Testing of IEC 61850 Compliant Smart Grid Devices a Malaysian Experience

Embed Size (px)

DESCRIPTION

Testing of IEC 61850

Citation preview

  • [email protected]

    Testing of IEC 61850 Compliant Smart Grid Devices: A Malaysian Experience

    1M.I. RIDWAN,

    1N.S. MISWAN,

    1M.N. NORAN,

    1M.S.M. SHOKRI,

    2H.N. AWANG,

    2A. MUSA

    1TNB RESEARCH SDN BHD

    2TENAGA NASIONAL BERHAD

    MALAYSIA

    AORC Technical meeting 2014C4-1093

    http : //www.cigre.org

  • 2

    SUMMARY

    One of the important aspects to ensure the success of a Smart Grid implementation is the ability of

    the devices and systems in a Smart Grid domain to be able to seamlessly communicate and exchange

    information with each other. This aspect, which is also referred as interoperability, is crucial for the

    execution of functions that are defined in a Smart Grid domain, regardless whether it is a distributed or

    centralized function. To ensure interoperability is implemented successfully in a Smart Grid domain, it

    is imperative for power utilities to acquire know-now on the relevant open standard based Smart Grid

    technologies that can ensure interoperability without fail. Smart Grid solutions with proprietary

    technology may pose significant long term risks to utilities, such as expensive replacement of devices

    and system extension due to over dependency to single vendor , low flexibility to define new

    requirements and susceptible to technology obsolescence from the single vendor.

    Interoperability in a Smart Grid domain is crucial to ensure the seamless information exchange

    between devices and systems in the domain to execute their intended functions. Standardization bodies

    such as the Institute of Electrical and Electronic Engineers (IEEE), International Electrotechnical

    Committee (IEC) and National Institute of Standards and Technology (NIST) have published

    standards, guideline and roadmaps suggesting on the technologies that can enable seamless

    interoperability between devices and systems in a Smart Grid domain. For communications related to

    power system and electrical substations in Smart Grid domain, IEC 61850 standard has been

    recognized as the open standard that enables interoperability through its standardized data models and

    communication services. These data models and communication services are mapped to the

    mainstream Ethernet technology, which has allowed IEC 61850 to be future proof regardless of the

    advancements of communication technology.

    As the public electric utility company in Malaysia, Tenaga Nasional Berhad (TNB) believes that the

    integration of solutions from different vendors using open standard is the way forward and has the

    promising potential to provide substantial cost savings in the near future. TNB has identified the IEC

    61850 standard as the key enabler standard for this purpose and has included the standard as a part of

    the long term technology implementation plan under the TNB Technology Road Map (TRM). To

    ensure the successful implementation of IEC 61850 standard in a Smart Grid domain, TNB has

    embarked in several initiatives, which are also defined in TNB TRM. The initiatives include the

    development of an IEC 61850 laboratory, new product acceptance process for IEC 61850 compliant

    devices and in-house software applications for IEC 61850 substations. These initiatives are vital for

    TNB not only to pave the path to realize TRM vision, but also to obtain in-depth understanding

    regarding IEC 61850 and to develop in-house expertise on the subject. Although IEC 61850 promises

    interoperability, it is imperative for users to understand the detailed methodologies and know-how

    specified in IEC 61850 to successfully achieve interoperability during the implementation stage. This

    paper will discuss TNBs experience on the interoperability testing of IEC 61850 compliant devices

    and highlights some of the findings which were observed during the execution of the initiatives above.

