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© 2016 IBM Corporation Advanced Micro Integration [email protected]
Reduzierte thermische Widerstände:
Schlüssel für eine erfolgreiche Energiewende?
IBM Research – Zurich | Science & Technology
Patrick Ruch, Stephan Paredes, Brian Burg, and Bruno Michel
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 2
Why are Breakthrough Innovations Needed?
• Past decades: Get access to low cost energy
– Get access to fission energy
– Get access to chemically stored solar energy (coal, oil, gas)
– Get access to low cost, low efficiency solar energy
– No focus on exergy and efficiency Exergy waste >75%
• Present: “Energy turnaround”
– Reason risk for human survival (nuclear or climate catastrophes)
– Major strategy change required from getting access to energy
to getting access to exergy and to improve efficiency
– Energy sector is mature and there is no breakthrough innovation possible ??
• Future decades: Use energy efficient and minimize waste
– Focus on efficiency allows thermal wastes to be reduced 3x to < 25%
– Efficiency: IT to reduce our energy consumption by better organization and analysis
– Efficient solar technologies with highest efficiency and minimal radiative forcing
– Efficient thermal transformers reduce exergy waste from 70% to <20%
– Better thermally mediated energy conversion processes
• Key breakthrough innovation
– Disruption when several rapid evolving elements meet and lead to a new convergence
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 3
Why Innovation from Outside of Energy Industry?
• Huge recent focus on cooling in computers
– Huge power densities AND exceptionally low thermal budget
– Exceptionally fast development 1000x overall demand increase in 10 years
– 30 x due to efficiency and 30x higher energy demand +40% per year!
– ICT industry has 3% ww carbon footprint larger than airline industry!
• Exceptional power density in computers (areal and volumetric)
– Increase from 1 to 100 W/cm2 = 0.01 to 1 MW/m2 at a gradient of <10ºC in 20 years
– Volumetric power density in computer is moderate ~0.01 W/cm3 (0.01 MW/m3)
– R&D goal: Dense computing massively improves efficiency (5000x)
– But requires 100-1000 W/cm3 system level power density
• Huge R&D investment to improve areal and volumetric power density
– Cooling technology to handle 1000 W/cm2 or 10 MW/m2 (at a gradient of 50ºC)
– Interlayer cooling at 1 kW/cm3 = 1GW/m3
– >10x better thermal performance than any other energy conversion technology
– Much larger power density than typical power conversion
– 50 kW piston engine (1l) = 50 W/cm3 for working space and ~1W/cm3 for system
– Reactor or furnace 300 MW in 300m3 = 1 MW/m3 or 1 W/cm3 <<1 W/cm3 for system
• IT Industry – Energy Industry Convergence
– Convergence drives disruptions in both industries
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 4
How are Thermal Resistances Massively Reduced?
• Transition from Air cooling to liquid cooling in computers
– Water with 4000 times better heat capacity and 30 time better thermal conductivity
• Microchannels
– High aspect ratio massive surface enlargement
– Disadvantage laminar flow and large pumping power
• Concept of branched hierarchical transport
– Our blood circulation system reaches best mass transport with minimal pumping power
– Optimal branching factor
• Ultra-short microchannels
– Prevent established laminar flow
• Radical miniaturization and use of silicon (dioxide) as structural material
– Good thermal conduction
– No thermal interfaces needed for heat flow
– Radical miniaturization
• Better interfaces
– Filling materials/gaps with percolation
– Improved overall thermal conduction due to necking
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 5
Entry into Energy Research: High-performance Liquid Cooling Datacenter-level power consumption
cooling infrastructure
APC Whitepaper #154
Rev. 2 (2010) Water-cooled IBM blade servers (2010)
HS22
QS22
IBM BladeCenter QS22/HS22 Cluster @ ETH Zurich
Wate
r-coolin
g m
odule
Connected to ETH hot water grid
Water- vs. air-cooling
Air-cooling Water-cooling
Thermal
conductivity
[W/(m∙K)]
Volumetric
heat capacity
[Wh/(L∙K)]
Air 0.02 0.0003
Water 0.6 1
qRT th
thermal gradient thermal resistance
heat flux
Rth = 1 Kcm2/W
T = 50-100 K
For 50-100 W/cm2:
Rth = 0.1 Kcm2/W
T = 5-10 K
First hot-water cooled supercomputer
with energy recovery
•80% energy recovery @ 60°C
•Direct feed to space heating grid
•Energy consumption -40%
•CO2 footprint -85%
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] IBM Zurich
Research
Laboratory |
7-Nov-16
© IBM
Research
2009
6
Manifold Micro-Channel Heat Sink
W. Escher, T. Brunschwiler, B. Michel and D. Poulikakos, “Experimental Investigation of an Ultra-thin Manifold
Micro-channel Heat Sink for Liquid-Cooled Chips”, ASME J. of Heat Transfer, 132, 081402-10 (2010).
