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DIGITAL OPTICAL NETWORK PRODUCT OVERVIEW Revision June 2007 Revision A Software Release: 3.0 Infinera Corporation 169 Java Drive Sunnyvale, CA. 94089 www.infinera.com + 1-408-572-5200

R3.0 Product Overview Student Handout 6-12-2007

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Page 1: R3.0 Product Overview Student Handout 6-12-2007

DIGITAL OPTICAL NETWORK

PRODUCT OVERVIEW

Revision June 2007

Revision A

Software Release: 3.0

Infinera Corporation169 Java DriveSunnyvale, CA. 94089www.infinera.com+ 1-408-572-5200

Page 2: R3.0 Product Overview Student Handout 6-12-2007

Copyright© 2007 Infinera Corporation. All rights reserved.

This Manual is the property of Infinera Corporation and is confidential. No part of this Manual may be reproduced for any purposes or transmitted in any form to any third party without the express written consent of Infinera.

Infinera makes no warranties or representations, expressed or implied, of any kind relative to the information or any portion thereof contained in this Manual or its adaptation or use, and assumes no responsibility or liability of any kind, including, but not limited to, indirect, special, consequential or incidental damages, (1) for any errors or inaccuracies contained in the information or (2) arising from the adaptation or use of the information or any portion thereof including any application of software referenced or utilized in the Manual. The information in this Manual is subject to change without notice.

TrademarksInfinera and Infinera Digital Optical Network are trademarks of Infinera Corporation.

GoAhead is a trademark of GoAhead Software, Inc.

All other trademarks in this Manual are the property of their respective owners.

Infinera DTN and Infinera Optical Line Amplifier Regulatory ComplianceFCC Class A

This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Modifying the equipment without Infinera's written authorization may result in the equipment no longer complying with FCC requirements for Class A digital devices. In that event, your right to use the equipment may be limited by FCC regulations, and you may be required to correct any interference to radio or television communications at your own expense.

DOC Class A

This digital apparatus does not exceed the Class A limits for radio noise emissions from digital apparatus as set out in the interference-causing equipment standard titled "Digital Apparatus," ICES-003 of the Department of Communications.

Cet appareil numérique respecte les limites de bruits radioélectriques applicables aux appareils numériques de Classe A prescrites dans la norme sur le matériel brouilleur: "Appareils Numériques," NMB-003 édictée par le Ministère des Communications.

Warning

This is a class A product. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures.

FDA

This product complies with the DHHS Rules 21 CFR Subchapter J, Section 1040.10, Applicable at date of manufacture.

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Page ii-i

DIGITAL OPTICAL NETWORK

PRODUCT OVERVIEW

COURSE OUTLINEJune 2007

Revision A

Software Release: 3.0

COURSE DESCRIPTION

This training course is designed for the student who needs an introduction into the capabilities of the Infinera Digital Optical Network®. Students are provided detailed information on the following topics: System Architecture

Chassis Capabilities

Hardware functions and features

Theory of Operations

Software functions and features

LEARNING OBJECTIVES

Upon successful completion of this course, the student should be able to: Describe the functions of Infinera’s PIC

List the capabilities of the DTN and the Optical Line Amplifier

Describe the network applications and topologies supported by the DTN/Optical Line Amplifier

List the capabilities of the DTC/OTC

Describe the functions and features of the hardware modules for the DTC/OTC

Describe the power feeds for the DTC

Describe the vertical cooling method used in the DTC

Describe the functions of the DTC/OTC control plane

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List the components of the control plane for the DTC and the OTC

List the components of the data plane for the DTC

Describe the system architecture for the DTN and the Optical Line Amplifier

List the functions and features of the software available for the DTN/Optical Line Amplifier

COURSE CONDITIONS

There are a maximum of 12 students

Students are issued training texts

Lectures are presented with projector displays

This course is 100% lecture

PREREQUISITES

To be successful in this course, students should have the following skills and knowledge: An understanding of fiber optics and digital communications technology

Experience with telecommunications systems

Experience with a graphical user interface such as a browser

Knowledge of Dense Wavelength Division Multiplexing (DWDM), Synchronous Optical Network (SONET), Synchronous Digital Hierarchy (SDH), and Gigabit Ethernet (GbE)

TIME

• The average time for this training course is 1 day.

COURSE OUTLINE

1. Introduction and Administration

a. Class Introductions

b. Safety

c. Administrative paperwork

2. System Architecture

a. Functions of the PIC

b. Infinera Digital Optical Network

c. DTN Capabilities

• 800Gbps capacity• GMPLS• G.709 Digital Wrapper

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• Client signal transport transparency• Multiple client signal support• O-E-O regeneration• Multiple configuration support• Add/Drop capabilities• Multi-chassis capabilities• Digital link reach• Topology support• Protection capabilities• Restoration capabilities• Enhanced troubleshooting capabilities• Redundant control plane

d. Optical Line Amplifier Capabilities

e. Chapter Review

3. Hardware Overview

a. DTN chassis overview

b. Components of the DTC

• Rack mount ears• Grounding• Power Entry Module(s) (PEM)• Input Output (I/O) Panel• Timing and Alarm Panel (TAP)• Fan Trays• Air Filter• Card cage

c. DTC Modules

• Management Control Modules (MCM)• Tributary Optical Modules (TOMs)• Tributary Adapter Modules (TAMs)• Digital Line Module (DLM)• TAM Extender Module (TEM)• Bandwidth Multiplexing Modules (BMM)

d. Optical Line Amplifier chassis overview

e. Components of the OTC

• Rack mount ears• Grounding• Power Entry Module(s) (PEM)

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• Input/Alarm Panel• Fan Trays• Air Filter• Card cage

f. OTC Modules

• Optical Management Module (OMM)• Optical Amplifier Modules (OAM)

g. Dispersion Management Chassis

• Dispersion Compensation Moduleh. Chapter Review

4. Theory of Operations

a. DTN Power and Cooling

b. Control Plane

• Network Level• DTN Control Plane Components• DTN Control Plane• DTN Redundant Control Plane• NCT cable configurations• Optical Line Amplifier Control Plane Components• Optical Line Amplifier Control Plane• Optical Line Amplifier Redundant Control Plane

c. Data Plane

• System data plane architecture• Digital Terminal Configuration• Digital Repeater Configuration• Digital Add/Drop Configuration

d. Multi-Chassis Configuration

e. Optical Line Amplifier Signal Flow

f. Chapter Review

5. Software Overview

a. Infinera Graphical Node Manager (GNM)

b. Infinera Digital Network Administrator (DNA)

c. TL-1

d. Chapter Review

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6. Course Review

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Page 1-1

Section 1 System Architecture

Section 2 Hardware Overview

Section 3 Theory of Operations

Section 4 Software Overview

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Slide-6 System Architecture - Chapter Learning Objectives

Slide-7 Infinera’s Breakthrough Technology

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System Architecture

CHAPTER LEARNING OBJECTIVES

Upon successful completion of this chapter, the student should be able to:• Describe the functions of Infinera’s Photonic Integrated Circuit

(PIC)• List the capabilities of the DTN and the Optical Line Amplifier.• Describe the network topologies that the DTN and the Optical

Line Amplifier can be deployed in.

INFINERA’S BREAKTHROUGH TECHNOLOGY

Infinera has introduced the first optical platform based on Photonic Integrated Circuits combines DWDM scalability, digital bandwidth management, and the network intelligence of Generalized Multi-Protocol Label Switching (GMPLS).

• Integration of >50 discrete optical components on ONE chip set. Lasers

Modulators

Wavelength Multiplexers

Demultiplexers

Photo detectors

• Dramatic Capital Expenditure (CapEx) reduction• Simplify Network Operations, Engineering, and Operations• 100Gbps Dense Wavelength Division Multiplexer on one chip set• 8 versions of PIC chip sets provide up to 80 channels of 10Gbs• Enables ultra low cost Optical-Electrical-Optical (OEO)

conversion

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System ArchitecturePage 1-4

Slide-8 PIC Chip Set Features - Transmit PIC

Slide-9 PIC Chip Set Features - Receive PIC

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EACH PIC CHIP SET FEATURES A TRANSMIT (TX) AND RECEIVE (RCV) PIC

PIC CHIP SET FEATURES - TRANSMIT PIC

Infinera currently produces eight different TX PICs.

Each TX PIC creates 10 separate 10G wavelengths, then multiplexes the 10 wavelengths into one 100Gbps signal.

With just 8 chips, Infinera provides the user 80 individual 10G channels!

Each Transmit PIC chip features:• 10 x DWDM lasers• 10 x 10G DWDM modulators• 10 x lambda DWDM multiplexer

PIC CHIP SET FEATURES - RECEIVE PIC

Infinera currently produces eight different RCV PICs.

Each RCV PIC receives the signal from a TX PIC and demultiplexes the 100G signal into 10 individual 10G wavelengths.

Each Receive PIC chip features:• 10 x 10G receivers• 10 lambda DWDM de-multiplexer

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System ArchitecturePage 1-6

Slide-10 PIC Chip Set Facts

Slide-11 Infinera’s Digital Optical Network™

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PIC CHIP SET FACTS

Each PIC chip set provides 100Gbps DWDM

10 separate channels at 10Gbps per channel

There are 8 separate PIC chip sets

Each PIC chip set is installed in one circuit pack

With just 8 circuit packs (each including a PIC chip set) Infinera provides the user with 800Gbps DWDM capability that fits in just one rack.

INFINERA DIGITAL OPTICAL NETWORK CAPABILITIES

Infinera offers Digital Optical Networking Systems which help carriers build Digital Optical Networks. The Infinera DTN is the first Digital Optical Networking System which provides digital add/drop and bandwidth management capabilities. In addition, Infinera Optical Line Amplifiers are provided to extend the optical reach between the DTNs. The DTN and Optical Line Amplifier network elements provide similar system interfaces, data plane and control plane functions providing ease of use and deployment.

The Infinera Digital Optical Network allows the construction of a single unified optical transport network that scales from metro to long haul applications.

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System ArchitecturePage 1-8

Slide-12 DTN Capabilities Overview

Slide-13 DTN 800Gbps Capacity

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DTN CAPABILITIES OVERVIEW

• 800Gbps capacity• GMPLS• G.709 digital wrapper• Client signal transport transparency• Multiple client signal support• O-E-O regeneration• Multiple configuration support• Add/Drop capabilities• Multi-chassis capabilities• Digital link reach• Topology support• Protection capabilities• Restoration capabilities• Enhanced troubleshooting capabilities• Redundant control plane

DTN 800GBPS CAPACITY

• 400 Gbps per chassis• Deployed in 100Gbps Optical Carrier Group (OCG) increments• Up to 80 channels• 10Gbps per channel• Multiplexed into 800Gbps Optical Transport Signal (OTS) per

fiber pair

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System ArchitecturePage 1-10

Slide-14 GMPLS

Slide-15 G.709 Digital Wrapper

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GMPLS

• Multi-protocol Label Switching (MPLS) is utilized to speed up packet forwarding and provide for traffic engineering in Internet Protocol (IP) networks.

• Generalized MPLS (GMPLS) extends MPLS to provide the control plane (signaling and routing) for devices that switch in any of these domains: packet; time; wavelength; fiber. This common control plane promises to simplify network operation and management by automating end-to-end provisioning of connections, managing network resources, and providing the level of Quality of Service (QoS) that is expected in the new, sophisticated applications.

G.709 DIGITAL WRAPPER

The digital wrapper universally encapsulates client signals for transport across the Digital Optical Network™

• The Digital Transport Frame (DTF) is based on G.709 Optical Transport Unit (OTU) format that includes:

Trib DTF

• Facilitates SONET and SDH like maintenance operations

Line DTF

• Forward Error Correction (FEC) overhead• Facilitates SONET and SDH like maintenance

operations

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System ArchitecturePage 1-12

Slide-16 Transport Transparency

Slide-17 Client Signal Support

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CLIENT SIGNAL TRANSPORT TRANSPARENCY

Native client signals are carried through the multiple transport layers of the Digital Transport Network with complete service transparency.

DTN CLIENT SIGNAL SUPPORT

The DTN provides client (tributary) signal support for most common signal rates and types including:

• Synchronous Optical Networks (SONET) OC-192• Synchronous Digital Hierarchy (SDH) STM-64• 10 Gigabit Ethernet (GbE) LAN• 10 Gigabit Ethernet (GbE) WAN• 10 Gigabit Clear Channel • 2.5 (2.488) Gigabit Clear Channel• SONET OC-48.• SDH STM-16• SONET OC-12• SDH STM-4• SONET OC-3• SDH STM-1• 1Gigabit Ethernet

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System ArchitecturePage 1-14

Slide-18 O-E-O Regeneration

Slide-19 DTN Configurations

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O-E-O REGENERATION

• Full Optical-Electrical-Optical (O-E-O) 4R regeneration of every channel at every DTN

4R

• Re-amplify• Reshape• Retime• Re-FEC

The 4R is performed at the DTF level

DTN CONFIGURATIONS

• Supported configurations include: Digital Terminal (DT)

Add-Drop (AD)

Digital repeater (DR)

Note: The default configuration for a newly commissioned DTN will be Digital Optical Node (DON).

