RTN 910 IDU Hardware Description V100R003C03 01

7/23/2019 RTN 910 IDU Hardware Description V100R003C03 01

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OptiX RTN 910 Radio Transmission System

V100R003C03

IDU Hardware Description

Issue 01

Date 2011-10-30

HUAWEI TECHNOLOGIES CO., LTD.


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Copyright Huawei Technologies Co., Ltd. 2011. All rights reserved.

No part of this document may be reproduced or transmitted in any form or by any means without prior written

consent of Huawei Technologies Co., Ltd.

Trademarks and Permissions

and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.

All other trademarks and trade names mentioned in this document are the property of their respective holders.

Notice

The purchased products, services and features are stipulated by the contract made between Huawei and the

customer. All or part of the products, services and features described in this document may not be within the

purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information,and recommendations in this document are provided "AS IS" without warranties, guarantees or representations

of any kind, either express or implied.

The information in this document is subject to change without notice. Every effort has been made in the

preparation of this document to ensure accuracy of the contents, but all statements, information, and

recommendations in this document do not constitute the warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.

Address: Huawei Industrial Base

Bantian, Longgang

Shenzhen 518129

People's Republic of China

Website: http://www.huawei.com

Email: [email protected]

Issue 01 (2011-10-30) Huawei Proprietary and Confidential

Copyright Huawei Technologies Co., Ltd.

i
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About This Document

Related Versions

The following table lists the product versions related to this document.

Product Name Version

OptiX RTN 910 V100R003C03

iManager U2000 V100R006C00

Intended Audience

This document is intended for:

l Network planning engineer

l Hardware installation engineer

l Installation and commissioning engineer

l Field maintenance engineer

l Data configuration engineer

l System maintenance engineer

Before reading this document, you need to be familiar with the following:

l Basics of digital microwave communication

l Basics of the OptiX RTN 910

Symbol Conventions

The symbols that may be found in this document are defined as follows.

Symbol Description

Indicates a hazard with a high level of risk,

which if not avoided, will result in death or

serious injury.


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Convention Description

[ x | y | ... ] Optional items are grouped in brackets and separated by

vertical bars. One item is selected or no item is selected.

{ x | y | ... }* Optional items are grouped in braces and separated byvertical bars. A minimum of one item or a maximum of all

items can be selected.

[ x | y | ... ]* Optional items are grouped in brackets and separated by

vertical bars. Several items or no item can be selected.

GUI Conventions

The GUI conventions that may be found in this document are defined as follows.

Convention Description

Boldface Buttons, menus, parameters, tabs, window, and dialog titles

are in boldface. For example, clickOK.

> Multi-level menus are in boldface and separated by the ">"

signs. For example, choose File > Create > Folder.

Update History

Updates between document issues are cumulative. Thus, the latest document issue contains all

updates made in previous issues.

Updates in Issue 01 (2011-10-30) Based on Product Version V100R003C03

This document is the first issue for the V100R003C03 product version.


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Contents

About This Document.....................................................................................................................ii

1 Introduction....................................................................................................................................1

1.1 Network Application..........................................................................................................................................2

1.2 Components........................................................................................................................................................31.3 Configuration Modes..........................................................................................................................................7

2 Chassis.............................................................................................................................................8

2.1 Chassis Structure................................................................................................................................................9

2.2 Installation Mode................................................................................................................................................9

2.3 Air Flow..............................................................................................................................................................9

2.4 IDU Labels.......................................................................................................................................................10

3 Boards............................................................................................................................................13

3.1 Board Appearance............................................................................................................................................15

3.2 Board List.........................................................................................................................................................16

3.3 CSTA................................................................................................................................................................23

3.3.1 Version Description.................................................................................................................................23

3.3.2 Functions and Features............................................................................................................................23

3.3.3 Working Principle....................................................................................................................................27

3.3.4 Front Panel...............................................................................................................................................30

3.3.5 DIP Switches and CF Card......................................................................................................................39

3.3.6 Valid Slots...............................................................................................................................................41

3.3.7 Board Feature Code.................................................................................................................................42

3.3.8 Types of SFP Modules............................................................................................................................423.3.9 Board Parameter Settings........................................................................................................................42

3.3.10 Technical Specifications........................................................................................................................43

3.4 CSHA/CSHB/CSHC........................................................................................................................................46




3.4.4 Front Panel...............................................................................................................................................59

3.4.5 DIP Switches and CF Card......................................................................................................................73

3.4.6 Valid Slots...............................................................................................................................................75

3.4.7 Board Feature Code.................................................................................................................................76


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3.4.8 Types of SFP Modules............................................................................................................................76

3.4.9 Board Parameter Settings........................................................................................................................78


3.5 CSHD/CSHE....................................................................................................................................................87




3.5.4 Front Panel.............................................................................................................................................100

3.5.5 DIP Switches and CF Card....................................................................................................................113

3.5.6 Valid Slots.............................................................................................................................................115

3.5.7 Board Feature Code...............................................................................................................................116

3.5.8 Types of SFP Modules..........................................................................................................................116

3.5.9 Board Parameter Settings......................................................................................................................118

3.5.10 Technical Specifications......................................................................................................................118

3.6 IF1...................................................................................................................................................................125

3.6.1 Version Description...............................................................................................................................125

3.6.2 Functions and Features..........................................................................................................................125

3.6.3 Working Principle and Signal Flow......................................................................................................127

3.6.4 Front Panel.............................................................................................................................................132

3.6.5 Valid Slots.............................................................................................................................................134



3.7 IFU2................................................................................................................................................................1363.7.1 Version Description...............................................................................................................................136



3.7.4 Front Panel.............................................................................................................................................143

