-
SFH 2704
1 Version 1.0 | 2019-03-21
Produktdatenblatt | Version 1.1 www.osram-os.com
Applications
SFH 2704
CHIPLED® Silicon PIN Photodiode
— Health Monitoring (Heart Rate Monitoring, Pulse Oximetry)
Features: — Package: clear epoxy
— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
— Suitable for reflow soldering — Especially suitable for
applications from 400 nm to 1100 nm — Small package (LxWxH): 2.0 mm
x 1.8 mm x 0.6 mm (WxDxH)
Ordering Information Type Photocurrent Photocurrent Ordering
Code
typ.Ee = 0.1 mW/cm²; λ = 535 nm Ee = 0.1 mW/cm²; λ = 535 nm IP
IP
SFH 2704 ≥ 0.35 µA 0.51 µA Q65112A7214
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SFH 2704
2 Version 1.0 | 2019-03-21
Maximum RatingsTA = 25 °C
Parameter Symbol Values
Operating Temperature Top min. max.
-40 °C85 °C
Storage temperature Tstg min. max.
-40 °C85 °C
Reverse voltage TA = 25 °C
VR max. 6 V
ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class
2)
VESD max. 2 kV
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SFH 2704
3 Version 1.0 | 2019-03-21
CharacteristicsTA = 25 °C
Parameter Symbol Values
Wavelength of max sensitivity λS max typ. 900 nm
Spectral range of sensitivity λ10% typ. 400 ... 1100 nm
Photocurrent Ee = 0.1 mW/cm²; λ = 535 nm; VR = 5 V
IP min. typ.
0.35 µA0.51 µA
Photocurrent Ee = 0.1 mW/cm²; λ = 940 nm; VR = 5 V
IP min. typ.
0.85 µA1.22 µA
Radiant sensitive area A typ. 1.51 mm²
Dimensions of active chip area L x W typ. 1.23 x 1.23 mm x
mm
Half angle φ typ. 60 °
Dark current VR = 5 V
IR typ. max.
0.1 nA25 nA
Spectral sensitivity of the chip λ = 535 nm
Sλ typ. 0.34 A / W
Quantum yield of the chip λ = 535 nm
η typ. 0.79 Electrons / Photon
Open-circuit voltage Ee = 0.1 mW/cm²; λ = 535 nm; VR = 5 V
VO min. typ.
490 mV510 mV
Rise time VR = 5 V; RL = 50 Ω; λ = 525 nm; IP = 600 µA
tr typ. 47 ns
Fall time VR = 5 V; RL = 50 Ω; λ = 525 nm; IP = 600 µA
tf typ. 67 ns
Forward voltage IF = 10 mA; E = 0
VF typ. 0.95 V
Capacitance VR = 0 V; f = 1 MHz; E = 0
C0 typ. 13.4 pF
Noise equivalent power VR = 5 V; λ = 535 nm
NEP typ. 0.017 pW / Hz1/2
Detection limit VR = 5 V; λ = 535 nm
D* typ. 7.4e12 cm x Hz1/2 / W
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SFH 2704
4 Version 1.0 | 2019-03-21
Relative Spectral Sensitivity 1), 2)Srel = f (λ)
400 600 800 1000λ [ ]
0
20
40
60
80
100[ ]
Directional Characteristics 1), 2)Srel = f (φ)
-90°
-80°
-70°
-60°
-50°
-40°
-30°
-20°-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°
Φ [ ]
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
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SFH 2704
5 Version 1.0 | 2019-03-21
Dark Current 1), 2)IR = f (VR); E = 0
0 2 4 6[ ]
6⋅10-11
7⋅10-11
8⋅10-11
9⋅10-11
1.0⋅10-10[ ]
Capacitance 1), 2)C = f (VR); f = 1MHz; E = 0; TA = 25°C
10-3 0.01 0.1 1 10[ ]
2
4
6
8
10
12
14[ ]
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SFH 2704
6 Version 1.0 | 2019-03-21
Dark Current 1)IR = f (TA); E = 0; VR = 5 V
0 20 40 60 80[ ]
0.1
1
10
100[ ]
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SFH 2704
7 Version 1.0 | 2019-03-21
Dimensional Drawing 3)
Further Information
Approximate Weight: 4.4 mg
Package marking: Cathode
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SFH 2704
8 Version 1.0 | 2019-03-21
Recommended Solder Pad 3)
Reflow Soldering ProfileProduct complies to MSL Level 3 acc. to
JEDEC J-STD-020E
00
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300t
T
˚C
St
t
Pt
Tp240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
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SFH 2704
9 Version 1.0 | 2019-03-21
Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum
Recommendation Maximum
Ramp-up rate to preheat*)25 °C to 150 °C
2 3 K/s
Time tSTSmin to TSmax
tS 60 100 120 s
Ramp-up rate to peak*)TSmax to TP
2 3 K/s
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peaktemperature TP - 5 K
tP 10 20 30 s
Ramp-down rate*TP to 100 °C
3 6 K/s
Time25 °C to TP
480 s
All temperatures refer to the center of the package, measured on
the top of the component* slope calculation DT/Dt: Dt max. 5 s;
fulfillment for the whole T-range
Taping 3)
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SFH 2704
10 Version 1.0 | 2019-03-21
Tape and Reel 4)
D0
2P
P0
1P
WFE
Direction of unreeling
N
W1
2W
A
OHAY0324
Label
Leader:Trailer:
13.0
Direction of unreeling
±0.2
5
min. 160 mm *min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Reel DimensionsA W Nmin W1 W2 max Pieces per PU
180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 3000
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SFH 2704
11 Version 1.0 | 2019-03-21
Barcode-Product-Label (BPL)
Dry Packing Process and Materials 3)
OHA00539
OSRA
M
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately afterbag opening.
