RTN 910 IDU Hardware Description-(V100R003C03_01)

OptiX RTN 910 Radio Transmission System V100R003C03

IDU Hardware DescriptionIssue Date 01 2011-10-30

HUAWEI TECHNOLOGIES CO., LTD.

Copyright Huawei Technologies Co., Ltd. 2011. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd.

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NoticeThe purchased products, services and features are stipulated by the contract made between Huawei and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied. The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute the warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.Address: Huawei Industrial Base Bantian, Longgang Shenzhen 518129 People's Republic of China http://www.huawei.com [email protected]

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OptiX RTN 910 Radio Transmission System IDU Hardware Description

About This Document

About This DocumentRelated VersionsThe following table lists the product versions related to this document. Product Name OptiX RTN 910 iManager U2000 Version V100R003C03 V100R006C00

Intended AudienceThis document is intended for: l l l l l l Network planning engineer Hardware installation engineer Installation and commissioning engineer Field maintenance engineer Data configuration engineer System maintenance engineer

Before reading this document, you need to be familiar with the following: l l Basics of digital microwave communication Basics of the OptiX RTN 910

Symbol ConventionsThe symbols that may be found in this document are defined as follows. Symbol Description Indicates a hazard with a high level of risk, which if not avoided, will result in death or serious injury.Issue 01 (2011-10-30) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. ii


About This Document

Symbol

Description Indicates a hazard with a medium or low level of risk, which if not avoided, could result in minor or moderate injury. Indicates a potentially hazardous situation, which if not avoided, could result in equipment damage, data loss, performance degradation, or unexpected results. Indicates a tip that may help you solve a problem or save time. Provides additional information to emphasize or supplement important points of the main text.

General ConventionsThe general conventions that may be found in this document are defined as follows. Convention Times New Roman Boldface Italic Courier New Description Normal paragraphs are in Times New Roman. Names of files, directories, folders, and users are in boldface. For example, log in as user root. Book titles are in italics. Examples of information displayed on the screen are in Courier New.

Command ConventionsThe command conventions that may be found in this document are defined as follows. Convention Boldface Italic [] { x | y | ... } Description The keywords of a command line are in boldface. Command arguments are in italics. Items (keywords or arguments) in brackets [ ] are optional. Optional items are grouped in braces and separated by vertical bars. One item is selected.Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. iii

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Convention [ x | y | ... ] { x | y | ... }*

Description Optional items are grouped in brackets and separated by vertical bars. One item is selected or no item is selected. Optional items are grouped in braces and separated by vertical bars. A minimum of one item or a maximum of all items can be selected. Optional items are grouped in brackets and separated by vertical bars. Several items or no item can be selected.

[ x | y | ... ]*

GUI ConventionsThe GUI conventions that may be found in this document are defined as follows. Convention Boldface > Description Buttons, menus, parameters, tabs, window, and dialog titles are in boldface. For example, click OK. Multi-level menus are in boldface and separated by the ">" signs. For example, choose File > Create > Folder.

Update HistoryUpdates between document issues are cumulative. Thus, the latest document issue contains all updates made in previous issues.

Updates in Issue 01 (2011-10-30) Based on Product Version V100R003C03This document is the first issue for the V100R003C03 product version.

Issue 01 (2011-10-30)


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Contents

ContentsAbout This Document.....................................................................................................................ii 1 Introduction....................................................................................................................................11.1 Network Application..........................................................................................................................................2 1.2 Components........................................................................................................................................................3 1.3 Configuration Modes..........................................................................................................................................7

2 Chassis.............................................................................................................................................82.1 Chassis Structure................................................................................................................................................9 2.2 Installation Mode................................................................................................................................................9 2.3 Air Flow..............................................................................................................................................................9 2.4 IDU Labels.......................................................................................................................................................10

3 Boards............................................................................................................................................133.1 Board Appearance............................................................................................................................................15 3.2 Board List.........................................................................................................................................................16 3.3 CSTA................................................................................................................................................................23 3.3.1 Version Description.................................................................................................................................23 3.3.2 Functions and Features............................................................................................................................23 3.3.3 Working Principle....................................................................................................................................27 3.3.4 Front Panel...............................................................................................................................................30 3.3.5 DIP Switches and CF Card......................................................................................................................39 3.3.6 Valid Slots...............................................................................................................................................41 3.3.7 Board Feature Code.................................................................................................................................42 3.3.8 Types of SFP Modules............................................................................................................................42 3.3.9 Board Parameter Settings........................................................................................................................42 3.3.10 Technical Specifications........................................................................................................................43 3.4 CSHA/CSHB/CSHC........................................................................................................................................46 3.4.1 Version Description.................................................................................................................................46 3.4.2 Functions and Features............................................................................................................................47 3.4.3 Working Principle....................................................................................................................................56 3.4.4 Front Panel...............................................................................................................................................59 3.4.5 DIP Switches and CF Card......................................................................................................................73 3.4.6 Valid Slots...............................................................................................................................................75 3.4.7 Board Feature Code.................................................................................................................................76 Issue 01 (2011-10-30) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. v


