Technology Trend and Application of OLED-on-CMOS (OLEDoS)

Fraunhofer IPMS

Dr. Uwe [email protected]

Technology Trend and Application of OLED-on-CMOS (OLEDoS)

Center for Organic Materials and Electronic Devices Dresden (COMEDD)Fraunhofer Institute for Photonic Microsystems (IPMS), Dresden, D-01109, Germany

2

Fraunhofer IPMS


time

com

plex

ity

Monochrome PM-Display

MulticolorPM-Display

Full colorPM-Display

Full colorAM-Display

Microdisplay See-throughMicrodisplay

MobileProjection

Display

MobileFlexibleDisplay

i AR

Mobile display driving forces: Multimedia content information navigation

by user interaction (touch screen,...)

augmented-reality (AR)

Mobile Display Dilemma micro-displays (

3

Fraunhofer IPMS


Definition

Physically very small, but

High information content (TV quality)

Active matrix substrate (often CMOS)

Low power consumption

Enlarged image viewed through magnifying optics

Applications

Projection

Rear projection

Front projection

Micro projection

Near-to-Eye (NTE)

Electronic Viewfinder (EVF)

Hand-held

Head Mounted Display (HMD)

Professional

Consumer

Microdisplays: Definition, Application (general)

4

Fraunhofer IPMS


OLED-on-CMOS(OLED-on-Silicon/OLEDoS)

5

Fraunhofer IPMS


Key features

highly-efficient OLED light source in/on CMOS

extremely thin (~100nm)

small-molecules/vapor phase (SM-OLED)

polymers/ liquid phase (P-LED)

arbitrary shapes

all colors monochrome, white, NIR

excellent current/power efficiency (low-voltage, low-power)

good/improving lifetime (several 10kh)

self-emissive

fast response time (MHz)

electronics feature integration

driving, acqusition, processing, control

sensor co-integration

CMOS-compatible sensors

embedded photodetectors

temperature

magnetic (Hall)

M(O)EMS,...

Light emission +_

top-emitting

intransparent substrate

transparent conductororganic layersmetal cathodesubstrate

(Silicon CMOS wafer)

CMOS cross-section with OLED on top

Introduction OLED-on-CMOS

6

Fraunhofer IPMS


-5 -4 -3 -2 -1 0 1 2 3 4 510-610-510-410-310-210-1100101102

101

102

103

104

105

orange emitter red emitter white emitter system

Cur

rent

den

sity

[mA

/cm

]

Voltage [V]

Lum

inan

ce [c

d/m

]

Top-emitting p-i-n OLED

based on small molecules(NOVALED AG)

evaporated on Si-wafer

intransparent bottomelectrode (Si-CMOSsubstrate)

transparent top electrode

high transparency

low sheet resistivity

Ag, Al or Yb

Doped charge transport layers

yield better OLED performance

reduce operating voltage

avoid CMOS HV devices

lower power dissipation atequivalent radiance

5.7

11.6

14.1

Currentefficiency

[Cd/A] @100cd/m

4.73.2white

12.0003.22.5ora

3.12.4red

@1000cd/m

@100cd/m

lifetime

@1000cd/m

Voltage [V]

Introduction OLED-on-CMOS

7

Fraunhofer IPMS


OLED post-processing SUNICEL plus200 by Sunic System, Ltd.

(Korea) Silicon and quartz wafer: 150 mm/6,

200 mm/8, thickness: 0.6 to 0.8 mm Configuration

7 process chambers 12 organic sources 5 inorganic sources 2 PVD sources Ar/O2 plasma activitation

Cycle time: ~ 60 min Pilot capacity: ~ 6000 wafers/a

CMOS (so far) 1.0, 0.6, 0.35, 0.18m

processes integrated, mixed-signal circuit design

by IPMS/COMEDD wafers contract-manufactured at

silicon foundry providers (e.g., X-FAB)

OLED-on-CMOS: Device Manufacturing/SM-OLED

8

Fraunhofer IPMS


PLED R&D and production line Si-wafer 200 mm Etching / Sputtering Clustex 200 | Leybold

Optics Spin coating EVG120 | EVG Nitrogen oven MB-OV | MBraun Etching, deposition by thermal evaporation

and Barix thinfilm encapsulation Helisys | ANS Korea Full-automated wafer bonding system

Hercules | EVG Wafer prober Pegasus PA200 | Wentworth Microscopes Eclipse L200 | Nikon Ellipsometer M-2000U | J. A. Woollam Particle scanner Surfscan 7700 | KLA Tencor former microdisplay production line of