• Configuration support is based on equipment installed in the DTN, not software

• Equipment can be added in-service to change functionality and capability

• All configurations are supported using the same software load.

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System ArchitecturePage 1-16

Slide-20 Add/Drop Capabilities

Slide-21 Multi-Chassis Capabilities

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ADD/DROP CAPABILITIES

The DTN provides a means for direct access to client data at wavelength (10Gbps, 2.5Gbps, and 1Gbps) granularity at any site, allowing flexible selection of whether to multiplex, add/drop, amplify, groom, or wavelength interchange individual channels.The Infinera DTN is the first Digital Optical Networking System which provides 0 to 100 percent digital add/drop and bandwidth management capabilities at every DTN.

MULTI-CHASSIS CAPABILITIES

No matter the number of individual chassis interconnected, the DTN functions, reports, and is managed as a single Network Element (NE).

• The DTN supports numerous multi-chassis configurations 2 to 10 chassis configurations are supported

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System ArchitecturePage 1-18

Slide-22 DTN Digital Link

Slide-23 Optical Transport Layers

Digital Link – defined as DTN to DTNSpan – fiber link between NEs

Optical Line Amplifiers used to extend the Digital Link Up to 7 Optical Line Amplifiers between DTNsInfinera’s Digital Optical Network components can recover an average of approximately (~) 26db per span for up to 8 spans

Digital LinkDigital Link

SpanSpan

8 x 26 Digital Link

Up to 7 Optical Line Amplifiers per Digital Link maximum

~26dbdrop

~26dbdrop

~26dbdrop

~26dbdrop

~26dbdrop

~26dbdrop

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DTN DIGITAL LINK

• Digital Link - Defined as DTN to DTN• Span - fiber link between network elements• Optical Line Amplifiers used to extend the digital link• Up to 7 Optical Line Amplifiers between DTNs• Infinera’s Digital Optical Network components can recover an

average of approximately(~) 26db per span for up to 8 spans

OPTICAL TRANSPORT LAYERS

There are four Optical Transport layers employed in the Digital Optical Network:

• Optical Transport Section• Optical Mux Section (C-band) (OMSb)• Optical Mux Section (OCG) (OMSa)• Optical Channel

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System ArchitecturePage 1-20

Slide-24 Topology Support

Slide-25 Point-to-Point Topology T

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TOPOLOGY SUPPORT

• Point-to-Point Single Span

Multiple Span

• Linear Add/Drop• Hub and Spoke• Ring• Mesh

POINT-TO-POINT

The basic deployment is an un-protected point-to-point network. The point-to-point network consists of two DTNs, each configured as a Digital Terminal (DT), connecting two sites in the network.

Depending on the distance of the route, the fiber loss and the potential for customer access at intermediate sites along the route, an optimal selection of Optical Line Amplifiers and DTNs can be included in the route.

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System ArchitecturePage 1-22

Slide-26 Linear Add/Drop Topology

Slide-27 Hub and Spoke Topology

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LINEAR ADD-DROP

A linear add/drop network is an extension of the point-to-point network configuration. Multiple point-to-point segments are concatenated and traffic is added, dropped, or passed through at the intermediate sites.

A point-to-point network can be upgraded in-service to a linear add/drop network by populating the appropriate interfaces at the Digital Repeater (DR) site or at the Digital Terminal (DT) site.

HUB AND SPOKE

A hub and spoke network configuration is an extension of the linear add/drop network configuration where one or more linear add/drop spoke-routes junction through a single location, with traffic switched between the spoke-routes. Each add/drop spoke-route can be at an arbitrary distance, effectively extending the reach of the add/drop to the appropriate termination location.

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System ArchitecturePage 1-24

Slide-28 Ring Topology

Slide-29 Mesh Topology

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RING

A ring network is a special case of a linear add/drop network where two Digital Terminal nodes are replaced by a single Digital Add/Drop node. So, a digital optical ring network consists of DTNs configured to perform add/drop function and interconnected in a ring topology. As with all other network configurations, a linear add/drop network is in-service upgradeable to a ring network. Infinera’s digital optical ring network eliminates the distance limitations on ring circumference. This allows the digital optical ring to be used in metro applications and core network applications

MESH

A mesh network is a special case where there are multiple paths to every destination. As with all other network configurations, a linear add/drop network is in-service upgradeable to a mesh network.

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System ArchitecturePage 1-26

Slide-30 Digital SNCP Protection Capabilities

Slide-31 Dynamic GMPLS Circuit Restoration

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PROTECTION CAPABILITIES

DIGITAL SUB-NETWORK CONNECTION PROTECTION (SNCP)

• Client (tributary) side protection• Physical Y-cable optical splitter• Functions like 1+1• User selectable Revertive / Non-revertive• Provisionable Wait-to-Restore period (5--12 minutes, default 5

minutes)

RESTORATION CAPABILITIES

DYNAMIC GMPLS CIRCUIT RESTORATION

• Topologies supported Linear

Ring

Mesh

• Triggers Loss of light (LOL)

Loss of signal (LOS)

Equipment failure

• Restoration activity Determines alternate path bandwidth availability

Reroutes SNCs utilizing available bandwidth

• Non-revertive

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System ArchitecturePage 1-28

Slide-32 Enhanced Troubleshooting Capabilities

Slide-33 Performance Monitoring Checkpoints

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ENHANCED TROUBLESHOOTING CAPABILITIES

• The DTN provides industry leading troubleshooting capabilities by providing:

Numerous Performance Monitoring (PM) checkpoints

Multiple loopback insertion points

PERFORMANCE MONITORING CHECKPOINTS

• Client Optical Tx - Rx• Client Electrical (Digital) Tx - Rx• DTF Path• DTF Line• Digital Channel• Optical Channel• OCG• OSC• OTS

Note: The TEM does not provide PMs.

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System ArchitecturePage 1-30

Slide-34 Loopback Insertion Points

Slide-35 Redundant Control Plane

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LOOPBACK INSERTION POINTS

Infinera defines a Facility Loopback as a loopback that returns to the closest fiber, and a Terminal Loopback as a loopback that faces back across equipment.

• There are 4 loopback insertion points 1 - Client Tributary Facility

2 - Client Tributary Terminal

3 - DTF Path Terminal

4 - DTF Line Facility

REDUNDANT CONTROL PLANE

• The Management Control Module (MCM-B) supports both redundant and non-redundant control plane configurations

• A redundant configuration provides protection for: Remote management

Communications

Software

Database

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System ArchitecturePage 1-32

Slide-36 Optical Line Amplifier Capabilities

Slide-37 Chapter Review

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OPTICAL LINE AMPLIFIER CAPABILITIES

• Amplifies the combined optical signal (bidirectional)• Extends the optical reach between the DTNs• Redundant control plane• Deployed where client access is not anticipated

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System ArchitecturePage 1-34

Chapter Review

Photonic Integrated Circuit (PIC):

1. Integration of ___________ discrete optical components on ONE chip set.• Dramatic CapEx reductions• __________________ service anywhere• Simplify Network Architecture• Simplify Engineering and Operations

2. __________________ Dense Wavelength Division Multiplexer on one chip set.3. Enables ultra low cost ___________________________________ conversion4. Two PIC chip set features:

• Transmit PIC _______ x DWDM lasers

10 x 10G DWDM modulators

10 x lambda DWDM multiplexer

• Receive PIC 10 x 10G receivers

_______ lambda DWDM de-multiplexer

DTN capabilities:

1. _______ Gbps capacity.2. _______ Gbps capacity per chassis deployed in 100Gbps ___________ ____________ _________

(OCG) increments.3. Generalized ___________________ ________________ _________________.4. G.709 __________ ___________.5. Client signal transport _________________________.6. Signal support for:

a. __________________________________________

b. Synchronous Digital Hierarchy (SDH) STM-64

c. 10Gigabit Ethernet (GbE) _______

d. 10Gigabit Ethernet (GbE) _______

e. 10 Gigabit ___________ _______________

f. ______ (2.488) Gigabit Clear Channel

g. SONET __________

h. SDH STM ________

i. ________ OC-12

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j. _______ STM-4

k. SONET ______

l. SDH ________

m. 1Gigabit _____________

7. Optical-________________-Optical (O-_-O) regeneration on every channel.8. ______ channels at 10Gbps capacity per channel.9. __________________ capability at each DTN.10. Enhanced performance monitoring (PM) and troubleshooting capabilities11. Configurations include:

• Digital Terminal (DT).• ______________ (AD).• Digital Repeater (____).

12. Multi-Chassis Configuration

• ____________ Chassis• ____________ Chassis

13. Network Topologies

a. Point-to-Point _______________ Span

b. Point-to-Point _______________ Span

c. Linear __________________

d. ________________________

e. ________________________

Optical Line Amplifier capabilities

1. Amplifies the combined optical signal (______________)2. Extend the ______________________between the DTNs3. Optical Line Amplifiers are deployed where client access is

______________________________.

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System ArchitecturePage 1-36

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Page 2-1Hardware Overview

NOTES:

Hardware Overview

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Hardware OverviewPage 2-2

Slide-1 Hardware Overview Chapter Learning Objectives

Slide-2 DTN

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Hardware Overview

CHAPTER LEARNING OBJECTIVES

Upon successful completion of this chapter, the student should be able to:

• Describe the functions and features of the hardware modules for the DTC.

• Describe the functions and features of the hardware modules for the OTC.

DIGITAL TRANSPORT CHASSIS (DTC)

1. Functional description

a. Digital Transport Chassis (DTC)

b. Deployed as a Main Chassis or an Expansion Chassis

c. Functions as a:

• Digital Terminal (DT)• Add-Drop (AD)• Digital Repeater (DR)

d. 800Gbps bidirectional line side capacity

e. 400Gbps tributary add/drop capacity

f. Installed in a 23” rack or a 600mmx600mm European Telecommunication Standards Institute (ETSI) rack

g. Seven slot card cage

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Slide-3 DTC Components

Slide-4 Chassis

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COMPONENTS OF THE DTC

• Chassis• Rack Mounting Ears• Grounding Points• Power Entry Modules (PEM)• Input/Output (I/O) Panel• Timing and Alarm Panel (TAP)• Fan Trays• AIr Filter• Card Cage

CHASSIS

The DTC Chassis is:• ANSI certified • ETSI certified• Weight - 78lbs (empty) Fans removed

Door removed

Top Cover removed

2 person lift

• 2 DTCs can be installed in standard 7’ rack

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Slide-5 Rack Mount Ears

Slide-6 Rack Grounding

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RACK MOUNTING EARS

Each DTC includes front rack mounting ears as an integral part of the chassis. They are utilized to front mount the chassis in a 23” rack or 600mmx600mm ETSI rack. Separate mid-mount ears are provided to allow the chassis to mount 1”, 2”, 5”, and 6” forward from the front of the 23” rack.

GROUNDING POINTS

There are 4 grounding points

• Two on the rear of the chassis• One on each side of the chassis

Note: Although there are multiple grounding points, only one should be connected to achieve proper grounding of the DTC.

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Slide-7 PEM

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POWER ENTRY MODULES (PEM)

The DTC accommodates two Power Entry Modules

PEM A on the left front

PEM B on the right front

The PEMs supply redundant power feeds to the DTC

PEMs are configured for load sharing.

Each PEM has a 70 AMP breaker for over-current protection.

The PEMs have two status Light Emitting Diodes (LED)

a. Power Input

b. Power Fault.

The LEDs indicate whether the power levels are within specified limits.

Table 1: PEM Status LEDs

TECHNICAL SPECIFICATIONS

Each PEM is dual-lugged and shielded around the faceplate permitter.

Electrical • Power Consumption 50 W

• Circuit Breaker Rating 70 A

• Operating Temperature range Normal 5C to 40 C

Short Term -5C to 55c (134f)

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Slide-8 IO Panel

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INPUT OUTPUT (I/O) PANEL

The I/O panel contains the management and operations interfaces

• Two 10/100Mb auto-negotiating Data Communication Network (DCN) RJ-45 interfaces

• Two 10Mb Administrative Inter-LAN RJ-45 interfaces, labeled as AUX interface

• Chassis level alarm LEDs (Critical, Major, Minor, Power)• Bay level alarm LEDs (Critical, Major, Minor)• Four inter-chassis interconnect RJ-45 interfaces referred to as

Nodal Control and Timing • Lamp Test button• ACO button• ACO LED• Craft RS232 Modem port

Note: The DCN and AUX ports are not supported on an Expan-sion Chassis.

The I/O panel Bay level LEDs reflect the status of all chassis in a bay.

