Automotive

BroadR-Reaches out overunshielded twisted pair, p19

PowerConfigurable powersupplies rated up to2500W, p31

Active Components

MCU additions boast lowest16bit active current, p24

Opto & Displays Rugged TFT displaydelivers high reliabilitytoo, p49

In ThIS ISSue

SSuuppeerrvviissoorryy && WWaattcchhddoogg TTiimmeerrMMuullttii --oouuttppuutt RReegguullaattoorrss SSllaasshh

CCoommppoonneenntt CCoouunntt

Cool fans turnto ambient air

Memory modulessuit high end indus-trial PCs & servers

February 2012 / Volume 3, Issue 2

COnTenTS & COveR STORIeS

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 3

HELPING industrial, medicaland comms equipment design-ers improve power systemperformance is Analog De-vices with its new ADP5041and ADP5040 multi-outputregulators that reduce boardspace. They meet the increas-ing demand for greaterpower density by combining ahigh efficiency, 3MHz, 1.2Abuck regulator and two300mA LDOs in a small 20lead LFCSP package.

Unlike discrete power solu-tions that require up to 14components and 126mm2 ofboard space, these highly in-tegrated regulators provide amore integrated circuit solu-tion using only nine compo-nents and 50mm2 of boardspace to increase perform-

ance and reliability andlower system cost.

The devices aredeemed ideal as powermanagement compan-ions to mid-range FPGA,microprocessor and DSPsystems where core, I/O andmemory voltages are neces-sary. ADP5041’s on-chipwatchdog timer providesgreater reliability by monitor-ing code execution integrity inprocessor based systems andresetting the processor if it failsto strobe within a preset time-out period. It also features ahigh accuracy, ±1.5% over-temperature, reset generatorthat can be externally pro-grammed to monitor low volt-age, power supply rails. Awide range of options also

addresses multiple reset andwatchdog timings.

ADP5041 also detectsthree state conditions whenapplied to the watchdog re-fresh input at the WDI pin,typically controlled by aprocessor/DSP output port.When the processor sets thisport in three-state mode, thewatchdog refresh timer is dis-abled, preventing a watch-dog reset to the processor. 8 For full editorial8 Datasheet 1 Download8 Datasheet 2 Download

4 Commentary

6 NewsLine

12 Design & Embedded

14 Automotive

20 Cabinets, Racks &Enclosures

24 Active Components

28 Power

32 Cables & Connection

36 Test & Measurement

38 Comms, Computing & Control

40 Passive Components

42 Wireless & Portables

46 Opto & Displays

50 Distribution Focus

52 Tech Videos

COnTenTS

Cool Fans Turn To Ambient Air

A 230Vac, 900m3/h variantis the latest addition to theRittal TopTherm range of fanand filters. The entire rangeutilises a diagonal fan for im-proved performance againstincreased static pressure dif-ference. In turn, this offersgreater energy efficiency anda more constant air through-put, effectively minimising theoccurrence of hot spots. Thenew variant is also fitted withan electronically commutatedmotor to further reduce

power consumption.Energy efficiency of

TopTherm fans and filterswhen fitted with single phaseac motors can be improvedin operation using a simplethermostat or more sophisti-cated fan speed control.

Rittal’s speed controller ad-justs fan speed in accordancewith the demand for cooling,reducing noise and energyconsumption when cooling isnot required. It also incorpo-rates a fault alarm activatedin the event of the tempera-ture of the air inside the en-closure rising above a prede-termined level, aninterruption in the supply tothe fan, a sensor short-circuit,or a failure in the supply tothe controller itself. Not onlydoes this device increasemaintenance intervals and re-duce energy consumption, italso alerts users to potentialproblems.8 For full editorial

Modules Suit highend Industrial PCs

Swissbit high performance,high reliability SDRAM mem-ory devices now includethree 8GB modules in DDR3SODIMM, DDR3 SO-UDIMMwith ECC and RegisteredDIMM versions. They boastthe highest DDR3 memorycapacity on the smallest pos-sible system area and enableapplications with high needsfor main memory running onthe latest multi-core CPUs.These modules use Samsung4Gb DDR3 components.8 For full editorial

Supervisory & Watchdog TimerMulti-Output Regulators SlashComponent Count

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electronica 2012 is now on the horizon, again bringingthe world’s electronics industry together in Munich whilefocusing on developments key to the industry’s future. Theevent takes place at the Munich Trade Fair Centre fromNovember 13 to 16 and will present visitors with the op-portunity to view and discuss all the latest offerings fromthe global electronics industry.

This year’s show featuring the global electronics indus-try is dedicated to all aspects of electronics technology.electronica 2012 will provide visitors with the opportunityto see all the major players from key industry sectors suchas power, semiconductors, interconnection, embeddedand test and measurement as well as the chance to learnmore about developments that are considered importantfor the industry’s future. Amongst other things, electronica2012 will focus on topics such as e-mobility, automotive,embedded solutions and smart energy solutions.

Electronic, as always, features a comprehensive and in-formative range of events for the automotive sector. Be-sides the exhibition sector, visitors can look forward to theelectronica automotive conference and the automotiveForum. The electronica automotive conference begins aday before the official opening of the fair and takes placeon November 12 and 13. Strategy presentations fromleading executives in the component, supply and automo-bile industry are planned for the first day.

The second day will revolve around the latest develop-ments for technical experts from the automotive industry,OEMs, component manufacturers and software develop-ers with an emphasis on components.

The conference programme continues on November14 with the Wireless Congress, where industry specialistsinform on current and future wireless technologies. elec-tronica 2012 also has an extensive program of relatedevents including four forums, i.e. the automotive Forum,the embedded Forum, the electronica Forum and theZVEI Forum. �

November’s findings in the IPC round-upof the North American Printed CircuitBoard Statistical Program show PCB indus-try growth rates and book to bill ratios.Rigid PCB shipments were down 5.9%and bookings down 7.2% in November2011 from November 2010. Year to date,rigid PCB shipments decreased 1.7% andbookings declined 9.6%. Compared tothe previous month, rigid PCB shipmentsincreased 8.8% and rigid bookings in-creased 2.8%. The book to bill ratio forthe North American rigid PCB industry inNovember 2011 declined to 0.97.

Flexible circuit shipments in November2011 were down 10.0% and bookingsgained 13.6% compared to November2010. Year to date, flexible circuit ship-ments decreased 0.7% and bookings in-creased 2.7%. Compared to the previ-ous month, flexible circuit shipmentsincreased 6.2% and flex bookings wereup 14.6%. The North American flexiblecircuit book-to-bill ratio in November2011 climbed back up to parity at 1.00.

For rigid PCBs and flexible circuits com-bined, industry shipments in November2011 decreased 6.2% from November2010, as orders booked decreased 5.6%from November 2010. Year to date,combined industry shipments were down1.6% and bookings were down 8.5%t.Compared to the previous month, com-bined industry shipments for November2011 increased 8.6% and bookings in-creased 3.8%. The combined rigid and

flex industry book to bill ratio in Novem-ber 2011 declined to 0.97.

“North American PCB sales in Novem-ber increased over the prior month,which is consistent with seasonal pat-terns,” says Sharon Starr, IPC Market Re-search Director. “Sales this year continueto lag behind sales in the same months of2010. Orders are up in the flexible circuitsegment but weak in the rigid segment.”

Book to bill ratios are calculated by di-viding the value of orders booked overthe past three months by the value ofsales billed during the same period fromcompanies in IPC’s survey sample. Aratio of more than 1.00 suggests that cur-rent demand is ahead of supply, which isa positive indicator for sales growth overthe next two to three months.

Book to bill ratios and growth rates forrigid PCBs and flexible circuits combinedare heavily affected by the rigid PCBsegment. Rigid PCBs represent an esti-mated 89%of the current PCB industry inNorth America, according to IPC’sWorld PCB Production Report.

IPC’s monthly survey of the NorthAmerican PCB industry tracks bookingsand shipments from U.S. and Canadianfacilities, which provide indicators of re-gional demand. These numbers do notmeasure US and Canadian PCB produc-tion. To track regional production trends,IPC asks survey participants for the per-centage of their reported shipments thatwere produced domestically. In Novem-ber 2011, 86% of total PCB shipments re-ported were domestically produced. Do-mestic production accounted for 85% ofrigid PCB and 88% of flexible circuit

shipments in November by IPC’s surveyparticipants. These numbers are signifi-cantly affected by the mix of companiesin IPC’s survey sample, which changeslightly in January, but are kept constantthrough the remainder of the year.

Flexible circuit sales typically includevalue-added services such as assembly,in addition to the bare flexible circuits. InNovember, the flexible circuit manufac-turers in IPC’s survey sample indicatedthat bare circuits accounted for about55% of their shipment value reported forthe month. Assembly and other servicesmake up a large and growing segmentof flexible circuit producers’ businesses.This figure is also sensitive to changes inthe survey sample, which may occur atthe beginning of each calendar year.

Year-on-year and year-to-date growthrates provide the most meaningful viewof industry growth. Month to month com-parisons should be made with caution asthey may reflect cyclical effects andshort-term volatility. Because bookingstend to be more volatile than shipments,changes in the book to bill ratios frommonth to month may not be significantunless a trend of more than three consec-utive months is apparent. It is also impor-tant to consider changes in bookings andshipments to understand what is drivingchanges in the book to bill ratio.

The information in IPC’s monthly PCBindustry statistics is based on data pro-vided by a representative sample of bothrigid and flexible PCB manufacturers inthe USA and Canada. IPC publishes thePCB Book-to-Bill Ratio and the PCB Statis-tical Program Report each month. �

Flex Boards Flex &Rigids Weaken In uS

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TDK-Lambda’s Zero VoltageSwitching Converter UKpatent application has beenapproved for grant by the UKIntellectual Property Office.

“There is an on-going pushfor power supply manufactur-ers to develop smaller, morefeature rich products,” ex-plains TDK UK CTO AndySkinner. “Since the use of anEMC filter can represent a sig-nificant percent of the overallvolume of the unit, reductionof the common-mode noiseflowing back into the powersource is a key criterion for amore compact design.”

In essence, the ZVSC topol-ogy uses a half-bridge switch-ing circuit with additionalnoise cancelling circuitry to re-duce conducted common-mode noise. TDK-Lambda’sNV300 uses such a topology,achieving a power density of8.3W/in3. 8 For full editorial

Power TopologyPatent Granted

Imec and Genalyte have de-veloped and produced a setof disposable silicon photon-ics biosensor chips for Gena-lyte diagnostic and mo-lecular detectionequipment. Thechips combineimec's standardsilicon pho-tonic wave-guide deviceswith bio-com-patible modifica-tions jointly devel-oped by imec andGenalyte. Thesechips allow for high lev-els of multiplexed bio sensingdue to the high integrationlevel of Si photonics.

The newly developed Si-photonics biosensor chipswere realised at imec, aspart of imec’s silicon photon-ics CMORE service. A bio-compatible passivation tech-

nology was developed on200mm wafer scale, thechips were tested in the field,

andproven to meet Genalyte’sfunctional requirements withhigh yields. The chips containup to 128 proprietary ringresonator sensors coated byGenalyte with application-specific chemistry to create

very sensitive molecular de-tection capability.

On-chip grating couplersare used to couple the in-frared light from and to Gen-alyte’s diagnostic equipment.The successful realization ofthese chips again confirmsthat imec’s CMORE service

is delivering customer chipsolutions to its partners.

Imec’s silicon pho-tonics platform al-lows miniaturisa-tion of complexphotonic functionson a single chipand a dense inte-

gration of photonicsand electronics. The

ability to use standardmicroelectronic CMOS

manufacturing facilities andprocesses to realise opticalfunctions makes silicon pho-tonics commercially very at-tractive because of the poten-tial to lower manufacturingcosts and increased volumeproduction. 8 For full editorial

Silicon Photonics BiosensorChips Are Disposable

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Sigma has purchasediLaunch software from Aegisafter identifying that its NPIprocess would benefit fromimproved speed, accuracyand control. Reviewing thesoftware from Aegis and itscompetitors revealed thatonly Aegis could deliver thespeed of conversion andcontrol of processes thatSigma sought.

Sigma was looking for com-prehensive CAD/BOM importwith error corrections, rapidconversion to intelligent data,and revision control for docu-mentation and programming.Accordingly, they found thatAegis’ iLaunch software al-lows rapid and accurate con-version of CAD/BOM data torevenue producing productswith secure revision control.

iLaunch’s Juki IS interfaceand accurate Juki IS program-ming capabilities were majorinfluences in Sigma’s decision.Juki IS is itself an intelligentmanufacturing software pack-age designed to optimize andstreamline production on theshop floor. The interface withiLaunch allows the Juki manu-facturing environment to beclosely integrated into Sigma’sNPI strategies.

iLaunch’s features optimisethe assembly definitionprocess, while generatingquality information and man-ufacturing instructions fromCAD/BOM data. Its singleenvironment supports instruc-tion sequences for systemand mechanical assembliesas well as graphical visualaids for circuit card assembly.Product and version control ismaintained, data integrity isverified and discrepanciesare corrected before reach-ing production. Operatorsbenefit from rapid, flexiblegeneration of paper-basedand paperless documentationand visual aids, and receivechange notices, process devi-ations and quality alerts.8 For full editorial

Sigma Plumps ForAegis For nPIOptimisatione nPI

Maxim’s G3-PLC protocol isapproved by the ITU as a newlow frequency, OFDM basednarrowband power line com-munications, NB-PLC, standard.

In partnership with ElectricitéRéseau Distribution France andSagemcom, Maxim developedthe G3-PLC specification to pro-mote open endedness andinter-operability among smartgrid implementations. Cur-rently, the G3-PLC is the onlyNB-PLC standard that supportsthe IPv6 internet protocol toallow new internet-based en-ergy management systems.

The specification also opti-mises bandwidth, corrects er-rors and provides a higherdata rate, supporting two waycommunication for demand re-sponse and other smart gridapplications. The result is an in-crease in the performance reli-ability of crossing transformers,enabling a dramatic reduction

in deployment costs. Last year, Maxim introduced

MAX2992 PLC modems topair with the MAX2991 ana-logue front end, providing thefirst fully compliant G3-PLCchipset solution. Today, severalmanufacturers offer ITU-com-patible G3-PLC solutions basedon this chipset, and one suchsolution is already being de-ployed in France. With the ap-proval of G3-PLC as an interna-tional standard and withavailable solutions from multi-ple sources, utility companiescan now plan their deploy-ments utilising G3-PLC toachieve cost-effective smartgrid systems with confidence.

Adding intelligence into theexisting power grid is a capital-intensive undertaking, and utili-ties have not wanted to makesuch a large investment withoutassurance that the standardthey have chosen will bewidely adopted. With the ITU’ssupport, G3-PLC has becomeone such accepted standard.8 For full editorial

ITu Approves G3PLC As SmartGrid Standard

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 7

Yamaha has adopted theSynopsys Processor De-signer tool to develop itscustom designed DSPs.Using the tool to automatethe design and implementa-tion of its XMP-1 DSP,Yamaha doubled the num-ber of sound channels forthe high definition soundgenerator device and tapedout six months, or 50%, ear-lier compared to its previousgeneration device.

The Yamaha design teamcited the Processor Designertool's complete flow, includ-ing the generation of an as-sembler, linker, C-Compilerand instruction-set simulator,easy to use processor de-scription language andoptimised RTL output as thedifferentiating reasons forits choice.

XMP-1 delivers 32 chan-

nel phrase sound genera-tion, AudioEngine richsound effects and LED directcontrol functionality foramusement or digital con-sumer applications, a levelof functionality not possiblewith fixed hardware.

“Processor Designermade the DSP develop-ment process easier to at-tain higher quality,” saidMorito Morishima, depart-ment manager of productdevelopment for the semi-conductor division atYamaha Corporation.“With Processor Designer,we doubled functionalityfor our high definitionsound generation DSP, de-veloping it in just one year,including the entire soft-ware development toolchain, while reducing cost.”8 For full editorial

yamaha Standardises OnSynopsys Processor

Altium has added a compre-hensive new range of boardlevel components from theSTMicroelectronics PowerManagement catalogue toits on-line AltiumLive system.Now Altium can deliverquality on-line content andservices directly to AltiumDesigner users.

Along with device manu-facturers such as STMicro-electronics, Altium has alsoestablished relationshipswith parts suppliers and ven-dors such as Newark, Digi-Key and Mouser.

This allows board levelcomponents to include real-time supply chain informa-tion, such as vendor choice,pricing and availability.

“Collaboration betweenAltium and parts manufactur-ers helps us produce high in-tegrity design IP for our cus-tomers,” says Altium’sRowland Washington. “We

are pleased to be workingwith companies such asSTMicroelectronics to de-velop an ever increasingrange of third party libraries,templates, reference designsand other ready to use de-sign content.”

This latest update to theboard level component con-tent, available through Al-tiumLive, has been devel-oped in close collaborationwith STMicroelectronics,and includes a comprehen-sive array of STMicroelec-tronics' energy efficientpower management devices.

The new range adds tothe STMicroelectronics com-ponents already availablein AltiumLive's board levelcomponent vault, which in-clude the company's STM8and STM32 family of micro-controllers, sensors andMEMS based devices.8 For full editorial

Altium Goes On-Line WithBoard Level Components

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Picochip recently signed anagreement of acquisition byMindspeed Technologies andhas now achieved first siliconsuccess using Synopsys's Lynxdesign system and Galaxy im-plementation platform in thedesign of its next generation40nm PC3008 picoXcell fem-tocell chip optimised for highvolume, cost-sensitive con-sumer applications.

Lynx enabled Picochip's en-gineering team to quickly andefficiently upgrade to a pre-tested 40nm Galaxy basedproduction design flow, sav-

ing significant time and effortcompared to developing theirown flow. In addition, Lynx'sfoundry ready system en-abled Picochip's engineers tobegin design work within twoweeks of initial deployment,accelerating their projectstart date by an estimatedeight weeks.

“In the mobile communica-tions market, each productgeneration requires higherperformance and functional-ity at a lower cost,” says Pic-ochip VP Will Robbins. “ForPicochip to deliver this, it is es-sential that we are able to mi-grate process technologiesquickly and easily.”8 For full editorial

Picochip has First40nm SiliconSuccess With Lynx

Atollic’s TrueStudio for ArmC/C++ development tool isnow available for the 32bitXMC4000 family from Infi-neon Technologies that usesthe Cortex-M4 processor.

The XMC4000 line-up istargeted at a wide range ofindustrial applications suchas electric drives, solar in-verters and the automationof manufacturing and build-ings. It combines a fully fea-tured, configurable periph-eral set with an industrystandard Cortex-M4 corethat is ideal for energy effi-cient industrial applications.

XMC4500, the first seriesof the new microcontrollerfamily, delivers the 32bitcomputing power embed-

ded developers need to in-novate a variety of industrialapplications within time-con-strained development cycles.Peripheral interface supportincludes SPI, I2C, UART andCAN configurable serialmodules together with 12bitADCs and DACs.

“Atollic TrueStudio forArm includes the time savingfeatures that professionalembedded developers needto reduce their developmentand testing time,” says Infi-neon Director Dr StephanZizala. “Our XMC4000 mi-crocontrollers are highlyreal-time optimized devicesand are well complementedby Atollic’s tools.”8 For full editorial

Development Tool SupportsXMC4000 MCus using Cortex-M4

Souriau snapped up the 2011Airbus Supplier of the YearAward in recognition of thebest global performance dur-ing the supplier SQALElectrics Conference held inToulouse on December 16,2011. And it’s the fifth time insix years it has made thisachievement.

In an continuing difficulteconomic environment linkedto consequences of the world-wide economic crisis of 2008,the Souriau group managedto cope with the strong de-mand variations while pre-serving its level of excellencetowards Airbus and their

main subcontractors spreadover several continents.

In an aggressive competitiveenvironment, the company in-creased the pace of new prod-uct development and rangeextensions thus accompanyingAirbus in facing the new chal-lenges of the civil aircraft mar-ket in areas such as the reduc-tion of fuel consumption, noisepollution and the impact onthe environment.

Souriau civil aviation tech-nologies include high powercontacts, high speed fibreopticcomponents, weight reductionwith a full range of 38999type connectors in compositeshells and miniaturisation withthe micro 38999 and micro-Comp ranges.8 For full editorial

Souriau Flyinghigh With AirbusAward

MIPS Technologies has joinedthe Renesas Electronics SoCPartner Programme. Renesasis a long term licensee of theMIPS64 architecture andprocessor cores including theMIPS32 74K, 24KE and 4KEcores. Its SoC Partner Pro-gramme promotes collabora-tion based around the Rene-sas SoC platform targetingthe mobile, automotive, andhome audio-visual device seg-ments. MIPS will work with Re-nesas Electronics as a partnerwith a focus on the digitalhome market.

“We’re very pleased towelcome MIPS Technologiesto our SoC Partner Programin support of our SoC prod-

ucts for the digital home,”notes Renesas General Man-ager Tomohisa Arai.

MIPS Marketing VP GideonIntrater adds, “MIPS is com-mitted to providing compre-hensive solutions that meetthe complex requirementsand exacting standards of ourcustomers developing prod-ucts for the digital home, mo-bile and networking markets.Renesas Electronics is a long-time and important MIPS li-censee, and we’re excited tobe a part of this collaborativeeffort that can benefit Rene-sas Electronics, its customers,and ultimately consumers inmany of MIPS’ key markets.”8 For full editorial

MIPS Joins Renesas SoCPartner Programme

Synopsys has concluded itsacquisition of ExpertIO andthis addition of protocol ex-perts and portfolio of storageVIP will accelerate Synopsys'sdelivery of a broad line-up ofhigh performance, easy touse, fully featured VIP thatcan help designers addresstheir growing verificationchallenges. The terms of thedeal have not been disclosed.

With leading SoC designsdeploying more complex pro-tocols, VIP has become a criti-cal component of the verifica-tion environment. Synopsys isfocused on delivering abroad portfolio of standards-based VIP to address thegrowing verification chal-lenges associated with creat-ing today's 'smart' electronics. 8 For full editorial

Synopsys Acquires expertIO

www.electronicspecifier.com10 | february 2012 | electronicspecifierproduct

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Finnish Company Bass Solu-tions has been incorporatedinto the GATE global allianceprogramme of Goepel Associ-ated Technical Experts. Thedevelopment and practical im-plementation of new solutions,products and modules basedon JTAG/Boundary Scan in-strumentation as well as en-hancements in the local sup-port, applications and inte-gration of the leading JTAG/Boundary Scan hardware so-lutions ScanFlex and Scan-Booster related to the SystemCascon software lay in thecentre of thise co-operation.

