Sensors and Semicon Industry, the Synergy Ratio€¦ · 3D Camera Laser Ranger (Time of Flight) RGB Proximity ALS Gas/Particle sensors Humidity + Temperature Pressure sensors Silicon

Sensors and Semicon Industry, the Synergy Ratio

Erik Jan Lous [email protected]

www.ams.com

ams AG at a glance • Sensor solutions

– Optical sensors & CMOS Image Sensors – Audio & Environmental sensors – Position sensors – Power management & Wireless/NFC

• EUR623m/$691m revenues (2015) • Integrated Device Manufacturer

– Standard products – Custom solutions

• 2,100+ employees in 20 countries (2900+ combined with Heptagon) – 18+1 design centers, 2+1 manufacturing

locations – 20 sales offices, 30+ channel partners – 35 years of design and manufacturing know-how

ALS & proximity sensor

6/2016

11/2015

10/2016

7/2016

Confidential © ams AG 2015 Page 3

Outline

1) Sensor market and semiconductor industry

2) Environmental sensor solutions

3) Optical sensor solutions

4) Sensor (3D) integration flow

5) Conclusion


Outline





5) Conclusion

Sources: Yole, ams AG (2016)

IR, UVA/B

Sensing applications and technologies

MEMS Optical CMOS

Embedded / Add-on

Embedded / Add-on

Embedded / Add-on

MEMS

MEMS

MEMS


Use cases – environmental sensors

Home Building Automation / Internet of Things Mobile and wearable


Use cases – optical sensors

Sun exposure control Food safety Optical authentication

Display management (Ambient light, color) Proximity and gesture Health and fitness Spectrometer Camera

Direct gas sensing Presence detection Spectrometer Camera

Source: ams AG Source: ams AG


Use cases – environmental sensors

0

2.000

4.000

6.000

8.000

10.000

12.000

14.000

16.000

18.000

20.000

22.000

24.000

26.000

2013 2014 2015 2016 2017 2018 2019 2020 2021

2013 - 2021 Cellphones and tablets sensors volume forecast by sensor type (M units)

Total (Munits)

Other emerging MEMS

CIS sensors

Optical HRM

Eye/Iris scanner

Fingerprint

3D Camera

Laser Ranger (Time of Flight)

RGB

Proximity

ALS

Gas/Particle sensors

Humidity + Temperature

Pressure sensors

Silicon Microphones

9-axis Combos

6-axis E-compass

6-axis IMUs

Magnetometers

OIS gyroscopes

Gyroscopes

Accelerometers

Yole Developpement @ April 2016

Source: Yole (2016)

Environmental

Optical

Inertial


Market trends and technology needs Performance New/better/more sensing functions Smarter and/or autonomous systems Through model & logic, ideal & good sensors again Self calibration & sensor to sensor corrections

Low power (battery applications) Size and cost: Small enough to enable mobility More and more functions per unit area Thinner devices

Miniaturized, integrated sensors

Monolithically Wafer stacking (3D integration) Wafer Level packaging

Smart Sensor Systems

Standalone Sensors

Integrated Multi-Sensors


Outline





5) Conclusion


Sensor software and inter-dependencies • Sensor data user information (sensor fusion)

• Sensor solution = Sensor IC hardware + system integration software

Temperature Relative humidity

Applications

Services

OS

Hardware ENS210 Sensor X

ENS210

driverSensor X

driver

CPU

status

CPU

App

Display

Display

status

T/RH

ServicesCompensation Engine Manager

Compensation Engine

LibraryCE

parameters

Software

Data

IC

StandardCorrected RH and T info

Thermal analysis and model

Rel. Humidity (RH) + Temperature (T) sensor IC Accuracy: ± 0.2C; ±3.5% (3σ) Power<0.02mW

Compensation engine

Source: ams AG

Combined sensors: Input of one (T) helps to improve the other sensor (RH)


Chemical – gas sensor • From discrete to SiP/SoC integrated sensors

2 x 4 µ-hotplate array

• High sensitivity towards reducing (CO, VOCs) and oxidizing (NO2) target gases

• long-term stability > 10 years continuous operation Source: ams AG

µ-hotplate SEM Air Quality Sensors


CMOS wafer CMOS wafer

Pressure sensor

• Examples: P sensor formed by Piezo & by CMOS post-processing

Top view ASIC with two membranes on CMOS

Top view membrane showing release etch holes

Top view Packaged Product

Power < 10 µW

Sensitivity o P range: 300-1200 mbar o (T range: -40 to +100 0C)

o P Accuracy: ±0.5 mbar

Source: ams AG

Piezoresistive CMOS post-processing

Bosch BMP280

LPS22HB


Outline





5) Conclusion


Ambient Light sensors • Lowest z-height requirement for smartwatches drives 3D/TSV adoption