    KEYWORDS

    IEC 61850, Intelligent Electronic Devices (IEDs), Interoperability, Smart Grid, Substation Configuration Language (SCL), Substation Information Management System (SIMS), Substation

    Protection, Automation and Control System (SPACS), System Verification and Simulation (SVS)

    Laboratory

  • 3

    1. Introduction

    Interoperability in a Smart Grid domain is crucial to ensure the seamless information exchange

    between devices and systems in the domain to execute their intended functions. Standardization bodies

    such as the Institute of Electrical and Electronic Engineers (IEEE), International Electrotechnical

    Committee (IEC) and National Institute of Standards and Technology (NIST) have published

    standards, guideline and roadmaps suggesting on the technologies that can enable seamless

    interoperability between devices and systems in a Smart Grid domain [1,2,3]. For communications

    related to power system and electrical substations in Smart Grid domain, IEC 61850 has been

    recognized as the open standard that enables interoperability through its standardized data models and

    communication services [4]. These data models and communication services are mapped to the

    mainstream Ethernet technology, which has allowed IEC 61850 to be future proof regardless of the

    advancements of communication technology [5].

    Realizing the benefits that can be exploited from the implementation of IEC 61850 standard, Tenaga

    Nasional Berhad (TNB), a public electric utility company in Malaysia has recognized IEC 61850 as

    the key enabler standard in the long term technology implementation plan which is called Technology

    Road Map (TRM). TRM defines Smart and Intelligent Electricity Delivery System as TNBs own

    definition of Smart Grid. The vision of TRM is to achieve the Smart and Intelligent Electricity

    Delivery System by the year 2020, which smart substation based on IEC 61850 standard has been

    identified as one of the major contributors for TNB to achieve the vision [6]. The overview of TNB

    TRM is illustrated in Fig. 1 below.

    Fig. 1. TNB Technology Roadmap Destinations and Enabling Technology

    Under TRM, a cluster of technologies have been identified to achieve the vision of Smart and

    Intelligent Electricity Delivery System by the year 2020. The vision is to develop smart substations

    equipped with integrated Substation Protection, Automation and Control System (SPACS), which is

    TNBs term for SAS. Realizing the capabilities and potential benefits of IEC 61850, the standard has

    been identified as the key enabler standard and foundation for the technologies. Fig. 2 highlights the

    cluster of technologies in TRM.

  • 4

    Fig. 2. Clusters of Technology under TRM with IEC 61850 Standard as the Enabler

    With IEC 61850, TNB expects to achieve the following goals:

    1. Integration of SPACS with IEDs from different vendors, or multi-vendor solution. This is to reduce the risk of common cause of failure and failure modes of IEDs from the same vendor

    2. Standardized and self descriptive data models which explicitly defines the functions in power system domain. Such feature will simplify the engineering and configuration of SPACS.

    3. Seamless exchange of information between multi-vendor devices using standardized communication services.

    4. Vendor independent engineering and maintenance tools to ease the training and change management process of end users in maintaining SPACS.

    To ensure that the above expectations are met, it is imperative for TNB to have the facility, tools and

    procedure to:

    1. Test IEC 61850 compliant devices and systems to ensure the functions are actually available and within the required performance criteria

    2. Confirm the interoperability of the devices in utilizing IEC 61850 data models and communication services for information exchange

    3. Identify and rectify potential issues before the devices are implemented in TNB system 4. Understand the specific implementation of IEC 61850 by vendors due to the open nature of the

    standard

    Hence, in July 2007, the Engineering Department of TNB Transmission Division has appointed

    TNB Research Sdn Bhd (TNBR), a wholly owned subsidiary of TNB, to carry out a 3 year R&D

    program called Research and Development of Substation Automation System based on IEC 61850

    for Optimal Substation Design in TNB. As part of the research program deliverables, an in-house

    research and testing laboratory which is the System Verification and Simulation (SVS) Laboratory has

    been developed. The laboratory is equipped with IEC 61850 compliant IEDs and system which

    simulates the communication of secondary equipment as per actual substation. The overview of the

    SVS Laboratory is shown in Fig. 3.

  • 5

    Fig. 3. SVS Laboratory in TNB Research Sdn Bhd

    The next section will discuss on the overall design, communication architecture and capabilities of

    the SVS Laboratory.

