Techniques for Improving Element Bandwidth

Name :Ashish S. PatilRoll no.:14MV009ME MICROWAVE

CONTENT :

Overview

Impedance matching technique for increasing bandwidth of MA

Probe compensation in Thick Microstrip patch

Increasing bandwidth of microstrip antenna by Proximity coupling

Characteristic of two layer electromagnetically coupled RPA

The SSFIP: A global concept for high performance broadband planar antenna

OVERVIEW

Impedance bandwidth

Pattern bandwidth

Gain bandwidth

Impedance matching technique for increasing bandwidth of MA

Bandwidth increase by increasing substrate thicknessOr dielectric constant reduced

But this is limited by inductive Impedance

This problem overcome by use thick substrate with same type Of additional impedance matching to cancel inductance

This paper use Bode Fano criteria to design matching network can Increase impedance bandwidth by 10-12%

Probe compensation in Thick Microstrip patch

Increase the substrate thickness

Inductive effect occur in which probe inductance prevent matching of patch impedance to input connector

This inductive effect can be overcome by adding series capacitorin probe feed circuit

Increasing bandwidth of microstrip antenna by Proximity coupling

Proximity coupling using small open tuning stub

Stub is connected in shunt with feed line

Provide broad bandwidth without excess substrate thickness

Characteristic of two layer electromagnetically coupled RPA

Bandwidth extension technique use two or more stagger tuned Resonator

Implemented with stacked patches or combination of dissimilar Element filled by air

Bandwidth increase from 10 to 20%

The SSFIP: A global concept for high performance broadband planar antenna

SSFIP = Strip-Slot-Foam-Inverted-Patch

Slot size used to increase bandwidth

Foam antenna substrate was used at x band to achieve excess ofbandwidth of 20%

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