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Contents

1 Introduction ...................................... ........................................................................ 3

2 Yield Improvement Equipment ....................... ........................................................ 4

2.1 Introduction ................................................................................................................ 4

2.2 Project execution and results .................................................................................... 4

3 Semiconductor Manufacturing Equipment ............. .............................................. 9

3.1 Introduction ................................................................................................................ 9

3.2 Project execution and results .................................................................................. 10

4 Scientific Instrumentation ........................ ............................................................ 12

4.1 Introduction .............................................................................................................. 12

4.2 Project execution and results .................................................................................. 13

4.3 PPS and Connection to Topsectors ........................................................................ 16

5 Semicon Equipment Portfolio ....................... ....................................................... 17

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1 Introduction

The Semiconductor Industry faces a number of challenges as outlined in the 2013 HTSM Semiconductor Equipment (SCE) roadmap: small, affordable, economical and integrated. The cost-of-ownership of the machines must be reduced. The machines need to become faster, have a smaller footprint and lower mass. The latter contributes to a lower consumption of energy and materials and makes the machines more economical. New applications require greater integration and new technologies make this possible. Of the ~38.2 B$ global Semiconductor Equipment market, shipments mostly to Asia, more than one fifth is delivered from the Netherlands. Consequently virtually all state-of-the-art chips in the world contain Dutch IP and are manufactured on some Dutch tools. The total R&D investment in this sector in the Netherlands by the industry is estimated over 1 B€, more than one fifth of the Dutch private R&D. In some areas the Dutch industry is dominant, like in lithography, where ASML has a market share in excess of 80%, in other areas significant, especially at the high-end side (high resolution imaging, atomic layer depositions, etc.). So, this particular industry secures tens of thousands of jobs for the end-producers but also the entire ecosystem of high-tech parts and assembly suppliers throughout the whole of the Netherlands. It is the ambition of the Roadmap Semiconductor Equipment (RM SE) to strengthen the Dutch ecosystem in the area of High-Tech Equipment for Semicon with breakthrough technologies and by broadening the scope of existing strong technologies. This enables the industry to develop modules and tools that are significantly more efficient and cheaper to run and gain a higher yield. The RM SE aims to secure the position of the Netherlands as semiconductor manufacturing equipment supplier to the world, by joining forces from industry and institutes to find solutions for current challenges while at the same time constantly challenging the current technological pathways. This will not only bring job security to the Netherlands for the years to come but also enables the electronics industry and the institutes to play their pathfinder role in solving some of societies largest future challenges. The Semicon Equipment & Devices Program knows three subprograms Semicon manufacturing Equipment, Scientific Instrumentation and Yield Improvement Equipment and one supporting program called Semion Equipment Portfolio where new ideas for new programs are investigated.

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2 Yield Improvement Equipment

2.1 Introduction

Within the Topsector High-Tech Systems and Materials, The Netherlands holds a strong position in the semiconductor equipment industry. The semiconductor community is facing serious challenges with respect to yield and contamination. This is mainly related to the introduction of EUV lithography and the aggressive industry trend to the production of smaller devices, known as Moore’s Law . The VP Yield Improvement Equipment has been defined to focus TNO’s knowledge investment to needs of semiconductor equipment companies besides actual lithography. The innovation topics are related to the high risk parts for the next generation semiconductor production line, such as EUV reticle infrastructure and defects on wafers. A major root cause for the occurrence of defects is system contamination. At the same time is contamination control for most industrial parties no core business and TNO has more than a decade experience in this knowledge and technology area. In 2013 the VP started with the following distinction of the main innovation topics in Yield Improvement Equipment: • Cleaning technologies to clean contaminants (particles and molecular). • Prevention of contamination in systems, which can cause yield problems. • Inspection to visualize contamination and what is being prevented or cleaned. During 2013 and looking forward to 2014 and the next strategic period, the goals of VP Yield Improvement Equipment were sharpened and the distinction of the main topics have been adapted to the following three topics, which are seen as major drivers in the field of contamination control:

Main topics on contamination control

In 2013 a number of EU projects have been started up. With TNO’s knowledge investments, technologies have been developed on YIE relevant topics were gaps were foreseen in the International Roadmap Semiconductors (ITRS).

2.2 Project execution and results

A selection of project results is presented in this section, divided in the under the three main topics: Prevention, diagnostics and remediation. Some of the mixed

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funding projects are covering more than one topic, but it is mentioned where the emphasis of the project is.