    2. TNB IEC 61850 System Verification and Simulation (SVS) Laboratory

    SVS laboratory is designed to replicate a typical configuration of 132kV Air Insulated Substation

    (AIS). The configuration follows a double bus-bar configuration with two over headline bays, one bus

    coupler bay, two HV transformer bays and two MV transformer bays. Each bay is assigned with 2

    protection IEDs with duplicated functions of Main 1 and Main 2 together with 1 control IED. The

    IEDs are connected to a dedicated Ethernet Switch for each bay using star topology through RJ45

    cables. The Ethernet Switches between bays are connected using fiber optic cables that form a ring

    topology network. The ring topology provides n-1 redundancy of the network connection through the

    Rapid Spanning Tree Protocol (RSTP). This configuration has allowed the SVS laboratory to emulate

    IEC 61850 station bus communication architecture as in the actual substations. Fig. 4 illustrates the

    physical communication architecture of the laboratory.

    Fig. 4. Physical Communication Architecture for SVS Laboratory

    While the physical communication architecture describes the physical connection between devices,

    the information flow of the SVS laboratory is described by the logical communication architecture.

    IEC 61850 services such as Manufacturer Messaging Specification (MMS) and Generic Object

  • 6

    Oriented Substation Event (GOOSE) are implemented for client-server and server-server

    communication. Fig. 5 describes the logical communication architecture in SVS Laboratory.

    Fig. 5. Logical Communication Architecture for SVS Laboratory

    As shown in Fig. 5, IEDs in SVS laboratory are engineered and configured to exchange information

    between each other in order to execute various substation functions. The detailed functions are

    described in Table I. TABLE I

    SUMMARY OF COMMUNICATION SERVICES AND INFORMATION FLOW IN SVS LABORATORY IN FIG. 5

    Symbol Descriptions

    MMS message exchange between IEDs (server) and client applications

    GOOSE (Trip & blocking) message exchange between Protection IEDs within bay

    GOOSE (Interlocking) message between protection IEDs to Control IED within bay

    GOOSE message between one protection IED to another protection IED within the same bay or adjacent bay

    GOOSE (Inter-trip) message between Transformer

    HV protection IEDs and Transformer MV protection IED

    GOOSE (Interlocking Live Transfer) message between Bus Coupler Control IED and rest of bay Control IED within same voltage level

    IEC 60870-5-104 message exchange between Switchgear Simulator Remote Terminal Unit (RTU)

    and Human Machine Interface (HMI)

    To prove the interoperability using IEC 61850 standard, SVS laboratory applies the multi-vendor

    concept where IEDs from 3 different vendors were installed and configured to communicate and

    exchange information based on IEC 61850 data models and communication services as per described

    in Table I. The IEDs were successfully configured and interoperability using IEC 61850 has been

    achieved in SVS laboratory. The detailed information of the IEDs and other devices installed in the

    SVS laboratory is described in Table II.

  • 7

    TABLE II

    DEVICES IN SVS LAB

    Equipment Manufacturer/

    Models

    Protection IED Protection 1: NR-PCS 931, PCS 9611, PCS 978

    Protection 2 : GE Multilin-L90, F35, T60

    Control IED NR-PCS 9705

    Automatic Voltage regulator IED Maschinenfabrik Reinhausen (MR)-Tapcon 260

    Managed Ethernet Switch RuggedCom-RS 900

    Time Server Tekron TCG 02-E

    Switchgear Simulator Xenon HMI server

    Brodersen-RTU 232 with auxiliary relay contacts

    Incontrol Tech-iTec 680 touch-screen based monitor

    Secondary Testing Equipment Omicron-CMC 256plus with CMIRIG-B

    The software applications that are used in the SVS laboratory are divided into two categories, which

    are the proprietary or hardware based applications and independent applications. The list of software

    applications is shown in Table III. TABLE III

    SOFTWARE APPLICATIONS IN SVS LABORATORY

    Proprietary software Independent software

    IED configuration tools-PCS PC and Visual SCD for NARI IEDs and Enervista for GE Multilin IEDs.

