Upload
doankhanh
View
223
Download
1
Embed Size (px)
Citation preview
SAMA5D27 SOM1 SAMA5D27 MPU, 1Gbit (128MB) DDR2 SDRAM, 10/100
Ethernet PHY, 64Mbit (8MB) Flash, Power Management IC,1Kbit EEPROM
Introduction
The Microchip SAMA5D27 SOM1 is a small single-sided System-On-Module (SOM) based on the high-performance System-in-Package 32-bit Arm Cortex-A5 processor-based MPU SAMA5D27 and 1GbDDR2 SDRAM running up to 500 MHz.
The SAMA5D27 SOM1 is built on a common set of proven Microchip components to reduce time tomarket by simplifying hardware design and software development.
The SOM also limits design rules of the main application board, reducing overall PCB complexity andcost. The SAMA5D27 SOM1 is delivered with a free Linux distribution and bare metal C examples.
Figure 1.SAMA5D27 SOM1
Features
System-In-Package (SAMA5D27C-D1G-CU) including: Arm Cortex-A5 processor-based SAMA5D2 MPU 1Gbit DDR2 SDRAM
On-Board Power Management Unit (MIC2800-G1JJYML) 1Kb Serial EEPROM with EUI-48 Node Identity (24AA02E48T-I/OT)
2017 Microchip Technology Inc. Datasheet DS60001521A-page 1
64Mb Serial Quad I/O Flash Memory (SST26VF064BT-104I/MF) 10Base-T/100Base-TX Ethernet PHY (KSZ8081RNAIA) 40 x 38 mm Module, Pitch 0.8mm, solderable by hand 103 I/Os Up to 7 Tampers One USB Device, one USB Host and one HSIC Interface Shutdown and Reset Control Pins Independent Power Supplies Available for Camera Sensor, for SD Card and for Backup depending on
Voltage Domains Operational Specifications:
Main operating voltage: 3.3V 5% Temperature range: -40C to 85C Integrated crystals, internal voltage regulators Multiple interfaces and I/Os for easy application development
Applications
Industrial Applications Motor Control Human Machine Interface Home Automation
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 2
Table of Contents
Introduction......................................................................................................................1
Features.......................................................................................................................... 1
Applications..................................................................................................................... 2
1. Description.................................................................................................................5
2. Reference Documents...............................................................................................6
3. Block Diagram........................................................................................................... 7
4. Pinout........................................................................................................................ 84.1. Pinout Overview........................................................................................................................... 84.2. Pin List .........................................................................................................................................9
5. Functional Description............................................................................................. 165.1. SAMA5D27 System-In-Package................................................................................................ 165.2. Power Supplies.......................................................................................................................... 185.3. System Control...........................................................................................................................185.4. Ethernet PHY............................................................................................................................. 195.5. QSPI Memory.............................................................................................................................205.6. EEPROM Memory......................................................................................................................21
6. Power Supply Connections and Timing Sequences................................................236.1. Power Supply Configuration #1..................................................................................................236.2. Power Supply Configuration #2..................................................................................................246.3. Power Supply Configuration #3..................................................................................................266.4. Power Supply Configuration #4..................................................................................................27
7. Booting Guidelines.................................................................................................. 307.1. Boot Process..............................................................................................................................307.2. Boot Configuration......................................................................................................................307.3. NVM Programming.....................................................................................................................317.4. Boot From External Memory...................................................................................................... 31
8. Debug Considerations............................................................................................. 33
9. Electrical Characteristics......................................................................................... 349.1. Absolute Maximum Ratings........................................................................................................349.2. Operational Characteristics........................................................................................................349.3. DC Electrical Characteristics......................................................................................................35
10. Mechanical Characteristics......................................................................................3710.1. Module Dimensions....................................................................................................................3710.2. Module Land Pattern..................................................................................................................38
2017 Microchip Technology Inc. Datasheet DS60001521A-page 3
11. Reflow Profile.......................................................................................................... 40
12. Ordering Information................................................................................................41
13. Revision History.......................................................................................................42
The Microchip Web Site................................................................................................ 43
Customer Change Notification Service..........................................................................43
Customer Support......................................................................................................... 43
Product Identification System........................................................................................44
Microchip Devices Code Protection Feature................................................................. 44
Legal Notice...................................................................................................................44
Trademarks................................................................................................................... 45
Quality Management System Certified by DNV.............................................................45
Worldwide Sales and Service........................................................................................46
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 4
1. DescriptionThe SAMA5D27 SOM1 is a high-performance System-On-Module based on the 32-bit ARM Cortex-A5RISC SAMA5D2 processor. The SAMA5D27 SOM1 is certified for industrial operating conditions over a-40 to 85C temperature range.
The system of the SAMA5D27 SOM1 operates at a maximum CPU operating frequency of 500 MHz anda maximum bus speed of 166 MHz. It features up to:
1 Gbit of DDR2 SDRAM memory (SAMA5D27C-D1G-CU) 1 Kb of EEPROM memory (24AA02E48T-I/OT) with EUI-48 64 Mb of QSPI Flash (SST26VF064BT-104I/MF) memory
The SAMA5D27 SOM1 is a 176-pin, 0.8mm pad pitch module with a 40mm x 38mm size.
The SAMA5D27 SOM1 offers an extensive peripheral set, including High-speed USB Host and Device,HSIC Interface, 10Base-T/100Base-TX Ethernet Interface, system control and up to 103 I/Os featuring:
Up to 4 UARTS Up to 4 Flexcoms Up to 6 Capactive Touch lines for up to 9 touch buttons Up to 4 ADC Inputs Up to 2 CAN Up to 7 Tamper Pins Serial Interfaces such as SPI, TWI, QSPI, SSC and IS SD/MMC, eMMC, SDIO Interfaces Up to 24-bit LCD RGB Interface CMOS Camera Interface Mono PDMIC and Full-Bridge Class-D Stereo
Tip: Each I/O of the SAMA5D27 SOM1 is configurable, as either a general-purpose I/O lineonly, or as an I/O line multiplexed with up to six peripheral I/Os. As the multiplexing is hardware-defined, the hardware designer and programmer must carefully determine the configuration ofthe PIO Controllers required by their application.
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 5
2. Reference DocumentsThe SAMA5D27 SOM1 is equipped with various Microchip silicon devices. The relevant documentation islisted in the table below.
Type Document Title Available Ref. No./Product
Datasheet SAMA5D2 www.microchip.com/SAMA5D2 DS60001476
Datasheet SAMA5D2 System-In-Package(SIP)www.microchip.com/
SAMA5D2 SIP DS60001484
Datasheet Serial EEPROMs with EUI-48Node Identitywww.microchip.com/
24AA02E48 24AA02E48T-I/OT
Datasheet 10BASE-T/100BASE-TXEthernet PHY www.microchip.com/ksz8081 KSZ8081RNAIA
Datasheet Serial Quad I/O (SQI) FlashMemorywww.microchip.com/
sst26vf064b SST26VF064BT-104I/MF
Datasheet Digital Power Management IC www.microchip.com/mic2800 MIC2800-G1JJYML
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 6
http://www.microchip.com/design-centers/32-bit-mpus/sama5-new/sama5d2-serieshttp://www.microchip.com/design-centers/32-bit-mpus/sama5-new/sama5d2-serieshttp://microchip.com/sama5d2sipshttp://microchip.com/sama5d2sipshttp://www.microchip.com/wwwproducts/en/24AA02E48http://www.microchip.com/wwwproducts/en/24AA02E48http://www.microchip.com/wwwproducts/en/ksz8081http://www.microchip.com/wwwproducts/en/sst26vf064bhttp://www.microchip.com/wwwproducts/en/sst26vf064bhttp://www.microchip.com/wwwproducts/en/mic2800
3. Block DiagramFigure 3-1.SAMA5D27 SOM1 Block Diagram
MPU + DDR2 1GbSAMA5D27C-D1G-CU
LFBGA289
64Mbit Serial QUAD I/OFlash Memory
SST26VF064BT-104I/MF
1K Serial EEPROMwith EUI-48 Node Identity
24AA02E48T-I/OT
10BASE-T / 100BASE-TXPHY With RMII Support
KSZ8081RNAIA
Power ManagementUnit
MIC2800-G1JJYML
VDDSDHC VDDISC VDDBU
MAIN3.3V
TWI Interface
103 I/O Available
CLA
SS-D
Ste
reo
eMM
C In
terfa
ce
QSP
I Int
erfa
ce
Cam
era
Inte
rface
Up
to 6
* PT
C B
utto
ns
Up
to 4
* AD
C In
puts
TWI I
nter
face
Up
to 4
* U
ART
2 * S
PI In
terfa
ces
Up
to 4
* FL
EXC
OM
LCD
Inte
rface
up
to 2
4-bi
t
SSC
Inte
rface
Mon
o PD
MIC
Inte
rface
Up
to 2
* C
AN
IS In
terfa
ce
SDIO
Inte
rface
SD-C
ARD
Int
erfa
ce
ExternalQSPI
Connection
JTAG & DBGU Interfaces DEBUG
SYSTEM
MISC
USB Dev.