Table 2: I/O Panel Bay Level LEDs

The I/O panel Chassis level LEDs reflect the severities of the current out-standing alarms within that chassis.

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Slide-9 TAP

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Table 3: I/O Panel Chassis Level LEDs

TIMING ALARM PANEL (TAP)

• The TAP provides interfaces for external timing synchronization and environmental alarm contacts.

• The TAP provides Building Integrated Timing Supply (BITS) input and output timing interfaces.

Note: External timing synchronization is not supported at this time.

The TAP also houses 20 alarm input contact-sets. Sixteen alarm input contact sets are user configurable. The rest are reserved for Bay LED and ACO inputs from Expansion Chassis(s).The TAP houses 20 alarm output contact-sets. Each output alarm contact set consists of normally-closed, normally-open and common contacts. Ten output contacts are user configurable. The rest are reserved for office alarms and Bay alarms.

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Slide-10 Fan Tray

Slide-11 Air Filter

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FAN TRAY

• The DTC contains two removable fan trays - 11lbs each• Each fan tray consists of 3 individually controlled fans • The top fan tray is Fan Shelf A• The bottom fan tray is Fan Shelf B• Both fan trays are required for normal operations and are not

redundant• Each fan tray is marked with ‘This Side Up” to ensure proper

installationEach Fan Tray has two LEDs

• Power• Fault

Table 4: Fan Tray LEDs

AIR FILTER

A replacable air filter is located below the bottom fan tray to filter out dust particles at the air intake of the DTC. Air is filtered at 80% dust arrestance. Depending upon the operational environment, the air filters should be replaced at regular intervals, preferably once every 6 months.

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Slide-12 Card Cage

Slide-13 DTC Components

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CARD CAGE

The DTC contains a single card cage with seven slots that house up to eight modules.

DTC COMPONENTS

• Chassis• Rack Mount Ears• PEMs• IO Panel• TAP• Fan Tray• Air Filter• Card Cage

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Slide-14 DTC Modules

Slide-15 MCM-B

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DTC MODULES

• Management Control Module (MCM)• Tributary Optical Module (TOM)• Tributary Adapter Module (TAM)• Digital Line Module (DLM)• TAM Extender Module (TEM)• Bandwidth Multiplexer Module (BMM)

MANAGEMENT CONTROL MODULE (MCM-B)

The MCM-B, is a half height module that slides into the chassis in slot 7A or slot 7B. The MCM-B is the shelf controller of all the modules resident within the DTC.The functions are:

• In a multi-chassis configuration, the MCM-B in the Main Chassis controls all the chassis within the DTN (Node Controller)

• In an Expansion Chassis, the MCM-B performs shelf controller functions controlling only the modules resident within that chassis (Shelf Controller)

• Management gateway functions to the external DCN in the Main Chassis

• Contains the software, and the database for the DTN• Can be deployed in a non-redundant (single MCM) or redundant

(Active/Standby) configuration

Note: Only MCM-Bs in a Main Chassis will maintain the data-base. MCM-Bs housed in an Expansion Chassis will not contain a database.

The MCM-Bs in the Main Chassis and Expansion Chassis are interconnected through NCT ports located on the I/O Panel.

The MCM-B supports the local craft interfaces for local management access.

For high-availability, redundant MCM-Bs can be deployed in a DTC. One MCM-B actively performs the node/shelf control functions while the other MCM-B is in the standby mode. In a multi-chassis configuration, the interconnected redundant MCM-Bs provide the inter-chassis redundancy.

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Slide-16 MCM-B

Slide-17 MCM LEDs

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Note: In a Multi-Chassis configuration, the DCN and AUX ports

on the I/O panel of the Main Chassis are active. The DCN and AUX ports on the I/O panel of an Expansion Chassis are disabled.

The MCM has the circuit pack status LED indicators and Craft Ethernet/Serial port connectors on the front panel

The MCM-B parameters are:

• 466Mhz processor• 1G NVS• 512 SDRAM

The MCM-B can be deployed in the below configurations

• Single Chassis• Multi-Chassis• Non-redundant

• Single MCM• Redundant

• An MCM will be installed in both 7A and 7BThe MCM-B has four circuit pack level LEDs

• Power (PWR)• Node Controller (NC)• Active (ACT)• Fault (FLT)

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Slide-18 MCM Faceplate

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Note: On the ACT MCM in the Main Chassis, the PWR, NC and

ACT LEDs will be solid green. On the STBY MCM the PWR LED will be solid green and the ACT LED will be solid amber. On the ACT MCM in an Expansion Chassis, the PWR and ACT LEDs will be solid green. On the STBY MCM in an Expansion Chassis, the PWR LED will be green and the ACT LED will be amber.

Table 2-1: MCM Circuit Pack Level LEDs

The MCM has Craft Ethernet and Serial Ports for management purposes.

Table 2-2: MCM Craft Connectors

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Slide-19 Tributary Optical Modules

Slide-20 TOM-10G-x

TOM-10G-SR1TOM-10G-IR2TOM-10G-LR2 – 1550nmTOM-2.5G-SR1TOM-2.5G-IR1TOM-2.5G-IR2TOM-2.5G-LR2 – 1550nmTOM-2.5GMR-IR1TOM-1G-ZX – 1550nmTOM-1G-LXTOM-1G-SX – 850nm (multimode)

All TOMs have LC connectorsProvide client signal interface Client signals are fully transparentTOMs operate at 1310nm except where otherwise noted

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TRIBUTARY OPTICAL MODULES (TOMS)

All TOMs convert the client optical signals to and from a serial electrical signal. All TOMs have LC connectors. The TOMs supported are:

• TOM-10G-SR1• TOM-10G-IR2• TOM-10G-LR2A - 1550nm• TOM-2.5G-SR1• TOM-2.5G-IR1• TOM-2.5G-LR2 - 1550nm• TOM-2.5GMR-IR1• TOM-1G-ZX - 1550nm• TOM-1G-LX• TOM-1G-SX - 850nm

TOM-10G-X

Has signal support for:

• OC-192• STM64• 10G Clear channel• 10G LAN• 10G WAN

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Slide-21 TOM-2.5G-x

Slide-22 TOM-2.5GMR-x

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TOM-2.5G-X

Has signal support for:

• OC-48• STM16• 2.488G Clear Channel

TOM-2.5GMR-X

Has signal support for:

• OC-48• STM16• 2.488G Clear Channel• OC-12• STM4• OC-3• STM1

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Slide-23 TOM-1G-x

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TOM-1G-X

Has signal support for:

• 1G Ethernet

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Slide-24 Tributary Adapter Module

Slide-25 TAM-4-2.5G

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TRIBUTARY ADAPTER MODULES (TAMS)

There are four types of TAMs

• TAM-4-2.5G• TAM-4-1G• TAM-8-1G• TAM-2-10G

All TAMs:

• Create and terminate the Trib DTF, and house TOMs

TAM-4-2.5G

The 2.5G Tributary Adapter Module, referred to as the TAM-4-2.5G, maps the client optical signals into digital signals for subsequent transmission through the DLM.

• Installed in any of the sub-slots in the DLM or TEM• Each TAM-4-2.5G has four sub-slots for Tributary Optical

Modules 2.5G (TOM-2.5G)• Maps client signals into electrical signals• Maximum capacity of 10Gbps per TAM-4-2.5G 2.5Gbps per TOM

Four TOM-2.5Gs per TAM-4-2.5G

The TAM-4-2.5G has three circuit pack level LEDs

a. Power (PWR)

b. Active (ACT)

c. Fault (FLT)

Table 3: TAM-4-2.5G Circuit Pack Level LEDs

In addition to TAM circuit pack status indicators, it houses the TOM-2.5G circuit pack LEDs:

Table 4: TOM-2.5G Port Level LEDs

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Slide-26 TAM-4-1G

Any sub-slot any DLM/TEM4 portsSupports

TOM-1G-LXTOM-1G-SXTOM-1G-ZX

Circuit pack LEDsTOM port LEDs

-- Only the faceplate labeling differentiate the TAM-4-1G from the TAM-4-2.5G.

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TAM-4-1G

The Tributary Adapter Module 1G, referred to as TAM-4-1G, maps the customer client ethernet signals into internal electrical signals for subsequent transmission through the DLM. The TAM-4-1G circuit packs can be arbitrarily equipped in any of the sub-slots located on the DLM or TEM. TAM-4-1Gs provide further sub-slots to enable the insertion of TOM’s.

TAM-4-1G supports 1GbE client interfaces. It does not support 1GbE multiplexing, rather each 1GbE client signal is mapped into a 2.5G sub-channel.

The TAM-4-1G has 3 LEDs to indicate the circuit pack status.

In addition to TAM circuit pack status indicators, the TAM-4-1G houses the TOM-1G circuit pack LEDs: ACT (Active), FLT (Fault) and LOS, one set for each TOM. The significance of an illuminated LED is described in the table below.

Table 5: TAM-4-1G status LED indicators

LED Indicator Color Meaning

PWR (Power)

Green Indicates the presence (lit) or absence (dimmed) of power supply to the TAM-4-1G circuit pack

ACT (Active)

Green / Yellow

Indicates the TAM-4-1G circuit pack status: Active or Standby

FLT (Fault) Red Indicates the presence (lit) or absence (dimmed) of an alarm on the TAM-4-1G circuit pack: Critical, Major or Minor

Table 6: TOM-1G-LX status indicators

LED Color Description

ACT (Active)

Green / Yellow

Indicates the TOM status: Active, Standby or Not provisioned

FLT (Fault) Red Indicates the presence (lit) or absence (dimmed) of a fault on the TOM

LOS Red Indicates the detection of LOS signal on the TOM

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Slide-27 TAM-8-1G

Any sub-slot any DLM/TEM8 ports

4 independent port pairs1a, 1b2a, 2b3a, 3b4a, 4b

SupportsTOM-1G-LXTOM-1G-SXTOM-1G-ZX

Circuit pack LEDsTOM port LEDs

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TRIBUTARY ADAPTER MODULE 8-1G (TAM-8-1G)

The Tributary Adapter Module-8-1G, referred to as TAM-8-1G, maps the customer client ethernet signals into sub-SNC internal electrical signals for subsequent transmission through the DLM. The TAM-8-1G circuit packs can be arbitrarily equipped in any of the sub-slots located on the DLM or TEM. TAM-8-1Gs provide sub-slots equipped in 4 logical port pairs to enable the insertion of TOM’s.

TAM-8-1G supports 1GbE client interfaces. It does not support 1GbE multiplexing, rather each 1GbE client sub-SNC signal pair (1a and 1b for example) is mapped into a channelized 2.5G sub-channel.

The TAM-8-1G has 3 LEDs to indicate the circuit pack status.

In addition to TAM circuit pack status indicators, the TAM-8-1G houses the TOM-1G circuit pack LEDs: ACT (Active), FLT (Fault) and LOS, one set for each TOM. The significance of an illuminated LED is described in the table below.

Table 7: TAM-4-1G status LED indicators

LED Indicator Color Meaning

PWR (Power)

Green Indicates the presence (lit) or absence (dimmed) of power supply to the TAM-4-1G circuit pack

ACT (Active)

Green / Yellow

Indicates the TAM-4-1G circuit pack status: Active or Standby

FLT (Fault) Red Indicates the presence (lit) or absence (dimmed) of an alarm on the TAM-4-1G circuit pack: Critical, Major or Minor

Table 8: TOM-1G-LX status indicators

LED Color Description

ACT (Active)

Green / Yellow

Indicates the TOM status: Active, Standby or Not provisioned

FLT (Fault) Red Indicates the presence (lit) or absence (dimmed) of a fault on the TOM

LOS Red Indicates the detection of LOS signal on the TOM

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Slide-28 TAM-2-10G

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TRIBUTARY ADAPTER MODULE 10G (TAM-2-10G)

a. Installed in any of the sub-slots in the DLM or TEM

b. Each TAM-2-10G has two sub-slots for Tributary Optical Modules 10G (TOM-10G)

c. FRU

d. Maps client signals into electrical signals

e. Maximum capacity of 20Gbps per TAM-2-10G

• 10Gbps per TOM• Two TOM-10Gs per TAM-2-10G

The TAM-2-10G has three circuit pack level LEDs

a. Power (PWR)

b. Active (ACT)

c. Fault (FLT)

Table 9: TAM-2-10G Circuit Pack Level LEDs

The TAM-2-10G has three port level indicators

a. Active (ACT)

b. Fault (FLT)

c. Loss of Signal (LOS)

Table 10: TAM-2-10G Port Level LEDs

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Slide-29 DLM

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DIGITAL LINE MODULE (DLM)

The Digital Line Module (DLM-n-C1-A), performs the following functions:

• Provides add/drop or switching of 2.5Gb/s, 10Gb/s, or 1Gb/s signals between TAMs, wavelengths on the OCG uplink, and peered DLMs, and TEMs across the backplane

• Contains five subslots in order to house TAMs• TAM-2-10G• TAM-4-2.5G• TAM-4-1G• TAM-8-1G• Maps the client signals from the TAMs into the Line Digital

Transport Frame (Line DTF) that are transmitted and received from the OCG OUT and OCG IN links on each DLM

• Codes and decodes the Forward Error Correction (FEC) signal for each wavelength of the OCG transmitted through the Tx and Rx Photonic Integrated Circuits (PICs)

• Multiplexes the 10 individual wavelengths into an OCG through the Tx PIC

• De-multiplexes the OCG into 10 individual wavelengths through the RX PIC

• Optically connects to the appropriate BMM for transmission over the facility line side

The Digital Line Module (DLM-n-Cn-x), performs the following functions:

• Contains mechanical modifications to accommodate future double-height TAM

• Provides add/drop or switching of 2.5Gb/s, 10Gb/s, or 1Gb/s signals between TAMs, wavelengths on the OCG uplink, and peered DLMs, and TEMs across the backplane

• Contains subslots in order to house TAMs Double height TAM (future)

TAM-2-10G

TAM-4-2.5G

TAM-4-1G

TAM-8-1G

• Maps the client signals from the TAMs into the Digital Transport Frame (DTF) that are transmitted and received from the OCG OUT and OCG IN links on each DLM

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Slide-30 DLM Versions

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• Codes and decodes the Forward Error Correction (FEC) signal for each wavelength of the OCG transmitted through the Tx and Rx Photonic Integrated Circuits (PICs)

• Multiplexes the 10 individual wavelengths into an OCG through the Tx PIC

• De-multiplexes the OCG into 10 individual wavelengths through the RX PIC

• Optically connects to the appropriate BMM for transmission over the facility line side

• Wider dispersion in order to increase distance between regeneration

DLM VERSIONS

Any version of the DLM can be equipped in slots 3 through 6.

