 MHz (Europe)
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Directional Coupler Selection
What is a Directional Coupler?
A 4 port passive device. One path passes signal
The other ports see a coupling of the signal
What Specs are Important?
- Frequency 860-960 MHz
- Insertion Loss .2dB
- Coupling/Isolation 20dB
What is the difference between Coupler and Circulator
–Directional Coupler is smaller and cheaper
–Directional Coupler has 20dB attenuation to receive path, so can limit the range
–Directional Coupler is more suited to shorter range
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Antenna requirements
High gain
Low S11 Reflectivity ( VSWR)
High bandwidth
Polarization
Ceramic vs. free space vs chip
(DEMO)
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Antenna suppliersCompany name Ordering name Antenna type Frequency dimension gain Polarization BW in 10 dB
Chequers JPA0915S35T63XA Ceramic 915 70*70 4 RHCP 3CompoTek CTA866/5/PA7NF/S1 patch 866 254*254*61 5 circ 4??Fractus ZIGBEE-915-EB chip 915 18*7.3*1 0 lin 5??Huber Suhner SPA 860 patch 867 620*320*40 11 RHCP 5Huber Suhner SPA 860/55/10 patch 867 370*370*41 10 RHCP 5Huber Suhner SPA 860/70/8 Patch 867 190*190*30 8 LIN 5Inpaq ACG-2005-A1-MC-S chip 868 20*5 0?? LIN 5??Johanson P/N 0920AT50A080 Chip 920 11*5 -1 LIN 5??Laird S9028PCL patch 915 9 circ 26Laird S9025PR patch 915MAC Korea MPAC62SF912PS-TA Ceramic 912 61*61 (65*68) -1 Circ 6Partron ANPS0912U9ZTA Ceramic 912 50*50 (70*70) 4 RHCP 6Pointing PATCH A0025 patch 860-960 245*245*40 7 circ 100Pointing PIFA 004 Ceramic 860 36*32*8 0?? lin ? 6RAN RANP0914B Ceramic 914 25*25*8 2 RHCP 4Tsanguan DAA915R37F915X4-40 Ceramic 915 37*37*4 3,5 RHCP 2Würth 7488910092 chip 868 11*5,1 -1 Lin 5??Yageo 29545 chip 868 17*14 1,5 LinTyco patch 868 CircKathrein patch 868 10 CircWisi patch 868 11 Lin
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Antenna measurement 1: Network analyzer
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Antenna measurement: reflected power
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Antenna measurment: Distance
Setup1:
Pout = ca.28dBm (TX-Level = 0dB/0dB), F = 920MHz
Reading Range = ca. 1cm
Setup2:
Pout = ca.20dBm (TX-Level = -6dB/-2dB), F = 956MHz
Reading Range = ca. 80cm max.
Setup3:
Pout = ca.27dBm (TX-Level = 0dB/0dB), F = 956MHz, NXP-Tag
Reading Range = ca. 170cm max.
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Needs for the PA Power Amplifier Parameters
CLEAN SUPPLY
– Amplitude (switching noise) will be seen in
spectrum
Gain approximately 3 dB higher than
output power
Low noise figure
High efficiency and heat sink
Temperature/Voltage range
5V5V Supply Voltage
Depends on source (USB source not possible)
Depends on source
Current Consumption
30dB20Gain
47dBm40dBmOPIP3
Approx 5dBApprox 5dBNoise Figure
>29dBm>20dBmOutput Power (P1dB)
840-960MHz840-960MHzFrequency Range
Long RangeShort RangeParameter
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PA overview
Producer Model Frequency Gain Vd Id NFOutput
IP3
P1dB suitable power Comment/Package
Minicircuits GALI 74+ 0-1 GHz 21,8 5 80 2,7 33 18,3 Gain BlockHitTite HMC580ST89 DC-1 GHz 17 5 88 2,8 33 19 Gain Block
SKYWORKS SKY65017-70LF DC-6 GHz 20 5 120 4,5 38 20 Gain BlockHitTite HMC589ST89 DC-4 GHz 19 5 82 4 32 21 Gain BlockASB ASL29W DC-3 GHz 13,5 5 75 0,9 39 22 Gain Block
RFMD SGA-7489(Z) DC-3000 MHz 21,5 5 115 2,8 35,5 22,4 Gain BlockSKYWORKS SKY65004 0,25-2,7 22 5 120 4 42 24 Gain Block
RFMD RF2172 0,9-2,5 28 3,6 130 na na 24 QFN 16RFMD RF3315 0,3-3 GHz 18 5 150 3 41 25 Gain Block
MACOM MAAMSS0048 0,25-4GHz 21 5 180 4,5 40 27 Gain BlockSKYWORKS SKY65112 0,4-2,3 18 5 200 (450@ 25 dBm) na 39 27 SO8- AMP
RFMD SPA2118 0,8 - 1 GHz 33 5 400 5 47 29 SO8- AMPASB AS420 DC-3GHz 31,5 5 370 6,8 47 29,5 SO8- AMP
SKYWORKS SKY65113-84LF 0,4-2,3 19 5 450 (550@30 dBm) 40 30,6 SO8- AMPRFMD RF5110G 0,8-0,95 27 3,5 200 (2000 @ 35 dBm) na na 32 QFN 16
MACOM MAAPSS0095 0,8-0,95 28 3,3 180(1000 @33 dBm) na na 32 GFN 16SKYWORKS SKY65111-348LF 0,8-1GHz 37? 3,2 200 (1300@33 dBm) na na 32 QFN 16
HitTite HMC453QS16G 0,4-2.2GHz 15 5 730 @32 dBm 8,5 49 32 QSOP16GASB AS621SW DC-3GHz 30 5 930 11 48 33 SO8- AMP
TRIQUENT AH322 0,4-3,2 GHz 20 5 500 (800@30 dBm) na 49 33,5 SO8- AMPMACOM MAAP-007649-000100 0,8-1GHz 19 7,5 540 49 34 QFN 16
TRIQUENT AH420 0,4-2,9 GHz 16 5 800 (1200@33 dBm) na 49 35 12 Pin DFN
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Passive components capacitors
Capacitors
Capacitors are non ideal components
Used to block noise
Matching for UHF
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Passive components Inductors
Inductors
Inductors are non ideal components too
Usage–Supply of PA
–Matching for UHF
Wired inductors –higher Q
–higher power
–danger of instability
Ceramic inductors –lower costs
P S
T1
XFMR_TCML1-116 1
34
positive out
C2822pF
L63n3
L339n
C20
47pF
C21
47pF
C39
10uF
C295p6
L23n3
L539n
