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DIGITAL OPTICAL NETWORK
PRODUCT OVERVIEW
Revision June 2007
Revision A
Software Release: 3.0
Infinera Corporation169 Java DriveSunnyvale, CA. 94089www.infinera.com+ 1-408-572-5200
Copyright© 2007 Infinera Corporation. All rights reserved.
This Manual is the property of Infinera Corporation and is confidential. No part of this Manual may be reproduced for any purposes or transmitted in any form to any third party without the express written consent of Infinera.
Infinera makes no warranties or representations, expressed or implied, of any kind relative to the information or any portion thereof contained in this Manual or its adaptation or use, and assumes no responsibility or liability of any kind, including, but not limited to, indirect, special, consequential or incidental damages, (1) for any errors or inaccuracies contained in the information or (2) arising from the adaptation or use of the information or any portion thereof including any application of software referenced or utilized in the Manual. The information in this Manual is subject to change without notice.
TrademarksInfinera and Infinera Digital Optical Network are trademarks of Infinera Corporation.
GoAhead is a trademark of GoAhead Software, Inc.
All other trademarks in this Manual are the property of their respective owners.
Infinera DTN and Infinera Optical Line Amplifier Regulatory ComplianceFCC Class A
This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Modifying the equipment without Infinera's written authorization may result in the equipment no longer complying with FCC requirements for Class A digital devices. In that event, your right to use the equipment may be limited by FCC regulations, and you may be required to correct any interference to radio or television communications at your own expense.
DOC Class A
This digital apparatus does not exceed the Class A limits for radio noise emissions from digital apparatus as set out in the interference-causing equipment standard titled "Digital Apparatus," ICES-003 of the Department of Communications.
Cet appareil numérique respecte les limites de bruits radioélectriques applicables aux appareils numériques de Classe A prescrites dans la norme sur le matériel brouilleur: "Appareils Numériques," NMB-003 édictée par le Ministère des Communications.
Warning
This is a class A product. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures.
FDA
This product complies with the DHHS Rules 21 CFR Subchapter J, Section 1040.10, Applicable at date of manufacture.
Page ii-i
DIGITAL OPTICAL NETWORK
PRODUCT OVERVIEW
COURSE OUTLINEJune 2007
Revision A
Software Release: 3.0
COURSE DESCRIPTION
This training course is designed for the student who needs an introduction into the capabilities of the Infinera Digital Optical Network®. Students are provided detailed information on the following topics: System Architecture
Chassis Capabilities
Hardware functions and features
Theory of Operations
Software functions and features
LEARNING OBJECTIVES
Upon successful completion of this course, the student should be able to: Describe the functions of Infinera’s PIC
List the capabilities of the DTN and the Optical Line Amplifier
Describe the network applications and topologies supported by the DTN/Optical Line Amplifier
List the capabilities of the DTC/OTC
Describe the functions and features of the hardware modules for the DTC/OTC
Describe the power feeds for the DTC
Describe the vertical cooling method used in the DTC
Describe the functions of the DTC/OTC control plane
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List the components of the control plane for the DTC and the OTC
List the components of the data plane for the DTC
Describe the system architecture for the DTN and the Optical Line Amplifier
List the functions and features of the software available for the DTN/Optical Line Amplifier
COURSE CONDITIONS
There are a maximum of 12 students
Students are issued training texts
Lectures are presented with projector displays
This course is 100% lecture
PREREQUISITES
To be successful in this course, students should have the following skills and knowledge: An understanding of fiber optics and digital communications technology
Experience with telecommunications systems
Experience with a graphical user interface such as a browser
Knowledge of Dense Wavelength Division Multiplexing (DWDM), Synchronous Optical Network (SONET), Synchronous Digital Hierarchy (SDH), and Gigabit Ethernet (GbE)
TIME
• The average time for this training course is 1 day.
