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The new environmental regulations toreduce average CO2 emissions and otherautomotive trends play in favor of greatervehicle electrification and fasterdeployment of Electric Vehicles/HybridElectric Vehicles (EV/HEVs). YoleDéveloppement expects that there will be24 million EV/HEVs sold annually by 2024.
Although China is the biggest market forelectric and hybrid electric vehicles,foreign suppliers still provide a bigproportion of power modules integratedinto systems in China. However, the shareof Chinese power module and die makersis increasing and the quality andperformance of these devices iscontinuously improving. One of the majorpower module manufacturers in China isStarPower.
In this context, System Plus Consultingprovides a full reverse costing study of theStarPower module GD820HTX75P6H. ThisTri-Pack power module, in a P6 packagefrom StarPower, drives 820 A with avoltage rating of 750 V. It uses copper pin-fin dissipation structure for direct liquidcooling.
Supported by a full teardown of themodule’s components and housing, thisreport reveals StarPower’s packagingtechnological choices as well as thedesigns of the IGBT and diode dies used.
This report provides insights abouttechnology data, manufacturing cost andthe selling price of the module. It includesan estimated manufacturing cost of all themodule’s components.
Also included an exhaustive comparisonbetween the Tri-Pack P6 moduleGD820HTX75P6H from StarPower and itscounterpart from Infineon, theHybridPACK™ Drive FS820R08A6P2B.
These comparisons highlight differences inthe packaging design, die technology, andcost.
COMPLETE TEARDOWN WITH
• Detailed optical and SEM photos
• Precise measurements
• Material EDX analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated selling price
• Technology and cost comparisons with
Infineon’s HybridPACK™ Drive
FS820R08A6P2B
Tri-Pack power module from StarPower with direct liquid cooling pin-finstructure.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: StarPowerGD820HTX75P6H Tri-Pack IGBT Module
Pages: 100
Date: March 2020
Format: PDF & Excel file
Price: EUR 3,990
StarPower GD820HTX75P6H Tri-Pack IGBT Module
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
Introduction
• Executive Summary
• Market Overview
• Reverse Costing Methodology and Glossary
Company Profiles
• StarPower
Physical Analysis
• Overview of the Physical Analysis
• Package Analysis
Package opening
Package cross-section
• Si IGBT Die
IGBT die view and dimensions
IGBT die process
IGBT die cross-section
• Si Diode Die
Diode die view and dimensions
Diode die process
Diode die cross-section
Manufacturing Process
• Si IGBT Fabrication Unit & Process Flow
• Si Diode Fabrication Unit & Process Flow
• Final Test and Packaging Fabrication Unit
• Packaging Process Flow
AUTHORS
Cost Analysis
• Synthesis of the Cost Analysis
• Yield Explanations and Hypotheses
• Si IGBT
IGBT front-end cost
IGBT wafer cost per process step
IGBT die probe test, dicing and cost
• Si Diode
Diode front-end cost
Diode wafer cost per process step
Diode die probe test, dicing and cost
• DBC Cost
DBC BOM cost
DBC assembly cost
• Module Cost
Module BOM cost
Packaging assembly cost
Final module cost
Selling Price Analysis
• Definition of Prices
• Estimation of Selling Price
Comparison
• StarPower vs Infineon Power Modules
STARPOWER GD820HTX75P6H TRI-PACK IGBT MODULE
RELATED REPORTS
Hitachi Double-Side Cooling Power Module from Audi e-tron’s InverterDiscover Hitachi’s power module and its innovative assembling technology of integrated double-side cooling structure.January 2020 - EUR 3,990*
Infineon FS820R08A6P2B HybridPACK Drive IGBT ModuleThe newest HybridPACK Drive power module from Infineonwith EDT2 IGBT technology.June 2017 - EUR 3,490*
Mitsubishi J1- Series 650V High-Power Modules for AutomotiveThe first power module with 7th-gen CSTBT IGBT and an innovative integrated substrate.October 2018 - EUR 4,990*
Amine Allouche is part of SystemPlus Consulting’s Power Electronicsand Compound Semiconductorsteam. Amine holds a Master’sdegree focused on Micro andNanotechnologies for integratedSystems.
Guillaume Chevalier has joinedSystem Plus Consulting in early2018 to perform physical analyses.He holds a two-year universitydegree in technology of physicalmeasurements and instrument-ation technics.
COSTING TOOLS
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Process-BasedCosting Tools
ParametricCosting Tools
WHAT IS A REVERSE COSTING®?
Reverse Costing® is the process of disassembling a device (or asystem) in order to identify its technology and calculate itsmanufacturing cost, using in-house models and tools.
IC Price+
MEMS CoSim+
Power CoSim+
LED CoSim+
3D PackageCoSim+
DisplayPrice+
PCBPrice+
SYSCost+
CONTACTS
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting is specialized
in the cost analysis of electronics
from semiconductor devices to
electronic systems.
A complete range of services and
costing tools to provide in-depth
production cost studies and to
estimate the objective selling price of
a product is available.
Our services:
• STRUCTURE & PROCESS
ANALYSES
• TEARDOWNS
• CUSTOM ANALYSES
• COSTING SERVICES
• COSTING TOOLS
• TRAININGS
www.systemplus.fr
Headquarters22, bd Benoni GoullinNantes Biotech44200 NantesFrance+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGermany+49 151 23 54 41 [email protected]
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Our analysis is performed with our costing tool Power CoSim+.
System Plus Consulting offers powerful costing tools to evaluate the production cost and selling price from
single chip to complex structures.
Power CoSim+Cost simulation tool to evaluate the cost of any Power Electronics process or device: from single chip tocomplex structures.
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