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User’s GuideTPA6304-Q1 Evaluation Module
Robert CliftonABSTRACT
This manual describes the operations of the TPA6304Q1EVM. The TPA6304Q1EVM is a stand-alone EvaluationModule (EVM). The PurePath™ Control Console 3 GUI (PPC3) is used to initialize and operate the EVM.
Table of Contents1 Required Equipment and Accessories:................................................................................................................................32 Hardware Overview................................................................................................................................................................ 4
2.1 TPA6304Q1 Evaluation Module Description...................................................................................................................... 42.2 TPA6304-Q1 Evaluation Module Functions....................................................................................................................... 5
3 Software Overview..................................................................................................................................................................63.1 PurePath™ Console 3 (PPC3) Access and Description.................................................................................................... 63.2 PurePath™ Console 3 – TPA6304Q1EVM Home Window................................................................................................83.3 PurePath™ Console 3 – TPA6304Q1EVM Register Map Window....................................................................................93.4 PurePath™ Console 3 – TPA6304Q1EVM Monitor & Control Window........................................................................... 10
4 TPA6304-Q1 Start Up............................................................................................................................................................ 114.1 TPA6304Q1EVM Setup....................................................................................................................................................114.2 TPA6304-Q1 Settings on Device Monitor & Control Window...........................................................................................124.3 TPA6304-Q1 Settings on Register Map Window............................................................................................................. 174.4 I2C Monitor Window.........................................................................................................................................................17
5 Board Layout, Schematic and Bill of Materials..................................................................................................................195.1 Board Layout....................................................................................................................................................................195.2 Schematic........................................................................................................................................................................ 215.3 Bill of Materials.................................................................................................................................................................24
Revision History.......................................................................................................................................................................28
List of FiguresFigure 2-1. TPA6304Q1EVM....................................................................................................................................................... 4Figure 2-2. EVM Block Diagram.................................................................................................................................................. 5Figure 3-1. PPC3 Download Window.......................................................................................................................................... 6Figure 3-2. PPC3 Window........................................................................................................................................................... 6Figure 3-3. Available Apps Window.............................................................................................................................................7Figure 3-4. PPC3 Downloading App............................................................................................................................................7Figure 3-5. PPC3 Installed Apps................................................................................................................................................. 8Figure 3-6. TPA6304Q1EVM Home Window...............................................................................................................................8Figure 3-7. TPA6304Q1EVM Register Map Window...................................................................................................................9Figure 3-8. TPA6304Q1EVM Device Monitor & Control Window.............................................................................................. 10Figure 4-1. TPA6304Q1EVM Connections................................................................................................................................ 11Figure 4-2. Device Monitor & Control Window...........................................................................................................................12Figure 4-3. Device State Control Section.................................................................................................................................. 12Figure 4-4. Master Mode/Slave Mode Section.......................................................................................................................... 13Figure 4-5. Channel Control Section......................................................................................................................................... 13Figure 4-6. Miscellaneous Control Section................................................................................................................................ 13Figure 4-7. Fault / Warning Signal Configuration Section..........................................................................................................14Figure 4-8. Faults / Warnings Section........................................................................................................................................14Figure 4-9. AC Load Diagnostics Section..................................................................................................................................15Figure 4-10. DC Load Diagnostics Section................................................................................................................................15
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TPA6304-Q1 Evaluation Module 1
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Figure 4-11. Spread Spectrum Control Section ........................................................................................................................ 15Figure 4-12. Register Map Window........................................................................................................................................... 17Figure 4-13. I2C Monitor Window - I2C Logging....................................................................................................................... 17Figure 4-14. I2C Monitor Window - I2C Logging....................................................................................................................... 18Figure 5-1. TPA6304Q1EVM Top.............................................................................................................................................. 19Figure 5-2. TPA6304Q1EVM Bottom.........................................................................................................................................20Figure 5-3. Schematic (Page 1).................................................................................................................................................21Figure 5-4. Schematic (Page 2).................................................................................................................................................22Figure 5-5. Schematic (Page 3).................................................................................................................................................23
List of TablesTable 5-1. Bill of Materials..........................................................................................................................................................24
TrademarksPurePath™ is a trademark of Texas Instruments.All other trademarks are the property of their respective owners.
Trademarks www.ti.com
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1 Required Equipment and Accessories:1. TPA6304Q1EVM2. USB A male to micro B male cable3. Power Supply Unit (PSU) up to 18 V, 6 A capable4. 1-4 resistive loads or speaker loads5. 2-6 pair of wires stripped both ends6. 2-mm slotted screwdriver7. 1-4 RCA cables
www.ti.com Required Equipment and Accessories:
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2 Hardware Overview2.1 TPA6304Q1 Evaluation Module DescriptionThe TPA6304Q1EVM is a stand-alone EVM. USB adapter is provided for a more thorough evaluation of thedevice. Figure 2-1 shows the EVM board.
Figure 2-1. TPA6304Q1EVM
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Figure 2-2 shows the TPA6304Q1EVM signal flow:
3.3-V
LDO
3.3 V
4.5- to 18-V
Input4.5-18 V
TPA6304
2nd
ORDER LC
FILTER
2nd
ORDER LC
FILTER
LED
Differential
Outputs
VBAT
XMOS GPIO
I2C
USBExternal
Audio
Input SHUTDOWN
GPIO2
GPIO1
FAULT
USB (I2C)
Single-ended
Inputs
ANALOG
DC Blocking
Capacitors
1+
2+
3+
4+
INREF
GND
Figure 2-2. EVM Block Diagram
2.2 TPA6304-Q1 Evaluation Module Functions• There are two switches
– Standby switch puts the device on or out of standby.– XMOS Disable switch enables or disables the onboard XMOS.
• The board has 8 jumpers
– J3 enables or disables the onboard XMOS.– J5 allows VBAT to be supplied by PVDD or another power supply.– J11 ties INREF to GND.– J12 and J13 allow for external I2C controller to run I2C commands the the TPA6304-Q1.– J14, J15, and J16 allow multiple input channels to be tied to the same input source.