Note: DLM versions must be mirrored on opposite ends of the digital link.

There are sixteen versions of the DLM supporting eight OCGs.

Table 11: DLM product details

Product Number Product Description

DLM-1-C1-A DLM, OCG 1, C-Band

DLM-1-C1-B DLM, OCG 1, C-Band

DLM-1-C2-A DLM, OCG 1, C-Band

DLM-2-C2-A DLM, OCG 2, C-Band

DLM-3-C1-A DLM, OCG 3, C-Band

DLM-3-C1-B DLM, OCG 3, C-Band

DLM-3-C2-A DLM, OCG 3, C-Band

DLM-4-C2-A DLM, OCG 4, C-Band

DLM-5-C1-A DLM, OCG 5, C-Band

DLM-5-C1-B DLM, OCG 5, C-Band

DLM-5-C2-A DLM, OCG 5, C-Band

DLM-6-C2-A DLM, OCG 6, C-Band

DLM-7-C1-A DLM, OCG 7, C-Band

DLM-7-C1-B DLM, OCG 7, C-Band

DLM-7-C2-A DLM, OCG 7, C-Band

DLM-8-C2-A DLM, OCG 8, C-Band

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Slide-31 DLM Connectors

Slide-32 DLM LEDs

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The DLM has two fiber connectors. The fiber connections are SC connectors.

a. The DLM has Line IN and Line OUT connectors to the BMM

The DLM has three circuit pack level LEDs:

a. Power (PWR)

b. Active (ACT)

c. Fault (FLT)

Table 12: DLM Circuit Pack LEDs

The DLM has two port level LEDs:

a. Active (ACT)

b. LOS (Loss of Signal)

Table 13: DLM Port LEDs

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Optical Specifications for the DLM

Table 14: DLM Optical Specifications

Type Parameter Specification

DLM-1 Frequency range OCG1 1548.915nm - 1563.455nm

Output power level -13.8dBm to -12.5dBm

DLM-2 Frequency range OCG2 1548.515nm - 1563.047nm

Output power level -13.8dBm to -12.5dBm

DLM-3 Frequency range OCG3 1548.115nm - 1562.640nm

Output power level -13.8dBm to -12.5dBm

DLM-4 Frequency range OCG4 1547.715nm - 1562.233nm

Output power level -13.8dBm to -12.5dBm

DLM-5 Frequency range OCG5 1531.507nm - 1545.720nm

Output power level -13.8dBm to -12.5dBm

DLM-6 Frequency range OCG6 1531.116nm - 1545.322nm

Output power level -13.8dBm to -12.5dBm

DLM-7 Frequency range OCG7 1530.334nm - 1544.526nm

Output power level -13.8dBm to -12.5dBm

DLM-8 Frequency range OCG8 1530.725nm - 1544.924nm

Output power level -13.8dBm to -12.5dBm

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Slide-33 TEM

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TAM EXTENDER MODULE (TEM)

The TEM provides additional TAM slots for a DLM so the bandwidth of a DLM may be fully utilized. The application of a TEM is more visible for lower density TAM-4-2.5G and TAM-4-1G. A DLM populated with either TAM will not be able to utilize the complete OCG bandwidth of 100Gbs. Each TEM provides an additional five subslots for TAMs which will enable:

• Up to 100% add/drop of 2.5G traffic using TAM-4-2.5G per OCG• Up to 50% add/drop of 1GbE traffic using TAM-4-1G per OCG

Each TEM provides the following:

• Add/drop or cross-connect of 2.5Gbs, 10Gbs, or 1Gbs signals between TAMs, and corresponding DLMs across the backplane

• Contains subslots in order to house TAMs Double height TAM (future)

TAM-2-10G

TAM-4-2.5G

TAM-4-1G

TAM-8-1G

A TEM can be equipped in slots 3 through 6.

The TEM is designed to work with DLMs in corresponding slots. Valid slot combinations are listed in the table below.

Table 15: TEM, DLM valid slot combinations

DLM slot Valid TEM slot DLM slot Valid TEM slot

3 4, 5, 6a

a. TEM slots in bold are indirect slot configurations where a cross-connect takes two hops between DLM and TEM.

5 3, 4, 6

4 3, 5, 6 6 3, 4, 5

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Slide-34 TEM LEDs

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Circuit Pack Level LEDs

The TEM has 3 LEDs to indicate the circuit pack status. The significance of an illuminated LED is described in the table below.

Table 16: TEM status LED indicators

LED Indicator Color Meaning

PWR (Power) Green Indicates the presence (lit) or absence (dimmed) of power supply to the TEM

ACT (Active) Green / Amber Indicates the circuit pack status: Solid green (Active), blinking amber (In maintenance state), and dimmed (Locked state)

FLT (Fault) Red Indicates the presence (lit) or absence (dimmed) of an alarm on the circuit pack: Critical, Major or Minor

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Slide-35 BMM

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BAND MUX MODULE (BMM)

There are 9 different BMM types that provide Optical Carrier Group (OCG) multiplexing/de-multiplexing, EDFA gain, and with/without mid-stage access. Which type of BMM will be deployed is dependent on the span loss on the transmit (TX) side.

BMM FUNCTIONAL DESCRIPTION

There is a set of BMMs that supports four OCGs in the C band with L band expansion capable.

There is another set of BMMs that supports four OCGs in the C band but with no L band expansion. These are currently at the -A revision but have the same functions as the -B version of the BMM-4-Cn.

A BMM performs the following functions:

Optically multiplexes up to 8 10x10Gb DWDM channels from the DLMs, known as Optical Carrier Groups (OCGs), onto the line side facility

OCGs 1-8can be optically multiplexed by the BMM

Optically de-multiplexes the OCGs from the line side facility into 10x10Gb DWDM channels, and passes them to local DLMs

OCGs 1-8 can be optically de-multiplexed by the BMM

Provides optical insertion and extraction of the 1510nm Optical Supervisory Channel by using a 1510nm optical filter

Optically amplifies the multiplexed transmitted and received OCG signals by using either an optical booster or a pre-amplifier

Provides a C/L-band splitter to support an in-service expansion of the system to enable optical transmission in the L-band (in some versions)

Provides the following Optical Spectrum Analyzer (OSA) ports for test purposes:

OSA port for the aggregate line input

OSA port for the receive EDFA output

OSA port for the aggregate line output

Provides sub-slot access for the OWM (future provision)

Accommodates mid-stage access Dispersion Compensation Fiber (DCF) (in some versions)

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Slide-36 BMM Versions

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Table 17: BMM Versions

Product Number Product Description

BMM-4-C1-B BMM, C/L band, supports span losses from 0 to 20 dB, with VOA, without mid-stage access, supports OCGs 1,3,5,and 7

BMM-4-CX1-A BMM, C band, supports span losses from 0 to 21 dB, with VOA, without mid-stage access, supports OCGs 1,3,5,and 7

BMM-8-CXH1-A BMM, high power, C band, supports span losses from 0 to 20 dB, with VOA, without mid-stage access, sup-ports OCGs 1-8

BMM-4-C2-MS-B BMM, C/L band, supports span losses from 19 dB to 26 dB, with mid-stage access, supports OCGs 1,3,5,and 7

BMM-4-CX2-MS-A BMM, C band, supports span losses from 20 dB to 27.5 dB, with mid-stage access, supports OCGs 1,3,5,and 7

BMM-8-CXH2-MS-A BMM, high power, C band, supports span losses from 19 dB to 26.5 dB, with mid-stage access, supports OCGs 1-8

BMM-4-C3-MS-B BMM, C/L band, supports span losses from 25 dB to 34 dB, with mid-stage access, supports OCGs 1,3,5,and 7

BMM-4-CX3-MS-A BMM, C band, supports span losses from 26 dB to 34 dB, with mid-stage access, supports OCGs 1,3,5,and 7

BMM-8-CXH3-MS-A BMM, high power, C band, supports span losses from 25 dB to 34 dB, with mid-stage access, supports OCGs 1-8

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Slide-37 BMM LEDs

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:The gain ranges for the different BMM types are listed below

BMM LEDS

The BMM has three circuit pack level LEDs to indicate the circuit pack status

• Power (PWR)• Active (ACT)• Fault (FLT)

Table 18: BMM Circuit Pack Level LEDs

The BMM has two port level LEDs to indicate the status of the combined optical signal

• Active (ACT)• Loss of Signal (LOS)

Table 19: BMM Line Connector LEDs

BMM Type BMM Span Loss Range (dB)

C1 0-20

CX1 0-21

CXH1 0-20

C2 19-26

CX2 20-27.5

CXH2 19-26.5

C3 25-34

CX3 26-34

CXH3 25-34

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Slide-38 BMM Connectors

Slide-39 BMM OCG Connectors

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BMM CONNECTORS

The BMM has many fiber connectors. All the fiber connections are SC connectors.

• Line connectors• Optical Spectrum Analyzer (OSA) monitor connector for line input

and output• OSA monitor port for facility output• L-Band connectors (not present on all BMMs)• Dispersion Compensation Module (DCM) connectors (not present

on all BMMs)• OCG 1 connectors• OCG 2 connectors• OCG 3 connectors• OCG 4 connectors• OCG 5 connectors• OCG 6 connectors• OCG 7 connectors• OCG 8 connectors

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Slide-40 BMM Optical Specifications

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BMM OPTICAL SPECIFICATIONS

40 Channel BMM (Cn and CXn versions)• Line Side Optics Wavelength spacing

• 100GHZ Wavelength frequency range

• 1530.725-1563.455nm ITU grid80 Channel BMM (Cn and CXn versions)

• Line Side Optics Wavelength spacing

• 50GHZ Wavelength frequency range

• 1530.334-1563.455nm ITU grid

OSC (all versions)• Optical Supervisory Channel Wavelength

• 1510 nm Format

• OC-3 Throughput

• 100Mbps.

Blank Circuit PacksWhenever a circuit pack is removed, the blank space must be occupied by the corresponding blank circuit pack. Blank circuit packs serve three important functions:

Prevents exposure to hazardous voltage and currents inside the chassis

Contains any electromagnetic interference (EMI) that might dam-age other equipment

Directs the flow of cooling air through the chassis.

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Figure 1-41. DTC and Components

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DTC AND COMPONENTS

• DTC• Modules MCM

TOM

TAM

DLM

TEM

BMM

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Slide-42 Optical Transport Chassis

Slide-43 OTC Components

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OPTICAL TRANSPORT CHASSIS

• Functional Description Optical Transport Chassis (OTC)

Bi-directional in-line amplifier used to extend the optical reach of the DTN

Deployed where client access is not anticipated

Note: The OTC does not support multi-chassis configuration(s).

OTC COMPONENTS

• Rack Mount• Grounding• PEM• IAP• Fan Tray• Air Filter• Card Cage

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Slide-44 OTC Chassis

Slide-45 Rack Mount

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OTC CHASSIS

• Weight ~ 50lbs - empty Front Cover removed

Fans removed

• ANSI compliant• ETSI compliant

Rack MountEach OTC includes front rack mounting ears as an integral part of the chassis. They are utilized to front mount the chassis in a 23” rack or 600mmx600mm ETSI rack. Separate mid-mount ears are provided to allow the chassis to mount 1”, 2”, 5”, and 6” forward from the front of the 23” rack.