    Client-Server and peer to peer communication applications-Omicron IED Scout

    Secondary testing application- Test Universe for Omicron 256plus

    Third party IEC 61850 System Configuration Tool-HELINKS STS

    Network Monitoring and Management-RuggedNMS for RuggedCom Ethernet switches

    Network Protocol Analyzer-MMS Ethereal and Wireshark

    HMI design-STRATON HMI Design Tool

    As mentioned earlier, one of the main functions of the SVS laboratory is to serve as the platform to

    test and verify IEC 61850 compliant devices before they are deployed in TNB system. This is

    facilitated under TNB product acceptance process where the IEC 61850 features of a device, typically

    IED, are meticulously tested and verified against TNB IEC 61850 requirement. The next section

    elaborates the implementation of the product acceptance process and highlights some findings related

    to interoperability during the tests.

    3. TNB Product Acceptance Process

    Starting from September 2013, the SVS laboratory has been utilized for TNB product acceptance

    process for IEC 61850 compliant devices, which mostly are IEDs. The significance of having an

    internal IEC 61850 product acceptance process is although most IEC 61850 compliant devices have

    been tested at independent test laboratories, there is no guarantee that that the devices can interoperate

    when assembled together in a system. This is mainly because the tests conducted at independent test

    laboratories are IEC 61850 conformance tests, which focuses on the IEC 61850 functionalities of the

    devices [7]. Hence, there is a need for TNB to establish a platform to be able to verify the

    interoperability aspect of the devices before they are installed in actual substations. Using the existing

    IEDs, communication network and testing tool in SVS laboratory, the test setup for the product

    acceptance process is shown in Fig. 6.

  • 8

    Ethernet Switching Local Area Network

    TIME SERVER

    GPS

    CLIENT

    DEVICE UNDER TEST(DUT)

    NETWORK ANALYSER

    GOOSE SIMULATOR

    SECONDARY INJECTION TEST

    SET

    SWITCHGEAR SIMULATOR

    IED CONFIGURATION

    TOOLS

    SCL CHECKER

    SCLFILES

    CONFIG.FILES

    SYSTEM CONFIGURATION

    TOOL

    IED CONFIGURATION

    TOOLSSCD FILE

    IRIG-B Time Bus

    Control

    Statuses

    VoltageCurrent

    Binary Output

    Binary Input

    REFERENCE INTELLIGENT ELECTRONIC

    DEVICE (RIED)

    Fig. 6. Test Setup for TNB Product Acceptance Process

    Even with constraints on tools, such as the unavailability of established IEC 61850 protocol

    analyzer and traffic generator, SVS laboratory is still able to conduct significant amount of test to

    verify the IEC 61850 features and capabilities of an IED in ensuring its compliance to the standard

    and TNB requirement. Table IV highlights the test cases which are tested in the test procedure. TABLE IV

    TEST CASES IN TNB IEC 61850 INTEROPERABILITY AND VERIFICATION TEST PROCEDURE

    DOCUMENT AND VERSION CONTROL

    1. DUT IEC 61850 Document Verification 2. DUT IEC 61850 Compliance with TNB Requirement

    CONFIGURATION FILE

    1. .icd File Schema Confirmation 2. .icd File General Content Verification

    DATA MODEL

    1. Logical Node (LN) Mandatory Objects Verification 2. Logical Node (LN) Mandatory Data Objects/Data Attributes Verification

    ASSOCIATION MODEL TEST

    1. Client Associations Test 2. Lost Connection Detection Test 3. Startup After Power Interruption Test

    SERVER MODEL TEST

    1. Quality Bits for Analog Value Test 2. Quality Bits for Status Value Test

    DATASET MODEL TEST

    Maximum Number of Dataset Elements Test REPORT MODEL TEST

    1. Self Descriptions Of Report Control Block (RCB) 2. RCB Trigger Options 3. RCB Optional Fields 4. BRCB Association Test 5. URCB Association 6. Buffering Events 7. Purge Buffered Events 8. Segmented Report

