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7/23/2019 THESIS - Emerson Network Power (3).docx
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CHAPTER I
1.1 INTRODUCTION
The company of Emerson Network Power, Cavite, is a division of
Emerson Electric Company, a global technology company that specializes
primarily to engage in the manufacture of electronic power conversion
products. lso in the development and manufacture of power backup
systems, power supplies, embedded computing solutions, precision cooling,
racks!enclosures, infrastructure management, and connectivity technologies
for original e"uipment manufacturers, and telecommunications service
providers.
The company is composed of di#erent production area consisting of a
number of production lines, which produces speci$c electronic products in
each line. %rom that, the company allowed us to conduct our study at the
&P Production speci$cally at 'P( 'ine in which there is an application of
)otion * Time &tudy +)T&, which really suited for the ob-ective of our study.
uring our line tour at 'P( 'ine, we observed each process conducting
a )otion * Time &tudy to gathered data for us to see where the bottleneck
occurred. %rom that we found out that the consumed time at /CT &tation
e0ceeded the design cycle time that is why among all operations it is themain source of bottleneck causing production delay.
&imilar organizations will bene$t from the study, serving as a reference
for future use.
1.2 COMPANY PROFILE:
Company Name!ddress1 stec Power Philippines, /nc.)ain ve. Corner 2d. 3,
Cavite Economic 4one,
2osario, Cavite, Philippines
Company Telephone!%a0 Nos.1 567 896 :;< =888 !
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567 896 :;< =)ounting @ulk Power ?nits
=
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1.3 BACKGROUND OF THE STUDY
'C)>688 is an advanced type of circuit board that Emerson Network
Power recently developed. @ased on the data gathered, the bottleneck of the
production line process is in the /CT &tation. The target output is :,98A
pieces but the produced output was only :,8=9 which is :B.:= of the
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&PEC/%/C D@3ECT/FEo To improve e0isting process of the production line
o To reduce idle time of the operators waiting due to the delay of
the production
o To achieve the highest possible productivity of 'C)>688
1.6 SIGNIFICANCE OF THE STUDY
The assessment pro-ect was developed for further analyzation of the
sought problem and it will provide bene$ts to the following1
1. Company
This study can help the company to realize the problems that ac"uire
additional cost in the production and to come out with a solution to the said
problem.
2. Employee of the Company
This study could motivate and challenge the employees to $nd ways
that will surely help the production in achieving the highest productivity.
3. Customer of Company
9
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This study will make them be more cognizant and aware of how the
company produced their products.
4. Future Researchers
This study can serve as a reference guide to the future researchers to
improve their related research allowing them to have further ideas for the
development of their studies.
5. Researcher
2esearchers may $nd the $ndings useful by providing some insightsand information on how they come up with the study.
1. SCOPE AND LIMITATIONS
The study was conducted to determine the factors a#ecting for not
meeting the target output of the production and the study will focus on the
production line of Emerson Network Power particularly in the /CT &tation
producing 'C)>688 from the month of Dctober =8
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Interview
The researchers conducted an interview to the sta#, team leaders,
supervisors and manager of the company in order to gather enough
information and to be familiar on the processes involve in the production
line. Engineering epartment e0plained the Gow of operations and guided
the researchers in their line tour describing each processes the product
undergoes.
Oservation
The proponent involved himself to permit the researchers to wander
inside the manufacturing location and allow them to e0amine the operations.
Dbservation to the operation provides the researcher further understanding
to the whole process and every detail and skills needed for the production.
Research an! "ata #atherin#
The data is gathered with the help of Dperations )anager. He permits
the researchers to make a company visit to see the input and output recordsand gives some information of the coming and goings of the production
department. The %inancing )anager also provided some data to the
researchers. Iith the following data collected the researchers were able to
formulate solutions to the problem of the production.
6
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1." DEFINITION OF TERMS
CT > Cycle time is the total time from the beginning to the end of process
T > downtime time when you are not working or busy, time during which a
computer or machine is not working.