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Slide-46 OTC Grounding

Slide-47 OTC PEM

Four grounding pointsRight rearLeft rearEach Side

Although there are multiple grounding points, only one should be connected to achieve proper grounding of the OTC

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GROUNDING POINTS

There are 4 grounding points

• Two on the rear of the chassis• One on each side of the chassis

Note: Although there are multiple grounding points, only one should be connected to achieve proper grounding of the OTC.

POWER ENTRY MODULE (PEM)

• Each OTC is equipped with 2 PEMs• PEM A is located on the front left• PEM B is located on the front right• PEMs supply redundant power to the OTC

Note: PEMs require a third party PDU with 10 AMP fuses per PEM.

• PEMs are configured for load sharingTechnical SpecificationsEach PEM is dual-lugged and shielded around the faceplate permitter.Electrical

• Power Consumption 20 W

• Input voltage range -40 to -60 VDC

• Operating Temperature Range Normal 5C to 40 C

Short Term -5C to 55c

PEM LEDS

The PEM has two status LEDs• Power Input• Power Fault

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Figure 1-48. I/O Alarm Panel Face Plate

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I/O Alarm Panel (IAP)

The I/O Alarm panel contains the management and operations interfaces plus environmental alarm input/output contacts

• Two 10/100Mb auto-negotiating Data Communication Network (DCN) RJ-45 interfaces

• Two 10Mb Administrative Inter-LAN RJ-45 interfaces, labeled as AUX interface.

• Chassis level alarm LEDs (Critical, Major, Minor, Power)• Bay level alarm LEDs (Critical, Major, Minor)• Four inter-chassis interconnect RJ-45 interfaces referred to as Nodal

Control and Timing • Lamp Test button• ACO button• ACO LED• Craft RS232 Modem port

Note: The OTC does not support multi-chassis configuration(s). The Nodal Control and Timing RJ-45 ports are disabled on all OTCs.

The I/O Alarm panel Chassis level LEDs reflect the severities of the cur-rent outstanding alarms within the chassis.

ALARM INPUT CONTACTS

There are 20 alarm input contacts. One Alarm contact is pre-defined and the nineteen other are user configurable alarm contacts. The user configurable alarm contacts are useful for generation of customized alarms which can be triggered remotely through the network management system.

ALARM OUTPUT CONTACTS

There are 20 alarm output contacts. Ten alarm contacts are pre-defined in the system and the ten other contacts user configurable. The ten user configurable contacts can be used to monitor the environmental alarms.

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Slide-49 Fan Trays

Slide-50 Air Filter

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Fan TrayThe OTC contains two removable fan trays, one on the left and one on the right. Each fan tray consists of an individually controlled fan.• The left fan tray is Fan Shelf A• The right fan tray is Fan Shelf B.• Both fan trays are required for normal operations and are not

redundant.

Each Fan Tray has two LEDs

a. Power

b. Fault

Air FilterAn air filter is located beside the right fan tray (Fan B) to filter out dust par-ticles at the air intake of the OTC. Air is filtered at 80% dust arrestance. Depending upon the operational environment, the air filter should be replaced at regular intervals, preferably once every 6 months.

Card CageThe OTC contains a single card cage that has three slots.

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Figure 1-51. OTC and Components

Slide-52 OTC Modules

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OTC Components

Rack Mounting Ears

IAP

PEMs

Fan Trays

Air Filter

Card Cage

OTC Modules

1. Optical Management Module (OMM)2. Optical Amplifier Module (OAM)

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Slide-53 OMM

Slide-54 OMM LEDs

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Optical Management Module (OMM)a. Installed in slot 1A or 1B

b. Half height module

c. Shelf controller for all modules in the OTC

d. Each OTC must have one OMM

e. Supports redundant and non-redundant configurations

f. Contains the network element software and database

g. OMM supports the local craft interfaces for local management access

h. May be deployed in a redundant or non-redundant configuration

The OMM has four circuit pack level LEDs

a. Power (PWR)

b. Node Controller (NC)

c. Active (ACT)

d. Fault (FLT)

Note: The OTC does not support multi-chassis configuration(s). Thus, the Node Controller LED should be green (lit).

The OMM has Craft Ethernet and Craft Serial Ports for management purposes.

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Slide-55 OMM Faceplate

Slide-56 OAM

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OMM Faceplate

Ejector

RS232 Serial port

Ethernet port

LEDs

Optical Amplifier Module (OAM)

There are 9 different OAM types providing different EDFA gain and with/without mid-stage access. Which OAM will be deployed is dependent on the span loss on the transmit (TX) side.

OAM Functional Description

The OAM can be equipped in slot 2 and/or 3 of the OTC.

Note: Two OAMs are required in an OTC to perform bi-direc-tional optical amplification.

There is a set of OAMs that amplifies in the C band with L band expansion capable.

There is another set of OAMs that amplifies in the C band but with no L band expansion. These are currently at the -A revision but have the same functions as the -B version of the OAM-Cn.

An OAM performs the following functions:

Provides optical insertion and extraction of the 1510nm Optical Supervisory Channel by using a 1510nm optical filter

Optically amplifies the multiplexed transmitted and received signals by using either an optical booster or a pre-amplifier

Provides a C/L-band splitter to support an in-service expansion of the system to enable optical transmission in the L-band (in some versions)

Provides Optical Spectrum Analyzer (OSA) ports for test purposes:

Provides sub-slot access for the OWM (future provision)

Accommodates mid-stage access Dispersion Compensation Fiber (DCF) (in some versions)

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Slide-57 OAM Versions

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The gain ranges for the different OAM types are listed below:

OAM Type OAM Module Gain Range (dB)

C1 0-20

C2 19-26

CX2, CXH2 19-26.5

C3 25-30

CX3, CXH3 25-30.5

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Slide-58 OAM LEDs

Slide-59 OAM Port LEDs

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Circuit Pack Level LEDsThe OAM has three LEDs to indicate the circuit pack status.

PWR

ACT

FLT

Port IndicatorsThere are two LEDs:

ACTIVE and LOS to indicate the line port status

LOS to indicate the OSC port status

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Slide-60 OAM Connectors

Slide-61 Optical Line Amplifier and Components

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OAM Connectors

Line

DCM (some versions)

-L-Band (Cn versions only)

OSC

OSA monitor ports

Optical Line Amplifier and Components

Rack Mounting Ears

PEMs

IAP

Fan Trays

Air filter

OMM

OAM

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Slide-62 Dispersion Management Chassis

Slide-63 Dispersion Compensation Modules

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Dispersion Management Chassis (DMC)

FUNCTIONAL DESCRIPTION

The DMC comprises of a chassis and Dispersion Compensation Modules (DCM)• It can be installed in a 23” rack as front mount and 1”, 2”, 5” and 6”

mid-mount or 600mmx600mm ETSI rack.• It accommodates up to 2 DCMs

Dispersion Compensation Module (DCM)

The Dispersion Compensation Module, referred to as DCM, is a pluggable module that slides into the Dispersion Management Chassis.• It houses Dispersion Compensation Fiber.• Supports 19 types of negative DCMs, ranging from 100 ps/nm to

1900 ps/nm in 100 ps/nm increments• Supports three types of positive DCMs, ranging from 100 ps/nm to

300 ps/nm.

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Slide-64 DTC Review

Slide-65 OTC Review

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DTC Review

DTC HARDWARE

Rack Mounting Ears

PEMs

I/O panel

Fan Trays

Air Filter

Card cage

DTC MODULES

MCM

TOM

TAM

DLM

TEM

BMM

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Chapter Review

DTN CHASSIS

1. Functional description

a. Digital Transport Chassis (DTC)

b. Deployed as a _____________ Chassis or an __________________ chassis

c. Functions as a:

• Digital ____________(___)• __________________(___)• Digital ________________(DR)

d. ____________ bidirectional line side capacity

e. _________________________ drop capacity

f. Installed in a 23” rack or a 600mmx600mm European Telecommunication Standards Institute (ETSI) rack

g. _____________slot card cage

COMPONENTS OF THE DTC

1. Rack Mounting Ears

2. _____________ grounding points3. Two ____________________________(___)

4. Input Output (I/O) PanelThe I/O panel contains the ____________________________and operations interfaces

• _______ 10/100Mb auto-negotiating Data Communication Network (DCN) RJ-45 interfaces• Two 10Mb Administrative Inter-LAN RJ-45 interfaces, labeled as ________ interface. • Chassis level alarm LEDs (_____________________________________________)• Bay level alarm LEDs (Critical, Major, Minor)• Four inter-chassis interconnect RJ-45 interfaces referred to as Nodal Control and Timing • Lamp Test button• ACO button• ACO LED• Craft RS232 Modem port

5. Timing Alarm Panel (TAP)• The TAP provides interfaces for __________________________synchronization and

__________________________________________ alarm contacts.• The TAP provides ___________________________________ timing interfaces.• ___________________________________ is not supported in Release 1.0.LT

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6. Fan Tray • The DTC contains ____________ removable fan trays. • Each fan tray consists of ________________ individually controlled

fans. • The top fan tray is Fan Shelf A• The bottom tray is Fan Shelf B.• Both fan trays are ______________________for normal operations

and are not redundant.

Each Fan Tray has two LEDs

a. Power

b. _________________________

7. Air Filter

8. Card CageThe DTC contains a single card cage that has ______________________slots.

MANAGEMENT CONTROL MODULE (MCM)

a. Installed in slot ________________________________________

b. Half height module

c. Field Replaceable Unit (FRU)

d. Shelf controller for all modules in the DTC

e. Each DTC __________________________________________ MCM

f. Contains the _________________________ and ___________________

g. MCM supports the local craft interfaces for local management access.

BAND MULTIPLEXING MODULE (BMM)

a. Installed in slot ______________________________

b. FRU

c. Optically multiplexes the 10x10Gb DWDM channels, known as __________________________________(_____), onto the line side facility

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d. Optically _________________________ the ____________into 10x10Gb DWDM channels.

e. Provides optical insertion and extraction of the 1510nm ________________________________________

f. Provides optical access points for power monitors or optical spectrum analyzers.

g. Accommodates mid-stage access_________________________________ in 9 versions of BMM

h. Provides sub-slot access for the Order Wire Module (OWM) circuit pack

i. There are _____ different BMM types providing different ______ gain and with/without _________________________________________ (for DCM)

DIGITAL LINE MODULE (DLM)

a. Up to _____________________DLMs can be in one DTC

b. Installed in slot _______________________and or _____________

c. FRU

d. Provides _____________ or ______________________ of client signals

e. Slots for up to _________Tributary Adapter Modules (TAM) or TAM blanks

f. Codes and Decodes the ______________________________________ for each lambda of the OCG

g. Maps and multiplexes the client signals from the TAM into the ______________________________________

h. Optically connects to the __________for transmitting the OCG on the facility line side

i. There are _____________versions of DLMs

TRIBUTARY ADAPTER MODULE 10G (TAM-10G)

a. Installed in any of the sub-slots in the DLM/TEM

b. Each TAM has __________sub-slots for TOM)-10G

c. FRU

d. Maps client signals into __________________signals

e. Maximum capacity of _______________________

• _______________ per TOM-10G• _____________ TOMs per TAM

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TAM-4-2.5G

a. Installed in any of the sub-slots in the DLM/_____

b. Each TAM has __________sub-slots for TOM-2.5G

c. FRU

d. Maximum capacity of _______________________

• _______________ per TOM• _____________ TOMs per TAM

TAM-4-1G

a. Installed in any of the sub-slots in the _____/______

b. Each TAM has __________sub-slots for TOM-1G-LX

c. FRU

d. Maximum capacity of _______________________

• _______________ per TOM• _____________ TOMs per TAM

TOM-10G

a. List two versions of the TOM-10G

• ________________• ________________

b. Hot-pluggable into any TAM_______ sub-slot

c. _____________ connectors

d. Converts client signals to and from a _________________________ signal

e. FRU

The TOM-10G tributary interface supports

a. SONET OC-192

b. ______________________________

c. 10G _________________ ___________________

d. 10GbE LAN

e. ____________________________________

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TOM-2.5G

a. List two versions of the TOM-2.5G

• ________________• ________________

b. Hot-pluggable into any TAM_______ sub-slot

c. _____________ connectors

d. Converts client signals to and from a _________________________ signal

e. FRU

The TOM-2.5G tributary interface supports

a. SONET OC-______

b. ______________________________

TOM-1G-X

a. Hot-pluggable into any TAM_______ sub-slot

b. _____________ connectors

c. Converts client signals to and from a _________________________ signal

d. FRU

The TOM-1G-x tributary interface supports

a. ______

OPTICAL TRANSPORT CHASSIS

1. Functional Description

a. Optical Transport Chassis (OTC)

b. Bidirectional in-line amplifier used to _______________________________of the DTN

c. Deployed where client access is _________________________________

d. Installed in a 23” rack or a 600mmx600mm European Telecommunication Standards Institute (ETSI) rack

Components of the OTC

1. Rack Mounting Ears2. __________ grounding points

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3. Two ____________________________(___)4. I/O Alarm Panel

The I/O Alarm panel contains the ________________________ and operations interfaces and _______________________________ alarm input and output contacts ________ 10/100Mb auto-negotiating Data Communication

Network (DCN) RJ-45 interfaces

Two 10Mb Administrative Inter-LAN RJ-45 interfaces, labeled as _____ interface.