COURSE OUTLINE
1. Introduction and Administration
a. Class Introductions
b. Safety
c. Administrative paperwork
2. System Architecture
a. Functions of the PIC
b. Infinera Digital Optical Network
c. DTN Capabilities
• 800Gbps capacity• GMPLS• G.709 Digital Wrapper
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• Client signal transport transparency• Multiple client signal support• O-E-O regeneration• Multiple configuration support• Add/Drop capabilities• Multi-chassis capabilities• Digital link reach• Topology support• Protection capabilities• Restoration capabilities• Enhanced troubleshooting capabilities• Redundant control plane
d. Optical Line Amplifier Capabilities
e. Chapter Review
3. Hardware Overview
a. DTN chassis overview
b. Components of the DTC
• Rack mount ears• Grounding• Power Entry Module(s) (PEM)• Input Output (I/O) Panel• Timing and Alarm Panel (TAP)• Fan Trays• Air Filter• Card cage
c. DTC Modules
• Management Control Modules (MCM)• Tributary Optical Modules (TOMs)• Tributary Adapter Modules (TAMs)• Digital Line Module (DLM)• TAM Extender Module (TEM)• Bandwidth Multiplexing Modules (BMM)
d. Optical Line Amplifier chassis overview
e. Components of the OTC
• Rack mount ears• Grounding• Power Entry Module(s) (PEM)
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• Input/Alarm Panel• Fan Trays• Air Filter• Card cage
f. OTC Modules
• Optical Management Module (OMM)• Optical Amplifier Modules (OAM)
g. Dispersion Management Chassis
• Dispersion Compensation Moduleh. Chapter Review
4. Theory of Operations
a. DTN Power and Cooling
b. Control Plane
• Network Level• DTN Control Plane Components• DTN Control Plane• DTN Redundant Control Plane• NCT cable configurations• Optical Line Amplifier Control Plane Components• Optical Line Amplifier Control Plane• Optical Line Amplifier Redundant Control Plane
c. Data Plane
• System data plane architecture• Digital Terminal Configuration• Digital Repeater Configuration• Digital Add/Drop Configuration
d. Multi-Chassis Configuration
e. Optical Line Amplifier Signal Flow
f. Chapter Review
5. Software Overview
a. Infinera Graphical Node Manager (GNM)
b. Infinera Digital Network Administrator (DNA)
c. TL-1
d. Chapter Review
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6. Course Review
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Page 1-1
Section 1 System Architecture
Section 2 Hardware Overview
Section 3 Theory of Operations
Section 4 Software Overview
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Slide-6 System Architecture - Chapter Learning Objectives
Slide-7 Infinera’s Breakthrough Technology
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System ArchitectureCHAPTER LEARNING OBJECTIVES
Upon successful completion of this chapter, the student should be able to:• Describe the functions of Infinera’s Photonic Integrated Circuit
(PIC)• List the capabilities of the DTN and the Optical Line Amplifier.• Describe the network topologies that the DTN and the Optical
Line Amplifier can be deployed in.
INFINERA’S BREAKTHROUGH TECHNOLOGY
Infinera has introduced the first optical platform based on Photonic Integrated Circuits combines DWDM scalability, digital bandwidth management, and the network intelligence of Generalized Multi-Protocol Label Switching (GMPLS).
• Integration of >50 discrete optical components on ONE chip set. Lasers
Modulators
Wavelength Multiplexers
Demultiplexers
Photo detectors
• Dramatic Capital Expenditure (CapEx) reduction• Simplify Network Operations, Engineering, and Operations• 100Gbps Dense Wavelength Division Multiplexer on one chip set• 8 versions of PIC chip sets provide up to 80 channels of 10Gbs• Enables ultra low cost Optical-Electrical-Optical (OEO)
conversion
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System ArchitecturePage 1-4
Slide-8 PIC Chip Set Features - Transmit PIC
Slide-9 PIC Chip Set Features - Receive PIC
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EACH PIC CHIP SET FEATURES A TRANSMIT (TX) AND RECEIVE (RCV) PICPIC CHIP SET FEATURES - TRANSMIT PIC
Infinera currently produces eight different TX PICs.