USB Host
HSIC
BACKUP7 * PIOBU
RXDWAKEUPRESET
SHUTDOWN
CLK_AUDIO
COMPP / COMPN
Disable Boot
USB Device Connector
USB Host Connector
HSIC Device
PhysicalReceiver
TransceiverInterface
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 7
4. Pinout
4.1 Pinout OverviewThe categories of pins are listed below:
Red: Power Supplies Black: Ground Blue: Signals Orange: Reserved for future use
Figure 4-1.SAMA5D27 SOM1 Pinout Overview
PC03
/LCD
PWM
/TIO
A1/S
PI1_
MIS
O/I2
SWS0
PB01/SPI0_SPCK/PWML1/CLASSD_R0
PB04/UTXD4/FIQ/CLASSD_R3
PC09/FIQ/ISI_D0/TIOA4PC12/ISI_D3/URXD3/TK0/A1
PC16
/ISI_
D7/R
K0/A
5
RFU2
RFU1
PC11
/ISI_
D2/T
CLK4
/CAN
RX0/
A0/N
BS0
PC18
/ISI_
D9/F
LEXC
OM3_
IO2/
A7
GND_
20
PB28
/LCD
DAT1
7/FL
EXCO
M0_
IO0/
TIOA
5
PB29
/LCD
DAT1
8/FL
EXCO
M0_
IO1/
TIOB
5
PB30
/LCD
DAT1
9/FL
EXCO
M0_
IO2/
TCLK
5
PB31
/LCD
DAT2
0/FL
EXCO
M0_
IO3
PC00
/LCD
DAT2
1/FL
EXCO
M0_
IO4
PC01
/LCD
DAT2
2/CA
NTX0
/SPI
1_SP
CK/I2
SCK 0
PC02
/LCD
DAT2
3/CA
NRX0
/SPI
1_M
OSI/I
2SM
CK0
PC07
/LCD
PCK/
TWCK
1/SP
I1_N
PCS3
/URX
D1
PB13
/LCD
DAT2
/PCK
1
PB14
/LCD
DAT3
/TK1
/I2SM
CK1
PB15
/LCD
DAT4
/TF1
/I2SC
K1
PB16
/LCD
DAT5
/TD1
/I2SW
S1
PB17
/LCD
DAT6
/RD1
/I2SD
I1
PB18
/LCD
DAT7
/RK1
/I2SD
O1
PB19
/LCD
DAT8
/RF1
/TIO
A3
PB20
/LCD
DAT9
/TK0
/TIO
B3/P
CK1
PB21
/LCD
DAT1
0/TF
0/TC
LK3/
FLEX
COM
3_IO
2
PB23
/LCD
DAT1
2/RD
0/TI
OB2/
FLEX
COM
3_IO
0
PB24
/LCD
DAT1
3/RK
0/TC
LK2/
FLEX
COM
3_IO
3
PB25
/LCD
DAT1
4/RF
0/FL
EXCO
M3_
IO4
PB26
/LC D
DAT1
5/UR
XD0
PB27
/LCD
DAT1
6/UT
XD0
PB11
/LCD
DAT0
/URX
D3/P
DMDA
T0
PB12
/LCD
DAT1
/UTX
D3/P
DMCL
K0
PB05
/TCL
K2/P
WM
H2/Q
SPI1
_SCK
PB07
/TIO
B2/P
WM
H3/Q
SPI1
_IO0
PB09
/TIO
A3/P
WM
FI1/Q
SPI1
_IO2
PB10
/TIO
B3/P
WM
EXTR
G1/Q
SPI1
_IO3
PC08
/LCD
DEN/
FIQ/P
CK0/
UTXD
1
GND_
24
GND_
23
GND_
22
GND_
21
PC22/ISI_VSYNC/FLEXCOM3_IO4/A11
PC14/ISI_D5/TD0/A3
PC20/ISI_D11/FLEXCOM3_IO0/A9
PC15/ISI_D6/RD0/A4PC24/ISI_MCK/A13
SHDN
VDDIN_3V3VDDIN_3V3
VDDISC
PD22/EEPROM_TWCK_PD22PD21/EEPROM_TWD_PD21
PD03/UTXD1/FIQ/NWAIT/PTCROW0
PD04/TWD1/NCS0/PTCROW1
PD05/TWCK1/NCS1/PTCROW2PD06/PCK1/NCS2/PTCROW3
PD07/NWR1/NBS1/PTCROW4
PD08/NANDRDY/PTCROW5
GND_04
GND_06
PD24/UTXD2/AD5PD23/URXD2/AD4
GND_03
RXD
ETH_RXMETH_RXP
ETH_LED0
ETH_TXMETH_TXP
GND_05
PC10/ISI_D1/TIOB4/CANTX0
PC13/ISI_D4/UTXD3/TF0/A2PC17/ISI_D8/RF0/A6
PC19/ISI_D10/FLEXCOM3_IO1/A8PC21/ISI_PCK/FLEXCOM3_IO3/A10
PD26/AD7PIOBU1
GND_00
GND_01
GND_02
GND_
09
PD27
/JTA
G_TC
K
PD28
/JTA
G_TD
IPD
29/J
TAG_
TDO
PD30
/JTA
G_TM
S
PIO
BU7
PA11
/SDM
MC0
_VDD
SEL/
TCLK
4/A2
2/NA
NDCL
E
PA00
/SDM
MC0
_CK/
QSPI
O0_S
LK/D
0
PA06
/SDM
MC0
_DAT
4/TI
OA5/
FLEX
COM
2_IO
0/D6
PA07
/SDM
MC0
_DAT
5/TI
OB5/
FLEX
COM
2_IO
1/D7
PA08
/SDM
MC0
_DAT
6/TC
LK5/
FLEX
COM
2_IO
2/NW
E/NA
NDW
EPA
09/S
DMM
C0_D
AT7/
TIOA
4/FL
EXCO
M2_
IO3/
NCS3
PA10
/SDM
MC0
_RST
N/TI
OB4/
FLEX
COM
2_IO
4/A2
1/NA
NDAL
E
GND_
07
VDDB
U
PD19
/PCK
0/TW
D1/A
D0PD
20/T
IOA2
/TW
CK1/
AD1
PIO
BU3
CLK_
AUDI
OnR
ST
PA03
/SDM
MC0
_DAT
1/QS
PI0_
IO1/
D3
PA02
/SDM
MC0
_DAT
0/QS
PI0_
IO0/
D2PA
04/S
DMM
C0_D
AT2/
QSPI
0_IO
2/D4
PA05
/SDM
MC0
_DAT
3/QS
PI0_
IO3/
D5
PIO
BU5
PIO
BU6
PIO
BU4
WKU
P
PIO
BU2
GND_
10
GND_
08
GND_
15
RFU0
PD25/AD6
PD01/A24
PC26/CANTX1/A15PC27/PCK1/CANRX1/A16
PC28/FLEXCOM4_IO0/PCK2/A17PC29/FLEXCOM4_IO1/A18
PC30/FLEXCOM4_IO2/A19PB00/SPI0_MOSI/PWMH1
PA14/SPI0_SPCK/TK1/QSPI0_SCK/I2SMCK1/FLEXCOM3_IO2/D9
PA15/SPI0_MOSI/TF1/QSPI0_CS/I2SCK1/FLEXCOM3_IO0/D10
PA16/SPI0_MISO/TD1/QSPI0_IO0/I2SWS1/FLEXCOM3_IO3/D11
PA17/SPI0_NPCS0/RD1/QSPI0_IO1/I2SDI1/FLEXCOM3_IO4/D12
PA18/SPI0_NPCS1/RK1/QSPI0_IO2/I2SDO1/SDMMC1_DAT0/D13PA20/SPI0_NPCS3/TIOB0/SDMMC1_DAT2/D15
PA22/FLEXCOM1_IO2/SPI1_SPCK/SDMMC1_CK/QSPI0_SCK
PA25/FLEXCOM1_IO3/SPI1_NPCS0/QSPI0_IO1
PA26/FLEXCOM1_IO4/SPI1_NPCS1/QSPI0_IO2
PB03/URXD4/IRQ/PWMEXTRG0/CLASSD_R2PB02/PWMFI0/CLASSD_R1
PA21/PCK2/IRQ/TCLK0/SDMMC1_DAT3/NANDRDY
PA27/TIOA1/SPI0_NPCS2/SPI1_NPCS2/SDMMC1_RSTN/QSPI0_IO3
PA23/FLEXCOM1_IO1/SPI1_MOSI/QSPI0_CS
PA24/FLEXCOM1_IO0/SPI1_MISO/QSPI0_IO0
GND_19
DIS_BOOTPB06/TIOA2/PWML2/QSPI1_CSPB08/TCLK3/PWML3/QSPI1_IO1
PD00/FLEXCOM4_IO4/UTXD3/A23
PA12/SDMMC0_WP/IRQ/NRD/NANDOEPA13/SDMMC0_CD/FLEXCOM3_IO1/D8
PA28/TIOB1/SPI0_NPCS3/SPI1_NPCS3/SDMMC1_CMD/CLASSD_L0PA29/TCLK1/SPI0_NPCS1/SDMMC1_WP/CLASSD_L1
PA30/SPI0_NPCS0/PWMH0/SDMMC1_CD/CLASSD_L2PA31/SPI0_MISO/PWML0/CLASSD_L3
GND_17
GND_16
GND_18
PA01
/SDM
MC0
_CM
D/QS
PI0_
CS/D
1GN
D_14
PD02/URXD1/A25
COM
PPCO
MPN
USBA
_MUS
BA_P
GND_
11VD
DSDH
C
USBB
_MUS
BB_P
STRO
BEDA
TA
GND_
13
GND_
12
PA19/SPI0_NPCS2/RF1/QSPI0_IO3/TIOA0/SDMMC1_DAT1/D14
PC31/FLEXCOM4_IO3/URXD3/A20
PC04
/LCD
DISP
/TIO
B1/S
PI1_
NPCS
0/I2
SDI0
PC05
/LCD
VSYN
C/TC
LK1/
SPI1
_NPC
S1/I2
SDO0
PC06
/LCD
HSYN
C/TW
D1/S
PI1_
NPCS
2
PB22
/LCD
DAT1
1/TD
0/TI
OA2/
FLEX
COM
3_IO
1
PC23
/ISI_
HSYN
C/A1
2
PC25
/ISI_
FIELD
/A14
1
5
10
15
20
25
30
35
40
42
43 45 50 55 60 65 70 75 80 85 88
8990
95
100
105
110
115
120
125
130
176
131
135
140
145
150
155
160
165
170
175
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 8
4.2 Pin ListThe pin list of the SAMA5D27 SOM1 is provided in the following tables.
Table 4-1.System-On-Module Pin Description: PIOA
Pin Number PIO Power Rail Other Features Type
80 PA00 VDDSDHC SDMMC0_CK/QSPIO0_SLK/D0 I/O
76 PA01 VDDSDHC SDMMC0_CMD/QSPI0_CS/D1 I/O
83 PA02 VDDSDHC SDMMC0_DAT0/QSPI0_IO0/D2 I/O
81 PA03 VDDSDHC SDMMC0_DAT1/QSPI0_IO1/D3 I/O
84 PA04 VDDSDHC SDMMC0_DAT2/QSPI0_IO2/D4 I/O
85 PA05 VDDSDHC SDMMC0_DAT3/QSPI0_IO3/D5 I/O
86 PA06 VDDSDHC SDMMC0_DAT4/TIOA5/FLEXCOM2_IO0/D6
I/O
79 PA07 VDDSDHC SDMMC0_DAT5/TIOB5/FLEXCOM2_IO1/D7
I/O
78 PA08 VDDSDHC SDMMC0_DAT6/TCLK5/FLEXCOM2_IO2/NWE/NANDWE
I/O
77 PA09 VDDSDHC SDMMC0_DAT7/TIOA4/FLEXCOM2_IO3/NCS3
I/O
82 PA10 VDDSDHC SDMMC0_RSTN/TIOB4/FLEXCOM2_IO4/A21/NANDALE
I/O
87 PA11 VDDIN_3V3 SDMMC0_VDDSEL/TCLK4/A22/NANDCLE
I/O
92 PA12 VDDIN_3V3 SDMMC0_WP/IRQ/NRD/NANDOE I/O
91 PA13 VDDIN_3V3 SDMMC0_CD/FLEXCOM3_IO1/D8 I/O
111 PA14 VDDIN_3V3 SPI0_SPCK/TK1/QSPI0_SCK/I2SMCK1/FLEXCOM3_IO2/D9
I/O
109 PA15 VDDIN_3V3 SPI0_MOSI/TF1/QSPI0_CS/I2SCK1/FLEXCOM3_IO0/D10
I/O
112 PA16 VDDIN_3V3 SPI0_MISO/TD1/QSPI0_IO0/I2SWS1/FLEXCOM3_IO3/D11
I/O
108 PA17 VDDIN_3V3 SPI0_NPCS0/RD1/QSPI0_IO1/I2SDI1/FLEXCOM3_IO4/D12
I/O
105 PA18 VDDIN_3V3 SPI0_NPCS1/RK1/QSPI0_IO2/I2SDO1/SDMMC1_DAT0/D13
I/O
101 PA19 VDDIN_3V3 SPI0_NPCS2/RF1/QSPI0_IO3/TIOA0/SDMMC1_DAT1/D14
I/O
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 9
Pin Number PIO Power Rail Other Features Type
104 PA20 VDDIN_3V3 SPI0_NPCS3/TIOB0/SDMMC1_DAT2/D15
I/O
103 PA21 VDDIN_3V3 PCK2/IRQ/TCLK0/SDMMC1_DAT3/NANDRDY
I/O
106 PA22 VDDIN_3V3 FLEXCOM1_IO2/SPI1_SPCK/SDMMC1_CK/QSPI0_SCK
