Thermal Management

Solutions for Electronics

ThermaCool® Interface MaterialsProviding Cost-Effective, Easy-to-Use Solutions to

Difficult Cooling Problems

Theseproductsarebasedupon50 yearsoftapemanufacturingexperience,designingthermalinterfaceswithcreativematerialsandqualityconstructionstoachievemaximum performance. The ThermaCool® product line give maximum thermal performance in a cost-effective form.

• ThermaCool thermal management products provide an effective path for heat dissipation with minimal complication to manufacturing processes. ThermaCool products are designed to simplify our customers’ manufacturing processes.

• ThermaCool products ensure excel-lent system performance, which is critical to optimize operating effi-ciency and expected life of modern microprocessors and other electronic components. This is even more criti-cal with increasing power density of microprocessors and electronic sys-tems. With sufficient cooling, micro-processors will operate at speeds lower than their design capability and operating life may be signifi-cantly reduced.

• System designers no longer need to sacrifice the thermal reliability in order to simplify the assembly process. ThermaCool products allow designers to have effective thermal solutions while keeping assembly costs to a minimum.

Solutions for Electronics

What is Thermal Management?A thermal management system consists of materials designed to remove the heat generated by an electronic device (such as a power transistor or a microprocessor) to the ambient environment in order to ensure the reliable operation of the system.

ContentsBackground Theory of Thermal Management . . . . . . . . . . . . . . 1

Definitions for Thermal Interface Design . . . . . . . . . . . . . . . . . . . . . . 1

Saint-Gobain’s Thermal Test Methods . . . . . . . . . . . . . . . . . . . . . . . . .2

How Thermal Interface Materials Ensure:

More Dependable and Reliable System Operation . . . . . . . . . . .3

The Right Thermal Interface Material for Your Application . . . . . . . . 5

Thermal Phase Change . . . . . . . . . . . . . . . .6

Thermal Tapes and Transfer Adhesives . . . . . . . . . . . . . . . . . . . . 7

Thermal Fabrics . . . . . . . . . . . . . . . . . . . . . . .8

Gap Fillers . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

ThermaCool Thermal Interface Materials Are Designed For Easy System AssemblySaint-Gobainrealizesthatthecompetitivenatureoftoday’scomputerassemblymarketrequiresautomatedmassproductiontechniques.That’swhyourthermalmanagementproductsaredesignedtoprovideaneffectivepathforheatdissipationwithminimalcomplicationtothemanufacturingprocess.Inordertoaccomplishthisobjective,Saint-Gobainutilizesover50yearsoftapemanufacturingexperiencetodesignthermalinterfaceswithcreativematerialsandqualityconstructionsthatwilldelivermaximumperformance.Theresultisaproductlinethatbalancesthemaximumthermalperformanceinacost-effectiveform(seeDiagram1).Maximumthermalperformanceofasystemiscriticaltooptimizetheprocessingspeedandtheexpectedlifeofmodernmicroprocessors,andbecomesevenmorecrucialasthepowerofmicroprocessorsandthepowerdensityofcomputerassembliescontinuetoincrease.Ifamicroprocessorisinsufficientlycooled,itwilloperateatspeedslowerthanitiscapableof.Inaddition,whenamicroprocessorisexposedtoelevatedtemperaturesforextendedtimeperiods,itsoperatinglifewillbedecreasedoritcanevenbedestroyed.Computerdesignersnolongerneedtosacrificethethermalreliabilityoftheirsystemsinordertosimplifytheassemblyprocess.Saint-Gobainallowsdesignerstoincorporatethenecessarythermalinterfacewhilekeepingtheirassemblycoststoaminimum.Thiscombinationcanproduceareliablesystemataverycompetitivecost.