2.2.1 Prevention Ultra clean handling Particle free reticle handing is seen as one of the most fundamental problems of EUV lithography after getting enough photons. Contamination protection on an EUV reticle is difficult because it will attenuate the EUV light. Therefore currently no protection is foreseen and the reticle should be handled extremely carefully to guarantee it will be contamination free. No nanometer sized particles are allowed on the reticle surface. • Results: An ultra-clean reticle handler setup has been designed and realized with the goal to have a platform to develop knowledge and technology on particle free handling. The reticle handler has been built up in a VLL cleanroom and will be characterized the coming year.

Assembly of the ultra-clean reticle handler

• Public Private Partnerships: This project started as a TNO initiative. Partners are welcome to join. • In 2014: The reticle handler setup will be characterized and prepared to be used as an open platform on ultra -lean handling technology development. The impact of plasma on surfaces Plasma can occur in different systems in the semiconductor production lines, which make use of ionizing wavelengths. To be able to analyze the effect of ions on surfaces TNO started an investigation on how to mimic relevant plasma parameters. This investigation started with a literature search and trade-off on different methods of exposures with ions with the required gasses. • Result: Trade-off, which resulted in a selected ion source. The source has been got operational with the required purge gasses and right process window. • Public Private Partnerships: The technology is attracting partner companies in semiconductor field and ITER. • In 2014: Results are planned to be published and the source will be built in a dedicated setup and characterized for reliable experiments.

2.2.2 Diagnostics High throughput SPM This project is a continuation of an architecture study in 2012, where a new idea on high throughput scanning probe microscopy has been investigated. The

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fundamentals of this high throughput concept are the possibility to miniaturize a scan head and a moving base. These high risk parts have been investigated in 2013. • Results: The realization of one arm for the high throughput demonstrator, with a miniaturized scan head and miniaturized moving base. All parts were tested separately before the setup was assembled.

The design of the mini moving base and scan head setup to prove the SPM priciple

• Public Private Partnerships: This project started as a TNO initiative. Partners are welcome to join. • In 2014: This project was a start of a larger research on parallelization of SPM and project will continue in the EU project E450EDL, where a multi-arm demonstrator will be developed. RapidNano particle detection to lower detection limits The RapidNano particle detector is a dark field microscope detection system to detect particles on blank reticle substrates. The RapidNano has the possibility to detect lower particles with a new illumination method, which allows the system to enhance the visibility of the particle w.r.t. the surface roughness. This new illumination method is a first step to realize a RapidNano with a detection limit lower than 20 nanometer particles. • Results: The new illumination method has been designed, realized and implemented in the RapidNano setup. The first results look promising and matches to the in 2012 developed model.

42 nm detection limit measured Developed roadmap for the system

• Public Private Partnerships: This project started as a TNO initiative. Partners are welcome to join. • In 2014: The project and RapidNano development will be continued to achieve lower detection limits and connection to the EUV reticle handler.

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2.2.3 Remediation NanoNextNL Nano-pattering The reticle is one of the most sensitive parts in an EUV production process. One defect can mean imaging errors on a complete wafer. NanoNextNL Nano-patterning has the goal to investigate cleaning processes on molecular and particle contamination on patterned reticles and also repair strategies with helium ion microscopy. • Results: A plasma cleaning process has been developed and validated for cleaning of molecular contamination in reticle patterns, and particle removal technique with an isolated droplet spray has been investigated experimentally. Complex shapes can be etched with the helium ion microscope on a tantalum nitride surface, which is known as the absorber layer for the pattern on a reticle.

Plasma: Used shielded micro-wave plasma source HIM: Etching of complex shapes

• Public Private Partnerships: Partner of TNO in this project are: ASML, TU Delft, TU/e. • In 2014: This project will continue for one quarter in 2014. EU project EEM450PR The objective of the EEM450PR project is to develop technology, equipment, material, ecosystem and infrastructure in preparation of a 450 mm pilot line. During 2013 TNO contributed on the following topics: o Batch furnace modelling o Backside wafer cleaning o Hydrocarbon containment o Fast computing algorithms More information of this project is published on the EU projects ENIAC/ECSEL page of the TNO website www.tno.nl • Public Private Partnerships: Partners of TNO in this project are: ASMI, Applied Materials, Nova. • In 2014: This project is a 4 year project and will continue in 2014. EU project SILVER The EU project Silver focusses on the “Green Fab” and TNO is working on a cleaning technique with the use of at least possible water. The goal is to develop a low waste wafer cleaning technique. The proposed way is to make use of rolling droplets on the wafer surface and thereby taking the particle contamination.

