RGM-300XGrinding System for Rotary Dressor

Specifications

TechMAC Co., LTD

◇ To make truing of Grinding Wheel ◇ 5 AXIS Mechanism

( 4 translation, 1 rotation )◇ High Frequency Spindle◇ R Machining using C Axis◇ large R Machining with XYC Axes◇ Control Panel with Hand-wheel Jog◇ Post Processing Software◇ Projector Reference ◇ PC based CNC

Controller PC-NC Tool Path GeneratorBLU : 0.0001mm

0.0001degree

Work-piece Rotary Motion C Direct Drive

Work-piece Linear Motion X (전후)Y (좌우)

Precision Ball ScrewMechanical LM Guide

Wheel Linear Motion U (좌우)V (전후)

Precision Ball ScrewMechanical LM Guide

Wheel 스핀들 (Spindle) 회전수용량

Max. 4,000 rpm1.5 kWWheel size : Ø300 x 10 (Ø60)

Work-peice 스핀들 (Spindle) 회전수용량

Max. 600 rpm0.12 kWWheel size : Ø200 x 220

Projection Instrument Screen sizeMagnificationManual XYZ

Absolute Linear Scale

30020x

Moving Range X, Y, CU, V

140, 330, +/-90170, 260

전기공급용량 (Electric) 전압용량

220 V 3상 & 380 V 3상약 20kW

Process : Loading/Unloading: Non contact Wafer Measuring, Notch Search: Wafer Centering: Round Edge Grinding : Notch Edge Grinding : Wash

Machining Range X Axis 200mm

Y Axis 200mm

Z Axis 80mm

C Axis ±180 degree

Machining Resolution

X Axis 0.0001mm

Y Axis 0.0001mm

Z Axis 0.0001mm

C Axis 0.00014 degree

Accuracy Straightness of X Axis ± 1 µm

Straightness of Y Axis ± 1 µm

Straightness of Z Axis ± 1 µm

Axial Error of C Axis 2 µm

Measuring Diameter, Thickness,Notch SearchCenter Compensation algorithm

Resolution : 0.1um

Wash DIW Wash & Spin Dry Notch positioning

Grinding Station 2set

Wash Station 2set

CNC Controller PC based Control- Parallel Control

XY InterpolationYӨ Interpolation

Specifications

TechMAC Co., LTD

12” Wafer Edge Grinding Machine

DOF : 8 AxesComposition : Linear motor, AC servo, Micro StepperSeal structure Microscope Vision 2set includedContinuous Interpolation Accuracy

Linear Straightness : below 1.0 umRun-out : below 1.0umLinear BLU : 0.1umRotational BLU : 0.0001 degree

Air-Spindle included

Ultra-Precision Grinding MachineTechMAC Co., LTD

DrillGMC-5HHybrid Drill Grinding System

TechMAC Co., LTD

◇ Hybrid Function(Grinding, EDG, CMM)◇ Easy to use Program◇ High Stiffness/Fine Resolution◇ Touch Probe◇ Tool Offset Sensor◇ PC based CNC◇ Control Panel with Hand-wheel Jog◇ Post Processing Software◇ Air Utility WC Ø0.8, H.A=30°, P.A=120°

WC Ø0.6, H.A=30°,P.A=100°

P1P

‘1 r∙

ε

r∙ε∙

cot

β

90°-β

P1

P‘1

X

Y

Z

β

Stroke

X axis 320

Y axis 440

Z axis 160

B axis(P/S Mode) ∞

C axis ±180°

ResolutionLinear Motion 0.00001mm

Rotary Motion 0.0001°

Full Close Control System Scale base

Spindle drive 2 KW

Grinding wheel diameter 80mm max.