DIAGRAM 1

Max Completelycon-formstosurfaceroughnessandconcavity

Messyandlaborintensivetoapply

Pre-formedinterfacewhichcannotbepreattachedtoheatsink/CPU

Canbeappliedtoheatsink/CPUwithspecialequipment

CanbepreattachedtoheatsinkorCPU

Surfaceadhesivewetsoutatlowpressures(10psi)

Requirespressure>25psitoensuresurfacebonding

Requireshighpressuretoper-formeffectively(300psi)

Min

1

Thermal Grease

Phase ChangeC1100 C1055 C1060

Gap FillerTC3000 TC100

R10404

Thermal TapesC695 C675 K272 K271

Phase ChangeC1095x01

Thermal Fabrics TF1860 TF400 TF1818 TF1870

ThEr

MA

L PE

rFO

rMA

NCE

EasyDifficult EASE OF uSE

2

Choosing Thermal Interface Materials

Low TC2900 C1100 KC100 (Less than TC3005 C1055 15 psi) TC3006 C1095 R10404 C1060

Medium TC3001HCT C6910 TC100U Tab C695 K271 TC3001 C675 K272 TC100U TR3/5 K275

high TC100 TC1870 (Over TC400 100 psi) TC1860 TC1818

Define Contact

Pressure in Operation

Electrical Isolation

requirements

Determine Interface Gap

required

high None high None high

>20 Mils <7 Mils

7-20 Mils

Gap Filler

Width of Gap

T Fabric Tape Tape P Chg

STAGE 1Determineinterfacegaptofill—Iflargerthan20mils,agapfillerisused;below20mils,tapesandfabricsareused.

STAGE 2Iselectricisolationrequired?

STAGE 3Howmuchpressureillbesuedtocreatecontactbetweentwosurfacesandinterfacematerial?Higertheforceavailable,thehardertheinterfaceshouldbe.

STAGE 4: ChOOSE ThE LOWEST ThErMAL CONDuCTIvITy Or IMPEDANCE

• Theabovestepswillhavenarrowedthepotentiallistofinterfacechoices.

• Thermalresistancevaluesshouldbemeasuredunderconditionsascloseaspossibletotheactualapplication.

• Testconditionsmustbethesameinordertocomparethermalresistancevalues.

• Dependingontheapplicationgivenperformancecanbegovernedbybulkthermalconductivityorthermalimpedance,asdepictedindiagramsatright.Itcanalsobedepictedintermsof“resistorinseries”model.

ProDuCT SELECTor GuIDE

2

3

1

3

Product Line Overview

TheThermaCoolproductlineprovidescost-effective,highperformancesolutionstoheattransferneedsinmanyelectricaland/orelectronicapplications.Frommicropro-cessorstohighpowerswitchgear,ThermaCoolproductsprovidestherightsolution— Simply the Coolest

Gap FillersThermallyconductive,lowdurometer,filledsiliconepolymersheetsusedtoprovidethermalsolutionswheninter-facegapsaregreaterthan20mils.

•TC100 — Unreinforcedsilicone

•TC100U — Uncuredmaterialthatcuresinplace

•TC3001 —Newcompliantproducts—positionedagainstChromerics1674

•TC3001HCT — HigherconductivitygapfillerpositionedagainstBergquistA3000

•TC3005 — VerycompliantgapfillerpositionedagainstBergquistVOUltraSoft

Thermally Conductive FabricsFabricreinforcedsiliconepolymersheetsusedtoprovidethermalsolu-tionswereinterfacegapsarelessthan20milsandhightorqueapplicationisrequired.

•TF1818 — Thermallyconductiverein-forcedelastomer

•TF187X — Higherperformancethermallyconductivereinforcedelastomer

•TF400 —Mediumperformanceproductwithexcellentvalue—Chromerics1674

Thermally Conductive TapesTapesystemswiththermallyconductiveadhesivesandsubstratesthatcaneitherbeelectricallyisolating/thermallyconduc-tiveoronlythermallyconductive.

•Kapton Tapes — K271, K272 and K275

•Aluminum Foil — C675

•Graphoil Tape — C695 and C6910

•Transfer Adhesive — TR-3 and TR-5

•Mostformulationsuseacrylicadhesivebutsiliconesystemisavailable.

Phase Change MaterialsHighperformancesystemsusedtocou-pleheatsinkandmicroprocessorsandotherminiatureelectroniccomponentsandprovidelowestthermalimpedanceofallThermaCoolthermalinterfacematerials.