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• Results: An experimental setup has been realized to clean surfaces with rolling droplets. The process seemed to be strongly dependent on the surfaces to clean. TNO has organized a partner day for the Silver consortium at October 30.

Manipulation of the droplets on a smooth surface

• Public Private Partnerships: Partners of TNO in this project are the consortium members of Silver. • In 2014: This project is not finalized and will continue in 2014.

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3 Semiconductor Manufacturing Equipment

3.1 Introduction

TNO choses for three research paths in the broad Semicon market. • New technologies for high optical resolutions • Development of equipment for the mask infrastructure • Development of equipment for efficient Front-End processing The program Semicon Manufacturing Equipment (SME) accelerates the development of the next generation semiconductor equipment by enhancing performance or productivity, or by introducing (or contributing to) completely new equipment or process concepts. The program focusses primarily on developments related to the equipment market segments in which the Netherlands (or Europe) holds a strong position already, and secondary on market segments in which the Dutch industry holds a strong technological base and could significantly improve its position. Examples are lithography, processing equipment, wafer dicing, and microscopy. The most dominant developments for this industry in 2014 are again: EUV lithography, transition to 450mm wafers and heterogeneous integration. Besides a strong position in Business-to-Business projects, the program aims to work within EU consortia (e.g. ENIAC) and national cooperations (e.g. sponsoring of PhD-positions) as well. The main topics of the program are: machine control, lithography and light-material interaction. Machine control: The developments in semiconductor manufacturing equipment are mainly related to higher productivity and increasing resolution. In case of a transition like the introduction of 450mm wafers the productivity (in number of wafers per hour) and resolutions does not only have to be improved, but the technical challenges are even higher because of the larger dimensions. In any case a tighter machine control is needed. Lithography: For many applications of lithography the use of masks leads to limitations in flexibility and cost reduction. We will continue the development of technologies and concepts for maskless lithography for several applications. • Lithography for Flat Panel Display or Packaging requires 1 micron resolution and very high throughputs. Which combination of optical concepts, resist types and light sources is consistent and enables this? • For PCB markets the primary requirement is low cost. Resolution and throughput are somewhat less demanding. Are there cost efficient solutions? Light-Material interaction: The interaction of intense light beams with materials does not only lead to unwanted effects (damage), but also leads to new possibilities. However, the interactions become far more complex if the critical dimensions of the materials approach the wavelength of light. Better understanding of the interactions is required before the next wave of applications becomes within reach. • Is detection of sub-nm layers of contamination by means of multi-photon spectroscopy feasible?

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• The potential of super-lenses or lenses with both diffractive and refractive properties in a single component are only feasible if we first generate insight in the interaction mechanisms by means of a new type of simulations, then study the manufacturability, and then look for the right applications. The projects within this VP are completely in line with the Topsector High-Tech Systems and Materials and specifically within the Roadmap Semicon. The roadmap for TNO is graphically given below:

3.2 Project execution and results

Some projects in this domain in 2013 were Adaptive optics The main goal has become the evaluation of the contribution to the total system performance of each individual component. The effect of the operational temperature is identified to impact the performance of several components probably due to the packaging. The Plan of Work in 2013 was: 1) Detail system design; 2) Opto-mechanical design of sensor head; 3) Build test setup for each individual component; 4) Test each individual component: FBG, 3x3 interferometer, optical head; 5) Build total system; 6) Perform one functional test of the integrated system with one optical head; 7) Data processing. Activities 1-3 have been concluded. A design report “Fiber interferometer array for mirror deformation measurement” is made available as deliverable. Regarding activity 4: all individual components have been acquired and components which are identified to have impact to the system performance have been tested. Additional tests are required with special type 3x3 interferometers. Those interferometers are currently procured. Activities 5-7 were finished successfully. In addition to the performed activities two patent applications have been submitted. Additionally we have determined the temperature dependency of

