ACS300 Gen2

The coaT develop soluTion

from piloT To high volume producTion

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ACS300 Gen2The Powerful CoaTing SoluTion for 300 mm

+ Highly flexible resist processing cluster for high-volume production

+ Concurrent 200 and 300 mm wafer processing without mechanical changeover

+ Scalable and field-upgradable cluster architecture

+ gYrSeT® closed bowl coating technology

+ Best in class edge bead performance through combination of precision edge bead removal and sophisticated chuck and bowl design

+ Customized solutions for handling standard and non-standard substrates such as stacked and warped wafers

+ 6-axis robot for handling a wide range of substrates including carrier solutions

+ Interface to Field Proximity Mask Aligner MA300 Gen2

FeATUreS And beneFiTS

The ACS300 Gen2 is a modular coat and develop cluster covering wafer sizes from 200 to 300 mm without the need of mechanical changeover as well as square substrates. The system offers superior performance in coating, baking and developing wafers for applications such as thin and thick resists, or photosensitive polymers like poly imide or Cyclotene™ (BCB). With its best in class coat and develop uniform-ity and an exceptional edge bead performance the ACS300 Gen2 is the dedicated cost- effective resist processing solution for the Advanced Pack aging market. The ACS300

series from SUSS MicroTec already has a large installed base with foundries, IDMs and R&D institutes worldwide. The ACS300 Gen2 has been designed a mo-dular and scalable system solution with field- upgradable process modules which allows for flexible production planning from R&D or pilot production to high volume production stages. It can be interfaced with the SUSS MA300 Gen2 1X Full Field Proximity Mask Aligner to form the integrated LithoPack300 cluster.

With the ACS300 Gen2 SUSS MicroTec has designed a flexible, cost-effective coating cluster solution that supports a variety of differen ma-nufacturing requirements as well as equipment extendibility for multiple device generations.

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THe dediCATed SySTem For THe AdVAnCed PACKAGinG mArKeT

The ACS300 Gen2 is the dedicated solution for the Advanced Packaging Market serving appli-cations like solder bumping, gold bumping, as well as front side Redistribution Layers (RDL)

AZ1505 Positive tone photoresist

Test Diameter: 290 mmMean: 0.90 µmStd. Dev.: 0.30 %Hi/Lo Variation: 0.90 %

ACS300 Gen2 CoATinG reSUlTS:

JSr WPr Photosensitive dielectric Test Diameter: 296 mmMean: 7.94 µmStd. Dev: 0.30 %Hi/Lo Variation: 0.71 %

AZ10XTPositive tone photoresist Test Diameter: 288 mmMean: 12.5 µmStd. Dev.: 0.46 %Hi/Lo Variation: 1.05 %

Hd-4000Polyimide

Test Diameter: 284 mmMean: 17.1 µmStd. Dev.: 0.31 %Hi/Lo Variation: 0.78 %

ToK Pmer P/CA1000PmPositive tone photoresist, chemically amplifiedTest Diameter: 294 mmMean: 20.6 µmStd. Dev.: 1.03 %Hi/Lo Variation: 2.57 %

AZ40XT Positive tone photoresist Test Diameter: 290 mmMean: 43.5 µmStd. Dev.: 1.36 %Hi/Lo Variation: 2.74 %

JSr THb 151-n negative tone photoresist Test Diameter: 295 mmMean: 72.0 µmStd. Dev.: 1.31 %Hi/Lo Variation: 3.95 %

JSr THb 151-n negative tone photoresist, double coatingTest Diameter: 294 mmMean: 122 µmStd. Dev.: 1.36 %Hi/Lo Variation: 3.51 %

used in Wafer Level CSP or backside RDL for 3D Packaging. The GYRSET® technology allows for coating thicknesses in the range of below 1 µm to over 100 µm:

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The challenges of photoresist processing in the field of wafer bumping, wafer level packaging and 3D packaging require a very careful design of coat, bake, develop modules in order to ob-tain optimum processing results. The ACS300 Gen2 is designed to produce resist coatings within a thickness range from less than one to over 100 microns. Thick resists require coat module geometries that can handle the high viscosities involved and yield highly uniform films.