MicroEmissive Displays Germany GmbH (MED) installed by MED at IPMS premises in

E/2006..B/2007 original product: MED eyescreen

ME3204 (QVGA, RGB) acquired by IPMS E/2009

OLED-on-CMOS: Device Manufacturing/P-LED

9

Fraunhofer IPMS


microdisplays microdisplay

HMD, mobile/micro-projection, HUD, electronic viewfinder (EVF),...

bi-directional microdisplay (display + embedded camera) interactive HMD, optical inspection,...

sensors optical sensors

fluorescence, color, flowmetry, photoplethysmography,...

embedded illumination for image sensors patterned illumination possible optical finger-print, lab-on-chip,...

light barriers (reflective) opto-coupler

autostereoscopic 3D displays mobile devices (single user, single/multi

view)

objectsurface

OLED CMOS detectorCMOS substrate (wafer) CMOS circuit

encapsulation

organic-opto-micro-system

micro-optics

OLED-on-CMOS: Applications

10

Fraunhofer IPMS


OLED micro-displays

11

Fraunhofer IPMS


colour VGA (640x480) OLED micro-display for HMD and micro-projection

24 bit parallel video interface

color options

monochrome (8 bit)

full colour (24 bit)

digital pixel cell

luminance control by pulse width (PWM)

color, contrast and gamma correction control via IC

0.18m CMOS foundry process

core supply 1.8V

digital 1.8V I/O interfaces

negative OLED cathode voltage (max. -5.5V)

active area 7.68x5.76mm

chip size 12x11mm

High brightness

up to 10,000 nits for monochrome green (micro-projection)

1,000 nits for RGB colour (HMD)

IC interface (configuration)

50/60Hz frame rate7.7mm

5.8m

m

OLED microdisplay: HYPOLED

12

Fraunhofer IPMS


Demonstrator

Full-color VGA microdisplay

MediaBox (DVB-T, DVB-H, WLAN)

Full-color VGA microdisplay

MediaBox

HYPOLED: System integration

13

Fraunhofer IPMS


OLED m

icrodisp

lay head-mounted display (HMD)

micro-projection optics (MPU)

MediaBox (DVB-T, DVB-H, WLAN)

MPU (3-panel)

MediaBox

HYPOLED: System integration

14

Fraunhofer IPMS


embedded photodetectors CMOS photodiodes

lower level than OLED side-by-side with active

electronics devices emission and detection can

be operated in parallel orsequentially

possibly shaping of OLED emissioncharacteristics (angular, spectralwidth)

OLED-on-CMOS: photodetector integration

OLED CMOS detectorCMOS substrate(wafer) CMOS circuit

encapsulationmicro-optics

15

Fraunhofer IPMS


OLED-Microdisplay

320 x 240 (QVGA)

Embedded image sensor

160x120 (QQVGA)

Embedded Computersystem

OLED micro-display mode

image sensor mode

inverted camera image

system setup

feedback-mode demonstrator

Bi-directional OLED micro-display

16

Fraunhofer IPMS


Bi-directional OLED microdisplay Feedback-mode demonstrator

no imaging optics so far

18

Fraunhofer IPMS


Head-mounted display (HMD) application: aimed at tracking the eye movement with respect to user's sight (consciously and unconsciously) user's (situation) awareness (unconsciously)

gaze-based human-display-interaction visual Input-/Output-Device (I/O) for personal

information management (PIM) interactive augmented-reality (AR) applications

see-through optics

real view

virtual image virtualzoom-inbutton

virtualzoom-outbutton

virtual street map

interaction object

53 km/h Radio

Navi

Men

Display off

-1

30

60

www.lumusvision.com

HMD carrier

bi-directionalOLED microdisplay

mobile hostplatform

Bi-directional OLED micro-display: HMD application

19

Fraunhofer IPMS


iSTAR: Bi-directional OLED micro-display

i AR

See-through view, display on

Near-to-eye projection optics attached to commercial sports goggles

ST-Prism and IR sources (eye scene illumination)

Interactive see-through augmented-reality displays (iSTAR)

Fraunhofer-internal collaborative project (WISA)

Display: VGA 640x480, full-color

embedded camera

128x96 pixel

frame camera

1280x80 pixel

20

Fraunhofer IPMS


Consumer head-mounted

Displays fr Smartphones, mobile TV (3D)

electronic viewfinder (EVF)

Industrial HMD Optical Inspection

Medizin HMD, lab-on-chip,

functionalmicroscopy

Automotive HMD, opto-

coupler MIL

ST-HMD

ThermocouplesPart No. 467-854

More Information

Yes No ?