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the individual components in the TNO Fiber Interferometer and changes in the thermal FBG of 0.1 pm over 14 h is demonstrated and we have developed a software for phase calculation and noise analysis to identify if there are any undesired frequency components in the test setup which have to be isolated. EUV sensor There is still a large need for a good sensor to measure the intensity of the EUV light. In 2013 a study has been done to measure the EUV power from the emission of photon power from the carbon target. A power sensor is designed accordingly and a testplan made for 2014. Light induced coating damage In the framework of the UV Level Sensor development activities at TNO test have shown that lifetime of broadband coated optics (AR and HR) is an issue even for relatively low power densities in the UV-DUV spectral range. DUV-UV induced contamination is one of the main issues in the typical experimental conditions, however a wider range of physical/chemical phenomenon can affect the performances of optics. Strategies to minimize the impact of these degradation mechanisms on optics exposed to UV are needed to increase the lifetime of instruments in different technology fields (litho, space), including reliable techniques to clean contaminated surfaces. The objective of this project is to make a step in the understanding of the degradation mechanisms and evaluate the effectiveness of the existing cleaning technology at TNO. The following activities have been planned: evaluate performance of a high performance UV BBAR coating after a full cycle of contamination + cleaning and evaluate the effectiveness and applicability of 2 different cleaning technologies for contaminated surfaces. In 2013 an E-gun contamination facility has been build and qualified as a collaborative effort between several projects including this one. The contribution of this project is related to the realization of the vacuum part and suitable cleaning parameters have been determined. After full cycle, central contamination is removed. Meta materials The last five years left handed materials or metamaterials get a lot of attention from a scientific point of view but only recently potential applications are being named view. Therefore we made an inventarization of (market) chances and technologies available. First conclusion is that this general technology does not yet has the readiness for application in commercial projects. The added value is still limited and production still has many issues to solve. But niches will be explored particularly on high resolution imaging.

Start sample After contamination with

e-gun vacuum setup. Time

of exposure: 3hrs

After cleaning in CD400

Plasma cleaning facility:

Time of exposure: 3 hrs

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4 Scientific Instrumentation

4.1 Introduction

The high-tech instrumentation industry in The Netherlands is of significant size and importance. This industry supplies instruments to almost all industrial sectors as well as to science, thus enabling advanced process control as well as advanced science. The VP1 Scientific Instrumentation aims to realize the TNO mission ‘to create innovations that boost the sustainable competitive strength of industry’ for the high-tech instrumentation industry. Specifically, we targeted three sectors in 2013: • Scientific instrumentation, in line with the HTSM Roadmap Advanced Instrumentation • Industrial instrumentation, in line with the HTSM Roadmap Advanced Instrumentation • Instruments for Life, in line with the HTSM Roadmap Healthcare Instrumentation for other sectors, such as Semicon, Process Industry, Oil & Gas and Defence is part of the respective VP’s. The VP Medical is aimed at research, rather than instrument development. The VP Scientific Instrumentation is part of the Semicon Program within the Theme Industrial Innovation, that operates on the basis of four clear principles. 1. Surprising Combinations. Real innovations can be realized by making surprising combinations of technologies or of market-and-technology. One specific aim of this VP is to create technology transfer between several (end) markets for instrumentation. 2. Pushing the Limits. The instruments developed at TNO are to be used in extreme environments of temperature, radiation, pressure et cetera with extreme requirements on quality, e.g. sensitivity, precision, data rate. 3. Make it Happen. For successful implementation, the full chain of technology supplier, module supplier, instrument supplier to end user is needed. Significant effort is put into ensuring such cooperation’s. 4. It’s all about sustainability. We strive to realize solutions that make productions processes more efficient and enable scientific breakthroughs to sustainable solutions. An innovation funnel is employed in order to use the limited resources effectively and efficiently. The first three phases can be financed (in part) from this VP. 1. Quick Scan. It is briefly checked that a proposed project solves a real industrial question and is likely to deliver value. Also, the technical feasibility is checked on paper. And it is ensured that intellectual property can be attained and protected – of vital importance for our partners. Finally, the major risks are assessed and potential mitigation measures are defined. 2. Validation. In case of a positive Quick Scan, a budget is assigned to a small validation study, which is typically used to demonstrate the technical feasibility of the idea experimentally. Such a demonstration is necessary to ensure the cooperation of partners. Only in case of a 10% cofinancing, some companies are willing to invest in this phase. 3. Demonstration. When the idea is validated experimentally and a partner is found that is willing and able to support and codevelop an idea, the demonstration phase is entered. A functional model (bread board, pre-prototype) is (co)developed and demonstrated.

1 VP: Vraaggestuurd Programma = Question-Driven Program

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Result of registration of images; M=maginification

Small sensor can detect the smallest sound

Plasma cleaning

Further stages include product development, testing and finalizing as well as marketing and after sales. TNO may support these phases in Business-to-Business contracts. In this report, we cannot go into the details of all Quick Scans due to confidentiality issues and limit the report to phase 2 and 3.