Janban sign > The term kanban refers to a visual replenishment signal such
as a card or an empty bin for an item
D& > operational se"uence analysis, is a predetermined motion time system
that is used primarily in industrial settings to set the standard time
DT > overtime is the amount of time someone works beyond normal working
hours.
( > (uality assurance +( is a way of preventing mistakes or defects inmanufactured products and avoiding problems when delivering services to
customers.
(uota > a speci$c amount or number that is e0pected to be achieved
;
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CHAPTER IIREVIE# OF RELATED LITERATURE
printed circuit board, or PC@, is a self>contained module of
interconnected electronic components found in devices ranging fromcommon $%%&%'()or pagers, and radios to sophisticated radar and
computer systems. The circuits are formed by a thin layer of conducting
material deposited, or Kprinted,K on the surface of an insulating board known
as the substrate. /ndividual electronic components are placed on the surface
of the substrate and soldered to the interconnecting circuits. Contact $ngers
along one or more edges of the substrate act as connectors to other PC@s or
to e0ternal electrical devices such as on>o# switches. printed circuit board
may have circuits that perform a single function, such as a signal ampli$er,
or multiple functions.
There are three ma-or types of printed circuit board construction1
single>sided, double>sided, and multi>layered. &ingle>sided boards have the
components on one side of the substrate. Ihen the number of components
becomes too much for a single>sided board, a double>sided board may be
used. Electrical connections between the circuits on each side are made by
drilling holes through the substrate in appropriate locations and plating the
inside of the holes with a conducting material. The third type, a multi>layered
board, has a substrate made up of layers of printed circuits separated by
layers of insulation. The components on the surface connect through plated
A
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holes drilled down to the appropriate circuit layer. This greatly simpli$es the
circuit pattern.
Components on a printed circuit board are electrically connected to the
circuits by two di#erent methods1 the older Kthrough hole technologyK and
the newer Ksurface mount technology.K Iith through hole technology, each
component has thin wires, or leads, which are pushed through small holes in
the substrate and soldered to connection pads in the circuits on the opposite
side. ravity and friction between the leads and the sides of the holes keeps
the components in place until they are soldered. Iith surface mount
technology, stubby 3>shaped or '>shaped legs on each component contact
the printed circuits directly. solder paste consisting of glue, Gu0, and solder
are applied at the point of contact to hold the components in place until the
solder is melted, or KreGowed,K in an oven to make the $nal connection.
lthough surface mount technology re"uires greater care in the placement of
the components, it eliminates the time>consuming drilling process and the
space>consuming connection pads inherent with through hole technology.@oth technologies are used today.
Two other types of circuit assemblies are related to the printed circuit
board. n *+,%-',%/ 0*'0*,)sometimes called an /C or microchip,
performs similar functions to a printed circuit board e0cept the /C contains
many more circuits and components that are electrochemically KgrownK in
place on the surface of a very small chip of silicon. hybrid circuit, as the
name implies, looks like a printed circuit board, but contains some
components that are grown onto the surface of the substrate rather than
being placed on the surface and soldered.
History
:
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Printed circuit boards evolved from electrical connection systems that
were developed in the
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esign
There is no such thing as a standard printed circuit board. Each board
has a uni"ue function for a particular product and must be designed to
perform that function in the space allotted. @oard designers use computer>
aided design systems with special software to layout the circuit pattern on
the board. The spaces between electrical conducting paths are often 8.89
inches +
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lead to prevent o0idation. Contact $ngers are plated with tin>lead, then
nickel, and $nally gold for e0cellent conductivity.
Purchased components include resistors, capacitors, transistors, diodes,
integrated circuit chips, and others.
The )anufacturing
Process
Printed circuit board processing and assembly are done in an
e0tremely clean environment where the air and components can be kept free
of contamination. )ost electronic manufacturers have their own proprietary
processes, but the following steps might typically be used to make a two>
sided printed circuit board.
Ioven glass $ber is unwound from a roll and fed through a process
station
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F*-'% 2 M*+- ,7% ($(,',% shows an enlarged section of a
PC@.
where it is impregnated with epo0y resin either by dipping or spraying.