“BASS Solutions has ahighly skilled team with ex-perts in the field of productdevelopment processes andtasks, product life cycle testingand production ramp-up,”says GATE Programme Man-ager Frank Amm. “The co-op-

eration was a logical step forGOEPEL electronic, signifi-cantly enhancing our cus-tomer orientated presence inScandinavia. By combiningour competences, we cannow accommodate the de-mands of the Finnish cus-tomers for excellent JTAG/Boundary Scan test strategiesand respective equipment, ap-plications and services in acomprehensive way.”

Goepel Director Lars Kong-sted-Jensen adds, “For sometime we have been looking fora good partner in the Ouluarea to intensify our local of-ferings within Boundary Scansupport and applications.BASS Solutions is offeringeven more than we were hop-ing for with their knowledgealso in RF, machine visionand life-cycle testing.”8 For full editorial

Bass Signs up ToGoepel’s GATe Programme

CommAgility AMC-2C6678and AMC-2C6670 DSPboards are now shipping,complete with the fastestversions of the highperformance

TMS320C6678and TMS320C6670

DSPs from TI.CommAgility boards now

use the 1.25GHz version of theC6678 DSP and the 1.2GHzC6670. With an increase of25% and 20% in processorspeed respectively comparedto the more common 1GHzversions, the modules providea valuable increasing in pro-cessing capability for demand-ing applications.

The two AdvancedMC mod-

ules are now also shippingwith 1GB DDR3 SDRAM foreach of the two on-boardDSPs. The increased memorystorage is a particular benefitin image processing applica-tions, and enables customersto future-proof their systems.

Designed for a wide rangeof high performance appli-

cations including tele-coms and image pro-cessing, the

AMC-2C6678 is a highperformance signal processingAMC card with 16 DSP coresand FPGA resources. It is pow-ered by two Texas InstrumentsTMS320C6678 DSPs.

The AMC-2C6670 high per-formance signal processingAMC card for 4G wirelessbaseband and test equipmentsolutions, includes LTE and LTEAdvanced. It also includes twoTI TMS320C6670 DSPs withan option for SFP+ connectionsdirect to the AIF2 interface ofone DSP to support CPRI. AGPS receiver for timing syn-chronisation is also available. 8 For full editorial

AMC Boards ShipWith highestSpeed TI DSPs

Acal BFi is inviting companiesoperating in hazardous envi-ronments, including oil andgas exploration and drilling,to challenge the next genera-tion Wolverine III flat panelcomputer against its toughestoperating conditions. TheAcal BFi Demo Challengeswill take place at customer lo-cations throughout Q1 thisyear and allow customers totest the Wolverine III's abilityto withstand salt, spray, dust,shock, vibration and extremesof temperature. During thechallenge customers will alsohave the opportunity to testthe operation of the unit’stouch screen which will workeven if the operator is wear-ing thick oil-covered gloves.

“If a customer wants to putthe Wolverine III in a freezerbefore using it or reconstructblinding desert conditions totest the display, then that is

what we will let them do,” ex-plains Acal BFi Manager IanRichards. “We want cus-tomers to see how theWolverine III combines signifi-cantly higher performanceand reliability, with fast main-tenance and a substantiallylower weight than previousgenerations of rugged flat-panel computers.”

Developed by GE Intelli-gent Computing Platforms,Wolverine III sets a newbenchmark for mean time torepair of just 1.5h for on-sitereplacement of the CPU, dis-play screen, processor orother modules from spares in-ventory. This significantly re-duces downtime by eliminat-ing the need for the unit to beswapped out for repairs andupgrades which is typically re-quired by other flat-panelcomputers.8 For full editorial

Acal BFi Throws Down GauntletIn Wolverine III PC Challenge

December 1 last year markedAVX’s compliance with the in-dependently audited Conflict-Free Smelter Programme forall its current tantalum pow-der and wire suppliers.

Going forward, AVX willexclusively use tantalum pow-der and wire from conflict-freecompliant smelters. Notably,it is first in the industry toreach this point, anothermajor marker in its ability toprovide verifiable assuranceto its customers that all AVXproducts contain only conflict-free tantalum, in accordancewith the principles of theDodd-Frank legislation andcurrent OECD guidelines.

OECD Due Diligence Guid-ance for Responsible MineralSupply Chains from Conflict-af-fected and High-risk Areas isfor use by any company po-tentially sourcing minerals ormetals from conflict-affectedareas of weak governanceand provides management

recommendations to help com-panies respect human rightsand avoid contributing to con-flict through their mineral ormetal purchasing decisionsand practices.

This advance is anotherstep forward in AVX’s contin-uing efforts to keep conflictminerals out of the supplychain. For the past ten years,the company has had a pol-icy of not using tantalumsourced from the DemocraticRepublic of Congo or anyother area in which insurgentsor similar groups benefit fromthe sale of minerals.

From 2007 onwards, AVXincreased the level of duediligence and improved itsability to comply with thispolicy and since 2009, AVXhas actively participated inthe industry-wide effort toeliminate conflict mineralsfrom the supply chainthrough the CFS programme. 8 For full editorial

Tantalum Capacitors Arevalidated Conflict Free

Panasonic New V-FT seriesLow ESR SMD Aluminium Electrolytic Capacitor

Features compared to V-FK series Applications Technical Data

Panasonic introduces the latest LOW ESR SMD Aluminium Electrolytic Capacitor. This product disposes of high capacitance and low resistance values combined with a smallsized case. The outstanding performance of the new V-FT series is achieved by highcapacity electrode foil and sophisticated Panasonic Low resistance technology.

rswww.com/panasonic

FIND IT. DESIGN IT. BUY IT.

CSR SiRFstudio client Lo-CoMo API gives designersthe tools to add location aswell as context awarenessof pedestrian motion, onany MEMS enabled An-droid device. LoCoMo APIinnovations are based onthe concept of locomotion,allowing the differentiationbetween different modes ofphysical movement, such aswalking and running.

These capabilities can beused to distinguish applica-tions in a number of cate-gories, such as gaming andphysical fitness. The Lo-CoMo API software devel-oper kit comes with theGoRun fitness applet devel-oped by CSR to illustrate Lo-CoMo API capabilities.

“CSR sees a strong desireon the part of applicationdevelopers to bridge thephysical and virtualworlds,” says CSR MDAshu Pande. “Developersof games increasingly de-mand a means of incentivis-ing physical activity with vir-tual rewards, and fitnessapplication developers

would like applications thatcan sense motion and clas-sify and quantify physicalactivity throughout the day --not just during exercise rou-tines. With the SiRFstudioClient LoCoMo API, CSR isgiving developers the bene-fit of our deep expertise inlocation and related signalprocessing so they may cre-ate compelling, differenti-ated applications.”

LoCoMo API enables al-ternative location determina-tion by providing CellID/Wi-Fi positioning whenGPS is unavailable by utilis-ing CSR’s cloud hostedCell/Wi-Fi Access Point Posi-tion Database and Motionsensing. The LoCoMo API’sLocomotion Context capabil-ity is a significant advanceover existing mobile phonepedometer APIs that forcedevelopers to assume astatic human stride length.This approach creates signif-icant error in the calculationof distance travelled, calo-ries burned and other re-lated values. 8 For full editorial

Android Developers Get Powerful& Flexible Location Aware API

Rittal's RiCAD-3D softwareversion 3 supports the cre-ation of models to providea complete 3D picture ofRittal products with the visu-alisation, layout and spac-ing of single components.The RiCAD 3D databaseincludes 2D and 3D draw-ings for virtually all Rittal

products, together withan extensive range of sys-tem accessories.

Many projects require a 3Dinternal and external view ofobjects such as wall and free-standing enclosure systems.3D views of the accessorieswithin an enclosure allow po-sitioning and spacing of railor mounted equipment, cabletrunking runs and the cableentry space required.8 For full editorial

3D Softwareenables efficientPlanning & Design

www.electronicspecifier.com12 | february 2012 | electronicspecifierproduct

DeSIGn & eMBeDDeD

IAR has a new KickStart Kitfor TI’s Hercules RM48 MCU.TI’s Hercules safety MCU plat-form has built-in hardwaresafety features, making it suit-able for development of sys-tems with high requirementson functional safety, for exam-ple within medical, industrial,and transportation applica-tions areas.

The platform consists ofthree Arm Cortex based mi-crocontroller families:TMS470M; TMS570 andRM4x. The RM4x family pro-vides the highest perform-ance, and is based on Arm’sCortex-R4F.

The KickStart Kit is the first

Cortex-R4F kit from IAR,making it a valuable addi-tion to the large number ofIAR KickStart Kit packagesavailable for several differ-ent architectures from awide array of semiconduc-tor manufacturers.

This bundled kit includesa fully featured HerculesTMDXRM48HDK kit and anIAR J-Link Lite debuggingprobe, enabling fast and sta-ble debugging with ad-vanced debugging featuresvia Embedded Workbench.

Also included in the kit aresoftware tools and exampleapplications from IAR and TI,supplying all the softwareand hardware necessary todesign, develop, integrate,and test applications.8 For full editorial

Kit Gives Start ToTI’s herculesSafety Device

Tensilica HiFi 3 audio/voiceDSP IP core for SoC designsis a fourth generation solu-tion delivering higher per-formance with lower powerfor high performance audiopost-processing and voiceprocessing algorithms insmartphone and home en-tertainment systems. It ex-pands Tensilica's HiFi archi-tecture to quad 24/32bitand the company has al-ready licensed HiFi 3 to atier one smartphone OEMand a tier one semiconduc-tor manufacturer.

“The HiFi 3 DSP is the nat-ural evolution of our popu-lar HiFi 2 architecture,” saysTensilica Director Larry Przy-wara, “which is the mostpopular licensable audioDSP core and has been de-signed into millions of smart-phones, Blu-ray Disc play-

ers, digital televisions, cam-eras, and other devices. HiFi3 was initiated based onsmartphone OEM and semi-conductor manufacturerneeds for better power effi-ciency of high performancevoice and audio post-pro-cessing functions.”

Przywara cites in particu-lar the HiFi 3 DSP whichachieves greater than an80% increase in perform-ance for the FFT, FIR and IIRfunctions that are essential inaudio pre and post-process-ing. There is also a greaterthan x1.5 improvement inperformance for most voicecodecs compared to HiFi EP.This performance boosthelps significantly reducethe power consumption re-quirements for leading edgealgorithms.8 For full editorial

hiFi 3 DSP IP Core PerformsFor Smartphones

DeSIGn & eMBeDDeD

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 13

Aldec and SynthWorks De-sign have collaborated on anOpen Source VHDL verifica-tion methodology, OS-VVM,underscoring the duo’s com-mitment to provide continuedsupport to the VHDL designcommunity.

OS-VVM delivers advancedverification test methodolo-gies, including Constrainedand Coverage-driven Ran-domization, as well as Func-tional Coverage, and pro-vides advanced features toengineers designing ASICSand FPGA based applicationsusing VHDL.

“Hardware description lan-guages such as VHDL andVerilog have provided elec-tronics design engineers withthe ability to create complexdigital projects,” says AldecDirector Igor Tsapenko.“However, the challenge that

many designers face is howto support system-level designrequirements. In recent years,new language standards suchas SystemVerilog and Sys-temC have emerged to aid inperforming advanced systemverification tasks, leavingVHDL designers with thedilemma of learning a newlanguage.”

VHDL Director Jim Lewisadds, “The unique featureof OS-VVM is the ability touse live results of functionalcoverage to control ran-domisation of stimulus.This ‘intelligent coverage’helps minimise the numberof test cases that need tobe generated to achievecomplete coverage - result-ing in fewer simulation cy-cles and a higher velocityof verification.”8 For full editorial

Duo’s Collaboration Delivers vhDLRandomisation & Functional Coverage

Movea’s Air MotionIC mo-tion enabled remote controlreference design uses In-venSense's MPU-6150, theworld's first and smallest sixaxis motion tracking deviceon a single chip with a built-in digital motion processor.It provides a complete mo-tion enabled remote controlreference design enablingMovea and InvenSense cus-tomers to take advantage ofan off the shelf, ready touse motion interface solu-tion to provide enhanceduser interface navigationand home entertainmentcontrol through motion.

Bryan Hoadley, Movea’sPresident &Executive VP ex-plains, “We are excited tobe working with InvenSenseon shaping the future ofhome entertainment experi-ence. We leverage In-venSense's inertial MEMSsensors expertise with our

SmartMotion technology tocreate the smallest and mostcost efficient solution to de-liver innovative motion fea-tures such as in-air pointing,advanced gesture recogni-tion and custom gesture-based user sign-on, dramati-cally improving userinterface navigation.”

InvenSense VP Dan Goehladds, “We are pleased tobe part of Movea's motion-enabled remote control ref-erence design, implementingour MPU-6150, the world'sfirst and only integrated sixaxis MotionTracking device.We believe that motion-inter-face is the most intuitive wayto reliably interact withtoday's content rich Smart-TV, set top box, and gamingconsole devices, andMovea's reference designwill enable faster adoptionby our joint customers.”8 For full editorial

3D Motion Down ToSix Axis Tracking

New Perforce managementsystem software includes built-in Perforce Streams codemanagement workflow. ThePerforce Streams model andthe associated visualisationtools give organisations morecontrol and visibility over com-plicated software develop-ment design projects. Out ofthe box, streams offer a pre-defined branch-and-mergestrategy based on Perforce'sown best practices. Compa-nies can adopt streams inwhole or in part to facilitatetheir own processes.

“As always, we give ourcustomers choices that sup-port however they want towork and streams are no dif-ferent,” explains PerforceMarketing Manager RandyDeFauw. “Perforce Streamsare based on more than adecade of our own develop-ment experience. Customerscan adapt them to enforcetheir own models or chooseto use Perforce the same way

they always have.”Perforce Streams intelli-

gently organise project mod-ules such as software librariesand the policies that governtheir workflow. A stream con-tains metadata about abranch - its location in thedepot, its parent branch, itsstability (such as release ordevelopment) and more. Thiscontextual information makesbranching behaviour more in-tuitive and visual, ensuringthat change flows in the rightdirection, in the right order.

Perforce Streams improvedevelopment productivity andreduce risk

Perforce Streams promotecode re-use and automatetasks associated with branch-ing and merging. Developershave more time to code be-cause Perforce's technologyefficiently performs every-dayfunctions like code merges,workspace updates and con-text switches.8 For full editorial

Software Introduces WorkflowTo Management System

Cadence has expanded itsFlash IP portfolio to includesupport for the Open NANDFlash Interface, ONFI, 3.0specification. The company isfirst to provide a combinedONFI 3 controller and PHY IPsolution, significantly stream-lining SoC and system designwhile ensuring an optimisedONFI 3 implementation formaximum performance. Ca-dence Flash IP, including thebroad portfolio of Denali IPacquired in 2010, has nowbeen implemented by over40 customers worldwide.

“System designers todaysee memory as a primarybandwidth bottleneck, whichhas given rise to many newinterface standards intendedto simplify design and im-prove overall system

throughput,” notes CadenceVP Vishal Kapoor. “As theleading supplier of memoryand storage IP, Cadence ap-plies its expertise in memorysubsystem design to rapidlydeliver solutions supportingthe latest standards, and toimplement those solutionswith a highly efficient archi-tecture designed for maxi-mum performance.”

The ONFI 3 specificationsimplifies the design of highperformance computing plat-forms, such as solid statedrives and enterprise stor-age solutions, and consumerdevices, such as tablets andsmartphones that integrateNAND Flash memory. It de-fines speeds of up to 400Mtransfers/s. In addition to thenew ONFI 3 specification,the Cadence Flash and con-troller IP also support theToggle 2.0 specification. 8 For full editorial

OnFI 3 Phy andController JoinsCadence Range

www.electronicspecifier.com14 | february 2012 | electronicspecifierproduct

AUTOmOTIVe

Macronix, collaborating withFreescale on its QorivvaMPC5645S MCU, has re-solved provides a cost-effec-tive and powerful platformfor high resolution colourgraphics and analogue func-tionality for automotive dash-board displays.

Using Macronix’s256Mbit~32Gbit, 3.3V se-rial Flash memory with anextended 32bit addressingcommand set and individualblock protection, Freescale'sMPC5645S MCU generatessuperior high resolutioncolour, TFT dual displaysand video input capabilitiesfor more advanced automo-tive applications.

“Nowadays, the rapidgrowth of functions built intothe automotive displays de-

mand more powerful memorysystem to satisfy the user ex-perience,” says Macronix As-sociate VP Winston Chen.“The Macronix 256Mbit se-rial Flash is the first memorychip tested with Freescale'sMPC5645S MCU, enablingautomotive manufactures toenjoy the cost-performanceadvantages of Freescale's sim-ple design with less pin mem-ory solution.

To keep up with higher ex-pectation from automotivedashboard and instrumentcluster design market, Macron-ix's MX25L25635E multipleI/O Flash memory can nowachieve higher read speedsthat surpass standard parallelFlash memories during continu-ous data output mode. 8 For full editorial

Serial Flash Colours UpThe Dashboard Display

Maxim’s Max13335E and13336E high fidelity stereoaudio input amplifiers are de-signed for automotive appli-cations requiring audio leveldetection and/or a jack sens-ing capability. The devicesfeature a dual channel, lownoise, programmable gainamplifier that accepts fully dif-ferential and quasi-differentialinput signals with diagnosticscapability controlled throughan I²C interface.

The devices’ audio receivercan also pair with Max13325and 13326 audio transmittersfor a full differential audio linkin automotive systems.

Each channel of the devicefeatures a high common mode

rejection ratio of 80dB, en-abling the recovery of audiosignals in the presence of largecommon-mode noise in auto-motive environments. An inte-grated programmable gainamplifier, adjustable over –14~+16dB for Max13335E and–22~+8dB for Max13336Ewith zero crossing detection,provides an optimum outputsignal level and limit zip noise.

The external flexible diag-nostic inputs can be config-ured to perform jack sensefunctions or to detect short tobattery, short to ground,open load and shorts be-tween channels.8 For full editorial8 Datasheet Download

Dual Differential AudioReceivers Integrate I²C Control

TRW Automotive Hold-ings, through its BodyControl Systems busi-ness, says it is transform-ing traditional technolo-gies such askeypad entrysystems tooffer controlof a variety ofoptions at thetouch of a fin-gertip. Just assmart phonesenable consumers toquickly switch from onetype of control function toanother, TRW is using multi-graphic rear projection andcapacitive touch sensing sovehicle owners can controla variety of vehicle func-tions quickly and easily.

TRW's multi-graphic rearprojection display is a lowcost solution that allows dif-ferent symbols to appear ona surface in the same physi-cal space at different times.The display does not requirean expensive graphicsprocessor. It can easily be

con-figured fornon-rectangu-lar and/or

curved surfaceapplications.

A prime example is key-pad entry systems that en-able vehicle access by utilis-ing a security code evenwithout car keys.

This previously one dimen-sional keypad only featurednumbers for punching in thecode but now with multi-graphic display options, thekeypad can instantly offerthe choice to control otherfunctions such as boot ac-cess, interior lighting, powerwindows and more.8 For full editorial

Touching On Vehicle Controls

Visteon's new mid-range info-tainment platform targetsglobal vehicle applicationsneeding enhanced connectivity,navigation, services and enter-tainment features. It’s compliantwith GENIVI requirements andgives vehicle manufacturers theflexibility to offer next genera-tion infotainment solutions at acost comparable to developingan embedded audio system.

“This platform builds on Vis-teon's expertise in global in-caraudio and entertainment tooffer an innovative infotain-

ment platform that providesconnectivity for mobile con-sumer electronic devices andInternet connectivity for down-loads of 'apps' and other off-board services,” says VisteonDirector Christian Feltgen. “Asone of the first automotive sup-pliers to adopt open source in-vehicle infotainment, Visteoncontinues to develop cost-effec-tive solutions that simplify theintegration of new consumerfeatures and services into thevehicle environment.”8 For full editorial

Platform Targets The Wider ScopeOf Automotive Infotainment

First FPGA based Ethernetaudio/video bridging, EAVB,network implementationcomes from Xilinx and it’s op-timised to carry high speeddata traffic within the car.

As consumer expectationsfor higher resolution dis-plays and graphics qualityin their driver assistance,navigation and passengerentertainment systems grow,so do the associated chal-lenges of moving content

around the vehicle.The implantation demon-

strates the capabilities of thenew EAVB development jjointly developed with XilinxAlliance Program memberDDC to give automotive sys-tem developers the frame-work and tools necessary toaccelerate their developmentof applications that deliver aricher experience for driversand passengers.8 For full editorial

Network bridges AutomotiveDriver Assistance & Infotainment

www.electronicspecifier.com16 | february 2012 | electronicspecifierproduct

AuTOMOTIve

Fault tolerance is a growingconcern in the march ofelectronics in automotivesystems in the bid toachieve not a single point offailure that would prevent acar from at least limping offthe road or making it to thenearest service station. Re-dundant systems, watchdogtimers and other control cir-cuits reroute signals andperform other functions toensure a vehicle can safelymake it off the road when afailure occurs.

Maxim’s Max16997 and16998 are said to enhanceautomotive system safety.The high voltage watchdogtimers boast extreme reliabil-ity and security in safety criti-cal MCP controlled applica-tions and in the event of afailure, the watchdog acti-vates and can safely switchto redundant circuitry.

These devices featuretime-out or windowedwatchdog functions, exter-nal voltage monitoring forpower up or down reset-ting, MCU resetting, en-

abling inputs and a highvoltage-tolerant system en-able output. As these ICscan be directly poweredfrom the 12V car batteryand are transient voltagetolerant up to 45V, they op-erate independently of alow voltage supply, unlikestandard low voltagewatchdog timer devices.Thus, if the downstream cir-cuitry fails due to a hard-ware or software, these su-pervisory circuits continueto operate independently.

Making the IC evenmore immune to hardwarefailures, the active lowreset, watchdog triggerinput, enable input and theexternal voltage reset inare all 20V rated to with-stand short circuiting to carbattery voltage.

This provides a robust bar-rier against downstream highvoltage electrical failures andguarantees the switch-over toredundant circuitry securelyin this condition.8 For full editorial8 Datasheet Download

Watchdog Timers enhanceAutomotive System Safety

Freescale says consumer de-mand for high performance,smart connectivity is revolu-tionising consumer in-car ex-periences and creatinggrowth opportunities for sili-con providers that offer auto-motive grade products capa-ble of meeting the rigorousdemands of the automotive in-dustry. So it says its GM 15year track record of utilisingits silicon for the OnStar plat-form will continue.