3.7.5 Valid Slots.............................................................................................................................................145



3.8 IFX2................................................................................................................................................................148




3.8.4 Front Panel.............................................................................................................................................155

3.8.5 Valid Slots.............................................................................................................................................157



3.9 ISU2................................................................................................................................................................161








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3.9.4 Front Panel.............................................................................................................................................168

3.9.5 Valid Slots.............................................................................................................................................170



3.10 ISX2..............................................................................................................................................................175

3.10.1 Version Description.............................................................................................................................175

3.10.2 Functions and Features........................................................................................................................175

3.10.3 Working Principle and Signal Flow....................................................................................................178

3.10.4 Front Panel...........................................................................................................................................182

3.10.5 Valid Slots...........................................................................................................................................185

3.10.6 Board Parameter Settings....................................................................................................................185


3.11 EM6T/EM6TA/EM6F/EM6FA....................................................................................................................191




3.11.4 Front Panel...........................................................................................................................................197

3.11.5 Valid Slots...........................................................................................................................................204

3.11.6 Types of SFP Modules........................................................................................................................204



3.12 EMS6............................................................................................................................................................212

3.12.1 Version Description.............................................................................................................................2123.12.2 Functions and Features........................................................................................................................212


3.12.4 Front Panel...........................................................................................................................................219

3.12.5 Valid Slots...........................................................................................................................................223

3.12.6 Types of SFP Modules........................................................................................................................224



3.13 EFP8.............................................................................................................................................................227




3.13.4 Front Panel...........................................................................................................................................233

3.13.5 Valid Slots...........................................................................................................................................236



3.14 SL1D/SL1DA...............................................................................................................................................238








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3.14.4 Front Panel...........................................................................................................................................242

3.14.5 Valid Slots...........................................................................................................................................244

3.14.6 Board Feature Code.............................................................................................................................245



3.15 ML1/MD1.....................................................................................................................................................247




3.15.4 Front Panel...........................................................................................................................................252

3.15.5 Valid Slots...........................................................................................................................................255




3.16 SP3S/SP3D...................................................................................................................................................257




3.16.4 Front Panel...........................................................................................................................................261

3.16.5 Valid Slots...........................................................................................................................................265



3.16.8 Technical Specifications......................................................................................................................2663.17 PIU................................................................................................................................................................267



3.17.3 Working Principle................................................................................................................................268

3.17.4 Front Panel...........................................................................................................................................269

3.17.5 Valid Slots...........................................................................................................................................271


3.18 FAN..............................................................................................................................................................271



3.18.3 Working Principle................................................................................................................................272

3.18.4 Front Panel...........................................................................................................................................273

3.18.5 Valid Slots...........................................................................................................................................274


4 Accessories..................................................................................................................................276

4.1 E1 Panel..........................................................................................................................................................277

4.2 PDU................................................................................................................................................................279

4.2.1 Front Panel.............................................................................................................................................279

4.2.2 Functions and Working Principle..........................................................................................................280





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4.2.3 Power Distribution Mode......................................................................................................................281

5 Cables...........................................................................................................................................283

5.1 Power Cable....................................................................................................................................................285

5.2 PGND Cable...................................................................................................................................................2855.2.1 IDU PGND Cable..................................................................................................................................285

5.2.2 E1 Panel PGND Cable...........................................................................................................................286

5.3 IF Jumper........................................................................................................................................................287

5.4 XPIC Cable.....................................................................................................................................................288

5.5 Fiber Jumper...................................................................................................................................................289

5.6 STM-1 Cable..................................................................................................................................................291

5.7 E1 Cables........................................................................................................................................................292

5.7.1 E1 Cable Connected to the External Equipment...................................................................................292

5.7.2 E1 Cable Connected to the E1 Panel.....................................................................................................296

5.8 Orderwire Cable.............................................................................................................................................298

5.9 Network Cable................................................................................................................................................298

A Parameters Description...........................................................................................................302

A.1 Parameters for Network Management...........................................................................................................303

A.1.1 Parameters for NE Management...........................................................................................................303

A.1.1.1 Parameter Description: NE Searching.........................................................................................303

A.1.1.2 Parameter Description: NE Creation...........................................................................................308

A.1.1.3 Parameter Description: Attribute_Changing NE IDs..................................................................310

A.1.1.4 Parameter Description: NE Time Synchronization.....................................................................311

A.1.1.5 Parameter Description: Localization Management of the NE Time............................................314

A.1.1.6 Parameter Description: Standard NTP Key Management...........................................................315

A.1.1.7 Parameter Description: License Management.............................................................................316

A.1.1.8 Parameter Description: Automatic Disabling of the Functions of NEs.......................................317

A.1.2 Parameters for Communications Management.....................................................................................318

A.1.2.1 Parameter Description: NE Communication Parameter Setting..................................................318

A.1.2.2 Parameter Description: DCC Management_DCC Rate Configuration.......................................319

A.1.2.3 Parameter Description: DCC Management_DCC Transparent Transmission Management.......321

A.1.2.4 Parameter Description: ECC Management_Ethernet Port Extended ECC..................................323

A.1.2.5 Parameter Description: NE ECC Link Management...................................................................324

A.1.2.6 Parameter Description: ECC Link Management_Availability Test............................................325

A.1.2.7 Parameter Description: IP Protocol Stack Management_IP Route Management........................327

A.1.2.8 Parameter Description: IP Protocol Stack Management_IP Route Management Creation.........328

A.1.2.9 Parameter Description: IP Protocol Stack Management_Availability Test.................................329

A.1.2.10 Parameter Description: IP Protocol Stack Management_OSPF Parameter Settings.................330