W. Escher, B. Michel and D.
Poulikakos, “A novel high
performance, ultra thin heat
sink for electronics”, Intl. J.
Heat and Fluid Flow 31,
586-598 (2010).
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 7
Datacenter: Cooling Infrastructure Chillers
(Refrigeration)
Evaporative Tower Fans
Condenser
Chilled
Water
CRAC/
CRAH
s
Racks & Fans
Electrical Power
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected]
Hot-Water-Cooled Zero Emission Data-
centers „Aquasar“
CMOS 80ºC
Water In 60ºC
Micro-channel
liquid coolers Heat exchanger
Direct „Waste“-Heat usage
e.g. heating
Biological inspired: Vascular systems optimized for low
pressure transport
Water Out 65ºC
Water Pump
8
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected]
Zero-Emission Data Centers
• High-performance chip-level cooling
improves energy efficiency AND
reduces carbon emission: – Cool chip with DT = 20ºC instead of 75ºC
– Save chiller energy: Cool with T > 60ºC hot water
– Re-use: Heat 700 homes with 10 MW datacenter
• Need carbon footprint reduction – EU, IPCC, Stern report targets
– Chillers use ~50% of datacenter energy
– Space heating ~30% of carbon footprint
• Zero-emission concept
valuable in all climates – Cold and moderate climates:
energy savings and energy re-use
– Hot climates: Free cooling, desalination
• Europe: 5000 district heating systems – Distribute 6% of total thermal demand
– Thermal energy from datacenters absorbed IBM Research – Zurich, Advanced Micro Integration [email protected] 9
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected]
Power Dissipation
up to 3.6 MW
HPLinpack Performance
2.9 PFLOPS
IDPX DWC dx360 M4
9288
Power Dissipation
up to 1.3 MW
HPLinpack Performance
X.X PFLOPS
NXS DWC nx360 M5
3096
Power Usage Effectiveness
PUE 1.1
World’s
Most Powerful &
Energy Efficient x86 Supercomputers
Phase I (2012)
SuperMUC at Leibniz Rechenzentrum
Phase II (2015)
9288 IBM System x iDataPlex dx360 M4
– 43997256 Components
– 8.08 m2 CMOS 4.22x1013 transistors
– 74304 4 GB DIMMs
– 11868 IB Fibre Cables 192640 m
– 34153 m Copper tubes, 7.9 m3 Water
– 18978 Quick Connects
Mass 194100 kg
IBM System x / Lenovo NeXtScale
DWC nx360 M5
• 90% heat flux to warm water
• 40% less energy used than air-cooled
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected]
Leibniz-Rechenzentrum (2015) Largest installation utilizing
datacenter waste heat
for adsorption cooling
APC Whitepaper #154 Rev. 2 (2010)
Warm-water cooling +
adsorption heat pumps:
-50% power consumption
for non-IT components
Value proposition without
reliance on external demand
11
Energy Efficiency in Datacenters
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 12
• Water-cooling used to be a necessity
• Today, water-cooling supports energy efficiency
and computing performance
• Enable ultra-dense systems: Computing as a service
• Ecosystem around hot water cooling and heat re-use
Water cooling
system
Energy consumption
reduced by
up to 40%
Direct reuse of waste heat
cuts CO2 emissions by
up to 85%
Microservers
for cloud
Computing
Water-Cooled Computing Roadmap
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected]
Scaling to 1 PFlops in 10 Liters
System with
1 PFlops in
10 liters
P. Ruch, T. Brunschwiler, W. Escher, S. Paredes,
and B. Michel, “Towards 5 dimensional scaling:
How density improves efficiency in future
computers”, IBM J. Res. Develop. 55 (5,
Centennial Issue), 15:1-15:13 (2011).