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3.4.8 Types of SFP Modules............................................................................................................................76 3.4.9 Board Parameter Settings........................................................................................................................78 3.4.10 Technical Specifications........................................................................................................................79 3.5 CSHD/CSHE....................................................................................................................................................87 3.5.1 Version Description.................................................................................................................................87 3.5.2 Functions and Features............................................................................................................................88 3.5.3 Working Principle....................................................................................................................................96 3.5.4 Front Panel.............................................................................................................................................100 3.5.5 DIP Switches and CF Card....................................................................................................................113 3.5.6 Valid Slots.............................................................................................................................................115 3.5.7 Board Feature Code...............................................................................................................................116 3.5.8 Types of SFP Modules..........................................................................................................................116 3.5.9 Board Parameter Settings......................................................................................................................118 3.5.10 Technical Specifications......................................................................................................................118 3.6 IF1...................................................................................................................................................................125 3.6.1 Version Description...............................................................................................................................125 3.6.2 Functions and Features..........................................................................................................................125 3.6.3 Working Principle and Signal Flow......................................................................................................127 3.6.4 Front Panel.............................................................................................................................................132 3.6.5 Valid Slots.............................................................................................................................................134 3.6.6 Board Parameter Settings......................................................................................................................134 3.6.7 Technical Specifications........................................................................................................................135 3.7 IFU2................................................................................................................................................................136 3.7.1 Version Description...............................................................................................................................136 3.7.2 Functions and Features..........................................................................................................................137 3.7.3 Working Principle and Signal Flow......................................................................................................139 3.7.4 Front Panel.............................................................................................................................................143 3.7.5 Valid Slots.............................................................................................................................................145 3.7.6 Board Parameter Settings......................................................................................................................145 3.7.7 Technical Specifications........................................................................................................................146 3.8 IFX2................................................................................................................................................................148 3.8.1 Version Description...............................................................................................................................148 3.8.2 Functions and Features..........................................................................................................................148 3.8.3 Working Principle and Signal Flow......................................................................................................151 3.8.4 Front Panel.............................................................................................................................................155 3.8.5 Valid Slots.............................................................................................................................................157 3.8.6 Board Parameter Settings......................................................................................................................158 3.8.7 Technical Specifications........................................................................................................................159 3.9 ISU2................................................................................................................................................................161 3.9.1 Version Description...............................................................................................................................161 3.9.2 Functions and Features..........................................................................................................................161 3.9.3 Working Principle and Signal Flow......................................................................................................164 Issue 01 (2011-10-30) Huawei Proprietary and Confidential Copyright Huawei Technologies 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3.9.4 Front Panel.............................................................................................................................................168 3.9.5 Valid Slots.............................................................................................................................................170 3.9.6 Board Parameter Settings......................................................................................................................171 3.9.7 Technical Specifications........................................................................................................................171 3.10 ISX2..............................................................................................................................................................175 3.10.1 Version Description.............................................................................................................................175 3.10.2 Functions and Features........................................................................................................................175 3.10.3 Working Principle and Signal Flow....................................................................................................178 3.10.4 Front Panel...........................................................................................................................................182 3.10.5 Valid Slots...........................................................................................................................................185 3.10.6 Board Parameter Settings....................................................................................................................185 3.10.7 Technical Specifications......................................................................................................................186 3.11 EM6T/EM6TA/EM6F/EM6FA....................................................................................................................191 3.11.1 Version Description.............................................................................................................................191 3.11.2 Functions and Features........................................................................................................................191 3.11.3 Working Principle and Signal Flow....................................................................................................195 3.11.4 Front Panel...........................................................................................................................................197 3.11.5 Valid Slots...........................................................................................................................................204 3.11.6 Types of SFP Modules........................................................................................................................204 3.11.7 Board Parameter Settings....................................................................................................................206 3.11.8 Technical Specifications......................................................................................................................207 3.12 EMS6............................................................................................................................................................212 3.12.1 Version Description.............................................................................................................................212 3.12.2 Functions and Features........................................................................................................................212 3.12.3 Working Principle and Signal Flow....................................................................................................216 3.12.4 Front Panel...........................................................................................................................................219 3.12.5 Valid Slots...........................................................................................................................................223 3.12.6 Types of SFP Modules........................................................................................................................224 3.12.7 Board Parameter Settings....................................................................................................................225 3.12.8 Technical Specifications......................................................................................................................225 3.13 EFP8.............................................................................................................................................................227 3.13.1 Version Description.............................................................................................................................227 3.13.2 Functions and Features........................................................................................................................227 3.13.3 Working Principle and Signal Flow....................................................................................................231 3.13.4 Front Panel...........................................................................................................................................233 3.13.5 Valid Slots...........................................................................................................................................236 3.13.6 Board Parameter Settings....................................................................................................................237 3.13.7 Technical Specifications......................................................................................................................237 3.14 SL1D/SL1DA...............................................................................................................................................238 3.14.1 Version Description.............................................................................................................................238 3.14.2 Functions and Features........................................................................................................................238 3.14.3 Working Principle and Signal Flow....................................................................................................240 Issue 01 (2011-10-30) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. vii


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3.14.4 Front Panel...........................................................................................................................................242 3.14.5 Valid Slots...........................................................................................................................................244 3.14.6 Board Feature Code.............................................................................................................................245 3.14.7 Board Parameter Settings....................................................................................................................245 3.14.8 Technical Specifications......................................................................................................................245 3.15 ML1/MD1.....................................................................................................................................................247 3.15.1 Version Description.............................................................................................................................247 3.15.2 Functions and Features........................................................................................................................247 3.15.3 Working Principle and Signal Flow....................................................................................................249 3.15.4 Front Panel...........................................................................................................................................252 3.15.5 Valid Slots...........................................................................................................................................255 3.15.6 Board Feature Code.............................................................................................................................256 3.15.7 Board Parameter Settings....................................................................................................................256 3.15.8 Technical Specifications......................................................................................................................256 3.16 SP3S/SP3D...................................................................................................................................................257 3.16.1 Version Description.............................................................................................................................257 3.16.2 Functions and Features........................................................................................................................257 3.16.3 Working Principle and Signal Flow....................................................................................................258 3.16.4 Front Panel...........................................................................................................................................261 3.16.5 Valid Slots...........................................................................................................................................265 3.16.6 Board Feature Code.............................................................................................................................266 3.16.7 Board Parameter Settings....................................................................................................................266 3.16.8 Technical Specifications......................................................................................................................266 3.17 PIU................................................................................................................................................................267 3.17.1 Version Description.............................................................................................................................267 3.17.2 Functions and Features........................................................................................................................268 3.17.3 Working Principle................................................................................................................................268 3.17.4 Front Panel...........................................................................................................................................269 3.17.5 Valid Slots...........................................................................................................................................271 3.17.6 Technical Specifications......................................................................................................................271 3.18 FAN..............................................................................................................................................................271 3.18.1 Version Description.............................................................................................................................271 3.18.2 Functions and Features........................................................................................................................272 3.18.3 Working Principle................................................................................................................................272 3.18.4 Front Panel...........................................................................................................................................273 3.18.5 Valid Slots...........................................................................................................................................274 3.18.6 Technical Specifications......................................................................................................................275

4 Accessories..................................................................................................................................2764.1 E1 Panel..........................................................................................................................................................277 4.2 PDU................................................................................................................................................................279 4.2.1 Front Panel.............................................................................................................................................279 4.2.2 Functions and Working Principle..........................................................................................................280 Issue 01 (2011-10-30) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. viii


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4.2.3 Power Distribution Mode......................................................................................................................281

5 Cables...........................................................................................................................................2835.1 Power Cable....................................................................................................................................................285 5.2 PGND Cable...................................................................................................................................................285 5.2.1 IDU PGND Cable..................................................................................................................................285 5.2.2 E1 Panel PGND Cable...........................................................................................................................286 5.3 IF Jumper........................................................................................................................................................287 5.4 XPIC Cable.....................................................................................................................................................288 5.5 Fiber Jumper...................................................................................................................................................289 5.6 STM-1 Cable..................................................................................................................................................291 5.7 E1 Cables........................................................................................................................................................292 5.7.1 E1 Cable Connected to the External Equipment...................................................................................292 5.7.2 E1 Cable Connected to the E1 Panel.....................................................................................................296 5.8 Orderwire Cable.............................................................................................................................................298 5.9 Network Cable................................................................................................................................................298