4.2 Project execution and results

4.2.1 Scientific Instrumentation Clean mirrors in nuclear fusion In nuclear fusion, many diagnostic tools are used to understand and control the plasma. Typically, these contain a ‘first mirror’, that collects a certain optical signal and reflects it into the diagnostic tool, while separating that tool from the extreme plasma conditions. As a result, the first mirror becomes contaminated rapidly. • Results: We have employed plasma technology (see image) developed at TNO for lithography to clean these mirrors. Also, we validated the use of other contamination control measures that reduce the contamination rate. Thus, we enable the realization of nuclear fusion, a sustainable energy source. • Phase: Validation. • PPS/Partners: ITER.NL-2 / FOM; TU/e; NRG. Industrial partners to be included in 2014. • 2014: We are actively seeking industrial partners to enter the next phase. The challenge is to design and tests solutions within the tight requirements of the ITER-project. Listening to neutrinos In 2016, the first phase of KM3-net is to be realized in the depths of the Mediterranean Sea. Its purpose is to detect the rare collision of neutrinos with matter. Extremely sensitive sensors are needed for this purpose. A surprising way to do this is to listen, as the shock wave produced by the collision produces a small acoustic signal.

• Results: A fiber-optical sensor has been designed, realized and tested (see image). We have shown that this sensor is sufficiently sensitive and that its signal-to-noise ratio is better than that of current sensors. Also, we expect that the production cost of the fiber-solution is a factor ten lower.

• Phase: Validation. • PPS/Partners: None. • 2014: We are actively seeking industrial partners to enter the next phase. The challenge is to demonstrate industrial production process and compensation for extreme high pressures.

Overlaying images For a better understanding of images of different types, it is valuable to ‘overlay’ or register those images digitally. This is extremely challenging, due to significant differences in magnification and angle of entry between the different techniques as well as within the images.

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OCT results obtained in 0.2 s

Het Huygenshuis: room(s) for all

A tool for fast, cheap production of FBG’s

• Results: Algorithms have been developed for the registration of images of the same sources and of different sources. Some of them are already applied by the industrial partner involved. • Phase: Demonstration. • PPS/Partners: Third phase cofinanced project/Dutch instrument supplier. • 2014: This work is finished. The technology has also been applied in registration of daylight and infrared images and comparable problems. Het Huygens Huys The Dutch government invests more than 100 M€/year in Big Science projects such as CERN, SKA, ESO and ITER. The Dutch landscape of activities for Big Science is rather scattered, resulting in a low return on investment for several projects, including ITER, CERN and ESRF. We aim to build ‘Het Huygens Huys’, a platform for Dutch Industries and academics with the aim to double the return on investment and ensure spin-off of the technologies developed. • Results: A round table discussion was held with ~30 partners, mostly from industry. The outlines for ‘Het Huygens Huys’ were drafted. • Phase: Validation. • PPS/Partners: More than 20 companies are involved, open for all high-tech parties. • 2014: We expect to start HHH in 2014 with a significant number of industries and NWO.

4.2.2 Industrial Instrumentation 100% in line inspection in mass production Mass production in Europe can be profitable when using high quality, efficient production processes with ‘Zero Defects’. This cuts costs and is more sustainable. For ‘Zero Defects’, it is necessary to monitor each part produced on size and shape to the micrometer. We have developed an inspection method based on Optical Coherence Tomo-graphy that achieves this resolution (~1 µm) at the rate required (1

part per 0.2 s) and demonstrated it in the lab. • Phase: Validation/demonstration. • PPS/Partners: MEGsFIT, HiPr/Philips Drachten and others; EU-financed project. • 2014: We will demonstrate the technology in a pilot line and aim for a project to implement it with the end customer and a SME that specializes in industrial instrumentation. Also, we have found a lot of interest to implement it in other production processes. Cheap production of high quality FBG’s FBG’s, Fiber Bragg Gratings in optical fibers, offer a generic solution for sensing almost any parameter to high precision and sensibility. The optical fibers is used both as ‘power line’ and for data transport, making installation easy. Also, the fiber is insensitive to electromagnetic fields, cannot cause explosions and withstands harsh conditions.

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Mock-up model of BLISS

FBG-fiber in hot oven

PITON: needle insertion

The cost of the fibers with FBG, however, is limiting its application. Also, FBG quality varies too much and production times are unacceptable. We have designed and demonstrated a tool for semi-automated fast production of affordable, constant quality FBG’s. • Phase: Demonstration. • PPS/Partners: Laser producer Coherent (Ch) and phase mask producer Ibsen (Dk) are involved in the marketing of the production. • 2014: We are seeking a Dutch SME for production and sales of the tool. Cheap production of high quality FBG’s FBG’s consists of an Fiber Bragg Grating, written in an optical fiber. It was long believed that such a fiber cannot be used at high temperatures. However, we demonstrated that a high temperature treatment ensures that the fibers can be used at 700°C without significant drift. Thus, we have put to use scientific research on this subject. • Phase: Demonstration. • PPS/Partners: None. • 2014: Possible applications in high temperature industrial processes are being discussed.