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3 Software Overview3.1 PurePath™ Console 3 (PPC3) Access and DescriptionPPC3 is a server-based tool. Request access at PUREPATHCONSOLE: PurePath Console GraphicalDevelopment Suite for Audio System design and Development. Once approval is given, download the softwarefrom Texas Instruments mySecure Software site.
Figure 3-1. PPC3 Download Window
Run the installation program. Also download the PPC3 User Manual (slou408) for further instructions.
Figure 3-2 shows the window displayed when first running PPC3. Click Sign in to see TPA6304 EVM application.
Figure 3-2. PPC3 Window
Different Apps might be displayed in Figure 3-3 depending on the user's access.
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Figure 3-3. Available Apps Window
Click the TPA6304 EVM App box to download the TPA6304-Q1 application. An Installation window appears, nextclick Install. Figure 3-4 shows the downloading progress of the application.
Figure 3-4. PPC3 Downloading App
The TPA6304 EVM box appears in the Installed EVM Apps section, see Figure 3-5. Click the TPA6304 EVM boxto launch the TPA6304 EVM App.
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Figure 3-5. PPC3 Installed Apps
3.2 PurePath™ Console 3 – TPA6304Q1EVM Home WindowThere are three windows available with the TPA6304Q1EVM PPC3: Home Window, Register Map Window, andDevice Monitor & Control Window. When the TPA6304Q1EVM PPC3 is launched, the Home Window displays(see Figure 3-6). If the EVM is powered on and the USB is connected to the PC, the Home Window displays theConnect box in the bottom left hand corner. If the EVM is not powered on or the USB is not connected, onlyTPA6304Q1EVM – Offline is displayed.
Figure 3-6. TPA6304Q1EVM Home Window
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3.3 PurePath™ Console 3 – TPA6304Q1EVM Register Map WindowClick on the Register Map Box in the Home Window to display the Register Map Window. The Register Mapindicates the current setting of all the registers in the TPA6304-Q1 device.
Figure 3-7. TPA6304Q1EVM Register Map Window
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3.4 PurePath™ Console 3 – TPA6304Q1EVM Monitor & Control WindowClick on Device Monitor & Control box in the Home Window to display Device Monitor & Control window.
Figure 3-8. TPA6304Q1EVM Device Monitor & Control Window
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4 TPA6304-Q1 Start UpThis section describes the TPA6304-Q1 start up procedure. Have all the equipment and accessories listed onthe first page of this document available.
4.1 TPA6304Q1EVM Setup
Figure 4-1. TPA6304Q1EVM Connections
Hardware and software connections:
• Desktop or laptop PC running Windows 7 or 10, open PPC3 GUI• Connect 14.4-VDC PSU to the TPA6304Q1EVM• Connect speakers or resistive loads to the TPA6304Q1EVM• Connect USB micro cable from the PC to the EVM• Set the STANDBY switch to down position and the XMOS DISABLE switch to the up position• Turn on the PSU• Connect the audio source – this can be a 3-mm stereo connector connected from the PC to the EVM as
shown in Figure 4-1• At this point, 3.3V LED, and USB-LOCK LED are on• On the PPC3 window, launch the TPA6304Q1EVM application
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• Click Connect at the bottom left corner of the window• Click Device Monitor & Control• Click on Play at the top left corner of the window• On the PC make sure the volume level is set as desired• On the EVM, first switch up the STANDBY switch• The audio can now be streamed to the speakers
4.2 TPA6304-Q1 Settings on Device Monitor & Control WindowMost of the register settings are done on the Device Monitor & Control window. The TPA6304-Q1 Register Mapwindow is for reference.
Click the CONNECT button on the bottom left corner of the TPA6304Q1EVM application window, see Figure 3-6.The LED next to the TPA6304Q1EVM changes from gray to green and the CONNECT button changes to aDISCONNECT button.
Click on the TPA6304-Q1 Device Monitor & Control box, the window should now display Figure 4-2.
Figure 4-2. Device Monitor & Control Window
This window has 8 major sections: the Device State Control section, Channel Control section, MiscellaneousControl section, Fault / Warning Signal Configuration section, Faults and Warnings section, AC Load Diagnosticssection, DC Load Diagnostics section, and Spread Spectrum Controls section.
4.2.1 Device State Control Section
This section allows the user to control all 4 channels at the same time instead of changing one channel at a time.When Hi-Z is selected, all 4 channels are put in Hi-Z. The display for each channel in the channel control sectionreflects these button selections.
Figure 4-3. Device State Control Section
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To the right hand side of the Device State Control section is the Master/Slave Mode Selector switch. The defaultstate of the device is Master Mode.
Figure 4-4. Master Mode/Slave Mode Section
4.2.2 Channel Control Section
Each channel has the same setting selections: Hi-Z, Mute, Play, Gain, Line Output mode and Speaker mode.
The drop down menu allows the user to select either Hi-Z, Mute or Play Mode for each channel.
The default gain for each channel is 28 dB. The other gain options are 10 dB, 16 dB and 22 dB. If another gain isneeded, select the button to the corresponding gain.
The default setting for each channel is Speaker mode. If Line Output is used select the Line Output button.
Figure 4-5. Channel Control Section
4.2.3 Miscellaneous Control Section
There are miscellanous settings that are available on the GUI for easy access (see Figure 4-6).
Figure 4-6. Miscellaneous Control Section
This device supports parallel bridged-tied load operations. Channels 1 and 2 can be one PBTL channel andchannels 3 and 4 can be the other. Before setting the channels to PBTL mode, connect the (+) terminals ofchannels 1 and 2 and/or channels 3 and 4. Then connect the same channels together for their respective (-)terminals. The device needs to be in standby before reconfiguring the output to PBTL.
The Clip Detect can be set to either disable or enable, with disable being the default setting.