Each TX PIC creates 10 separate 10G wavelengths, then multiplexes the 10 wavelengths into one 100Gbps signal.
With just 8 chips, Infinera provides the user 80 individual 10G channels!
Each Transmit PIC chip features:• 10 x DWDM lasers• 10 x 10G DWDM modulators• 10 x lambda DWDM multiplexer
PIC CHIP SET FEATURES - RECEIVE PIC
Infinera currently produces eight different RCV PICs.
Each RCV PIC receives the signal from a TX PIC and demultiplexes the 100G signal into 10 individual 10G wavelengths.
Each Receive PIC chip features:• 10 x 10G receivers• 10 lambda DWDM de-multiplexer
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System ArchitecturePage 1-6
Slide-10 PIC Chip Set Facts
Slide-11 Infinera’s Digital Optical Network™
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PIC CHIP SET FACTSEach PIC chip set provides 100Gbps DWDM
10 separate channels at 10Gbps per channel
There are 8 separate PIC chip sets
Each PIC chip set is installed in one circuit pack
With just 8 circuit packs (each including a PIC chip set) Infinera provides the user with 800Gbps DWDM capability that fits in just one rack.
INFINERA DIGITAL OPTICAL NETWORK CAPABILITIES
Infinera offers Digital Optical Networking Systems which help carriers build Digital Optical Networks. The Infinera DTN is the first Digital Optical Networking System which provides digital add/drop and bandwidth management capabilities. In addition, Infinera Optical Line Amplifiers are provided to extend the optical reach between the DTNs. The DTN and Optical Line Amplifier network elements provide similar system interfaces, data plane and control plane functions providing ease of use and deployment.
The Infinera Digital Optical Network allows the construction of a single unified optical transport network that scales from metro to long haul applications.
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System ArchitecturePage 1-8
Slide-12 DTN Capabilities Overview
Slide-13 DTN 800Gbps Capacity
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DTN CAPABILITIES OVERVIEW• 800Gbps capacity• GMPLS• G.709 digital wrapper• Client signal transport transparency• Multiple client signal support• O-E-O regeneration• Multiple configuration support• Add/Drop capabilities• Multi-chassis capabilities• Digital link reach• Topology support• Protection capabilities• Restoration capabilities• Enhanced troubleshooting capabilities• Redundant control plane
DTN 800GBPS CAPACITY
• 400 Gbps per chassis• Deployed in 100Gbps Optical Carrier Group (OCG) increments• Up to 80 channels• 10Gbps per channel• Multiplexed into 800Gbps Optical Transport Signal (OTS) per
fiber pair
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Slide-14 GMPLS
Slide-15 G.709 Digital Wrapper
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GMPLS• Multi-protocol Label Switching (MPLS) is utilized to speed up packet forwarding and provide for traffic engineering in Internet Protocol (IP) networks.
• Generalized MPLS (GMPLS) extends MPLS to provide the control plane (signaling and routing) for devices that switch in any of these domains: packet; time; wavelength; fiber. This common control plane promises to simplify network operation and management by automating end-to-end provisioning of connections, managing network resources, and providing the level of Quality of Service (QoS) that is expected in the new, sophisticated applications.
G.709 DIGITAL WRAPPER
The digital wrapper universally encapsulates client signals for transport across the Digital Optical Network™
• The Digital Transport Frame (DTF) is based on G.709 Optical Transport Unit (OTU) format that includes:
Trib DTF
• Facilitates SONET and SDH like maintenance operations
Line DTF
• Forward Error Correction (FEC) overhead• Facilitates SONET and SDH like maintenance
operations
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Slide-16 Transport Transparency
Slide-17 Client Signal Support
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CLIENT SIGNAL TRANSPORT TRANSPARENCYNative client signals are carried through the multiple transport layers of the Digital Transport Network with complete service transparency.