A.1.2.11 Parameter Description: IP Protocol Stack_Proxy ARP.............................................................335

A.1.2.12 Parameter Description: Management of Multiple OSPF Areas.................................................336

A.1.2.13 Parameter Description: Management of Multiple OSPF Areas_Adding OSPF Areas..............337

A.1.2.14 Parameter Description: Management of Multiple OSPF Areas_Adding Routes to Be ManuallyAggregated................................................................................................................................................338





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A.1.2.15 Parameter Description: Port OSPF Setting................................................................................339

A.1.2.16 Parameter Description: OSI Management_Network Layer Parameter......................................339

A.1.2.17 Parameter Description: OSI Management_Routing Table........................................................340

A.1.2.18 Parameter Description: OSI Management_OSI Tunnel............................................................341

A.1.2.19 Parameter Description: OSI Management_OSI Port Parameters..............................................345

A.1.2.20 Parameter Description: DCN Management_Bandwidth Management......................................346

A.1.2.21 Parameter Description: DCN Management_Port Setting..........................................................347

A.1.2.22 Parameter Description: DCN Management_Access Control.....................................................347

A.1.2.23 Parameter Description: DCN Management_Packet Control.....................................................348

A.1.2.24 Parameter Description: L2 DCN Management..........................................................................349

A.1.2.25 Parameter Description: Access Control.....................................................................................350

A.1.3 Parameters for Network Security Management....................................................................................351

A.1.3.1 Parameter Description: NE User Management............................................................................351

A.1.3.2 Parameter Description: NE User Management_Creation............................................................351A.1.3.3 Parameter Description: LCT Access Control..............................................................................354

A.1.3.4 Parameter Description: RADIUS Configuration_Creation.........................................................355

A.1.3.5 Parameter Description: RADIUS Configuration_RADIUS Server.............................................356

A.1.3.6 Parameter Description: Enabling/Disabling the RADIUS Function...........................................357

A.2 Radio Link Parameters..................................................................................................................................358

A.2.1 Parameter Description: Link Configuration_XPIC Workgroup_Creation...........................................358

A.2.2 Parameter Description: Link Configuration_XPIC..............................................................................363

A.2.3 Parameter Description: N+1 Protection_Create...................................................................................370

A.2.4 Parameter Description: N+1 Protection................................................................................................371

A.2.5 Parameter Description: IF 1+1 Protection_Create................................................................................373

A.2.6 Parameter Description: IF 1+1 Protection............................................................................................376

A.2.7 Parameter Description: Link Configuration_Creating a PLA Group...................................................380

A.2.8 Parameter Description: Link Configuration_PLA................................................................................380

A.2.9 Parameter: Link Configuration_IF/ODU Configuration......................................................................381

A.3 Multiplex Section Protection Parameters......................................................................................................391

A.3.1 Parameter Description: Linear MSP_Creation.....................................................................................391

A.3.2 ParameterDescription: Linear MSP.....................................................................................................395

A.4 SDH/PDH Service Parameters......................................................................................................................399

A.4.1 ParameterDescription: SDH Service Configuration_Creation............................................................399

A.4.2 ParameterDescription: SDH Service Configuration_SNCP Service Creation....................................401

A.4.3 ParameterDescription: SDH Service Configuration_Converting Normal Services Into SNCP Services

........................................................................................................................................................................405

A.4.4 Parameter Description: SDH Service Configuration............................................................................409

A.4.5 ParameterDescription: SNCP Service Control....................................................................................411

A.4.6 ParameterDescription: TU_AIS Insertion...........................................................................................414

A.5 Parameters for Board Interfaces....................................................................................................................415

A.5.1 ParameterDescription: Working Modes of Ports.................................................................................415

A.5.2 PDH Port Parameters............................................................................................................................416

A.5.2.1 Parameter Description: PDH Ports_Basic Attributes..................................................................416





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A.5.2.2 Parameter Description: PDH Ports_Advanced Attributes...........................................................417

A.5.3 Parameters for the Ports on Ethernet Boards........................................................................................421

A.5.3.1 Parameter Description: Ethernet Interface_Basic Attributes.......................................................421

A.5.3.2 Parameter Description: Ethernet Interface_Flow Control...........................................................425

A.5.3.3 Parameter Description: Ethernet Interface_Layer 2 Attributes...................................................427

A.5.3.4 Parameter Description: Ethernet Port_Layer 3 Attributes...........................................................431

A.5.3.5 Parameter Description: Ethernet Interface_Advanced Attributes...............................................432

A.5.4 Serial Port Parameters...........................................................................................................................435

A.5.4.1 Parameter Description: Serial Port_Basic Attributes..................................................................435

A.5.4.2 Parameter Description: Serial Port_Creation of Serial Ports.......................................................436

A.5.5 Microwave Interface Parameters..........................................................................................................437

A.5.5.1 Parameter Description: Microwave Interface_Basic Attributes..................................................437

A.5.5.2 Parameter Description: Microwave Interface_Layer 2 Attributes...............................................438

A.5.5.3 Parameter Description: Microwave Interface_Layer 3 Attributes...............................................440

A.5.5.4 Parameter Description: Microwave Interface_Advanced Attributes...........................................442

A.5.6 IF Board Parameters.............................................................................................................................445

A.5.6.1 Parameter Description: IF Interface_IF Attribute........................................................................445

A.5.6.2 Parameter Description: IF Interface_ATPC Attribute.................................................................453

A.5.6.3 Parameter Description: Hybrid_AM Configuration_Advanced Attributes.................................455

A.5.6.4 Parameter Description: ATPC Adjustment Records...................................................................456

A.5.6.5 Parameter Description: PRBS Test..............................................................................................457