Thick resist CoatingThe ACS300 Gen2 is a master when it comes to processing of ultra-thick resists which often involves spinning the material at speeds below the optimum dynamic spin speed range. The ACS300 Gen2 offers contamination control and automated cleaning capabilities which is of par-ticular importance when processing high vis-cosity material. The combination of precision edge bead removal and an optimized chuck / bowl design guarantees best in class edge bead performance.

Thick resist baking For superior bake performance with ultra-thick photoresists the ACS300 Gen2 enables fully

programmable proximity bakes which allows for optimizing bake time versus temperature. High-ly symmetric exhaust and purge geometries guarantee for uniform solvent removal across the wafer during the bake. When utilizing such careful bakes, uniform solvent content in the photoresist prepares the substrate for subse-quent exposure and develop steps.

Thick resist development SUSS MicroTec has incorporated features al-lowing highly uniform resist development with lowest media consumption and shortest pro-cess times. The developer chemistry can be heated in a controlled fashion and is applied to the wafer by a large assortment of optimized dispense nozzles. The dispense pattern is con-trolled by of user-definable dispense arm sweeps including variable rate arm movement. Recipe-programmable z-height of the dispense arms is applied for optimization of develop media impact and wafer coverage. For the development of thin photoresist and other poly-mers, the ACS300 Gen2 shows exceptional uniformity and stability due to media flow, spin speed and point-of-use temperature control.

THe eXPerT AT THiCK reSiST ProCeSSinG

Photoresist Coat & Develop

Dry Film Develop

Polyimide for Repassivation

Solder bUmPinG

Coat & Develop

Gold bUmPinG CU PillAr

Via Formation

ACS300 Gen2 APPliCATion oVerVieW

Re-routing Layers

Dielectrics(e.g. Polyimide, PBO, BCB)

FronT-/bACKSide rdl

Lithography for 3D Packaging

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enAblinG GyrSeT® CoATinG TeCHnoloGy

The GYRSET® rotating closed cover coating process enables a unique turbulence-free and solvent rich atmosphere above the substrate during coating, thereby significantly reducing the influence of ambient temperature and humidity on the processing results.

Two major physical effects can be taken advan-tage of:First, the air flow above the wafer does not get turbulent, since the enclosed atmosphere is forced to spin at the same speed as the sub-strate. Photoresists designed and qualified for 200 mm do not always work well for 300 mm, since the required spin speeds are above the limit tolerable for laminar air flow. This causes fringes and non-uniformity at the wafer edge for spins above a critical speed limit. For non-round substrates like squares or even pieces, this is even true for slower spin speeds. The GYRSET® technology eliminates these turbulences almost completely.Second, the solvent rich atmosphere keeps the resist material closer to its original viscosity for an extended period of time. Thus, the resist is

also able to flow for an extended period of time, compared to conventional open bowl coating. This results into a greatly widen process window. Already qualified resist materials can be used for even thinner layers than originally intended. This reduces qualification work and the number of different resist types in warehousing.

Turbulence free coating using GYRSET® allows uniform resist thickness even to the corner of substrates

without GYRSET®

with GYRSET®

GYRSET® System

Conventional

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SPin-CoATinG modUleThe GYRSET® principle enables highly uniform coatings of 200/300 mm wafers as well as square substrates with minimum resist consumption. Processes with open and rotating closed cover can be accommodated.

The spin coating modules have three independent, optionally temperature controlled dispense lines per arm. The solvent media set-ups allow for precision Edge Bead Removal and Back Side Rinse. The Auto Nozzle Clean option allows for individual clean-ing of each resist dispense nozzle. Automatic chamber cleaning enables easy maintenance and guarantees higher uptime.

deVeloPer modUleAn assortment of dispense options is available for developing exposed films. Binary spray, fan spray or stream /puddle dis-penses are standard configurations. The dispense arms offer programmable sweep movements and are also programmable in height for best spray geometry.