DTN CLIENT SIGNAL SUPPORT
The DTN provides client (tributary) signal support for most common signal rates and types including:
• Synchronous Optical Networks (SONET) OC-192• Synchronous Digital Hierarchy (SDH) STM-64• 10 Gigabit Ethernet (GbE) LAN• 10 Gigabit Ethernet (GbE) WAN• 10 Gigabit Clear Channel • 2.5 (2.488) Gigabit Clear Channel• SONET OC-48.• SDH STM-16• SONET OC-12• SDH STM-4• SONET OC-3• SDH STM-1• 1Gigabit Ethernet
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Slide-18 O-E-O Regeneration
Slide-19 DTN Configurations
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O-E-O REGENERATION• Full Optical-Electrical-Optical (O-E-O) 4R regeneration of every channel at every DTN
4R
• Re-amplify• Reshape• Retime• Re-FEC
The 4R is performed at the DTF level
DTN CONFIGURATIONS
• Supported configurations include: Digital Terminal (DT)
Add-Drop (AD)
Digital repeater (DR)
Note: The default configuration for a newly commissioned DTN will be Digital Optical Node (DON).
• Configuration support is based on equipment installed in the DTN, not software
• Equipment can be added in-service to change functionality and capability
• All configurations are supported using the same software load.
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Slide-20 Add/Drop Capabilities
Slide-21 Multi-Chassis Capabilities
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Page 1-17System Architecture
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ADD/DROP CAPABILITIESThe DTN provides a means for direct access to client data at wavelength (10Gbps, 2.5Gbps, and 1Gbps) granularity at any site, allowing flexible selection of whether to multiplex, add/drop, amplify, groom, or wavelength interchange individual channels.The Infinera DTN is the first Digital Optical Networking System which provides 0 to 100 percent digital add/drop and bandwidth management capabilities at every DTN.
MULTI-CHASSIS CAPABILITIES
No matter the number of individual chassis interconnected, the DTN functions, reports, and is managed as a single Network Element (NE).
• The DTN supports numerous multi-chassis configurations 2 to 10 chassis configurations are supported
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Slide-22 DTN Digital Link
Slide-23 Optical Transport Layers
Digital Link – defined as DTN to DTNSpan – fiber link between NEs
Optical Line Amplifiers used to extend the Digital Link Up to 7 Optical Line Amplifiers between DTNsInfinera’s Digital Optical Network components can recover an average of approximately (~) 26db per span for up to 8 spans
Digital LinkDigital Link
SpanSpan
8 x 26 Digital Link
Up to 7 Optical Line Amplifiers per Digital Link maximum
~26dbdrop
~26dbdrop
~26dbdrop
~26dbdrop
~26dbdrop
~26dbdrop
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Page 1-19System Architecture
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DTN DIGITAL LINK• Digital Link - Defined as DTN to DTN• Span - fiber link between network elements• Optical Line Amplifiers used to extend the digital link• Up to 7 Optical Line Amplifiers between DTNs• Infinera’s Digital Optical Network components can recover an
average of approximately(~) 26db per span for up to 8 spans
OPTICAL TRANSPORT LAYERS
There are four Optical Transport layers employed in the Digital Optical Network:
• Optical Transport Section• Optical Mux Section (C-band) (OMSb)• Optical Mux Section (OCG) (OMSa)• Optical Channel
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Slide-24 Topology Support
Slide-25 Point-to-Point Topology T
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TOPOLOGY SUPPORT• Point-to-Point Single Span
Multiple Span
• Linear Add/Drop• Hub and Spoke• Ring• Mesh
POINT-TO-POINT
The basic deployment is an un-protected point-to-point network. The point-to-point network consists of two DTNs, each configured as a Digital Terminal (DT), connecting two sites in the network.
Depending on the distance of the route, the fiber loss and the potential for customer access at intermediate sites along the route, an optimal selection of Optical Line Amplifiers and DTNs can be included in the route.