A.5.7 ODU Parameters...................................................................................................................................458

A.5.7.1 Parameter Description: ODU Interface_Radio Frequency Attribute...........................................458A.5.7.2 Parameter Description: ODU Interface_Power Attributes..........................................................459

A.5.7.3 Parameter Description: ODU Interface_Equipment Information................................................463

A.5.7.4 Parameter Description: ODU Interface_Advanced Attributes....................................................464

A.5.8 Parameters for SDH Interface Boards..................................................................................................465

A.5.8.1 Parameter Description: SDH Interfaces.......................................................................................466

A.5.8.2 Parameter Description: Automatic Laser Shutdown...................................................................467

A.5.9 Parameters for PDH Interface Boards..................................................................................................468

A.5.9.1 Parameter Description: PDH Ports..............................................................................................468

A.5.9.2 Parameter Description: PRBS Test..............................................................................................471

A.5.10 Parameters for Overhead....................................................................................................................472

A.5.10.1 Parameter Description: Regenerator Section Overhead............................................................472

A.5.10.2 Parameter Description: VC-4 POHs..........................................................................................473

A.5.10.3 Parameter Description: VC-12 POHs........................................................................................475

A.5.11 Parameter Description: Ethernet Virtual Interfaces............................................................................476

A.6 Parameters for Ethernet Services and Ethernet Features on the Packet Plane...............................................479

A.6.1 Parameters for Ethernet Services..........................................................................................................479

A.6.1.1 Parameter Description: E-Line Service_Creation........................................................................479

A.6.1.2 Parameter Description: E-Line Service.......................................................................................500

A.6.1.3 Parameter Description: VLAN Forwarding Table Items for E-Line Services_Creation.............511





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A.6.1.4 Parameter Description: E-LAN Service_Creation.......................................................................512

A.6.1.5 Parameter Description: E-LAN Service......................................................................................518

A.6.1.6 Parameter Description: QinQ Link_Creation..............................................................................529

A.6.1.7 Parameter Description: E-AGGR Services_Creation..................................................................529

A.6.1.8 Parameter Description: E-AGGR Services..................................................................................537

A.6.2 Parameters for Ethernet Protocols........................................................................................................542

A.6.2.1 Parameter Description: ERPS Management_Creation................................................................542

A.6.2.2 Parameter Description: ERPS Management................................................................................545

A.6.2.3 Parameter Description: MSTP Configuration_Port Group Creation...........................................551

A.6.2.4 Parameter Description: MSTP Configuration_Port Group Configuration..................................553

A.6.2.5 Parameter Description: MSTP Configuration_ Bridge Parameters.............................................553

A.6.2.6 Parameter Description: MSTP Configuration_CIST Parameters................................................559

A.6.2.7 Parameter Description: MSTP Configuration_Running Information About the CIST...............561

A.6.2.8 Parameter Description: Ethernet Link Aggregation Management_LAG Creation.....................569

A.6.2.9 Parameter Description: Ethernet Link Aggregation_Link Aggregation......................................577

A.6.2.10 Parameter Description: LPT Management_Point-to-Point LPT................................................578

A.6.2.11 Parameter Description: LPT Management_Creating Point-to-Point LPT.................................580

A.6.2.12 Parameter Description: LPT Management_Point-to-Multipoint LPT.......................................580

A.6.2.13 Parameter Description: LPT Management_Creating Point-to-Multipoint LPT........................583

A.6.3 Parameters for the Ethernet OAM........................................................................................................587

A.6.3.1 Parameter Description: Ethernet Service OAM Management_Maintenance Domain Creation

..................................................................................................................................................................587

A.6.3.2 Parameter Description: Ethernet Service OAM Management_Maintenance Association Creation

..................................................................................................................................................................588

A.6.3.3 Parameter Description: Ethernet Service OAM Management_MEP Creation............................589

A.6.3.4 Parameter Description: Ethernet Service OAM Management_Remote MEP Creation..............590

A.6.3.5 Parameter Description: Ethernet Service OAM Management_MIP Creation.............................591

A.6.3.6 Parameter Description: Ethernet Service OAM Management_LB Enabling..............................592

A.6.3.7 Parameter Description: Ethernet Service OAM Management_LT Enabling..............................593

A.6.3.8 Parameter Description: Ethernet Service OAM_Enabling Service Loopback Detection............595

A.6.3.9 Parameter Description: Ethernet Port OAM Management_OAM Parameter.............................596

A.6.3.10 Parameter Description: Ethernet Port OAM Management_OAM Error Frame Monitoring

..................................................................................................................................................................598A.6.4 QoS Parameters....................................................................................................................................599

A.6.4.1 Parameter Description: Diffserv Domain Management..............................................................599

A.6.4.2 Parameter Description: DiffServ Domain Management_Create.................................................605

A.6.4.3 Parameter Description: DiffServ Domain Applied Port_Modification.......................................612

A.6.4.4 Parameter Description: Policy Management...............................................................................614

A.6.4.5 Parameter Description: Port Policy.............................................................................................620

A.6.4.6 Parameter Description: Port Policy_Traffic Classification Configuration..................................627

A.6.4.7 Parameter Description: Port Shaping Management_Creation.....................................................638

A.7 Parameters for Ethernet Services and Ethernet Features on the EoS/EoPDH Plane.....................................640

A.7.1 Parameters for Ethernet Services..........................................................................................................640





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A.7.1.1 Parameter Description: Ethernet Line Service_Creation.............................................................640

A.7.1.2 Parameter Description: Ethernet Line Service_Creating QinQ-Based Ethernet Line Services

..................................................................................................................................................................644

A.7.1.3 Parameter Description: Ethernet Line Service.............................................................................648