I/O
102 PA23 VDDIN_3V3 FLEXCOM1_IO1/SPI1_MOSI/QSPI0_CS
I/O
99 PA24 VDDIN_3V3 FLEXCOM1_IO0/SPI1_MISO/QSPI0_IO0
I/O
97 PA25 VDDIN_3V3 FLEXCOM1_IO3/SPI1_NPCS0/QSPI0_IO1
I/O
100 PA26 VDDIN_3V3 FLEXCOM1_IO4/SPI1_NPCS1/QSPI0_IO2
I/O
90 PA27 VDDIN_3V3 TIOA1/SPI0_NPCS2/SPI1_NPCS2/SDMMC1_RSTN/QSPI0_IO3
I/O
95 PA28 VDDIN_3V3 TIOB1/SPI0_NPCS3/SPI1_NPCS3/SDMMC1_CMD/CLASSD_L0
I/O
96 PA29 VDDIN_3V3 TCLK1/SPI0_NPCS1/SDMMC1_WP/CLASSD_L1
I/O
94 PA30 VDDIN_3V3 SPI0_NPCS0/PWMH0/SDMMC1_CD/CLASSD_L2
I/O
93 PA31 VDDIN_3V3 SPI0_MISO/PWML0/CLASSD_L3 I/O
Table 4-2.System-On-Module Pin Description: PIOB
Pin Number PIO Power Rail Other Features Type
119 PB00 VDDIN_3V3 SPI0_MOSI/PWMH1 I/O
122 PB01 VDDIN_3V3 SPI0_SPCK/PWML1/CLASSD_R0 I/O
124 PB02 VDDIN_3V3 PWMFI0/CLASSD_R1 I/O
123 PB03 VDDIN_3V3 URXD4/IRQ/PWMEXTRG0/CLASSD_R2
I/O
125 PB04 VDDIN_3V3 UTXD4/FIQ/CLASSD_R3 I/O
134 PB05 VDDIN_3V3 TCLK2/PWMH2/QSPI1_SCK I/O
127 PB06 VDDIN_3V3 TIOA2/PWML2/QSPI1_CS I/O
133 PB07 VDDIN_3V3 TIOB2/PWMH3/QSPI1_IO0 I/O
128 PB08 VDDIN_3V3 TCLK3/PWML3/QSPI1_IO1 I/O
132 PB09 VDDIN_3V3 TIOA3/PWMFI1/QSPI1_IO2 I/O
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 10
Pin Number PIO Power Rail Other Features Type
135 PB10 VDDIN_3V3 TIOB3/PWMEXTRG1/QSPI1_IO3 I/O
148 PB11 VDDIN_3V3 LCDDAT0/URXD3/PDMDAT0 I/O
151 PB12 VDDIN_3V3 LCDDAT1/UTXD3/PDMCLK0 I/O
155 PB13 VDDIN_3V3 LCDDAT2/PCK1 I/O
150 PB14 VDDIN_3V3 LCDDAT3/TK1/I2SMCK1 I/O
162 PB15 VDDIN_3V3 LCDDAT4/TF1/I2SCK1 I/O
154 PB16 VDDIN_3V3 LCDDAT5/TD1/I2SWS1 I/O
157 PB17 VDDIN_3V3 LCDDAT6/RD1/I2SDI1 I/O
152 PB18 VDDIN_3V3 LCDDAT7/RK1/I2SDO1 I/O
158 PB19 VDDIN_3V3 LCDDAT8/RF1/TIOA3 I/O
156 PB20 VDDIN_3V3 LCDDAT9/TK0/TIOB3/PCK1 I/O
164 PB21 VDDIN_3V3 LCDDAT10/TF0/TCLK3/FLEXCOM3_IO2
I/O
161 PB22 VDDIN_3V3 LCDDAT11/TD0/TIOA2/FLEXCOM3_IO1
I/O
160 PB23 VDDIN_3V3 LCDDAT12/RD0/TIOB2/FLEXCOM3_IO0
I/O
168 PB24 VDDIN_3V3 LCDDAT13/RK0/TCLK2/FLEXCOM3_IO3
I/O
159 PB25 VDDIN_3V3 LCDDAT14/RF0/FLEXCOM3_IO4 I/O
169 PB26 VDDIN_3V3 LCDDAT15/URXD0 I/O
163 PB27 VDDIN_3V3 LCDDAT16/UTXD0 I/O
167 PB28 VDDIN_3V3 LCDDAT17/FLEXCOM0_IO0/TIOA5 I/O
144 PB29 VDDIN_3V3 LCDDAT18/FLEXCOM0_IO1/TIOB5 I/O
165 PB30 VDDIN_3V3 LCDDAT19/FLEXCOM0_IO2/TCLK5 I/O
143 PB31 VDDIN_3V3 LCDDAT20/FLEXCOM0_IO3 I/O
Table 4-3.System On Module Pin Table : PIOC
Pin Number PIO Power Rail Other Features Type
145 PC00 VDDIN_3V3 LCDDAT21/FLEXCOM0_IO4 I/O
141 PC01 VDDIN_3V3 LCDDAT22/CANTX0/SPI1_SPCK/I2SCK0
I/O
146 PC02 VDDIN_3V3 LCDDAT23/CANRX0/SPI1_MOSI/I2SMCK0
I/O
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 11
Pin Number PIO Power Rail Other Features Type
142 PC03 VDDIN_3V3 LCDPWM/TIOA1/SPI1_MISO/I2SWS0
I/O
136 PC04 VDDIN_3V3 LCDDISP/TIOB1/SPI1_NPCS0/I2SDI0
I/O
137 PC05 VDDIN_3V3 LCDVSYNC/TCLK1/SPI1_NPCS1/I2SDO0
I/O
140 PC06 VDDIN_3V3 LCDHSYNC/TWD1/SPI1_NPCS2 I/O
139 PC07 VDDIN_3V3 LCDPCK/TWCK1/SPI1_NPCS3/URXD1
I/O
138 PC08 VDDIN_3V3 LCDDEN/FIQ/PCK0/UTXD1 I/O
2 PC09 VDDISC FIQ/ISI_D0/TIOA4 I/O
9 PC10 VDDISC ISI_D1/TIOB4/CANTX0 I/O
175 PC11 VDDISC ISI_D2/TCLK4/CANRX0/A0/NBS0 I/O
3 PC12 VDDISC ISI_D3/URXD3/TK0/A1 I/O
4 PC13 VDDISC ISI_D4/UTXD3/TF0/A2 I/O
8 PC14 VDDISC ISI_D5/TD0/A3 I/O
12 PC15 VDDISC ISI_D6/RD0/A4 I/O
174 PC16 VDDISC ISI_D7/RK0/A5 I/O
5 PC17 VDDISC ISI_D8/RF0/A6 I/O
172 PC18 VDDISC ISI_D9/FLEXCOM3_IO2/A7 I/O
6 PC19 VDDISC ISI_D10/FLEXCOM3_IO1/A8 I/O
14 PC20 VDDISC ISI_D11/FLEXCOM3_IO0/A9 I/O
7 PC21 VDDISC ISI_PCK/FLEXCOM3_IO3/A10 I/O
11 PC22 VDDISC ISI_VSYNC/FLEXCOM3_IO4/A11 I/O
170 PC23 VDDISC ISI_HSYNC/A12 I/O
13 PC24 VDDISC ISI_MCK/A13 I/O
173 PC25 VDDISC ISI_FIELD/A14 I/O
115 PC26 VDDIN_3V3 CANTX1/A15 I/O
114 PC27 VDDIN_3V3 PCK1/CANRX1/A16 I/O
117 PC28 VDDIN_3V3 FLEXCOM4_IO0/PCK2/A17 I/O
118 PC29 VDDIN_3V3 FLEXCOM4_IO1/A18 I/O
120 PC30 VDDIN_3V3 FLEXCOM4_IO2/A19 I/O
116 PC31 VDDIN_3V3 FLEXCOM4_IO3/URXD3/A20 I/O
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 12
Table 4-4.System-On-Module Pin Description: PIOD
Pin Number PIO Power Rail Other Features Type
121 PD00 VDDIN_3V3 FLEXCOM4_IO4/UTXD3/A23 I/O
113 PD01 VDDIN_3V3 A24 I/O
23 PD02 VDDIN_3V3 URXD1/A25 I/O
24 PD03 VDDIN_3V3 UTXD1/FIQ/NWAIT/PTCROW0 I/O
27 PD04 VDDIN_3V3 TWD1/NCS0/PTCROW1 I/O
21 PD05 VDDIN_3V3 TWCK1/NCS1/PTCROW2 I/O
22 PD06 VDDIN_3V3 PCK1/NCS2/PTCROW3 I/O
25 PD07 VDDIN_3V3 NWR1/NBS1/PTCROW4 I/O
28 PD08 VDDIN_3V3 NANDRDY/PTCROW5 I/O
58 PD19 VDDIN_3V3 PCK0/TWD1/AD0 I/O
57 PD20 VDDIN_3V3 TIOA2/TWCK1/AD1 I/O
19 PD21 VDDIN_3V3 EEPROM_TWD_PD21 I/O
20 PD22 VDDIN_3V3 EEPROM_TWCK_PD22 I/O
30 PD23 VDDIN_3V3 URXD2/AD4 I/O
29 PD24 VDDIN_3V3 UTXD2/AD5 I/O
110 PD25 VDDIN_3V3 AD6 I/O
34 PD26 VDDIN_3V3 AD7 I/O
53 PD27 VDDIN_3V3 JTAG_TCK I/O
51 PD28 VDDIN_3V3 JTAG_TDI I/O
52 PD29 VDDIN_3V3 JTAG_TDO I/O
54 PD30 VDDIN_3V3 JTAG_TMS I/O
Table 4-5.System-On-Module Pin Description: System
Pin Number PIO Power Rail Designation Type
61 CLK_AUDIO VDDIN_3V3 Audio clock Output
64 COMPN VDDBU External analog comparator input Input
63 COMPP VDDBU External analog comparator input Input
126 DIS_BOOT VDDIN_3V3 QSPI Interface Disable pin Input
67 USBA_M VDDIN_3V3 USB Device High Speed Data -
68 USBA_P VDDIN_3V3 USB Device High Speed Data +
70 USBB_M VDDIN_3V3 USB Host Port B High Speed Data -
71 USBB_P VDDIN_3V3 USB Host Port B High Speed Data +
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 13
Pin Number PIO Power Rail Designation Type
74 DATA VDDHSIC USB High-Speed Inter-Chip Data
73 STROBE VDDHSIC USB High-Speed Inter-Chip Strobe
60 NRST VDDIN_3V3 Microprocessor reset Input / ActiveLow
33 PIOBU1 VDDBU Tamper or Wakeup input Input
44 PIOBU2 VDDBU Tamper or Wakeup input Input
48 PIOBU3 VDDBU Tamper or Wakeup input Input
47 PIOBU4 VDDBU Tamper or Wakeup input Input
46 PIOBU5 VDDBU Tamper or Wakeup input Input
59 PIOBU6 VDDBU Tamper or Wakeup input Input
45 PIOBU7 VDDBU Tamper or Wakeup input Input
32 RXD VDDBU Low Power Asynchronous Receiver Input
35 SHDN VDDBU Shutdown Control Output
49 WKUP VDDBU Wakeup Input
36 ETH_LED0 VDDIN_3V3 Status LED control for Ethernet ports Output
37 ETH_RXM 2.5V Physical receive or transmit signal (differential) I/O
38 ETH_RXP 2.5V Physical receive or transmit signal (+differential) I/O
40 ETH_TXM 2.5V Physical receive or transmit signal (differential) I/O
41 ETH_TXP 2.5V Physical receive or transmit signal (+differential) I/O
Table 4-6.System-On-Module Pin Description: Power
Pin Number PIO Description Comments
16,17 VDDIN_3V3 Main 3.3V Supply inputs. Used forPeripheral I/O lines and MIC2800-G1JJYML supplies.