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Slide-26 Linear Add/Drop Topology
Slide-27 Hub and Spoke Topology
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Page 1-23System Architecture
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LINEAR ADD-DROPA linear add/drop network is an extension of the point-to-point network configuration. Multiple point-to-point segments are concatenated and traffic is added, dropped, or passed through at the intermediate sites.
A point-to-point network can be upgraded in-service to a linear add/drop network by populating the appropriate interfaces at the Digital Repeater (DR) site or at the Digital Terminal (DT) site.
HUB AND SPOKE
A hub and spoke network configuration is an extension of the linear add/drop network configuration where one or more linear add/drop spoke-routes junction through a single location, with traffic switched between the spoke-routes. Each add/drop spoke-route can be at an arbitrary distance, effectively extending the reach of the add/drop to the appropriate termination location.
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Slide-28 Ring Topology
Slide-29 Mesh Topology
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RINGA ring network is a special case of a linear add/drop network where two Digital Terminal nodes are replaced by a single Digital Add/Drop node. So, a digital optical ring network consists of DTNs configured to perform add/drop function and interconnected in a ring topology. As with all other network configurations, a linear add/drop network is in-service upgradeable to a ring network. Infinera’s digital optical ring network eliminates the distance limitations on ring circumference. This allows the digital optical ring to be used in metro applications and core network applications
MESH
A mesh network is a special case where there are multiple paths to every destination. As with all other network configurations, a linear add/drop network is in-service upgradeable to a mesh network.
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Slide-30 Digital SNCP Protection Capabilities
Slide-31 Dynamic GMPLS Circuit Restoration
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PROTECTION CAPABILITIESDIGITAL SUB-NETWORK CONNECTION PROTECTION (SNCP)
• Client (tributary) side protection• Physical Y-cable optical splitter• Functions like 1+1• User selectable Revertive / Non-revertive• Provisionable Wait-to-Restore period (5--12 minutes, default 5
minutes)
RESTORATION CAPABILITIES
DYNAMIC GMPLS CIRCUIT RESTORATION
• Topologies supported Linear
Ring
Mesh
• Triggers Loss of light (LOL)
Loss of signal (LOS)
Equipment failure
• Restoration activity Determines alternate path bandwidth availability
Reroutes SNCs utilizing available bandwidth
• Non-revertive
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Slide-32 Enhanced Troubleshooting Capabilities
Slide-33 Performance Monitoring Checkpoints
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ENHANCED TROUBLESHOOTING CAPABILITIES• The DTN provides industry leading troubleshooting capabilities by providing:
Numerous Performance Monitoring (PM) checkpoints
Multiple loopback insertion points
PERFORMANCE MONITORING CHECKPOINTS
• Client Optical Tx - Rx• Client Electrical (Digital) Tx - Rx• DTF Path• DTF Line• Digital Channel• Optical Channel• OCG• OSC• OTS
Note: The TEM does not provide PMs.
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Slide-34 Loopback Insertion Points
Slide-35 Redundant Control Plane
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LOOPBACK INSERTION POINTSInfinera defines a Facility Loopback as a loopback that returns to the closest fiber, and a Terminal Loopback as a loopback that faces back across equipment.