Discard if circles overrun.Avoid metal contact.
WET
Do not eat.
Comparatorcheck dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%bake units
bake units
If wet,
change desiccant
If wet,
Humidity IndicatorMIL-I-8835
If wet,
Moi
stur
e Le
vel 3
Flo
or ti
me
168
Hou
rs
Moi
stur
e Le
vel 6
Flo
or ti
me
6
Hou
rs
a) H
umid
ity In
dica
tor C
ard
is >
10%
whe
n re
ad a
t 23
˚C ±
5 ˚C
, or
reflo
w, v
apor
-pha
se ref
low
, or eq
uiva
lent
pro
cess
ing
(pea
k pa
ckag
e
2. A
fter th
is b
ag is
ope
ned,
dev
ices
that
will
be
subj
ecte
d to
infrar
ed
1. S
helf
life
in s
eale
d ba
g: 2
4 m
onth
s at
< 4
0 ˚C
and
< 9
0% rel
ativ
e hu
mid
ity (R
H).
Moi
stur
e Le
vel 5
a
at fa
ctor
y co
nditi
ons
of
(if b
lank
, sea
l dat
e is
iden
tical
with
dat
e co
de).
a) M
ount
ed w
ithin
b) S
tore
d at
body
tem
p.
3. D
evic
es req
uire
bak
ing,
bef
ore
mou
ntin
g, if
:
Bag
sea
l dat
e
Moi
stur
e Le
vel 1
Moi
stur
e Le
vel 2
Moi
stur
e Le
vel 2
a4. If
bak
ing
is req
uire
d,
b) 2
a or
2b
is n
ot m
et.
Dat
e an
d tim
e op
ened
:
refe
renc
e IP
C/J
ED
EC
J-S
TD
-033
for ba
ke p
roce
dure
.
Flo
or ti
me
see
belo
w
If bl
ank,
see
bar
cod
e la
bel
Flo
or ti
me
> 1
Yea
r
Flo
or ti
me
1
Yea
r
Flo
or ti
me
4
Wee
ks10%
RH
.
_<
Moi
stur
e Le
vel 4
Moi
stur
e Le
vel 5
˚C).
OPT
O S
EMIC
OND
UCTO
RS
MO
ISTU
RE S
ENSI
TIVE
This
bag
con
tain
s
CAUT
ION
Flo
or ti
me
72
Hou
rs
Flo
or ti
me
48
Hou
rs
Flo
or ti
me
24
Hou
rs
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bl
ank,
see
bar co
de la
bel
Moisture-sensitive product is packed in a dry bag containing
desiccant and a humidity card according JEDEC-STD-033.
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SFH 2704
12 Version 1.0 | 2019-03-21
Schematic Transportation Box 3)
OHA02044
PACK
VAR:
R077Ad
ditiona
l TEXT
P-1+Q
-1
Multi T
OPLE
D
Muste
r
OSRA
M Opto
Semic
ondu
ctors
(6P) B
ATCH
NO:
(X) PR
OD NO
:
10
(9D) D
/C:
11(1T) LOT
NO:
21002199
8
123GH
1234
024 5
(Q)QT
Y:200
0
0144
(G) GR
OUP:
260 C
RT240
C R
3
220 C
R
MLBin
3:Bin2: Q
-1-20
Bin1: P
-1-20
LSY T
6762
2a
Temp
ST
R18
DEMY
PACK
VAR:
R077Ad
ditiona
l TEXT
P-1+Q
-1
Multi T
OPLE
D
Muste
r
OSRA
M Opto
Semic
ondu
ctors
(6P) B
ATCH
NO:
(X) PR
OD NO
:
10
(9D) D
/C:
11(1T) LOT
NO:
21002199
8
123GH
1234
024 5
(Q)QT
Y:200
0
0144
(G) GR
OUP:
260 C
RT240
C R
3
220 C
R
MLBin
3:Bin2: Q
-1-20
Bin1: P
-1-20
LSY T
6762
2a
Temp S
T
R18
DEMY
OSRAM
Packing
Sealing label
Barcode label
Moi
stur
e Le
vel 3
Flo
or ti
me
168
Hou
rs
Moi
stur
e Le
vel 6
Flo
or ti
me
6
Hou
rs
a) H
umid
ity In
dica
tor C
ard
is >
10%
whe
n re
ad a
t 23
˚C ±
5 ˚C
, or
reflo
w, v
apor
-pha
se ref
low
, or e
quiv
alen
t pro
cess
ing
(pea
k pa
ckag
e
2. A
fter th
is b
ag is
ope
ned
, de
vice
s th
at w
ill b
e su
bjec
ted
to in
frar
ed
1. S
helf
life
in s
eale
d ba
g: 2
4 m
onth
s at
< 4
0 ˚C
and
< 9
0% rel
ativ
e hu
mid
ity (R
H).