    SELF DESCRIPTIONS OF GOOSE CONTROL BLOCK (GoCB) TEST

    CONTROL MODEL TEST

    1. Direct Control With Normal Security 2. Select Before Operate (SBO) - Positive Response Test 3. Select Before Operate (SBO) - Negative Response Test

    IRIG-B TIME SYNCHRONIZATION TEST

    SNTP TIME SYNCHRONIZATION TEST

    DUT GOOSE COMMUNICATION LATENCY PERFORMANCE AND TEST MODE FEATURE TEST

  • 9

    1. Secondary Injection Test (SIT) And Device Under Test (DUT) Test 2. Reference Intelligent Electronic Device (RIED) And Device Under Test (DUT) Test 3. Goose in Test Mode Test

    CLIENT and DEVICE UNDER TEST (DUT) TEST

    FILE TRANSFER TEST

    As of January 2014, 12 IED models for 4 different vendors has been tested and approved to be

    deployed in TNB. However, regardless of the IEDs having certified as IEC 61850 compliant, issues

    related to IEC 61850 functional and interoperability are still observed. Some of the issues are [8]:

    1. The performance of GOOSE message for protection tripping was not as fast as declared. This will impact the performance of protection function if GOOSE is used for tripping. Fortunately, TNB only specifies that GOOSE message is to be used for non-time critical functions such as

    interlocking for the time being.

    2. IED tested or device under test (DUT) could not interoperate with some IEDs in SVS laboratory despite of exhaustive engineering and configuration effort. This has raised the

    question of the degree of interoperability of the DUT.

    3. Capability declaration of DUT in its IEC 61850 documents did not match with the actual capability of the DUT, such as inability of sending buffered reporting after connection failure is normalized, although the DUTs were from the same vendor but different model. These are

    shown in Fig. 5 and Fig.6. Some DUT also showed missing data object and data attributes

    although they were declared supported in the documents.

    Fig. 7. Vendor X Model A-Buffered reports were not sent after connection failure is normalized

    Fig. 8. Vendor X Model B-buffered reports were sent after connection failure is normalized

  • 10

    4. Certain DUT configuration tools were not able to parse Substation Configuration Language

    (SCL) file generated using third party engineering tool. This will restrict the engineering process as users need to fully rely on vendor proprietary for engineering and configuration of

    IEC 61850.

    5. Unexplained error message generated by DUT was observed during the test for control function. The control command was successful but the latest status was not updated to the IEC 61850

    client simulator. This is illustrated in Fig. 9. Vendor has yet to provide an explanation on this phenomena

    Fig. 9. Unexplained No-error error observed in Vendor Y DUT when performing control function

    6. Significant deviation of DUT timestamp was also observed although the DUT were

    synchronized using external IRIG-B time synchronization protocol. The vendor highlighted that it was due to the event sorting method implemented in the DUT that has caused the delay

    in time stamping

    The above observations have shown that the importance of having an in-house testing facility and

    methodology to test IEC 61850 compliant devices before they are installed in the system. This is to

    ensure that the implementation of IEC 61850 will not pose unnecessary risk to the system, in

    particularly SPACS. Although the issues may look trivial, if they were not discovered and rectified

    earlier, there is high probability that they may affect other critical substation functions that may

    jeopardize the reliability and availability of TNB transmission network when deployed.

    Apart from testing works, the SVS laboratory is also utilize as research and development platform

    for TNB to further explore advanced functionalities that can be achieved from IEC 61850 and Smart

    Grid domains. The next section will discuss on TNBs vision to develop in-house software

    applications for the operation and maintenance of IEC 61850 compliant substation and systems.