A.7.1.4 Parameter Description: Ethernet LAN Service_Creation of Ethernet LAN Services Based on IEEE802.1d/802.1q Bridge...............................................................................................................................650

A.7.1.5 Parameter Description: Ethernet LAN Service_Creating IEEE 802.1ad Bridge-Based Ethernet LAN

Service......................................................................................................................................................654

A.7.1.6 Parameter Description: Ethernet LAN Service............................................................................659

A.7.1.7 Parameter Description: VLAN Filtering Table_Creation............................................................665

A.7.1.8 Parameter Description: Aging Time of MAC Address Table Entries.........................................666

A.7.2 Parameters for Ethernet Protocols........................................................................................................667

A.7.2.1 Parameter Description: ERPS Management_Creation................................................................667

A.7.2.2 Parameter Description: ERPS Management................................................................................670

A.7.2.3 Parameter Description: Spanning Tree_Protocol Enabling.........................................................676

A.7.2.4 Parameter Description: Spanning Tree_Bridge Parameters........................................................677

A.7.2.5 Parameter Description: Spanning Tree_Port Parameters.............................................................678

A.7.2.6 Parameter Description: Spanning Tree_Bridge Running Information........................................680

A.7.2.7 Parameter Description: Spanning Tree_Port Running Information............................................681

A.7.2.8 Parameter Description: Spanning Tree_Point-to-Point Attribute................................................682

A.7.2.9 Parameter Description: IGMP Snooping Protocol_Enabling......................................................683

A.7.2.10 Parameter Description: IGMP Snooping Protocol_Creation of Static Multicast Table Entries

..................................................................................................................................................................684

A.7.2.11 Parameter Description: IGMP Snooping Protocol_Aging Time of Multicast Table Entries

..................................................................................................................................................................685

A.7.2.12 Parameter Description: Ethernet Link Aggregation_Creation of LAGs...................................686

A.7.2.13 Parameter Description: Ethernet Link Aggregation_Link Aggregation....................................688

A.7.2.14 Parameter Description: LPT Management_Creation of Point-to-Point Service LPT................689

A.7.2.15 Parameter Description: LPT Management_Creation of Point-to-Multipoint Service LPT.......690

A.7.2.16 Parameter Description: Port Mirroring_Creation......................................................................691

A.7.3 Parameters for the Ethernet OAM........................................................................................................692

A.7.3.1 Parameter Description: Ethernet Service OAM_Creation of MDs.............................................692

A.7.3.2 Parameter Description: Ethernet Service OAM_Creation of MAs.............................................693

A.7.3.3 Parameter Description: Ethernet Service OAM_Creation of MPs..............................................694A.7.3.4 Parameter Description: Ethernet Service OAM_Enabling LB....................................................696

A.7.3.5 Parameter Description: Ethernet Service OAM_Enabling LT....................................................697

A.7.3.6 Parameter Description: Ethernet Port OAM_OAM Parameter...................................................698

A.7.3.7 Parameter Description: Ethernet Port OAM_OAM Error Frame Monitoring.............................699

A.7.3.8 Parameter Description: Ethernet Port OAM_Remote OAM Parameter......................................700

A.7.4 QoS Parameters....................................................................................................................................701

A.7.4.1 Parameter Description: QoS Management_Creation of Flows....................................................701

A.7.4.2 Parameter Description: QoS Management_Creation of CAR.....................................................703

A.7.4.3 Parameter Description: QoS Management_Creation of CoS......................................................705

A.7.4.4 Parameter Description: QoS Management_Creation of CAR/CoS.............................................707





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A.7.4.5 Parameter Description: QoS Management_Shaping Management of Egress Queues................707

A.7.4.6 Parameter Description: QoS Management_Port Shaping............................................................709

A.7.5 Parameters for the Ports on Ethernet Boards........................................................................................710

A.7.5.1 Parameter Description: Ethernet Port_External Port...................................................................710

A.7.5.2 Parameter Description: Ethernet Port_Internal Port....................................................................717

A.7.5.3 Parameter Description: Type Field of QinQ Frames...................................................................723

A.8 RMON Parameters.........................................................................................................................................724

A.8.1 ParameterDescription: RMON Performance_Statistics Group...........................................................724

A.8.2 ParameterDescription: RMON Performance_History Group..............................................................725

A.8.3 ParameterDescription: RMON Performance_History Control Group.................................................726

A.8.4 ParameterDescription: RMON Performance_RMON Setting.............................................................727

A.9 Parameters for MPLS/PWE3 Services..........................................................................................................728

A.9.1 MPLS Tunnel Parameters.....................................................................................................................729

A.9.1.1 Parameter Description: Basic Configurations of MPLS Tunnels................................................729

A.9.1.2 Parameter Description: Unicast Tunnel Management_Static Tunnel..........................................730

A.9.1.3 Parameter Description: Unicast Tunnel Management_Creation of Unidirectional Tunnels.......734

A.9.1.4 Parameter Description: Unicast Tunnel Management_Creation of Bidirectional Tunnels.........738

A.9.1.5 Parameter Description: Unicast Tunnel Management_OAM Parameters...................................742

A.9.1.6 Parameter Description: Unicast Tunnel Management_FDI.........................................................747

A.9.1.7 Parameter Description: Unicast Tunnel Management_LSP Ping................................................748

A.9.1.8 Parameter Description: Unicast Tunnel Management_LSP Traceroute......................................751

A.9.1.9 Parameter Description: PW Management_PW Management......................................................754

A.9.1.10 Parameter Description: PW Management_MS-PW Creation....................................................759A.9.1.11 Parameter Description: PW Management_PW OAM...............................................................770