The overcurrent (OC) has four level that can be changed via the drop-down menu in the OC box. The defaultlevel is 1.
Overtemperature warning (OTW) can be programed using the pull-down menu to choose the OTW temperature.The default setting is 130°C.
The output switching frequency (FSW) or Pulse Width Modulation (PWM) frequency is set at 2.1 MHz. The pull-down menu on the Frequency box is used to change the PWM to 384kHz, 576kHz, and 2.3MHz.
Another feature this device has is being able to adjust at what THD level the clip detect goes off. The pull-downmenu on the Clip Level box allows the user to set the detect threshold to go off at either 1% THD, 2% THD, 3%THD or 10% THD. 1% THD is the default value.
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PWM Mode allows the user to choose between a BD modulation scheme or a BDHE/1SPW modulation scheme.BD modulation is the default value.
GPIO 1 and GPIO 2 pull-down menus have the same configuration options but are for their respective pins.Each one can be used to output specific signals or as inputs depending on the setting chosen. The states thatcan be selected for GPIO 1 and GPIO 2 are the following: Hi-Z, WarningZ, FaultZ, Clip Detect 1, Clip Detect 2,Sync Out, DVDD, GND, Sync In, and Mute Z. WarningZ and FaultZ are the Warning and Fault output signalsand the MuteZ setting allows the device to have a hardware control mute pin. Default setting is Hi-Z for bothGPIO 1 and GPIO 2.
The final part of the Miscellaneous Controls section is the Fault Pin pull-down menu. This changes thecorresponding device fault pin. It can be selected to read out either FaultZ, WarningZ, Clip Detect 1 or ClipDetect 2. FaultZ is the default setting.
4.2.4 Fault / Warning Signal Configuration Section
This section controls what the Fault and Warning signals report when selected. To get to this section click the
icon on the top right of the Miscellaneous Control Section. This changes the display to show Figure 4-7.
Figure 4-7. Fault / Warning Signal Configuration Section
The Warning signal can be set to report when a Clip, Invalid Clock, Overtemperature Shutdown (OTSD), PowerFault, overtemperature warning (OTW), Temperature Gain Foldback (TGFB), or ILimit event is triggered. Bydefault, Warning does not have any event selected.
The Fault signal can be set to report when a Protective Shutdown, Invalid Clock, OTSD, Power Fault, DC faultdetection, Overcurrent (OC), or ILimit event is triggered. By default the Fault signal will report a fault only when aDC, OC, or ILimit event is detected.
4.2.5 Faults / Warnings Section
The top right buttons on the Faults / Warnings box serve as controlling and monitoring faults. Clip enable routethe clip detection bit to the warning pin. This is displayed as a yellow LED on the EVM. Thermal enable route theovertemperature warning bit to the warning pin. This is displayed as the same yellow LED on the EVM. TheClear button clears all the faults and warnings. The Read button manually read the faults and warnings.
Figure 4-8. Faults / Warnings Section
4.2.6 AC Load Diagnostics Section
The AC load diagnostics report speaker impedance and phase. The diagnostics can be performed with one or allfour channels.
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Figure 4-9. AC Load Diagnostics Section
Select the correct output impedance and click the Start > button. Follow the pop up instructions to run the loaddiagnostics.
Click on the icon located on the top right of the AC load diagnostics box to see the results.
4.2.7 DC Load Diagnostics Section
The DC load diagnostics report if a channel's output is short to power, short to ground, short to load, or open.
Figure 4-10. DC Load Diagnostics Section
Select the impedance of the load from 0.5 to 5 Ω. Click "Start >" and then click the icon on the top right ofthe box to view results.
4.2.8 Spread Spectrum Control Section
The Spread Spectrum Controls Section allows the user to control features related to spread spectrum andmanaging electromagnetic conductivity/interference.
Figure 4-11. Spread Spectrum Control Section
By default, spread spectrum is enabled. This can be disabled by clicking on the Spread Spectrum Enabledbutton. To re-enable, simply click the box again.
Another button found in this section is the Automatic Channel Phasing. By default Automatic Channel Phasing isdisabled but can be enabled the same way as Spread Spectrum is.
The three drop-down menus, Dephase Ch2 to Ch1, Dephase Ch3 to Ch1, and Dephase CH4 to Ch1, all controlthe channels output phases from each other. Each can be set to be either 0 degrees, 45 degrees, 90 degrees,
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135 degrees, 180 degrees, 225 degrees, 270 degrees or 315 degrees out of phase from channel 1. The defaultvalues for Dephase Ch2 to Ch1, Dephase Ch3 to Ch1, and Dephase CH4 to Ch1 are 180 degree, 90 degree,and 270 degree, respectively.
TPA6304-Q1 Start Up www.ti.com
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4.3 TPA6304-Q1 Settings on Register Map WindowSelect a particular register then double click on any bit, that isn't reserved, and the bit changes state. This stateis executed at the end of the click.
Figure 4-12. Register Map Window
4.4 I2C Monitor WindowThe PPC3 has an I2C monitor and also configuration program options (see Figure 4-13).
Figure 4-13. I2C Monitor Window - I2C Logging
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When this window is first open, the round button is green. To record I2C commands, click on this button to turn itred. This button can be clicked again to stop recording I2C commands. Doing this will turn the button back togreen. The recording can be saved for later use by clicking the save icon.
The I2C commands can also be copied to the clip board by clicking the icon next to trash bin icon.
Figure 4-14. I2C Monitor Window - I2C Logging
A set of I2C commands can be loaded and executed from this window. On the top right corner, click on the I/Obutton to display the window in Figure 4-14. Write I2C commands here, or open an existing *.cfg file then clickthe Execute button on the bottom left corner of the I2C Monitor window. The I2C commands are sent to thedevice when the Execute button is pressed.