•C1055 — OlderPCTIMmaintainedforprints

•C1060 — FabricreinforcedversionofC1055

•C1095 X01 —No-stickPCTIM

•C1100 and C1100F — HighestperformanceproductforhigherpowerMPUsvsShin-Etsugrease

Data sheets and other information for the Thermal Management Line can be found on the web site:

www.thermacool.saint-gobain.com1

4

Thermal Fabrics

ProDuCT ovErvIEWThermallyConductiveFabricsarefiberglass-reinforcedceramic-filledsiliconepolymersheetsusedtoprovidethermaltransferandelectricalisolationwhereinterfacegapsarelessthan20milsandhightorqueapplicationisrequired.Thefiberglass/ceramic-filledsiliconecompoundconstructionprovidesexcellentcut-thruresistance,highthermaltransferandeffectiveelectricalisolation.Thesematerialsaretypicallyusedincomputerpowersuppliesandamplifierswherethecombinationofcut-thruresistanceandhighthermaltransferprovidesacost-effectivesolution.

TYPICAL APPLICATIoNS•Productstofilltheneedofvaryingcomponentclampingforcesandmethods

•Electricallyisolatingcomponentswhileprovidingexcellentthermaltransfertoheatsinks

•Electronicmodulesforpowersuppliesandtelecommunications

•FitsbetweenCPUandHeatSpreader

•HeatTransferpadsinMemoryModules

ProDuCTS AND DESCrIPTIoN•TF400 Series:Cost-effectivethermallyconductivesiliconecoatedfabricsuppliedinthicknessof7.0and 9.0milsthick.

•TF1870 Series:Similarto TF400Seriesbutimprovedthermalperformance.

•TF1818:18.0milthickthermallyconductivesiliconecoatedfabric.Increasedbreakstrengthandextrasmoothsurface.

•All Products:Canbesuppliedwithathermallyconductiveacrylicadhesiveononeside.

Product Color Thickness Flame rating Thermal Thermal Name (mils) vertical Burn Conductivity Impedance UL 94 (W/mK) (°C in.2/W) ASTM E1530 ASTM E1530

CONSTruCTION MEChANICAL ThErMAL COMMENTS

TF1867 Gray 7 VTM-0 0.9 0.65 Lowestcostfabric

TF1869 Gray 9 VTM-1 0.9 0.70

TF407 Gray 7 V0 0.9 0.31 Mediumperformancematerial

TF409 Gray 9 V0 0.9 0.39

TF412 Gray 12 V0 0.9 0.48

TF1818 Gray 18 V0 0.8 0.89 Verythickfabricforhighpuncture

TF1877 Green 7 V0 1.3 0.24 Higherthermalperformance

TF1879 Green 9 V0 1.3 0.28

All products RoHS compliant

5

Gap Fillers

ProDuCT ovErvIEWGapFillersarethermallyconductive,compliantceramic-filledsiliconepolymersheetsusedtoprovidethermalsolutionswheninterfacegapsaregreaterthan20mils.GapFillerscanbeusedtospanairgaps,enhancingthermalperformanceofcomputermemorymodules,telecommunicationequipmentandotherelectronicdevices.TheThermaCoolGapFillerfamilyincludesproductsinavarietyofthicknessesandarangeofhardnessestoeffectivelyclosegapswhileprovidingthethermaltransferneededindemandingelectronicapplications.

TYPICAL APPLICATIoNS•Fillingareasofirregularsurfacestoprovideathermalinterfacetotheheatsink

•Electricallyisolatingcomponentswhileprovidinggoodthermaltransfertoheatsinks

•FitsbetweenCPUandHeatSpreader

•HeatTransferpadsinMemoryModules

•CDROMCooling

•Cushioningtoremovedamagecausedbyvibration

•HeatPipeAssemblies

ProDuCTS AND DESCrIPTIoN•R 10404:Thermallyconductiveclosedcellspongeforgasketingheattransferandcushioning.Providedinsheetsoryardgoodsforeaseofcuttinginthicknessfrom0.032 –0.250.