4.2.3 Instruments for Life BLISS at the GP’s practice A GP, or General Practitioners diagnoses a large number of patients on a daily base. Often, this diagnoses is supported by (lab) measurements. It would be advantageous to perform these measurements immediately during the consult. This would reduce patient anxiety as well as that of the GP. Also, it is expected to reduce the number of hospital visits considerable, thus cutting overall health care cost. Indeed, a large number of tests has been developed. However, the GP does not employ many tests, because of concerns on quality and also because of the complexity of the use of so many different tests, each with its own user unfriendliness and the consequent risk on mistakes. We have developed the concept of BLISS, a suitcase containing all relevant test, quality certification and one user interface with extremely simple operating software (compare the AED-device). BLISS has attracted a lot of interest of the stakeholders. • Phase: Validation. • PPS/Partners: BLISS/UMCM, …. • 2014: Investors and codevelopers need to be found. Enabling minimal surgery In surgery, a strong trend is towards minimal invasive surgery (MIS), allowing precise and even tele-operated procedures that inflict as little as possible tissue damage to the patient, thus improving his recovery time. We develop specific technology for a number of applications with industrial and academic partners.

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i-OCT: detecting eye-illnesses

IMIT: FBG force feedback sensor

• Results: We have realized several demonstrators for relevant technologies. These include a robot for inserting a MRI compatible steerable needle (PITON, see figure), a parallax endoscope for 3D –vision in MIS (BOEM) and an idea for a magnetic in-body sensor based on a fiber optic sensor. Also, we have developed adaptive optics technology for improved OCT (iOCT) in eye-surgery and a small fiber optic-based sensor for force feedback in medical and remote handling application (IMIT). • Phase: Demonstration. • PPS/Partners: STW-PITON/DEAM (coordinator), TNO, TUD, TU/e, UMC-U, Technobis and Hemolab. BOEM/Pontes (coordinator), DEAM IOP: i-OCT/AMC (coordinator), Focal, TU Delft STW: IMIT/TU Delft (coordinator), Erasmus MC/AMC. • 2014: This research line is to be finished in 2015 as it no longer fits the TNO strategy. We are actively seeking partners to industrialize the products. Optical detection of skin diseases Even for experienced dermatologists, it is very difficult to diagnose skin alterations. We have started a project to enable the diagnosis of skin cancers with Raman-technology. • Result: The project has started only recently. • PPS/Partners: IOP: i-OCT/Erasmus MC, Leiden Universitair Medisch Centrum, Philips, Avantes, RiverD International, TU Delft. • 2014: The project will continue in 2104.

4.3 PPS and Connection to Topsectors

The VP Scientific Instrumentation is closely connected to the HTSM Topsector, specifically to the Roadmaps of Advanced Instrumentation and that of Healthcare. The healthcare Roadmap within the HTSM Topsector focusses largely on instrumentation. Within the traditional organization of TNO, these instrumentation applications were organized within one VP. This will be adapted in 2015, 2014 being a year of transition. Much of the work in this VP is already done in a Public Private PartnersShip (PPS) as can be seen in chapter 2. In 2013, both Het Huygens Huys and BLISS have been initiated by TNO as well as I-RASKIN, an IOP project.

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5 Semicon Equipment Portfolio

A number of new ideas investigated in this program will be described. Project Interrogator-on-chip Sensors based on Fiber Bragg Gratings (FBGs) are attractive in many applications, in particular for their high sensitivity, versatility, compatibility with harsh environments and immunitiy to electrical interference. Moreover, many sensors can be multiplexed on a single fiber, and read-out can be done at large distance from the sensor itself. However, the read-out unit (‘interrogator’) for FBGs is typically expensive (10s of kEUR), and large (> 1000 cc). The goal of this project is to integrate all the optics for a multi-channel FBG read-out unit on a single chip, providing an outlook to small-size and low-cost interrogator systems. An interrogator-on-chip has been designed end 2011, the design was submitted to Oclaro for fabrication in Indium Phosphide, in the framework of the PARADIGM program. The optical circuit (4x6 mm) consists of a single optical input, demultiplexed into 8 channels by an Arrayed Waveguide Grating (AWG), with for each channel a 3-port interferometer with on-chip photodiodes. The interferometer provides the high resolution (aim sub-pm) while the AWG enables multi-channel operation and coarse resolution (to identify the period number of the interferometer). Due to an error during chip fabrication at Oclaro (lithography parameter ‘optimization’) the waveguides have serious side wall roughness, which has two consequences: 1) optical losses are excessive, up to several 10s of dBs per centimeter, depending on the orientation on the chip, and 2) risk of polarization mixing. Still, in spite of the huge losses we were able to verify that the circuit works. We were offered the opportunity to participate in another fabrication run by Smart Photonics. Due to size restrictions and the pre-defined locations for active components in this run, some re-layouting was necessary, but the main circuit is essentially the same. The design was submitted end of June, and the fabricated chips were received early November and the correct operation of the chip was confirmed.