A.9.1.12 Parameter Description: PW Management_PW Ping.................................................................774

A.9.1.13 Parameter Description: PW Management_PW Traceroute.......................................................777

A.9.1.14 Parameter Description: MPLS APS Protection Management...................................................779

A.9.1.15 Parameter Description: Tunnel Protection Group_Creation......................................................782

A.9.1.16 Parameter Description: PW APS Protection Group_Creation...................................................787

A.9.1.17 Parameter Description: Slave Protection Pair of a PW APS Protection Group_Creation.........798

A.9.2 CES Parameters....................................................................................................................................804

A.9.2.1 Parameter Description: CES Service Management.....................................................................804

A.9.2.2 Parameter Description: CES Service Management_Creation.....................................................813

A.9.3 ATM Parameters...................................................................................................................................826

A.9.3.1 Parameter Description: ATM IMA Management_IMA Group Management.............................826

A.9.3.2 Parameter Description: ATM IMA Management_Bound Path Configuration............................831

A.9.3.3 Parameter Description: ATM IMA Management_IMA Group Status........................................833

A.9.3.4 Parameter Description: ATM IMA Management_IMA Link Status...........................................834

A.9.3.5 Parameter Description: ATM IMA Management_ATM Interface Management........................834

A.9.3.6 Parameter Description: Configuration of ATM Service Class Mapping Table...........................836

A.9.3.7 Parameter Description: Configuration of ATM Service Class Mapping Table_Creation...........838

A.9.3.8 Parameter Description: ATM Policy Management.....................................................................840





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A.9.3.9 Parameter Description: ATM Policy Management_Creation......................................................844

A.9.3.10 Parameter Description: ATM Service Management..................................................................849

A.9.3.11 Parameter Description: ATM Service Management_Creation..................................................858

A.9.3.12 Parameter Description: ATM OAM Management_Segment and End Attributes.....................870

A.9.3.13 Parameter Description: ATM OMA Management_CC Activation Status................................874

A.9.3.14 Parameter Description: ATM OAM Management_Remote End Loopback Status...................877

A.9.3.15 Parameter Description: ATM OAM Management_LLID.........................................................880

A.10 Clock Parameters.........................................................................................................................................881

A.10.1 Parameter Description: Frequency Selection Mode...........................................................................881

A.10.2 Physical Clock Parameters.................................................................................................................882

A.10.2.1 Parameter Description: Clock Source Priority Table................................................................882

A.10.2.2 Parameter Description: Priority Table for the PLL Clock Source of the External Clock Port

..................................................................................................................................................................884

A.10.2.3 Parameter Description: Clock Subnet Setting_Clock Subnet....................................................886A.10.2.4 Parameter Description: Clock Subnet Setting_Clock Quality...................................................889

A.10.2.5 Parameter Description: Clock Subset Setting_SSM Output Control........................................892

A.10.2.6 Parameter Description: Clock Subset Setting_Clock ID Enabling Status.................................893

A.10.2.7 Parameter Description: Clock Source Switching_Clock Source Restoration Parameters.........894

A.10.2.8 Parameter Description: Clock Source Switching_Clock Source Switching..............................896

A.10.2.9 Parameter Description: Clock Source Switching_Clock Source Switching Conditions...........897

A.10.2.10 Parameter Description: Output Phase-Locked Source of the External Clock Source.............898

A.10.2.11 Parameter Description: Clock Synchronization Status............................................................901

A.10.3 CES ACRClock Parameters..............................................................................................................902

A.10.3.1 Parameter Description: ACR Clock Source..............................................................................903

A.10.3.2 Parameter Description: Clock Domain......................................................................................903

A.10.3.3 Parameter Description: Clock Domain_Creation......................................................................904

A.10.4 PTP ClockParameters........................................................................................................................905

A.10.4.1 Parameter Description: Clock Synchronization Attribute.........................................................905

A.10.4.2 Parameter Description: Clock Synchronization Attribute_Creation of PTP Clock Ports.........915

A.10.4.3 Parameter Description: Setting of a PTP Clock Subnet_Clock Subnet.....................................916

A.10.4.4 Parameter Description: Setting of a PTP Clock Subnet_BMC.................................................917

A.10.4.5 Parameter Description: External Time Port_Basic Attributes...................................................918

A.10.4.6 Parameter Description: External Time Port_BMC....................................................................919

A.10.4.7 Parameter Description: External Time Port_Cable Transmission Distance..............................921

A.10.5 ParameterDescription: Auxiliary Ports..............................................................................................922

A.11 Parameters for the Orderwire and Auxiliary Interfaces...............................................................................923

A.11.1 Parameter Description: Orderwire_General.......................................................................................923

A.11.2 Parameter Description: Orderwire_Advanced....................................................................................925

A.11.3 Parameter Description: Orderwire_F1 Data Port................................................................................926

A.11.4 Parameter Description: Orderwire_Broadcast Data Port....................................................................926

A.11.5 Parameter Description: Environment Monitoring Interface...............................................................927

B Board Loopback Types............................................................................................................931





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C Indicators of Boards.................................................................................................................933

D Weight and Power Consumption of Each Board................................................................953

E Glossary......................................................................................................................................955

E.1 0-9..................................................................................................................................................................956

E.2 A-E.................................................................................................................................................................956

E.3 F-J...................................................................................................................................................................965

E.4 K-O.................................................................................................................................................................970

E.5 P-T..................................................................................................................................................................976

E.6 U-Z.................................................................................................................................................................985





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1 IntroductionAbout This Chapter

The OptiX RTN 910 is a product in the OptiX RTN 900 radio transmission system series.