Freescale’s i.MX 6Solo ap-plications processor has beenselected as the primary pro-cessing engine for the nextgeneration of GM’s deemedgroundbreaking OnStartelematics system.

The advanced security ca-pabilities of the i.MX 6Soloproduct were key to its selec-tion. As the era of connectedintelligence boosts the volumeof data flowing into and outof automobiles, the incorpora-tion of processors that helpprotect the security of this im-portant data grows increas-ingly vital to automakers andtheir customers.

“Freescale is pleased thatour i.MX 6Solo device willplay a defining role in help-ing advance GM’s world-class OnStar system,” saysFreescale VP Bernd Lienhard.“This design win highlightsFreescale’s leadership in de-livering processing capabili-ties that meet and exceed thedemanding requirements ofthe world’s top automakers.” 8 For full editorial

Freescale DriveContinuesWith GM

TEF7006 and TEF7007 arenext generation, high per-formance FM car radio re-ceivers from NXP Semicon-ductors for backgroundscanning and data services.They can decode data RDS,RBDS and TMC services todeliver infotainment andradio station data.

The devices are designedfor automotive and boasthigher performance com-pared to alternative automo-tive solutions based on con-sumer or mobile designs.

Built on NXP’s low-IFtuner, car DSPs and digitallyprocessed RDS demodula-tion and decoding technolo-gies, these FM receivers en-able rich infotainment viaradio broadcast data, deliv-ering automotive qualifiedperformance in a compact,

low cost design. The globally compatible

devices cover a broad bandspectrum of 76~108MHzfor Europe, Japan and theUS. The receivers come inthin leadless HVQFN plasticpackaging measuring5x5x0.85mm and requiringonly minimal external com-ponents.

“TEF7006 is a great fit inour product portfolio for carOEMs,” says Fujitsu-TenGeneral Manager YukihiroHashimoto. “The device canbe applied flexibly in manyproducts, covering a widerange of FM reception stan-dards and offering variousinterfaces such as MPX out-put and digital audio output.As RDS/TMC functionality isalready mandatory in theEuropean market, at Fujitsu-Ten we are convinced thatthe TEF7006 strengthensour future product roadmapby delivering an integratedsystem solution with NXP’sexisting automotive DSPs.”8 For full editorial8 Datasheet Download

next Generation FM Receivers DeliverBackground Scanning & Data Services

Vishay’s new non-contactHall effect linear positionsensor covers short electri-cal strokes <10mm and isavailable with a spring re-turn system. 20 LHE is opti-mised for applications inharsh environments requir-ing long life sensors.

The Hall effect sensor en-ables performance in condi-tions involving high fre-quency vibrations up to 20gand shocks up to 50g. Witha 10 million cycle life, thisdevice is ideal for shortstroke measurements in in-dustrial applications. 20LHE’s linearity is down to±1%, with the sensor provid-

ing analogue ratiometric ordigital PWM output andproviding continuous per-formance for the life of thedevice with no linearity drift.

The device operates froma 5V ±10%, <1mA typicalsupply and withstands +20Vover-voltages and −10V re-verse voltages. Recommend-ed load resistance is 1kΩ foranalogue and PWM outputs.

Applications include tillers,heads for fork lift steering,tractor gear shifts, truck tiltsensors and pressure meas-urement and pedal displace-ment systems.8 For full editorial8 Datasheet Download

hall effect Sensor Suits ShortStrokes Linear Positioning

www.electronicspecifier.com18 | february 2012 | electronicspecifierproduct

AUTOmOTIVe

SMP480 digital pressure sen-sors are for barometric airpressure measurement indiesel or gasoline engine man-agement control. It’s designedfor a standard pressure rangeof 40~115kPa and is basedon a two chip design. The sen-sor element is manufacturedwith Bosch’s advanced poroussilicon membrane process andallows a stable, single crys-talline membrane to be pro-duced with a surface micro-

mechanic process.The pressure signal is ampli-

fied and temperature com-pensated by a separate ASICmanufactured in a highly inte-grated CMOS technology.The digital signal evaluationenables elaborate self tests.Additionally to the pressuresignal the sensor provides atemperature signal.

Bosch says that with thesetechnologies it realised a ro-bust design and achieved highsensor accuracy. The sensor isshort circuit and ESD pro-tected and RoHS compliant.8 For full editorial

Barometric SensorSuits enginemanagement

LeDs Raise Bar On Light

TI has a full system solutionfor connected automotive in-fotainment, combining itsleading automotive infotain-ment processors, wireless con-nectivity solutions, analoguesolutions and optimised soft-ware to enable feature richautomotive applications suchas automotive infotainmenthead units, rear seat enter-tainment devices, radio, andnavigation tools.

“The road ahead is pavedby the demands of on the goconsumers who are alreadyaccustomed to always con-

nected, multimedia richlifestyles fuelled by smart-phones, tablets and othermobile products,” says TIProduct Manager MatthewWatson. “As similar featuresmove to the automotive mar-ket, TI is uniquely positionedto be a single source fortechnologies that will pioneerthe next generation of con-sumer-demanded automotiveinfotainment capabilities.Our full solution, completewith feature rich processing,wireless connectivity and op-timised software, helps auto-motive customers stay aheadof the curve with compelling,trusted products.”8 For full editorial

TI Well ConnectedFor AutomotiveInfotainment

u-blox 6 GPS receiver mod-ules have been designed intotwo lines of advanced in-carinfotainment systems byForyou General Electronicsfor its Android basedAN6B01 and CE6620.

“Our in-car infotainmentand navigation systems offerthe highest level of perform-ance in terms of design, qual-ity, user-friendliness and satis-fying user experience,”explains Foryou’s Head ofSourcing Yang Dan. “Reliablenavigation is a core feature ofour products, and our cus-tomers expect uncompromis-ing performance in demand-

ing driving environments. Thatis why we rely on u-blox GPStechnology.”

u-blox Manager Fred Caiadds, “We are pleased tosee the positive results of ourlongterm relationship withForyou. Foryou recognisesour industry leading GPStechnology but also appreci-ates our world class supportand local presence.”

Foryou’s car infotainmentsystems deliver a rich, graphi-cal navigation experiencewith touchscreen control. Mul-timedia features include TV,radio, and DVD playback.8 For full editorial

Foryou NavigatesTo U-blox GPS

Surface mounting PowerMetal Strip resistors fromVishay come in a 2512 casesize, combining 3W highpower capacity with resistancevalues down to 0.0005Ω.SLP2512 incorporates a solidmetal nickel chrome or man-ganese copper alloy resistiveelement with a TCR<20ppm/°C. The resultanthigh power resistors operateover −65~+170 °C whileboasting superior electricalcharacteristics with the PowerMetal Strip construction.

These devices enable thedesign of high power circuitsfeaturing the smallest possibleresistor for higher perform-ance end products. Further-more, the resistor’s high tem-perature capability makes itsuitable for harsh, high tem-perature environments with-out sacrificing power rating orelectrical performance.

The resistors suit currentsensing and pulse applica-tions, including switching andlinear power supplies, instru-ments, power amplifiers, andshunts in automotive elec-tronic controls. 8 For full editorial8 Datasheet Download

Resistor Is 3WRated DownTo 0.0005Ω

Two new headlight LED proto-types from Osram Opto Semi-conductors shape up as OslonBlack Flat and the Ostar Head-lamp Pro. Both combine a newchip and packaging and a ce-ramic converter for high lightoutput even at high currents.Light pattern is uniform, withthermal stability and a goodcontrast ratio

Ever more flexibility is need-ed for the light sources used inheadlights, the eyes of any ve-hicle, says Osram. Not onlydo they have to be reliableand provide the appropriateamount of light in all visibilityand driving conditions, theyhave to perform various func-tions and cope with changingambient conditions, includingthe high temperatures in theheadlight itself. Osram’s new

devices are designed to meetthese requirements.

Oslon Black Flat is QFNpackaged with a ceramic con-verter typically providing athermal resistance of 5k/W, a20% improvement on otherBlack Series LEDs. The thermalcoefficient of expansion of thespecial material matches thecoefficient of expansion of themetal core board for high sta-bility. The LED needs no lensso its light can be injected veryclose to the light guide andwith an identical solder pad toothers in the range, applica-tion light output can be signifi-cantly increased from alargely identical board design.Power consumption is 2.3 W,operating at 700mA and typi-cal luminous flux is 190lm.8 For full editorial

AuTOMOTIve

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 19

8 Our world is becoming one of ubiquitous, seamless, intel-ligent connectivity, says Freescale. It touches our lives in un-expected ways today and profoundly shapes the future ofour communication, entertainment, healthcare, energy man-agement, safety, transportation and more. In automotive,many in the industry believe that the automobile will un-dergo more changes in the next 15 years than it has sinceinception 125 years ago. Connectivity, safety and energyefficiency come to mind...

Connected For Automotive’s Future

As in-vehicle connectivitygrows, automotive manufactur-ers are under constant pres-sure to deliver competitive, in-novative features whileminimising cost. Broadcom'sBroadR-Reach enables multi-ple in-vehicle systems such asinfotainment, automated driverassistance and on board-diag-nostics, to simultaneously ac-cess information over un-shielded single twisted paircable. By eliminating cumber-some, shielded cabling, auto-motive manufacturers can sig-nificantly reduce connectivitycosts and cabling weight.

Engineered to meet rigorous

qualifications and demands forthe automotive semiconductormarket, BroadR-Reach pro-vides 100Mbps bandwidthwhile dramatically reducingconnectivity costs up to 80%and cabling weight up to 30%.

Devices in the BroadR-Reachportfolio include three highlyintegrated switches with em-bedded PHYs and two stand-alone PHY solutions. Each isdesigned to meet in-car EMCrequirements for extreme auto-motive temperature grades.

Broadcom, NXP, Freescaleand Harman recently formeda special interest group todrive the wide scale adoption

of Ethernet based automotiveconnectivity. Jointly devel-oped with founding automo-tive members BMW andHyundai, the One Pair Ether-net Open Alliance will ad-

dress requirements for improv-ing in-vehicle safety, comfortand infotainment, while signifi-cantly reducing network com-plexity and cabling costs.8 For full editorial

BroadR-Reaches Out Overunshielded Twisted Pair

Linear Technology’s LT4363controller provides over-volt-age and over-current protec-tion to high availability elec-tronic systems. It builds on firstgeneration LT4356 device ca-pabilities by extending protec-tion capabilities beyond 100Vwithout sacrificing over-currentprotection. LTC4363 reactsquickly to over-current andshort circuit faults at the load,limiting the current to a safevalue set by a sense resistor.

Armed with a 100V maxi-mum and operational capabil-ity down to 4V cold crank,LT4363 makes an ideal bar-rier against badly behavingsupplies. A simple controllersupply clamp extends protec-tion beyond the native 100V. It

even survives reversed batteryconnections to –60V.

During voltage surges, theoutput is regulated to a volt-age set by a resistive divider,allowing the load to operatesafely and smoothly throughtransient events. Over-voltageand under-voltage compara-tor inputs ensure LT4363 re-mains off outside a user de-fined voltage range.

To limit thermal stress on thepower MOSFET, LT4363 usesa VDS accelerated fault timer.If the fault persists, a warningis flagged before the MOSFETshuts off. By limiting MOSFETgate slew, the controller can beadapted for Hot Swap. 8 For full editorial8 Datasheet Download

Controller Is effectivehigh voltage Surge Stopper

Antenova’s GPS RadioNovaRF antenna modules havebeen selected by leading Ko-rean vehicle black box manu-facturer iTronics, AMON andUB1 for global markets.

“We have seen increasinginterest in our GPS RadioNovaRF antenna modules from vehi-cle black box and other vehi-cle tracking device manufac-

tures,” comments AntenovaCEO Greg McCray. “Many ofthe black box driverecorder/tracker devices aremanufactured in Korea for theJapanese and European mar-kets. The demand for these de-vices is being driven by gov-ernment legislation and theinsurance industry for monitor-ing and recording driver be-

haviour for a variety of rea-sons from improving driversafety to assessing collision lia-bility, reducing fraudulentclaims and enabling pay asyou drive/usage based insur-ance schemes. Our GPS RF an-tenna modules provide thehigh accuracy and reliable lo-cation information, which is es-sential for these applications, in

a small, compact and simple tointegrate module.”

RadioNova RF antennamodules come in space sav-ing, low profile form factorsincluding GPS receiver ICsfrom CSR/SiRF and u-blox.M10382 is a surface mount-ing GPS module incorporat-ing the u-blox 6 GPS chipsetwith Antenova’s high perform-ing GPS antenna. 8 For full editorial

Korea Twigs Antenna Modules For vehicle Black Box Market

Belden MIPP is a terminationpanel for cables that need tobe connected to active equip-ment such as switches, indus-trial Ethernet devices and anyother device with an Ethernetlink. It provides greater systemreliability and eases installa-tion. The MIPP provides theideal connection betweenBelden cables and Hirschmannswitches and is designed tohave the same look and feelas Hirschmann products.

Using patch cords to connectto active equipment, cablescan be terminated outside thecabinet in an organised andstructured way for high reliabil-

ity. Installation is quick andeasy, saving time and signifi-cantly reducing initial set-upcosts, whilst at the same timecontributing to greater reliabil-ity and easier and more effi-cient system management, re-quiring less maintenance.

With a lightweight alu-minium structure that in-creases overall versatility, theMIPP can easily be mountedon a DIN rail or even fixed atthe sides of the cabinets via awall mounting plate.

The MIPP was designed forindustrial use, where its func-tionality and reliability cancontribute to the uptime andavailability of systems. 8 For full editorial

www.electronicspecifier.com20 | february 2012 | electronicspecifierproduct

CABIneTS, RACKS & enCLOSuReS

Schroff’s ULTRX fibreglass,wall mounting enclosuresare designed to providelong life protection for elec-tronics or electrical equip-ment in potentially corrosiveenvironments.

The enclosures are manu-factured by Schroff sistercompany Hoffman, fabri-cated from compressionmoulded fibreglass for hightemperature, chemical andimpact resistance. A seam-less foam in place gasket en-sures IP66 rating.

These versatile enclo-sures can be turned 180O

for left or right hinging andavailable with solid doorsor an impact resistant poly-

carbonate window. The hinge design allows

opening up to 270O anddoors incorporate a stain-less steel, quarter-turn latchthat can be optionally up-graded to a key locking orpadlocking handle foradded security.

Moulded-in bosses and in-tegral mounting rails areprovided for attaching inter-nal panels. The ULTRXrange also includes acces-sories such as panel bracketkits, swing-out panels, rackmounting angles, swingframes, hole seals, doorstop kits and mountingbracket kits.8 For full editorial

Fibreglass Wall Mountingenclosures Are IP66 Rated

Mounting equipment on theinside of enclosures withouta mounting plate or drillingholes into the wall is not al-ways easy, says Rittal whoseinterior rails are designed tofit within a range of enclo-sures, with various depths, toeliminate the need fordrilling holes in the sides,base or top of the enclosurethat could lead to wateringress or corrosion.

Rails are simply fitted by lo-cating them between the rearwall and the door jamb of theenclosure and friction screwsare then tightened to create astrong mechanical fixing point

for a number of accessories.Rails are punched with the

standard hole pattern to ac-cept a wide range of avail-able products. These rangefrom lights, door switches anddoor stays, through to mount-ing fails in various lengths to-gether with cable conduitholders to make fitting out theenclosures easier and moreprofessional without the needfor drilled holes.

8 For full editorial

enclosure RailsMake For easyKit Mounting

1110-U120-PH is Emka’s lift-offhinge with a simple screw fix-ing. Clever design, it says,maintains cabinet door in-tegrity as only screw holepunching, not cut-outs areneeded, maintaining doorrigidity. AISI 316 castings, fineground and in a simple designenable rapid door removal by

simply lifting them off.The hinge programme, in

stainless steel, accommodates26mm door returns with180° opening. This is idealfor use on adjacently situatedsuites of cabinets in corrosivewash down environments orfor harsher applications forexample off-shore whereoften larger and heavierdoors are needed.

Matching stainless steel Land T handles as well asswing handles are availableas are some 500 extrudedrubber sealing profiles fordoor sealing. 8 For full editorial

hinging On Reliability

Modular PatchPanel ConnectsFor Reliability

CABINeTS, RACkS & eNCLOSUReS

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 21

Improved thermal perform-ance at low cost is the boastof ABL Components for itsBGA heatsinks. The companyalready supplies much of theUK heatsink market and, fol-lowing new product develop-ments in recent years, hasalso substantially increasedits overseas sales, beingspecified by many OEMsaround the world.

The BGA range has been

developed to suit a variety ofdemanding requirements andcomes with both flip chip,push pin and standard BGAoptions. The comprehensiverange is said to assist design-ers and engineers in selectingthe product that will providemaximum thermal perform-ance as well as suiting the op-erating envelope in which thedevice will be sited. 8 For full editorial

BGA Heatsinks Set To Perform

Four KM6 sub-rack variantsfrom Verotec are each opti-mised for specific applica-tions. Meeting IEC60297-3,they are heralded as the mostversatile and configurable sys-tems on the market, andavailable ex-stock with nominimum order restrictions.

For light and medium dutyapplications, KM6-II featurestwo screw fixing for all tie-bars for a rigid assembly. It isavailable in heights of 3, 4, 6and 9U, widths of 24, 42, 60and 84HP and depths of 160,240, 300, 360 and 420mm.The KM6-RF sub-rack rangealso meets IEEE 1101.10/11for VME64x, cPCI, VPX andPCI telecoms, medical and in-strumentation applications.RFI shielding, support forRTM, front panel ESD andcoding and injector/extractor

handles are all provided aspart of the system.

KM6-HD sub-rack systemsare designed for military andtransport applications wherea rugged system is requiredto resist shock and vibration.These Mil-Std-167 designs fea-ture positive guide retention,heavy two screw fixing tie-bars, 3mm side plates andrack angles with a conductivefinish throughout.

KM6-HD sub-racks acceptstandard Eurocards in 3, 6and 9U heights with depths upto 400mm. For high volume,cost-sensitive applications,KM6-EC preserves KM6-IIbuild quality and versatility of ,providing a cost-reduced sys-tem featuring lighter extrusionprofiles, single point tie-bar fix-ings and Zintec side plates. 8 For full editorial

Sub-Racks Get Down To Specifics

Large 24~60in long XL Se-ries panel supports from Pro-duction Solutions use thesame patented technology asin its ML and GO! versions.

The demand for largepanel shipments continues togrow and the company saysits Red-E-Set XL Series cansupport them, providing userswith reduced changeovertimes and improved quality.

The range now comes withnumerous different levels ofsupport tooling from the GO!to the mid-range ML manuallock series, to the fully auto-matic AS auto-set and nowthe XL series.

All Red-E-Set products areproven to reduce changeovertimes, improve quality, elimi-nate component damage andincrease revenue once imple-mented on any screen printer,pick&place, chip shooter ordispensing machine.8 For full editorial

Large PanelSupports ReduceChangeover Times

Hammond's new Rack Ba-sics racks and cabinetspromise contractors a qual-ity, economy option at acompetitive price. The com-pany says distributors andcontractors are used toHammond high qualityproducts, however, it seesthe need for a product linethat meets the basic contrac-tors need both in price andquality. It also wanted toprovide a fresh, new lookfor the brand, making iteasy to distinguish from theHammond line.

Rack Basics products in-clude SWCC, WMC andFWB wall mounts andDC200 server cabinets. Lat-est in the range is RB-2P77,an economy two post openframe rack. It is directly com-parable to the heavy dutyoffering of the competition,says the company and hasalready seen interest by anumber of distributors, con-tractors and end-users. It is instock and priced to sell.

Hammond Manufacturingfirst introduced a two postrack in Canada in 1935.Since then, it has been an in-novator in the data commu-nications industry. 8 For full editorial

hammond PacksA Punch For economy

www.electronicspecifier.com22 | february 2012 | electronicspecifierproduct

CABIneTS, RACKS & enCLOSuReS

OKW has added a case sizesand a wider selection of inter-mediate rings to its Minitecrange of miniature enclo-sures. The new intermediaterings include wider versionsfor increased case height,plain versions without eyeletsfor hand held only devices,and a new ring with an aper-ture in the end for fitting aUSB connector.

The range now comprisestwo basic designs: Edge rec-tangular style cases and Dropdroplet style cases. There arenow eight individual casessizes with dimensions rangingfrom 51x32x13mm to84x53x19mm.

These highly attractive multi-coloured housings are de-signed for personal electronicdevices which are carried inthe hand, on a key ring, wriststrap, or lanyard. Typical ap-plications include medical de-vices, personal safety, detec-tion, monitoring, emergencycall, audio, alarm, and re-mote control electronics.

Each case consists of a top,bottom and soft intermediatering. The top and bottomparts are moulded in off-whiteor lava grey ABS, or black in-frared transparent UL 94 HBPMMA. The recessed toppart is designed for locating a

membrane keypad or prod-uct label.

Edge versions also comewith a smooth top for fittingrubber keypads and locationbosses are moulded in thebottom for mounting PCBsand components. The casesare assembled using a singleself-tapping fixing screw.

The intermediate rings aremoulded in soft touch TPE infour standard colours of vol-cano grey, orange, limegreen and bright blue. Therings with eyelets or straploops are designed for thekey ring, wrist strap or lan-yard accessories.8 For full editorial

Miniature enclosure Range extended

Component life expectancy isdramatically reduced whenoperating above optimumtemperature, says Gardtec,and over cooling is energy in-efficient. Its Green Fan Cord,available from Aerco, is her-alded as the only fan supplycable that can thermostati-cally control ac fans.

Promising ac fan revolution,it simply replaces existing fancables and needs no addi-tional wiring, PCBs, controlboxes or design changes. Itsuits multi-fan configurations

such as fan trays. Intelligentcooling systems incorporatingdc fans have been common-place for many years be-cause the speed of a dc fancan be simply controlled byvarying the supply voltage.

With the Green Fan Cord,ac fans are automaticallyturned on and off to keep asystem operating at a pre-setoptimum temperature thussaving energy, reducingcosts, minimising noise and in-creasing product life.8 For full editorial

AC Fans Wired ForThermostatic Control

Metcase Datamet wall mount-ing enclosures now havethree more models in therange. The stylish aluminiumhousings are designed for in-door electronics which can bemounted to a wall or machinehousing. The four part assem-bly enables full access to theelectronics during installationand servicing.