Dimension 1600x1600x2000

Electrical Connection Ø3, 220V, 20KW

WC EDG 가공 상황 WC 외경 방전 특성

PCD 외경 방전면 조도 (Ra = 0.4um)PCD micro PIN

PCD micro Tool

Specifications

UPL-200Ultra Precision Machining System

: Various Machining Function such as

Milling, Turing, grinding, Shaping

: Slide/Spindle Technology

: Coreless Linear Motor Driving

: 10nm Feedback Resolution

: Precision Linear/Rotary Motion

: Tool Set-up Apparatus with Nano-stage

: Granite Machine Base mounted

Passive Air Isolation System

Machining Range X Axis 250mm

Y Axis 250mm

Z Axis 80mm

C Axis ±180 degree

Resolution X Axis 0.0001mm

Y Axis 0.00001mm

Z Axis 0.00001mm

C Axis 0.00018 degree

Accuracy Straightness of X Axis ± 0.05 µm

Straightness of Y Axis ± 0.4 µm

Straightness of Z Axis ± 0.4 µm

Axial Error of C Axis 2 µm

Overall Dimensions Width x Length x Height 700 x 800 x 1500

CNC Controller PC-NC Controller 4 Axes InterpolationExternal DIO/AIO ControlEthernet interface

Specifications

TechMAC Co., LTD

UPL-200Ultra Precision Machining System Micro Groove Machining

Mechanical Micro Machining Tools for micro-molding Lens machiningTurning Applications

Typical Application

1 방향 가공 샘플

(V Groove 가공깊이 : 0.005mm) (V Groove 가공깊이 : 0.025mm)(X2000)

Pyramid 가공 샘플

X100 X200

X100SEM

X500SEM

10 15 20 25 30 35 40 45

0

10

20

30

40

50

60

70

80

Posit

ion (n

m)

Time (sec)

Accuracy/Response

0.01㎛0.1㎛

Flight-1200XGiant 5 Axes Machining System

Specifications

TechMAC Co., LTD

◇ 5 AXES Mechanism( 3 translation, 2 rotation )

◇ High Frequency Spindle◇ Auto Tool Changer◇ Tool Offset Sensor◇ PC based CNC◇ Control Panel with Hand-wheel Jog◇ Post Processing Software◇ Oil Chiller◇ Air Utility

스트로크 (Stroke) X, Y, ZC, A

6500, 12000, 3500 mm±180, ±100 degree

최대속도 (Max. Speed) X, Y, ZC, A

500 mm/sec (30000 mm/min)50 deg/sec (3000 deg/min)

위치제어분해능 (Resolution) X, Y, ZC, A

0.001 mm0.0001 deg

구동모터용량 (Servo Motor) X, Y, ZC, A

3.5, 2x3.5, 1.5/3.5 kW

스핀들 (Spindle) 회전수용량

Max. 24,000 rpm11 kW

공구보정센서 (Tool Offset Sensor) 반복정밀도 1.0 um

자동공구교환장치 (ATC) 공구수 10 EA

컨트롤러 (CNC Controller) 8-axes PC-NC ControllerExternal DIO/AIOExternal Controller for U’Cart

전기공급용량 (Electric) 전압용량

220 V 3상 & 380 V 3상약 10kW

Flight-1200XGiant 5 Axes Machining System

TechMAC Co., LTD

System Configuration

CNC Display Post Processor

5축 몰드 가공 5축 수지 도포 5축 수지 가공

TechMAC Co., Ltd www.techmac.co.kr

5 Axis Milling Machine

Specifications

스트로크 (Stroke) X, Y, ZC, A

150, 150, 100 mm±180, ±100 degree

최대속도 (Max. Speed) X, Y, ZC, A

50 mm/sec 10 deg/sec

위치제어분해능 (Resolution) X, Y, ZC, A

0.001 mm0.0001 deg

구동모터용량 (Servo Motor) X, Y, ZC, A

400 W

스핀들 (Spindle) 회전수용량

Max. 24,000 rpm200 W

전기공급용량 (Electric) 전압용량

220 V 3상

NanoCELLNon Contact Surface Profiler

SpecificationsVertical Measuring Range Z-Axis 100 um

Vertical Resolution Z-Axis 1 nm

Lateral Resolution X-Y Plane 0.2-4um(Objective Dependent)