A Parameters Description...........................................................................................................302A.1 Parameters for Network Management...........................................................................................................303 A.1.1 Parameters for NE Management...........................................................................................................303 A.1.1.1 Parameter Description: NE Searching.........................................................................................303 A.1.1.2 Parameter Description: NE Creation...........................................................................................308 A.1.1.3 Parameter Description: Attribute_Changing NE IDs..................................................................310 A.1.1.4 Parameter Description: NE Time Synchronization.....................................................................311 A.1.1.5 Parameter Description: Localization Management of the NE Time............................................314 A.1.1.6 Parameter Description: Standard NTP Key Management...........................................................315 A.1.1.7 Parameter Description: License Management.............................................................................316 A.1.1.8 Parameter Description: Automatic Disabling of the Functions of NEs.......................................317 A.1.2 Parameters for Communications Management.....................................................................................318 A.1.2.1 Parameter Description: NE Communication Parameter Setting..................................................318 A.1.2.2 Parameter Description: DCC Management_DCC Rate Configuration.......................................319 A.1.2.3 Parameter Description: DCC Management_DCC Transparent Transmission Management.......321 A.1.2.4 Parameter Description: ECC Management_Ethernet Port Extended ECC..................................323 A.1.2.5 Parameter Description: NE ECC Link Management...................................................................324 A.1.2.6 Parameter Description: ECC Link Management_Availability Test............................................325 A.1.2.7 Parameter Description: IP Protocol Stack Management_IP Route Management........................327 A.1.2.8 Parameter Description: IP Protocol Stack Management_IP Route Management Creation.........328 A.1.2.9 Parameter Description: IP Protocol Stack Management_Availability Test.................................329 A.1.2.10 Parameter Description: IP Protocol Stack Management_OSPF Parameter Settings.................330 A.1.2.11 Parameter Description: IP Protocol Stack_Proxy ARP.............................................................335 A.1.2.12 Parameter Description: Management of Multiple OSPF Areas.................................................336 A.1.2.13 Parameter Description: Management of Multiple OSPF Areas_Adding OSPF Areas..............337 A.1.2.14 Parameter Description: Management of Multiple OSPF Areas_Adding Routes to Be Manually Aggregated................................................................................................................................................338 Issue 01 (2011-10-30) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. ix


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A.1.2.15 Parameter Description: Port OSPF Setting................................................................................339 A.1.2.16 Parameter Description: OSI Management_Network Layer Parameter......................................339 A.1.2.17 Parameter Description: OSI Management_Routing Table........................................................340 A.1.2.18 Parameter Description: OSI Management_OSI Tunnel............................................................341 A.1.2.19 Parameter Description: OSI Management_OSI Port Parameters..............................................345 A.1.2.20 Parameter Description: DCN Management_Bandwidth Management......................................346 A.1.2.21 Parameter Description: DCN Management_Port Setting..........................................................347 A.1.2.22 Parameter Description: DCN Management_Access Control.....................................................347 A.1.2.23 Parameter Description: DCN Management_Packet Control.....................................................348 A.1.2.24 Parameter Description: L2 DCN Management..........................................................................349 A.1.2.25 Parameter Description: Access Control.....................................................................................350 A.1.3 Parameters for Network Security Management....................................................................................351 A.1.3.1 Parameter Description: NE User Management............................................................................351 A.1.3.2 Parameter Description: NE User Management_Creation............................................................351 A.1.3.3 Parameter Description: LCT Access Control..............................................................................354 A.1.3.4 Parameter Description: RADIUS Configuration_Creation.........................................................355 A.1.3.5 Parameter Description: RADIUS Configuration_RADIUS Server.............................................356 A.1.3.6 Parameter Description: Enabling/Disabling the RADIUS Function...........................................357 A.2 Radio Link Parameters..................................................................................................................................358 A.2.1 Parameter Description: Link Configuration_XPIC Workgroup_Creation...........................................358 A.2.2 Parameter Description: Link Configuration_XPIC..............................................................................363 A.2.3 Parameter Description: N+1 Protection_Create...................................................................................370 A.2.4 Parameter Description: N+1 Protection................................................................................................371 A.2.5 Parameter Description: IF 1+1 Protection_Create................................................................................373 A.2.6 Parameter Description: IF 1+1 Protection............................................................................................376 A.2.7 Parameter Description: Link Configuration_Creating a PLA Group...................................................380 A.2.8 Parameter Description: Link Configuration_PLA................................................................................380 A.2.9 Parameter: Link Configuration_IF/ODU Configuration......................................................................381 A.3 Multiplex Section Protection Parameters......................................................................................................391 A.3.1 Parameter Description: Linear MSP_Creation.....................................................................................391 A.3.2 Parameter Description: Linear MSP.....................................................................................................395 A.4 SDH/PDH Service Parameters......................................................................................................................399 A.4.1 Parameter Description: SDH Service Configuration_Creation............................................................399 A.4.2 Parameter Description: SDH Service Configuration_SNCP Service Creation....................................401 A.4.3 Parameter Description: SDH Service Configuration_Converting Normal Services Into SNCP Services ........................................................................................................................................................................405 A.4.4 Parameter Description: SDH Service Configuration............................................................................409 A.4.5 Parameter Description: SNCP Service Control....................................................................................411 A.4.6 Parameter Description: TU_AIS Insertion...........................................................................................414 A.5 Parameters for Board Interfaces....................................................................................................................415 A.5.1 Parameter Description: Working Modes of Ports.................................................................................415 A.5.2 PDH Port Parameters............................................................................................................................416 A.5.2.1 Parameter Description: PDH Ports_Basic Attributes..................................................................416 Issue 01 (2011-10-30) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. x