C1222pF
C135p6
C35
n.c.
C18n.c.
C38
100n 50R-track
negative out
Supply voltage of power amplifier
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Loop filter components
100p //
15p
4n718k33p //
330p
9k1External
VCO
100p4n720k330p10kInternal
VCO
C3C2R2C1R1
VCO bandwidth determined by:•KVCO•Charge pump current•Main divider N
basically 2nd order Wn = root(Icp.Kv/C.N)
The resistors effect the damping factorwider loop bandwidth, faster settling, but more noise and spurs, compromise
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Clock generation
Required accuracy: 10 ppm
1. Crystal;-
• need shunt capacitors for tuning
• temperature dependency
2. TCXO
• easy to source
• no shunt needed
• Cost are higher
U7
20MHz1 3
24 C19
24p
C22
24p
X2TCXO
VC
1O
UT
3
GND2
VDD4 3V3
C562u2
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Filter
Ceramic Filter
Available in 0603, 0805
S11 ( reflectivity for stability of PA)
Insertion loss (S21)
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Balun‘s
Balun� BALanaced Unbalanced
Transformer for differential to single ended
Impedance on one side
100:50…
S21 (Insertion loss)
S11 (return loss)
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Hardware Tips
•Keep tune line of VCO away from other signals as could be cause noise to VCO
•In RF lines avoid sharp turns.
•Allow enough ground plane for chip Antennas. Don’t put components on other side of the PCB as will
disturb the antenna
•Ground in extremely important. Avoid ground loop.
•Use longer leads on the QFN 64, so you have more solder tin.
•Use less solder tin on the exposed paddle. ( swimming effect)
•MCU lines should not cross the CD1,2, ADGm VCO, CP, COMPA...COMNB. This
will corrupt both, the TX spectrum and RX performance.
•using a LDO that blocks the Supply noise in front of the PA
•using a strong ground concept between the LDO, the PA and the UHF chip to minimize ground loop
induced noise.
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Some words on the Protocol
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TX protocol settings
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ALOHA anti collision
DEMO
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Logic analyzer
System debugging with OAD pins
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Tag memory
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GUI setup
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System training
Focus: Application training for UHF developers
Hardware:
general block diagram and needed external components.
passive components inclusive loop filter
crystal requirement
UHF specifics
matching network
balun
circulator / coupler
Power amplifier
layout rules
Guideline on hand solder a QFN64 device
What are the specific's on the reference designs and how they can help you to speed up the design
Software:
What the Software can do for us.- What are the features the are already integrated.
Layers of the Software
Host to reader Communication Interface commands
defines to tailor the Software
Needed steps for porting the software
GUI:
setup the compiler
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What the Software can do for us
FW Software Feature List
Modular setup
portable to Controller
change of communication Interface
Diagnosis functions Network analyzer, spectrum analyzer
Access, Lock, Kill, Read, Write commands included
Special commands from Tag chips vendors (NXP)
USB- HID, and UART Interface layer
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Layers of the Software
Link to Docu Index file
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Interface possibilities
no experience yet, Software questionable
Needs old fashioned Interface
Needs driver to be installed, unstable operation,
Difficult to program, New commands needs to be installed in the descriptor, low throughput ( 20 Tags/ sec)
very high throughput, no driver needed, WLAN can be integratedeasy programming
High throughput, easy programming,
Needs no driver easy for user very stable operation
EthernetUARTUSB UARTUSB HID
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Resources of Software
•Firmware provided by austriamicrosystems
–Features can be added on customer request
•Firmware provided by third party companies ( license model)
•GUI provided by austriamicrosystems
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Optional software License model based ARM-7
Step 1: Step 2: Step 3:
Licence Reader
Licence Dongle
Source: RF-
Embedded
UART
Upload Firmware
Firmware
Source: RFE FTP
Server
Use Reader
Reader Tag
PCB
Controller + boot loader
AS399x
Distributor
Licenscefrom dongle
UART
PC + update tool
UART, USB
Internet
PCB+ Bootlader+ Firmware
Vendor Customer
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Simplified flowchart of application layerMain.c
initialization
usbCommands()
selftest
usbCommands()
USB data packet
availible ?