Objectives. Interferometric 50x (Selection)Manual Turret (Option)

FOV 0.32x0.24

Guide-way High-Precision Linear Guide

Light Source Coaxial Tungsten Lamp

X-Y Table CNC 50 x 50 mm

Scanner Fine Feeding Mechanism Piezo Actuator

Z Table Course Feeding Mechanism 50 mm

Vibration Table Desk top

Analysis Software Profile/RoughnessFiltering Process Cross-Section Display3D Surface Display

PerformanceEnvironment

20°C ~ 25 °CNo external vibration

Utility Requirement VoltageFrequencyCurrent

220 VAC±10%, Single Phase50/60 Hz5A

• Non Contact Measurement

• Nanometer Vertical Resolution

• WSI Measuring Method

• Easy To Use

• High Performance

TechMAC Co., LTD

NanoCELLNon Contact Surface Profiler

• Application

• Sample Measurement

• Principle

Micro Lens Micro Tool Thin film thickness

CCD

Piezo Scanner

Close LoopController

-Inspection of LCD Defect-Measurement of MEMS Structure-Roughness of Patterns-Inspection of Machined Surface-Dimension Analysis/Quality Control

TechMAC Co., LTD

Intensity Analysis

Work-piece

Raw data of fringe pattern

Specifications

TechMAC Co., LTD

• Non Contact Measurement

• Nanometer Vertical Resolution

• WSI/PSI Measuring Method

• Easy To Use

• Low Cost

• High Performance Algorithms

• Manual Stage

NanoCELLNon Contact Surface Profiler

Items Specification

ControllerSerial CommunicationPower supplier(CCD & LED)

CCD Camera Image size: 640*480

PZT & SG Stroke : 100um, Strain gauge sensor

Objective Lens 50x or 10x

Light Source High-power LED(White warm)

X-Y-Z StageStroke : 15mmManual stage

Inclination Stage Manual stage

WSI Algorithms PSI Algorithms

TechMAC Co., LTD NanoCELLNon Contact Surface Profiler

Measuring Sample

TechMAC Co., LTD NanoCELLNon Contact Surface Profiler

Unwrapping Process

Micro lens measurement by PSI Algorithms

Linear Scale Grating measurement by WSI Algorithms

Interferometric Measuring Module

Specifications

TechMAC Co., LTD

• Non Contact Measurement

• Nanometer Vertical Resolution

• WSI/PSI Measuring Method

• Easy To Use

• Low Cost

• High Performance Algorithms

• Motorized Stage

NanoCELL-plus Non Contact Surface Profiler

Items Specification

ControllerSerial CommunicationPower supplier (HV amplifier & LED)

CCD CameraImage size: 640*480USB protocol

PZT & SG Stroke : 100um, 20um, Strain gauge sensor

Objective Lens 50x, 10x turret method

Light Source High-power LED(White warm)

X-Y-Z StageStroke : 20mmMotorized stage

Inclination Stage Manual stage

WSI Algorithms PSI Algorithms

TechMAC Co., LTD NanoCELLNon Contact Surface Profiler

TechMAC Co., LTD NanoCELL-plusNon Contact Surface Profiler

Unwrapping Process

Unwrapping Procedure

ç Surface Roughness of Wafer Back Grinding

ç LCD Pattern 1

LCD Pattern 2 è

Thin Film Thickness è

SpecificationsMeasuring Range X-Axis

Y-AxisZ-Axis

100 mm100 mm50 mm

Resolution 0.00005 mm

Accuracy RepeatabilityLinear Displacement Accuracy

+/- 1 µm3.0 µm for each axis

Overall Dimensions WidthLengthHeight

700 mm700 mm1200 mm

Weight 90 kg

Max. Positioning Velocity 25 mm/sec

Max. Acceleration 300 mm/sec²

Utility Requirement VoltageFrequencyCurrent

220 VAC±10%, Single Phase50/60 Hz3A

FOV 0.12x 0.08

Objective Telecentric 20x, 10x

CCD (standard) 640x480, ¼”