•TC100: Thermallyconductivesolidsiliconerubber,providedinyardgoodsfrom0.025 – 0.062thickforfillingairgapsunderhighloadforce.

•TC100U:SimilartotheTC100butsuppliedina“B”Stageconfigurationtofillgapsandbonddissimilarmaterialsinplaceprovidingathermaltransferpath.

•TC 3000 Family: Thermallyconductiveconformablesiliconerubber,providedin24" x 24"sheetsfrom15–220milsthickforfillingairgapsunderhighloadforce.TheproducthasUL94 V-0flamerating.Theproductisnaturallytackyandhasaverylowthermalresistance.

–TC3001:Verysoft(5–10ShoreA) –TC3002:Soft(25–30ShoreA) –TC3005:Extremelysoft(<5ShoreA)

Product Standard Surfaces* Flame hardness Thermal Name Thicknesses Burn rating (Shore A) Conductivity (mils) UL 94 vertical ASTM E1530 (W/mK)

CONSTr. MEChANICAL ThErMAL COMMENTS

TC2900 30–220 Neat,1–6 V01 5–10 1.3 Lowcost,mediumperformancegapfiller

TC3001 20–220 Neat,1–6 V0 5–10 1.5 Softgapfiller

TC3005 20–220 Neat,1–6 V0 <5 1.5 Verycompliantforlargercompressionvalue

TC3001HCT 40–220 Neat,1–6 V01 5–10 3.0 Higherthermalconductivitygapfiller

TC3006 20–220 Neat,1–6 V01 5–10/Shore 00 1.1 Extremelysoftforverylargecompression

R10404 1/32"–1/4" Neat,1–6 V1 15 0.3–0.6 Conductivesponge

TC100 25, 32, 62 Neat,1–6 HB 65 1.3 Verytoughgapfiller,mediumperformance

TC100U 15, 32, 62 Neat,1–6 — 652 1.3 Uncuredmaterialforbondingandgapfilling

1 Pending2Aftercure

* 1 BN–ononesidenostick 3 PolyimideFilm 5 MTKapton

2 PETfilm 4 FabricScrim 6 ThermalFabric

6

Thermal Tapes

ProDuCT ovErvIEWThermallyConductiveTapeshavethermallyconductivepressure-sensitiveadhesivesappliedtosubstratesthatcaneitherbeelectricallyisolating/thermallyconductiveoronlythermallyconductive.Theyareusedtojoinheatsinkstocomputerprocessorsinplaceofmechanicalfasteners,enhancetheperformanceofheatsinksbylaterallyspreadingheat,orelectricallyisolatecomponentsofapowersupplywhilestillprovidinganexcellentthermalconductionpath.

TYPICAL APPLICATIoNS•Bondingheatsinkstoceramicormetalpackagedmicroelectroniccomponentsoncircuitboards

•Electricallyisolatingcomponentswhileprovidinggoodthermaltransfertoheatsinksorbackplanes

•Providingbondingmethodsformaterialsthataresuppliedwithoutadhesiveforeaseinassembly

•Replacingmechanicalfastenerswithapowerfulbondingsystemthatallowsrapidassembly

ProDuCTS AND DESCrIPTIoN•KAPTON Tapes:Thermallyconductiveandelectricallyisolating

–K271—One-sidedadhesivecoatedThermalKaptonMT®tape

– K272—Two-sidedsiliconecoatedThermalKaptonMT®tape

– K275—Two-sidedadhesivecoatedThermalKaptonMT®tape

•Metal Foil Tapes: Thermallyconductivemetalfoiltapes

–C675—Aluminumfoilwithacrylicthermallyconductiveadhesive

•Grafoil® Tapes:Thermallyconductiveflexiblegraphitetape

–C695 and C6910 —Graphitetapewithacrylicthermaladhesiveononeside

•Thermally Conductive Transfer Adhesives

–TR3 & TR5—Thermallyconductiveacrylicadhesives

Product Carrier Thickness Adhesion Dielectric Strength Thermal Conductivity Thermal Impedance Name (mils) (oz./in.2) (volts total) (W/mK) ASTM E1530 (°C in.2/W) ASTM E1530