Typical applications includecontrol units, measurementtechnology, medical equip-ment, safety and security sys-tems, communication devices,and machine controllers. Thenew designs are said to proveespecially useful for heavierindustrial applications.

Datamet enclosures incor-porate a die-cast front bezelthat locates on the

fabricated aluminium casebody and rear panel assem-

bly. The rear panel includesmounting points for fixing thePCBs and fitting the enclosureto a wall or machine. The un-derside of the case body canbe used for cable glands orconnectors. The cases areeasy to assemble and thereare no visible fixing screws onthe case body or rear panel.

Three standard sizes areavailable: 250x180x120mm,350x250x120mm and400x300x120mm. 8 For full editorial

Wall MountingRange extended

CABIneTS, RACKS & enCLOSuReS

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 23

IP65 rated 1071 compressionlatches from FDB Panel Fit-tings are compact, providingan unusually low profile ofonly 22mm when open andyet providing 3mm of com-pression, enabling the bene-fits of compression lock tech-nology to be achieved insituations where space is at apremium. Included are vehi-cle applications or where aninterior panel or other equip-ment requires clearance from

the lock cam.The 1071 series provides

is also vibration proof andcomes in left and righthanded orientation, with aquiet and secure fastening.

Operation is by a quarterturn which will latch thecam in position, followedby a further quarter turnto complete the 3mm com-pression cycle.

The pre-assembled 1071, to-gether with rigid H sectioncam, can be quickly and tool-lessly installed in doors up to2mm thickness.8 For full editorial

IP65 CompressionLatch Keeps ALow Profile

Rittal now has a nano coatingoption for its outdoor enclo-sure range that can be ap-plied to the external finish tohelp reduce the effects ofgraffiti, making clean-upquicker, easier and less costly.

This option is in addition tousing nano-technology proper-tiesas a cold spray pre-treat-ment prior to painting to im-prove corrosion resistance.

The nano coating has Lotuseffect characteristics wheresurfaces are not wetted whenin direct contact with a liquidand dust particles do not ad-here. The nano-technologycoating minimises surface fric-

tion and provides a structurethat resists adhesion once set.However, it has excellent ad-hesion to the underlying sur-face and is also transparentand inert, with good mechani-cal and chemical resistance.

The coating has long lastingwater and organic fluid repel-lency, limiting the effect of ap-plied graffiti and enabling eas-ier removal by pressurecleaning. Longterm cost bene-fits are clear, says Rittal, dueto improved resistance andcheaper removal of unwantedgraffiti, as well as improved re-sistance to corrosion.8 For full editorial

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Series 54 series from FDB aredesigned to optimise aesthet-ics, lightness and strength.They are specifically intendedfor enclosures, 19in racks, cab-inets and door panels in thespecialist panel industry andfor storage boxes, personalstorage facilities, special ma-chines and more wherecurved style adds design flair.

FDB’s new 54 Series hingesare robust and corrosion re-sistant with 270° opening.They are matte black finishedand in symmetrical or asym-metrical format.

Fitting options include coun-tersunk screws or integral stain-less steel studs. Sizes include30, 40, 50 and 60mm, en-abling a tensile strength of1200~5100N and a shearstrength of 850~4200N.8 For full editorial

hinging OnCabinet Strength

Finder panel thermo-stats are designed tomaintain constanttemperature levels incontrol panels andenclosures. For sim-ple and sophisti-cated heating andventilation systems,7T Series thermo-stats improve com-ponent reliabilityand preserve instru-mentation accuracythrough enhancedtemperature settingand control.

With red or bluetemperature settingdials to clearly identify theheating and ventilation vari-ants, the thermostats are IP20rated and come in slim17.5mm rail mounting hous-ings, ensuring easy installation

and usage in com-pact panel designs.

Temperature set-ting range is0~60ºC, makingthem suitable for awide range of envi-ronments, while theirsnap action bi-metal-lic sensor means apositive switchingaction and a longelectrical life of100,000 cycles.

The thermostat’soutput contact, nor-mally closed forheating control ornormally open for

ventilation control, is rated at250Vac, 10A, enabling directswitching of heater or fanloads up to 2500VA AC1and 250VA AC15.8 For full editorial

Panel Thermostats Ramp up Reliability

First industrial grade MicroS-DHC memory card shapesup from Apacer Technology,with up to 16GB capacityand firmware and compo-nents that can be fixed rightafter customer recognitionand validation. This reducesthe risk of out of stock andcompatibility issues by pro-viding stable customer sup-ply and high reliability.

MicroSDHC is SD 3.0compliant and supportsClass 10 high speed trans-mission. It is available in4GB, 8GB and 16GB ver-

sions with sequential readand write speeds up to20/14MB/s, fulfilling the re-quirements for high capac-ity, high speed data storage.

To ensure data stays cor-rect in transmission, MicroS-DHC supports ECC function-ality, effectively minimisingpotential errors through fre-quent data access while en-suring data integrity in trans-mission. Global Wearlevelling also helps deliver aprolonged life, as well assafer data storage.8 For full editorial

Industrial-Grade Memory CardBoasts Safe Transmission

www.electronicspecifier.com24 | february 2012 | electronicspecifierproduct

ACTIve COMPOnenTS

up To new Standard Chiphas More In Store

PIC24F GA3 MCUs join Mi-crochip’s eXtreme LowPower, XLP, family and boast-ing the lowest active currentfor 16bit Flash MCUs, as wellas several flexible low powersleep modes.

The devices feature 150µA/MHz active current, as well assix DMA channels, whichallow a routine to be executedwith less power consumptionand increased throughput. Thefamily, says the company,demonstrates the continual ad-vancement of its XLP technol-ogy and adds a new lowpower sleep mode with RAMretention down to 330nA.

The devices are the first PicMCUs with VBAT for batterybackup of the on-chip real timeclock calendar and with an in-tegrated LCD driver and otherperipherals, the devices en-able more efficient, less expen-

sive designs for a host of con-sumer and industrial app.

Some applications requirebattery life to approach theoperational life of the endproduct. Pic24F GA3 MCUsenable maximum battery lifeby reducing the overallamount of power that the ap-plication consumes.

For the RTC to continue run-ning when primary power isremoved, the VBAT pin can beused to supply back-uppower with only 400nA. Ad-ditionally, the transition fromVDD to the VBAT is automaticwhen VDD is removed. The in-tegrated LCD driver directlydrives up to 480 segments,with an eight common drivecapability, enabling more in-formative and flexible dis-plays that include descriptiveicons and scrolling.8 For full editorial

MCu Additions BoastLowest 16bit Active Current

8 The LCD Explorer development board enables designersto evaluate and design systems with a complex eight com-mon LCD drivers. The 296 segment LCD is driven by 37 seg-ments and eight common lines and allows customers toutilise a 37x7 segment banner. The on-board potentiometer,temperature sensor, four buttons, mTouch key and PICtailplus expansion connectors, provide a versatile platform forlow power system development.

Development Board ScreensLCD Applications

First voltage level translatorcompliant with the latest SD 13.0 standard comes fromSTMicroelectronics. And the in-crease in storage capacity andaccess speed together with thelow static power consumptionand small package size of ST'snew level translator, makes itan ideal choice for interfacingapplication processors or digi-tal basebands to SD memorycards in mobile phones,portable media players,tablets, digital cameras or per-sonal navigation devices.

The SD 3.0 specificationprovides up to 2TB of storageand accelerates SD interfaceread/write speeds to 50MB/sat 50 MHz double data rate.ST’s new ST6G3244 devicecouples high speed operationwith very low power dissipa-tion, supported with thePower Down mode.

Data integrity is securedthrough balanced propaga-tion delays and electromag-netic-interference filters andsignal conditioning. 8 For full editorial

ACTIve COMPOnenTS

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 25

Power ManagementConverters Simplify Design

Showtime highlights

8 Check out this preview on NXP's BFU6xx-7xx, 6th and7th generation wide band transistors.

ZMDI’s 1, 2 and 3A currentmode synchronous buckdc/dc converter ICs are tai-lored for easy design, quickproduct development and lowmaterials costs. The 1MHzZSPM401x product line com-prises three families and 18products: the ZSPM4011 1A;ZSPM4012 2A andZSPM4013 3A families.

High level of integrationmeans only four external de-vices are required: three ca-pacitors and an inductor.Each family comes in fixedoutput voltage options of 1.5,1.8, 2.5, 3.3 and 5V to re-duce external parts counts,while allowing for quick partselection and easy design.Input voltage range is 6~24V

or 6~20V with a 3A optionthat lets designers targetmore applications with onebasic design technique.

Each family also offers avariable output option of0.9~5V for maximum partflexibility. At 5Vin and1.8Vout, the parts deliver90% efficiency. At 6Vin and3.3Vout, efficiency increasesto 93%.

The high efficiency of thedesign eliminates the need forany external thermal protec-tion. Additional features areinput supply under-voltagelockout, soft start for con-trolled start-up with no over-shoot, and full protection forover-current, over-tempera-ture, and Vout over-voltage.

Synchronous switchingat 1MHz, ±10%, and inter-nal compensation minimisesthe number and size of ex-ternal parts, thus minimisingboard space.

A typical, low standbymode of 5µA maximises en-ergy efficiency while reducingthe application's powerbudget. The ICs operate over–40~+125°C.8 For full editorial

Flexibility drops into electricitymetering and energy monitor-ing applications with a littlehelp from TI’sMSP430F673x/F672x rangeof ultra-low power, 16bitMCUs. The devices guaran-tee no interruption of opera-tion through a backup capa-ble microcontroller supportingRTC operation and powermanagement from the mainpower supply and up to twoseparate auxiliary supplies.

The 24 new devices alsoachieve more precise meas-urements through an in-creased sampling rate and su-perior linearity over multipleoperating conditions, such ascurrent range and time, result-ing in a stable system solution.These devices are TI’s first 6xxseries MCUs with integrated24bit sigma-deltas and a 320segment LCD controller.

Compared to the previous

160segment solution, TI

says developers can take ad-vantage of enhanced seg-mented LCDs with more pro-grammability and enablemore characters on displays,especially with Asian lan-guages. As part of theMSP430 portfolio, F673x andF672x devices are designedfor ultra-low power modes, en-suring the LCD display is con-suming as little power as possi-ble during operation.

Tools and software for sim-plified development are avail-able to support metrology soft-ware on the devices, provid-ing an easy start-up for devel-oping utility meter products. 8 For full editorial

Two Dozen MCusDeliver SolutionFlexibility

www.electronicspecifier.com26 | february 2012 | electronicspecifierproduct

ACTIve COMPOnenTS

8 The STM32 F4 tutorial from STMicroelectronics highlightsthe high performance Cortex M MCU with FPU delivering168MHz/210 DMIPS performance.

MCu Ramps up MIPs Performance

ZMDI’s ZSSC3016 16bit sen-sor signal conditioning IC forcalibrated resistive sensormodules, combines high accu-racy amplification, 16bit pre-cision a/d conversion and an18bit DSP for linearisationand calibration.

The high resolution sensorinterface ASSP provides spe-cial features for batterydriven low power devicessuch as an overall currentconsumption of <1mA com-bined with an ultra-lowstandby current of <250nA,operation voltages between1.8 and 3.6V and an intelli-gent power save scheme toensure lowest overall currentconsumption. Designed forhigh resolution altimeter mod-

ule applications, the ZSSC3016 is ideal for use in mobilephones, sport watches or out-door GPS tracking systems.

With a practically noise-free,16bit output signal, ZSSC3016allows an altitude resolution of<15cm at sea level. It is suffi-ciently accurate for barometricaltitude measurement forportable navigation or emer-gency call systems, altitudemeasurement for car naviga-tion, inside hard disk pressuremeasurement, and weatherforecasting equipment. Mod-ern consumer products, suchas motion sensing sportsequipment or multi-functionwatches benefit fromZSSC3016’s precision. 8 For full editorial

Sensor Signal Conditioner Delivershigh energy-efficient Accuracy

Two high security Eon SiliconSolution Flash memory devicesfrom Transonics are non-volatile and feature a parallelinterface on the EN29GA andSPI serial on the EN25QA.The devices feature persistentprotection bits and are Nagraapproved for set-top box andpay TV applications.

The devices boast high secu-rity protection for programmeddata, achieved via PPB func-tionality. Each PPB is individu-ally programmed and there isno PPB Erase command.

EON high security Flash de-vices are also suitable for otherapplications including PoS ter-minals, smart meters and handheld equipment where codeneeds to be protected toavoid modification or copying. 8 For full editorial

Flash Memory extends To high Security

Lattice Semiconductor’s lowpower, high speed, mini pack-aged additions to its Lat-ticeECP3 FPGA family areideal for power and spacelimited applications in profes-sional cameras, surveillancecameras, medical imaging,video communication, andsmall-form-factor wireline and

wireless appliances.The three new FPGAs con-

sume on the average 30%lower power compared to thestandard devices and 10%faster. Family additions also in-clude the industry’s smallestFPGA with high speed Serdesand DDR3 memory interfac-ing. The mini FPGA with Ser-des is 66% smaller than thestandard LatticeECP3 deviceof the same logic capacity.8 For full editorial

Compact Trioextends FPGA Performance

Adding to its PCI Expressclock generator and clockbuffer portfolio, Silicon Labo-ratories says it provides the in-dustry's broadest range ofclocking solutions to addressthe stringent specifications ofthe PCIe Generation 1/2/3standards. Included are offthe shelf Si5214x clock gener-ators and Si5315x clockbuffers for power and cost-sensitive PCIe applicationsand the Si5335 web customis-able clock generator/bufferfor FPGA and SoC based de-signs requiring various differ-

ential clock formats that arealso PCIe compliant.

The PCIe interconnect stan-dard has been widelyadopted and is also in FPGAand SoC devices, providingdesigners with versatile, highperformance solutions fortransferring data within sys-tems. Silicon Labs has appliedits mixed signal expertise todeliver a suite of flexibleclocking solutions that enablePCIe design across varyingmarket and application re-quirements.8 For full editorial

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ACTIve COMPOnenTS

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 27

8 NXP's proprietary resonator technology for MEMSbased timing devices features higher frequency stability,lower timing jitter and lower temperature drift compared toother CMOS oscillators. First product released for produc-tion enables a highly stable clock reference that is ideal forcommunications equipment using Gigabit Ethernet, USB,PCI-Express and S-ATA, plus CPU timing, memory and con-trol in consumer electronics devices. Its high level of systemintegration and very small form factor make it a compact,robust and highly cost-effective alternative to quartz crystalbased timing devices.

Tiny MeMS Frequency SynthesiserTalks Precision

Intersil ISL28407, ISL28417,and ISL28408 precision am-plifiers provide excellent dcaccuracy and noise per-formance. These quad am-plifiers are suit 12~24bitprocess control, instrumenta-tion and data acquisitionapplications.

The PR40 bipolar devicesmeet low noise requirementsfor high gain front ends in in-dustrial control designs whilereducing total power con-sumption for high signalcount applications.

ISL28407 operates over4.5~40V with an ultra-lowbias current drift of0.3pA/°C over –40~+85°C, which is said tobe 30% lower than compet-itive quad precision amps.Its low offset of 90µV maxi-mum and offset drift of

0.8µV/°C maximum, pro-vide high dc accuracy overtemperature. It delivers290µA maximum/channel),has a 1MHz bandwidth,low input bias current driftof 0.3pA/°C and low noiseof 13nV/√Hz at 1kHz.

ISL28417 is designed forsensor front ends, dacbuffering, precision voltageregulation or low noise in-strumentation applicationsthat need a diverse rangeof signals. It delivers veryhigh performance whileconsuming only530µA/channel maximum,with low frequency noise ofonly 250nV peak to peakand 8nV/√Hz at 1kHz. Off-set voltage is just 70µV max-imum, with an offset drift ofonly 0.75µV/°C maximum.8 For full editorial

Low noise Quad PrecisionAmplifiers Consume Less Power

www.electronicspecifier.com28 | february 2012 | electronicspecifierproduct

POWeR

UniPower DRC Series highvoltage dc power suppliesare designed to provide4~240kW across a widerange of applications. Theyfeature low ripple, fast tran-sient response and a stableoutput across a wide vari-ety of line voltages andload impedances. Toler-ance of repetitive arcing forboth process stability andpower supply protection isalso a key feature.

DRC is compact and mod-ular to provide power den-sities down to 5.8W/in³with advanced thermalmanagement for enhancedreliability. Individual unitsare designed for 19in rackmount with a height of just10.5in and a depth of 24in.

UniPower can provide air

and water cooled versions,and inputs can be187~528 Vac, single andthree phase, with outputs of500~450kV. All versionscan provide positive, nega-tive, reversible or floatingoutputs as options.

These PSUs provide pre-cise regulation of voltageand current with smooth au-tomatic crossover betweenconstant voltage and con-stant current modes as theload or command settingschange. For the high volt-age output section, UniPow-er has a variety of insulationmethods according to powrlevel and application. Theseinclude air insulation, rubberor epoxy encapsulation andoil filled tanks.8 For full editorial

Compact DC Power SupplyDelivers high voltage

Rohm BZ6A series of ultra-compact power supplymodules integrate an induc-tor, capacitors and all othernecessary PSU componentsinto a single package. Andit shapes up as the indus-try’s smallest at 2.3x2.9x1mm for high densitymounting applications.

Mobile devices, includingsmartphones are now multi-functional, increasing compo-nent count along with thenumber of power sourcesneeded within the circuit. Thegreater power requirements,along with the trend towardsincreased miniaturization, de-mand smaller, more efficient

power supplies.BZ6A series integrates a

BU9000X series 6MHz highspeed switching power sup-ply LSI directly into the boardand includes all necessarycomponents in a single pack-age. High performance is en-sured in the small form factor.

The all in one configurationeliminates the need for exter-nal components, simplifyingdesign time. 8 For full editorial

Single PackagePSu Modules AreIndustry’s Smallest

Extending the power capac-ity of standalone threephase UPSs, PowerWAVE6000 from UninterruptiblePower Supplies is designedto deliver the optimal bal-ance between energy effi-ciency, availability andpower performance. It isavailable in 400 and500kVA power ratings, par-allelable up to 5MVA.

Compared to equivalentUPS systems of a similar ca-pacity, PowerWAVE 6000

dramatically reduces overallfootprint with a power densityup to 363kW/m2 and con-suming less energy. It gener-ates lower CO2 emissions andprovides significant overallcost savings.

Existing PowerWAVE6000 models already boastone of the lowest environ-mental impacts and smallestphysical footprints on themarket. The new additions,available from April, are setto make a significant impactwithin the large data centreand facilities sectors.8 For full editorial

uPS Ratedup To 5MvA

Powersolve’s GMB Seriesrechargeable lithium polymerbatteries are ideal for handheld computer or PDA deviceapplications, as well as formobile communication equip-ment such as cellular phonesor radios and hand held barcode readers.

GMB Series cells provide3.7V at ratings of 120~10,000mAh from a com-pact, low profile package.They can be supplied assingle cells in over 150standard sizes, with profilesof 2~10mm, or as pack-aged cells in shrink sleevingto increase output voltageor capacity.

According to PowersolveMD Peter Clark, custom ver-sions can be manufactured

in various shapes and di-mensions to suit specific ap-plications, but these maybe subject to minimumorder quantities and tool-ing charges.

All GMB Series cells orpackages feature PCM toprotect against over-charging,over-discharging and over-cur-rent. The cells are designedfor applications where a slowdischarge rate is requiredfrom the battery. Maximumdischarge rate is 1 x batterycapacity and operating tem-perature is –10~+45ºC dur-ing discharge and 0~+45ºCduring charging. Standardcharge times are around 8hwith fast charging achievablein only 2.8h.8 For full editorial

Rechargeable LithiumPolymer Cells Suit handhelds

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www.electronicspecifier.com30 | february 2012 | electronicspecifierproduct

POWeR

TI’s battery charger inte-grated circuit supports highercell capacity batteries and in-creasing battery charge cur-rents of tablets, e-readers andsmartphones. The highly inte-grated single cell Li-Ion bat-tery charger has dual inputswhich allow operation fromeither a USB port or higherpower input supply such asan ac adapter or wirelesspower input.

The two inputs are fully in-dependent from each otherand are easily configurableusing the I2C interface or

stand-alone interface. Inte-grated FETs support chargerates up to 2.5A, 10.5Wfrom the In input and 1.5Afrom USB input. The chargerhas dual source inputs, anac adapter and USB2.0/3.0 compatibility, pro-viding flexibility in designand applications.

A D+/D- auto adapter forUSB input eases system de-sign and reduce externalcomponents. The 20V inputwith 10.5V over voltage pro-tection supports low cost un-regulated adapters and poorUSB sources. The integratedpower path allows systemstart-up from deeply dis-charged or no battery poweroperating conditions. 8 For full editorial

Dual Input ChargerIs A First ForTablets, e-Readers& Smartphones

Powersolve THL-20WI seriesof dc/dc converters are de-signed to provide 20W from ametal package measuring just25.4x25.4mm with the indus-try standard pin-out. Height offthe board is just 10.2mm.

With an ultra-wide 4:1 inputrange of either 9~36 Vdc or18~75Vdc, the Traco Power

THL-20WI series features ad-justable outputs of 3.3~15V,operating over –40~+75ºC.

These dc/dc converters fea-ture short circuit protection,remote on/off, input/outputisolation specified to 1500Vdc and an input filter whichmeets EN 55022, class A.8 For full editorial

20W DC/DC Converters Deliverhighest Power Density

2.5kW models join the TDK-Lambda HFE series of 1Uhigh, single output ac/dc hotswap, front end power sup-plies. Power density is29W/in3, making it suitablefor 2.5kW bulk power andDPA applications.

All HFE2500 models fea-ture full current sharing capa-bilities and an internal ORingMOSFET for isolation to sup-port hot swap and redun-dancy applications such asthose found in servers, data-com, data storage, communi-cations, broadcast, military,medical, process control and

industrial automation.Operating from a universal

85~265Vac input, HFE2500is up to 93% efficient, minimis-ing heat dissipation andpower consumption. Up to±20% output voltage adjust-ment is possible, enabling thePSU to be customer set ac-cording to specific needs.