callSendFirmwareHardwareID;
callSendDeviceInfo;
ccallResetCPU;
callAntennaPower;
callWriteRegister;
callReadRegister;
callInventory;
callSelectTag;
callWriteToTag;
callReadFromTag;
callLockUnlock;
callKillTag;
callNXPCommands;
callInventory6B;
callChangeFreq;
callInventoryRSSI;
end
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Host to Reader Interface
PayloadFrame LengthReport ID
Variable lengthByte 2Byte 1
0x38IN_READ_FROM_TAG
0x37OUT_READ_FROM_TAG
0x50IN_READ_FROM_TAG_6B_ID0x36IN_WRITE_TO_TAG
0x49OUT_READ_FROM_TAG_6B_ID0x35OUT_WRITE_TO_TAG
0x48IN_WRITE_TO_TAG_6B_ID0x34IN_SELECT_TAG
0x47OUT_WRITE_TO_TAG_6B_ID0x33OUT_SELECT_TAG
0x46IN_NXP_COMMAND0x32IN_INVENTORY
0x45OUT_NXP_COMMAND0x31OUT_INVENTORY
0x44IN_INVENTORY_RSSI0x1DIN_READ_REG
0x43OUT_INVENTORY_RSSI0x1COUT_READ_REG
0x42IN_CHANGE_FREQ0x1BIN_WRITE_REG
0x41OUT_CHANGE_FREQ0x1AOUT_WRITE_REG
0x40IN_INVENTORY_6B_ID0x18OUT_ANTENNA_POWER
0x3FOUT_INVENTORY_6B_ID0x16OUT_CPU_RESET
0x3EIN_KILL_TAG0x13IN_DEVICE_INFO
0x3DOUT_KILL_TAG0x12OUT_DEVICE_INFO
0x3CIN_LOCK_UNLOCK 0x11IN_FIRM_HARDW_ID
0x3BOUT_LOCK_UNLOCK0x10OUT_FIRM_HARDW_ID
valueReportvalueReport
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Defines to tailor the Software
System defines:
LEO, ROGER, ARNIE
LOWSUPPLY
EXTPA vs. INTPA, SINGLEINP vs. BALANCEDINP INTVCO vs. EXTVCO
RUN_ON_AS3992, UARTSUPPORT
AS399X_DO_SELFTEST
SERIALINTERFACE (SPI)
Memory usage:
EPCLENGTH, PCLENGTH, MAXFREQ, MAXTAG
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Needed steps to port the Software
1. Set the defines to system requirements
2. Exchange the micro controller specific code
• parallel port communication
• Host to reader protocol
3. Add the communication part
4. Strip down code to needs ( read write..) from app layer ( usb_commands.c)
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Our possibilities with reference design
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How we segmented the market
High PowerLow Power Mid Power
Leo RogerArnie
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Low Power Applications
Ticketing
Mobile Phones
UHF Printers
UHF Enabled PDA’s
E Passport/Ticket Scanners
Low Power Scanner
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Mid Power Applications
Library
Interactive Shopping Carts
Apparel
High Power Handheld
Access Control
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High Power Applications
Electronic Toll Control
Pallet Tracking
Car Parking
Portals
Container Tracking
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Reference Design Roadmap
H1/2008 H2/2008 H1/2010
LEO
Roger
Frank
Ready and being used in the market.
Ready to be shipped
1 W power output – 30 dBm
20 – 27 dBm out
Low cost, low power
Up to 20 dBm out
Modular approach
Circulator design
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Evaluation System content FrankDigital board
–Microcontroller, USB Interface
–LCD
Analogue board–Circulator, VCO, power amplifier
Software package–PC control Software
–Firmware source code
–Application note
Additional equipment–Main power adapter
– 6 dBi gain Patch Antenna
–Chip Antenna
–Antenna cable
–2 EPC GEN2 tags
CDROM Documentation–Application note
–Demo board schematic
–Software description
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LEO and ROGER
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Features of Demo board
Modular approach with a controller board and an analogue board
Digital board enables:–USB Interface to a PC Software
–Simple hardware adaptation to own controller platform
–Simple firmware adaptation due example based on TI-MSP 430
Several options on analogue board possible–Optional VCO
–Optional Power Amplifier
–Optional Circulator
–Optional TXCO
Equipped with optional VCO, TXCO, Power Amplifier and Circulator