Figure: Mask layout (left) and measurement (right) of the redesigned chip

EU project FIREFLY The aim of the FIREFLY project is to develop new components and processing technologies for optical data transmission over short distances, e.g. in a photonic

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integrated circuit. Two main objectives for TNO in 2013 were the design of moulds and masks for demonstrators, and the development of photonic crystal (PhC) structures for the bending of light in a waveguide. In close cooperation with TE Connectivity, the Optics department succeeded in making fibre coupling blocks, that will be used for the coupling of polymer waveguides with glass fibres; see Figure below.

Figure: Mask layout for the alignment blocks

In addition, wafers with VCSEL pockets have been made for demonstrators in which light from VCSELs will be coupled into waveguides. The departments of Responsive Materials and Coatings has made good progress in the preparation of PhC structures by making crystals of titania nanoparticles on an imprinted polymer substrate. The biggest challenge for 2013 was to make a cubic stack of particles (Figure below) in an upscalable way. Several techniques have been tried, of which a sedimentation techniques shows the best stacking of particles, but it is a very slow process. A printing technique is being explored for the upscaling. The next Figure shows an example of cubic stacking of particles on an imprinted substrate.

Figure: Model of a cubic stack for light bending Figure: Nanoparticles on a structured substrate

In 2014 the aim is to improve the PhC structure, integrate it with a waveguide and show the bending of light in this waveguide. Spatial Roll-to-Roll ALD In the past years TNO has developed new technology for spatially-separated atomic layer depostion. Besides speeding up the process by several factors, significantly less material used to reach the required metal layer quality and quantity. This development has led to the spin-off company SoLayTec.

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TNO is developing a Roll-to-Roll spatial ALD reactor consisting of a central drum that contains one or more combinations of TMA and water half-reaction zones35. These zones are separated and surrounded by nitrogen gas bearings. The foil to be coated is pulled over this drum, where the gas bearing ensures that the foil is kept at a fixed distance from the surface of the drum (typically tens to hundreds of micrometers). If the foil is then moved over the drum, ALD deposition will take place, where the total thickness is determined by the number of half-reaction zone pairs that the foil passes. Higher deposition rates can be achieved if the drum is rotated in the opposite direction of the movement direction of the foil. In this manner, the total thickness is determined by the rotation frequency of the drum in combination with the translation speed of the foil. One main benefit of this Roll-to-Roll concept is that there is no mechanical contact between the deposition side of the foil and the reactor and that there is a minimum of moving parts. This minimizes contamination of the foil with particles that would lead to pinholes in the deposited films and; consequently, to deterioration of the barrier function. In this project a small-scale prototype reactor was realized to learn the challenges when applying this technology on flexible surfaces as well as serving as a demonstrator to possible future clients. Qualification testing revealed that the reactor works according to specification. Next steps in the coming year will be to develop several recipes for showcasing different applications. This will be done under the Holst Centre-ALD-program.

The portfolio program also supported two EU projects in the photonics domain. FP7 ESSenTIAL As the key role of TNO in the scope of Photonic Integrated Circuits is to enable the industrial take-up of this technology, lowering the entry costs for the customers and increasing the awareness within possible end users has become its top priority. In the FP7-ESSenTIAL project (2011-2014), TNO coordinates the outreach efforts of the consortium, organizes outreach events and provides feasibility studies, which are free-of-charge for European Small and Medium Enterprises (SMEs). The main outreach efforts from TNO have been focused in contacting through different channels the potential new users of Silicon Photonics technology, in the Netherlands, Europe and worldwide.