• Efficiency comparison – 1PFlops system currently consumes ~10MW
– 0.1 PF ultra-dense system consumes 20 W
• Ultra-dense Bionic System – Stack ~10 layers of memory on logic
– Stack several memory-logic stacks to stack of stacks
– Combine several blocks of stacks to MCM (MBM)
– Combine MCMs to high density 3D system
• Key enabling technologies – Interlayer cooling
– Electrochemical chip
power supply
• Impact – 5’000x smaller power
– 50’000’000x denser
– Scalability to zetascale With cooling
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 14
Experimental Smarter Energy Research Agenda
High performance
microchannel coolers
Growth in Cloud
and Big Data
Heat exchanger
Pump
Underfloor
heating
Research background
Economic value of heat reduces datacenter total
cost of ownership by 50-70% lower energy cost
60°C
65°C
>700 W/cm2
leverage in
Critical energy & environmental issues
Sustainable generation
Electricity and heat
Fresh water scarcity
Renewable heating and cooling
Zero-emission
datacenter
High-concentration
PV/thermal
Adsorption
heat pump
Membrane distillation
desalination
Electrochemical redox
energy conversion
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 15
High Concentration PV/thermal (HCPVT) Multigeneration
•Solar provisioning of electricity and heat
today typically employs two separate
power stations → doubled cost
•Current solar systems capture <35% of
incoming solar irradiation → >65% waste
HCPVT system captures >80%
of solar energy content with
one installation
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 16
Better Competitiveness and Efficiency by Integration
• Matching provider and consumer of heat
• Making use of optimized interfaces
• Best Solar to Electricity, Water, Cooling
Efficiency
Low grade heat thermal process
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 17 17
Advantages of HCPVT System
• Higher concentration factor
– Air cooling looses 50ºC in package and wastes heat
– 10x reduced package thermal resistance allows
– 90ºC fluid removes heat from 100ºC cells for >2000 suns
• Higher electrical efficiency
– PV, CPV, and CSP have overall system yield <30%
– 350ºC solar thermal systems dissipate 75% waste heat
– High concentration allows triple junction PV with >30% yield
• Desalinated water, heating, and cooling from waste heat
– HCPVT makes heat re-usable without
degrading PV efficiency
– System output 80%
– Electrical power, desalinated water and
cooling at lower cost
• Superior HCPVT system performance
– >50% heat available on top of
the electrical yield
NASA SSE Release 6.0 Data set 22-year Monthly &
Annual Average (1983 - 2005). Map by DRL (2008)
Heating / Hot water
4.4 kWh/(m2 day)
Yield 50%
Electrical Power
2.6 kWh/(m2 day)
Yield 30%
Desalination
>50 L/(m2 day)
GOR 7-8
Cooling
2.8 kWh/(m2 day)
COP 0.6
OR
OR
AND
HCPVT
Irradiance 850 W/m2 or
8.8 kWh/(m2 day)
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 18
HCPVT Technology Advantage
PV chip with inter-
mediate substrate
PV chip direct attach
Multi Cell Module
(MCM)
PV chip direct attach
Single Cell Module
(SCM)
TIM 2
TIM 1
PV Cell
heat sink Manifold
TIM 1
PV Cell
1st level
manifold Si cooler chip
assembly
Large Multi Cell Receiver (MCR)
1500 suns
12 kWel / 25 kWth prototype units in 2015
Receiver packaging and thermal management
10x reduced thermal resistance with
respect to air-cooling
TIM: Thermal Interface Material
• 40m2, 12kW electrical and 25 kW thermal
• Cooling water 90°C
• 30% electrical, 50% thermal, and 80% total
• LCOE: <0.1$/kWh for sunny locations
• 10x lower cost than steel/glass
technologies
• Reduce the number of expensive multi-
junction solar cells
• Combination with adsorption cooling
and desalination
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 19
Are Active or Passive Solar
Technologies better Counter-
measures to Global Warming?
• White roofs reduce urban temperatures
for cities in the Sunbelt while solar panels cause a heat island effect
An inconvenient truth for the cost focused solar industry
Need refocus on efficiency; avoid building integration
?
