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SUSS MicroTec. Spray Coating. M arkets. Compound Semiconductor. MEMS. Source: CIS. Source: Intel. Source: Süss MicroOptics. Advanced Packaging. MOEMS. Types of Resist. Clariant AZ1500, AZ4000, AZ9000, AZ520D Rohm HaasShipley 1818 TOK PMER-P, TELR-N - PowerPoint PPT Presentation
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2
Markets MEMS
Source: CIS
Source: Süss MicroOptics
MOEMS Advanced Packaging
Compound Semiconductor
Source: Intel
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Types of Resist
Clariant AZ1500, AZ4000, AZ9000, AZ520D
Rohm Haas Shipley 1818
TOK PMER-P, TELR-N
Dow Chemicals BCB 3000 / 4000
Asahi Cytop CTL 107 M
Dow Corning Silicone
ALLRESIST e-beam PMMA
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Coating Challenges
Resist film tends to tear at the topography edges
Limited control of resist thickness at the bottom of the topography
Goal: Uniform coating of topography
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In Principal
X – Y stage Not a spin process (no striations or comet tails) Multi-flexible nozzle movement
Process Flow
X-Stage
Y-Stage
Spray Nozzle
Meander Path
Katrin FischerSUSS MicroTec, April 2005
88
Coating Topography AZ9260
4µm Top
300µm Step3 µm resist
on top of the edge
3µm Bottom
Katrin FischerSUSS MicroTec, April 2005
13
Coating Topography BCB 4000
300µm Step
7µm Top
3µm Bottom
5µm on top of the edge
Katrin FischerSUSS MicroTec, April 2005
1414
Coating Vertical Topography Goal: Protective coating in
trenches without filling
50 µm trench depth Modified Clariant AZ4620 Reliable edge coverage
Katrin FischerSUSS MicroTec, April 2005
15
Exposure Results
6µm of modified AZ 9260 across 300µm deep KOH etched trenches (no edge treatment)
coated with SUSS spray coating technology, exposed with SUSS large exposure gap optics
Katrin FischerSUSS MicroTec, April 2005
16
Lines across topography step
150 µm step height Good resist profiles throughout
Top view of printed lines
Katrin FischerSUSS MicroTec, April 2005
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Manual: AltaSpray
wafer sizes from pieces up to 200mm round
& 6” square programmable spray pattern adjustable nozzle heights EBR / BSR / nozzel + chuck
cleaning function 2 nozzel option with
seperate lines for different resist sorts
Katrin FischerSUSS MicroTec, April 2005
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Automated: Gamma
integrated modules for vapor priming, spining, spray-coating, baking, developing
cassette to cassette handling parallel spin and spray
processing wafer sizes
2” to 200mm round 2” to 6” square
EBR / BSR / nozzel + chuck cleaning function
2 nozzel option with seperate lines for different resist sorts
Katrin FischerSUSS MicroTec, April 2005