SMS by " BOSS" :(Wed, 05/02/14, 18:21)

Hi Paul,how about our meeting today?Have you missed it? Please call back immediately!Rgds, BOSS.

CALL DEL ESC

OT: 5:35

SPL: 60dB

BP : 40/105

F: 23mNHR: 93

SPL

CT: 14:21

LAS MOB

f: 1kHz

Markets

21

Fraunhofer IPMS


Outlook

22

Fraunhofer IPMS


Organics Micro-Patterning

OLED Microdisplay Fabrication by Orthogonal Photolithography (OLITH)

Aims

full-color OLED micro-displays w/o color-filter (CF)

high-resolution (90%)

fast, parallel processing

scaleable onto 8 wafers and beyond

Advantages

high OLED efficiency (10x)

better stability (via color-specificstack design)

widened color gamut

no color diffusionWater solutionFluorous solution

Octadecenesolution

23

Fraunhofer IPMS


color-by-color OLED microdisplays color gamut current/power efficiency , power consumption

Enhanced hardware/circuitry integration additional, non-optical CMOS sensorics (e.g. magnetic) additional system features

e.g., embedded eye-tracking high-luminance OLED microdisplays (>1000cd/m)

ST-HMD outdoor micro-projection (ultra-flat optical module)

micro-signs no active CMOS small die size cost-effective

passive, i.e., external drive/control very fine patterning of emission areas e.g., signs, 7-segment displays,...

micro-optics integration (in cover glass) beam steering, shaping

high-temperature OLED-on-CMOS (lifetime) ..+85..105..125C

NIR-OLED integration 750..900nm

3D+ high-res, high-speed emissive image source

new applications sensors

1.3 mm

2 m

4 m

~60 mm

Outlook

24

Fraunhofer IPMS


Tool extension to combine SM-OLED & P-LED Extension of 8 P-LED tool by SM-OLED

add 2 organic evaporationchambers

liquid and vapor phaseprocesses in single clustertool

hybrid OLED (small-molecules + polymers)

eBeam, sputter chamber and etcher allow new processesfor SM-OLED

attractive for 8 wafercustomers due to uniquelarge variety of processes

etcher, eBeam, Vitex-TFE, metal evaporation, sputter, organicsevaporation

FAT Q1..2/13

further extension feasible

25

Fraunhofer IPMS


R&D and pilot-fabrication of OLED Microdisplays & Sensors

design, process development/integration, system integration

OLED micro-displays (QVGA..XGA), bi-directional (display and imager in singledevice, QVGA..SVGA)

backplane CMOS IC design (in silicon foundryprocess, 0.11..0.6m)

proprietary OLED module @ silicon foundry

OLED processing (SM-OLED & P-LED)

system design (e.g., multimedia controller)

applications (e.g., head-mounted display)

pilot fabrication lines

pilot line OLED-on-CMOS (8 Si wafer)

pilot line PLED-on-CMOS (ex MicroEmissiveDisplays production line, 8 Si wafer)

- Confidential -

COMEDD: Business Unit OLED Microdisplay & Sensors

26

Fraunhofer IPMS


Dr. Uwe Vogel Business Unit Manager OLED Microdisplays and Sensors Center for Organic Materials & Electronic Devices Dresden (COMEDD) Fraunhofer Institut fr Photonische Mikrosysteme (IPMS)

Maria-Reiche-Strasse 2 D-01109 Dresden

phone:+49-351-8823-282 email: [email protected]

Thanks to collaborative partners: X-FAB Semiconductor Foundries; Novaled, Fraunhofer IOF, IOSB, IGD; TU Dresden

Work was in parts sponsored by European Commission within the HYPOLED project (High-Performance OLED-Microdisplays for Mobile Multimedia HMD and

Projection Applications, ICT-2007.3.2-217067) Federal Ministry for Education and Research of the German government (Bundesministerium fr Bildung und Forschung),

BMBF 01 BK 916-919, 16SV2283/"ZOOM", 16SV3682/"ISEMO" Schsische Aufbaubank (SAB) of the State of Saxony (11107/1733) Fraunhofer Internal Programs iSTAR, Grant No. WISA 817 805 (Industry-focused strategic alliance)

See you!

http://www.eetimes.com/electronics-news/4213523/Photo-gallery-Eye-on-innovations-at-ISSCC

Contact

Documents

Technology Trend and Application of OLED-on-CMOS (OLEDoS)