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A.5.2.2 Parameter Description: PDH Ports_Advanced Attributes...........................................................417 A.5.3 Parameters for the Ports on Ethernet Boards........................................................................................421 A.5.3.1 Parameter Description: Ethernet Interface_Basic Attributes.......................................................421 A.5.3.2 Parameter Description: Ethernet Interface_Flow Control...........................................................425 A.5.3.3 Parameter Description: Ethernet Interface_Layer 2 Attributes...................................................427 A.5.3.4 Parameter Description: Ethernet Port_Layer 3 Attributes...........................................................431 A.5.3.5 Parameter Description: Ethernet Interface_Advanced Attributes...............................................432 A.5.4 Serial Port Parameters...........................................................................................................................435 A.5.4.1 Parameter Description: Serial Port_Basic Attributes..................................................................435 A.5.4.2 Parameter Description: Serial Port_Creation of Serial Ports.......................................................436 A.5.5 Microwave Interface Parameters..........................................................................................................437 A.5.5.1 Parameter Description: Microwave Interface_Basic Attributes..................................................437 A.5.5.2 Parameter Description: Microwave Interface_Layer 2 Attributes...............................................438 A.5.5.3 Parameter Description: Microwave Interface_Layer 3 Attributes...............................................440 A.5.5.4 Parameter Description: Microwave Interface_Advanced Attributes...........................................442 A.5.6 IF Board Parameters.............................................................................................................................445 A.5.6.1 Parameter Description: IF Interface_IF Attribute........................................................................445 A.5.6.2 Parameter Description: IF Interface_ATPC Attribute.................................................................453 A.5.6.3 Parameter Description: Hybrid_AM Configuration_Advanced Attributes.................................455 A.5.6.4 Parameter Description: ATPC Adjustment Records...................................................................456 A.5.6.5 Parameter Description: PRBS Test..............................................................................................457 A.5.7 ODU Parameters...................................................................................................................................458 A.5.7.1 Parameter Description: ODU Interface_Radio Frequency Attribute...........................................458 A.5.7.2 Parameter Description: ODU Interface_Power Attributes..........................................................459 A.5.7.3 Parameter Description: ODU Interface_Equipment Information................................................463 A.5.7.4 Parameter Description: ODU Interface_Advanced Attributes....................................................464 A.5.8 Parameters for SDH Interface Boards..................................................................................................465 A.5.8.1 Parameter Description: SDH Interfaces.......................................................................................466 A.5.8.2 Parameter Description: Automatic Laser Shutdown...................................................................467 A.5.9 Parameters for PDH Interface Boards..................................................................................................468 A.5.9.1 Parameter Description: PDH Ports..............................................................................................468 A.5.9.2 Parameter Description: PRBS Test..............................................................................................471 A.5.10 Parameters for Overhead....................................................................................................................472 A.5.10.1 Parameter Description: Regenerator Section Overhead............................................................472 A.5.10.2 Parameter Description: VC-4 POHs..........................................................................................473 A.5.10.3 Parameter Description: VC-12 POHs........................................................................................475 A.5.11 Parameter Description: Ethernet Virtual Interfaces............................................................................476 A.6 Parameters for Ethernet Services and Ethernet Features on the Packet Plane...............................................479 A.6.1 Parameters for Ethernet Services..........................................................................................................479 A.6.1.1 Parameter Description: E-Line Service_Creation........................................................................479 A.6.1.2 Parameter Description: E-Line Service.......................................................................................500 A.6.1.3 Parameter Description: VLAN Forwarding Table Items for E-Line Services_Creation.............511 Issue 01 (2011-10-30) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. xi


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A.6.1.4 Parameter Description: E-LAN Service_Creation.......................................................................512 A.6.1.5 Parameter Description: E-LAN Service......................................................................................518 A.6.1.6 Parameter Description: QinQ Link_Creation..............................................................................529 A.6.1.7 Parameter Description: E-AGGR Services_Creation..................................................................529 A.6.1.8 Parameter Description: E-AGGR Services..................................................................................537 A.6.2 Parameters for Ethernet Protocols........................................................................................................542 A.6.2.1 Parameter Description: ERPS Management_Creation................................................................542 A.6.2.2 Parameter Description: ERPS Management................................................................................545 A.6.2.3 Parameter Description: MSTP Configuration_Port Group Creation...........................................551 A.6.2.4 Parameter Description: MSTP Configuration_Port Group Configuration..................................553 A.6.2.5 Parameter Description: MSTP Configuration_ Bridge Parameters.............................................553 A.6.2.6 Parameter Description: MSTP Configuration_CIST Parameters................................................559 A.6.2.7 Parameter Description: MSTP Configuration_Running Information About the CIST...............561 A.6.2.8 Parameter Description: Ethernet Link Aggregation Management_LAG Creation.....................569 A.6.2.9 Parameter Description: Ethernet Link Aggregation_Link Aggregation......................................577 A.6.2.10 Parameter Description: LPT Management_Point-to-Point LPT................................................578 A.6.2.11 Parameter Description: LPT Management_Creating Point-to-Point LPT.................................580 A.6.2.12 Parameter Description: LPT Management_Point-to-Multipoint LPT.......................................580 A.6.2.13 Parameter Description: LPT Management_Creating Point-to-Multipoint LPT........................583 A.6.3 Parameters for the Ethernet OAM........................................................................................................587 A.6.3.1 Parameter Description: Ethernet Service OAM Management_Maintenance Domain Creation ..................................................................................................................................................................587 A.6.3.2 Parameter Description: Ethernet Service OAM Management_Maintenance Association Creation ..................................................................................................................................................................588 A.6.3.3 Parameter Description: Ethernet Service OAM Management_MEP Creation............................589 A.6.3.4 Parameter Description: Ethernet Service OAM Management_Remote MEP Creation..............590 A.6.3.5 Parameter Description: Ethernet Service OAM Management_MIP Creation.............................591 A.6.3.6 Parameter Description: Ethernet Service OAM Management_LB Enabling..............................592 A.6.3.7 Parameter Description: Ethernet Service OAM Management_LT Enabling..............................593 A.6.3.8 Parameter Description: Ethernet Service OAM_Enabling Service Loopback Detection............595 A.6.3.9 Parameter Description: Ethernet Port OAM Management_OAM Parameter.............................596 A.6.3.10 Parameter Description: Ethernet Port OAM Management_OAM Error Frame Monitoring ..................................................................................................................................................................598 A.6.4 QoS Parameters....................................................................................................................................599 A.6.4.1 Parameter Description: Diffserv Domain Management..............................................................599 A.6.4.2 Parameter Description: DiffServ Domain Management_Create.................................................605 A.6.4.3 Parameter Description: DiffServ Domain Applied Port_Modification.......................................612 A.6.4.4 Parameter Description: Policy Management...............................................................................614 A.6.4.5 Parameter Description: Port Policy.............................................................................................620 A.6.4.6 Parameter Description: Port Policy_Traffic Classification Configuration..................................627 A.6.4.7 Parameter Description: Port Shaping Management_Creation.....................................................638 A.7 Parameters for Ethernet Services and Ethernet Features on the EoS/EoPDH Plane.....................................640 A.7.1 Parameters for Ethernet Services..........................................................................................................640 Issue 01 (2011-10-30) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. xii