Output voltage is program-mable by resistance, externalvoltage or optional PMBuscompatible I²C communica-tion interface. Output currentis external voltage or optionalPM bus programmable. 8 For full editorial

8 ULT series isolated 30W dc/dc converters from Muratacome in miniature 1/32 brick, industry standard, distributedpower Open Standards Alliance, DOSA, compatible openframe packaging. They measure just 19.1x23.4x8.89mmand occupy significantly less board space than other 30Walternatives. Through-hole and surface mounting versionsare available.

30W Converter needs Little Space

hot Swap, Front endhot Swap, Front endPower Supplies ArePower Supplies Are1u Racking1u Racking

POWeR

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 31

Schaefer’s PRP-750 Serieshigh efficiency, pure sinewave inverters provide up to750VA of power in a chassismounting package. Versionsare available to EN60950and EN50155 standards.

Standard inputs of 12, 24,48, 72 and 110Vdc are in-verted to adjustable 120 or230Vac outputs that are regu-lated to 4% or better. Unitscan be configured for three

phase synchronised output.All models in the series fea-

ture overload protection, areup to 88% efficient and haveremote inhibit as part of thestandard design. A wide op-erating temperature of –25~+70°C allows for installa-tions in extreme conditionsand meets EN50155 Class 3.

Emissions to EN61000-6-4and EN60121-3-2 meet indus-trial and rail standards andminimise interference to othersensitive equipment.

The compact designs meas-ures 7.87x5.12x1.95in andin addition to chassis mount-ing, an optional DIN rail clipis available.8 For full editorial

Rugged Inverter SuitsCompact Rail & Industrial Apps

VEAM PowerLock Box, fromITT Interconnect Solutions, en-ables emergency power to bequickly and safely recon-nected to large facilities suchas supermarkets, defence in-stallations, factories, hospitalsand offices in the event of fail-ure of the mains supply.

With a single reconnectionpoint, the PowerLock Box pro-vides a simple and speedy so-lution, vital to protect valu-able frozen and chilledfoodstuffs in supermarketsand restore power to essen-tial equipment in hospitalsand offices. It provides a sin-

gle, easy to use connectionpoint for any emergency gen-erator and when fitted in anelectrical switch room or sub-station, allows cables from amobile generator to bequickly connected to thestore’s power system.

The PowerLock Box hasground, neutral and threephase connectors which arekeyway controlled and theycan only be mated in the cor-rect sequence.

Contacts are finger-pro-tected to prevent inadvertenttouching of live parts. 8 For full editorial

Solution Provides SpeedyConnection To emergency Power

PSA160 standard open framepower supplies from Phihongdeliver up to 160W for IT andmultimedia applications. The2x4 PSU is available in 12,24, 48 and 56Vdc outputsand is ideal for use in 1Uracks for a variety of network-ing applications.

“The PSA160 series is de-signed for devices that requiremore power in a small formfactor for applications likecable TV,” comments PhihongVP Keith Hopwood. “Thepower supplies’ low cost, high-power output and small foot-print allow OEMs to fit a lot ofpower in a limited space.”

PSA160 features over-volt-

age, over-current and shortcircuit protection, with cUL/ULand CE safety approvals. Inthe event of a voltage surgeor overload, the unit will auto-matically restart while the out-put can be shorted perma-nently without damage.Operating temperature rangeis –20~+70°C, load deratingat 45°C with forced air cool-ing enabled and at 40°Cwithout fan cooling.

To achieve full power at160W, the unit requires fancooling. Without the additionof 12.6cfm forced air, outputrating is reduced to a maxi-mum of 90W. The PSA160has high efficiencies between86~88% at 115Vac inputand at 88~90% with230Vac input.8 For full editorial

Open Frame 160WPower Supply IsLow Cost

XP Power’s fleXPower X15and XM15 series multiple out-put configurable ac/dcpower supplies suit highpower medical and IT/indus-trial applications. X15 com-plies with EN/UL 60950 forIT and industrial applications.And meeting demanding re-quirements of third editionmedical safety standards, andhaving low leakage, XM15suits applications in medicaldiagnostic appliances, CATscan and MRI equipment.

Capable of delivering1500W at low line input and2500W at high line >180Vacinput, these compact fancooled units have a power

density of up to 9.09W/in3.They measure 279.4x127x127mm. The mechanical chas-sis of the series provides 20slots for arranging two orthree slot output modules.

The modules, available withsingle or dual outputs, coverall the popular nominal out-put voltages over+3.3~+60Vdc in a variety ofoutput current ratings. Theability to parallel up outputsfor more power, or use mod-ules in series for non-standardoutput voltages offer designengineers thousands of differ-ent output combinations.8 For full editorial8 Datasheet Download

Configurable PowerSupplies Rated up To 2500W

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CABLeS & COnneCTIOn

Cost optimisation is beingfocussed more and moreon ensuring different mod-ules share as many identi-cal or similar componentsas possible. And this cre-ates the potential for sig-nificant for savingsthroughout, from purchas-ing to production.

Plug and socket connec-tors, for example, fre-quently require only slightmodification on dimen-sions without changingelectrical characteristics, tomake them suitable for differ-ent applications. At volumesover certain minimum orderlevels, Suyin can make appli-cation-specific modificationsquickly and inexpensively.

Series 200097MB four po-sition, right angled SMTspring contact battery con-nectors for example, realisedtwo project versions featuringdifferent heights of 6.55 and9.2mm. The housing wasadapted to match the spe-cific application.

For mating reliability, evenwhen the devices are sub-jected to vibration, the 2mm

pitch spring contacts are spe-cially designed. Spring travelis 1.6mm nominal and contactforce ≥165g/contact. Dielec-tric strength is specified at12V/2A/contact and thenumber of mating cycles is6500 minimum.

Both versions of the springcontact battery connector arefitted with three SMT soldertabs, two side and one at theback. And with additional po-sition locking insertion tabs onthe base of the connector, thesolder tabs ensure a reliableand rugged mechanical con-nection to the PCB.8 For full editorial

Cost-effective Modifiable Connections

Modular jacks with multi-portand single-port RJ45 connec-tors added to the FCI line-upare ideal for broadbandswitches, hubs, routers,servers and telecommunica-tion applications. The com-pany compared its selectivelygold plated RJ45 with tradi-tional versions with full goldplating and found no deterio-ration in connector durabilityor performance.

“Our entire RJ45 family is alow profile solution with dura-bility rated at 1000 cycles forthe multi-port version,” saysFCI Product Manager MeganTeng, “and 750 cycles for thesingle port version. This com-bined with a very attractiveprice demonstrates tangiblebenefits to our customers.”

These RJ45 connectorscome in 1x1 single port,1x2, 1x4, 1x6 and 1x8multi-port versions, we as2x1, 2x2, 2x3, 2x4, 2x6and 2x8 stacked multi-portversions, with shielding forLED selection. They feature asimple and flexible design tosupport cat3 wiring for16Mbps signal transmissionin networking and telecom-munication equipment.

The modular jacks incorpo-rate a shielded shell for EMIprotection and can withstandoperating temperatures over–40~+85ºC and come withplating options includingG/F, 15 and 30µm goldplating and also optionalLED colours. 8 For full editorial

Modular Jacks Come In Single& Multi-Port versions

Yokowo's two piece batteryconnector range now in-cludes a compact versionfeaturing two less bladesthan the original six bladeconcept. This four bladedmodel is designed for flexibil-ity in horizontal and verticalblade insertion, with the re-duced size also reducingpitch from 3mm to 2.5mm.

For constant connection, thereceptacle side uses dualbeam contact in both inser-tion directions. Two tabs onthe receptacle provide a se-cure grip around the bladeon insertion. Bi-axial torsionand floating functionality ab-sorb the battery gap, reduc-ing the risk of intermittentpower outages, even if thedevice is dropped.

This two piece battery con-nector is ideal for deviceswhere uninterrupted power iscritical including cellphones,mobile devices, GPS units,tablet PCs and any type ofhandheld portable operatedin harsh environments. Thefour blade version handles upto 2A/blade.

This compact, two piecebattery connector features a30mΩ maximum initial con-tact resistance and operatesover –40~+85ºC at 12Vac/dc. Operational durabilityis 2000 cycles.

The plug is 2.2x2.6x7mmand the receptacle3x2.5x8.8 mm. Each bladeconsists of four contacts witha 2.5mm pitch. 8 For full editorial

Compact Battery ConnectorFeatures Two Way Insertion

Optimising connectivity inminiaturising electronic prod-ucts, TE Connectivity’s 0.3mmfront flip lock flexible printedcircuit connectors boasts lowhalogen and features up to71 way connectors.

“With this extended positionsize range and the availabilityof a front flip lock actuator,”says TE’s Specialist Tyler Mad-den, “TE Connectivity offersmore flexibility to product de-signers, who now can breakthrough traditional technologi-cal restrictions. As TE continuesto expand our presence in theFPC connector market, we are

excited to announce the intro-duction of this expanded offer-ing to serve customers with ap-plications requiring connectorsoutside of standard range of10~50 positions.”

Choose between front fliplock or back flip lock actua-tors, satisfying various designspecifications for consumerelectronics, set-top boxes, mo-bile devices and more. Thefront flip lock offering is low-halogen, which is more envi-ronmentally friendly andmeets current requirements ofmany consumer products.8 For full editorial

Flip Lock FPC Connector heralds0.3mm Breakthrough

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CABLeS & COnneCTIOn

Spec Pak high power connec-tors from Anderson PowerProducts for environmentalapplications handle75~260A and come in anIP68 rated shell.

Spec Pak connectors areUL94 V-0 flammability and UL746C F1 weather-ability ratedand compatible with industrystandard PG threaded seal-ing glands. Sturdy aluminiumlatches are lock-out and tag-out capable.

Connector shells accept75~180A Powerpole con-tacts and up to eight auxiliarycontacts. Powerpole contact

housings are available in awide array of colours, provid-ing wire to housing colourcoding options and designflexibility.

The combination of hous-ings, power, ground and sig-nal contacts pose thousandsof design options for demand-ing applications. Wire sizesaccommodated range from24 to 3/0 AWG. The userconfigurable insert housingsprovide flexibility for the con-nector, with H02 arrange-ments holding up to twoPP180 contacts and eightauxiliaries, and H03 featuringup to three PP120 contactsand eight auxiliaries. 8 For full editorial8 Datasheet Download

Connector Powersup To Tough environments

ITW McMurdo's Micronector200 and 300 series high den-sity 2mm pitch connectors, areavailable from Lane Electron-ics for BS approved assemblyat its Horsham HQ where stan-dard and customer specificproduct can be supplied onshort lead times.

Both ranges meet UK andInternational standards foruse primarily in military andaerospace applications, fromfast jet to gun turret, wherehigh resistance to vibrationand extreme reliability arecritical. Other applications in-clude high end engineeringwhere constant exposure tovibration could be an issue

that has caused other two-part connectors to fail.

Micronector 200 is de-signed for board to board orcable to cable applicationsand can be assembled inseven sizes, single row from2~7 and 17 ways, and in 11sizes, double row 4~34ways. The connectors aresmall in footprint for in-creased packing density withhigh reliability circular con-tacts for increased resistanceto shock and vibration.

Micronector 300 three row,2mm pitch connectors can besupplied in 27, 51 and 78way sizes and in a variety offormats. Included are malestraight pc, 90º pc and crimpterminations, and femalestraight pc, flexi circuit andcrimp terminations as well asa male panel mount version.8 For full editorial

high Density TwoPart ConnectorsAssembled DownThe Lane

CCM03 and CCM04 Seriesrugged smart card connec-tors from C&K Componentshave a card detection switchbuilt in for machine to ma-chine applications. Theseharsh environment connectorsmeet IEC 512 certificationand are resistant to shock, vi-bration, humidity and ex-treme temperatures.

CCM03 and CCM04 areideal for asset tracking, auto-motive e-call and tracking,signage, metering, vendingmachine, security and remotemonitoring applications. De-pending on the type, the

CCM03 Series features in-sulated normally open carddetection or increased con-tact forces for maximum vi-bration resistance. Both se-ries are available withstandard gold plated con-tacts or with specific inlayalloy for increase wear andcorrosion resistance.

The smart card connectorsdeliver an advanced contactsystem that optimises electri-cal performance, flexibilityand reliability, while minimiz-ing the electrical contact resist-ance and overall cost. Theyfeature six or eight contactsand a mechanical life of10,000~50,000 cycles, de-pending on the type. 8 For full editorial

Tough ConnectorsIntegrate M2MCard Detection

The Everett Charles Technolo-gies Compliant ConnectorGroup provides flexible inter-connect solutions. Compliantconnectors boast durability inhigh cycle life applications,with pogo based solutionsmaintaining consistent electro-mechanical characteristics>1million cycles. When mat-ing planar tolerances pose achallenge or a longer reach isrequired, pogo based con-nectors, says the company,are the preferred solution.

The new Group uses arange of innovative compliant

technologies as well as con-ventional spring probe tech-nologies to build custom con-nectors and pogos tocustomer specifications. It sup-ports NPI and HVM applica-tions and machined bodiesvarious materials are used forsmall run custom applications.For higher volumes, mouldedbodies are used.

Connector packaging canbe optimised for downstreamprocesses using tape&reel,for example, and this highlyinteractive design phase frominception to volume presentsa simplified walk-through ap-proach said to benefits cus-tomer and end product.8 For full editorial

CompliantConnector GroupDeals In Flexibility

CABLeS & COnneCTIOn

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 35

Rugged, high reliabilityscrew coupling circular con-nectors from Weald Electron-ics and available from LaneElectronics, are designed toBS 9522 F0014.

The new IP67 rated LMGrange suits harsh environmentapplications where high resist-ance to vibration, liquidingress rugged constructionare high priorities.

The LMG range comeswith either an aluminiumalloy shell with a finethread coupling or brass

shell and coarse thread. Designed for ac or dc and

low frequency applications,these multi-contact circularconnectors have polychloro-prene inserts and 2~26 sol-der contacts in 19 contactarrangements.

Current capability is up to60A depending on size andthe connectors are availablein various finishes includingRoHS compliant and can besupplied with 360º EMCscreen termination. 8 For full editorial

IP67 Screw Coupling MakesRugged Connection

Micro-miniature coax andcable assemblies from GTKcan be used in diverse appli-cations including WLAN ra-dios and access points,handheld computers, PDAs,test equipment, wireless secu-rity, metering and GPS track-ing products.

These cable assembliescome as standard with MHF

II and MHF III connectors andcan be customised to includeother coax connectors suchas SMA and FME if required.When using the MHF III con-nector an extremely low mat-ing height of 1.5mm can beachieved.

The high performance as-semblies boast low insertionlosses and a wide operatingfrequency of dc~6GHz. Theyare inter-mateable with U.Fland W.Fl connectors.8 For full editorial

Micro Coax CablesAssemble For TheDiverse

TE Connectivity’s Forge powerdrawer connectors are for highcurrent, high voltage powersupplies and power distributionsystems. They are blind mate-able and scalably moulded sousers can specify connectorconfiguration according to de-

sign requirements.Rated at up to 1000Vac or

dc and robust in design, theseconnectors suit high efficiencypower conversion and high re-liability power systems inrugged environments. Targetapplications include power in-

verters, servers, switches androuters used in data centres, al-ternative energy power conver-sion, and military and aero-space products.

With the scalable mouldingcapability, Forge power draw-er connectors allow users tospecify the number of moduleson its housing as well as thesize and location of its con-

tacts. Housings can be dualrow, one to five column config-urations for a maximum of tenmodules and a current carry-ing capacity of over 1kA, de-pendent on configuration. Thiscustomisation enables TE toquickly deliver power connec-tors, shortening design timeand saving design space.8 For full editorial

Customisable Connector MouldedFor up To 1kv Applications

8 Molex’s SeaRay connector, for the large and growinghigh density, high performance mezzanine connector mar-ket, accommodate low profile applications not suitable forHD Mezz products

This board to board connector is designed for computer,networking, telecom, storage and general market applica-tions with high pin count devices or memory modules thatare mounted on mezzanine or module PCBs. SeaRayboasts superior electrical and mechanical features that arecost competitive. Its solder charge technology results in bet-ter process yields and a lower applied cost versus equiva-lent BGA connector products. Circuit sizes cover 160~500positions and mated stack heights are 7~13mm.

The SeaRay flexible jumper system is high performance,for board to board connector applications. It has been de-signed, developed and tested to support mixed digital andanalogue. Assemblies use multiple layers of flex cable toadd shielding between layers and ensure signal clarity forhigh speed connectivity. Most assemblies incorporate theplug connector to aid in blind mating and to protect the pinson the motherboard through the receptacle shroud.

The connector and flex jumper provide numerous bene-fits. Both can achieve data rates up to 10Gbps and allowcustomers to simplify PCB routing without sacrificing per-formance. Customers will avoid the expense of large, com-plex, multilayer boards and utilise space better within agiven card slot area.

Option cards may be added or upgraded to increaseflexibility in design, production and testing. And if the needis for customised pin-out, Molex can provide a fast solutionwith performance guaranteed. Jumpers are available in3~22mm and in all stack heights and pin counts in theSeaRay connector range.

SeaRay Connects OnReally Low Profiles

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TeST & MeASuReMenT

PoP component assembly orbare die assembly on CoBapplications, as well as theoptimisation of material con-sumption demands increasedknowledge of the actualplacement forces, says Es-semtec. So it developed acost-efficient placing forcemeasurement option for theFLX2011 series.

The system comprises achuck, where placement ismade and substrates such asPCBs can be easily insertedand fixed. The chuck enablesthe processing of substratesup to 200x200x3mm.

By a special software plug-in, placement force from0~5N, ±0.5N, can be prede-fined. Subsequently, spring

characteristic is calibrated foreach nozzle on the place-ment machine and the data isstored in its database.

The assistance of the trackmeasurement ensures that thenozzle is processed in the cor-rect force-path sequence forthe component assembly.

Force measurement beginsas soon as the nozzle touchesthe substrate’s surface.

After values are stored inthe log file, the single forcepath sequences of place-ment can then be analysedand broken down to indi-vidual placement headsand nozzles, allowing de-tailed analysis of the place-ment process.8 For full editorial

Force Measurement AidsDevice Placement

Keithley has upgraded the ca-pabilities of its ACS test envi-ronment to Version 4.4 foruse with a number of the com-pany's instrument and systemconfigurations in automateddevice characterisation andreliability analysis. It supportsenhanced reliability test withModel ACS-2600-RTM, aswell as expanded ultra-fastbias temperature instabilitytesting, high current testing ofpower components and newproject libraries designed forhigh voltage reliability,charge pumping, pulse-stressreliability, and stress migra-tion testing applications.

The latest revision alsoadds support for Windows 7which simplifies staying cur-rent with a facility’s PC/sys-tem OS requirements.

ACS V4.4 supports an up-dated optional reliability testmodule that simplifies creat-

ing and executing complexstress measure analyse test se-quences in device reliabilitytests, such as HCI, TDDB,NBTI, J-Ramp, and more.

This updated softwaremodule gives semiconductortest engineers doing devicereliability testing and analy-sis in R&D or production testenvironments the tools theyneed to test more produc-tively, whether they’re char-acterising single devices ormanaging high device counttest applications.

ACS helps users managecomplex system instrumenta-tion configurations, quicklydefine test parameters com-mon to large groups of de-vices or many sub-groups, ex-ecute tests with run-timeresults feedback, and beginanalyzing large datasets ofmeasurement results sooner.8 For full editorial

Software update expands Support forReliability/high Power Device Test

TOS5300 Hipot Flash and In-sulation Resistance testersfrom Telonic Instruments aremanufactured by Japanbased Kikusui. Three modelsin the range are designed foruse in withstanding voltageand insulation resistance test-ing to help ensure the safetyof electrical and electroniccomponents and equipment.

The testers incorporate aninnovative PWM amplifierthat achieves high stabilityand has an input voltage reg-ulation of.3%. Rise and falltime control of the test voltageis provided and a stable out-put is unaffected by mainsvoltage variations.

Test frequencies of 50 or60Hz can be selected andupper and lower current limits

set within 0.0~110mA ac and0.01~11mA dc. AC test volt-age is settable over 0.05~5kVand dc test voltages can bevaried over 0~6kV.

TOS5300 is for withstand-ing voltage ac testing up to5kV. TOS5301 has an acand dc withstanding voltagetest capability with ac up to5kV and dc up to 6kV.TOS5302 has 5kV ac with-standing voltage test capabil-ity plus an insulation test func-tion with test voltages from25V to 1000V.

All models operate from anyglobal ac inputs and frequen-cies, and are equipped with aUSB interface. Easy to use con-trols and a large LCD panelfeature on the front panel.8 For full editorial

hhiippoott && IInnssuullaatt iioonnRReessiissttaannccee

TTeesstteerrss

Uson’s Optima vT leak andflow tester is heralded as aone of a kind solution. It in-cludes one or two test chan-nels with four sensors each,totally customisable pneu-matics, multiple built-in auto-mated calculators, myriaddata handling and storageoptions and other featuresthat combine to make theOptima a best match testtechnology for the greatestnumber of leak and flowtest applications.

R&D for the multi-functionsingle or dual channel config-ured tester began in 2009and incorporated Uson’sknowledgebase of the wideranging requirements for leakdetection and flow testing inmedical, automotive, andother industrial parts testingusing adaptable two channel,eight sensor methods to de-liver test technology without apremium price tag.

“No matter what you want

to achieve in your test appli-cation,” says Uson TechnicalSpecialist Joe Pustka, “Usoncan do it and now the Op-tima vT will most often be theleak detector of choice. Youwant production speed on theorder of a million parts ayear including highly accu-rate and multiple tests? Wecan configure the Optima tobe that throughput king. Youwant a variety of tests done insequence such as a pressuredecay followed by a series offlow tests in different ranges?That is doable too. Add incustom pneumatic configura-tions allowing you to selectbest-match regulators, valvesand additional sensors plus awide range of built-in auto-mated calculators such asthose used for temperaturecompensation or total leak-age calculators that can elimi-nate needs for added test se-quences, and other built-inmath and you have OptimavT, which hands down is themost versatile leak detectordesign to ever be released.”8 For full editorial

Tester CoversLeak & FlowGamut

TeST & MeASuReMenT

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 37

PDM I/O is a new optionfrom Audio Precision for itsAPx500 series audio analy-sers. PDM, pulse densitymodulation, is a 1bit, highclock rate data stream usedwith digital MEMS micro-phones, and extensively insmartphone design. The op-tion enables APx500 seriesaudio analysers to connectdirectly to any device with aPDM input or output, en-abling comprehensiveaudio testing.