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5 Board Layout, Schematic and Bill of Materials5.1 Board Layout
Figure 5-1. TPA6304Q1EVM Top
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Figure 5-2. TPA6304Q1EVM Bottom
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5.2 Schematic
GND
47.0kR25
GND
1.0V
GND
1.0V
GND
1.0V
GND
1.0V
GND
1.0V
GND
1.0V
GND
1.0V
GND
1.0V
GND
1.0V
GND
1.0V
GND
1.0V
GND
1.0V
GND
1.0V
GND
1.0V
3.3V
SN74LVC2G07DSFR
1A1
GND2
2A3
2Y4
VCC5
1Y6
U6
3.3V
VDDIOL6
VDD11
VDDIOL14
VDD16
VDD17
VDDIOL19
VDD24
VDDIOL29
VDD36
VDD41
VDDIOL42
VDDIOR52
VDD56
VDD60
NC65
VDDIOR67
VDD73
VDDIOR78
VDD80
VDD81
VDDIOR83
VDD87
VDDIOR92
VDD101
VDD102
PLL_AVDD103
PLL_AGND104
OTP_VCC105
VDDIOT110
VDDIOT111
VDD120
USB_VDD3344
USB_VDD49
NC50
VDD126
PAD129
U4E
XE216-512
3.3V 1.0V
3.3V
1.0V
4.75R7
GND
X0D363
X0D374
X0D385
X0D397
X0D408
X0D419
X0D4210
X0D4312
X0D0127
X0D1028
X0D0030
X0D0431
X0D1132
X0D0533
X0D0634
X0D0735
X0D0237
X0D0338
X0D0839
X0D0940
X0D1457
X0D1558
X0D2059
X0D2161
X0D1262
X0D1363
X0D2264
X0D2366
X0D1668
X0D1769
X0D1870
X0D1971
X0D2488
X0D2589
X0D3490
X0D3591
X0D2693
X0D2794
X0D3295
X0D2896
X0D3397
X0D2998
X0D3099
X0D31100
U4A
XE216-512
1.00kR13
3.3V
GND
3.3V
GND
3.3V
GND
3.3V
GND
3.3V
GND
3.3V
GND
3.3V
GND
3.3V
GND
3.3V
GND
3.3V
GND
3.3V
GND
3.3V
GND
3.3V
GND
3.3V
X-SCL
X-SDA
GND
3.3V
USB_D_P
USB_D_M
USB_ID
VBUS_IN
X1D3513
X1D3615
X1D3718
X1D3820
X1D1825
X1D1926
X1D1451
X1D1553
X1D2054
X1D2155
X1D0272
X1D0374
X1D0475
X1D0576
X1D0677
X1D0779
X1D0882
X1D0984
X1D0085
X1D0186
X1D41107
X1D42108
X1D43109
X1D40106
X1D26112
X1D27113
X1D28114
X1D29115
X1D30116
X1D31117
X1D32118
X1D33119
X1D3921
X1D1622
X1D1723
X1D10121
X1D11122
U4B
XE216-512
3.3V25.5kR22
1.0V
51.0kR24
10.0kR23
3.3V
GNDGND
GND
10.0kR17
10.0kR18
X-24M
2.2uF10V
C57
GND USB I/O
GN
D-U
SB
USB_ID43
USB_VBUS45
USB_DP46
USB_DM47
USB_RTUNE48
U4C
XE216-512
43.2R15
GND
GND
X-TCKX-TMS
X-TDOX-TDI
X-TRSTN X-RSTN
TRST123
RST124
CLK125
TMS127
TCK128
TDO1
TDI2
U4D
XE216-512
X-24M
X-TCKX-TMS
X-TDOX-TDI
X-RSTN
TRST
XMOS AND I/Os
0R11
JTAG CLOCK GENERATION
GND
3.3V
GND
3.3V
GND
3.3V
1
2
3
4
5
6
J9
JTAG
GNDX-TDI
X-TMS
X-TCK
X-TDO
X-TRSTN
VBUS-XMOS
TODUT
GND
24MHz
VDD4
OE/STANDBY1
GND2
OUT3
Y13.3V
GND
33.2
R21
BlueD4 USB RDY
680
R8
3.3V
3.3V
GND
X-HS-EN
10.0k
R10
GND
3.3V
SN74AVC2T244DQMR
VCCA1
A12
A23
GND5
B26
B17
OE4
VCCB8
U9
GND GND
3.3V
X-MCLK33.2
R19
X-SCL
X-SDA
GND
3.3V to 1.8V LDO1.8V3.3V
1uF6.3V
C54
GND
GND GND
GND
1.8V1.8V
X-MCLK
X-MCLK
GND
XIN/CLK
GND
3.3V
GND
3.3V
GND GND
1.8V 1.8V
TPS62085RLTR
EN1
PG2
FB3
VOS4
GND5
SW6
VIN7
U2
40.2kR3
162kR4
1.00M
R12
3.3V to 1V BUCK LDO
1.0V
GND
GND
GND
GND GND
3.3V
10V10uFC53
10.0kR20
3.3V
TPS73618DBVR
IN1
GND2
EN3
NR/FB4
OUT5
U8
TPS3897ADRYR
ENABLE1
GND2
SENSE3
SENSE_OUT4
CT5
VCC6
U5
J3
HS-EN
XIN/CLK1
S02
VDD3
VCTR4
GND5
VDDOUT6
VDDOUT7
Y38
Y29
GND10
Y111
SCL/S212
SDA/S113
XOUT14
CDCE913PWR
U7
X-24M
10.0kR9
GND
L12
22µF10V
C7822µF10V
C79
GPIO2
GPIO1
FAULT
6
4
5
S2
XMOS DISABLE
GND
16V0.01uF
C55
50V470pF
C58
0.1uFC32
0.1uFC68
0.1uFC56
0.1uFC81
0.1uFC60
0.1uFC61
0.1uFC82
0.1uFC62
0.1uFC80
0.1uFC110
0.1uFC38
0.1uFC74
0.1uFC75
0.1uFC76
0.1uFC77
0.1uFC69
0.1uFC70
0.1uFC71
0.1uFC44
0.1uFC72
0.1uFC73
0.1uFC43
0.1uFC42
0.1uFC41
0.1uFC36
0.1uFC96
0.1uFC95
0.1uFC94
0.1uFC93
0.1uFC92
0.1uFC91
0.1uFC90
0.1uFC89
0.1uFC88
0.1uFC87
0.1uFC86
0.1uFC85
0.1uFC84
VBUS1
D-2
D+3
ID4
GND5
678
11
10
9
J10
L10