1.1 Network Application

The OptiX RTN 900 is a new generation TDM/Hybrid/Packet integrated microwave

transmission system developed by Huawei. It provides a seamless microwave transmission

solution for mobile communication network or private networks.

1.2 Components

The OptiX RTN 910 adopts a split structure. The system consists of the IDU 910 and the ODU.

Each ODU is connected to the IDU through an IF cable.

1.3 Configuration Modes

The OptiX RTN 910 supports different configuration modes in which different system control,

switching, and timing boards, IF boards, and ODUs are configured, suited for various microwave

application scenarios.


IDU Hardware Description 1 Introduction



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1.1 Network ApplicationThe OptiX RTN 900 is a new generation TDM/Hybrid/Packet integrated microwave

transmission system developed by Huawei. It provides a seamless microwave transmission

solution for mobile communication network or private networks.

OptiX RTN 900 Product Family

There are three types of OptiX RTN 900 products: OptiX RTN 910, OptiX RTN 950, and OptiX

RTN 980. Users can choose the product best suited for their site.

l The IDU of the OptiX RTN 910 is 1U high and supports one or two IF boards.

l The IDU of the OptiX RTN 950 is 2U high and supports one to six IF boards.

l The IDU of the OptiX RTN 980 is 5U high and supports one to fourteen IF boards.

NOTE

All the products in the OptiX RTN 900 series use the same types of IF and service interface boards.

The OptiX RTN 900 series provide a variety of service interfaces and can be installed easily and

configured flexibly. The OptiX RTN 900 series provide a solution that can integrate TDM

microwave, Hybrid microwave, and Packet microwave technologies according to the

networking scheme for the sites, achieving smooth upgrade from TDM microwave to Hybrid

microwave, and from Hybrid microwave to Packet microwave. This solution is able to adapt to

changing service scenarios brought about by evolutions in radio mobile networks. Therefore,

this solution meets the transmission requirements of 2G and 3G networks while also allowing

for integration with future LTE and 4G networks.

OptiX RTN 910The OptiX RTN 910 is microwave equipment deployed at the access layer. Figure 1-1 shows

the microwave transmission solution provided by the OptiX RTN 910.

Figure 1-1 Microwave transmission solution provided by the OptiX RTN 910

OptiX RTN 910 BTSNodeB BSCRNC

FE

E1

FEE1

E1

E1

FE

E1

E1

FE

FE/GE

E1/

STM-1

Regional TDM

Network

E1/

STM-1

FE/GE

FE/GE

Regional Packet

Network

MSTP





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NOTE

l In this solution, the OptiX RTN 910 is connected to an RNC and BSC directly or through a regional backhaul

network.

l The OptiX RTN 910 provides a wide range of interfaces and service bearer technologies to adapt to the

regional backhaul network. The regional backhaul network can be a time-division multiplexing (TDM)

network or packet switching network (PSN).

l The OptiX RTN 910 supports the Ethernet over SDH (EoSDH) function and Ethernet over PDH

(EoPDH) function. Therefore, packet services can be backhauled through a TDM network.

l The OptiX RTN 910 supports the pseudo wire emulation edge-to-edge (PWE3) technology. Therefore,

TDM, ATM, and Ethernet services can be backhauled through a PSN.

l The OptiX RTN 910 supports the VLAN sub-interface function. Therefore, MPLS packet services can

be backhauled through a Layer 2 network.

l When three or more microwave directions are required, cascade several sets of the OptiX RTN 910 or use

the OptiX RTN 950 or OptiX RTN 980 that provides more powerful functions and supports more microwave

directions.

1.2 Components

The OptiX RTN 910 adopts a split structure. The system consists of the IDU 910 and the ODU.

Each ODU is connected to the IDU through an IF cable.

IDU 910

The IDU 910 is the indoor unit for an OptiX RTN 910 system. It receives and multiplexes

services, performs service processing and IF processing, and provides the system control and

communications function.

Table 1-1 lists the basic features of the IDU 910.

Table 1-1 Features of the IDU 910

Item Description

Chassis height 1U

Pluggable Supported

Number of microwave

directions

1 or 2

RF configuration mode 1+0 non-protection configuration

2+0 non-protection configuration

1+1 protection configuration

N+1 protection configuration (N = 1)

XPIC configuration





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Figure 1-2 Appearance of the IDU 910

ODU

The ODU is the outdoor unit for the OptiX RTN 900. It converts frequencies and amplifies

signals.

The OptiX RTN 900 product series can use the RTN 600 ODU and RTN XMC ODU, covering

the entire frequency band from 6 GHz to 38 GHz.

NOTE

Unlike the other frequency bands that use 14 MHz, 28 MHz, or 56 MHz channel spacing, the 18 GHz

frequency band uses 13.75 MHz, 27.5 MHz, or 55 MHz channel spacing.

Table 1-2 RTN 600 ODUs that the OptiX RTN 910 supports

Item Description

Standard PowerODU

High-Power ODU Low Capacity forPDH ODU

ODU type SP, SPA HP, HPA LP

Frequency band 7/8/11/13/15/18/23/

26/38 GHz (SP

ODU)6/7/8/11/13/15/18/2

3 GHz (SPA ODU)

6/7/8/10/10.5/11/13/

15/18/23/26/28/32/3

8 GHz (HP ODU)7/8/11/13/15/18/23

GHz (HPA ODU)

7/8/11/13/15/18/23

GHz (LP ODU)

Microwave

modulation scheme

QPSK/16QAM/

32QAM/64QAM/

128QAM/256QAM

QPSK/16QAM/

32QAM/64QAM/

128QAM/256QAM

QPSK/16QAM





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Item Description

Standard PowerODU

High-Power ODU Low Capacity forPDH ODU

Channel spacing 3.5/7/14/28 MHz 7/14/28/40/56 MHz(6/7/8/10/11/13/15/1

8/23/26/28/32/38

GHz)