In addition to standardaudio measurements, thisPDM Interface providesvariable dc supply, vari-able sample rate and apower supply rejectionmeasurement to test the de-vice's full operating param-eters. Mono or stereoPDM can be selected foranalyser inputs and outputssimultaneously, and PDMcan be paired with anyother available I/O formatincluding analogue, AES,S/PDIF, Bluetooth, HDMIor serial digital.

For new digital MEMSdesigns, the APx PDM op-tion can generate modu-lated PDM bitstreams, send-ing them directly todecimation stages withoutfurther conversion or hard-ware. Smartphone andtablet manufacturers can in-terface designs directly withMEMS microphones andPDM decimation stages totune and verify perform-ance. A special acoustic re-sponse suite of measure-ments makes MEMStransducer testing fast,easy, and efficient, even innon-anechoic environments.

APx analysers are theideal platform for completesmartphone and tabletaudio development, combin-ing PDM with an integratedBluetooth testing solution,low noise analogue for test-ing headphone outputs, I2Sdigital serial for direct chip-level communication andHDMI for devices with HDvideo capabilities.8 For full editorial

Option enables PDM MeMS Testing

LEM’s ITZ transducers arefor galvanically isolated,ultra-accurate precision dc,ac and pulsed current meas-urement in industrial andlaboratory applications.

The high accuracy prod-uct range comprises a se-ries of transducers for nom-inal current measurementover 600A~24kA, provid-ing overall accuracies at25°C ambient of only afew ppm.

Achieving such accuracyat high current levels is chal-lenging, says the company,in measurement technology.LEM used closed loop Flux-gate to address the prob-lem, providing an initial off-set error <2ppm withlinearity in the range of

1~10ppm and an ex-tremely low thermal drift of0.1~0.6ppm/K.

ITZ transducers delivermeasurements as an outputcurrent or voltage. In addi-tion to these normal signaloutputs, they also provideoutputs indicating trans-ducer state.

Indications includewhether the transducer isoperational or not, if themeasured current is ex-tremely low or high or if thetransducer is in overloadcondition.

Each state is signalled vianormally open or closedcontacts and each of theseconditions is supported by adedicated LED.8 For full editorial

Transducers enable high AccuracyMeasurement up To 24kA

www.electronicspecifier.com38 | february 2012 | electronicspecifierproduct

COMMS, COMPuTInG & COnTROL

Now in production at Murataare its ultra-thin VSLBG2216Ewaterproof, piezo-electricspeakers. And at 0.9mm thickthey are reckoned to be theworld's thinnest IPX7 speaker.They are designed for con-sumer electronics applications.

This speaker, says the com-pany, is unlike other similardevices as it does not requireany additional waterproofmembrane to be applied inend-product manufacturing,saving time, costs and impact

on audio output quality. Using a piezo-electric ele-

ment without any magnet, en-sures that this speaker is freefrom the ingress of metallicparticles. Moreover, there isno electromagnetic noise thatcould affect other magneticsensors incorporated into theunit. Typical applications in-clude mobile phones, tabletcomputers, e-book readers,digital cameras and portablemusic players.8 For full editorial

It’s Go, Go, Go On Thin WaterproofPiezo-electric Speaker Production

Intersil’s high performance,cost efficient D2Audio DAE-3HT, 12 channel digitalsound processor and ampli-fier controller, provides pre-mium sound quality in theiraudio systems. It’s designedto bring high quality audioto price sensitive sound barsand Blu-ray home theatresystems and accepts up toeight digital inputs and sup-ports up to 12 PWM out-puts for driving Class-Dpower stages.

This cost-effective, 72 pinQFN packaged SoC pro-vides system interface flexi-bility with four I2S inputs,

one I2S output, S/PDIFinput/output, I2C port, andan SPI port.

It is also compatiblewith Audio Canvas III, In-tersil’s custom audio pathconfiguration design toolwhich includes supportfor D2Audio SoundSuiteaudio path enhancementsand virtualisations.

The 12 PWM outputseach provide overall excep-tional audio performancedriving both powered andline outputs.

DAE-3HT is available in72 pin QFN packaging.8 For full editorial

Processors Are WiredFor Great Sound

OPC-5xx7 panel PCs fromDSL are open frame designedto allow users to quickly andeasily integrate them intotheir own chassis, makingthem an ideal, cost-effectivesolution for a wide range ofapplications.

OPC-5xx7 is available withhigh performance 8, 12, 15 or19in LCD screens, with resistivetouchscreen options. The PCsare powered by fanless

1.6GHz Intel Atom CPUs withup to 2GB of RAM on a solidcapacitor motherboard. Dual10/100/1000Mbps LAN andfour USB 2.0 ports togetherwith three serial ports accom-modate a wide range of con-nectivity requirements.

Support is also provided forCompactFlash or SATA HDDand an 11~32Vdc inputrange gives adde flexibility.8 For full editorial

OM9141-10G is Kontron’s10G ATCA open modularplatform featuring advancedand faster bladed data trans-port, and switching and sys-tem management hardware.And the platform is a startingpoint for telecom equipmentmanufacturers to build on acommon platform a multitudeof new equipment configura-tions using CPU, NPU, DSP,storage and special third

party ATCA based line cardsthat meet the requirements for3G, 4G LTE, WiMax, GPON,IPTV and carrier cloud net-work elements.

Each OM9141-10G in-cludes redundant powerentry modules, cooling in-frastructure with hot swap-pable redundant fans, andsecond generation 10GbEswitching capabilities basedon Kontron’s AT8910 10GATCA switch.

Shelf management is built-in with redundancyand inter-operabilitytested shelf managercross connects accord-ing to the PICMGspecification. An op-tional Kontron COMExpress dual coremodule is also avail-able on the AT8910for centralised systemmanagement with astandards based HPIimplementation.

A telco alarm panelprovides telecomgrade external system

alarm notification.8 For full editorial

Open Modular Platformenhanced For 4G LTe

OOppeenn FFrraammee FFaannlleessss PPaanneell PPCCMMaakkee FFoorr eeaassyy DDeessiiggnn IInntteeggrraattiioonn

COMMS, COMPuTInG & COnTROL

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 39

PICMG 2.0 compliant cPCI-6210 series 6U CompactPCIprocessor host and peripheralblades from AdLink Technol-ogy are based on Intel Corei7 and i5 processors, with upto 16GB of DDR3-1600 mem-ory support. This performancecomputing solution has en-hanced management featuresincluding PICMG 2.9 compli-ant IPMI, Intel vPro based re-mote management and an op-tional Trusted Platform Modulefor security management. It issuitable for applications in mili-tary, communication and in-dustrial control.

cPCI-6210 boasts outstand-ing processing and graphicsperformance for applicationsrequiring reliable, scalableCompactPCI products. Dualindependent display function-ality is provided via dualmode DisplayPort and DVI-Igraphics interfaces.

The DisplayPort interfacesupports single link DVI orHDMI with a passive adaptercable and analogue VGAoutput via an active adaptercable. When coupled withAdLink’s XMC-G460 graphicsmodule installed in the XMC

site or a cPCI-R6700 reartransition module, cPCI-6210supports up to four independ-ent displays.

The cPCI-6210 series is thecompany’s first CompactPCIproduct to support hardwarebased remote managementusing vPro technology.AdLink Director Eric Kaosays, “To address the needsof our customers who haverequested remote manage-ment capabilities to save oncosts and improve efficiencyof both operation and mainte-nance, AdLink’s cPCI-6210Series implements remotemanagement functionalitythat allows administrators totroubleshoot, query, upgradeand protect the device via anetwork connection.”8 For full editorial

Intel Chips PowerCompactPCI Blade

Saelig Epic, Electric PotentialIntegrated Circuit, electricfield sensors measure electricfield changes without requir-ing physical or resistive con-tact including electro-physio-logical signals or spatialelectric fields.

The sensor is said to simplifythe way medicalECG/EKG/EEG/EOG, move-ment sensing, proximity non-touch switching, or even ges-ture recognition signals aretaken in medical and sportsinstruments, toys, electric ap-pliances, smart lighting, gam-ing, and security.

The electrode surface of thedetector is coated with a pas-sivated thin dielectric for di-

rect application to a test sur-face, such as skin, without theneed for electrically conduc-tive gel. It can be used as adry contact ECG sensor with-out the need for potentiallydangerous low impedancecircuits across the heart.

By detecting changes in theelectric field, the sensor alsodrives a relay to act as a sim-ple non-touch electric switch.The sensor can be employedin a proximity mode or to de-tect specific kinds of move-ment as a gesture recognitiondevice. As the sensor doesnot need line of sight, it caneven detect movementthrough solid walls, and canalso be used to replace, or asan adjunct to, PIR sensors in avariety of applications includ-ing security motion detectors. 8 For full editorial

Potential SensorGestures For nonContact eCG

Two new firewalls join theHirschmann Eagle20 rangefrom Belden, with more portsso users can deploy single de-vices instead of having to use

multiple Eagle20s.Eagle20-0400 and 30-

0402 herald technologicalinnovation as they are saidto be the first firewalls in aconvection cooled DIN Rail

housing, supporting six LANports. Two of these are Gi-gabit ports.

“To help achieve maxi-mum availability, these two

new Eagle firewalls.”Says Belden ProductManager Mark Cook-sley, “offer unprece-dented flexibility of de-ployment, as well asstate of the art securityfunctionality. This en-ables operators to ben-efit from a protectionregime which fits pre-cisely to their individualrequirements.”

Because Belden hasfocused on the needs ofindustrial networks, thesenew firewalls bring keybenefits over current op-tions including multipleand Gigabit ports, WANconnections, content in-spection and certifica-tions for PT&D and oiland gas markets.

These firewalls aresaid to feature a greater tem-perature range, have moreflexible deployment possibili-ties and provide wider volt-age ranges.8 For full editorial

Multi-Port Firewalls First up DInRail Convection Cooled

8 First up in Farnell’s New Product Solutions for Engineers!video series showcases some of the latest and greatestproducts and technologies. Included here are devices fromTI, Sensirion, Linear Technology, Freescale and Honeywell,as well as National Semiconductor’s Sensor AFE system16bit ADC evaluation board.

Solutions for engineers

www.electronicspecifier.com40 | february 2012 | electronicspecifierproduct

PASSIve COMPOnenTS

Murata’s GJM02 seriesMLCCs are specifically de-signed for high frequencymodule applications such ascoupling power amplifiers incellular phone handsets.

Reckoned to be theworld's first 01005 size EIA,Hi Q MLCC, this miniaturecapacitor measures up atjust 0.4 x0.2mm and hasboth high 'Q' and low ESRcharacteristics.

Having a high Q valueand low ESR is essential foruse in VHF, UHF and mi-crowave power amplifier.Together they contribute to

improving power amplifierefficiency and loweringpower consumption.

GJM02 comes in the newW4PI tape packaging andusing a 4mm wide em-bossed plastic tape with1mm component pitch, re-moves the problems associ-ated with conventionalpaper tape that can depositpaper dust.

Product pick-up errors,caused by static and alsocomponent ESD damageare further said to be min-imised with the device.8 For full editorial

MLCC Is A World FirstAnd It’s Tiny Too

DMTL can help designers in-corporate new generationcrystal devices from AVX.CX3225xx small, low profilesurface mounting devices,available in two and four ter-minal versions, suit automo-tive safety, engine manage-ment and communicationssystems applications, as wellas other consumer productsthat rely on electronics forcontrol. All devices in the se-ries are available as AEC-Q200 qualified components.

“These new crystal oscilla-tors represent a major step for-

ward in both size reductionand performance improve-ment,” says DTML DirectorPete Jones. “We have becomeused to AVX raising the bar inpassives and these new sur-face mount devices are yet an-other great example of thecompany’s technology leader-ship in passives development.”

Three models comprise therange, all capable of operat-ing up to 54MHz. The 3.2x2.5mm devices are low profilewhen mounted. Frequencyrange is 9.8~54MHz. Fre-quency deviation of ±30 ppmat 25ºC or ±150ppm over –40~+125ºC, maintaining con-ductivity after 3000 cycles. 8 For full editorial

new GenerationCrystal OscillatorsKeep A Low Profile

CCHD-957 ultra-low phasenoise HCMOS clock oscilla-tors from Crystek, come withstandby mode and feature anextremely low close-in phasenoise of -100dBc/Hz at 10Hzoffset. Typical noise floor is–170dBc/Hz at 100kHz offset.

This performance, says thecompany, suits its HCMOSclock oscillator family to ap-plications such as DACs,ADCs, DAB and professionalCD audio equipment.

CCHD-957 also features a

standby function and when indisable mode, the internal os-cillator is completely shutdown and its output buffer isplaced in Tri-State.

This oscillator family is9x14mm SMT packaged, op-erating from a +3.3V supplyand consuming 15mA. Stabil-ity is rated at 20~50ppm over0~+70°C and ±25~50ppmover –40~+85°C. The devicegenerates 10MHz~50MHzfrequencies and its outputdriver is capable of driving±24mA: a rise/fall time of~3ns maximum at 20~80%Vcc with a 15pF load.8 For full editorial

Clock Oscillatorhas The vibesFor hD

RFMD's RFSA3013 andRFSA3023 fully monolithicanalogue voltage controlledattenuators boast exceptionallinearity over a 30dB mini-

mum gain control range.These VCAs also feature inter-nal temperature compensa-tion that provides an attenua-tion profile highly insensitiveto temperature changes.

Each VCA is controlled bya single positive control volt-age with on-chip dc condi-tioning circuitry. The slopeof the control voltage versusgain is selectable. The VCAshave been characterised for75Ω CATV applicationsover the full attenuation andfrequency ranges with noexternal matching compo-nents required. The compo-nents come in compact3x3mm QFNs.8 For full editorial

vCA Boast exceptional Linearity

TS 4533-RA from knitter-switch is a small, tactile,pushbutton switch that com-pletes its popular TS/TSS4500 series line-up.

Unlike other models inthe series, this new designhas a horizontal stemmaking it ideal for a vari-ety of applications that de-mand a very small andvery robust momentary ac-tion pushbutton.

With a total height offthe board of just 5.2mm,the through-hole mountingswitch features a choiceof actuation forces of100, 160 or 260gf and

an operating lifetime of50,000 cycles.

With a hard polyamidestem, TS 4533-RA is suit-able as a reset switch foroperation by pen, screw-driver or probe.

Typical applications in-clude satellite navigationsystems, PDAs, communica-tions equipment such asmodems and routers, enter-tainment and games con-soles, television set-topboxes, medical products,home appliances and indus-trial control and instrumen-tation equipment.8 For full editorial

Switched On Tactile Switch

PASSIve COMPOnenTS

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 41

C Series heatsinks fromOhmite combine excellentthermal performance with acomponent attachment mech-anism that saves time andmoney when it comes to anupgrade or replacement.

The heatsinks are availablein a wide range of sizes andin standard 25, 50, and75mm lengths for TO-220and TO-247 devices and 30,

58, and 85mm lengths forTO-264 packages, Theheatsink will attach compo-nents in groups of 1, 2 or 3and convenient ‘camming’clips eliminate the need formounting holes and screws.The clip devices are resilient,and provide the same amountof force after repeated use.

C series comes in de-greased and black anodisedfinishes. Custom lengths andclip quantities can be suppliedto order.8 For full editorial

heatsinks SnapInto Action

Linear Technology’s LTC4366over-voltage protection con-troller operates from9~>500V. The floating surgestopper utilises an adjustablefloating topology to enablevery high voltage operationindependent of the voltagerating of the LTC4366's inter-nal circuitry.

Two internal shunt regula-tors coupled with the externalvoltage dropping resistorsgenerate the LTC4366’s inter-nal supply rails. The maxi-mum operating voltage is setby the breakdown of the ex-ternal resistors and MOS-FETS. The LTC4366 is the firstproduct of its kind to protect,for example, a 12V circuitfrom a 500V transient withoutthe need for additional pro-tection components.

LTC4366 monitors voltage

at its output and reacts quicklyto input supply over-voltageby controlling the gate of ann-channel MOSFET. The de-vice regulates the output to auser defined voltage duringan overvoltage transient al-lowing the load to remain op-erational while the over-volt-age is dropped across aMOSFET. An adjustable faulttimer ensures safe shutdown ifthe fault persists.

LTC4366 is ideal for harshindustrial, automotive andavionic applications wheresystems must continue operat-ing reliably through severeovervoltage events. High volt-age applications include pro-tecting from motor transients,coupled overvoltage, incor-rect input supplies or powersupply failures.8 For full editorial

Floating Surge Stopper Providesunlimited Overvoltage Protection

MP500 microswitches fromCyntech Components exhibitjust 10% of the hysteresis anda third of the dead zone pass-ing of comparable V4 mi-croswitches. These improve-ments, it says, enable greaterprecision in pressure and tem-perature switch operation inprocess applications.

SPDT changeover mi-croswitches have a commonterminal that switches be-tween two others: normallyclosed and normally open.The distance between thecommon terminal disconnect-ing from normally closed andthe connection being made tonormally open is the ‘deadzone passing’ distance. ForMP500, the differential move-ment is 1µm, compared totypically 10µm movements ina normal switch.

Hysteresis, or differentialmovement, refers to the differ-ence in operating point be-tween when the switchplunger is depressed andwhen it’s released. In manyswitches this can be 0.15mmor more. In the MP500, it’sreduced to 0.05mm.

These improvements inswitching precision are partic-ularly useful when MP500 mi-croswitches are used to buildpressure and temperatureswitches. In these applica-tions, they enable more accu-rate process control.

MP500 comes in V4, DIN41 635 B-form, housingssealed to IP67. Options in-clude PCB terminals, solderterminals or a flying lead,and users can specify silver orgold over silver contacts.8 For full editorial

Microswitch Dead ZonePassing Distance Is Just 1µm

PWR power pushbuttonswitches from C&K Compo-nents feature redundant dou-ble break contacts. The de-sign is IP65 sealed andprovide excellent tactile feelwith quiet detent.

The surface mounting,tape&reel or tube packagedswitch allows single step pro-cessing of SMD boards.The momentary, SPST

switches feature an extendedoperating life of 100,000mechanical cycles.

“The rugged PWR pushbut-ton switches are designed fordemanding, power applica-tions,” says C&K BusinessDevelopment ManagerOwen Camden. “Thesehighly reliable switches arevibration resistant, makingthem ideal for challengingautomotive, industrial andwhite goods environments.”

PWR is ideal for selectwhite good and appliance

main power, industrialpanel, automotive,and computer and pe-ripheral power switchapplications. It accom-modates a range of20~250Vac,10mA~2A and has amaximum contact re-sistance of 100mΩ,handling inrush loadsup to 7A. Nominal op-erating force is 7Nand operating travelis 1mm. Operatingtemperature range is–40~+85ºC. 8 For full editorial

Pushbutton needsno SecondaryProcessing

LTE is becoming the de factostandard for next generationmobile data services, saysSierra Wireless. With fastdata rates, low latency, andgood coverage, LTE can de-liver an excellent user experi-ence and a range of busi-ness and technology benefitsfor network operators, de-vice manufacturers andother stakeholders.

One of the most significanttrends now unfolding in thewireless industry is the growthin LTE services using the1800MHz frequency band, orBand 3. Well positioned be-

tween low and high band-width parts of the spectrum,Band 3 provides an attractivecombination of capacity andcoverage. And, since1800MHz is already widelyused by operators for 2GGSM services, it also providesa cost-effective solution forboosting mobile broadbandcapacity. It allows operators torefarm spectrum they alreadyown for LTE, instead of or inaddition to licensing new spec-trum. See the Sierra Wirelesswhite paper for the full story.8 For full editorial8 Download White Paper

LTe1800 Is versatile ForConnected Devices & Applications

www.electronicspecifier.com42 | february 2012 | electronicspecifierproduct

WIReLeSS & PORTABLeS

Broadcom boasts theworld's most complete androbust Wi-Fi Display soft-ware stack that allows usersof smartphones, tablets andlaptops to play games,video and thousands ofapps on a larger HDTVscreen by transmitting themobile screen images overa wireless connection.

With the increased avail-ability of faster mobile net-works, end users are usingmore bandwidth-intensiveapplications and consumingsignificantly more high defi-nition video on their mobiledevices. Wi-Fi Display cou-ples Wi-Fi and H.264 videoencoding technology toallow the consumer toseamlessly move the mobileuser interface from a smallscreen to a bigger displaywhile maintaining controlvia the touch screen. Sinceconsumers demand real-time interaction with games,movies and apps, only thebest implementations of Wi-Fi that are tightly integratedwith high quality videocodecs will result in a soliduser experience.

Broadcom's Wi-Fi solu-

tions for mobile and STB/TVhave been engineered tominimise packet loss andmitigate interference whilemaximizing screen resolu-tion and picture quality. Inaddition, as 5GHz Wi-Fibased on the 802.11acstandard enables wirelessnetwork bandwidth over1Gb/s, Wi-Fi Display willbe able to seamlesslystream ultra-HD contentsuch as new 2K and 4K res-olution digital media.

The Wi-Fi Display specifi-cation driven by the Wi-Fi Al-liance is based on matureH.264 and 802.11 stan-dards. Broadcom is fully sup-porting and contributing tothe Wi-Fi Alliance process toachieve full interoperabilityamong suppliers of sourcedevices that send an en-coded video signal and sinkdevices that can receive theencoded video signal.Broadcom is working withmultiple third party partnersas well as tightly integratingthe technology into its ownSTB and mobile SoCs to en-sure the highest quality end-to-end user experience. 8 For full editorial

Software Delivers Mobile DeviceContent To Larger hDTv Screens

8 CES 2012 provided the stage for NXP to showcase itsmulti-standard and multi-tuner digital radio demonstration ofHD radio, DAB, DAB+, T-DMB and DRM, with its solutionsbased on software defined radio technology.

Software Defined Radio Solutions

Alpha Micro’s GainSpanGS1500M is a high perform-ance 802.11b/g/n Wi-Fimodule with enabling supportfor peer to peer networking.It’s designed for embeddeddevices that require next gen-eration Wi-Fi connectivitysuch as security cameras,home appliances and indus-trial control systems.

This module makes it easyto add Wi-Fi connectivity tostandard 8~32bit micro-controllers and is aimed atplug-and-play integrationof Wi-Fi into embeddedplatforms using SPI orUART interfaces.

The module enables newInternet of Things, IoT, appli-cations, building onGainSpan’s existing ultra-lowpower embedded Wi-Fi port-folio. The feature rich module

enables new opportunitiesfor IoT applications where802.11b/g/n connectivity isa key requirement.