CONSTruCTION MECh. ELECTrICAL ThErMAL COMMENTS

K271 MTKapton 4.5 30 / 601 7000 0.6 0.40 Onesideadhesive,oneside siliconeonKapton

K272 MTKapton 6.0 None 7000 0.9 0.30 TwosidesiliconeonKapton K275 MTKapton 30 / 601 6500 0.4 0.49 TwosideadhesiveonKapton

C675 Aluminum 6.0 30 / 601 Non- 2.0 0.10 Bondingtapetompu Foil insulating forheatsinks

C695 Graphite 6.0 3-52 Non- 2.0 0.12 Veryhighconductivity, Paper insulating goodforheatspread

C6910 Graphite 11.0 3-52 Non- 2.6 0.15 ThickerversionofC695 Paper insulating

TR3 PET 3.0 30 Non- 0.4 0.3 Thermallyconductive insulating transferadhesive– 3mils

TR5 PET 5.0 60 Non- 0.4 0.5 Thermallyconductive

insulating transferadhesive–5mils

1 Adhesion to steel (value after thermosetting); 2 Adhesion to aluminumAll products RoHS compliant

7

Thermal Phase Change

ProDuCT ovErvIEWPhaseChangeMaterialschangefromasolidtoaliquid-likematerialatmicroprocessortemperatures,significantlyenhancingthermalperformanceincomputerapplications.ThermaCoolphasechangeproductsprovidehighperformanceheattransferwithoutthemanufacturingorassemblyproblemsassociatedwithmessythermalgreases.Thesephasechangematerialsprovideexcellentthermalcouplingbetweencomputermicropro-cessorsandheatsinks,ensuringhighsystemperformanceinacost-effectiveformat.

•C1095 x01: Athermallyconductivepolymericinterfacematerialdesignedspecificallyforapplicationrequiringathermalinterfacematerial(TIM)thatwillnotcreateanybondlineadhesionbetweenaheatsinkorotherheatdissipatingdeviseandthemetalcasesurfaceofamicroprocessor(MPU)orotherheatgeneratingdevice.

•ThermaCool C1100: familyofhighperformancephasechangingcompoundswhichselfadheretotheheatsinkatroomtemperature.ThisadhesivequalityalsocreatesaconformableinterfacebetweenthesinkandMPUanddramaticallyimprovingheattransfer.

ProDuCTS AND DESCrIPTIoN•C1055 & C1060:Thermallyconductiveproductsdesignedtoexhibitexceptionalviscoelastic(creepandflow)properties.Effectsofviscosityandelasticitydetermineconformability.Minimalforceisrequiredforthismaterialtoflowandachievetotalwet-out.Astemperaturedecreasesthematerialdoesnotstiffen.Themodulusremainsuniformbetween0°Cand130°C.TheseuniqueviscoelasticpropertiesoftheC1055,combinedwiththeinherentlowthermalresistance,insureminimalcontactresistanceandahighlyeffectivepathforheatdissipation.

TYPICAL APPLICATIoNS•Createshighperformancethermalcouplingbetweenflipchiporheatspreadertoheatsink

•Materialscanbeprovidedinanon-bondingformulationtopreventanyadhesionbetweenmicroprocessorandheatsink,whilestillhavingexcellentthermalperformance

•Replacingmessythermalgreaseinrapidmicroelectronicassembly

Product reinforcing Thickness Phase Change Thermal Conductivity Thermal Impedance Name Carrier (mils) Temperature (°C) (W/mK) ASTM E1530 (°C in.2/W) ASTM E1530

CONSTruCTION ThErMAL COMMENTS

C1055 None 3.0 3.5 & 6.0 1.0 0.04 Highperformancephasechange

C1060 Fiberglass 3.5 45 0.7 0.10 Reinforcedversionof C1055

C1095 Polymer 2.5 >50 0.6 0.13 Nostickphasechangefor Film easydisassembly

C1100 None 3.5 & 6.0 37 1.0 0.03 Greaselikeperformance,easytouse

C1100F Aluminum 3.5 & 6.0 40 1.0 0.05 Nostickversionof C1100 Foil

All products RoHS compliant

8

Saint-Gobain’s Thermal Test Methods

Saint-Gobain employs two standard thermal conductivity/thermal resistance test methods.