    4. Development of IEC 61850 Substation Intelligent Management System (SIMS) in-

    house software applications

    The SIMS initiative is intended to develop in-house software applications that can be utilized as

    operation, maintenance and monitoring tools for IEC 61850 based substations. Unlike commercial off-

    the-shelf tools, in-house developed tools are independent from any patent or contract restrictions from

    vendors. Hence, there will be no cost impact to TNB in fully utilizing or make any changes to the

    tools. Furthermore, these tools are independent from IED vendors hence associated issues related to

    IEC 61850 interoperability can be minimized. The overview of SIMS platform is shown in Fig. 10 [9].

  • 11

    Fig. 10. TNB IEC 61850 SIMS platform

    The key elements in the SIMS platform are the software applications which are intended for various

    operation, maintenance, monitoring and analytic purposes. In total there are 16 applications which

    were developed under SIMS using National Instruments LabViewTM

    programming software. Some

    notable applications are:

    1. Communication Network Management (NetView) 2. Fault and Disturbance Analysis Viewer (FastView) 3. Substation Asset Monitoring (SAM) 4. GOOSE Message Viewer (GOOSEVIEW)

    The snapshots on some of the applications above are shown in Fig. 11 and Fig. 12.

    Fig. 11. SIMS NetView Application

    Fig. 12. Publisher-Subscriber Matrix for SIMS GOOSEVIEW

  • 12

    The main challenge during SIMS development was the design of IEC 61850 Communication Stack

    as TNB has decided not to use any commercially available stacks to avoid any potential restriction in

    further developing and implementing the applications in the future. The IEC 61850 Communication

    Stack is the heart of all the 16 applications and the SIMS initiative is currently still on-going to further

    improve and enhance the stack.

    Conclusion

    The initiatives implemented by TNB has allowed the utility to have better insight in achieving

    interoperability using IEC 61850 which is vital to ensure the successful Smart Grid implementation. It

    is also believed an in-depth understanding regarding the key enablers of interoperability should be the

    main focus for utilities before embarking in any Smart Grid initiatives. This is to avoid unnecessary

    cost implications and technical issues that may hinder the Smart Grid implementation.

    References

    [1] Zhong Fan, et al. Smart Grid Communications: Overview of Research Challenges, Solutions and Standardization Activities, IEEE Communications Surveys & Tutorials, Vol. 15, No. 1, First Quarter 2013

    [2] Mahesh Sooriyabandara, Janake Ekanayake, Smart Grid-Technologies for Its Realizations, 2010 IEEE International Conference on Sustainable Energy Technologies (ICSET), 6-9 December 2010, Kandy, Sri Lanka

    [3] Xin Mao, et al. Comparing Smart Grid Technology Standards Roadmap of the IEC, NIST and SGCC, 2012 China International Conference on Electricity Distribution (CICED), 5-6 September 2012, Shanghai, P.R. China

    [4] NIST Special Publication 1108R2 NIST Framework and Roadmap for Smart Grid Interoperability Standards, Release 2.0 February 2012. [Online]. Available:www.nist.gov/smartgrid/

    [5] R.E. Mackiewicz, Overview of IEC 61850 and Benefits, Transmission and Distribution Conference and Exhibition, 21 24 May 2006, Dallas, Texas, USA,

    [6] Aminuddin Musa IEC 61850, Enabler of Smart Substations, Proceedings of 1st TNB ICT Technical Conference, College of Information Technology, 21-22 February 2011, Kajang,

    Selangor, Malaysia

    [7] J.C. Tan, C. Zhang, Z.Q. Bo, The Importance of IEC 61850 Interoperability Testing, 43rd International Universities Power Engineering Conference, 1 4 September 2008

    [8] Mohd Iqbal Ridwan, et al. Standardized IEC 61850 Product Acceptance Procedure for Intelligent Electronic Devices: A Malaysian Power Utilitys Experience, OMICRON 2013 International Protection Testing Symposium, 24-26 September 2013, Boston, Massachusetts, USA

    [9] TNB Research Sdn Bhd R & D Project Final Report, Study and Development of Integrated and Standardized Engineering Workstation (EWS) Applications for TNB Transmission IEC 61850 Based Substation Automation System, Revision 4.0, July 2012