“For typical IoT applica-tions, customers look to opti-mise cost of deployment,range and power consump-tion, and in these cases802.11b is ideal,” explainsAlpha Micro Marketing Direc-tor Maxine Hewitt. “This is es-pecially true in the case ofGainSpan’s GS1011M mod-ule, where 802.11b has beenoptimised for IoT applications,while maintaining interoper-ability with existing accesspoints. Some of our cus-tomers, however, are lookingat IoT applications that re-quire higher radio networkthroughput, and this is wherethe GS1500M is required.” 8 For full editorial

next Generation Wi-Fi moduleAdds Connectivity For embedded

WIReLeSS & PORTABLeS

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 43

A new Mako 6500 net-work appliance incorpo-rates a 3G mobile dataconnection to keep businessflowing during ADSL or Eth-ernet network outages, Italso provides connectivityin areas not served by fixedline networks.

The new 6500 features afailover option so that in theevent of fixed-line networkoutages, the appliance auto-matically switches to a wire-less 3G connection. Whenthe primary connection be-comes available again, it willfall back to its original con-nection method. Since Makospecialises in connecting andsecuring payment networks,continuous connectivity is crit-ical for its customers.

“The flexibility offered byour 3G devices enablesbusinesses to stay in busi-ness, despite any local net-work conditions they’refacing,” says Mako R&DDirector Murray.“Whether operating bywired or wireless, ADSL orEthernet, the Mako 6500keeps connections estab-

lished and secure.”Mako 6500 3G units con-

tinuously check the health oftheir wireless connection toensure a mobile network isavailable and on standby incase it is needed. If a mobilenetwork is unavailable, theMako System automaticallyissues an email alert to in-form network administratorsthat the failover networkneeds attention. Users canset 3G as the primary con-nection where ADSL or Eth-ernet is unavailable, such asremote sites, locationswhere local ADSL cabinetsare over capacity, or newbuilds waiting for fixed-lineconnectivity to be delivered,often a problem faced inshopping malls.

The 6500 is designed forcompatibility with all GSM3G networks. Settings in thecentral management systemallow administrators to setthresholds and limits on theamount of 3G data use per-mitted on each 6500 device.Users must supply a SIMcard for each 6500 3G unit.8 For full editorial

network ApplianceAdds 3G Connectivity

Commercial grade versionsof Connect One’s NanoWiReach and Nano SocketiWiFi modules are slashed incost by 25%.

Unlike the original mod-ules that were designed forharsher conditions and ex-tended temperature opera-tion over –20~75ºC, thesemodules are said to deliverwireless connectivity environ-ments to in-building or cli-mate-controlled areas in anarrower temperature rangeof –10~65ºC.

Applications targeting moremoderate conditions canchoose the commercial-gradeNano WiReach and Nano

Socket iWiFi for designs be-cause they are 100% compat-ible in form, fit and function tothe original, extended-temper-ature versions.

Based on Connect One’siChipSec CO2144 IP con-troller chip, Nano WiReachand Nano Socket iWiFi in-clude a full suite of InternetProtocols and applications,enabling fully featured se-cure connectivity.

Tailored for seamless inte-gration, the modules provideimmediate connectivity with-out WiFi driver developmentor porting, supporting severalmodes of operation.8 For full editorial

Commercial-Grade embeddedWiFi Suits Climate Controlled Apps

First up in the Pentek highperformance Onyx family isthe new Model 71760, afour channel, 200MHz A/DXMC module that is basedon the Xilinx Virtex-7FPGAs. Onyx modules usethe same modular I/O in-terfaces as the Virtex-6FPGA Cobalt family, boost-ing memory, logic andI/O performance.

Onyx 71760 is similar tothe Cobalt 71660, says Pen-tek, but has twice the mem-ory capacity and I/O band-width, addressing the mostchallenging unmanned aer-ial vehicle, radar and com-

munication applications.“Onyx is a strategic exten-

sion of our successful Cobaltline,” comments Pentek VPRodger Hosking. “Withhigher speed A/Ds andD/As, and tougher DSP al-gorithms, we needed morehorsepower to keep pace.Pentek leveraged the modu-lar architecture of the Cobaltfamily, along with the latestXilinx FPGA technology, toprovide customers abroader range of price andperformance options anda future path for the mostdemanding signal process-ing applications.”

Pentek will release at leasttwelve additional Onyx fam-ily modules this year.

“Pentek is among thefirst customers to leveragethe high performance, lowpower Virtex-7 FPGA fam-ily,” adds Xilinx DirectorBrent Przybus. “As withall our 28nm 7 SeriesFPGA families, our goal isto deliver a scalable, uni-fied FPGA offering withoptimized features to in-crease the performanceand flexibility customersneed at the lowest possiblepower consumption.”8 For full editorial

Module Builds On Xilinx ForDemanding Applications

8 Broadcom’s Prashant Mantha puts Steve McIntyre on thespot on how Broadcom chips enable a variety of Bluetoothbased remote devices and others, including gestures andvoice activated search that do not require a remote.

Remotely Speaking...

Two PLL synthesisers fromAnalog Devices boast utmostflexibility and phase noiseperformance. ADF4151 andADF4196 PLL ease design ina variety of applications in-cluding communications infra-structure base stations, pulseand Doppler radar applica-tions, test and instrumentationequipment, microwave pointto point systems, PMR, VSATand aerospace systems.

With an RF bandwidth of3.5GHz, ADF4151 allows theimplementation of a frac-tional-n or integer-n PLL syn-thesiser. It consists of a lownoise digital phase frequencydetector, precision chargepump and a programmablereference divider. It is pin andsoftware compatible with

ADI’s ADF4350 4.4 GHzPLL. When used together,ADF4151 facilitates the use ofan external VCO and im-proves phase noise withoutsignificant board revisions.

ADF4196 is an ultra-fast set-tling 6GHz fractional-n PLLthat has been specifically de-signed to meet the GSM/Edge lock time requirementsfor communications infrastruc-ture and pulse Doppler radarapplications. In conjunctionwith an external loop filterand VCO, it can achieve locktimes <5µs. It consists of a lownoise, digital phase frequencydetector and a precision dif-ferential charge pump. 8 For full editorial8 Datasheet 1 Download8 Datasheet 2 Download

PLL Synthesisers Deliver Flexibility& Phase noise Performance

www.electronicspecifier.com44 | february 2012 | electronicspecifierproduct

WIReLeSS & PORTABLeS

Toshiba wireless LSI is compli-ant with the TransferJet stan-dard for close proximity wire-less transfer technology.Using its wireless communica-tion technology, the newproduct achieves receivingsensitivity of -78dBm, said tobe the best performance inthe industry, surpassingTransferJet specification1. The high sensitivity con-tributes to stable communica-tion between TransferJetcompliant digital devices.

Toshiba's RF-CMOS LSI en-abled the incorporation ofthe RF circuit and RF switchfor TransferJet in the wirelessLSI. The 65nm processed LSIlowers the number of exter-nal RF circuits and peripheralcomponents, and uses the in-dustry's smallest package toreduce overall chip size.

The product is ideal for in-creasingly compact and light-weight digital products, suchas smartphones, tablet PCs,notebook PCs, and digitalcameras.TransferJet is a close proxim-ity wireless transfer technol-ogy standard promoted bythe TransferJet Consortiumwhose membership consists of53 companies includingToshiba. It provides highspeed data transfer with lowpower consumption simply byselecting on the screen of amobile device the data file tobe transferred and touchingthe receiving device with themobile device . Applicationsof TransferJet could expandto digital signage when com-bined with near field commu-nications technology.8 For full editorial

LSI Meets Transferjet CloseProximity Wireless Transfer

First IEEE 802.11ac solutionenabling integration in smart-phone application processorsand mobile combo chips,comes from Redpine Signals.By developing the latest Wi-Fi technology, the companyhelps drive the market formobile devices with evenfaster data rates with lowpower consumption.

Redpine’s Quali-Fi802.11ac ultra-low power so-lution addresses the emergingmarkets for wire speed datatransfers over wireless, en-abling high utilisation of theincreasingly crowded license-free spectrum. The standardfocuses on 5GHz with itswide array of available chan-nels. It also increases datarates through a combinationof wider channel bandwidth,up from 40MHz in 11n to80MHz and 160MHz, morecomplex 256 QAM modula-tions and MIMO streams.

“Our Quali-Fi technologyleverages proven low power

innovations spanning over tenyears and provides an opti-mal solution for integrationinto smart phone applicationprocessors and mobilecombo chips,” explains Red-pine CEO Venkat Mattela.

Redpine’s Quali-Fi licens-able product includes exten-sive hooks for supporting co-existence among the host ofother wireless technologiesavailable in smartphones,tablets and other mobile prod-ucts, with innovations support-ing high wireless performanceon WLAN as well as on otherwireless interfaces. And withlegacy 802.11abgn support, italso provides the simultaneousdual-band operation thatRedpine pioneered in itsMaxi-Fi BEAM450 productfor efficient operation in futureRF environments. Other per-formance enhancing featuresinclude advanced beamforming, multi-user MIMOand LDPC.8 For full editorial

ultra-Low Power 802.11ac SolutionIs First For Smartphone Processors

SiGe:C low noise amplifiersfrom NXP Semiconductorsare designed to improve thelinearity, noise figure and re-ception of GPS signals, includ-ing GloNass and Galileo,while providing the smallestfootprint in the market. As theindustry's first GPS LNAs todynamically suppress strongcellular, Bluetooth andWLAN transmit signals, theNXP BGU700x family offersthe best reception for weakGPS signals, delivering an im-provement of 10 dB or betterIP3 under –40 ~–20dBmjamming conditions, while thenoise figure remains below1dB. Requiring only two ex-ternal components, theBGU700x LNAs save up to50% in PCB size and 10% incomponent cost.

GPS has become a stan-dard feature in a wide rangeof consumer products, frompersonal navigation devicesto digital video cameras,watches, electric cars, andmore. GPS signal power lev-els are weak and below the

noise floor at –155dBm. Inmany of these products, espe-cially smart phones, strongtransmitters such as Bluetooth,WLAN and cellular can drivethe GPS LNA into compres-sion. When the GPS LNA is incompression, it has lower gainwhich causes poor GPS re-ception; it also generates inter-modulation products and har-monics from the transmittersignals, capable of overpow-ering weak signals and lead-ing to loss of GPS reception.8 For full editorial

GPS LnAs Dynamically SuppressStrong Transmission Signals

WIReLeSS & PORTABLeS

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 45

APG BT W400 is a wirelessaccess point gateway fromLaird Technologies, said to beideal for M2M wireless com-munications and for connect-ing Bluetooth enabled devicesin a personal area networkto an IP network via Ethernetor WLAN.

Based on Laird’s Bluetoothplatform, this gateway pro-vides four class 1 BT modules,Ethernet and WLAN communi-cation as a standard package.It’s built on embedded Linux

and supports application de-velopment and customisationusing Lua scripting and op-tional support for Python andJava. The gateway deliversversatile functionality to addapplications, offers flexibleconfiguration via web or con-sole, and provides multipleconnectivity options using USB,RS232 and RJ45 ports.

“The APG W400 features amulti-radio modular architec-ture,” says Laird Poduct Man-ager Sachin Andhare, “andbuilds on Laird Technologies’family of frequency hoppingspread spectrum radios.”8 For full editorial

Wireless GatewayMakes BluetoothConnection

RFMD's RF3928B, 65V,380W, high power discreteamplifier is designed for S-Band pulsed radar, air trafficcontrol and surveillance, andgeneral purpose broadbandamplifier applications.

RF3928B is a matchedGaN transistor in a hermetic,flanged ceramic package.The package provides ther-mal stability through the useof advanced heat sink andpower dissipation and is eas-ily integrated through the in-corporation of simple, opti-mised matching networksexternal to the package.These provide wideband gainand power performance in a

single amplifier.8 For full editorial

Gan Wideband PulsedPower Amplifier...

RDA5990 from RDA Micro-electronics is a combinationchipset that integrates Wi-Fi,Bluetooth and FM functional-ity on a single die. This highperformance product pro-vides significant advantagesto the global smartphonemarket by offering higher in-tegration, improved powerconsumption, minimizedboard space and lower cost.The Company has begunsampling the product withChina handset manufacturersfor initial field testing.

The RDA5990 integrates a

complete IEEE 802.11 b/gsystem with Bluetooth 2.1 +EDR and an FM radio re-ceiver and transmitter. Com-bining several proven wirelesstechnologies on a single sili-con die allows the compo-nents to work simultaneouslyand independently, while con-suming less power and im-proving battery life. RDA's su-perior integration design uses55nm CMOS process in acompact 6x6 mm 48 pinQFN package, minimisingboard space and reducingcustomer cost. Manufacturerscan quickly integrate theRDA5990 on platforms to en-able rapid time to market.8 For full editorial

Wi-Fi Combo ChipIntegrates Wi-Fi,Bluetooth & FM

BroadOne LTE Femtocellfrom Fujitsu, is a compact in-door base station for theeasy construction of highbandwidth, high quality in-door wireless communica-tions environments. It de-ploys interference control toreduce signal interferencebetween outdoor macrocellbase stations and the femto-cell, thus enabling highquality communications.

By simply connecting thedevice to a broadband con-nection, it can be used im-mediately, without havingto perform initial configura-tion, for the connection ofup to eight handsets.

In addition, because itallows for seamless switch-ing between LTE and Wi-Fi,the new device deliversimproved user convenienceand an enhanced userexperience.

The popularity of smart-phones and tablet deviceshas led to a sharp increasein the volume of data sentand received among users.So, mobile communicationsproviders faced the need to

augment wireless communi-cations bandwidth.

To increase wireless com-munications capacity,providers will have to takenecessary steps such as im-proving the efficiency ofwireless bandwidth throughthe deployment of LTE serv-ices, expanding the fre-quencies available to themby switching to wirelesswideband, and offloadingwireless traffic through Wi-Fi. Additionally, they willneed to take a small zoneapproach that reduces thegeographic range coveredby a single base station toallow for higher capacityand higher-quality mobilebandwidth.

Furthermore, in the caseof high speed data commu-nications, as user satisfac-tion is contingent on thequality of the user experi-ence, it is often necessaryto construct high speedcommunications environ-ments for indoor environ-ments that experienceheavy traffic loads.8 For full editorial

LTe Femtocell Makes For easyIndoor Wireless Communications

TI’s SimpleLink is heraldedas the industry's widest port-folio of easy to use wirelessconnectivity technologies forlow power, low cost embed-ded applications. The rangeincludes self-contained wire-less processors, enablingeasy integration with anyembedded system.

Cornerstone of the range isSimpleLink Wi-Fi CC3000, aneasy to implement Wi-Fi solu-tion that will lead the chargein expanding the world’s In-ternet of Things. The Sim-pleLink Wi-Fi CC3000 is aself-contained 802.11 network

processor, making it ideal forsimple and quick addition ofInternet connectivity to anyembedded application.

“The number of devicesshipping with Wi-Fi inside isforecast to expand to 2.6 bil-lion annually by 2016, as theInternet of Things becomesmore prolific,” states IMS Re-search Analyst Filomena Be-rardi. “TI’s CC3000 will takeadvantage of the mature Wi-Fi infrastructure, providing op-timal integration necessary tohelp drive this Wi-Fi expan-sion. TI is well positioned tobring Wi-Fi to low power em-bedded devices, and turn tra-ditional products into con-nected, interactive services.”8 For full editorial

Connectivity Solutions hasIoT in Sight

Driving next generation ofmainstream LED lighting up-take, Cree’s XLamp XB-D isthe first LED based on thecompany’s new tech-nology platform. It issaid to usher in anew era ofprice/perfor-mance forlighting classLEDs and can sim-plify designs, ultimatelyremoving up-front system cost,a key barrier to widespreadLED implementation.

XB-D LED delivers twice thelumens/$ of other LEDs, saysCree, from the industry’ssmallest lighting class footprintof 2.5x2.5mm, that’s 48%smaller than the XLamp XP,

making it ideal for high lumendensity and compact lightsource applications.

Cree says the innovation be-hind this development enablessignificantly lower prices forLED lighting products by usingup to three times fewer LEDs,

three times fewer opticsand substantially

smaller circuitboards than cur-rent designs.

Mike Watson,Cree Senior Direc-

tor, says “With thisnew platform Cree has

fundamentally redefined theprice/performance paradigmfor our components customers.It’s not enough to just makeLEDs brighter, it’s also aboutimproving product paybackand market acceptance ofLED lighting.”8 For full editorial

LeD Doubles Lm/$To Speed LeDAdoption

Four LDU series PCB mount-ing dc input constant currentLED drivers join the XP Powerportfolio, delivering outputs of5, 7, 14 and 20W. Thesehighly efficient LED drivershave a typical efficiency of93% for 5~14W models and95% for 20W devices.

LDU20 provides up to700mA output and theLDU05, 07 and 14 series out-puts 1A maximum. The driv-ers can accommodate a widerange of inputs of 7~30Vdcwhich needs to be at least 2Vhigher than the output.

Dimming options includevoltage or resistance ana-logue and PWM input. ThePWM approach has a maxi-

mum operating frequency of1kHz, with a minimum 200nson/off time. When using ananalogue dimming, the outputcurrent range can be ad-justed over 25~100% ofnominal current.

A remote on/off controlinput provides the designer theability to control the output orsequence the start-up. All mod-els provide protection in theevent of a short or open circuitof the LED device.

The LDU series suits abroad range of indoor, out-door, underwater and auto-motive LED lighting applica-tions, ,as well as batterypowered applications.8 For full editorial

Miniature Board MountedLeD Driver Range extended

www.electronicspecifier.com46 | february 2012 | electronicspecifierproduct

OPTO & DISPLAyS

New signal conditioning ICsfrom Vishay suit IR remotecontrol discrete photodiodesignal processing. VSOP383..and VSOP584 come in small,2x2x0.76mm QFNs and arecapable of continuous datatransmission processing froma wide supply voltage rangeand low supply current.

Vishay’s standard IR re-mote control receivers includethe photodiode and signalconditioning IC in a singlepackage. By separating thesignal processing circuit from

the photodiode and QFNpackaging it, VSOP383 andVSOP584 devices delivergreater flexibility for a num-ber of applications.

The devices can, for exam-ple, be used in systems whereultra-wide spatial reception isrequired through multiplephotodiodes aimed in differ-ent directions.

They will also be usedwhere unique photodiodepackages are required orwhere alternative wave-lengths need to be received,such as blue light in under-water applications or visiblelight communication.8 For full editorial

Conditioning ICsProcess DiscreteIR Remote Control

GlacialLight’s new LED FloodLight Series uses Philips GL-FL12, GL-FL30 and GL-FL120Lumiled LED Chips. They pro-vide a direct indoor and out-door replacement solution foroutdated mercury lamps withthe Lumileds efficiently con-verting electricity into light.The Flood Light Series pro-duces over 30,000h of natu-ral-looking light and whenused for 8h/day they can lastfor over a decade, loweringmaintenance costs.

The series promises shining,high quality, cool white lightwhile using less energy than

traditional lighting: GL-FL12consumes 13W, GL-FL3027W and GL-FL120 110W,equivalent to 50, 75, and300W mercury lamps respec-tively. Colour temperature ofthe series is 6000K, with acolour rendering index of atleast 70, making people andobjects look more natural inthe gentler LED light with noperceivable flickering.

With the environment inmind GlacialLight says itdesigned the Flood Light Se-ries with no hazardouschemicals such as mercuryor harmful radiation emis-sions such as UV or IR. Thusthey are more eco-friendlythan traditional lighting.8 For full editorial

Flood Light LeDsAre Based OnLumiled Chips

8 Eric Siegel, TI’s Product Marketing Engineer previews thecompany’s 2012 CES wares.

In Touch With TI At CeS

OPTO & DISPLAyS

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 47

Sharp’s 10W LED arraysare based on technical ad-

vances it has made in LEDproduction, improving effi-ciency by up to 47%. Thesesecond generation arrayshave four distinguishing fea-tures: they are compact,lightweight, economical and

significantly brighter.Measuring 15x12x1.6mm

and retaining the aluminiumceramic plate carrier design,make it possible to easily at-tach modules to a suitableheat sink to achieve efficientheat dissipation.

Depending on the module,these devices provide lightoutput up to 900lm, luminousefficacy up to 106lm/W instandard operation, high CRIvalues of 82 and a long serv-ice life of 40,000h at up to90°C operation.

The new generation is speci-fied for use with a forwardvoltage of 17.7V and a for-ward current of 480mA.However, they can also oper-ate at up to 800mA, achiev-ing up to 1300lm. In naturalwhite, warm white and purewhite versions, colour temper-ature of the arrays is 3000~to 5000K. 8 For full editorial

Compact 10W LeDArrays AreBrighter

OPA779 Series display light-ing for indoor illuminationfrom TT electronics Optoelec-tronics delivers all of the ben-efits of LEDs, says the com-pany, namely energyefficiency, longer life andlight quality. This tube assem-bly makes it easy for manu-facturers to switch from fluo-rescent to energy efficientLED based systems.

Emitting uniform and consis-tent white light within itslength, OPA799 provides ex-ceptional lighting for retail, ar-chitectural, under-counter, re-frigeration, mobile foodservice and PoS applications.

“OPA779 was designed

through collaboration withour customers to produce asolid state lamp,” says TT Di-rector Roland Chapa, “thatnot only provided the bene-fits of energy efficiency butalso met their needs for alow profile solution with ex-cellent light quality. “We sup-ported those requirements byleveraging our expertise inoptics, thermal managementand electrical design. In ad-dition, Optek has a proventrack record with multi-chro-matic tuning to generate aconsistent and uniform whitelight that is critical for aes-thetic applications.” 8 For full editorial

TB62D701 and the TB62771are LED drivers from Toshiba.TB62D701 is a high power,eight channel device andTB62771 four channel. Bothare for use in applicationssuch as LCD TVs and monitorbacklights, area lighting, sig-nage and traffic signals.

These drivers are producedusing Toshiba’s mixed signal,sub-micron silicon process, in-tegrating single chips that cantake on much of the function-ality typically handled byother components in an appli-cation. Both LED drivers fea-ture integrated dc/dc boostcontrollers and multiplepower MOSFETs for channelcurrent regulations.

TB62D701 has eight MOS-FETs, each capable of driving

up to 150mA and up to 58V,while TB62771 has fourMOSFETs, driving up to200mA each and up to 45V.The integration of these MOS-FETs on chip enables reducescomponent counts, resultingin a smaller designs andlower material costs.