* The objective lens can be changed by user requirements (resolution, FOV,…)

VMM-liteVision based Inspection System

• Easy To Use

• Simple Control by Serial Communication

• 2D Measurement for Enhanced Accuracy

• Cross-Section Profile Measurement

• Various Analysis

TechMAC Co., LTD

Turret Mechanism for Objective Lens 2D Measuring sample

MicroCELLCNC Coordinate Measuring Machine

Measuring Range X-AxisY-AxisZ-Axis

600 mm700 mm500 mm

Resolution 0.0005 mm

ISO 10360-2Performance Spec.

MPEEMPEP (with TP20)

3.0 + 5L/1000 µm5.0 µm

Guide-way High-Precision Air Guide

Overall Dimensions WidthLengthHeight

1300 mm1800 mm2500 mm

Work Capacity X-AxisY-AxisZ-Axis

850 mm1200 mm500 mm

Weight 1200 kg

Max. Positioning Velocity 100 mm/sec

Max. Acceleration 300 mm/sec²

PerformanceEnvironment

20°C ~ 25 °CNo external vibration

Utility Requirement VoltageFrequencyCurrent

220 VAC±10%, Single Phase50/60 Hz10A

Specifications

• Easy To Use

• High Performance

• Low Cost

• Various Measuring Functions

• Compact Design

TechMAC Co., LTD

MicroCELLControl & Measuring Software

Calipers• height/width/gap• angle/diameter

Profile SCAN• DXF export• compare with design data

Auto-MeasureProgramming

3D Elements• manual/auto

ElementCalculator

Smart UCS Setting• programming available

Surface SCAN• DXF, IGS export• contour extract

Various Analysis• straightness• flatness• circularity• roundness• error analysis• soft-measure• best-fit

TechMAC Co., LTD

SpecificationsMeasuring Range X-Axis

Y-AxisZ-Axis

150 mm150 mm150 mm

Resolution 0.00005 mm

Accuracy RepeatabilityLinear Displacement Accuracy

3.0 µm5.0 µm for each axis

Overall Dimensions WidthLengthHeight

400 mm470 mm420 mm

Weight 20 kg

Max. Positioning Velocity 25 mm/sec

Max. Acceleration 300 mm/sec²

Utility Requirement VoltageFrequencyCurrent

220 VAC±10%, Single Phase50/60 Hz3A

Laser Sensor (standard) ResolutionMeasuring Range

3 µm20 mm

* The laser sensor can be changed by user requirements (resolution, range,…)

Scan3D-S3D Surface Digitizing Machine

• Easy To Use

• Low Cost

• Simple Design

(all control units included in machine)

• Simple Control by RS232C

• Auto-Tracing Measurement for Enhanced Accuracy

• Various Surface Digitizing Shapes : rectangle, circle, polygon

• Cross-Section Profile Measurement

• Various Display and Analysis

• Height Gage Function

TechMAC Co., LTD

Scan3D-SControl & Measuring Software

• Easy To Use

• Various Surface Digitizing Shapes : rectangle, circle, polygon

• Cross-Section Profile Measurement

• Height Gage

TechMAC Co., LTD

UPL-200Ultra Precision Guide-way

• Application

• Features - Non Contact Motion - Zero Friction/Zero Wear - Straight Motion- Silent Smooth Operation

• Specification Working Range Max 1500mm

Straightness 1um/300mm

Payment Load 30kg

Stiffness 1um/30kg

Driving Optional Linear MotorBelt Driving

PerformanceEnvironment

20°C ~ 25 °C4-6bar(Dry Air)

- Coordinate Measuring Machine - Ultra Precision Grooving Machine - Semiconductor Lithography- AOI System- Slicing/Dicing System

TechMAC Co., LTD