The impregnated glass $ber then passes through rollers which roll the
material to the desired thick>ness for the $nished substrate and also
remove any e0cess resin.
The substrate material passes through an oven where it is semicured.
fter the oven, the material is cut into large panels.
The panels are stacked in layers, alternating with layers of adhesive>
backed copper foil. The stacks are placed in a press where they are
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sub-ected to temperatures of about 798M% +
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F*-'% 2$ D'**+- +/ &,*+- ,7% 78%( shows the drilling and
plating the holes after the individual boards are cut from the larger
panel.
Creatin# the printe! circuit pattern on the sustrate
The printed circuit pattern may be created by an KadditiveK process or a
KsubtractiveK process. /n the additive process, copper is plated, or added,
onto the surface of the substrate in the desired pattern, leaving the rest of
the surface unplated. /n the subtractive process, the entire surface of the
substrate is $rst plated, and then the areas that are not part of the desired
pattern are etched away, or subtracted. Ie shall describe the additive
process.
The foil surface of the substrate is degreased. The panels pass through
a vacuum chamber where a layer of positive photoresist material is
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pressed $rmly onto the entire surface of the foil. positive photoresist
material is a polymer that has the property of becoming more solublewhen e0posed to ultraviolet light. The vacuum ensures that no air
bubbles are trapped between the foil and the photoresist. The printed
circuit pattern mask is laid on top of the photoresist and the panels are
e0posed to an intense ultraviolet light. @ecause the mask is clear in the
areas of the printed circuit pattern, the photoresist in those areas is
irradiated and becomes very soluble.
The mask is removed, and the surface of the panels is sprayed with an
alkaline developer that dissolves the irradiated photoresist in the areas
of the printed circuit pattern, leaving the copper foil e0posed on the
surface of the substrate.
The panels are then electroplated with copper. The foil on the surface
of the substrate acts as the cathode in this process, and the copper is
plated in the e0posed foil areas to a thickness of about 8.888.88=inches +8.8=B>8.8B8 mm. The areas still covered with photoresist
cannot act as a cathode and are not plated. Tin>lead or another
protective coating is plated on top of the copper plating to prevent the
copper from o0idizing and as a resist for the ne0t manufacturing step.
The photoresist is stripped from the boards with a solvent to e0pose
the substrateLs copper foil between the plated printed circuit pattern.
The boards are sprayed with an acid solution which eats away the
copper foil. The copper plating on the printed circuit pattern is
protected by the tin>lead coating and is una#ected by the acid.
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$ttachin# the contact %n#ers
The contact $ngers are attached to the edge of the substrate to
connect with the printed circuit. The contact $ngers are masked o#
from the rest of the board and then plated. Plating is done with three
metals1 $rst tin>lead, ne0t nickel, then gold.
Fusin# the tin&lea! coatin#
The tin>lead coating on the surface of the copper printed circuit pattern
is very porous and is easily o0idized. To protect it, the panels are
passed through a KreGowK oven or hot oil bath which causes the tin>
lead to melt, or reGow, into a shiny surface.
'ealin#( stencilin#( an! cuttin# the panels
Each panel is sealed with epo0y to protect the circuits from being
damaged while components are being attached. /nstructions and other
markings are stenciled onto the boards.
The panels are then cut into individual boards and the edges are
smoothed.
)ountin# the components
/ndividual boards pass through several machines which place the
electronic components in their proper location in the circuit. /f surface
mount technology is going to be used to mount the components, the
boards $rst pass through an automatic solder paster, which places a
dab of solder paste at each component contact point. Fery small
components may be placed by a Kchip shooterK which rapidly places, or
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shoots, the components onto the board. 'arger components may be
robotically placed. &ome components may be too large or odd>sized forrobotic placement and must be manually placed and soldered later.
The components are then soldered to the circuits. Iith surface mount
technology, the soldering is done by passing the boards through
another reGow process, which causes the solder paste to melt and
make the connection.
The Gu0 residue from the solder is cleaned with water or solvents
depending on the type of solder used.
*ac+a#in#
?nless the printed circuit boards are going to be used immediately,
they are individually packaged in protective plastic bags for storage or
shipping.