Both LED drivers can re-spond to pulse signals downto 500ns, equivalent to 1% ofa 20kHz PWM signal. Suchhigh resolution dimming capa-bility allows LCD TV applica-tions to achieve a super con-trast ratio for HD video andultra-low power consumptionat low brightness levels.

Each channel of the TB62D701 can be individually pro-grammed to any requiredlevel with its eight independentPWM inputs, making it invalu-able for local dimming andchannels phase shift control.8 For full editorial

highly IntegratedLeD Drivers SlashComponent Count

Two compact LED series fromAvago Technologies reducespace requirements for auto-focus auxiliary flash function-ality in digital cameras.ASMT-FJ70 and ASMT-FG70come in one of the thinnest,smallest footprint LED pack-ages with the brightnessneeded for auto-focus func-tionality in dark settings.

ASMT-Fx70 devices meas-ure 3.6x3.2x3.4mm and aresurface mounting. They havea clear, non-diffused lens forhigh luminosity within a nar-row radiation pattern, provid-ing smooth, consistent opticalperformance for precisionauto-focussing.

ASMT-FJ70 is an AlInGaPdevice that features a 12O

viewing angle, while ASMT-FG70 is InGaN, delivering14O viewing angle. Both havehigh luminous efficiency, pro-ducing high light output over awide range of drive currents.

Narrow viewing angles de-liver long distance illuminationand the narrow beam pattern

required for auto-focussingauxiliary flash. The ASMT-FJ70 is orange and theASMT-FG70 the first greenauxiliary flash LEDs in thissize range.

“Digital cameras continue toshrink in size while growing infunctionality and capacity,”says Avago Director FrancisKhor. “Our new auxiliary flashLEDs address this challenge byallowing designers to pack ingreater functionality/in2 of thecamera. The ASMT-Fx70 LEDsprovide the best of bothworlds, as they offer a smalldesign footprint without sacri-ficing auto-flash performance.”8 For full editorial

Auto-Focus Auxiliary FlashLeDs have Small Footprint

efficient LeD Displayefficient LeD DisplayLighting Improves Lighting Improves Light QualityLight Quality

www.electronicspecifier.com48 | february 2012 | electronicspecifierproduct

OPTO & DISPLAyS

Supertex CL220 high volt-age, temperature compen-sated, constant current, LEDdriver ICs are designed todrive a string of LEDs at aconstant 20mA. Multiple ICscan be used in parallel to pro-vide higher output currents inincrements of 20mA for a va-riety of solid state applica-

tions including signage, auto-motive, industrial indicatorsand accent lighting.

The device operates from5~220V supplies and istrimmed for a constant outputcurrent of 20mA, ±10%, at5~160V input. It can be usedas a two terminal, constantcurrent source or constant cur-rent sink. CL220’s tempera-ture compensated outputmaintains consistent LEDbrightness regardless of tem-perature fluctuations, says thecompany. The IC also with-stands transients without theneed for any additional tran-sient protection circuitry whenused as recommended.

CL220 is available in D-PAK TO-220 and CL220N5-G and CL220K4-G TO-252packaging.8 For full editorial8 Datasheet Download

Linear LeD DriverProvides highvoltage Solution

Oclaro laser diodes are de-signed into the first 15kW di-rect diode fibre coupled lasersystems. Featuring the highestpower levels, broadest wave-length range and leadingbrightness, Oclaro laserdiodes scale from 910nm to1070nm at high power levelsand high brightness to meetdemanding performance re-quirements of these next gen-eration 15kW systems.

15kW and other multi-kilo-watt systems are ideal for ap-plications such as metal weld-ing, cladding and cutting thatcontinually require higherpower to improve the per-formance of the laser systemand process efficiency. Due totheir output power, brightnessand colours, the Oclaro laserdiodes have become a keytechnology that is driving thedevelopment of these nextgeneration laser systems.

Because the power of thesesystems scales linearly withthe number of wavelengthsavailable for multiplexing,Oclaro's ability to providelasers with wavelengths from910nm up to 1070nm with

high power levels and excel-lent brightness is the technol-ogy that is allowing customersfor the first time, to designcommercial fibre coupledmulti-kilowatt direct diodelaser systems that can meetand exceed 15kW.

Says Oclaro VP BerndMeyer, “Our customers arealways looking for ways toexpand their business intonew markets and applicationsthat require more power andbrightness, and the 15kWlaser systems being enabledby our laser diodes are key totheir success.”

One of the first Oclaro cus-tomers designing next genera-tion 15kW laser systems isLaserline who plumped forOclaro direct diode solutionsbecause for power, bright-ness and reliability reasoningto bring its 15kW direct diodesystems to market. In addi-tion, Oclaro was able to pro-vide Laserline with its in-housedesign and manufacturing ex-pertise along with the capa-bility to scale to volumequickly and cost effectively.8 For full editorial

Laser Diodes Light The WayTo 15kW Direct Laser Systems

Mitsubishi Electric’s 8.4inAA084VJ01 and 10.4inAA104VJ02 VGA colour TFTLCDs are for industrial andrugged outdoor applications.These new modules featurehigh brightness, a high con-trast ratio and a wide viewingangle, as well as operatingover –30~+80°C and –20~+70°C respectively.

The modules boast long lifeLED backlit performance andare equipped with a circuitboard embedded LED driverfor compact system design. At

25°C, the LED backlightshave an operating life of>100,000h.

TFT-LCD modules usingLVDS interfacing have be-come widely spread recentlybecause they can be run athigh speed and low noise. Byimplementing Mitsubishi’scross-compatible LVDS con-cept, design costs at customerside are reduced becausethey do not have to changethe interface depending onthe resolution of the display. 8 For full editorial

Colour TFT Modules Take OnRugged Outdoor Applications

Boasting an up to 70%more efficient genera-tion of itsPrevaled LEDlight enginerange,Osram’snewPrevaledCore EcoZ2 lineachievesup to108lm/W.

These newCoB individualLEDs are said to ensurea particularly homogenouslight. Core Eco Z2 can re-place high pressure dis-

charge lamps of up to 70W,energy saving lamps with upto 2x42W and halogenlamps, each with up to100W consumption.

The range covers800~5000lm and

emits no harm-ful UV or in-frared, thussensitiveproductssuch ascosmeticsor food-stuffs can

also be illu-minated, says

the company.The low heat is

given off at the back ofthe module via standardisedthermal interfaces.8 For full editorial

Light engines Areup To 70% Moreefficient

OPTO & DISPLAyS

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 49

Latest Hitachi Display Prod-ucts Rugged+ TFT displaymodule is the 7in TX18D35VM0AAB, designed andmanufactured to function inchallenging and harsh envi-ronmental conditions. This IPSTFT screen provides excep-tional colour saturation,colour stability, contrast andblack levels with a 170° widevertical and horizontal view-ing angle.

The 15:9 wide aspect ratiodisplays WVGA 800x600pixels resolution and incorpo-rates LED backlighting for abrightness of 800cd/m² and

half brightness life of70,000h. Contrast ratio is600:1, ensuring display im-ages are clear, concise andeasily viewed.

“Reliable and consistentoperation under extremetemperature, mechanicalshock and vibration are anecessity in many harsh envi-ronments,” says HitachiProduct Marketing ManagerMark Stephenson.

The ruggedised TFT featuresan industry standard 40 pin,6bit RGB, CMOS interfacewhich enables a colourpalette of up to 262,000colours. It measures165x104x12.8mm and oper-ates over –30~+80°C.8 For full editorial

Rugged TFT Display Delivershigh Reliability Too

DisplayLink’s SuperSpeedUSB 3.0 DL-3000 Series dis-play controller chips, avail-able from Display Solution,enable the development ofnew generation USB moni-tors and universal dockingstations. They can resolve in-dustrial application issueswith the integration of USB2.0 and 3.0, HDMI, DVI,VGA, DAC, and Gigabit Eth-

ernet. These controller ICs enable

high performance, high reso-lution, compact and afford-able PC peripherals andalso support up to two fullHD displays. DisplayLink DL-3000 with its improved DL 3adaptive compression tech-nology benefits from the5Gbps transfer speeds ofUSB 3.0, allowing for up to10 times faster virtual graph-ics performance.8 For full editorial8 Datasheet Download

LCD ControllerChip SuperspeedsWith uSB 3.0

Maxim’s Max44000 digitalambient light and infraredproximity sensor detects lightjust like a human eye. TheBiCMOS device integratesthree optical sensors, twoADCs, and digital functional-ity into a tiny 2x2x0.6mmpackage, saving board spacewhile delivering optical fusionand unparalleled light sensingperformance.

Max44000 consumes just5µA when the ambient sen-sor is enabled and only7µA when proximity andambient light sensors areactivated, significantly ex-tending battery life. The de-vice is ideal for touchscreenapplications, including smart-phones, portable devices, in-dustrial sensors, and pres-ence detection.

When making a call on asmartphone, the touch screenmust be shut off to prevent in-advertent touches that may

disrupt the call. Proximitysensing is crucial and once asensed signal is received, it isrun through a dc ambient, in-frared rejection front endcircuit and sent to an ADC.This allows Max44000 tooperate in the presence ofhigh dc IR radiation.

Single pulsing the externalIR LED renders the sensor im-mune to fixed frequency ex-ternal IR radiation, saysMaxim, leading to more reli-able sensor operation.8 For full editorial8 Datasheet Download

Maxim eyes Proximity SensingTo Deliver Optical Fusion

TE Connectivity’s NICHIACoB-L solderless LED socketseries is Type NL2 for quickLED termination. It providesa reliable mechanical andelectrical connection for anLED to a heat sink and en-hances TE's portfolio of sol-derless LED sockets.

Connecting LEDs withoutmanually soldering hasmany benefits, says TE. It’stime consuming and pains-taking, as LEDs are difficult tosolder, with spatter poten-tially damaging the emittingarea of the LED. Solder ter-minations are also awkwardto desolder and over timecan become a weak pointthat can reduce connectionreliability. Heat during solder-ing can also transfer to theLED and shorten its life.

In contrast, the solderless

socket enables connectionuniformity with a strong yetremovable connection andno need for heat applica-tion. The one piece connec-tor assembly features TE’spoke-in wire termination forAWG 18~22 solid, AWG18~20 pre-bonded andAWG 18 stranded wires.

Termination to the CoB-LLED is simplified with locat-ing features that position theLED into the socket duringthe assembly process.

This mechanically protectsthe ceramic LED edges andintegrated polarisation en-ables a secure and lastingconnection for solid, strand-ed or fused wire. Installationis therefore fast and easy,with minimal manual work-ing, reducing time and cost.8 For full editorial

Solderless LeD Socket ProvidesFast nichia CoB LeD Termination

www.electronicspecifier.com50 | february 2012 | electronicspecifierproduct

DISTRIBuTIOn FOCuS

New SL Power embeddedpower supplies from Acal BFiboast 90% efficiency and oneof the smallest heat footprintsin ac to dc conversion.

Eight models comprise theCINT1200 family with outputsof 12~48V and up to 200Wfrom a wide input range of90~264Vac. The space-sav-ing PSU modules measure7.6x12.7x3.3cm and easily fitinto a 1U chassis.

Designed to meet the strin-

gent EMC requirements for in-dustrial and information tech-nology equipment applica-tions, these modules are Halttested for durability and threeyear warranteed. They areCE marked and ITE ap-proved, making them suitablefor worldwide applications.

“These modules are de-signed to help engineers re-duce overall size and heatdissipation of end products aswell as increase reliability inharsh or high reliability appli-cations,” says Acal BFi Presi-dent Philippe Gruson.8 For full editorial

Modules Deliver200W AC to DCembedded Power

Mark Pinkney is the new toDivisional Marketing Man-ager at Anglia Lighting,where he will lead the busi-ness into its next phase ofgrowth. The company distrib-utes Cree and, specialises inenergy efficient LED lightingfor commercial and domesticbuildings, including hotels,retail premises, restaurantsand vehicles.

Pinkney sees significant op-portunities to grow AngliaLighting in a sector that hasbeen relatively unaffected bythe downturn. “Anglia Light-ing will double its turnover thisyear,” he comments, “and Iexpect to see it double againnext. LED lighting is extremelyattractive, as it saves cost andcarbon emissions, but is alsoquite complex. Anglia Light-ing offers customers a wall tolight solution backed by anexceptional level of expert

support. Working with us, cus-tomers can implement a light-ing system that maximiseslight out, minimises energy inand provides the longest pos-sible life from the LED itself.”

According to Steve Rawlins,Anglia’s CEO, “MarkPinkney has demonstratedoutstanding business develop-ment skills during his elevenyears with Anglia, and alsohas a background in the light-ing industry. He is the idealperson to take this successfuland strategic Anglia businessforward to a new level.”8 For full editorial

Anglia Appoints...

Arm Cortex-M3 based micro-controllers from Energy Microand available from Solid StateSupplies include the EFM32Gecko range which has beenexpanded to include 100 newlow power devices. Memoryconfigurations up to 1MB areavailable, package choice hasbeen expanded and there areconnectivity, display drivingand energy saving options.Some devices also have three

on-chip op amps to reduce ex-ternal component count.

New package options in-clude QFN64, QFP100,BGA112, QFP64 and 7 x 7mmsmall form factor BGA120.Connectivity now includes a fullspeed USB 2.0 port on Leop-ard and Giant devices, with anintegral 3.3V regulator to facili-tate powering the microcon-troller over USB. Communica-tions interfaces include EnergyMicro’s Low Energy UART,which consumes just 150nA at9600 baud.8 For full editorial

energy FriendlyMicrocontrollersIn Legion...

Premier Farnell is to distributeArm development tools, soft-ware, evaluation boards anddebug hardware across theAmericas through its Newarkelement14 brand.

With the addition of Armproducts, Premier Farnellstrengthens its position as asource of engineering knowl-edge and solutions.

“We are pleased to build onour excellent relationship withPremier Farnell to make Armsystem design solutions avail-able to Premier Farnell’s de-sign engineering community inthe Americas,” comments ArmDirector Mark Onions. “Pre-mier Farnell’s innovative ap-proach of combining thepower of community and de-signer engagement with ecom-merce adds great value to thewider Arm ecosystem.”8 For full editorial

Arm StrengthensIn Americas WithPremier Farnell

Taiwanese LED and relatedlighting products maker King-bright, has recognised AvnetAbacus for delivering out-standing sales growth in2010/2011 as its largest pan-European distributor. Avnetcarries extensive stocks ofthe LED company’s wideproduct range.

“Avnet Abacus has soldKingbright products for manyyears into the Industrial elec-tronics market,” says Avnet

Abacus VP Alan Jermyn.“This award recognises notonly our success but the suit-ability of Kingbright’s innova-tive portfolio of discrete LEDs,super-bright LEDs, displayssensors, clusters and lightpipes. Kingbright’s productportfolio complements ourcommodity passive compo-nent ranges.”

Udo Reinhold, KingbrightEurope MD adds, “AvnetAbacus has the technical ex-pertise to help designers max-imise the benefits that our LEDtechnology offers.”8 For full editorial

Avnet AbacusShining LightFor Kingbright

DISTRIBuTIOn FOCuS

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 51

SFH 4258S/4259S PowerTopled with lens from OsramOpto Semiconductors has an80% higher optical outputthan the standard version ofthe infrared LED, despite thesame surface area and thesame current. This boostcomes from a special thin filmchip which, through Nanos-tack technology, has two p-njunctions that are grown oneon top of the other. The result-ant increased range will

above all benefit applicationsin the security sector and ingesture recognition. The newPower Topled is now avail-able at distributor Rutronik.

Apart from the Nanostackchip and the associated higheroutput the new infrared PowerTopled is the same as the stan-dard version and can there-fore be used as a simple directreplacement. Package dimen-sions remain the same so exist-ing designs can continue to beused. Because of the series cir-cuit the voltage is higher byabout a factor of two. 8 For full editorial

Power TopledDelivers 80%higher Output

Northern Connectors is Hart-ing’s Specialist Distributor ofthe Year for 2011.

Commenting on the award,Harting’s Jane Bacon says,“Northern Connectors havehad another excellent year indeveloping their HARTINGbusiness in the UK. Their com-

mitment to offering customersthe highest level of serviceand technical support hasbeen a key factor in their suc-cess. Northern Connectors’continued efforts at the de-sign-in stage have increasedtheir customer base for Hart-ing and stand them in goodstead for continued growthgoing forward.”8 For full editorial

SpecialistConnections...

Mouser is stocking Beagle-Board’s BeagleBone Commu-nity Development Board. Thishighly sought-after board de-livers the bare bones with thegreatest access to interfacesignals for sensors and con-trols, while eliminating theneed for additional equip-ment with a single cable de-velopment environment. In-tended to work stand aloneor in conjunction with existingBeagleBoard and Beagle-Board-xM, the board is tar-

geted at application develop-ers enabling easy access toindustry standard I/O’s.

BeagleBone features the TIAM3359 processor, a700MHz ARM Cortex-A8,256-MB RAM, and a USB2.0 port with the ability tosupply power. BeagleBoneand BeagleBoard-xM areideal for such applications as3D printers and industrial ro-botics, web servers and Inter-net enabled kiosks, in-vehicleentertainment, and homemedia centres.8 For full editorial

Dog & Bone...

Hameg test and measure-ment equipment and acces-sories from Rapid Electronicsnow includes two and fourchannel digital, analogueand mixedsignal oscillo-scopes, benchtop multime-ters, spectrumanalysers,function gen-erators, PSUsand a full range of acces-sories. Hameg products aredesigned specifically for themid-market, budget con-scious user in the educa-tional, industrial and homeenvironment.

Hameg digital oscillo-

scopes provide the full rangeof features and testing poten-tial – bandwidth up to200MHz, 2MPts memorydepth, serial bus trigger andhardware accelerated de-code, component testing andauto measurement. The ex-

tensive features, flexibil-ity and highconnectivitymake thesewhisper quietoscilloscopesideal toolsfor training,

laboratory,development and service.The HM8112-3 bench topdigital multimeter offers highperformance, feature richmeasurement of volts, ohmsand amps as well as fre-quency and period.8 For full editorial

Rapid Putshameg To ItsTesting Range

TTI has added two MurataLQH series of wire woundpower inductors to its portfo-lio. The devices feature a lowprofile, improved current satu-ration and low dc resistance.

Both parts incorporate fullshielding to reduce magneticflux leakage for low dc resist-ance and high inductance.These power inductors areideal for power circuitry in

audio-visual equipment andmany other applications.

The LQH44P_J0 and LQH44P_P0 typically measure4x4mm and have a maximumprofile of 1.2 or 1.8mm respec-tively. The LQH44P_J0 comesin inductance values of 1.0 to47μH and the 1.0μH part israted at 2.0A with a low dc re-sistance of 0.048Ω. LQH44P_P0 comes in inductance val-ues of 1~22μH and the 1.0μHpart is rated at 2.95A, with alow dc resistance of 0.03Ω. 8 For full editorial

Wirewound PowerInductors Keep ALow Profile

Targeted at 10/100 Ethernetapplications, Microchip’sPic32 Multimedia Develop-ers Kit from element14, thefirst collaborative globalelectronics community fromPremier Farnell. It providescomprehensive design soft-ware support for rapid eval-uation and engineering de-velopment projects.

Optimised for multimediaapplications such as audio,graphics and touch screen de-velopment, the kit features aPic32 Ethernet Starter Kit and

Multimedia Expansion Board,providing a powerful devel-opment tool with extra func-tionality via a PicTail socketgiving access to additionalI/O. A free to download ver-sion of Microchip’s MPLABPIC32 C compiler providescode development support.

“The combination of thePic32 Ethernet Starter Kit andMultimedia Expansion Boardprovide a low risk yet power-ful platform for engineers ofall grades to rapidly evaluatethe potential of Microchip’sPIC32 MCUs,” says MikeMcGlade Channel Managerfor Microchip.8 For full editorial

Kit Acceleratesethernet ProjectDevelopment

www.electronicspecifier.com52 | february 2012 | electronicspecifierproduct

More explaining On LeDsThis Luxon LEDs Explained video addresses developmentsand questions on LEDs and LED solutions.

Driving Set-Top Box Signals See how Broadcom enables MoCA 2.0 integrated set-topboxes to push low latency, high throughput content acrossdozens of streams for home viewing on multiple devices.

Flexible LeD Lighting Strips

LeD Lighting news

Tracking, Configuring &Authenticating With Gen2

See how NXP uses RFID and I2C serial interfacing to config-ure consumer electronics devices.

Simplifying eMC Shielding & More

TeCh vIDeOS

EZ-BoardWare SMT PCB hardware from Harwin that allowssimplified EMC shielding, improves cable management andsolves tricky PCB layout issues. Optek LED lighting strips demos in this latest Geek moment.

Learn about LED standards and regulations in this edition ofLED Lighting News from Osram.

www.electronicspecifier.com electronicspecifierproduct | february 2012 | 53

LeD Driver BasicsDigi-Key previews Atmel's LED driver basics.

easy Peasy DesignDesignSpark PCB version 3 is heralded as the world mostpowerful, free and easy to use PCB design tool.

RAZR Sharp...

RF Power Fixture Kit Assembly

Lemons & LeDsRahm, Vayd & Sagar put the power of lemons to work on LEDs.

Looking Behind The Trophy...

TeCh vIDeOS

TI tested Motorola’s RAZR, communicating via Bluetoothlow energy with the Salutron heart rate strap and TI'sCC2540DK-MINI development kit.

Anritsu: Informa LTE North America’s most innovative test kit.

This second part of a video guide instructs you on the as-sembly of RF power fixture kits, preparing and solderingcoaxial cable and mounting the RF connectors.

Open-frame & Enclosed• 5 - 3000 Watts• PCB or chassis mount• Ultra-compact design• Industrial & medical approvals• Green Power versions

DC-DC Converters• 0.25 - 600 Watts• Regulated & unregulated versions• 2:1 & 4:1 input ranges• Industry standard SIL, DIL

& SMD packages

External Power Supplies• 8-250 Watts• Energy efficiency level V• Industrial & medical approvals• Compact high efficiency design• Optional class II

DIN Rail Mount• 5-960 Watts• Single or 3 phase input versions• DC OK signal & LED indicator• Rugged design for industrial

applications

RedefiningIndustry Expectations

Visit our website to request a copy of ournew 2011/12 Power Supply Guide andsee our complete line of power products.

GREEN•POWER