Chassis level alarm LEDs (Critical, Major, Minor, Power)

Bay level alarm LEDs (Critical, Major, Minor)

_________ inter-chassis interconnect RJ-45 interfaces referred to as Nodal Control and Timing

Lamp Test button

ACO button

ACO LED

Craft RS232 Modem port

5. Fan TrayThe OTC contains ______ removable fan trays, one on the left and one on the right. Each fan tray consists of an __________________________________ controlled fan.

The __________________________ fan tray is Fan Shelf A

The ______________________________________ tray is Fan Shelf B.

Both fan trays are _______________________ for normal operations and are not redundant.

Each Fan Tray has two LEDs

a. Power

b. Fault

6. Air Filter

7. Card CageThe OTC contains a single card cage that has three slots.

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OPTICAL MANAGEMENT MODULE (OMM)

a. Installed in slot _____or _____

b. Half height module

c. Shelf ________________________________ for all modules in the OTC

d. Each OTC _______________________________ one OMM

e. Contains the ____________________________ and database

f. OMM supports the local craft interfaces for local management access.

OPTICAL AMPLIFIER MODULE (OAM)

a. Performs ____________________ in-line optical amplification of the incoming signal

b. Provides optical insertion and extraction of the 1510nm Optical Service Channel using a 1510nm optical filter

c. Optically __________________ the multiplexed transmitted and received OCG signals by using either an optical booster or a pre-amplifier

d. Provides a C/L-band splitter to enable an in-service expansion of the system to enable optical transmission in the L-band

e. Provides optical access points for power monitors or optical spectrum analyzers.

f. Accommodates ____________________________ Dispersion Compensation Fiber (DCF) in 6 versions of OAM

g. Provides sub-slot access for the Order Wire Module (OWM) circuit pack

h. ______ OAMs are required in a OTC to perform optical amplification in both directions.

DISPERSION MANAGEMENT CHASSIS (DMC)

FUNCTIONAL DESCRIPTION

The DMC comprises of a chassis and _______________________________________• It can be installed in a 23” rack as front mount and 1”, 2”, 5” and 6” mid-mount or 600mmx600mm ETSI

rack.• It accommodates up to _____ DCMs

DISPERSION COMPENSATION MODULE (DCM)

The Dispersion Compensation Module, referred to as DCM, is a pluggable module that slides into the Dispersion Management Chassis.

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• It houses Dispersion Compensation Fiber.• Supports ________ types of negative DCMs, ranging from 100 ps/nm

to 1900 ps/nm in 100 ps/nm increments• Supports ________ types of positive DCMs, ranging from 100 ps/nm

to 300 ps/nm.

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Theory Of Operations

CHAPTER LEARNING OBJECTIVES

Upon successful completion of this chapter, the student should be able to:

• Describe the power feeds for the Infinera DTN• Describe the vertical cooling method used in the Infinera DTN• Describe the functions of the control plane• List the components of the control plane for the DTC and the OTC• List the components of the data plane for the DTC.• Describe the system architectures for the DTC and the OTC

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Slide-105 Power and Cooling

Slide-106 Control Plane Network Level

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Power -48V dual feeds

Automated power shutdown for under voltage condition

The DTN will attempt an automatic restart when voltage goes above -40V

The DTN breakers will trip when the applied power exceeds -72V or 70A requiring a manual reset of the breakers

Cooling

The DTN implements a vertical push pull cooling method

Control Plane

The Control Plane is a logical partition of the DTN system at both the network and node level. At a very broad level, the control plane provides:

• The ability to locally or remotely provision (configure) the network element in accordance with a specific customer application

• Performance and fault monitoring, the ability to accumulate performance statistics, and the ability to locally or remotely access the collected information

Control Plane Network Level

The Optical Supervisory Channel (OSC) provides inter-node connectivity within the network. The OSC occupies a dedicated OC3 1510NM wavelength for each span between network elements. Each network element, consisting of any combination of DTCs or an OTC is required to terminate the OSC. Management access to network elements from external systems may be provided by direct connection to those systems or through an external switched or routed Data Communications Network (DCN) infrastructure. External access is provided using the DCN ports on the network element. Additional Auxiliary ports (AUX) are provided for communications between customer end-systems. From a hardware standpoint, the AUX and DCN ports simply provide external access to the inter-network element and intra-network element Ethernet/IP infrastructure.

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Slide-107 Components of the DTN Control Plane

Slide-108 Functions of the DTN Control Plane

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Components of the DTC Control Plane

The DTN Control Plane is made up of the MCM, TEM, DLM, and BMM modules along with the backplane

All of the connections are provided by fixed backplane interconnect. There are Ethernet switches located on each MCM and each BMM. The MCM switch provides both layer 2 switching (including address learning) and layer 3 forwarding. The layer 3 forwarding tables must be explicitly configured by the MCM processor. The switch is capable of switching and layer 3 forwarding between any combination of attached interfaces. The switch located on the BMM provides only switching (including address learning) at layer 2. Its function is to allow access to the MCM switch for the OSC. VLAN tags are passed transparently by this switch. All of the intra-chassis links shown are full-duplex, 100 Mbps Ethernet

The Control Plane links performance monitoring, provisioning, and alarm monitoring signals between the modules in slots 1-6 and the MCM

Functions of the DTC Control Plane

Is the internal communications bus within the DTN

Operates on an internal LAN within the DTN

Carries IP messaging traffic across the backplane between the MCM(s) and line modules including OSC

Provides a path for module software downloads

Provides a path for PM and Alarm retrieval and reporting

Provides a path for provisioning commands

.

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Slide-109 DTN Control Plane Block Diagram

Slide-110 DTN Redundant Control PLane

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DTN Control Plane Block Diagram

The MCM switch/router is responsible for routing all internal and external communications

The BMM switch forwards communications sent and received over the OSC Multi-Chassis Interconnect Interfaces

DTN Redundant Control Pane

The DTN redundant control plane employs an active and standby MCM

In the event the active MCM fails, the standby MCM will reboot and reestablish internal and external communications

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Slide-111 Redundant Main Non-redundant Expansion

Slide-112 Redundant Main and Redundant Expansion

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Redundant Main and Non-redundant on the Expansion

The MCM in an Expansion Chassis communicates with the active MCM in the Main Chassis through the Nodal Control and Timing (NCT) Ethernet cables

The MCM in an Expansion Chassis does not maintain a copy of the database

Note: The DCN and AUX ports on an Expansion Chassis are dis-abled.

Redundant Main and Redundant on the Expansion

The active MCM in an Expansion Chassis communicates with the active MCM in the Main Chassis through the Nodal Control and Timing (NCT) Ethernet cables.

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Slide-113 NCT Cable Configurations

Slide-114 3 Chassis NCT Configuration

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NCT Cable Configurations

For 3 to10 Chassis configurations with Main Chassis Redundancy, and non-redundant on all Expansion Chassis.

The recommended NCT port connections for a DTC system with control redundancy only at the Main Chassis. This mixed-redundancy configuration exhibits the following failure impacts:

If the active MCM fails on the Main Chassis, an activity switch to the standby MCM occurs. In this case, all other chassis are still avail-able and reachable from the Main Chassis.

A MCM fault of the Expansion Chassis isolates that chassis from the rest of the node and it will be unreachable.

3 Chassis NCT Configuration / Redundant Main Non-Redundant Expansion Chassis

Chassis 1 NCT2B to Chassis 2 NCT1A

Chassis 2 NCT2A to Chassis 3 NCT1A

Chassis 3 NCT2A to Chassis 1 NCT1A

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Slide-115 4-10 Chassis NCT Configuration

Slide-116 Optical Line Amplifier Control Plane Components

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4-10 Chassis NCT Configuration / Redundant Main Non-Redundant Expansion Chassis

Chassis 1 NCT2B to Chassis 2 NCT1A

Chassis 2 NCT2A to Chassis 3 NCT1A

Chassis 3 NCT2A to Chassis 4 NCT1A

Chassis 4 NCT2A to Chassis 1 NCT1A

Note: Continue the “Daisy Chain” connections for up to 10 chas-sis.

Optical Line Amplifier Control Plane Components

The Optical Line Amplifier Control Plane is made up of the OMM and OAM modules along with the backplane

The Control Plane links performance monitoring, provisioning, and alarm monitoring signals between the OAMs in slots 2-3 and the OMM

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Slide-117 Functions of the Optical Line Amplifier Control Plane

Slide-118 Optical Line Amplifier Control Plane

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Functions of the Optical Line Amplifier Control Plane

Is the internal communications bus within the OTC

Operates on an internal LAN within the OTC

Carries IP messaging traffic across the backplane between the OMM(s) and line modules including OSC

Provides a path for module software downloads

Provides a path for PM and Alarm retrieval and reporting

Optical Line Amplifier Control Plane

The OMM switch/router is responsible for routing all internal and external communications

The OAM switch forwards communications sent and received over the OSC

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Slide-119 Optical Line Amplifier Redundant Control PLane

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Optical Line Amplifier Redundant Control Plane

The Optical Line Amplifier redundant control plane employs an active and standby OMM

In the event the active OMM fails, the standby OMM will reboot and reestablish internal and external communications

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Slide-120 DTN Data Plane

Slide-121 DTN System Data Plane TOM

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DTN Data Plane

The DTN Data Plane is utilized to route Digital Transport Frames (DTFs) across the backplane between DLM/TEM Crosspoints.

The backplane pins for the data plane are located in slots 3, 4, 5, and 6 where cross-connects can be provisioned.

DTN System Data Plane Architecture TOM

Tributary Optical Module –TOM•

Receive –The incoming signal is converted from optical to electrical

Transmit -The outgoing signal is converted from electrical to optical

Note: Both digital and optical performance monitoring statistics are collected.

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Slide-122 DTN System Data Plane Architecture TAM

Slide-123 DTN System Data Plane Architecture Crosspoint

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DTN System data Plane Architecture TAM The incoming signal from the TOM is wrapped in the Trib DTF and

performance data is collected.

The outgoing signal to the TOM is stripped of the Trib DTF and per-formance data is collected.

DTN System data Plane Architecture Crosspoint

A Local DLM Route DTF will pass straight through to the Cross-point to the Mapper or TAM in 2.5G segments.

A DTF to or from an alternate DLM or TEM will be routed across the backplane to the appropriate DLM/TEM Crosspoint and forwarded to the Mapper or TAM in 2.5G segments.

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Slide-124 DLM Mapper

Slide-125 DLM Photonic Integrated Chip (PIC) Transmit

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DLM Mapper

The DLM Mapper codes, decodes, and applies the Forward Error Correction algorithm at the DTF level

The DTF is then forwarded to the PIC or Crosspoint

DTF and FEC performance monitoring statistics are collected

DLM PIC Transmit

The DLM PIC converts the 10G Digital Channel signal from the Mapper from electrical (digital) to a ITU DWDM optical wavelength channel

The ten 10G wavelength channels are multiplexed onto a common optical path as a 100G Optical Carrier Group (OCG)

Both digital and optical performance monitoring statistics are col-lected

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Slide-126 DLM PIC Receive

Slide-127 BMM Transmit

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DLM PIC Receive

The DLM PIC demultiplexes the 100G OCG into ten 10G Optical Channels (OCh).

Each OCh is applied to the appropriate receiver that converts the OCh to a 10G Digital Channel.

Both digital and optical performance monitoring statistics are col-lected.

BMM Transmit

The BMM combines the eight OCGs onto a common optical path creating a 800G C Band signal.

The C Band signal is amplified by an Erbium Doped Fiber Amplifier (EDFA), the OC3 Optical Supervisory Channel (OSC) is added cre-ating the Optical Transport Signal (OTS), performance monitoring statistics are collected, and the signal is sent to the Line Out.

Both optical and digital OSC performance monitoring statistics are collected.

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Slide-128 BMM Receive

Slide-129 Add Drop Connection

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BMM Receive The 800G OTS is received at the Line In, the OC3 Optical Supervi-

sory Channel (OSC) is removed, dispersion compensation may be applied, and the C Band signal is amplified by an Erbium Doped Fiber Amplifier (EDFA).

The BMM then demultiplexes the C Band signal into eight 100G OCGs and each is sent to the appropriate OCG connector.•Both optical and digital OSC performance monitoring statistics are col-lected.