(uality Control
Fisual and electrical inspections are made throughout the manufacturing
process to detect Gaws. &ome of these Gaws are generated by the
automated machines. %or e0ample, components are sometimes misplaced on
the board or shifted before $nal soldering. Dther Gaws are caused by the
application of too much solder paste, which can cause e0cess solder to Gow,
or bridge, across two ad-acent printed circuit paths. Heating the solder too
"uickly in the $nal reGow process can cause a KtombstoneK e#ect where one
end of a component lifts up o# the board and doesnLt make contact.
Completed boards are also tested for functional performance to ensure their
output is within the desired limits. &ome boards are sub-ected to
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environmental tests to determine their performance under e0tremes of heat,
humidity, vibration, and impact.
To0ic )aterials and
&afety Considerations
The solder used to make electrical connections on a PC@
contains %/)which is considered a to0ic material. The fumes from the
solder are considered a health hazard, and the soldering operations must be
carried out in a closed environment. The fumes must be given appropriatee0traction and cleaning before being discharged to the atmosphere.
)any electronic products containing PC@s are becoming obsolete
within of>the>art electronics. Dther electronics are disassembled and
the computer parts are salvaged for resale and reuse in other products.
/n many countries in Europe, legislation re"uires manufacturers to buy
back their used products and render them safe for the environment before
disposal. %or manufacturers of electronics, this means they must remove and
reclaim the to0ic solder from their PC@s. This is an e0pensive process and
has spurred research into the development of non>to0ic means of making
electrical connections. Dne promising approach involves the use of water>
soluble, electrically conductive molded plastics to replace the wires and
solder.
The %uture
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The miniaturization of electronic products continues to drive printed
circuit board manufacturing towards smaller and more densely packedboards with increased electronic capabilities. dvancements beyond the
boards described here include three>dimensional molded plastic boards and
the increased use of integrated circuit chips. These and other advancements
will keep the manufacture of printed circuit boards a dynamic $eld for many
years.
CHAPTER IIIPRESENTATION OF GATHERED DATA
3.1 M8,*8+ 9T*% S,/; F8'
=8
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F*-'% 3.1 M8,*8+ 9 T*% S,/; F8' shows our gathered data from 7>cycle time for each process. Iith this, we were able to detect the process
consuming much time, highlighted with red marks. F*-'% 3.1$ G'&7*0 A+;(*( shows the graph, which revealed the
source of bottleneck in the operation. s presented, T< and T9 e0ceeded the
design cycle time.
=
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3.2 M8+,7; O,&, T$%(
T$% 3.2&hows the breakdown of the weekly output data produced by the
company for the month of Dctober =8
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&%' +*,
TARGET
OUTPUT
+*,(=/
;
TARGET
OUTPUT
+*,(=>%
%
ACTUAL
OUTPUT
? LOSS COST
COMPUTATIO
NSP7&
#EEK 44 :A BAA B66 7.;9 6
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#EEK 5< :A BAA B;8 7.86 B8==8
#EEK 51 :A BAA B66 7.;9 6
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AVERAGE :A BAA BAB 9.9=
3.3 S'; 8@ M8+,7; O,&, D,
T$% 3.3&hows the overall detailed breakdown of summary of the
monthly output data produced by the company for the month of Dctober
=8
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SUPPORTING COMPUTATIONS
T2ET D?TP?T T2ET D?TP?T!dayO:6 ID2J/N &
:AO:6 "4
CT?' D?TP?T QCT?' D?TP?T!month==B65=A=95==BA5
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C(%(
C8'%
P'8$%
E%0,(
F*-'% 4.1 P'8$% T'%% S,'0,'% shows the reasons that caused why
e0isting core problem occurred and the e#ects it contributed to the whole
production line.