7/14/28 MHz (10.5

GHz)

3.5/7/14/28 MHz

Table 1-3 RTN XMC ODUs that the OptiX RTN 910 supports

Item DescriptionHigh-Power ODU Low Capacity for PDH

ODU

ODU type XMC-2 XMC-1

Frequency band 7/8/11/13/15/18/23/26/38

GHz

7/8/11/13/15/18/23 GHz

Microwave modulation

scheme

QPSK/16QAM/32QAM/

64QAM/128QAM/256QAM

QPSK/16QAM

Channel spacing 7/14/28/40/56 MHz 3.5/7/14/28 MHz

There are two methods for mounting the ODU and the antenna: direct mounting and separate

mounting.

l The direct mounting method is generally adopted when a small- or medium-diameter and

single-polarized antenna is used. In this situation, if one ODU is configured for one antenna,

the ODU is directly mounted at the back of the antenna. If two ODUs are configured for

one antenna, an RF signal combiner/splitter (hence referred to as a hybrid coupler) must

be mounted to connect the ODUs to the antenna. Figure 1-3 illustrates the direct mounting

method.

The direct mounting method can also be adopted when a small- or medium-diameter and

dual-polarized antenna is used. Two ODUs are mounted onto an antenna using an

orthomode transducer (OMT). The method for installing an OMT is similar to that for

installing a hybrid coupler.





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Figure 1-3 Direct mounting

l The separate mounting method is adopted when a large- or medium-diameter and single-

or dual-polarized antenna is used. Figure 1-4 shows the separate mounting method. In this

situation, a hybrid coupler can be mounted (two ODUs share one feed boom).

Figure 1-4 Separate mounting

NOTE

The OptiX RTN 910 provides an antenna solution that covers the entire frequency band, and supports

single-polarized antennas and dual-polarized antennas with diameters of 0.3 m to 3.7 m along with the

corresponding feeder system.





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1.3 Configuration Modes

The OptiX RTN 910 supports different configuration modes in which different system control,

switching, and timing boards, IF boards, and ODUs are configured, suited for various microwave

application scenarios.

Table 1-4 Configuration modes that the OptiX RTN 910 supports

ConfigurationMode

Control,Switching,and TimingBoard

IF Board ODU Application

PDH

microwave

equipment

CSTA IF1 Low capacity

for PDH ODU

Provides a radio

link with

capacity nothigher than 16 x

E1.

SDH

microwave

equipment

CSTA IF1 Standard power

ODU or high

power ODU

Provides an

STM-1 radio

link or a high-

capacity PDH

radio link.

CSTA ISU2

ISX2

Standard power

ODU or high

power ODU

Provides one or

two STM-1

radio links.

Integrated IP

microwave

equipment

CSHA

CSHB

CSHC

CSHD

CSHE

IFU2

ISU2

Standard power

ODU or high

power ODU

Provides a

Integrated IP

radio link.

XPIC Integrated

IP microwave

equipment

CSHA

CSHB

CSHC

CSHD

CSHE

IFX2

ISX2

Standard power

ODU or high

power ODU

Provides a

Integrated IP

radio link of the

super capacity.





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2 ChassisAbout This Chapter

The IDU of the OptiX RTN 910 is a 1U chassis. It can be deployed in a variety of scenarios and

on several different types of racks, cabinets, and surfaces.

2.1 Chassis Structure

The dimensions (H x W x D) of the IDU 910 chassis are 44 mm x 442 mm x 220 mm. The IDU

910 chassis has a two-layered structure that is air cooled.

2.2 Installation Mode

The IDU 910 can be deployed in a variety of scenarios and on several different types of racks,

cabinets, and surfaces.

2.3 Air Flow

An IDU 910 chassis is air-cooled with air in on the left side and air out on the right side.

2.4 IDU Labels

Product nameplate labels, qualification card labels, ESD protection labels, grounding labels,

laser safety class labels, high temperature warning labels, and operation warning labels, and

other types oflabels are affixed in their respective positions on the IDU chassis or boards. Adhere

to the warnings and instructions on the labels when performing various types of tasks in order

to avoid bodily injury or damage to the equipment.


IDU Hardware Description 2 Chassis



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2.1 Chassis StructureThe dimensions (H x W x D) of the IDU 910 chassis are 44 mm x 442 mm x 220 mm. The IDU

910 chassis has a two-layered structure that is air cooled.

Figure 2-1 shows the chassis structure of the IDU 910.

Figure 2-1 Chassis structure of the IDU 910

W

H

D

2.2 Installation ModeThe IDU 910 can be deployed in a variety of scenarios and on several different types of racks,

cabinets, and surfaces.

The IDU 910 can be installed:

l In a 300 mm European Telecommunications Standards Institute (ETSI) cabinet

l In a 600 mm ETSI cabinet

l In a 450 mm 19-inch cabinet

l In a 600 mm 19-inch cabinet

l In a 19-inch open rack

l In an outdoor cabinet for wireless equipment

l On a wall

l On a table

2.3 Air FlowAn IDU 910 chassis is air-cooled with air in on the left side and air out on the right side.

Figure 2-2 shows the airflow in an IDU 910 chassis.


IDU Hardware Description 2 Chassis



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Figure 2-2 Air flow in an IDU 910 chassis

2.4 IDU Labels

Product nameplate labels, qualification card labels, ESD protection labels, grounding labels,

laser safety class labels, high temperature war

Documents

RTN 910 IDU Hardware Description V100R003C03 01