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Turnkey IC and Device Packaging
Package Science Services LLC
Package design, characterization,
simulation, modeling, measurements and
analysis
Package Science Services Mission
Our mission is to provide best-in-class technical services for packaging of high technology single and multi-chip integrated circuits and discrete devices from concept through mass production using our extensive inventory of hardware and software tools and copious experience in microelectronic and technology package engineering.
PSS can help to provide a solution for a broad array of design and performance problems.
Expert packaging, design, materials and supply chain personnel are on board to completely support the packaging process and work with your device and engineering staff to match your needs with the right package and supplier for your prototype and volume IC packaging needs. Our goal is to serve semiconductor companies that need a knowledgeable, veteran staff to take the worry and learning curve out of packaging complex products.
Need developmental or prototype packaging? Let PSS help you with engineering lots to provide concepts and demonstrate performance.
PSS also supports services at any point in the packaging chain with a full array of software, hardware and measurement tools.
Package Science Services
PSS provides turnkey IC and technology packaging services. We can help to develop the right package with the right performance and cost in tandem with your chip design. We can take the process from concept to mass volume with industry experts who have been in the IC packaging business for three decades. We can reduce your learning curve and decrease time to market by supporting your packaging needs, allowing you to free up your internal resources for other critical tasks.
Package Science has the tools and staff to efficiently solve your IC packaging issues.
Turnkey support for all types of IC and discrete device packaging:
Package selection based on form factor, cost and performance criteria
Design and layout for wire bond, flip-chip, 3D, SIP, lead-frame and CSP
Single chip, multi-chip, discrete devices
Electromagnetic modeling, simulation and measurement tools
Thermal modeling, simulation and measurement tools
Material set selection, supply chain support
Assembly process development
Prototype assembly
Qualification / Reliability plan
Transfer to mass production
Failure analysis and physical deconstruction
www.pkgscience.com
Packaging for High Technology ProductsChip manufacturing has evolved to where simple, low-performance designs can be packaged in the millions and billions with high yield and extremely low cost
This presents the illusion that all packaging is simple and should be relatively easy and low cost
The old model of creating the device followed by packaging it is obsolete
Successful packaging of high technology devices requires consideration at the outset of the product design cycle
Concurrent design practices for the device and package are mandatory for high performance products
High-Frequency Electrical Measurement Probe Station
3287 Kifer RoadSanta Clara, CA 95051tel: +1-408-969-2388fax: +1-408-841-7597
email: [email protected]: www.pkgscience.com