55 VDDBU Input supply for Slow ClockOscillator, internal 32 kHz RCOscillator and a part of theSystem Controller
65 VDDSDHC SDMMC I/O lines supply input
15 VDDISC Image Sensor I/O lines supplyinput
For decoupling guidelines, refer tothe section "Design Guidelines".
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 14
Pin Number PIO Description Comments
1, 10, 18, 26,31, 39, 42, 43,50, 56, 62, 66,69, 72, 75, 88,89, 98, 107,130, 131, 149,166, 171, 176
GND Ground connections Must be connected together
129 RFU0 Reserved for future use Must be left floating
147 RFU1 Reserved for future use Must be left floating
153 RFU2 Reserved for future use Must be left floating
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 15
5. Functional Description
5.1 SAMA5D27 System-In-PackageThe SAMA5D2 System-In-Package (SIP) (SAMA5D27C-D1G-CU) integrates the ARM Cortex-A5processor-based SAMA5D2 MPU with 1 Gbit DDR2-SDRAM in a single package.
By combining the high-performance, ultra-low-power SAMA5D2 with DDR2-SDRAM in a single package,PCB routing complexity, area and number of layers is reduced. This makes board design easier andlowers the overall cost of bill of materials. Board design is more robust by facilitating design for EMI, ESDand signal integrity.
For more information about the SIP, see "Reference Documents". This section lists the sole referencedocuments for product information on the SAMA5D2 and the DDR2-SDRAM memory.
The SAMA5D27C-D1G-CU is available in a 289-ball TFBGA package.
Connections of the supplies and the system pins of the SAMA5D27C-D1G-CU are described in thefollowing schematics.
Figure 5-1.SAMA5D27C-D1G-CU Supplies Distribution Schematic
VDDIN_3V3
VDDUTMII
VDDOSC
VDDAUDIOPLL
VDDIOP0
VDDIOP1
VDDIOP2
GNDUTMII
10F
4.7
F
2.2R
100n
F
100n
F
100n
F
2.2R
BLM03AX100SZ11 2
4.7
F
100n
F10
0nF
MLZ1608N100L1 2
BLM03AX100SZ1
1 2
100n
F
100n
F
0R
100n
F
MLZ1608N100L1 2
BLM03AX100SZ11 2
BLM03AX100SZ11 2
BLM03AX100SZ1
1 20R
100n
F
VDDANA
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 16
Figure 5-2.SAMA5D27C-D1G-CU Supplies Decoupling Schematic
(3V3)
(3V3)
(3V3)
(1V2)
(3V3)
(3V3)
(3V3)
(3V3)
(1V8)
(1V2)
(2V5)
(1V2)
(1V2)
VDDIOP2
VDDIOP1
VDDIOP0
VDDOSC
VDDUTMII
VDDAUDIOPLL
VDDBU
VDDFUSE
VDDSDHC
VDDISC
VDDCORE
GNDUTMII
4.7
F
100n
F
100n
F
4.7
F
MLZ1608N100L1 2
100n
F
100n
F
100n
F
100n
F
SAMA5D27C-D1G-CU
U2G
GNDADCJ6GNDANAM1
GNDBUU4
GNDCORE_1E12
GNDCORE_2F12
GNDCORE_3J11
GNDCORE_4K6
GNDCORE_5K7
GNDCORE_6K11
GNDDDR_1E10
GNDDDR_2F8
GNDDDR_3G10
GNDDDR_4H12
GNDDDR_5J9
GNDDDR_6K10
GNDDDR_7M14
GNDDPLLT3
GNDFLTDPLLT4
GNDIOP0_1E3
GNDIOP0_2F2
GNDIOP1_1M12
GNDIOP1_2P11
GNDOSCP5
GNDPLLAT5
GNDUTMIM6
GNDUTMI_CORER6
VDDADCK4 VDDANAJ5
VDDBUU5
VDDCORE_1D7
VDDCORE_2E9
VDDCORE_3H2
VDDCORE_4L12
VDDCORE_5P7
VDDDDR_1E8
VDDDDR_2E11
VDDDDR_3G12
VDDDDR_4H10
VDDDDR_5J8
VDDDDR_6L10
VDDDDR_7L14
VDDFLTDPLLM4
VDDFUSEN13
VDDIOP0_1D4
VDDIOP0_2F3
VDDIOP1_1N12
VDDIOP1_2P12
VDDOSCN6
VDDPLLAR5
VDDSDHCN8
VDDUTMIP6
VDDUTMI_COREM7
GNDIOP2_1D6
VDDCORE_6U3
VDDIOP2_1D9
VDDHSICR7
VDDISIH3
GNDISIH5
GNDSDHCR8
2.2R
100n
F
VDDPLLA
VDDUTMIC
VDDHSIC
VDDANA
100n
F
100n
F
VDDIODDR
100n
F
100n
F
100n
F
100n
F
100n
F
1nF
1nF
100n
F
100n
F
1nF
1nF
10F
1nF
1nF
1nF
VDDIODDR
VDDCORE
1nF
1nF
1nF
100n
F
1nF
100n
F
100n
F
100n
F
10F
100n
F
1nF
1nF
100n
F
VDDCORE
VDDCOREBLM03AX100SZ11 2
VDDCOREBLM03AX100SZ1
1 2
Figure 5-3.SAMA5D27C-D1G-CU System Schematic
R & Cas close as possibleVDDANA
COMPNCOMPP
LOWQ#PIOBU1PIOBU2PIOBU3PIOBU4PIOBU5PIOBU6PIOBU7
GNDUTMII
SHDN
WKUP
nRST
USBA_MUSBA_P
USBB_MUSBB_P
STROBEDATA
CLK_AUDIO
RXD
NX2012SA_32-768KHz
1 2
8pF50V
NX2016SA_24MHz
11 2
GN
D1
334
GN
D2
12pF50V 10pF25V
SAMA5D27C-D1G-CU
ADVREFPL9
CLK_AUDIOT8
COMPNU7COMPPU6
HHSDMAT10
HHSDMBT11
HHSDPAU10
HHSDPBU11
JTAGSELR3 NRSTT7
PIOBU0P3
PIOBU1M3
PIOBU2P2
PIOBU3P4
PIOBU4N4
PIOBU5M5
SHDNT2 TSTR4
VBGT6
WKUPR2
XINU9
XIN32U2
XOUTU8
XOUT32U1
PIOBU6N5
PIOBU7N3
HHSDPDATCT12
HHSDMSTRCU12
RXDN2
100R
8pF50V
100R
100R 100R12pF50V
10K
5.62
K
100R
Y1
Y2
Table 5-1.SAMA5D27C-D1G-CU External Crystal
Item Designation Type Manufacturer Manufacturer Specification Number
Y1 24MHz Crystal NX2016SA NDK EXS00A-CS08664
Y2 32.768kHzCrystal
NX2012SA NDK EXS00A-MU00626
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 17
5.2 Power SuppliesThe SAMA5D27 SOM1 is supplied by an external 3.3V and generates its own internal supplies byinterfacing with the Microchip MIC2800-G1JJYML power management unit.
The MIC2800 is a high-performance power management IC, providing three output voltages withmaximum efficiency and is optimized to respect the MPU power up and down cycles.
Integrating a 2 MHz DC/DC converter with an LDO post regulator, the MIC2800 gives two high-efficiencyoutputs with a second, 300mA LDO for maximum flexibility. The DC-to-DC converter uses small values ofL and C to reduce board space while still retaining efficiency over 90% at load currents up to 600mA.
The three outputs supply the following internal nodes: DCDC set @ 1.8V supplies SAMA5D27C-D1G-CU DDR2 pads and device. LDO1 set @ 1.2V supplies SAMA5D27C-D1G-CU Core. LDO2 set @ 2.5V supplies SAMA5D27C-D1G-CU VDDFUSE pad.
The MIC2800 is a Cap design, operating with very small ceramic output capacitors and inductors forstability.
It is available in fixed output voltages in the 16-pin 3mm x 3mm MLF lead-less package. For moreinformation, refer to the product web page.
Figure 5-4.Power Management Unit Schematic
VDDBU
VDDIN_3V3
VDDFUSE
VDDIODDR
VDDIODDRVDDCORELOWQ#
nRST
4.7uF
10uF
2.2uF
100nF 10nF
2.2uH1 2
100nF
100K
10uF
10uFMIC2800-G1JJYML
POR12
SW5
FB9
CBIAS2
LOWQ1
VIN16
VIN27 LDO2
8
PGN
D4
SGN
D3
EN216
EN115
CBYP14
CSET13
LDO10
LDO111
TPAD
17
VDDIN_3V3
56K
100nF
5.3 System ControlThe SAMA5D27 SOM1 provides global system Reset (NRST) and Shutdown (SHDN) pins to theapplication board.
The NRST pin is an output pin generated by the internal Power Management Unit (MIC2800-G1JJYML) in respect with power sequence timing. It can be forced externally in case of a systemcrash and must be connected as described in the example schematic below.
The SHDN pin is an output pin and is managed by the software application. It switches the Main3.3V Supply ON or OFF.
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 18
http://www.microchip.com/wwwproducts/en/MIC2800
Figure 5-5.Internal System Control Schematic
SHDN
Q1
DMN26D0UDJ-7D1
6
S11
2 G1
5G2
4S2
3D2
VDDIN_3V3
10K
nRST
VDDBU
100K
From SAMA5D27
5.4 Ethernet PHYThe Microchip SAMA5D27 SOM1 embeds a single-supply 10BASE-T/100BASE-TX Ethernet physical-layer transceiver for transmission and reception of data over standard CAT-5 unshielded twisted pair(UTP) cable.
The KSZ8081RNAIA is a highly-integrated PHY solution. The KSZ8081RNAIA offers the Reduced MediaIndependent Interface (RMII) for direct connection to RMII-compliant MACs in Ethernet processors.
The KSZ8081RNAIA is available in 24-pin, lead-free QFN packages. For more information, refer to the product web page.