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A.7.1.1 Parameter Description: Ethernet Line Service_Creation.............................................................640 A.7.1.2 Parameter Description: Ethernet Line Service_Creating QinQ-Based Ethernet Line Services ..................................................................................................................................................................644 A.7.1.3 Parameter Description: Ethernet Line Service.............................................................................648 A.7.1.4 Parameter Description: Ethernet LAN Service_Creation of Ethernet LAN Services Based on IEEE 802.1d/802.1q Bridge...............................................................................................................................650 A.7.1.5 Parameter Description: Ethernet LAN Service_Creating IEEE 802.1ad Bridge-Based Ethernet LAN Service......................................................................................................................................................654 A.7.1.6 Parameter Description: Ethernet LAN Service............................................................................659 A.7.1.7 Parameter Description: VLAN Filtering Table_Creation............................................................665 A.7.1.8 Parameter Description: Aging Time of MAC Address Table Entries.........................................666 A.7.2 Parameters for Ethernet Protocols........................................................................................................667 A.7.2.1 Parameter Description: ERPS Management_Creation................................................................667 A.7.2.2 Parameter Description: ERPS Management................................................................................670 A.7.2.3 Parameter Description: Spanning Tree_Protocol Enabling.........................................................676 A.7.2.4 Parameter Description: Spanning Tree_Bridge Parameters........................................................677 A.7.2.5 Parameter Description: Spanning Tree_Port Parameters.............................................................678 A.7.2.6 Parameter Description: Spanning Tree_Bridge Running Information........................................680 A.7.2.7 Parameter Description: Spanning Tree_Port Running Information............................................681 A.7.2.8 Parameter Description: Spanning Tree_Point-to-Point Attribute................................................682 A.7.2.9 Parameter Description: IGMP Snooping Protocol_Enabling......................................................683 A.7.2.10 Parameter Description: IGMP Snooping Protocol_Creation of Static Multicast Table Entries ..................................................................................................................................................................684 A.7.2.11 Parameter Description: IGMP Snooping Protocol_Aging Time of Multicast Table Entries ..................................................................................................................................................................685 A.7.2.12 Parameter Description: Ethernet Link Aggregation_Creation of LAGs...................................686 A.7.2.13 Parameter Description: Ethernet Link Aggregation_Link Aggregation....................................688 A.7.2.14 Parameter Description: LPT Management_Creation of Point-to-Point Service LPT................689 A.7.2.15 Parameter Description: LPT Management_Creation of Point-to-Multipoint Service LPT.......690 A.7.2.16 Parameter Description: Port Mirroring_Creation......................................................................691 A.7.3 Parameters for the Ethernet OAM........................................................................................................692 A.7.3.1 Parameter Description: Ethernet Service OAM_Creation of MDs.............................................692 A.7.3.2 Parameter Description: Ethernet Service OAM_Creation of MAs.............................................693 A.7.3.3 Parameter Description: Ethernet Service OAM_Creation of MPs..............................................694 A.7.3.4 Parameter Description: Ethernet Service OAM_Enabling LB....................................................696 A.7.3.5 Parameter Description: Ethernet Service OAM_Enabling LT....................................................697 A.7.3.6 Parameter Description: Ethernet Port OAM_OAM Parameter...................................................698 A.7.3.7 Parameter Description: Ethernet Port OAM_OAM Error Frame Monitoring.............................699 A.7.3.8 Parameter Description: Ethernet Port OAM_Remote OAM Parameter......................................700 A.7.4 QoS Parameters....................................................................................................................................701 A.7.4.1 Parameter Description: QoS Management_Creation of Flows....................................................701 A.7.4.2 Parameter Description: QoS Management_Creation of CAR.....................................................703 A.7.4.3 Parameter Description: QoS Management_Creation of CoS......................................................705 A.7.4.4 Parameter Description: QoS Management_Creation of CAR/CoS.............................................707 Issue 01 (2011-10-30) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. xiii