470nH
Figure 5-3. Schematic (Page 1)
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TPA6304-Q1 Evaluation Module 21
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GND
GND
SCLSDA
FAULT
SDA
SCLX-SCL
X-SDA
I2CFROMXMOS
GND GND
GND
IN_REF
6.3V1uFC9
IN_4PIN_3PIN_2PIN_1P
GND
GND
GND
GND
GND
GND
GND
GND
OUT_4POUT_4M
OUT_3POUT_3M
OUT_2POUT_2M
OUT_1POUT_1M
BST4+
BST4-
BST3+
BST3-
BST2+
BST2-
BST1+
BST1-
OUT_4P
OUT_4M
OUT_3P
OUT_3M
OUT_2P
OUT_2M
OUT_1P
OUT_1M
OUT4+
OUT4-
OUT3-
OUT2+
OUT2-
OUT1+
OUT1-
1uF50V
C26
1uF50V
C33
1uF50V
C7
1uF50V
C40
1uF50V
C21
1uF50V
C25
1uF50V
C27
1uF50V
C28
INPUTS
IN_2P
IN_1P
IN_4P
IN_3P
STANDBY
GPIO1GPIO2
GPIO1
GPIO2
FAULT
3.3V
VBAT
0.1uF50V
C35
PVDD
GND
OUT4+OUT4-OUT3+OUT3-
GND
50V0.01uFC45
GND
50V0.01uFC46
GND
50V0.01uFC47
GND
50V0.01uFC48
GND
50V0.01uFC49
GND
50V0.01uFC50
GND
50V0.01uFC51
GND
50V0.01uFC52
PVDDTP3
4+
3+
2+
1+
0.1uF50V
C22
J11
GND INREF
INREF
GND
INREF
INREF
INREF
TP7
IN4+
TP8
IN3+
TP9
IN2+
TP10
IN1+
TP11
IN-REF5
4
1
2
3
6
7
8
J8
Output
OUT2+OUT2-OUT1+OUT1-
TP12
FAULT
TP13
GPIO2
TP14
GPIO1
FAULT
GPIO2
GPIO1
4.99k
R16
3.3V
YellowD2 GPIO2
RedD3 FAULT
YellowD5 GPIO1
4.99k
R2
3.3V
4.99k
R28
3.3V
0R26
1nFC99
0R27
0R33
0R34
GND
1nFC97
GND
1nFC34
GND
1nFC24
GND
6
4
5
S1
STANDBY
3.3V
GND
4.99k
R14
3.3R37
0.01uFC103
GND
3.3R36
0.01uFC102
GND
3.3R38
0.01uFC104
GND
3.3R39
0.01uFC105
GND
3.3R40
0.01uFC106
GND
3.3R41
0.01uFC107
GND
3.3R42
0.01uFC108
GND
3.3R43
0.01uFC109
GND
10.0kR29
10.0kR30
10.0kR31
10.0kR32
GND
0.1uF50V
C6
GND
GNDGND
0.1uF50V
C30
16V 1uFC13
GND
1nFC101
GND
0R35
GPIO119
IN_4P9
IN_3P10
SDA16
FAULT18
GND4
GND21
AVDD6
SCL15
IN_2P11
IN_1P12
STANDBY17
IN_REF8
GVDD5
BST_1P27
GND42
GND25
OUT_1P26
OUT_1M24
DVDD14
VBAT3
PVDD22PVDDQ
2PVDD1
GND30
GND37
AVDD_RET7
GND13
GPIO220
OUT_2P31
OUT_3P 38
OUT_4P43
OUT_2M29
OUT_3M36
OUT_4M 41
BST_1M23
BST_2M28
BST_2P32
BST_4P 44
BST_4M40
BST_3M35
BST_3P39
PVDD33
PVDD34
U1
TPA6304Q1DDV
1µF16VC8
1µF16VC10
1µF16VC39
1µF16VC14
1µF16VC16
1µF16VC19
1µF16VC20
1µF16VC23
H9HeatSink
GND
1 2 3
J12 SCL
GND
1 2 3
J13 SDA
GND
1
2J2
IN4+
1
2J4
IN2+
1
2J6
IN3+
1
2J7
IN1+
2.20kR5
3.3V
2.20kR6
3.3V
1
2
J16
1
2
J15
1
2
J14
1µF50V
C29
1µF50V
C5
1
1µF50V
C18
3.3uH
L1
3.3uH
L2
3.3uH
L3
3.3uH
L4
3.3uH
L5
3.3uH
L6
3.3uH
L7
3.3uH
L8
470nFC17
470nFC31
470nFC37
470nFC98
2.2µFC100
2.2µF16VC15
0.1uFC59
Figure 5-4. Schematic (Page 2)
Board Layout, Schematic and Bill of Materials www.ti.com
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GNDGNDGND GND
1.50k
R1
GND
3.3V
GreenD1 3.3V
VBATPVDD
1
2
J5
VBAT
TP13.3V
TP2GND
GND
TP4GND
GND
TP5GND
GND
TP6GND
GND
VIN
GND
VIN RANGE
4.5-18VDC
GNDGND GND GND
3.3V
3.3V-VR
GND
100uF10V
C11
VBAT
IN3
OUT2
1
GND
U3LM1086IT-3.3/NOPB
GND
4700pF100V
C66
GND
4700pF100V
C64
PVDD
L11
1
2
3
4
J1
VIN 35V470uFC4
GND
GND
L9
150nH
2.2nF50V
C3
50V4.7µFC1
8.2nF50V
C2
100nF50V
C67
6.8nF50V
C656.8nF50V
C63
35V10uFC83
0.1uFC12
Figure 5-5. Schematic (Page 3)
spacer
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TPA6304-Q1 Evaluation Module 23
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5.3 Bill of MaterialsTable 5-1. Bill of Materials
Designator Qty Value Description Package Reference Part Number Manufacturer
C1 1 4.7uF CAP, CERM, 4.7 µF, 50 V,+/- 20%, X7R, AEC-Q200 Grade 1, 1210 1210 UMK325B7475MMHT Taiyo Yuden
C2 1 8200pF CAP, CERM, 8200 pF, 50 V, +/- 10%, X7R, AEC-Q200 Grade 1, 0603 0603 GCD188R71H822KA01D MuRata