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 19
http://www.microchip.com/wwwproducts/en/ksz8081
Figure 5-6.Ethernet PHY Schematic
VDDIN_3V3
VDDIN_3V3
VDD
IN_3
V3
VDDIN_3V3
ETH_TXPETH_TXM
ETH_RXPETH_RXM
GTXCK_PD09GTX1_PD16GTX0_PD15GTXEN_PD10GRX1_PD14GRX0_PD13GRXER_PD12GRXDV_PD11GMDC_PD17GMDIO_PD18ETH_INT_IRQ_PD31
nRST
ETH_LED0
100nF
2.2uF
0R
BLM18PG181SN1D
1 2
100nF
22pF50V
100nF 10K
1KU6
KSZ8081RNAIA
TXM5 TXP6
RXP4
RXM3
VDD_1V21
GND22
PADDLE25
REXT9
XI8
XO7
REF_CLK16
TXD121
TXD020
TXEN19
RXD112
RXD013
RXER17
CRS_DV/PHYAD[1_0]15
MDC11
MDIO10
INTRP18
VDDA_3V32
VDDIO14
LED0/ANEN_SPEED23
RST#24
10uF
NX2
016S
A_25
MH
z
11
2
GND1 33
4
GND210K
6.49K
22pF50V
10uF
1K
ETH_XO
ETH_XI
Y3
Table 5-2.KSZ8081RNAIA External Crystal
Item Designation Type Manufacturer Manufacturer Specification Number
Y3 25MHz Crystal NX2016SA NDK EXS00A-CS10694
5.5 QSPI MemoryThe SAMA5D27 SOM1 embeds the SST26VF064BT-104I/MF, a 64Mb Serial Quad I/O Flash memory.
The SST26VF064BT-104I/MF SQI features a six-wire, 4-bit I/O interface that allows for low-power, high-performance operation in a low pin-count package.
The SST26VF064BT-104I/MF is available in 8-lead WDFN package with 6mm 5mm dimensions.
For more information, refer to the product web page.
Figure 5-7.QSPI Memory Schematic
VDDIN_3V3
VDDIN_3V3 VDDIN_3V3
VDDIN_3V3
PB07/TIOB2/PWMH3/QSPI1_IO0
PB08/TCLK3/PWML3/QSPI1_IO1
PB09/TIOA3/PWMFI1/QSPI1_IO2
PB10/TIOB3/PWMEXTRG1/QSPI1_IO3
PB05/TCLK2/PWMH2/QSPI1_SCK
QSPI_SCK_PB05QSPI_IO3_PB10QSPI_IO2_PB09QSPI_IO1_PB08QSPI_IO0_PB07
PB06/TIOA2/PWML2/QSPI1_CS
DIS_BOOT
QSPI_CS_PB06
22R
22R
10KDNP
10KDNP
22R
NL17SZ126DFT2G
OE1
IN2
GND3
OUT4
VCC5
22R
22R
10KDNP
22R
10KDNP
10K
22R
100nF
22R
10KDNP
22R
10KDNP
SST26VF064B-104I/MF
CE#1SO/SIO1
2
WP#/SIO23 VSS
4SI/SIO05
SCK6 HOLD/SIO37
VDD8
TPAD9
22R
100nF
22R
10K
22R
QSPI_CS#
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 20
http://www.microchip.com/wwwproducts/en/SST26VF064B
Tip: In case of non-use at application level of the QSPI embedded in SAMA5D27 SOM1, it ispossible to reassign the signals dedicated to QSPI memory to another PIO function as definedin the table below. To do so, the DIS_BOOT pin (SAMA5D27 SOM1 pad 126) must be forced toground.
Table 5-3.Other GPIO Possibilities for QSPI Interface in Case of Non-use
Pin Number Power RailPrimary PIO Peripheral
Reset StateSignal Dir Func Signal Dir IOset
134 VDDIN_3V3 PB05 I/O A TCLK2 I 1 PIO, I, PU,ST
C PWMH2 O 1
D QSPI1_SCK O 2
127 VDDIN_3V3 PB06 I/O A TIOA2 I/O 1 PIO, I, PU,ST
C PWML2 O 1
D QSPI1_CS O 2
133 VDDIN_3V3 PB07 I/O A TIOB2 I/O 1 PIO, I, PU,ST
C PWMH3 O 1
D QSPI1_IO0 I/O 2
128 VDDIN_3V3 PB08 I/O A TCLK3 I 1 PIO, I, PU,ST
C PWML3 O 1
D QSPI1_IO1 I/O 2
132 VDDIN_3V3 PB09 I/O A TIOA3 I/O 1 PIO, I, PU,ST
C PWMFI1 I 1
D QSPI1_IO2 I/O 2
135 VDDIN_3V3 PB10 I/O A TIOB3 I/O 1 PIO, I, PU,ST
C PWMEXTRG1 I 1
D QSPI1_IO3 I/O 2
Tip: The QSPI interface can be shared with another external device. To do so, the QSPI_CS#node must stay at "High" level. That means that the DIS_BOOT pin (SAMA5D27 SOM1 pad126) must be forced to ground.
5.6 EEPROM MemoryThe SAMA5D27 SOM1 embeds the 24AA02E48T-I/OT, a 1Kb Serial EEPROM with pre-programmedEUI-48 MAC address.
The device is organized as one block of 128 x 8-bit memory with a 2-wire serial interface. The secondblock is reserved for MAC Address storage.
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 21
The 24AA02E48T-I/OT also has a page write capability for up to 8 bytes of data.
The 24AA02E48T-I/OT is available in the standard 5-lead SOT-23 package. For more information, seethe product web page.
Figure 5-8.EEPROM Memory Schematic
VDDIN_3V3
VDDIN_3V3
PD22/EEPROM_TWCK_PD22
PD21/EEPROM_TWD_PD21
EEPROM_TWCK_PD22
EEPROM_TWD_PD2122R
24AA02E48T-I/OT
VCC4
SCL1
SDA3
VSS2
NC5 2.2K
100nF
22R
22R
2.2K
22R
Tip: The 2-Wire serial interface can be externally shared with another device. 2-Wire DataSignal (SAMA5D27 SOM1Pad 19) and 2-Wire Clock Signal (SAMA5D27 SOM1Pad 20) areused.
Important: If the 2-Wire serial interface is used externally, the device connected must have adifferent IC address than the embedded EEPROM. The embedded EEPROM has the followingIC address range: 0x40 0x47
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 22
http://www.microchip.com/wwwproducts/en/24AA02E48
6. Power Supply Connections and Timing SequencesThe SAMA5D27 SOM1 can be supplied in different ways depending on application needs.
Four power domains must be supplied and can be connected differently. The four different powerconnections are described below:
Power Configuration #1: All supplies are connected to the Main 3.3V Supply. Power Configuration #2: Backup domain is connected to a coin-cell and the rest to the Main 3.3V
Supply. Power Configuration #3: Backup domain is connected to a coin-cell. Camera sensor is connected
to a separate power supply and the rest to the Main 3.3V Supply. Power Configuration #4: All supply domains are connected to separate power supplies.
For each power configuration, a Power-On and Power-Off timing sequences to respect are describedbelow.
6.1 Power Supply Configuration #1The SAMA5D27 SOM1 is supplied by only one main supply.
In this configuration mode, all supplies are connected together and supplied by the main 3.3V supply. AllPIOs have VDDIN_3V3 Power Rail as voltage reference.
Figure 6-1.Power Configuration #1
SHDN
nRST
VDDSDHC
VDDISC
VDDBU
VDDIN_3V3
nRST
SHDN
3.3V
SAM
A5D
27-S
OM
1
In this configuration mode, the two following timing sequences are applied.
Figure 6-2.Power-On Sequence Timing DiagramSYSTEM IS OFF SYSTEM IS POWERED-UP RESET IS RELEASED
VDDIN_3V3 MAIN 3.3V IS PRESENT
VDDBU VDDIN_3V3 LEVEL
VDDISC VDDIN_3V3 LEVEL
VDDSDHC VDDIN_3V3 LEVEL
INT_VDD INTERNAL SUPPLIES GENERATION
SHDN VDDIN_3V3 LEVEL
nRST
Tmain
Tstart
Tpor
a
c
d
e
f
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 23
Figure 6-3.Power-Off Sequence Timing DiagramSYSTEM IS ON POWER-OFF PROCEDURE SYSTEM IS POWER-DOWN SYSTEM IS OFF
VDDIN_3V3 MAIN 3.3V IS PRESENT
VDDBU VDDIN_3V3 LEVEL
VDDISC VDDIN_3V3 LEVEL
VDDSDHC VDDIN_3V3 LEVEL
INT_VDD INTERNAL SUPPLIES SWITCH-OFF
SOFTWARE SOFTWARE IS RUNNING SOFTWARE SHUTDOWN
SHDN SOFTWARE REQUEST
nRST
Tsoft
Tmain_off
Tstop
c
d
a
b
Table 6-1.Timing Values
Symbol Description Min. Typ. Max. Unit
tmain(1) Main 3.3V Startup Time 1 ms
tstart Internal Delay before starting System CoreSupplies
1 3 ms
tpor Power-On Reset Delay 10 11 ms
tsoft Software Shutdown Time Depending on systemoff time
ms
tmain_off Main 3.3V Power-off Time 1 ms
tstop Internal Delay before switching off System CoreSupplies
1 3 ms
Note:1. The three supplies VDDIN_3V3, VDDISC and VDDSDHC must be applied at the same time. If a
delay is implemented, it must be lower than 800s. VDDBU must be applied at the same time asVDDIN_3V3 or just before. It is forbidden to apply VDDBU after VDDIN_3V3.
6.2 Power Supply Configuration #2The SAMA5D27 SOM1 is supplied by different power supplies.
Backup domain is connected to a coin-cell. The rest of the power inputs are connected to the main 3.3V supply.
In this configuration, the following PIOs have VDDBU Power Rail as reference. All other PIO haveVDDIN_3V3 Power Rail as reference.
COMPP and COMPN PIOBU1 to PIOBU7 RXD, SHDN and WKUP
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 24
Figure 6-4.Power Configuration #2
SHDN
nRST
VDDSDHC
VDDISC
VDDBU
VDDIN_3V3
nRST
SHDN
3.3V
SAM
A5D
27-S
OM
1
In this configuration, the two following timing sequences are applied.
Figure 6-5.Power-On Sequence Timing DiagramSYSTEM IN BACKUP SYSTEM IS POWERED-UP RESET IS RELEASED
VDDIN_3V3 MAIN 3.3V IS PRESENT
VDDBU VDDBU ALWAYS PRESENT
VDDISC VDDIN_3V3 LEVEL
VDDSDHC VDDIN_3V3 LEVEL
INT_VDD INTERNAL SUPPLIES GENERATION
SHDN VDDBU LEVEL / SOFTWARE RELEASE
nRST
Tmain
Tstart
Tpor
b
c
d
e
a
f
Figure 6-6.Power-Off Sequence Timing DiagramSYSTEM IS ON POWER-OFF PROCEDURE SYSTEM IS POWER-DOWN SYSTEM IN BACKUP
VDDIN_3V3 MAIN 3.3V IS PRESENT
VDDBU VDDBU ALWAYS PRESENT
VDDISC VDDIN_3V3 LEVEL
VDDSDHC VDDIN_3V3 LEVEL
INT_VDD INTERNAL SUPPLIES SWITCH-OFF
SOFTWARE IS RUNNING SOFTWARE SHUTDOWNSOFTWARE
SHDN SOFTWARE REQUEST
nRST
Tsoft
Tmain_off
Tstop
c
d
a
b
Table 6-2.Timing Values
Symbol Description Min. Typ. Max. Unit
tmain(1) Main 3.3V Startup Time 1 ms
tstart Internal Delay before starting System CoreSupplies
1 3 ms
tpor Power-On Reset Delay 10 11 ms
tsoft Software Shutdown Time Depending on systemoff time
ms
tmain_off Main 3.3V Power-off Time 1 ms
tstop Internal Delay before switching-off System CoreSupplies
1 3 ms
Note:
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 25
1. The three supplies VDDIN_3V3, VDDISC and VDDSDHC must be applied at the same time. If adelay is implemented, it must be lower than tstart.