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On 2nd of July, Jose Pozo gave an invited talk at the industrial session of the ICTON conference entitled “ESSenTIAL: EPIXfab Services specifically targeting (SME) Industrial Take up of Advanced silicon photonics”, in which the means of access to affordable standardized active and passive silicon photonic IC and packaging technology of ePIXfab was explained. Furthermore, TNO took an active part on the workshop “Low-Cost Open Access to Photonic Integration Technology - 4th European Photonic Integration Forum”, coorganized by ePIXfab. The integrated photonics activity at TNO took strong effort on the announcement and dissemination of the ePIXfab services at Photonics West (2-7 February, San Francisco), ECOC (22-26 September, London), and IEEE Leos Benelux Chapter (25-26 November, Eindhoven). Between 24-28th of March 2013, TNO organized the ePIXfab training course, which had very highly represented by industrial partners, such as VLC Photonics, Technobis Fiber Technologies, CMC and MOSIS. Finally, TNO is taking the lead on the organization of the workshop “How to Create a Photonic SME” (http://photonicsme.eu). The workshop will be held on Sunday, June 23rd in Cartagena, Spain. The purpose of this workshop is to inform the would-be entrepreneurs with a scientific background in photonics about the reasons, opportunities and risks on the path towards starting their own companies. The audience will have the opportunity to hear first-hand expert stories on how to plan, devise a strategy and implement new company ideas. Examples of successful Photonic SMEs will be presented by the invited CEO’s. The CEO’s of those Photonic SMEs are users of the integrated photonic services, such as VLC Photonics (focused on acting as a design house for ePIXfab among other integrated photonic platforms), Medlumics (using integrated photonic technology for diagnostic imaging) and Aragon Photonics (developer of high end characterization equipment). The keynote speaker will be Milton Chang, one of the most successful entrepreneurs worldwide in the field of Photonics technology, the former president of New Focus and Newport and author of the bestselling book ‘Establishing A Successful Technology Business’. He will be followed on stage by speakers of the level of Laurent Malier (CEA - LETI), Carlos Lee (EPIC), Géraldine Andrieux-Gustin (Yole Finance), Erik Pennings (7 Pennies), Hans van den Vlekkert (LioniX) and many more. FP7 PLAT4M The European project FP7 Plat4M (Photonic Libraries And Technology for Manufacturing) focuses on bringing the existing silicon photonics research platform to a level that enables seamless transition to industry, suitable for different application fields and levels of production volume. Under this project’s umbrella, NXP and TNO work together on one of the test-vehicles, being the development of a multichannel sensor for monitoring CO2, relative humidity and temperature. Such sensor will be compatible with current CMOS sensing platform of NXP and will satisfy the market driven specifications of smart buildings and the automotive industry. The novel photonic sensor transducers are based on optical ring resonators fabricated in silicon photonics technology. Different gas sensitive chemical coatings, responding to the target gasses, are applied on the optical resonating circuits. During a sensing event, the refractive index contrast between the waveguides and the claddings changes, which results in a shift in the resonance as a function of the concentration of the target gas. TNO realized the test circuit. It was fabricated at imec in the framework of ePIXfab. The laser input is distributed over 6 ring resonators and a 3-port interferometer. This 3-port interferometer has the goal of determining the wavelength of the laser input at any given time. The interferometer has three outputs at a 120º mutual phase difference, for the following reasons: 1) At any input wavelength, at least one output

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has considerable amplitude and derivative with respect to wavelength. 2) The combined outputs enable unambiguous tracking over wavelength spans larger than the Free Spectral Range (FSR). In comparison, a 2-port interferometer has two 180º out-of-phase outputs, and the sign of change is unknown at the boundaries of one FSR range, where the output derivatives to wavelength are zero. 3) It is insensitive to the modulation depth of the interference. The test circuit with rings and interferometer is included in a larger chip design, containing a large variety of ring resonators and related components. Characterizing the chip, we found that the circuit works well. Using a normalization procedure, we found that the wavelength accuracy provided by the interferometer signals is just below 1% of the interferometer periodicity of 250 pm, so about 2 pm.

This gives us a target for adjusting the interferometer path length for the next iteration. In addition, we have designed a dedicated chip for the Plat4M project, which will be fabricated in the imec ISIPP25G technology. In short, this technology integrates passive waveguides with modulators, and SiGe photo diodes. The entire chip will be covered by an oxide layer in which

openings are defined, so that sensor elements are exposed to the environment. This technology enables us to have optimal shielding of reference sensors by means of this oxide layer. Our circuit will be similar to the previous test circuit, but now with integrated photodiodes, so only a single optical connection is needed, and eight straightforward electrical connections. As an additional benefit, we expect the integrated detectors to reduce residual reflections, and as such to achieve a better performance. The figure shows the submitted mask design.