C3 1 2200pF CAP, CERM, 2200 pF, 50 V, +/- 10%, X7R, 0603 0603 C0603X222K5RACTU Kemet
C4 1 470uF CAP, AL, 470 uF, 35 V, +/- 20%, 0.03 ohm, TH RCAP, 8x20mm EEU-FR1V471LB Panasonic
C5, C18, C29 3 1uF CAP, CERM, 1 µF, 50 V,+/- 10%, X7R, AEC-Q200 Grade 1, 0805 0805 08055C105K4Z2A AVX
C6, C12, C22, C30, C32,C35, C36, C38, C41, C42,C43, C44, C56, C59, C60,C61, C62, C68, C69, C70,C71, C72, C73, C74, C75,C76, C77, C80, C81, C82,C84, C85, C86, C87, C88,C89, C90, C91, C92, C93,C94, C95, C96, C110
44 0.1uF CAP, CERM, 0.1 uF, 50 V, +/- 10%, X7R, 0402 0402 C1005X7R1H104K050BB TDK
C7, C21, C25, C26, C27,C28, C33, C40
8 1uF CAP, CERM, 1 uF, 50 V, +/- 10%, X7R, 0603 0603 UMK107AB7105KA-T Taiyo Yuden
C8, C10, C13, C14, C16,C19, C20, C23, C39
9 1uF CAP, CERM, 1 uF, 16 V, +/- 10%, X7R, AEC-Q200 Grade 1, 0603 0603 GCM188R71C105KA64D MuRata
C9 1 1uF CAP, CERM, 1 uF, 6.3 V,+/- 10%, X7R, 0402 0402 GRM155R70J105KA12D MuRata
C11 1 100uF CAP, AL, 100 uF, 10 V, +/- 20%, 0.44 ohm, SMD 6.3x5.8 UUD1A101MCL1GS Nichicon
C15 1 2.2uF CAP, CERM, 2.2 uF, 16 V, +/- 10%, X7R, 0603 0603 EMK107BB7225KA-T Taiyo Yuden
C17, C31, C37, C98 4 0.47uF CAP, CERM, 0.47 uF, 25 V, +/- 10%, X7R, AEC-Q200 Grade 1, 0603 0603 CGA3E3X7R1E474K080AB TDK
C45, C46, C47, C48, C49,C50, C51, C52
8 0.01uF CAP, CERM, 0.01 uF, 50 V, +/- 5%, C0G/NP0, AEC-Q200 Grade 1, 0603 0603 CGA3E2C0G1H103J080AA TDK
C53 1 10uF CAP, CERM, 10 uF, 10 V, +/- 20%, X5R, 0603 0603 C1608X5R1A106M080AC TDK
C54 1 1uF CAP, CERM, 1 uF, 6.3 V, +/- 20%, X7R, 0402 0402 GRM155R70J105MA12D MuRata
C55 1 0.01uF CAP, CERM, 0.01 uF, 16 V, +/- 10%, X7R, 0402 0402 885012205031 Wurth Elektronik
C57 1 2.2uF CAP, CERM, 2.2 uF, 10 V, +/- 10%, X7R, 0603 0603 GRM188R71A225KE15D MuRata
C58 1 470pF CAP, CERM, 470 pF, 50 V, +/- 10%, X7R, AEC-Q200 Grade 1, 0402 0402 CGA2B2X7R1H471K050BA TDK
C63, C65 2 6800pF CAP, CERM, 6800 pF, 50 V, +/- 10%, X7R, 0603 0603 C0603C682K5RACTU Kemet
C64, C66 2 4700pF CAP, CERM, 4700 pF, 100 V, +/- 5%, C0G/NP0, 0603 0603 C0603C472J1GAC7867 Kemet
C67 1 0.1uF CAP, CERM, 0.1 uF, 50 V, +/- 10%, X7R, 0603 0603 885012206095 Wurth Elektronik
C78, C79 2 22uF CAP, CERM, 22 µF, 10 V,+/- 10%, X7R, 1206 1206 CL31B226KPHNFNE Samsung Electro-Mechanics
C83 1 10uF CAP, CERM, 10 uF, 35 V, +/- 10%, X7R, 1206 1206 C3216X7R1V106K160AC TDK
C100 1 2.2uF CAP, CERM, 2.2 uF, 25 V, +/- 10%, X7R, AEC-Q200 Grade 1, 0805 0805 CGA4J3X7R1E225K125AB TDK
D1 1 Green LED, Green, SMD LED_0603 150060GS75000 Wurth Elektronik
Board Layout, Schematic and Bill of Materials www.ti.com
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Table 5-1. Bill of Materials (continued)Designator Qty Value Description Package Reference Part Number Manufacturer
D2, D5 2 Yellow LED, Yellow, SMD LED_0603 150060YS75000 Wurth Elektronik
D3 1 Red LED, Red, SMD LED_0603 150060RS75000 Wurth Elektronik
D4 1 Blue LED, Blue, SMD LED_0603 150060BS75000 Wurth Elektronik
H1, H2, H3, H4 4 MACHINE SCREW PAN PHILLIPS 4-40 Machine Screw, 4-40, 1/4 inch PMSSS 440 0025 PH B&F Fastener Supply
H5, H6, H7, H8 4 ROUND STANDOFF 4-40 ALUM 1/2" ROUND STANDOFF 4-40ALUM 1/2 inch
2027 Keystone
H9 1 Heat Sink, Aluminum, 0.25" Corner, Used for TPA63xxEVM Boards Heatsink HeatSink_TAS54xxPHD Any Machine Shop
J1 1 Terminal Block, 4x1, 5.08mm, TH 4x1 Terminal Block 39544-3004 Molex
J2, J4, J6, J7 4 RCA Jack, 1Pos, Tin, R/A, TH RCJ Jack, 1Pos, R/A, TH RCJ-041 CUI Inc.