6.3 Power Supply Configuration #3Some power inputs of the SAMA5D27 SOM1 are grouped and others are supplied by a separated powersupplies.
Backup domain is connected to a coin cell. Camera sensor power input (VDDISC) is connected to a separate power supply set at one of the
following voltage levels (1.8V/2.5V/2.8V/3.0V or 3.3V) depending on the camera sensor technologyused in the application.
The remaining power inputs are connected to the main 3.3V supply.
In this configuration, the following PIOs have: VDDBU Power Rail as reference
COMPP and COMPN PIOBU1 to PIOBU7 RXD, SHDN and WKUP
VDDISC Power Rail as reference PC09 to PC25
All other PIOs have VDDIN_3V3 Power Rail as reference.
Figure 6-7.Power Configuration #3
SHDN
nRST
VDDSDHC
VDDISC
VDDBU
VDDIN_3V3
nRST
SHDN
3.3V
SAM
A5D
27-S
OM
1
In this configuration mode, the two following timing sequences are applied.
Figure 6-8.Power-On Sequence Timing DiagramSYSTEM IN BACKUP WAKE UP SYSTEM IS POWERED-UP RESET IS RELEASED
VDDIN_3V3 MAIN 3.3V IS PRESENT
VDDBU VDDBU ALWAYS PRESENT
VDDISC EXTERNAL VDDISC LEVEL (1.8V/2.5V/2.8V/3.0V/3.3V)
VDDSDHC VDDIN_3V3 LEVEL
INT_VDD INTERNAL SUPPLIES GENERATION
SHDN VDDBU LEVEL / SOFTWARE RELEASE
nRST
Tmain
Ton1
Tstart
Tpor
b
a
d
c
e
f
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 26
Figure 6-9.Power-Off Sequence Timing DiagramSYSTEM IS ON POWER-OFF PROCEDURE SYSTEM IS POWER-DOWN SYSTEM IN BACKUP
VDDIN_3V3 MAIN 3.3V IS PRESENT
VDDBU VDDBU ALWAYS PRESENT
VDDISC EXTERNAL VDDISC LEVEL (1.8V/2.5V/2.8V/3.0V/3.3V)
VDDSDHC VDDIN_3V3 LEVEL
INT_VDD INTERNAL SUPPLIES SWITCH-OFF
SOFTWARE IS RUNNING SOFTWARE SHUTDOWNSOFTWARE
SHDN SOFTWARE REQUEST
nRST
Tsoft
Tmain_off
Toff1
Tstop
c
d
e
a
b
Table 6-3.Timing Values
Symbol Description Min. Typ. Max. Unit
tmain(1) Main 3.3V Startup Time (From regulatoravailable on the motherboard)
1 ms
ton1 VDDISC Regulator Startup Time (From regulatoravailable on the motherboard)
800 s
tstart Internal Delay before starting System CoreSupplies
1 3 ms
tpor Power-On Reset Delay 10 11 ms
tsoft Software Shutdown Time Depending on systemoff time
ms
tmain_off Main 3.3V Power-off Time (From regulatoravailable on the motherboard)
1 ms
toff1 VDDISC Regulator Power-off Time (Fromregulator available on the motherboard)
1 ms
tstop Internal Delay before switching off System CoreSupplies
1 3 ms
Note:1. The supplies VDDIN_3V3 and VDDSDHC must be applied at the same time. If a delay is
implemented, it must be lower than tstart.
6.4 Power Supply Configuration #4Each power input of the SAMA5D27 SOM1 is supplied by separate power supplies.
Backup domain is connected to a coin cell. Camera sensor power input (VDDISC) is connected to a separate power supply set at one of the
following voltage levels (1.8V/2.5V/2.8V/3.0V or 3.3V) depending on the camera sensor technologyused in the application.
SD Card power input (VDDSDHC) is connected to a separate power supply set at one of thefollowing voltage levels (1.8V or 3.3V) depending on the SD Card Technology/Speed used in theapplication.
VDDIN_3V3 power input is connected to the main 3.3V supply.
In this configuration, the following PIOs have:
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 27
VDDBU Power Rail as reference COMPP and COMPN PIOBU1 to PIOBU7 RXD, SHDN and WKUP
VDDISC Power Rail as reference PC09 to PC25
VDDSDHC Power Rail as reference PA00 to PA10
All other PIOs have VDDIN_3V3 Power Rail as reference.
Figure 6-10.Power Configuration #4
SHDN
nRST
VDDSDHC
VDDISC
VDDBU
VDDIN_3V3
nRST
SHDN
3.3V
SAM
A5D
27-S
OM
1SDMMC0_VDDSEL
In this configuration mode, the two following timing sequences are applied.
Figure 6-11.Power-On Sequence Timing DiagramSYSTEM IN BACKUP WAKE UP SYSTEM IS POWERED-UP RESET IS RELEASED
VDDIN_3V3 MAIN 3.3V IS PRESENT
VDDBU VDDBU ALWAYS PRESENT
VDDISC EXTERNAL VDDISC LEVEL (1.8V/2.5V/2.8V/3.0V/3.3V)
VDDSDHC DYNAMIC VDDSDHC LEVEL (3.3V) DYNAMIC VDDSDHC LEVEL (1.8V)
SDMMC0_VDDSEL
INT_VDD INTERNAL SUPPLIES GENERATION
SHDN VDDBU LEVEL / SOFTWARE RELEASE
nRST
Tmain
Ton2Ton1
Tstart
Tpor Tsys
b
d
c
g
e
a
f
Figure 6-12.Power-Off Sequence Timing DiagramSYSTEM IS ON POWER-OFF PROCEDURE SYSTEM IS POWER-DOWN SYSTEM IN BACKUP
VDDIN_3V3 MAIN 3.3V IS PRESENT
VDDBU VDDBU ALWAYS PRESENT
VDDISC EXTERNAL VDDISC LEVEL (1.8V/2.5V/2.8V/3.0V/3.3V)
VDDSDHC VDDSDHC LEVEL (1.8V) VDDSDHC LEVEL (3.3V)
SDMMC0_VDDSEL
INT_VDD INTERNAL SUPPLIES SWITCH-OFF
SOFTWARE IS RUNNING SOFTWARE SHUTDOWNSOFTWARE
SHDN SOFTWARE REQUEST
nRST
Tsoft
Tmain_off
Toff1
Toff2
Tstop
c
d
e
f
a
b
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 28
Table 6-4.Timing Values
Symbol Description Min. Typ. Max. Unit
tmain Main 3.3V Startup Time (From regulatoravailable on the mother board)
1 ms
ton1 VDDISC Regulator Startup Time (From regulatoravailable on the mother board)
800 s
ton2 VDDSDHC Regulator Startup Time (Fromregulator available on the mother board)
800 s
tstart Internal Delay before starting System CoreSupplies
1 3 ms
tpor Power-On Reset Delay 10 11 ms
tsys Low Speed to High Speed card timing(1) Depending on systemoff time
ms
tsoft Software Shutdown Time Depending on systemoff time
ms
tmain_off Main 3.3V Power-off Time (From regulatoravailable on the motherboard)
1 ms
toff1 VDDISC Regulator Power-off Time (Fromregulator available on the motherboard)
1 ms
toff2 VDDSDHC Regulator Power-off Time (Fromregulator available on the motherboard)
1 ms
tstop Internal Delay before switching off System CoreSupplies
1 3 ms
Note:1. Timing depends on the system boot time. No particular recommendations to apply.
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 29
7. Booting GuidelinesThis section provides an overview of how to program a Non Volatile Memory (NVM) and boot from it.
The SAMA5D27 SOM1 embeds a Quad I/O Flash Memory as a source for boot. Another type of NVMmay be located on the motherboard. This section explains how to program, select and boot from an NVM.
7.1 Boot ProcessThe system always boots from the ROM memory at address 0x0. The ROM code is a boot programcontained in the embedded ROM. It is also called First level bootloader. The SAMA5D2 can beconfigured to run a Standard Boot mode or a Secure Boot mode. More information on how the SecureBoot mode can be enabled, and how the chip operates in this mode, is provided in the documentSAMA5D2x Secure Boot Strategy, document no. 44040. To obtain this application note and additionalinformation about the secure boot and related tools, contact a Microchip sales representative.
By default, the chip starts in Standard Boot Mode.
The ROM code standard sequence is executed as follows: Basic chip initialization: crystal or external clock frequency detection. Attempt to retrieve a valid code from external non-volatile memories (NVM). Execution of a monitor called SAM-BA Monitor, in case no valid application has been found on any
NVM (1).
Note:1. This may be the case during the first start-up or after an NVM erase or when a "boot disable
jumper" is used on the memory Chip Select, in order to force an update.
7.2 Boot ConfigurationThe boot sequence is controlled using a Boot Configuration Word in the Fuse area. The BootConfiguration Word allows several customizations of the Boot Sequence:
To configure the IO Set where the external memories used to boot are connected (see Section16.4.8 Hardware and Software Constraints for a description of the IO sets)
To disable the boot on selected memories To configure the UART port used as a terminal console To configure the JTAG pins used for debug. Refer to Debug Considerations.
See the section Boot Configuration Word of the SAMA5D2 datasheet, document no. DS60001476, for adetailed description of all the bitfields in this word. By default, the value of this word is 0x0. Duringprototyping phases, the value of this fuse word can be overridden by the content of a backup register.The conditions to enable this feature are as follows:
The fuse bit DISABLE_BSCR must not be set (default value). The Boot Sequence Controller Configuration Register (BSC_CR) must have the BUREG_VALID bit
set and indicate in BUREG_INDEX which register has to be used.
Using BUREG allows the user to test several boot configuration options, including Secure Boot Mode,without burning fuses.Note: VDDBU must be connected in order to benefit from this feature. However, in production, it ishighly recommended to disable this feature and to write the boot configuration in fuses.
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 30
7.3 NVM ProgrammingThe SAMA5D27 SOM1 is delivered with SAM-BA In-System Programmer, a comprehensive tool toprogram boot memories.
In case the boot code does not find a valid program in NVM, the SAM-BA monitor is launched in order toprogram the considered NVM.
The SAM-BA monitor principle is to: Initialize DBGU and USB. Check if USB Device enumeration occurred. Check if characters are received on the DBGU.
Once the communication interface is identified, the application runs in an infinite loop waiting for differentcommands.
The firmware can be sent and programmed in the NVM.