4.2 P'8$% T'%% A+;(*(
CAUSES
*oor ,ayout
'ayout of the company is very essential, with the set up of the
machines and the path needed in the transportation, and it can determine
the optimal productivity of a certain process. %rom the current layout, its
hard for the operator of the /CT &tation to get the circuit boards because
there is no conveyor belt on that production line to support the transferring
of the units on that station that is why he needs to travel "uite a distance
=;
Emerson Network Power is experiencing 4.08% opportunity loss in ICT Sttion
pro!ucing "C#-$00 circuit or!s &rom t'e mont' o& (ctoer )0*+ to ,nury
)0*4 mounting to *0*+$0 pesos.
'ow
Productivity
Dpportunity
'oss
&low
Production
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about 78>98 seconds -ust to reach the units and go back again to the station.
Dn the other hand, the arrangement of the testing machines is not in linewith each other so it takes time and too much motion for the operator to
handle the machines. These causes traSc and congestion to the production
line.
)anpower "e%ciency
/n production process, manpower is of very important because they are
the one in charge for operating the machines and keeping the production
process ongoing. Iith our gathered data, there is a target output of :,98A
pieces of circuit boards but the produced output was only :8=9 pieces. This
is 9.8A opportunity loss e0perienced by the company due particularly in
the /CT &tation which composed of T< and T9, each of which consists of 7
machines. Iith regards to the distribution of load, there is < sta# who
operates in the /CT &tation and < sta# only who operates to both T< and T9.
/f there will be an additional manpower that would operate T< and T9
separately, we can minimize the time it consumes thus, opportunity loss will
be minimize.
Out&!ate! *arts $ccessories for *ro!uction
The companys parts accessories though can be considered as enough
in number but still it cant fully support the production line due to its
functionality problem which une0pectedly takes place during the production
process causing delays on the production line resulting for its functional
ability to be not that consistent and accurate.
=A
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EFFECTS
'low *ro!uction
Problems in parts accessories can result to the speed loss causing
delays of transferring the items from one operation to another process. The
production will become ine#ective and will come up for not meeting their
"uota which may lead to opportunity loss.
,ow *ro!uctivity
/n the production process system of the company, distance travel done
by the operator is one of the ma-or impacts why delay on the production line
occurs. The transportation of the items consumes time leading to bottle neck
instances which in turn causes idle time for the ne0t operation. /n the case of
the /CT station, low productivity happens because of unnecessary motions,
manpower de$ciency due as well to the outdated parts accessories.
Opportunity ,oss
The company is facing a pro$t loss for not meeting the target output of
the production. They must be able to $nish the re"uired number of circuit
boards because their ma-or products rely on such components, so for them
to sustain the needs of such products they should meet the "uota and once
the "uota is not met, the company will have to e0tend the working hours
producing additional e0penses to the manpower, machines and other
operational e0penses.
=:
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4.3 O$%0,*% T'%%
MEANS
OBJECTIVE
ENDS
F*-'% 4.3 shows the means to accomplish the ob-ective and the end of
each mean.
4.4 O$%0,*% T'%% A+;(*(
MEANS
$rran#e ,ayout E-ectively an! Eciently
rranging the production layout and the facilities design, placing them
on proper location, the production line will Gow e#ectively and eSciently. /t
will bene$t and provide ade"uate system that will allow more e#ective and
eScient workers. The machines should be in line ne0t to each other and near
to the ne0t process of operation to minimize the travel time it takes.
78
/nstall @elt
Conveyor
&ustain
Enough
)anpower
rrange
'ayout
E#ectively *
To minimi/e 4.08% opportunity loss in t'e ICT sttion o& t'e
pro!uction process.
%ast
Production
High
Productivity
Pro$t
Dpportunity
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'ustain Enou#h )anpower
)anpower is a key essential part of the manufacturing process. They
are the one who make the ob-ective of the company to met. )anpower
should be sustained enough and directly distributed as well as e"ually
balanced to the need of the production. &ince there is a bottleneck that is
e0periencing in the /CT &tation, the researcher is looking forward to the
development of the distribution of manpower the process is needed.
.
Install Conveyor /elt
/nstalling conveyor belt in the /CT &tation will result to smooth Gow of
operation which may take place. /t will also lessen the handling of the items
which are unnecessary and will minimize the causes of opportunity loss. lso
the conveyor belt is the cheapest and more productive type of conveyor that
is appropriate in the production environment. Iith the use of conveyor belt,
the items will smoothly run throughout the whole production phase
especially in the /CT &tation where the items are sought to be in critical
receiving of items.