• There are 4 loopback insertion points 1 - Client Tributary Facility
2 - Client Tributary Terminal
3 - DTF Path Terminal
4 - DTF Line Facility
REDUNDANT CONTROL PLANE
• The Management Control Module (MCM-B) supports both redundant and non-redundant control plane configurations
• A redundant configuration provides protection for: Remote management
Communications
Software
Database
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Slide-36 Optical Line Amplifier Capabilities
Slide-37 Chapter Review
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OPTICAL LINE AMPLIFIER CAPABILITIES• Amplifies the combined optical signal (bidirectional)• Extends the optical reach between the DTNs• Redundant control plane• Deployed where client access is not anticipated
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Chapter Review
Photonic Integrated Circuit (PIC):
1. Integration of ___________ discrete optical components on ONE chip set.• Dramatic CapEx reductions• __________________ service anywhere• Simplify Network Architecture• Simplify Engineering and Operations
2. __________________ Dense Wavelength Division Multiplexer on one chip set.3. Enables ultra low cost ___________________________________ conversion4. Two PIC chip set features:
• Transmit PIC _______ x DWDM lasers
10 x 10G DWDM modulators
10 x lambda DWDM multiplexer
• Receive PIC 10 x 10G receivers
_______ lambda DWDM de-multiplexer
DTN capabilities:
1. _______ Gbps capacity.2. _______ Gbps capacity per chassis deployed in 100Gbps ___________ ____________ _________
(OCG) increments.3. Generalized ___________________ ________________ _________________.4. G.709 __________ ___________.5. Client signal transport _________________________.6. Signal support for:
a. __________________________________________
b. Synchronous Digital Hierarchy (SDH) STM-64
c. 10Gigabit Ethernet (GbE) _______
d. 10Gigabit Ethernet (GbE) _______
e. 10 Gigabit ___________ _______________
f. ______ (2.488) Gigabit Clear Channel
g. SONET __________
h. SDH STM ________
i. ________ OC-12
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Page 1-35System Architecture
j. _______ STM-4
k. SONET ______
l. SDH ________
m. 1Gigabit _____________
7. Optical-________________-Optical (O-_-O) regeneration on every channel.8. ______ channels at 10Gbps capacity per channel.9. __________________ capability at each DTN.10. Enhanced performance monitoring (PM) and troubleshooting capabilities11. Configurations include:
• Digital Terminal (DT).• ______________ (AD).• Digital Repeater (____).
12. Multi-Chassis Configuration
• ____________ Chassis• ____________ Chassis
13. Network Topologies
a. Point-to-Point _______________ Span
b. Point-to-Point _______________ Span
c. Linear __________________
d. ________________________
e. ________________________
Optical Line Amplifier capabilities
1. Amplifies the combined optical signal (______________)2. Extend the ______________________between the DTNs3. Optical Line Amplifiers are deployed where client access is
______________________________.
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Hardware OverviewPage 2-2
Slide-1 Hardware Overview Chapter Learning Objectives
Slide-2 DTN
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Hardware OverviewCHAPTER LEARNING OBJECTIVES
Upon successful completion of this chapter, the student should be able to:
• Describe the functions and features of the hardware modules for the DTC.
• Describe the functions and features of the hardware modules for the OTC.
DIGITAL TRANSPORT CHASSIS (DTC)
1. Functional description
a. Digital Transport Chassis (DTC)
b. Deployed as a Main Chassis or an Expansion Chassis
c. Functions as a:
• Digital Terminal (DT)• Add-Drop (AD)• Digital Repeater (DR)
d. 800Gbps bidirectional line side capacity
e. 400Gbps tributary add/drop capacity
f. Installed in a 23” rack or a 600mmx600mm European Telecommunication Standards Institute (ETSI) rack
g. Seven slot card cage
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Slide-3 DTC Components
Slide-4 Chassis
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COMPONENTS OF THE DTC• Chassis• Rack Mounting Ears• Grounding Points• Power Entry Modules (PEM)• Input/Output (I/O) Panel• Timing and Alarm Panel (TAP)• Fan Trays• AIr Filter• Card Cage
CHASSIS
The DTC Chassis is:• ANSI certified • ETSI certified• Weight - 78lbs (empty) Fans removed
Door removed
Top Cover removed
2 person lift
• 2 DTCs can be installed in standard 7’ rack
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Slide-5 Rack Mount Ears
Slide-6 Rack Grounding
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RACK MOUNTING EARSEach DTC includes front rack mounting ears as an integral part of the chassis. They are utilized to front mount the chassis in a 23” rack or 600mmx600mm ETSI rack. Separate mid-mount ears are provided to allow the chassis to mount 1”, 2”, 5”, and 6” forward from the front of the 23” rack.
GROUNDING POINTS
There are 4 grounding points
• Two on the rear of the chassis• One on each side of the chassis
Note: Although there are multiple grounding points, only one should be connected to achieve proper grounding of the DTC.