For more information, refer to the following link. http://www.at91.com/linux4sam/bin/view/Linux4SAM/Sama5d2XplainedMainPage#Using_SAM_BA_to_flash_components
7.4 Boot From External MemorySeveral types of external memories such as NAND Flash, SDCard, SPI Flash, QSPI Flash, etc. can beconnected to the SAMA5D27 SOM1 and placed on the motherboard.
For details of the Boot sequence, refer to the "NVM Bootloader Program Description for MRL C Parts"diagram of the SAMA5D2 datasheet, document no. DS60001476.
The table below provides the list of external memory types and interfaces that enable connection to theSAMA5D27 SOM1:
Table 7-1.External Memory Connections
Memory Type Interface PIO Comments
SDCard
SD-MMC0 PA0 to PA13If external SDMMC0 interface is not used, bitSDMMC_0 in Boot Configuration Word mustbe set to 1.
SD-MMC1 PA18 to PA22, PA27to PA30
If external SDMMC1 Interface is not used, bitSDMMC_1 in Boot Configuration Word mustbe set to 1.
eMMC SD-MMC0 PA0 to PA10, PA13If external SDMMC0 Interface is not used, bitSDMMC_0 in Boot Configuration Word mustbe set to 1.
NAND Flash NFC PA0 to PA21, PC11 toPC31, PD0 to PD8
Field NFC in Boot Configuration Word mustbe set to "01". IOSET2 is selected. (SeeNotes below)
QSPI Flash QSPI0 PA0 to PA5Field QSPI_0 in Boot Configuration Wordmust be set to "00". IOSET1 is selected. (SeeNotes below)
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 31
Memory Type Interface PIO Comments
PA14 to PA19Field QSPI_0 in Boot Configuration Wordmust be set to "01". IOSET2 is selected. (SeeNotes below)
PA22 to PA27Field QSPI_0 in Boot Configuration Wordmust be set to "10". IOSET3 is selected. (SeeNotes below)
QSPI1 PB5 to PB10
Need to tie DIS-BOOT pin to GND. BitsQSPI_1 in Boot Configuration Word must beset to "01". IOSET2 is selected. (See Notesbelow)
SPI Flash
SPI0
PA14 to PA17Bits SPI_0 in Boot Configuration Word mustbe set to "00". IOSET1 is selected. (SeeNotes below)
PA30, PA31, PB0,PB1
Bits SPI_0 in Boot Configuration Word mustbe set to "01". IOSET2 is selected. (SeeNotes below)
SPI1
PA22 to PA25Bits SPI_1 in Boot Configuration Word mustbe set to "01". IOSET2 is selected. (SeeNotes below)
PC1 to PC4Bits SPI_1 in Boot Configuration Word mustbe set to "00". IOSET1 is selected. (SeeNotes below)
Note: For these external memory configurations, set the EXT_MEM_BOOT_ENABLE bit to "1" in BootConfiguration Word.
Note: The Boot Configuration Word allows several customizations of the boot sequence. For details,refer to the section "Boot Configuration" in the SAMA5D2 datasheet, document no. DS60001476.
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 32
8. Debug ConsiderationsThe SAMA5D27 SOM1 JTAG access is disabled during the execution of the ROM code sequence. It isre-enabled when jumping into SRAM when a valid code has been found on an external NVM, at the sametime the ROM memory and fuses are hidden. If no valid boot is found on an external NVM, the ROM code
enables the USB connection and one UART serial port starts the standard SAM-BA monitor locks access to the ROM memory re-enables the JTAG connection
The SAMA5D27 SOM1 has multiple debug and JTAG settings. For more information, refer to theSAMA5D2 datasheet, document no. DS60001476, SECUMOD JTAG Protection Control Register,"Customer Fuse Matrix" and "Special Function Bits".
The JTAG I/O set can be configured. For correct operations, the I/O set to be used is JTAG_IOSET_3,i.e., the field JTAG_IO_SET in the Boot Configuration Word must be written with value '2'.(1)
Note: Due to IO conflict on line PA22, JTAG_IOSET_4 must not be implemented when SDMMC1 isused as an NVM boot media. See the SAMA5D2 datasheet, document no. DS60001476, BootConfiguration Word.
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 33
9. Electrical CharacteristicsThis section provides an overview of the electrical characteristics of the SAMA5D27 SOM1 module.Absolute maximum ratings for the SAMA5D27 SOM1 module are listed below. Exposure to thesemaximum rating conditions for extended periods may affect device reliability. Functional operation of themodule at these or any other conditions, above the parameters indicated in the operation listings of thisspecification, is not implied.
9.1 Absolute Maximum RatingsTable 9-1.Absolute Maximum Ratings
Parameter Conditions Min. Max.
Storage Temperature -60C +150C
Maximum Operating Temperature -40C +85C
Voltage on Inputs Pins With respect to ground -0.3V +4.0V
Maximum Voltage
On VDDIN_3V3 Pads +4.0V
On VDDBU Pad +4.0V
On VDDSDHC Pad +4.0V
On VDDISC Pad +4.0V
Important: Stresses beyond those listed under Absolute Maximum Ratings may causepermanent damage to the device. This is a stress rating only and functional operation of thedevice at these or other conditions beyond those indicated in the operational sections of thisspecification is not implied. Exposure to absolute maximum rating conditions for extendedperiods may affect device reliability.
9.2 Operational CharacteristicsThe following characteristics are applicable to the operating temperature range TA = -40C to +85C,unless otherwise specified.
Table 9-2.Table 7. Power Supplies Operating Conditions
Pad Parameters Conditions Min. Typ. Max.
VDDIN_3V3DC Supply 3.0V 3.3V 3.6V
Maximum InputCurrent 450mA
VDDBUDC Supply Must be established first or atthe same time as VDDIN_3V3. 1.65V 3.3V 3.6V
Maximum InputCurrent 0.1 mA
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 34
Pad Parameters Conditions Min. Typ. Max.
VDDSDHCDC Supply SDHC I/Os Lines 1.65V 3.3V 3.6V
Maximum InputCurrent 30mA
VDDISCDC Supply ISC I/Os Lines 1.65V 3.3V 3.6V
Maximum InputCurrent 30mA
9.3 DC Electrical Characteristics
9.3.1 Standard InterfacesThe following characteristics are applicable to the operating temperature range TA = -40C to +85C,unless otherwise specified.
Table 9-3.DC Electrical Characteristicsfor GPIO Inputs
Pad Parameters Conditions Min. Typ. Max.
VILLow-level InputVoltage All GPIO @ 3.3V -0.3V 0.4V
VIHHigh-level InputVoltage All GPIO @ 3.3V 2.3V 3.6V
VOLLow-level OutputVoltage IO Max. 0.41V
VOHHigh-level OutputVoltage IO Max. 2.9V --
IILLow-level InputCurrent All GPIO @ 3.3V -1A 1A
IIHHigh-level InputCurrent All GPIO @ 3.3V -1A 1A
IOLLow-level OutputCurrent
All GPIO @ 3.3V / Low -2mA --
All GPIO @ 3.3V / High -32mA --
IOHHigh-level OutputCurrent
All GPIO @ 3.3V / Low 2mA
All GPIO @ 3.3V / High 32mA
RPULLUP Pull-up ResistorsAll GPIO @ 3.3V and PDxx inAD mode. 280k 380k 480k
All IOs in GPIO mode @3.3V. 40k 66k 130k
RPULLDOWNPull-downResistors
All GPIO @ 3.3V and PDxx inAD mode 280 k 380k 480k
All IOs in GPIO mode @3.3V. 40k 77k 160k
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 35
Note: This table applies to all the following pads: PA0PA31, PB0PB31, PC0PC31, PD0PD8, PD19-PD30.
9.3.2 Other PIOsThe following characteristics are applicable to the operating temperature range TA = -40C to +85C,unless otherwise specified.
Table 9-4.Table 7. DC Electrical Characteristics for System Inputs
Pad Parameters Conditions Min. Typ. Max.
VILLow-level InputVoltage DIS_BOOT 1.0V
VIHHigh-level InputVoltage DIS_BOOT 2.3V
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 36
10. Mechanical Characteristics
10.1 Module DimensionsThe SAMA5D27 SOM1 has dimensions of 40mm x 38mm with the specific following mechanicalcharacteristics.
Figure 10-1.System-On-Module Dimensions
123456789101112131415161718192021222324252627282930313233343536373839404142
43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
176
175
174
173
172
171
170
127126125124123122121120119118117116115114113112111110109108107106105104103102101100
9998979695949392919089
130129128
(TP1) (TP2)
(TP7)
(TP9)
(TP10)
(TP5)
(TP6)
(TP4)
(TP3)
(TP8)
177178
179
180
181
184183
185
186
182
PIN 1 CORNERE1
D1 D2
E2S
A1
TOP
VIEW
P1b
aaa
P2f ff f x n
E
D
e
B
BOTT
OM
VIE
W
P2Eb
P2Ea jjjjjj x m
Pads :Body :Pads Pitch :
17640 x 38 x 2.80
0.8A11SAMA5D27-SOM1_POD
02/05/2017
SAMA5D27-SOM1 DIMENSIONS Drawn by : R C R
Units: mm
P1t
aaa
P2f fn x
47 48 8259 70
4
31
4191
173
89
252627
51 54
170
155
Table 10-1.System-On-Module Dimensions
SymbolCommon Dimensions
CommentsMin. Typ. Max.
Body SizeX E -- 40.000 40.100
Y D -- 38.000 38.100
Pad Pitch e -- 0.800 --
PCB Thickness S 1.150 1.200 1.250
Total Thickness A1 -- 2.750 2.800
PCB Angle Hole Diameter(1) B 0.200
Pad Length(1) Bottom Side P1b 1.500
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 37
SymbolCommon Dimensions
CommentsMin. Typ. Max.
Top Side P1t 0.800
Pad Width(1) P2 0.600 Solder Maskdefined 0.550
Pad Space(1) aaa 0.200
Opening Drilling Diameterfff
0.400
0.400 typicminusmetallization
Pad Count n 176
Edge Center toCenter
X E1 37.550 37.630 37.700
Y D1 34.400 34.480 34.550
X E2 35.550 35.630 35.700
Y D2 32.400 32.480 32.550
Pad Axis to Edge(1)X P2Ea 2.000
Y P2Eb 2.600
Note:1. Tolerances are defined upon:
IPC A600 - Class2 IPC 2615
Warning: Test points placed on the bottom side are used for factory test only. It is not possibleto connect external devices on these test points.
10.2 Module Land PatternThe SAMA5D27 SOM1 Module has the following recommended Land Pattern characteristics.
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 38
Figure 10-2.System-On-Module Land Pattern
Pads :Body :Pads Pitch :
17640 x 38 x 2.80
0.8A11SAMA5D27-SOM1_POD
02/05/2017
SAMA5D27-SOM1 DIMENSIONS Drawn by : R C R
LAND PATTERN RECOMMENDATIONS
PIN 1 CORNER
S1
S2
Wk
L
Inside square, keepout areaNo vias, no tracks, no copper are allowed.
Units: mm
Table 10-2.System-On-Module Land Pattern Dimensions
SymbolCommon Dimensions
CommentsMin. Typ. Max.