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 20
Large Energy Demand in Sunny Regions
• Tripled global cooling demand (2010 -2040)
predicted by International Energy Agency (IEA)
• Driven by growth markets in hot regions
• Vapor-compression cooling strains power grid
• Solution: Solar thermal cooling with afternoon
peak output when demand is highest
• HCPVT with heat driven sorption chillers
provides cooling without loss of electrical output
• Smallest solar fields – maximized yield
• No water consumption: Dry cooling, no cleaning
Off Peak Base Load Off Peak
Peak with
compr. cooling
Peak with
sorption cooling
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 21
Low temperature
Key performance metrics
• Specific cooling power (SCP) [W/kg] Cooling power per unit adsorber mass
• Coefficient of performance (COP) [-] Cooling power per unit thermal driving power
→ Adsorbent materials
→ Heat and mass transfer
→ Heat exchanger and system design
High temperature Medium temperature
Adsorption Compression
Water-based Refrigerants
COPel >10 COPel <5
1500 $/kW 500 $/kW
30 W/kg 100 W/kg
10 kW/m3 60 kW/m3
Today’s technology
Adsorption Cooling
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 22
Transport dynamics Adsorbents
Refrigerants
Silica gel Zeolite
Activated
carbon
Alumino-
phosphates
MOFs Salt
composites
Sources: Henninger et al., JACS 131 (2009) 2776; Critoph & Zhong, Proc. IMecE 219 (2005) 285; Freni et al., Appl. Therm. Eng. 27 (2007) 2200; Aristo
Name Formula Boiling point
[°C]
Latent heat
[kJ/kg]
Latent heat density
[kJ/m3]
Water H2O 100 2 258 2 163
Methanol CH3OH 65 508 872
Ammonia NH3 -34 1 368 932
Sulphur dioxide SO2 -10 605 534
Adsorption Cooling
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 23
Characterization of Adsorption Dynamics
scale bar: 1 cm
Cooling power measurement Experimental setup
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 24
Physical modeling of
heat & mass
transport with
sorption phenomena
Location-specific modeling of solar thermal and
waste heat driven cooling systems 1 2
Synthesis of adsorbents with tailored
application-specific properties 3
Characterization via vapor sorption
isotherms and adsorbate diffusion
coefficient measurements 4
Adsorbent assembly for optimized
heat & mass transport rates 5
In situ transient thermography and
cooling power characterization 6
Test facility for 1 kW heat
exchanger
characterization 7
0.5 mm 100 µm
0
10
20
30
40
50
60
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
Relative pressure
Ma
ss u
pta
ke
[%
] M
ass u
pta
ke [%
]
Relative pressure
Domestic hot water
150°C | 60°C | 12°C
Space heating
80°C | 40°C | 12°C
Air-conditioning
60°C | 30°C | 18°C
Summary of Expertise
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 25
Thermally Driven Heat Pumps in Switzerland: National Project
Scenario assessment
Impact evaluation
Technology development
Sub-project 4 System & interface
Sub-project 5 Sustainability analysis
Sub-project 1 Tailored materials
Sub-project 4 System & interface
Sub-project 5 Sustainability analysis
Sub-project 2 Advanced adsorbers
Sub-project 3 Compact heat pump
THRIVE Project leader
NRP 70
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 26
Why now?
• Why nobody noticed this fact so far
– No overlap between the two disciplines
– Insufficient focus on efficiency
• 1) Because of past focus on energy and not exergy/efficiency
– Waste heat was not an issue BUT need to turn your enemy into your friend
– Paradigm change in computer industry from performance focus
– (squeeze as much as you can out of a silicon processor chip) to
– Efficiency focus (squeeze as much as you can out of a Joule)
• 2) Because of our focus on electrical energy
– Initial energy transport was done by heat and then by electricity due to introduction of
electrical transformer
– Heat requires understanding of the concept of exergy: Need thermal transformer
• 3) Because of lack of technology and effort
– Focus on electrically driven heat pumps
• Energy turnaround triggers a lot of research
– NRP 70 and 71 programs in Switzerland
– THRIVE project
– Reduced convective and conductive thermal resistance everywhere
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 27
Thermal Resistance: Importance beyond Heating/Cooling
• Major reason for limited efficiency
– Losses due to convective and conductive thermal resistances
• Convective thermal resistance
– Microchannel (disadvantage laminar flow)
– Hierarchical branched transport network (developing flows)
• Conductive thermal resistance
– Better materials copper
– Shorter path lengths
– Better interfaces
• Most energy conversion processes use thermal path or cause waste heat
– Heat driven heatpump: less than 30% exergetic efficiency
i.e. COP of 0.6 for Tdrive 90ºC, Tamb 30ºC and Tcool 10ºC 20% exergetic efficiency
– Steam engines 42% = 58% losses (mainly in boiler and due to Rankine Cycle)