Moi
stur
e Le
vel 5
a
at fa
ctor
y co
nditi
ons
of
(if b
lank
, sea
l dat
e is
iden
tical
with
dat
e co
de).
a) M
ount
ed w
ithin
b) S
tore
d at
body
tem
p.
3. D
evic
es req
uire
bak
ing,
bef
ore
mou
ntin
g, if
:
Bag
sea
l dat
e
Moi
stur
e Le
vel 1
Moi
stur
e Le
vel 2
Moi
stur
e Le
vel 2
a4. If
bak
ing
is req
uire
d,
b) 2
a or
2b
is n
ot m
et.
Dat
e an
d tim
e op
ened
:
refe
renc
e IP
C/J
ED
EC
J-S
TD-0
33 fo
r ba
ke p
roce
dure
.
Floo
r tim
e se
e be
low
If bl
ank,
see
bar
cod
e la
bel
Flo
or ti
me
> 1
Yea
r
Floo
r tim
e
1 Y
ear
Flo
or ti
me
4
Wee
ks10%
RH
.
_<
Moi
stur
e Le
vel 4
Moi
stur
e Le
vel 5
˚C).
OPT
O S
EMIC
ONDU
CTO
RS
MO
ISTU
RE S
ENSI
TIVE
This
bag
con
tain
s
CAUT
ION
Flo
or ti
me
72
Hou
rs
Flo
or ti
me
48
Hou
rs
Flo
or ti
me
24
Hou
rs
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bl
ank,
see
bar c
ode
labe
l
Barcode label
Dimensions of Transportation BoxWidth Length Height
200 ± 5 mm 195 ± 5 mm 30 ± 5 mm
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SFH 2704
13 Version 1.0 | 2019-03-21
NotesThe evaluation of eye safety occurs according to the
standard IEC 62471:2006 (photo biological safety of lamps and lamp
systems). Within the risk grouping system of this IEC standard, the
device specified in this data sheet fall into the class exempt
group (exposure time 10000 s). Under real circumstances (for
expo-sure time, conditions of the eye pupils, observation
distance), it is assumed that no endangerment to the eye exists
from these devices. As a matter of principle, however, it should be
mentioned that intense light sources have a high secondary exposure
potential due to their blinding effect. When looking at bright
light sources (e.g. headlights), temporary reduction in visual
acuity and afterimages can occur, leading to irrita-tion,
annoyance, visual impairment, and even accidents, depending on the
situation.
Subcomponents of this device contain, in addition to other
substances, metal filled materials including silver. Metal filled
materials can be affected by environments that contain traces of
aggressive substances. There-fore, we recommend that customers
minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when
tested using the described tests above did show no performance
deviations within failure limits during the stated test duration.
Respective failure limits are described in the IEC60810.
For further application related information please visit
www.osram-os.com/appnotes
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SFH 2704
14 Version 1.0 | 2019-03-21
Disclaimer
Attention please!The information describes the type of component
and shall not be considered as assured characteristics. Terms of
delivery and rights to change design reserved. Due to technical
requirements components may contain dangerous substances.For
information on the types in question please contact our Sales
Organization.If printed or downloaded, please find the latest
version on the OSRAM OS webside.
PackingPlease use the recycling operators known to you. We can
also help you – get in touch with your nearest sales office.By
agreement we will take packing material back, if it is sorted. You
must bear the costs of transport. For packing material that is
returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.
Product safety devices/applications or medical
devices/applicationsOSRAM OS components are not developed,
constructed or tested for the application as safety relevant
component or for the application in medical devices. In case Buyer
– or Customer supplied by Buyer– considers using OSRAM OS
components in product safety devices/applications or medical
devices/applications, Buyer and/or Customer has to inform the local
sales partner of OSRAM OS immediately and OSRAM OS and Buyer and
/or Customer will analyze and coordi-nate the customer-specific
request between OSRAM OS and Buyer and/or Customer.
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SFH 2704
15 Version 1.0 | 2019-03-21
Glossary1) Typical Values: Due to the special conditions of the
manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical
parameters can only reflect statistical figures. These do not
necessarily correspond to the actual parameters of each single
product, which could dif-fer from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed
without any further notice.
2) Testing temperature: TA = 25°C3) Tolerance of Measure: Unless
otherwise noted in drawing, tolerances are specified with ±0.1
and
dimensions are specified in mm.4) Tape and Reel: All dimensions
and tolerances are specified acc. IEC 60286-3 and specified in
mm.
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SFH 2704
16 Version 1.0 | 2019-03-21
Revision HistoryVersion Date Change
1.0 2019-03-21 Initial Version
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SFH 2704
17 Version 1.0 | 2019-03-21
Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4,
D-93055 Regensburg www.osram-os.com © All Rights Reserved.