Land Pattern Pad Width W 0.600 Solder MaskDefined0.550
Land Pattern Pad Length L 2.000
Land Pattern Pad X Space S1 37.000
Land Pattern Pad Y Space S2 35.000
Land Pattern Pad Space k 0.200
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 39
11. Reflow ProfileThe SAMA5D27 SOM1 was assembled using standard lead-free reflow profile IPC/JEDEC JSTD-020.
The SAMA5D27 SOM1 can be soldered to the host PCB by using the standard leaded and lead-freesolder reflow profile. To avoid damage to the module, follow these recommendations:
Follow solder reflow recommendations provided in Microchip Technology Application Note AN233Solder Reflow Recommendation (DS00233).
Do not exceed the peak temperature (TP) of 250C. Refer to the solder paste datasheet for specific reflow profile recommendations. Use no-clean flux solder paste. Use no-clean flux solder paste Use only one flow. If the PCB requires multiple flows, mount the module at the time of the final flow.
Figure 11-1.Reflow Profile Example used for Soldering SAMA5D27 SOM1 Module on SAMA5D27-SOM1-EK1 board
Z6
COO
L1C3Z8Z7C2Z5Z4C1Z2 Z3Z1
20
40
60
80
100
120
140
200
160
180
217,00C
235,00C
220
280
240
260
Tem
pera
ture
(C)
Time (mm:ss,tt)00:00,00 01:00,00 02:00,00 03:00,00 04:00,00 05:00,00 06:00,00
#2 PCB mobile rail#4 PCB center#6 PCB f xed rail
Probe
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 40
12. Ordering InformationTable 12-1.Ordering Information
Ordering Code Version Package Carrier Type OperatingTemperature Range
ATSAMA5D27-SOM1 1 176-pin 38x40mm Tray -40C to +85C
ATSAMA5D27-SOM1-EVAL 176-pin 38x40mm Tray Room temperature
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 41
13. Revision HistoryTable 13-1.SAMA5D27 SOM1 Datasheet, Rev. DS60001521A, Oct-2017
Changes
First issue.
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 42
The Microchip Web Site
Microchip provides online support via our web site at http://www.microchip.com/. This web site is used asa means to make files and information easily available to customers. Accessible by using your favoriteInternet browser, the web site contains the following information:
Product Support Data sheets and errata, application notes and sample programs, designresources, users guides and hardware support documents, latest software releases and archivedsoftware
General Technical Support Frequently Asked Questions (FAQ), technical support requests,online discussion groups, Microchip consultant program member listing
Business of Microchip Product selector and ordering guides, latest Microchip press releases,listing of seminars and events, listings of Microchip sales offices, distributors and factoryrepresentatives
Customer Change Notification Service
Microchips customer notification service helps keep customers current on Microchip products.Subscribers will receive e-mail notification whenever there are changes, updates, revisions or erratarelated to a specified product family or development tool of interest.
To register, access the Microchip web site at http://www.microchip.com/. Under Support, click onCustomer Change Notification and follow the registration instructions.
Customer Support
Users of Microchip products can receive assistance through several channels:
Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support
Customers should contact their distributor, representative or Field Application Engineer (FAE) for support.Local sales offices are also available to help customers. A listing of sales offices and locations is includedin the back of this document.
Technical support is available through the web site at: http://www.microchip.com/support
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 43
http://www.microchip.com/http://www.microchip.com/http://www.microchip.com/support
Product Identification System
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Architecture
Product Group
ATSAMA5 D27 - SOM1
System on Module
Version
Architecture: SAMA5
Product Group: D27
System on Module: SOM
Version: 1
Microchip Devices Code Protection Feature
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the
market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of
these methods, to our knowledge, require using the Microchip products in a manner outside theoperating specifications contained in Microchips Data Sheets. Most likely, the person doing so isengaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their
code. Code protection does not mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving thecode protection features of our products. Attempts to break Microchips code protection feature may be aviolation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your softwareor other copyrighted work, you may have a right to sue for relief under that Act.
Legal Notice
Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates. It is your responsibility to ensure that yourapplication meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORYOR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITSCONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE.Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 44
support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend,indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resultingfrom such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectualproperty rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings,BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo,Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA,SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks ofMicrochip Technology Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLightLoad, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom,chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController,dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit SerialProgramming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi,motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, OmniscientCode Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REALICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, TotalEndurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA aretrademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary ofMicrochip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their respective companies. 2017, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-2203-7
Quality Management System Certified by DNV
ISO/TS 16949Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and waferfabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in Californiaand India. The Companys quality system processes and procedures are for its PIC MCUs and dsPIC
DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory andanalog products. In addition, Microchips quality system for the design and manufacture of developmentsystems is ISO 9001:2000 certified.
SAMA5D27 SOM1
2017 Microchip Technology Inc. Datasheet DS60001521A-page 45
AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPECorporate Office2355 West Chandler Blvd.Chandler, AZ 85224-6199Tel: 480-792-7200Fax: 480-792-7277Technical Support:http://www.microchip.com/supportWeb Address:www.microchip.comAtlantaDuluth, GATel: 678-957-9614Fax: 678-957-1455Austin, TXTel: 512-257-3370BostonWestborough, MATel: 774-760-0087Fax: 774-760-0088ChicagoItasca, ILTel: 630-285-0071Fax: 630-285-0075DallasAddison, TXTel: 972-818-7423Fax: 972-818-2924DetroitNovi, MITel: 248-848-4000Houston, TXTel: 281-894-5983IndianapolisNoblesville, INTel: 317-773-8323Fax: 317-773-5453Tel: 317-536-2380Los AngelesMission Viejo, CATel: 949-462-9523Fax: 949-462-9608Tel: 951-273-7800Raleigh, NCTel: 919-844-7510New York, NYTel: 631-435-6000San Jose, CATel: 408-735-9110Tel: 408-436-4270Canada - TorontoTel: 905-695-1980Fax: 905-695-2078
Asia Pacific OfficeSuites 3707-14, 37th FloorTower 6, The GatewayHarbour City, KowloonHong KongTel: 852-2943-5100Fax: 852-2401-3431Australia - SydneyTel: 61-2-9868-6733Fax: 61-2-9868-6755China - BeijingTel: 86-10-8569-7000Fax: 86-10-8528-2104China - ChengduTel: 86-28-8665-5511Fax: 86-28-8665-7889China - ChongqingTel: 86-23-8980-9588Fax: 86-23-8980-9500China - DongguanTel: 86-769-8702-9880China - GuangzhouTel: 86-20-8755-8029China - HangzhouTel: 86-571-8792-8115Fax: 86-571-8792-8116China - Hong Kong SARTel: 852-2943-5100Fax: 852-2401-3431China - NanjingTel: 86-25-8473-2460Fax: 86-25-8473-2470China - QingdaoTel: 86-532-8502-7355Fax: 86-532-8502-7205China - ShanghaiTel: 86-21-3326-8000Fax: 86-21-3326-8021China - ShenyangTel: 86-24-2334-2829Fax: 86-24-2334-2393China - ShenzhenTel: 86-755-8864-2200Fax: 86-755-8203-1760China - WuhanTel: 86-27-5980-5300Fax: 86-27-5980-5118China - XianTel: 86-29-8833-7252Fax: 86-29-8833-7256
China - XiamenTel: 86-592-2388138Fax: 86-592-2388130China - ZhuhaiTel: 86-756-3210040Fax: 86-756-3210049India - BangaloreTel: 91-80-3090-4444Fax: 91-80-3090-4123India - New DelhiTel: 91-11-4160-8631Fax: 91-11-4160-8632India - PuneTel: 91-20-3019-1500Japan - OsakaTel: 81-6-6152-7160Fax: 81-6-6152-9310Japan - TokyoTel: 81-3-6880- 3770Fax: 81-3-6880-3771Korea - DaeguTel: 82-53-744-4301Fax: 82-53-744-4302Korea - SeoulTel: 82-2-554-7200Fax: 82-2-558-5932 or82-2-558-5934Malaysia - Kuala LumpurTel: 60-3-6201-9857Fax: 60-3-6201-9859Malaysia - PenangTel: 60-4-227-8870Fax: 60-4-227-4068Philippines - ManilaTel: 63-2-634-9065Fax: 63-2-634-9069SingaporeTel: 65-6334-8870Fax: 65-6334-8850Taiwan - Hsin ChuTel: 886-3-5778-366Fax: 886-3-5770-955Taiwan - KaohsiungTel: 886-7-213-7830Taiwan - TaipeiTel: 886-2-2508-8600Fax: 886-2-2508-0102Thailand - BangkokTel: 66-2-694-1351Fax: 66-2-694-1350
Austria - WelsTel: 43-7242-2244-39Fax: 43-7242-2244-393Denmark - CopenhagenTel: 45-4450-2828Fax: 45-4485-2829Finland - EspooTel: 358-9-4520-820France - ParisTel: 33-1-69-53-63-20Fax: 33-1-69-30-90-79France - Saint CloudTel: 33-1-30-60-70-00Germany - GarchingTel: 49-8931-9700Germany - HaanTel: 49-2129-3766400Germany - HeilbronnTel: 49-7131-67-3636Germany - KarlsruheTel: 49-721-625370Germany - MunichTel: 49-89-627-144-0Fax: 49-89-627-144-44Germany - RosenheimTel: 49-8031-354-560Israel - RaananaTel: 972-9-744-7705Italy - MilanTel: 39-0331-742611Fax: 39-0331-466781Italy - PadovaTel: 39-049-7625286Netherlands - DrunenTel: 31-416-690399Fax: 31-416-690340Norway - TrondheimTel: 47-7289-7561Poland - WarsawTel: 48-22-3325737Romania - BucharestTel: 40-21-407-87-50Spain - MadridTel: 34-91-708-08-90Fax: 34-91-708-08-91Sweden - GothenbergTel: 46-31-704-60-40Sweden - StockholmTel: 46-8-5090-4654UK - WokinghamTel: 44-118-921-5800Fax: 44-118-921-5820
Worldwide Sales and Service
2017 Microchip Technology Inc. Datasheet DS60001521A-page 46
IntroductionFeaturesApplicationsTable of Contents1.Description2.Reference Documents3.Block Diagram4.Pinout4.1.Pinout Overview4.2.Pin List
5.Functional Description5.1.SAMA5D27 System-In-Package5.2.Power Supplies5.3.System Control5.4.Ethernet PHY5.5.QSPI Memory5.6.EEPROM Memory
6.Power Supply Connections and Timing Sequences6.1.Power Supply Configuration #16.2.Power Supply Configuration #26.3.Power Supply Configuration #36.4.Power Supply Configuration #4
7.Booting Guidelines7.1.Boot Process7.2.Boot Configuration7.3.NVM Programming7.4.Boot From External Memory
8.Debug Considerations9.Electrical Characteristics9.1.Absolute Maximum Ratings9.2.Operational Characteristics9.3.DC Electrical Characteristics9.3.1.Standard Interfaces9.3.2.Other PIOs
10.Mechanical Characteristics10.1.Module Dimensions10.2.Module Land Pattern
11.Reflow Profile12.Ordering Information13.Revision HistoryThe Microchip Web SiteCustomer Change Notification ServiceCustomer SupportProduct Identification SystemMicrochip Devices Code Protection FeatureLegal NoticeTrademarksQuality Management System Certified by DNVWorldwide Sales and Service