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A.7.4.5 Parameter Description: QoS Management_Shaping Management of Egress Queues................707 A.7.4.6 Parameter Description: QoS Management_Port Shaping............................................................709 A.7.5 Parameters for the Ports on Ethernet Boards........................................................................................710 A.7.5.1 Parameter Description: Ethernet Port_External Port...................................................................710 A.7.5.2 Parameter Description: Ethernet Port_Internal Port....................................................................717 A.7.5.3 Parameter Description: Type Field of QinQ Frames...................................................................723 A.8 RMON Parameters.........................................................................................................................................724 A.8.1 Parameter Description: RMON Performance_Statistics Group...........................................................724 A.8.2 Parameter Description: RMON Performance_History Group..............................................................725 A.8.3 Parameter Description: RMON Performance_History Control Group.................................................726 A.8.4 Parameter Description: RMON Performance_RMON Setting.............................................................727 A.9 Parameters for MPLS/PWE3 Services..........................................................................................................728 A.9.1 MPLS Tunnel Parameters.....................................................................................................................729 A.9.1.1 Parameter Description: Basic Configurations of MPLS Tunnels................................................729 A.9.1.2 Parameter Description: Unicast Tunnel Management_Static Tunnel..........................................730 A.9.1.3 Parameter Description: Unicast Tunnel Management_Creation of Unidirectional Tunnels.......734 A.9.1.4 Parameter Description: Unicast Tunnel Management_Creation of Bidirectional Tunnels.........738 A.9.1.5 Parameter Description: Unicast Tunnel Management_OAM Parameters...................................742 A.9.1.6 Parameter Description: Unicast Tunnel Management_FDI.........................................................747 A.9.1.7 Parameter Description: Unicast Tunnel Management_LSP Ping................................................748 A.9.1.8 Parameter Description: Unicast Tunnel Management_LSP Traceroute......................................751 A.9.1.9 Parameter Description: PW Management_PW Management......................................................754 A.9.1.10 Parameter Description: PW Management_MS-PW Creation....................................................759 A.9.1.11 Parameter Description: PW Management_PW OAM...............................................................770 A.9.1.12 Parameter Description: PW Management_PW Ping.................................................................774 A.9.1.13 Parameter Description: PW Management_PW Traceroute.......................................................777 A.9.1.14 Parameter Description: MPLS APS Protection Management...................................................779 A.9.1.15 Parameter Description: Tunnel Protection Group_Creation......................................................782 A.9.1.16 Parameter Description: PW APS Protection Group_Creation...................................................787 A.9.1.17 Parameter Description: Slave Protection Pair of a PW APS Protection Group_Creation.........798 A.9.2 CES Parameters....................................................................................................................................804 A.9.2.1 Parameter Description: CES Service Management.....................................................................804 A.9.2.2 Parameter Description: CES Service Management_Creation.....................................................813 A.9.3 ATM Parameters...................................................................................................................................826 A.9.3.1 Parameter Description: ATM IMA Management_IMA Group Management.............................826 A.9.3.2 Parameter Description: ATM IMA Management_Bound Path Configuration............................831 A.9.3.3 Parameter Description: ATM IMA Management_IMA Group Status........................................833 A.9.3.4 Parameter Description: ATM IMA Management_IMA Link Status...........................................834 A.9.3.5 Parameter Description: ATM IMA Management_ATM Interface Management........................834 A.9.3.6 Parameter Description: Configuration of ATM Service Class Mapping Table...........................836 A.9.3.7 Parameter Description: Configuration of ATM Service Class Mapping 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A.9.3.9 Parameter Description: ATM Policy Management_Creation......................................................844 A.9.3.10 Parameter Description: ATM Service Management..................................................................849 A.9.3.11 Parameter Description: ATM Service Management_Creation..................................................858 A.9.3.12 Parameter Description: ATM OAM Management_Segment and End Attributes.....................870 A.9.3.13 Parameter Description: ATM OMA Management_CC Activation Status................................874 A.9.3.14 Parameter Description: ATM OAM Management_Remote End Loopback Status...................877 A.9.3.15 Parameter Description: ATM OAM Management_LLID.........................................................880 A.10 Clock Parameters.........................................................................................................................................881 A.10.1 Parameter Description: Frequency Selection Mode...........................................................................881 A.10.2 Physical Clock Parameters.................................................................................................................882 A.10.2.1 Parameter Description: Clock Source Priority Table................................................................882 A.10.2.2 Parameter Description: Priority Table for the PLL Clock Source of the External Clock Port ..................................................................................................................................................................884 A.10.2.3 Parameter Description: Clock Subnet Setting_Clock Subnet....................................................886 A.10.2.4 Parameter Description: Clock Subnet Setting_Clock Quality...................................................889 A.10.2.5 Parameter Description: Clock Subset Setting_SSM Output Control........................................892 A.10.2.6 Parameter Description: Clock Subset Setting_Clock ID Enabling Status.................................893 A.10.2.7 Parameter Description: Clock Source Switching_Clock Source Restoration Parameters.........894 A.10.2.8 Parameter Description: Clock Source Switching_Clock Source Switching..............................896 A.10.2.9 Parameter Description: Clock Source Switching_Clock Source Switching Conditions...........897 A.10.2.10 Parameter Description: Output Phase-Locked Source of the External Clock Source.............898 A.10.2.11 Parameter Description: Clock Synchronization Status............................................................901 A.10.3 CES ACR Clock Parameters..............................................................................................................902 A.10.3.1 Parameter Description: ACR Clock Source..............................................................................903 A.10.3.2 Parameter Description: Clock Domain......................................................................................903 A.10.3.3 Parameter Description: Clock Domain_Creation......................................................................904 A.10.4 PTP Clock Parameters........................................................................................................................905 A.10.4.1 Parameter Description: Clock Synchronization Attribute.........................................................905 A.10.4.2 Parameter Description: Clock Synchronization Attribute_Creation of PTP Clock Ports.........915 A.10.4.3 Parameter Description: Setting of a PTP Clock Subnet_Clock Subnet.....................................916 A.10.4.4 Parameter Description: Setting of a PTP Clock Subnet_BMC.................................................917 A.10.4.5 Parameter Description: External Time Port_Basic Attributes...................................................918 A.10.4.6 Parameter Description: External Time Port_BMC....................................................................919 A.10.4.7 Parameter Description: External Time Port_Cable Transmission Distance..............................921 A.10.5 Parameter Description: Auxiliary Ports..............................................................................................922 A.11 Parameters for the Orderwire and Auxiliary Interfaces...............................................................................923 A.11.1 Parameter Description: Orderwire_General.......................................................................................923 A.11.2 Parameter Description: Orderwire_Advanced....................................................................................925 A.11.3 Parameter Description: Orderwire_F1 Data Port................................................................................926 A.11.4 Parameter Description: Orderwire_Broadcast Data Port....................................................................926 A.11.5 Parameter Description: Environment Monitoring Interface...............................................................927

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C Indicators of Boards.................................................................................................................933 D Weight and Power Consumption of Each Board................................................................953 E Glossary......................................................................................................................................955E.1 0-9..................................................................................................................................................................956 E.2 A-E.................................................................................................................................................................956 E.3 F-J...................................................................................................................................................................965 E.4 K-O.................................................................................................................................................................970 E.5 P-T..................................................................................................................................................................976 E.6 U-Z.................................................................................................................................................................985

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1 Introduction

1About This Chapter

Introduction

The OptiX RTN 910 is a product in the OptiX RTN 900 radio transmission system series. 1.1 Network Application The OptiX RTN 900 is a new generation TDM/Hybrid/Packet integrated microwave transmission system developed by Huawei. It provides a seamless microwave transmission solution for mobile communication network or private networks. 1.2 Components The OptiX RTN 910 adopts a split structure. The system consists of the IDU 910 and the ODU. Each ODU is connected to the IDU through an IF cable. 1.3 Configuration Modes The OptiX RTN 910 supports different configuration modes in which different system control, switching, and timing boards, IF boards, and ODUs are configured, suited for various microwave application scenarios.

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1.1 Network ApplicationThe OptiX RTN 900 is a new generation TDM/Hybrid/Packet integrated microwave transmission system developed by Huawei. It provides a seamless microwave transmission solution for mobile communication network or private networks.

OptiX RTN 900 Product FamilyThere are three types of OptiX RTN 900 products: OptiX RTN 910, OptiX RTN 950, and OptiX RTN 980. Users can choose the product best suited for their site. l l l The IDU of the OptiX RTN 910 is 1U high and supports one or two IF boards. The IDU of the OptiX RTN 950 is 2U high and supports one to six IF boards. The IDU of the OptiX RTN 980 is 5U high and supports one to fourteen IF boards.NOTE

All the products in the OptiX RTN 900 series use the same types of IF and service interface boards.

The OptiX RTN 900 series provide a variety of service interfaces and can be installed easily and configured flexibly. The OptiX RTN 900 series provide a solution that can integrate TDM microwave, Hybrid microwave, and Packet microwave technologies according to the networking scheme for the sites, achieving smooth upgrade from TDM microwave to Hybrid microwave, and from Hybrid microwave to Packet microwave. This solution is able to adapt to changing service scenarios brought about by evolutions in radio mobile networks. Therefore, this solution meets the transmission requirements of 2G and 3G networks while also allowing for integration with future LTE and 4G networks.