E0"'
$!!itional *ro%t Opportunity
Ihen the improvement done in the /CT &tation of the company, the
operators can now ma0imize their -ob and save time and energy that can do
their -ob more e#ectively. /t will eliminate delay which can be happened to
7
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the production line of the company. Iith this improvement, it will increase
their productivity that can now meet the "uota.
i#h *ro!uctivity
s the improvement of the Gow pattern is being implemented, the
production will become e#ective and productive to the e0tent that the Gow of
the production is e0pected to be smooth Gowing. The operators can
ma0imize their time, and energy e#ectively. There is no reason for delays,and traSc -ams. The process will Gow e#ective and furthermore the
production will meet its "uota. The machine will run only when needed and
the whole production will move e#ectively.
ain *ro%t
chieving these goals and ob-ectives, the company can reduce the
opportunity loss and in return, the pro$t will e"ualize with the production
output of the company thus, it is gaining.
CHAPTER V
ALTERNATIVE COURSES OF ACTION
7=
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5.1 ACA1 ARRANGE LAYOUT
The proposed layout of the researchers is to arrange the production
line into single Gow formation. The machines for the station of /CT &tation >
T< and T9 are aligned in single row for better access of the operators. The
&ony @ond and Coating stations are combined into one line as well as the
%F/, %CC, (, 'abelling and Packing. Iith this arrangement the Gow of
production will be smooth and fast.
T$% 5.1shows the advantages and disadvantages of rearranging
the layout
COST COMPUTATION OF:
I+(,,*8+ 8@ V%+,*,*8+ T$% F+
CD&T manpower+labor!hour O 2ate!Hour ONo of workers
CD&T 788 O A O 9
CD&T :,688.88 Php
77
A/+,-%( D*(/+,-%(
&mooth Gow of production dditional cost
Eliminate traSc
Eliminate un$nished works
%ast and e#ective
production
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Price @ased on Payroll DSce and H2 oSce
V%+,*,*8+ T$% F+
CD&T ?nit Price O Piece
CD&T RB8O9BO=
CD&T 9,B88.88Php
Price @ased on http1!!www.alibaba.com!product>gs!
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T$% 5.2shows the advantages and disadvantages of adding man power
to the production line
COST COMPUTATION
#-% C8&,,*8+
C(ST 2 No. mnpower 7 te 7 9ysC(ST 2 :*7+60;7$COST = 2,100 Php / Salary per week
Price
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TOTAL = 2,340.00Php
While in Overtie!
C(ST 2 (T te per =our 7 sic slry rte 7 no. o& mn powerC(ST 2 6 7 +60 7 )*COST = 41",#$0.00Php per h%&r
Price
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9imension *6.$@ ?i!t'PriceA 600 P'p
C(ST2 Price 7 PieceC(ST2 600 7 4T(T"A 30,000.00PhpPrice incline>conveyors.php
T$% 5.3 shows the advantages and disadvantages of replacing parts
accessories for production
A*+ATA- *SA*+ATA-
>st n! Smoot' >low o& Process
Smll or !elicte prt 'n!ling
Ses time
"ess error
!!itionl Cost
7;
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T'oroug' inspection o& pro!ucts
T8, C8(, 8@ ACA3
Total 'C monitors 5 conveyor belt 5 @arcode scanner
Total 78,888 5 ;;,988 5 ;,B88
Total 114)"st n! e&&ectiepro!uction
7A
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ACA73!Instll Coneyor 688 circuit boards from the month of
Dctober =8
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delays caused by the malfunction of those parts can be eliminated by
replacing them with new ones. Though it involves money matters but still, in
return of their investments, it will greatly bene$t the company. %rom these
three alternative courses of action, it can help to resolve the problem of
opportunity loss.
REFERENCES
@raithwaite, Nicholas and raham Ieaver, eds. Electronic
Materials. @utterworths,
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&ris &a$ette