Add Drop Connection

Add/Drop Connection –Drop Direction

The 800G OTS is received at the Line In, the OSC is stripped and sent to the MCM for processing, the C Band signal is amplified by EDFA, the BMM then demultiplexes the C Band signal into eight 100G OCGs and each is sent through the appropriate OCG con-nector to the DLM

On the DLM, the PIC converts the signal from optical to electrical, the Mapper decodes and applies FEC, and then the signal is routed by the Crosspoint to the provisioned outbound DLM/TEM where the signal from the Crosspoint is sent to the provisioned TAM

On the TAM the DTF is stripped and the signal is routed to the appropriate TOM

On the TOM the signal is converted from electrical to optical and sent to the client.

Note: Add/Drop Connection –Add Direction- The flow described above is reversed

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Slide-130 Express Connection

Slide-131 Hairpin Connection

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Express Connection

The 800G OTS is received at the Line In, the C Band is amplified by EDFA, the BMM then demultiplexes the eight 100G OCGs and each is sent to the appropriate OCG connector.

On the DLM, the PIC converts the signal from optical to electrical, the Mapper decodes and applies FEC, and then the signal is routed by the Crosspoint to the outbound DLM

On the outbound DLM the signal comes in from the Crosspoint to the Mapper, new FEC is coded and read into the DTF, then the PIC converts the signal from electrical to optical and multiplexes the OChs into the OCG

The BMM combines the eight OCGs onto a common optical path creating the 800G C Band signal

The C Band signal is amplified by the EDFA, the OSC is added, and the OTS is sent to the Line Out

Hairpin Connection

On the TOM the signal from the client is converted from optical to electrical and sent to the TAM

On the TAM the client signal is wrapped in the DTF and sent to the DLM/TEM

On the DLM/TEM, the signal is routed by the Crosspoint to the pro-visioned outbound DLM/TEM where the signal from the Crosspoint is sent to the provisioned TAM

On the TAM the DTF is stripped and the signal is routed to the appropriate TOM

On the TOM the signal is converted from electrical to optical and sent to the client

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Slide-132 Channelized SNC

Slide-133 Digital Terminal

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Channelized SNC

Channelized cross-connects, and channelized SNCs, associations, and sub-SNCs supported by the TAM-8-1G, which maps two 1GbE circuits to a single 2.5G DTF

Digital Terminal Configuration

Optical transport capacity deployable in OCG increments

Client access capacity deployed using individually pluggable TEMs, TAMs and subtending TOMs

There is no Express Traffic at a Terminal configuration

A Digital Terminal configuration terminates the incoming line side traffic and hands off the traffic to the customer equipment. The DTN can termi-nate up to 400Gbps per chassis by populating the client side interfaces as and when needed, using TAMs and TOMs.

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Slide-134 Digital Repeater

Slide-135 Digital Add Drop

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Digital Repeater

Digital Repeater function deployed in OCG increments

Up to 200Gbps in each fiber direction per chassis

Paired DLM’s with expressed backplane capacity

Per-channel PM & fault monitoring

There is no Add/Drop traffic at a Repeater configuration

Digital Add Drop

Add/Drop function provides per-channel manageability

Full per-channel O-E-O function with PM & fault monitoring

Deployed as DLM/TEMs with dynamically configurable switching

Adjacent slot grooming prevents channel blocking

DLM/TEM to TOM(s) provide service termination & payload moni-toring

Add/Drop, Hairpin, and Express connection capability

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Slide-136 System Data Pane Architecture

Slide-137 Multi-Chassis Configurations

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System Data Plane Architecture

Hairpin

Express

Add Drop

Multi-Chassis Configurations

Combining up to 24 DLMs and 6 BMMs across 10 chassis provides the user with virtually limitless possible configuration variations and directional support.

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Slide-138 Optical Line Amplifier Signal Flow

Slide-139 Optical Line Amplifier Configuration

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Optical Line Amplifier Signal Flow

Each Optical Amplifier Module (OAM) is a unidirectional amplifier

One OAM amplifies the Eastbound OTS signal

One OAM amplifies the Westbound OTS signal

The combined effect is bi-directional amplification of both East and Westbound OTS signals

Note: Signal flow through an Optical Line Amplifier is unidirec-tional.

Optical Line Amplifier Configuration

The Eastbound OTS signal arrives at the IN port, the OSC is stripped off and sent to the OMM for processing, the C Band signal is amplified by the EDFA, then new OSC is coupled onto the C Band, and the combined OTS signal is sent out Eastbound through the Out port.

The Westbound OTS signal arrives at the IN port, the OSC is stripped off and sent to the OMM for processing, the C Band signal is amplified by the EDFA, then new OSC is coupled onto the C Band, and the combined OTS signal is sent out Westbound through the Out port.

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Slide-140 Review

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Chapter Review

Theory of Operations

Power and Cooling

Control Plane

Data Plane Architecture

System Configurations

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Chapter Review1. Power: ______________ redundant feeds2. Cooling: Vertical ____________ _________________ cooling3. Control Plane

a. Functions:

• The ability to locally or remotely ________________ (configure) the NE in accordance with a specific customer application

• _____________________ and ________________ monitoring, the ability to accumulate _________________________ statistics, and the ability to locally or remotely access the collected information

b. Components

• DTC: _________, BMM, __________• OTC: _____________, ______________

4. System Data Plane Architecture components

a. DTC: ___________, TAM, __________, ________________, ______________________

5. System Configuration

a. Digital _______________________

b. Digital Repeater

c. Digital ______________________________

d. Optical Line Amplifier

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Software Overview

Chapter Learning Objectives

Upon successful completion of this chapter, the student should be able to:

• List the functions and features of the software available for the DTN/Optical Line Amplifier

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Slide-142 Graphical Node Manager

Slide-143 Accessing graphical Node Manager

G raph ica l N ode M anager

B row ser launched Java app lica tion (cache m anager)

F au lt M an agem entC onfigura tio n M anagem entS erv ice P rov is ion in gP erfo rm ance M on ito r in gS ecurity M anagem ent

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Infinera Graphical Node Manager (GNM)

Infinera GNM is a node-level element management application that provides users with on-site access and control of Infinera DTNs and Infinera Optical Line Amplifiers.

GNM provides browser-based Java application (cache manager): Fault Management

Configuration Management

Service Provisioning

Performance Management

Security Management

Accessing Graphical Node Manager

Open a supported browser

• Internet Explorer• Netscape• Mozilla

Type the target network element DCN or craft IP address in the address bar

Note: The craft port may require the use of a crossover cable.

The Java applet initiates and JAR files are downloaded

• The following Java 2 Runtime Environments are supported

• JRE 1.4.2_04• JRE 1.4.2_06• JRE 1.4.2_09• JRE 1.4.2_10• JRE 1.5.0_04• JRE 1.5.0_05• JRE 1.5.0_06

Login screen will appear

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Slide-144 Login Screens

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Initial Login

• Default Username - secadmin• Default password - Infinera1• Click Login

Note: Usernames and passwords are case sensitive.

Security message is displayed

• Click OK to continue

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Slide-145 Change Password

Slide-146 GNM Main View

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Changing Passwords

Change password on initial login or if password expires:

• Type current password• Type new password• Confirm new password• Click Apply

Note: Password must be alphanumeric and 6 to 10 characters long.

GNM Main View

On a successful login to the target network element, the GNM Main View is displayed.The GNM Main View provides access to:

a. Equipment

b. Facilities

c. Tools used to control and monitor the target network element

d. Graphical representation of the network element

GNM Main View

a. Main Menu

b. Equipment Tree

c. Equipment View

d. Workspace Area

e. Quick View Browser

f. Alarm Manager

g. Status Bar

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Slide-147 File and Fault management Menus

Slide-148 Configuration Menu

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Infinera GNM Interface Components

File Menu

Contains the drop-down menus.

a. Exit

Fault management

Contains the drop-down menus.

a. Alarm Manager

b. Event Log

c. Export all Alarms to file

d. Export all Events to file

e. Export Current View of Alarms to File

f. Export Current View of Events to File

g. Alarm Severity Profile Settings

Configuration

Contains the drop-down menus.

a. Network Element

b. Create Chassis

c. Create Protection group

d. Equipment Manager

e. Facility Manager

f. Protection Group Manager

g. Link Manager

h. Back Plane Link Manager

i. Static Route Manager

j. Default Templates

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Slide-149 Provisioning

Slide-150 Security

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Provisioning

Contains the drop-down menus.

a. Cross-Connect Manager

b. Circuit Manager

c. Create Cross-Connect

d. Create Circuit

Security

Contains the drop-down menus.

a. Change Password

b. NE Security Administration

c. Active User Sessions

d. NE-Wide Security Settings

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Slide-151 Tools Window and Help Menus

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Tools

Contains the following drop down menus

a. SW-DB Manager

b. SW-DB Upload Download Manager

c. PM Upload Scheduler

d. Connectivity Verification Tools

e. TL-1 Session

f. View

Window

Contains the following drop down menus

a. Cascade

b. Node

Help

Contains the following drop down menus

a. Contents

b. Technical Support

c. About

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Slide-152 BMM Drop Down Menu

Slide-153

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The user can right click on any module to access associated drop down menus

BMM Menu

a. Properties

b. Show Alarms

c. Show Facilities

d. Admin State

e. Alarm Reporting

f. Delete

g. Reset

h. GMPLS Link

i. OSC

j. Span

k. Optical Carrier Group

l. Connectivity Verification Tools

DLM Menu

a. Properties

b. Show Alarms

c. Show Facilities

d. Protection Group Manager

e. Admin State

f. Alarm Reporting

g. Delete

h. Reset

i. Provisioning

j. Optical Carrier Group

k. Optical Channels

l. Line DTF Path

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Slide-154 MCM Menu

Slide-155 TOM Menu

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MCM Menu

a. Properties

b. Show Alarms

c. Admin State

d. Alarm Reporting

e. Delete

f. Reset

g. Switch over

h. Make Standby

TOM Menu

a. Properties

b. Show Alarms

c. Show Facilities

d. Protection Group Manager

e. Admin State

f. Alarm Reporting

g. Delete

h. Provisioning

i. Trib DTF Path

j. Trib Port

k. Client trib termination point

l. Create Protection group

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Slide-156 Quick View Browser

Slide-157 Equipment Tree

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Quick View Browser

The Quick View Browser provides summary information about the equipment last selected in the Equipment Tree or the Equipment View.

Equipment Tree

The Equipment Tree provides a hierarchical view of all the equipment contained within the target network element. The Equipment Tree also lists all other nodes in the same signaling domain through the Network Neighborhood.

The Equipment Tree displays a tree structure of the following:

a. Current Network Element View

• The Current Network Element View displays the target network element and it’s sub-equipment. It lists the network element’s chassis and other contained equipment in hierarchical format.

b. Network Neighborhood View

• The Network Neighborhood View lists the network elements within the same signaling domain of the target network element.

When the user selects an item in the Equipment Tree, it is highlighted in the Equipment View by a black outline. Right-clicking an item displays a shortcut menu.

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Slide-158 GNM Help

Slide-159 Online Troubleshooting Assistance

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GNM Help

Context sensitive

Search Capable

Print capable

GNM User Guide and Maintenance and Troubleshooting Guide

Access from any screen

GNM Online Troubleshooting Assistance

Double click an alarm or right click and alarm and select Details

Click Troubleshoot

Associated alarm clearing procedure is displayed

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Slide-160 Infinera DNA

Slide-161 DNA Components

Browser launched Java application (cache manager)

Fault ManagementEquipment ConfigurationService ProvisioningPerformance MonitoringSecurity Administration

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NOTES:

Infinera Digital Network Administrator (DNA)

The Infinera DNA is a scalable, robust, carrier class element management application based on ITU-T TMN and Telcordia standards.

Infinera DNA provides browser based Java application (cache manager):

a. Fault Management

b. Configuration Management

c. Service Provisioning

d. Performance Management

e. Security Management

DNA provides advanced features:

a. Network wide real-time fault management and monitoring, including current alarm summary, historical event logs, and threshold crossing alerts

b. Physical and Provisioning topological views, topology updates, auto-discovery and network synchronization

c. Network equipment inventory reporting with comprehensive manufacturing information

d. Scheduling network element configuration backup and manual restoration

e. Historical performance monitoring collection, archiving and viewing

The DNA has the following two main components:

a. DNA Server

b. DNA Client

DNA supports Operations, Administration, Maintenance and Provisioning (OAM&P) functions.

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Slide-162 DNA Main View

Slide-163 DNA Views

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DNA Main View

On a successful login to the DNA Client, the DNA Main View is displayed. The DNA Main View displays a graphical representation of the network and provides a access to the following:

a. Main Menu

b. Equipment Tree

c. Workspace Area

d. Quick View Browser

e. Alarm Manager

f. Status Bar

DNA Views

Topographical View

Provisioning View

Physical View

Quick View Browser

Equipment Tree

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Slide-164 Digital Link and Channel Map Viewers

Slide-165 TL1 Interface

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Channel Map and Digital Link Viewer

DNA provides exceptional span analysis and performance monitoring tools with the Channel Map Viewer and Digital Link Viewer.