OptiX RTN 910The OptiX RTN 910 is microwave equipment deployed at the access layer. Figure 1-1 shows the microwave transmission solution provided by the OptiX RTN 910. Figure 1-1 Microwave transmission solution provided by the OptiX RTN 910

FE FE E1 E1

E1 E1 E1/ STM-1 Regional TDM Network

E1/ STM-1

FE/GE FE/GE E1 FE FE E1 Regional Packet Network FE/GE

OptiX RTN 910

MSTP

NodeB

BTS

RNC

BSC

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NOTE

l In this solution, the OptiX RTN 910 is connected to an RNC and BSC directly or through a regional backhaul network. l The OptiX RTN 910 provides a wide range of interfaces and service bearer technologies to adapt to the regional backhaul network. The regional backhaul network can be a time-division multiplexing (TDM) network or packet switching network (PSN). l The OptiX RTN 910 supports the Ethernet over SDH (EoSDH) function and Ethernet over PDH (EoPDH) function. Therefore, packet services can be backhauled through a TDM network. l The OptiX RTN 910 supports the pseudo wire emulation edge-to-edge (PWE3) technology. Therefore, TDM, ATM, and Ethernet services can be backhauled through a PSN. l The OptiX RTN 910 supports the VLAN sub-interface function. Therefore, MPLS packet services can be backhauled through a Layer 2 network. l When three or more microwave directions are required, cascade several sets of the OptiX RTN 910 or use the OptiX RTN 950 or OptiX RTN 980 that provides more powerful functions and supports more microwave directions.

1.2 ComponentsThe OptiX RTN 910 adopts a split structure. The system consists of the IDU 910 and the ODU. Each ODU is connected to the IDU through an IF cable.

IDU 910The IDU 910 is the indoor unit for an OptiX RTN 910 system. It receives and multiplexes services, performs service processing and IF processing, and provides the system control and communications function. Table 1-1 lists the basic features of the IDU 910. Table 1-1 Features of the IDU 910 Item Chassis height Pluggable Number of microwave directions RF configuration mode Description 1U Supported 1 or 2 1+0 non-protection configuration 2+0 non-protection configuration 1+1 protection configuration N+1 protection configuration (N = 1) XPIC configuration

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Figure 1-2 Appearance of the IDU 910

ODUThe ODU is the outdoor unit for the OptiX RTN 900. It converts frequencies and amplifies signals. The OptiX RTN 900 product series can use the RTN 600 ODU and RTN XMC ODU, covering the entire frequency band from 6 GHz to 38 GHz.NOTE

Unlike the other frequency bands that use 14 MHz, 28 MHz, or 56 MHz channel spacing, the 18 GHz frequency band uses 13.75 MHz, 27.5 MHz, or 55 MHz channel spacing.

Table 1-2 RTN 600 ODUs that the OptiX RTN 910 supports Item Description Standard Power ODU ODU type Frequency band SP, SPA 7/8/11/13/15/18/23/ 26/38 GHz (SP ODU) 6/7/8/11/13/15/18/2 3 GHz (SPA ODU) Microwave modulation scheme QPSK/16QAM/ 32QAM/64QAM/ 128QAM/256QAM High-Power ODU HP, HPA 6/7/8/10/10.5/11/13/ 15/18/23/26/28/32/3 8 GHz (HP ODU) 7/8/11/13/15/18/23 GHz (HPA ODU) QPSK/16QAM/ 32QAM/64QAM/ 128QAM/256QAM QPSK/16QAM Low Capacity for PDH ODU LP 7/8/11/13/15/18/23 GHz (LP ODU)

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Item

Description Standard Power ODU High-Power ODU 7/14/28/40/56 MHz (6/7/8/10/11/13/15/1 8/23/26/28/32/38 GHz) 7/14/28 MHz (10.5 GHz) Low Capacity for PDH ODU 3.5/7/14/28 MHz

Channel spacing

3.5/7/14/28 MHz

Table 1-3 RTN XMC ODUs that the OptiX RTN 910 supports Item Description High-Power ODU ODU type Frequency band Microwave modulation scheme Channel spacing XMC-2 7/8/11/13/15/18/23/26/38 GHz QPSK/16QAM/32QAM/ 64QAM/128QAM/256QAM 7/14/28/40/56 MHz Low Capacity for PDH ODU XMC-1 7/8/11/13/15/18/23 GHz QPSK/16QAM 3.5/7/14/28 MHz

There are two methods for mounting the ODU and the antenna: direct mounting and separate mounting. l The direct mounting method is generally adopted when a small- or medium-diameter and single-polarized antenna is used. In this situation, if one ODU is configured for one antenna, the ODU is directly mounted at the back of the antenna. If two ODUs are configured for one antenna, an RF signal combiner/splitter (hence referred to as a hybrid coupler) must be mounted to connect the ODUs to the antenna. Figure 1-3 illustrates the direct mounting method. The direct mounting method can also be adopted when a small- or medium-diameter and dual-polarized antenna is used. Two ODUs are mounted onto an antenna using an orthomode transducer (OMT). The method for installing an OMT is similar to that for installing a hybrid coupler.

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Figure 1-3 Direct mounting

l

The separate mounting method is adopted when a large- or medium-diameter and singleor dual-polarized antenna is used. Figure 1-4 shows the separate mounting method. In this situation, a hybrid coupler can be mounted (two ODUs share one feed boom). Figure 1-4 Separate mounting

NOTE

The OptiX RTN 910 provides an antenna solution that covers the entire frequency band, and supports single-polarized antennas and dual-polarized antennas with diameters of 0.3 m to 3.7 m along with the corresponding feeder system.

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1.3 Configuration ModesThe OptiX RTN 910 supports different configuration modes in which different system control, switching, and timing boards, IF boards, and ODUs are configured, suited for various microwave application scenarios. Table 1-4 Configuration modes that the OptiX RTN 910 supports Configuration Mode Control, Switching, and Timing Board CSTA IF Board ODU Application

PDH microwave equipment

IF1

Low capacity for PDH ODU

Provides a radio link with capacity not higher than 16 x E1. Provides an STM-1 radio link or a highcapacity PDH radio link. Provides one or two STM-1 radio links. Provides a Integrated IP radio link.

SDH microwave equipment

CSTA

IF1

Standard power ODU or high power ODU

CSTA

ISU2 ISX2

Standard power ODU or high power ODU Standard power ODU or high power ODU

Integrated IP microwave equipment

CSHA CSHB CSHC CSHD CSHE

IFU2 ISU2

XPIC Integrated IP microwave equipment

CSHA CSHB CSHC CSHD CSHE

IFX2 ISX2

Standard power ODU or high power ODU

Provides a Integrated IP radio link of the super capacity.