ASTM e1530Oneistheguardedheatflowmetermethod,whichconformstoASTME1530(Diagram1)andismostlyapplicabletosamplesthatrangeinthicknessfrom0.5–25mm.Inthismethodanevenreproduciblepressureisappliedtothetestsamplebypneumaticcylindersthatallowtestpressuresrangingfrom0psi(contact)to300psi.Thesampleisheldbetweentwopolishedmetalsurfaceswheretheupperplateisheatedandthelowerplateischilled,establishingatemperaturegradientthroughthestack.Thelowerplateisalsopartofacalibratedheatfluxtransducer.

ASTM D5470 Theothertestingmethodisforthermaltransmissionpropertiesofthinthermallyconductiveelectricallyinsulating

materials,whichconformstoASTMD5470andisapplicabletosamplesranginginthicknessfrom0.02 – 10mm.Inthismethodanevenreproduciblepressureisappliedtothetestsamplebypneumaticcylindersthatallowtestpressuresrangingfrom0psi(contact)to500psi.Thesampleisheldbetweentwopolished

metalsurfaceswherethelowerplateisheatedandtheupperplateischilled,establishingatemperaturegradientthroughthestackthatismeasuredvia4thermocouples,asdepictedonDiagram2.Thermalimpedancecanbedeterminedbymeasuringthetempera-tureresistanceacrossthesample.

Definitions for Thermal Interface Design

INTErFACE GAP Thegapwhichresultsbetweenthemicroprocessorandtheheatsinkduetothestack-upofflatnessspecificationtolerances.Twonominallyflatsurfaceswillalwaysproduceaninterfacegapwhenplacedtogether.

CoNTACT rESISTANCE Inthermaltransfer,airequalsresistance.Thus,contactresistanceisatheoreticalmeasureofthevolumeofairvoidsalongtheinterfaceofanytwosurfaces.Thesemicroscopicvoidsareformedbysurfaceroughness,surfaceconcavityortheinter-facematerialineffectivelyconformingtoacomponent’ssurface.ThisisillustratedinthemagnifiedsectionofDiagram2.

ThErMAL CoNDuCTIvITY Theabilityofamaterialtoconductheat

aftertheheathasenteredthatmaterial.Thermalconductivityvaluescanbemisleadingwhenusedtoevaluatethermalinterfacematerialssinceactualperformanceisaffectedbythecontactresistancewithboththeheatsinkandthemicroprocessor.ThermalconductivityistypicallyexpressedinunitsofW/m-K.

ThErMAL IMPEDANCE Adefinedparameterwhichiscalculatedbydividingthetemperaturedifferenceacrosstheinterfacebythepoweroutputofthemicroprocessor.Thermalimpedancevaluesarequitevaluableinthermalmanagementdesignsincetheyinherentlyreflecttheimpactofcontactresistancesoninterfaceperformance.Lowthermalresistancesindicateasystemwhichdissipatesheateffectively.Thermalimpedanceistypicallyexpressedinunitsof°C-in2/W.

DIELECTrIC STrENGTh Ameasureofthevoltagerequiredtocauseabreakdownofaspecificthicknessofinterfacematerial.Dielectricstrengthistypicallyexpressedinunitsofvolts/mil.

CoNTACT PrESSurE Thepressurebetweenthemicroprocessorandtheheatsink.Thispressureistypicallygeneratedandmaintainedbytheheatsinkclipswhichattachtoasocket.Contactpressureistypicallymea-suredinpoundspersquareinch(psi).

APPLICATIoN PrESSurE Thepressurerequiredtoattachaninterfacematerialtoaheatsinkortoamicroprocessor.Applicationpressureistypicallymeasuredinpoundspersquareinch(psi).