J3, J5, J11, J14, J15, J16 6 Header, 100mil, 2x1, Gold, TH Sullins 100mil, 1x2, 230 milabove insulator
PBC02SAAN Sullins ConnectorSolutions
J8 1 Terminal Block, 3.5mm, 8x1, Tin, TH Terminal Block, 3.5mm, 8x1,TH
393570008 Molex
J9 1 Receptacle, 50mil, 6x1, Gold, R/A, TH 6x1 Receptacle LPPB061NGCN-RC Sullins ConnectorSolutions
J10 1 Connector, Receptacle, Micro-USB Type AB, R/A, Bottom Mount SMT 5.6x2.5x8.2mm 475890001 Molex
J12, J13 2 Header, 100mil, 3x1, Gold, TH 3x1 Header TSW-103-07-G-S Samtec
L1, L2, L3, L4, L5, L6, L7,L8
8 3.3uH 3.3µH Shielded Wirewound Inductor 2.9A 0.058Ohm Max Nonstandard SMT_IND_4MM0_4MM0 ASWPA4035S3R3MT Sunlord
L9 1 FIXED IND 150NH 16A 4.1 MOHM SMD SMD2 SRP5015TA-R15Y Bourns
L10 1 FIXED IND 470NH 2A 52 MOHM SMD SMD2 NRV2010TR47NGFV Taiyo Yuden
L11 1 180 ohm Ferrite Bead, 180 ohm @ 100 MHz, 3.4 A, 0806 0806 NFZ2MSM181SN10L MuRata
L12 1 600 ohm Ferrite Bead, 600 ohm @ 100 MHz, 2 A, 0805 0805 MPZ2012S601AT000 TDK
R1 1 1.50k RES, 1.50 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 RMCF0402FT1K50 Stackpole ElectronicsInc
R2, R16, R28 3 4.99k RES, 4.99 k, 1%, 0.063 W, 0402 0402 RC0402FR-074K99L Yageo America
R3 1 40.2k RES, 40.2 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0402 0402 ERJ-2RKF4022X Panasonic
R4 1 162k RES, 162 k, 1%, 0.1 W, 0603 0603 RC0603FR-07162KL Yageo
R5, R6 2 2.20k RES, 2.20 k, 1%, 0.063 W, 0402 0402 RC0402FR-072K2L Yageo America
R7 1 4.75 RES, 4.75, 1%, 0.1 W, 0603 0603 RC0603FR-074R75L Yageo
R8 1 680 RES, 680, 1%, 0.1 W, 0603 0603 RC0603FR-07680RL Yageo
R9, R10 2 10.0k RES, 10.0 k, 1%, 0.1 W, 0402 0402 ERJ-2RKF1002X Panasonic
R11 1 0 RES, 0, 5%, 0.05 W, AEC-Q200 Grade 1, 0201 0201 ERJ-1GE0R00C Panasonic
R12 1 1.00Meg RES, 1.00 M, 1%, 0.1 W, 0603 0603 RC0603FR-071ML Yageo
R13 1 1.00k RES, 1.00 k, 1%, 0.0625 W, 0402 0402 RC0402FR-071KL Yageo America
R14 1 4.99k RES, 4.99 k, 1%, 0.05 W, 0201 0201 RC0201FR-7D4K99L Yageo America
R15 1 43.2 RES, 43.2, 1%, 0.1 W, 0603 0603 RC0603FR-0743R2L Yageo
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TPA6304-Q1 Evaluation Module 25
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Table 5-1. Bill of Materials (continued)Designator Qty Value Description Package Reference Part Number Manufacturer
R17, R18, R20, R23 4 10.0k RES, 10.0 k, 1%, 0.05 W, 0201 0201 RC0201FR-0710KL Yageo America
R19, R21 2 33.2 RES, 33.2, 1%, 0.05 W, 0201 0201 RC0201FR-0733R2L Yageo America
R22 1 25.5k RES, 25.5 k, 1%, 0.05 W, 0201 0201 RC0201FR-0725K5L Yageo America
R24 1 51.0k RES, 51.0 k, 1%, 0.05 W, 0201 0201 RC0201FR-0751KL Yageo America
R25 1 47.0k RES, 47.0 k, 1%, 0.0625 W, 0402 0402 RC0402FR-0747KL Yageo America
R26, R27, R33, R34, R35 5 0 RES, 0, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 ERJ-3GEY0R00V Panasonic
R29, R30, R31, R32 4 10.0k RES, 10.0 k, 1%, 0.1 W, 0603 0603 ERJ-3EKF1002V Panasonic
S1, S2 2 Switch, Toggle, SPDT 1Pos, TH 7 X 11 X4.5 mm G12AP NKK Switches
SH-J1, SH-J2, SH-J3, SH-J4, SH-J5, SH-J6, SH-J7,SH-J8
8 1x2 Shunt, 100mil, Gold plated, Black Shunt SNT-100-BK-G Samtec
TP1 1 Test Point, Multipurpose, Red, TH Red Multipurpose Testpoint 5010 Keystone
TP2, TP4, TP5, TP6 4 Test Point, Compact, Black, TH Black Compact Testpoint 5006 Keystone
TP7, TP8, TP9, TP10, TP11,TP12, TP13, TP14
8 Test Point, Miniature, Orange, TH Orange Miniature Testpoint 5003 Keystone
U1 1 45-W, 2.1-MHz Analog Input 4-Channel Automotive Class-D AudioAmplifier with Load Dump Protection and I2C Diagnostics, DDV0044E(TSSOP-44)
DDV-44 TPA6304Q1DDV Texas Instruments
U2 1 3-A Step-Down Converter with DCS-Control and Hiccup Short CircuitProtection in 2x2 HotRod Package, RLT0007A (VSON-HR-7)
RLT0007A TPS62085RLTR Texas Instruments
U3 1 1.5A Low Dropout Positive Regulators, 3-pin TO-220, Pb-Free NDE0003A LM1086IT-3.3/NOPB Texas Instruments
U4 1 IC MCU 512KB RAM, 128TQFP TQFP-128 XEF216-512-TQ128-C20 XMOS semiconductor
U5 1 Single-Channel Ultra-Small Adjustable Supervisory Circuit With Active-High Open-Drain Output, DRY0006A (USON-6)
DRY0006A TPS3897ADRYR Texas Instruments
U6 1 Enhanced Product Dual Buffer/Driver with Open-Drain Output, DCK0006A(SOT-SC70-6)
DSF0006A SN74LVC2G07DSFR Texas Instruments
U7 1 Programmable 1-PLL VCXO Clock Synthesizer with 2.5-V or 3.3-VLVCMOS Outputs, PW0014A (TSSOP-14)
PW0014A CDCE913PWR Texas Instruments
U8 1 Single Output LDO, 400mA, Adj.(1.2 to 5.5V), Cap free, Low Noise,Reverse Current Protection, DBV0005A (SOT-23-5)
DBV0005A TPS73618DBVR Texas Instruments
U9 1 Dual-Bit Dual-Supply Bus Transceiver, DQM0008A (X2SON-8) DQM0008A SN74AVC2T244DQMR Texas Instruments
Y1 1 OSC, 24 MHz, 2.25 - 3.63 V, SMD 2x1.6mm ASTMLPA-24.000MHZ-EJ-E-T Abracon Corporation
C24, C34, C97, C99, C101 0 1000pF CAP, CERM, 1000 pF, 50 V, +/- 10%, X7R, 0603 0603 C0603X102K5RACTU Kemet
C102, C103, C104, C105,C106, C107, C108, C109
0 0.01uF CAP, CERM, 0.01 uF, 50 V, +/- 5%, C0G/NP0, 0603 0603 C1608NP01H103J080AA TDK
FID1, FID2, FID3, FID4,FID5, FID6
0 Fiducial mark. There is nothing to buy or mount. N/A N/A N/A
R36, R37, R38, R39, R40,R41, R42, R43
0 3.3 RES, 3.3, 5%, 0.1 W, 0603 0603 CRCW06033R30JNEA Vishay-Dale
Board Layout, Schematic and Bill of Materials www.ti.com
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Table 5-1. Bill of Materials (continued)Designator Qty Value Description Package Reference Part Number Manufacturer
TP3 0 Test Point, Multipurpose, Red, TH Red Multipurpose Testpoint 5010 Keystone
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TPA6304-Q1 Evaluation Module 27
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Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (September 2019) to Revision A (October 2020) Page• Added Spread Spectrum Control Section.........................................................................................................15
Revision History www.ti.com
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Copyright © 2020 Texas Instruments Incorporated
STANDARD TERMS FOR EVALUATION MODULES1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordancewith the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. Forclarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditionsset forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or productionsystem.