For optimal CD uniformity control individual dispense arm sweep patterns can be programmed in each recipe. The point-of-use temperature control offers excellent uniformity for tem-perature sensitive processes.

HoT PlATe STACKThe ACS300 Gen2 HCV stack can be individually configured with up to 7 hot or cool plate cassettes or a HMDS vacuum primer that takes 2 positions in the stack. The ACS300 Gen2 can have one HCV stack in a defined module position and can also be equipped with a frame extension which can have an-other two HCV stacks.

The plate cassettes have motorized lift pins with programmable lift height as well as fixed minimum proximity balls which guaran-tees for optimum bake results. Evaporating solvent is extracted through a balanced environment of individually adjustable ex-haust and nitrogen purge.

SySTem oVerVieW

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SySTem oVerVieW

ProCeSS FloW inTeGrATionIn each frame one central 6-axis robot serves up to four spinner modules. For larger configurations further robots can be added.

The industry proven 6-axis robot combines highest speed and accuracy with a long range. With a maximum payload of over 3 kg this robot also allows for handling heavy substrates like stacked wafers or carrier solutions like glass, silicon or ceramics. Non-contact wafer centering is accomplished by an optical pre-aligner system that uses machine vision for determining the wafer position. Any misalignment is corrected by the robot.

mediA CAbineTThe media cabinet is equipped with individual drawers for easy access to resist and chemicals. Tanks can be filled from a cen-tral media supply. Automatic tank and bottle switching enables continuous operation. The media supply is configurable for a large variety of media combinations.

Depending on the system configuration a larger number of tanks and resist bottles can directly be installed in the chemical com-partments of the process modules. This guar antees for short dispense lines to the point of use which is of particular impor-tance for high viscosity material.

inPUT/oUTPUT modUle (i/o)The ACS300 Gen2 offers two different I/O options. Up to two load port modules can directly be attached to the machine frame. With a separate EFEM the ACS300 Gen2 can be equipped with up to four load port modules, which offer inte-grated wafer mapping and can be used with standard FOUPs or FOSBs.

Full bridge capability is ensured by cassette adapters that allow handling 200 mm wafers. The ACS300 Gen2 offers the flexibility of simultaneous 200 and 300 mm wafer processing without me-chanical changeover.

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+ Simple sequence / recipe path editing+ Simply drag and drop module icon into path+ Each “module slot” is represented by an icon

+ Level indication for all chemicals+ Visualization and status of wafers+ Icons for each module+ Programmable user levels+ Instant access to all current analog & digital module parameters

inTUiTiVe GUi deSiGn

The production proven software of the ACS300 Gen2 offers the most up-to-date controller technology available in the market. The system is based on Windows 7 operating system combined with Multi Module Controller (MMC) software.

It provides a user interface that graphically shows the current status of the entire machine. For service purposes each module can be accessed individually. Machine operation is intuitive and easy to learn. The location and status of each wafer in the machine is displayed in real time. Module controller components and software are based on a common design for convenient serviceability.

Process recipes and flow sequences are gene-rated with point and click ease. The sequence cascading feature enables continuous sub-strate flow, even in case of sequence change. The operator can run multiple process flows, multiple recipes and multiple substrate sizes simultaneously. He can, e.g. run one cassette of wafers in a coating sequence while running another one in a developing sequence. Online and offline sequence editing and process simu-lation are possible even during operation.

Detailed protocols and E10 states facilitate wafer and tool tracking. A host interface is available which is compliant to SECS-II/GEM (SEMI E4/E5/E30/E37) and 300 mm communication standards (SEMI E40/E87/E90/E94 and E116 states).

enAblinG ConTroller TeCHnoloGy

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liTHoPACK300 INTEGRATED COAT, BAkE, EXPOSE, DEVELOP SOLUTION

The SUSS LithoPack300 is a dedicated litho-graphy tool for wafer-level packaging of 200 and 300 mm wafers with coat, bake, expose and develop modules.