– CHP 65% = 35% losses
– Solar thermal: <15%
– Photovoltaic: < 15%
– Combined CPV and thermal 80% total and >50% exergetic efficiency
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 28
Summary
• Reuse ICT heat for heating and cooling Zero-emission datacenter
– Clear technology lead >10x lower thermal convective resistance than in energy industry
• Convert heat from Solar HCPVT and datacenters into cooling
– Needs high efficiency HCPVT receiver and district cooling
– Heat driven heat pump 10x better due to lower conductive resistance and better isotherm
– Heat pump with high exergetic efficiency Thermal Transformer
• Move solar industry away from the wrong track
– Low efficiency solar contributes to global warming by radiative forcing
– Solar in sunbelt: No building integration and high efficiency needed
• Microchannel flow boiling to be used in low grade heat steam engines
– Rankine cycle with limited efficiency Should use near isothermal expander
• Common part: Massively reduced convective and conductive heat transfer
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 29
Summary: Solving the Energy–Water–Cooling Challenge
• Solutions for Fresh water solar dilemma and large energy and cooling demand
• Selection of emerging technologies with a huge potential
– Emerging to become mature as part of a project roadmap
– Offer higher overall efficiency and zero carbon footprint during operation
– Best overall sustainability profile
• Each technology alone able to displace the current market leader
• Energy HCPVT provides best LCOE values
• Water Heat driven membrane distillation desalination
• Cooling Efficient heat driven adsorption cooler
• Best Solution: Amplify overall efficiency by integration
Making use of optimized interfaces
• Why thermal processes? Efficiency and low cost storage
• IBM experience in heat reuse, higher efficiency, and power density
• Initial prototype solutions available for testing in 2015
• Breakthrough solutions for sustainable solar energy, cooling, and water
• Project roadmap for 2016 and 2017 for complete low cost, high performance
solutions
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 30
Heat Transformation Through Solid Sorption
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected]
Green Datacenter Market Drivers and Trends
• Increased green consciousness, rising cost of power
• IT demand outpaces technology improvements – Server energy use doubled 2003-2008; temporary slowdown due
to economic crisis; resumed growth is not sustainable
– Koomey Study: Server use 1.2% of U.S. energy
• ICT industries consume 2% world wide energy – Carbon dioxide emission like global aviation
Real Actions Needed
Brouillard, APC, 2006
Future datacenters dominated by energy cost;
half energy spent on cooling Source IDC, 2009
IBM Research – Zurich, Advanced Micro Integration [email protected] 31
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] IBM Zurich
Research
Laboratory |
7-Nov-16
© IBM
Research
2008
32
Chip Scale Liquid Cooling
A
A’
A-A’
Arrayed jets, distributed return
SEM cross-section of two-level
jet plate with diameter of 35µm
Biological vascular systems are optimized for
the mass transport at low pressure
Direct Liquid Jet-Impingement Cooling with Micron-Sized
Nozzle Array and Distributed Return Architecture, T.
Brunschwiler et al., Proceedings ITHERM (2006)
Cooling of up to 350 W/cm2
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected]
Adsorption Cooling Energy Ecosystem
Renewables
Solar thermal
Driving heat
Heat rejection
CPV/T
Geothermal
Combined heat & power
Gas turbines Micro-CHP
Cooling
Waste heat
Industry
• Residential
• Commercial
• Industrial
• District cooling
© 2016 IBM Corporation
IBM Research Zurich
Smart System Integration [email protected] 34
Low / Medium Grade Heat Driven Processes
• Desalination needed for increasing demand and diminishing supply of water
– Multistage Flash and Reverse Osmosis overstresses electrical supply / grids
– Temperatures limited due to scale formation – fits with CPVT temperatures
• Multi Effect Membrane Distillation (MEMD)
– Uses micro-porous, hydrophobic membrane, low grade heat and plastic vessels
– Combines advantages of RO with water purity from distillation processes
MEMD and CPVT with best output of electricity and desalinated water
– Water needed during hot and dry season with lots of sun
• Compression cooling for air conditioning overstresses electrical grids
– Multi-generation supporting space heating and cooling via an adsorption chiller
– IEA predicts tripling of cooling demand from 2010 to 2040
Adsorption and CPVT provide cooling on top of electrical power
– Heat is available at low cost in CPVT system with peak power around noon
– Cooling needed during hot season with lot of sun
Solar heat driven cooling and
desalination solve energy and water problem