Sources: M.Schrems et al. ESSDEC 2014, ams AG, System Plus Consulting (2016),

380µm

ALS for smartphones (CSP)

Source: ams AG

TSV

IC

metal layer

bump

Si substrate

Filter Sensor

220µm

Wafer Yield Cross section Optical

Response

ALS for smartwatches (3D/TSV)


Proximity, gesture,…

• IR sensing can be applied to integrate multiple sensing functions

Ambient Light, Color, Proximity, Gesture, Barcode/Mobeam, Remote Control

Source: ams AG

TMD4903


Biosensors • PhotoPlethysmoGraphy (PPG)

– measures Pulse Rate Variation

(PRV) by changes in reflected

signals caused by blood vessel

dilation/contraction on a blood

pressure wave induced by the heart.

• algorithms for

– Heart Rate Monitoring (HRM)

– Heart Rate Variability (HRV)

– Blood Pressure (BP)

• Sensor Interface for

– Galvanic Skin Resistance (GSR)

– Skin temperature (e.g.thermopile)

AS7000

GPIO4GPIO3GPIO2GPIO1GPIO0 GPIO8

GPIO7

GPIO6

GPIO5

Ele

ctr

ica

l

Fro

nte

nd

Op

tica

l

Fro

nte

nd

14 bit ADCLDO Biasing

Optical barrier

AGND

SIGREFVDD

V_LDO

GND

VD1

VD2

VD4

VD3

ON=0,

OFF=1Cortex M0

4kByte RAM

32kByte EEPROM

UART, SPI, I2C

Sources: ams AG, http://www.electronicsweekly.com/news/products/sensors-products/wristband-heart-rate-sensor-includes-dsp-2015-09/


Multi-spectral sensors

• 6-channel device with various choices of passband filters

for different applications ; SiP or 3D/TSV

UV-A UV-B

Z

Y X NIR

X

Z

Y

IR

Source: ams AG

6-channel photosensor AS726x - Top view and TSV/WLP bottom view

PROM

SPI

Quad Sensor Analog Front End LED

BLE I/F UART

/I2C

Spectral Sensing Engine

Communication/Network Interfaces

XYZ-NIR UVAB

6-channel VIS +IR

6-channel VIS

Interference Filter options

…. and more

6-channel photosensor AS726x - architecture


Outline





5) Conclusion


Sensor-IC production flow diagram Device Physics Simulations

Device Library, containing Sensors, TSV, 3D integration, Packaging

Design Input, containing ASIC, Lay-out & Package + DFM

GDS2 data

Chipfin & Mask making

Wafer(s) production

(3D integration of Multiple wafers)

De

sig

n R

ule

Ma

nu

al

(Wafer Level) Packaging

(Wafer Level) Test & Calibration

Tape & Real

Wafer Test (Process Control Modules)

Customer

Functional Spec

Customer

Sensor-IC


Test & Calibration Request to test & handler tools: Physical stimuli in handler environment NIST traceable High accuracy & repeatability Test at low cost = high speed Small dimensions, incl. CSP dies or Wafer Level

Osai Spea Xcerra Cascade Absolute Optical & Spectral sensing


Outline





5) Conclusion


Conclusions • CMOS post-processing and 3D-integration of MEMS or sensors adds

further options for miniaturization and systems integration: the 4th option technology in CMOS.

• Form factor, power and cost reduction needs in smartphones and wearables drive SiP, SoC, and 3D/TSV/WLP integration depending from application needs

• System integration software is needed to model all sensors aspects, cross-correlations and to provide end-users with sensor solutions with accurate information

Thank you!


Abstract

Requested Title: Sensors and Semicon Industry, the Synergy Ratio The vision of a semicon foundry concerning sensor technology for measurement in areas like humidity, temperature, pressure, biosensors, imaging. Erik Jan Lous, ams (confirmed) Abstract: Sensors are becoming a 4th option technology in CMOS fabs, besides the current 3: RF, High Voltage and embedded memories. Together with advanced packaging and test methods miniaturization and mass production are being enabled. Design libraries can be developed in classical ways to integrate sensors with sensor interfaces in new ASIC designs. This will be shown with a few examples in the areas like humidity, temperature, pressure, biosensors, imaging and several other optical sensor solutions for smartphones and wearables. This can be applied in other markets as well.

Documents

Sensors and Semicon Industry, the Synergy Ratio€¦ · 3D Camera Laser Ranger (Time of Flight) RGB Proximity ALS Gas/Particle sensors Humidity + Temperature Pressure sensors Silicon