2 Limited Warranty and Related Remedies/Disclaimers:2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused byneglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that havebeen altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specificationsor instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality controltechniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or creditUser's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warrantyperiod to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair orreplace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall bewarranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) daywarranty period.
WARNINGEvaluation Kits are intended solely for use by technically qualified,professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanicalcomponents, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommendedguidelines and any applicable legal or environmental requirementsas well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommendedguidelines may result in personal injury or death or propertydamage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output andelectrical loads.
NOTE:EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATIONKIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.
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3 Regulatory Notices:3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or softwareassociated with the kit to determine whether to incorporate such items in a finished product and software developers to writesoftware applications for use with the end product. This kit is not a finished product and when assembled may not be resold orotherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the conditionthat this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit mustoperate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTIONThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may causeundesired operation.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.
FCC Interference Statement for Class A EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment isoperated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if notinstalled and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.
FCC Interference Statement for Class B EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentialinstallation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interferencewill not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, whichcan be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:
• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that maycause undesired operation of the device.
Concernant les EVMs avec appareils radio:Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationest autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doitaccepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna typeslisted in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.
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Concernant les EVMs avec antennes détachablesConformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotroperayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Leprésent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antennenon inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur
3.3 Japan3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certifiedby TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow theinstructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule forEnforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japanwith respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けていないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社東京都新宿区西新宿6丁目24番1号西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to alow-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment thisproduct may cause radio interference in which case the user may be required to take adequate measures.
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4 EVM Use Restrictions and Warnings:4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety informationrelated to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to inputand output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TIfield representative prior to connecting interface electronics including input power and intended loads. Any loads appliedoutside of the specified output range may also result in unintended and/or inaccurate operation and/or possiblepermanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting anyload to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may becomevery warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronicand/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safelylimit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes allresponsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and localrequirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurateas possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites asaccurate, complete, reliable, current, or error-free.
6. Disclaimers:6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALLFAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUTNOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESSFOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADESECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BECONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL ORINTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THEEVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY ORIMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITSLICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANYHANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLYWHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGALTHEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
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8. Limitations on Damages and Liability:8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OFSUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL ORREINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OFUSE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TIMORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HASOCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDEDHEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR INCONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAREVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARECLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive reliefin any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2019, Texas Instruments Incorporated
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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2020, Texas Instruments Incorporated