TL1 Interface

Transaction Language 1 (TL1) is an industry-recognized common language protocol for messages exchanged between network elements and an Operating System (OS). The TL1 Interface uses the common language protocol to eliminate the need to support vendor-specific interfaces.

The TL1 Interface on the network element allows an operations system to perform the following functions:

a. Fault Management

b. Equipment Configuration

c. Service Provisioning

d. Performance Monitoring

e. Security Administration

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Chapter Review INFINERA GRAPHICAL NODE MANAGER (GNM) OVERVIEW

Infinera GNM is a ____________________element management application that provides users with on-site access and control of Infinera DTN Digital Nodes (DTN) and Infinera Optical Line Amplifiers (Optical Line Amplifier).

GNM INTERFACE COMPONENTS

1. Main Menu2. Equipment Tree3. ______________________________ View4. Workplace Area5. __________________________ Browser6. Alarm Manager7. ____________________________________

INFINERA DNA INTERFACE COMPONENTS

1. Main Menu2. Equipment Tree3. _______________________________________________4. Quickview Browser5. Status Bar

TL1 INTERFACE

The TL1 Interface on the network element allows operations system to perform the following functions:

a. Fault Management

b. ________________________ Configuration

c. Service Provisioning

d. ____________________________ Monitoring

e. Security Administration

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Appendix A

Acronyms

Table A-1 List of Acronyms

Abbreviation Description

AACLI application command line interface

ACO alarm cutoff

ACT active

AD add/drop

ADM add/drop multiplexer

ADPCM adaptive differential pulse code modulation

AGC automatic gain control

AID access identifier

AINS administrative inservice

AIS alarm indication signal

ALS automatic laser shutdown

AMP amplifier

ANSI American National Standards Institute

AO autonomous output

APD avalanche photo diode

API application programming interface

APS automatic protection switching

ARC alarm reporting control

ARP address resolution protocol

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ASAP alarm severity assignment profile

ASE amplified spontaneous emission

ASIC application-specific integrated circuit

ATM asynchronous transfer mode

AU administrative unit

AUX auxiliary port

AWG array waveguide gating

AWG american wire gauge

BBDFB battery distribution fuse bay

BDI backward defect indication

BDI backward defect indication

BEI backward error indication

BER bit error rate

BERT bit error rate testing

BGA ball grid array

BIP-8 bit interleaved parity

BITS building-integrated timing supply

BLSR bi-directional line switched ring

BMM-C Band Mux Module - C band

BNC Bayonet Niell-Concelman; British Naval Connector

BOL beginning of life

BOM bill of material

BOOTP bootstrap protocol

bps bits per second

BPV bipolar violations

CC Celsius

CCITT Consultative Committee on International Telegraph and Telephone

CCLI commissioning command line interface

CDE chromatic dispersion equalizer

CDR clock and data recovery

CDRH Center for Devices and Radiological Health

Table A-1 List of Acronyms

Abbreviation Description

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CFR code for federal regulations

CH/Ch/ch channel

CID circuit identifier

CIT craft interface terminal

CLEI common language equipment identifier

CLI command line interface

CO central office

CODEC coder and decoder

COM communication

CORBA common object request broker architecture

CPC common processor complex

CPE customer premises equipment

CPLD complex programmable logic device

CPU central processing unit

CRC cyclic redundancy check

CSPF constraint-based shortest path first algorithm

CSV comma separated value

CTAG correlation tag

CTP channel termination point

CTTP client tributary termination point

CTS clear to send

CV coding violation

CV-L coding violation-line

CV-P coding violation-path

CV-S coding violation-section

DDA digital amplifier

DAWN Digital Amplified Wavelength Network

dB decibel

DB database

DCC data communications channel

DCE data communications equipment

DCF dispersion compensation fiber

DCM dispersion compensation module

Table A-1 List of Acronyms

Abbreviation Description

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DCN data communication network

DEMUX de-multiplexing

DFB distributed feedback

DFE decision feedback equalizer

DGE dynamic gain equalization

DHCP dynamic host configuration protocol

DLM digital line module

DMC dispersion management chassis

DPG datapath protection group

DR digital repeater

DSF dispersion shifted fiber

DT digital terminal

DTC digital transport chassis

DTE data terminal equipment

DTF digital transport frame

DTL digital transport line

DTMF dual tone multi frequency

DTP digital transport path

DTS digital transport section

DWDM dense wavelength division multiplexing

EEDFA erbium doped fiber amplifier

EEPROM electrically-erasable programmable read only memory

EMC electromagnetic compatibility

EMI electro-magnetic interference

EMS element management system

EOL end-of-life

ESD electrostatic discharge; electrostatic-sensitive device

ES-L line-errored seconds

ES-P path-errored seconds

ES-S section-errored seconds

ETS IEEE european test symposium

ETSI European Telecommunications Standards Institute

Table A-1 List of Acronyms

Abbreviation Description

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FF fahrenheit

FA frame alignment

FAS frame alignment signal

FC fiber channel; failure count

FCAPS fault management, configuration management, accounting, performance monitor-ing, and security administration

FCC Federal Communications Commission (USA)

FDA Food and Drug Administration

FDI forward defect indication

FEC forward error correction

FIFO first-in-first-out

FIT failure in time

FLT fault

FPGA field programmable gate array

FRU field replaceable unit

FTP file transfer protocol

GGbE gigabit ethernet

Gbps gigabits per second

GCC general communication channel

GFP general framing protocol

GHz gigahertz

GMPLS generalized multi protocol label switching

GNE gateway network element

GNM graphical node manager

GUI graphical user interface

H/IHTML hypertext markup language

HTTP hypertext transfer protocol

IAP input, output and alarm panel

ICG invalid code group

ID identification

Table A-1 List of Acronyms

Abbreviation Description

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IDF invalid data flag

IEC International Electrical Commission

I/O Input/Output

IOP input output panel

IP Internet protocol

IQ see IQ NOS

IQ NOS Infinera IQ network operating system

IR intermediate reach

IS in-service

ITU-T International Telecommunications Union - Telecommunications

J/K/LJabber Jabber is the transmission of a packet on a computer network that is larger than the

network's MTU

JDK Java Development Kit

JRE Java Runtime Environment

JS jabber seconds

LAN local area network

LBC laser bias current

LC fiber optic cable connector type

LCK locked

LED light-emitting diode

Linear ADM linear add/drop multiplexer

LOF loss of frame

LOL loss of light

LOP loss of pointer

LOS loss of signal

LR long reach

LSB least significant bit

LTE line-terminating equipment

LVDS low voltage differential signaling

MMA monitoring access

MAC media access control

MB megabyte

Table A-1 List of Acronyms

Abbreviation Description

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Mb/s megabits per second

MIB management information base

MCM management and control module

MEMS micro electro mechanical systems

MFAS multi frame alignment signal

MIB management information base

MMF multimode fiber

MS multiplex section

MSA multi source agreement

MSB most significant bit

MSOH multiplex section overhead

MTBF mean time between failure

MTU maximum transmission unit

MX multiplex, multiplexer, multiplexing

NNA network administrator

NAND flash type

NC normally closed; node controller

NCC node controller chassis

NCT nodal control and timing

NDSF non zero dispersion shifted fiber

NE network engineer

NEBS network equipment building system

NECG net electrical coding gain

NEPA national fire protection association

NJO negative justification opportunity

nm nanometer

NML network management layer

NMS network management system

NNI network-to-network interface

NO normally open

NSA non-service affecting

NTP network time protocol

NVRAM nonvolatile random access memory

Table A-1 List of Acronyms

Abbreviation Description

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OOAM optical amplification module

OAM&P operation, administration, maintenance and provisioning

OC-12 optical carrier signal at 622.08 mb/s

OC-192 optical carrier signal at 9.95328 gb/s

OC-3 optical carrier signal at 155.52 mb/s

OC-48 optical carrier signal at 2.48832 gb/s

OCG optical carrier group

Och Optical channel

OCI open connection indication

ODU optical channel data unit

OEO optical-electrical-optical conversion

OFC open fiber control

OH overhead

OIF optical internetworking forum

OLA optical line amplifier

OMM optical management module

OMS optical multiplex section

OOS out-of-service

OOS-MT out-of-service maintenance

OPR optical power received

OPT optical power transmitted

OPU optical channel payload unit

ORL optical return loss

OS operating system

OSA optical spectrum analyzer

OSC optical supervisory channel

OSNR optical signal-to-noise ratio

OSPF open shortest path first

OSS operations support system

OTC optical transport chassis

OTDR optical time domain reflectometer

OTN optical transport network

OTS optical transport section

Table A-1 List of Acronyms

Abbreviation Description

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OTU optical channel transport unit

OW orderwire

OWM orderwire module

P/QPC personal computer

PCPM per channel power monitoring

PDU protocol data unit; power distribution unit

PEM power entry module

PF partial failure

PG protection group

PHY physical

PIC photonic integrated circuit

PID protocol identifier

PIN positive-intrinsic negative

PJO positive justification opportunity

PLD programmable logic device

PLL phase locked loop

PM performance monitoring

PMD polarization mode dispersion

POH path overhead

POP point-of-presence

PPM part per million

PPP point-to-point protocol

PR provisioning

PRBS pseudo random binary sequence

ps pico second (unit of measure for dispersion)

PSC protection switch completion; protection switch count

PSD protection switch duration

PSTN public switched telephone network

PT parallel telemetry

PTP physical termination point; point-to-point

PWR power

QOS quality of service

Table A-1 List of Acronyms

Abbreviation Description

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RRAM random access memory

RDI remote defect indication

REI-L remote error indication-line

REI-P remote error indication-path

RFI remote failure indication

ROM read-only memory

RS regenerator section; reed solomon

RSOH regenerator section overhead

RTC real time clock

RTN return lead

RTS ready to send

RU rack unit

Rx receiver; receive

Rx Q receiver quality

SSA service affecting; security administrator

SAPI source access point identifier

SC square shaped fiber optic cable connector

SD signal degrade

SDH synchronous digital hierarchy

SDRAM synchronized dynamic random access memory

SEF severely errored frame

SEFS severely errored frame second

SELV safety extra low voltage

SERDES serializer and deserializer

SES severely errored seconds

SF signal fail

SFP small form factor plug

SID source identifier; system identifier

SMF single-mode fiber

SML service management layer

SNC subnetwork connection

Table A-1 List of Acronyms

Abbreviation Description

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SNCP subnetwork connection protection

SNE subtending network element

SNMP simple network management protocol

SNR signal-to-noise ratio

SOH section overhead

SOL start of life

SONET synchronous optical network

SPE synchronous payload envelope

SQ signal quality

SR short reach

SSH Secure Shell

SSHv2 Secure Shell version 2

SSL secure sockets layer

STE section terminating equipment

STM synchronous transfer mode

STM-1 SDH signal at 155.52 Mb/s

STM-16 SDH signal at 2.48832 Gb/s

STM-4 SDH signal at 622.08 Mb/s

STM-64 SDH signal at 10 Gb/s

STM-n synchronous transport module of level n (for example, STM-64, STM-16)

STS synchronous transport signal

STS-n synchronous transport signal of level n (for example, STS-12, STS-48)

SW software

T/U/VTAM tributary adapter module

TAP timing and alarm panel

TCA Threshold Crossing Alert

TCP transmission control protocol

TE traffic engineering

TEC thermo-electric cooler

TEM TAM Extender Module

TERM terminal

TFTP trivial file transfer protocol

TID target identifier

Table A-1 List of Acronyms

Abbreviation Description

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TIM trace identifier mismatch

TL1 transaction language 1

TMN telecommunications management network

TOM tributary optical module

TP termination point

TR transceiver

TT test and turn-up

TTI trail trace identifier

Tx Transmitter; Transmit

UA unavailable seconds

UART universal asynchronous receiver transmitter

UAS unavailable seconds

UAS-L unavailable seconds, near-end line

UAS-P unavailable seconds, near-end STS path

UDP user datagram protocol

UPSR unidirectional path switched ring

URL universal resource locator

UTC Coordinated Universal Time

V volt

VGA variable gain amplifier

VLAN virtual local area network

VOA variable optical attenuator

VPN virtual private network

VSR very short reach

W/X/Y/ZWAN wide area network

WDM wavelength division multiplexing

XC cross-connect

XFP name of a small form factor 10 Gbps optical transceiver

XML extensible markup language

MISC1R re-amplification

2R re-amplification, re-shape

Table A-1 List of Acronyms

Abbreviation Description

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3R re-amplification, re-shape, re-time

4R re-amplification, re-shape, re-time, re-code

Table A-1 List of Acronyms

Abbreviation Description

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