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2 Chassis

2About This Chapter

Chassis

The IDU of the OptiX RTN 910 is a 1U chassis. It can be deployed in a variety of scenarios and on several different types of racks, cabinets, and surfaces. 2.1 Chassis Structure The dimensions (H x W x D) of the IDU 910 chassis are 44 mm x 442 mm x 220 mm. The IDU 910 chassis has a two-layered structure that is air cooled. 2.2 Installation Mode The IDU 910 can be deployed in a variety of scenarios and on several different types of racks, cabinets, and surfaces. 2.3 Air Flow An IDU 910 chassis is air-cooled with air in on the left side and air out on the right side. 2.4 IDU Labels Product nameplate labels, qualification card labels, ESD protection labels, grounding labels, laser safety class labels, high temperature warning labels, and operation warning labels, and other types of labels are affixed in their respective positions on the IDU chassis or boards. Adhere to the warnings and instructions on the labels when performing various types of tasks in order to avoid bodily injury or damage to the equipment.

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2.1 Chassis StructureThe dimensions (H x W x D) of the IDU 910 chassis are 44 mm x 442 mm x 220 mm. The IDU 910 chassis has a two-layered structure that is air cooled. Figure 2-1 shows the chassis structure of the IDU 910. Figure 2-1 Chassis structure of the IDU 910

H D W

2.2 Installation ModeThe IDU 910 can be deployed in a variety of scenarios and on several different types of racks, cabinets, and surfaces. The IDU 910 can be installed: l l l l l l l l In a 300 mm European Telecommunications Standards Institute (ETSI) cabinet In a 600 mm ETSI cabinet In a 450 mm 19-inch cabinet In a 600 mm 19-inch cabinet In a 19-inch open rack In an outdoor cabinet for wireless equipment On a wall On a table

2.3 Air FlowAn IDU 910 chassis is air-cooled with air in on the left side and air out on the right side. Figure 2-2 shows the air flow in an IDU 910 chassis.Issue 01 (2011-10-30) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 9


2 Chassis

Figure 2-2 Air flow in an IDU 910 chassis

2.4 IDU LabelsProduct nameplate labels, qualification card labels, ESD protection labels, grounding labels, laser safety class labels, high temperature warning labels, and operation warning labels, and other types of labels are affixed in their respective positions on the IDU chassis or boards. Adhere to the warnings and instructions on the labels when performing various types of tasks in order to avoid bodily injury or damage to the equipment.

Label DescriptionTable 2-1 provides the description of the labels on the IDU chassis and boards. Actual labels may vary depending on the configurations of the chassis and boards. Table 2-1 Description of the IDU labels Label Label Name ESD protection label Description Indicates that the equipment is sensitive to static electricity. Indicates the grounding position of the IDU chassis.

Grounding label

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Label

Label Name Fan warning label

Description Warns you not to touch fan leaves when the fan is rotating. Indicates that the board surface temperature may exceed 70C when the ambient temperature is higher than 55C. Wear protective gloves to handle the board. Instructs you to read related instructions before performing any power-related tasks. For details, see Labels in 3.17.4 Front Panel.

High temperature warning label

Power caution label

/ QUALIFICATION CARD

Qualification card label

Indicates that the equipment has been quality checked.

HUAWEIHUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

RoHS label

Indicates that the equipment complies with the related requirements specified in the RoHS directive.

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Label

Label Name Product nameplate label

Description Indicates the product name and certification.

Operation guidance labelPULL

Instructs you to slightly pull the switch lever outwards before setting the switch to the "I" or "O" position.

Label PositionFigure 2-3 shows the positions of the labels on the chassis of the IDU 910. Figure 2-3 Positions of the IDU 910 labels / QUALIFICATION CARD

HUAWEIHUAWEI TECHNOLOGIES CO.,LTD.

50

MADE IN CHINA

!

! W A R N IN G -48V O U T PU T T U R N O FF P O W ER B EF O R E D ISC O N N EC TIN G IF C AB LE

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3 Boards

3About This Chapter

Boards

The IDU 910 supports the following types of boards: system control, switching, and timing boards, IF boards, Ethernet boards, SDH boards, PDH boards, power supply boards, and fan boards. 3.1 Board Appearance The dimensions (H x W x D) of the board in the extended slot of the IDU 910 chassis are 19.82 mm x 193.80 mm x 225.80 mm. The dimensions (H x W x D) of the system control, switching, and timing board in the IDU 910 chassis are 20.60 mm x 388.40 mm x 266.79 mm. 3.2 Board List The IDU 910 provides various functions with different boards inserted. 3.3 CSTA The CSTA is an integrated TDM system control, switching, and timing board. 3.4 CSHA/CSHB/CSHC The CSHA/CSHB/CSHC is the integrated Hybrid system control, switching, and timing board. The CSHA, CSHB, and CSHC differ from each other with regard to the types and number of service ports. 3.5 CSHD/CSHE The CSHD/CSHE is the integrated Hybrid system control, switching, and timing board. The difference between the CSHD and CSHE is that the GE ports on the CSHD support pluggable SFP optical/electrical modules, while the GE ports on the CSHE are fixed electrical ports. 3.6 IF1 The IF1 is a medium-capacity SDH IF board. The IF1 uses the DC-I power distribution mode. 3.7 IFU2 The IFU2 is a universal IF board that supports the Integrated IP radio mode. The IFU2 uses the DC-I power distribution mode. 3.8 IFX2 The IFX2 is a universal IF board that supports the XPIC function in Integrated IP radio mode. The IFX2 uses the DC-I power distribution mode. 3.9 ISU2Issue 01 (2011-10-30) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd. 13


3 Boards

The ISU2 is a universal IF board that supports the Integrated IP radio mode and SDH radio mode at the same time. The ISU2 uses the DC-I power distribution mode. 3.10 ISX2 The ISX2 is a universal XPIC IF board and provides the XPIC function for signals transmitted/ received in Integrated IP radio mode and SDH radio mode. The ISX2 uses the DC-I power distribution mode. 3.11 EM6T/EM6TA/EM6F/EM6FA The EM6T/EM6F/EM6TA/EM6FA is an FE/GE interface board, which provides four FE electrical ports and two GE ports. The EM6T/EM6TA has similar functions to the EM6F/ EM6FA. The only difference is as follows: The GE ports on the EM6T/EM6TA use fixed electrical ports whereas the GE ports on the EM6F/EM6FA use the SFP modules and therefore can function as two FE/GE optical or GE electrical ports. The GE electrical ports on the EM6F/EM6FA and the EM6T/EM6TA are compatible with the FE electrical ports. 3.12 EMS6 The EMS6 is an FE/GE EoSDH processing board providing th

Documents

RTN 910 IDU Hardware Description-(V100R003C03_01)