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Quantum Leap Packaging, Inc. Page 1
High Performance Organic Cavity Packaging developed for
Hermetic,
High Rel Applications
Dr. Mike Zimmerman and Christopher Lee
Quantum Leap Packaging, Inc April 29, 2008
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Quantum Leap Packaging, Inc. Page 2
OutlineOutline
Company BackgroundMaterial and Enabling TechnologiesHermetic
Semiconductor PackagingReliabilityApplicationsSummary
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Quantum Leap Packaging, Inc. Page 3
Company BackgroundCompany BackgroundFounded December
2002Headquartered in Wilmington, Massachusetts
• 32,000 sq. ft. manufacturing facility in Wilmington, MA•
20,000 sq. ft. manufacturing facility in Poway, CA
Venture Capital:
Strategic Investor:
Strategic Partnerships• DuPont
• CMC Interconnect Technologies
• Customer Joint Development
Materials Company with first products in semiconductor
packaging
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Quantum Leap Packaging, Inc. Page 4
High Performance PolymerHigh Performance Polymer
New Molecular Structure: QUANTECHTMIsotropic PropertiesHigh
Temperature Stability (500°C)Ability to Manipulate Material
Properties• Control of Mechanical Properties, CTE• Tailored
Electrical Properties
Excellent Adhesion to Metal Leadframes and FlangesHermetic Lid
Seal Techniques Outstanding Moisture Resistance
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Quantum Leap Packaging, Inc. Page 5
QuantechQuantechTMTM Material Material
TGA(Low Outgassing: Stability to 500°C)
No discernable TgDMA (-200°C – 500°C)
High Temperature Stability and Linearity
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Quantum Leap Packaging, Inc. Page 6
QuantechQuantechTMTM MaterialMaterial
QLP/Sumitomo3.09.2QLP 140-2
Sumitomo20.519QLP135-10
Sumitomo31.527QLP 135-8
Sumitomo839Sumitomo E7008
Sumitomo1046Sumitomo SCX-072C1
Testing
TransverseDirections (ppm/oC)
Mold Direction (ppm/oC)Product
Isotropic and Tailorable CTE
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Quantum Leap Packaging, Inc. Page 7
Permeability of QuantechTM
QuantechQuantechTMTM Material Material
Permeability Comparable to Glass
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Quantum Leap Packaging, Inc. Page 8
Enabling Technology: Enabling Technology: Lid Seal ProcessLid
Seal Process
UltraSealTM: Ultrasonic Weld
B-Stage Epoxy Seal
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Quantum Leap Packaging, Inc. Page 9
QFN Cross Section: Lid InterfaceQFN Cross Section: Lid
Interface
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Quantum Leap Packaging, Inc. Page 10
Enabling Technology: Enabling Technology: UltraSealUltraSealTMTM
Ultrasonic Lid SealUltrasonic Lid Seal
Hermetic Lid SealRapid Cycle TimeRoom Temp ProcessingElimination
of Epoxy Cure and OvensThin Wall and Package Miniaturization
Load Load Position Position
Weld Weld Position Position
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Quantum Leap Packaging, Inc. Page 11
Traditional LCP Issues: Traditional LCP Issues: Adhesion and
Hermetic PropertiesAdhesion and Hermetic Properties
Dye leakage at Interface
Red Dye Red Dye PenetrantPenetrant TestTest
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Quantum Leap Packaging, Inc. Page 12
Enabling Technology: Enabling Technology: Adhesion Adhesion
Cross Section: QuantechTM/Leadframe Interface
No Leakage @ Lead Interface
No dye leakage @ Interface
Top View
Bottom View
Red Dye Penetrant Test
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Quantum Leap Packaging, Inc. Page 13
Attachment with AuSn 330°C and higher die attach
temperatures
High Power Packaging: 300 WAuSn Die Attach: 320 C Higher Die
Attach Temperatures
Process Temperatures
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Quantum Leap Packaging, Inc. Page 14
Reliability Testing of Sealed Reliability Testing of Sealed
Military Power PackageMilitary Power Package
21/21 Pass
45/47 Pass*
47/49 Pass*
49/49 Pass
49
MIL-STD-883E
1000 Temp Cycles (-40°C to +125°C)
500 Temp Cycles (-40°C to +125°C)
Initial Fine Leak Test (
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Quantum Leap Packaging, Inc. Page 15
Air Cavity Hermetic PackageAir Cavity Hermetic Package8x8 QFN
Image Sensor8x8 QFN Image Sensor
Adhesion to Glass
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Quantum Leap Packaging, Inc. Page 16
Image Sensors Image Sensors with Advantages of QLP
Technologywith Advantages of QLP Technology
True Hermetic PackageNo EpoxyMiniaturizationRoom Temp Lid
Assembly
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Quantum Leap Packaging, Inc. Page 17
Dew Point Test MethodDew Point Test Method
Moisture Condensation or
Cloudiness?
NO YES Cooling Plate Temp =
Dew Point Temp
LID: Visual Inspection @20-30X Mag
Pre-Conditioning120hrs 60C/70%RH
2x260 C Reflow
85C/85%RH Exposure
Cooling Plate
Nitrogen Box
• Starting Temp 25 C• Decrease Temp, 5 C Intervals• Down to -35
C
10s Lid face down
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Quantum Leap Packaging, Inc. Page 18
Image Sensor Packages Image Sensor Packages
40 parts: 8x8 QFN Sealed with Glass Lid120 hrs 60°C/70%RH
ExposureDew Point Test Method
• Chill Plate: 10 seconds• 30X Visual inspection for
condensation
40/40 Dew point
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Quantum Leap Packaging, Inc. Page 19
Dew Point Test ResultsDew Point Test Results
Exposure 85°C/85RH through 1000hrsPrecondition: 120 hrs at
60°C/70%RHRequirement < +25 °CResults < -35 °CEXCEEDS Ceramic
package w glass lid
D ew P oint Test R esults
-35
-25
-15
-5
5
15
25
35
0 100h 300h 500h 1000h
Tim e a t 85C/85%RH (Hrs)
Dew
Poi
nt (C
)
6162636465965768696
Requirement < 25C
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Quantum Leap Packaging, Inc. Page 20
Temp Cycle & Hermetic PerformanceTemp Cycle & Hermetic
Performance
Condition: -65 °C/150°C 500 cyclesPrecondition:
• 120 hrs at 60°C/70%RH• 2x 260 C Peak Reflow
Requirement < 1.0E-08 (Pa/s)Results: 0 Failure
Requirement < 25C
Hermetic Leak Rate vs Temp Cycle
0.00E+001.00E-092.00E-093.00E-094.00E-095.00E-096.00E-097.00E-098.00E-099.00E-091.00E-08
0 100 300 500
# of Cycles
Leak
Rat
e (P
a/s)
422233425262728292212
Requirement:
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Quantum Leap Packaging, Inc. Page 21
Summary Summary
Plastic air cavity packages achieve Hermetic performance through
QLP Material and Enabling Technologies Proven Reliability
Performance generated by customer evaluationsWorking with Lead
customers for co-development• High Rel Applications• Image Sensors•
Military Electronics
Recognized as Industry’s First Plastic Hermetic Package
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