It allows quick changeover between 200 and 300 mm wafers and is the integrated lithography solution for both integrated device manufacturers as well as foundries.

With the next generations of both the ACS300 coat / develop cluster as well as the MA300 mask aligner SUSS MicroTec now offers an unprecedented integrated and modular lithography solution.

mA300 Gen2 modUleThe MA300 Gen2 exposure unit is a 300 mm 1X Full-Field proximity mask aligner that enables wafers to be exposed in a single step, enabling the printing of special features at the wafer periphery without compromising on high throughput. This is an important advantage of the mask aligner over stepper technology espe-cially when subsequent metallization of bumps or redistribution traces is to be carried out using an electroplating process. The SUSS MA300 features a dedicated alignment kit for creating 3D interconnects for applications like chip stacking and 3D image sensor packaging.

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The ACS300 Gen2 is a modular cluster system that can be individually configured from a construction set of frame com-ponents and process modules to perfectly match your pro-cessing and productivity requirements.

The scalable system architecture with field-upgradable pro-cess modules guarantees full flexibility from the R&D stage to high volume production.

ACS300 Gen2

i/o modUleS

2x I/O

module

4x I/O

module

ACS300 Gen2: 4 module configuration with 2x I/O module and frame extension for 2

HCV stacks

ACS300 Gen2: 8 module configuration with

4x I/O module

LithoPack300: ACS300 Gen2 with 4 process modules, 2x

I/O module and MA300 Gen2 Mask Aligner

eXemPlAry ConFiGUrATion:

Basic frame for up to 4 process modules

Frame exten sion for up to 2 HCV stacks

ACS300 Gen2 FrAme ComPonenTS

mA300 Gen2

Mask Aligner

ConSTrUCTion SeT:

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Data, design and specification of custom built machines depend on individual process condi-tions and can vary according to equipment con-figurations. Not all specifications may be valid simultaneously. Illustrations in this brochure are not legally binding. SUSS MicroTec reserves the right to change machine specifications without prior notice.

TeCHniCAl dATA

GenerAl FeATUreS

Substrate Size 200 mm and 300 mm roundOption: square and rectangular

Substrate Handling Fully automatic FOUP, FOSB, open cassette, SMIF and factory automation options

Substrate Processing Fully programmable cluster tool

User Interface Windows 7 operating system with SUSS MMC software

Max. # Spin Modules ≤ 8 (scalable system)

Max. # HP/CP ≤ 24 (scalable system)

Max. # of Sequences 10 000

Max. # of Recipes 1 000 with 50 steps (on spin processes) each

CoAT And deVeloP modUleS

Spin Speed Control ±1 rpm with digital spin motor controller

# of Dispense Lines Up to 3 temperature controlled resist dispense lines per dispense arm

Options Large selection of pumps and dispense systemsEdge bead removal and back side rinseControlled flow metersProgrammable exhaustSpin motor flange temperature controlFilter fan units or local cleanroomWafer Edge Exposure

Develop Chemistries Module designs for aqueous and solvent based developing

Developer Dispense Stream / puddle, binary spray and fan spray

oVen STACK modUleS

HoT PlATe

Hot Plate Temperature Up to 250 °C

Temperature Uniformity ≤ 0.8 °C up to 100 °C ≤ 1 % above 100 °C

Bake Method Programmable proximity with fixed minimum proximity

Cool PlATe

Cool Plate Temperature 15 to 30 °C

Temperature Control ± 0.2 °C

Cool Method Programmable proximity with fixed minimum proximity

VAPor Prime feaTureS

Vapor Prime Temperature Up to 250 °C

Priming Method HMDS vapor prime

UTiliTieS

Vacuum min. - 0.8 bar, +/- 5 %

Compressed Dry Air 8 bar, +/- 10 %

Nitrogen 8 bar, +/- 10 %

DI Water 3 bar, +/- 10 %

Power Configuration dependent

www.suss.com

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SÜSS MicroTec AG | Phone: +49 89 32007-0 | info@suss.com

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