SFH 2711 A01

1 Version 1.1 | 2020-09-21

Produktdatenblatt | Version 1.1 www.osram-os.com

Applications

SFH 2711 A01

CHIPLED® Silicon PIN Photodiode with Vλ Characteristics

— Ambient Light Sensors — Industrial Automation (Machine Controls, Light Barriers, Vision Controls)

Features: — Package: black epoxy

— Corrosion Robustness Class: 3B

— Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. — ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

— Very small SMT package — Good match to human eye sensitivity (Vλ) — Sensitivity to IR radiation (λ > 750nm) < 1%

Ordering Information Type Photocurrent 1) Photocurrent Ordering Code

typ.Ev = 1000 lx; white LED; VR = 5 V Ev = 1000 lx; white LED; VR = 5 VIP IP

SFH 2711 A01 ≥ 0.056 µA 0.12 µA Q65112A4787

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Maximum RatingsTA = 25 °C

Parameter Symbol Values

Operating Temperature Top min. max.

-40 °C 100 °C

Storage temperature Tstg min. max.

-40 °C 100 °C

Reverse voltage VR max. 16 V

ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

VESD max. 2 kV

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CharacteristicsTA = 25 °C

Parameter Symbol Values

Spectral sensitivity VR = 5 V; Std. Light A; T = 2856 K

S typ. 0.115 nA/lx

Wavelength of max sensitivity λS max typ. 580 nm

Spectral range of sensitivity λ10% typ. 470 ... 670 nm

Radiant sensitive area A typ. 0.35 mm²

Dimensions of active chip area L x W typ. 0.59 x 0.59 mm x mm

Half angle φ typ. 55 °

Dark current VR = 5 V

IR typ. max.

0.01 nA 5 nA

Open-circuit voltage Ev = 1000 lx; Std. Light A; VR = 0 V

VO min. typ.

300 mV 377 mV

Short-circuit current Ev = 1000 lx; Std. Light A; VR = 0 V

ISC typ. 0.115 µA

Rise time VR = 5 V, RL = 50 Ohm, λ = 530nm

tr typ. 0.06 µs

Fall time VR = 5 V, RL = 50 Ohm, λ = 530nm

tf typ. 0.06 µs

Forward voltage 0

VF typ. 0.70 V

Capacitance VR = 0 V; f = 1 MHz; E = 0

C0 typ. 28 pF

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Relative Spectral Sensitivity 2), 3)Srel = f (λ)

400 500 600 700λ [ ]

0

20

40

60

80

100[ ]

Directional Characteristics 2), 3)Srel = f (φ)

-90°

-80°

-70°

-60°

-50°

-40°

-30°

-20°-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°

Φ [ ]

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

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Dark Current 2), 3)IR = f (VR)

0 2 4 6 8 10 12 14 16[ ]

2

3

4

5

10

20[ ]

Capacitance 2), 3)C = f (VR); f = 1MHz; E = 0; TA = 25°C

10-3 0.01 0.1 1 10[ ]

10

15

20

25

30[ ]

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Dimensional Drawing 4)

Further Information:

Approximate Weight: 3.8 mg

Package marking: Cathode

Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43)

Pin Description

1 Anode

2 Cathode

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7 Version 1.1 | 2020-09-21

Recommended Solder Pad 4)

OHFP2578

3.2

1.25

1

Component location on padBauteil positioniert

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Reflow Soldering ProfileProduct complies to MSL Level 3 acc. to JEDEC J-STD-020E

00

s

OHA04525

50

100

150

200

250

300

50 100 150 200 250 300t

T

˚C

St

t

Pt

Tp240 ˚C

217 ˚C

245 ˚C

25 ˚C

L

Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum

Ramp-up rate to preheat*)25 °C to 150 °C

2 3 K/s

Time tSTSmin to TSmax

tS 60 100 120 s

Ramp-up rate to peak*)TSmax to TP

2 3 K/s

Liquidus temperature TL 217 °C

Time above liquidus temperature tL 80 100 s

Peak temperature TP 245 260 °C

Time within 5 °C of the specified peaktemperature TP - 5 K

tP 10 20 30 s

Ramp-down rate*TP to 100 °C

3 6 K/s

Time25 °C to TP

480 s

All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

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Taping 4)

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Tape and Reel 5)

Reel DimensionsA W Nmin W1 W2 max Pieces per PU

180 mm 12 + 0.3 / - 0.1 mm 60 mm 12.4 + 2 mm 18.4 mm 3000

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Barcode-Product-Label (BPL)

Dry Packing Process and Materials 4)

OHA00539

OSRA

M

Moisture-sensitive label or print

Barcode label

Desiccant

Humidity indicator

Barcode label

OSRAM

Please check the HIC immidiately afterbag opening.

Discard if circles overrun.Avoid metal contact.

WET

Do not eat.

Comparatorcheck dot

parts still adequately dry.

examine units, if necessary

examine units, if necessary

5%

15%

10%bake units

bake units

If wet,

change desiccant

If wet,

Humidity IndicatorMIL-I-8835

If wet,

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whe

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Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

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Disclaimer

Attention please!The information describes the type of component and shall not be considered as assured characteristics.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS website.

PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.OSRAM OS products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-nate the customer-specific request between OSRAM OS and buyer and/or customer.

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Glossary1) Photocurrent: The photocurrent values are measured (by irradiating the devices with a homogenous

light source and applying a voltage to the device) with a tolerance of ±11 %.2) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-

es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

3) Testing temperature: TA = 25°C (unless otherwise specified)4) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and

dimensions are specified in mm.5) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

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14 Version 1.1 | 2020-09-21

Revision HistoryVersion Date Change

1.1 2020-09-21 Taping Schematic Transportation Box Dimensions of Transportation Box

SFH 2711 A01

15 Version 1.1 | 2020-09-21

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