LOAD LOAD

upper Meter Block

Insulation

heater

upper Plate Tu •

Specimen

Guar

d he

ater

Guar

d he

ater

heat Sink

Lower Plate TM •

Bottom heater TL•

Plate

hFT

T1

T2

T3

T4

Specimen“T” Type Thermo Couple

Lower Meter Block

heating Block

+–

Water in Water outCu Block

ASTM D5470ASTM e1530

DIAGRAM 1 DIAGRAM 2

9

Non Conformable Conductive

Non Conformable Conductive — uncured

Conformable Closed Cell Sponge

Conformable Low hardness

Conformable Medium hardness

very Conformable very Soft

TC100

TC100U

R10404

TC3001

TC3002

TC3005

N/A

Therm-A-Form T646

N/A

Therm-A-Gap

A174/T174/F174

Therm-A-GapA274/T274

Therm-A-GapA574/574

N/A

N/A

N/A

Gap-PadA2000

Gap-Pad1500, 1500R

Gap-PadVOUltraSoft,Gap-Pad 1500

SarconGTR

N/A

N/A

SarconHR,GR-d,GR

SarconHR,GR-d,GR

N/A

Description ThermaCool Chomerics Bergquist Fujipoly

ThErMAL GAP FILLErS

Graphite foil with 1 side PSA

Aluminum foil with 2 side PSA

MT Kapton with 2 side PSA

MT Kapton with 1 side PSA/1 side silicone

Transfer Adhesives

C695

C695

K275

K271

TR3 & TR5

N/A

Thermattach T405, T412

Thermattach T404, T414

ChoTherm 1680

Thermattach T413

N/A

Q-PadII

Bond-Ply 660

Sil-Pad K4, K6

Bond-Ply 100

Description ThermaCool Chomerics Bergquist

ThErMAL TAPES

Low Cost Thermal Fabric

Mid Performance Fabric

high Performance Fabric

TF400

1818, 1877, 1879

TF500

ChoTherm 1674

ChoTherm 1674

ChoTherm 1671, 1678, T500

Sil-Pad 400

Sil-Pad 600

Sil-Pad 800, 900S, A1500

Description ThermaCool Chomerics Bergquist

ThErMAL FABrICS

high Power MPu

high Power MPu with Al Foil one side

reinforced

Non Stick one side

C1055, C1100

C1100F

C1060

C1095-X01

Thermflow T725

ThermflowT766

Thermflow T443

N/A

Hi-Flow225U, 225UT, 625

Hi-Flow225FT, 225FAC

Hi-Flow115-AC, 200G

N/A

T-PCM900, T-PCM-HP105

N/A

N/A

N/A

Description ThermaCool Chomerics Bergquist Fujipoly

ThErMAL PhASE ChANGE

Thermal Management Materials Competitive offsets

AFF-XXXX-0M -0907 -SGCS ©2007 Saint-Gobain Performance Plastics Corporation

Limited Warranty: For a period of 6 months from the date of t sale, Saint-Gobain Performance Plastics Corporation warrants this product(s) to be free from defects in manufacturing. Our only obligation will be to provide replacement product for any portion proving defective, or at our option, to refund the purchase price thereof. User assumes all other risks, if any, including the risk of injury, loss or damage, whether direct or consequential, arising out of the use, misuse, or inability to use this product(s). SAINT-GOBAIN PERFORMANCE PLASTICS DISCLAIMS ANY AND ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.

NOTE: Saint-Gobain Performance Plastics Corporation does not assume any responsibility or liability for any advice furnished by it, or for the performance or results of any installation or use of the product(s) or of any al product into which the product(s) may be incorporated by the purchaser and/or user. The pur-chaser and/or user should perform its own tests to determine the suitability and s of the product(s) for the particular purpose desired in any given situation.

Saint-Gobain Performance PlasticsCorporation 14 McCa rey Street Hoosick Falls, New York 12090-0320 www. f.saint-gobain.com

For Customer or Technical Support:(800)962-2666Tel: (518) 686-7301Fax: (800) 526-8479

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