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Slide-7 PEM
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POWER ENTRY MODULES (PEM)The DTC accommodates two Power Entry Modules
PEM A on the left front
PEM B on the right front
The PEMs supply redundant power feeds to the DTC
PEMs are configured for load sharing.
Each PEM has a 70 AMP breaker for over-current protection.
The PEMs have two status Light Emitting Diodes (LED)
a. Power Input
b. Power Fault.
The LEDs indicate whether the power levels are within specified limits.
Table 1: PEM Status LEDs
TECHNICAL SPECIFICATIONS
Each PEM is dual-lugged and shielded around the faceplate permitter.
Electrical • Power Consumption 50 W
• Circuit Breaker Rating 70 A
• Operating Temperature range Normal 5C to 40 C
Short Term -5C to 55c (134f)
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Slide-8 IO Panel
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INPUT OUTPUT (I/O) PANELThe I/O panel contains the management and operations interfaces
• Two 10/100Mb auto-negotiating Data Communication Network (DCN) RJ-45 interfaces
• Two 10Mb Administrative Inter-LAN RJ-45 interfaces, labeled as AUX interface
• Chassis level alarm LEDs (Critical, Major, Minor, Power)• Bay level alarm LEDs (Critical, Major, Minor)• Four inter-chassis interconnect RJ-45 interfaces referred to as
Nodal Control and Timing • Lamp Test button• ACO button• ACO LED• Craft RS232 Modem port
Note: The DCN and AUX ports are not supported on an Expan-sion Chassis.
The I/O panel Bay level LEDs reflect the status of all chassis in a bay.
Table 2: I/O Panel Bay Level LEDs
The I/O panel Chassis level LEDs reflect the severities of the current out-standing alarms within that chassis.
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Slide-9 TAP
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Table 3: I/O Panel Chassis Level LEDsTIMING ALARM PANEL (TAP)
• The TAP provides interfaces for external timing synchronization and environmental alarm contacts.
• The TAP provides Building Integrated Timing Supply (BITS) input and output timing interfaces.
Note: External timing synchronization is not supported at this time.
The TAP also houses 20 alarm input contact-sets. Sixteen alarm input contact sets are user configurable. The rest are reserved for Bay LED and ACO inputs from Expansion Chassis(s).The TAP houses 20 alarm output contact-sets. Each output alarm contact set consists of normally-closed, normally-open and common contacts. Ten output contacts are user configurable. The rest are reserved for office alarms and Bay alarms.
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Slide-10 Fan Tray
Slide-11 Air Filter
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FAN TRAY• The DTC contains two removable fan trays - 11lbs each• Each fan tray consists of 3 individually controlled fans • The top fan tray is Fan Shelf A• The bottom fan tray is Fan Shelf B• Both fan trays are required for normal operations and are not
redundant• Each fan tray is marked with ‘This Side Up” to ensure proper
installationEach Fan Tray has two LEDs
• Power• Fault
Table 4: Fan Tray LEDs
AIR FILTER
A replacable air filter is located below the bottom fan tray to filter out dust particles at the air intake of the DTC. Air is filtered at 80% dust arrestance. Depending upon the operational environment, the air filters should be replaced at regular intervals, preferably once every 6 months.
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Slide-12 Card Cage
Slide-13 DTC Components
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CARD CAGEThe DTC contains a single card cage with seven slots that house up to eight modules.
DTC COMPONENTS
• Chassis• Rack Mount Ears• PEMs• IO Panel• TAP• Fan Tray• Air Filter• Card Cage
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Slide-14 DTC Modules
Slide-15 MCM-B
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DTC MODULES• Management Control Module (MCM)• Tributary Optical Module (TOM)• Tributary Adapter Module (TAM)• Digital Line Module (DLM)• TAM Extender Module (TEM)• Bandwidth Multiplexer Module (BMM)
MANAGEMENT CONTROL MODULE (MCM-B)
The MCM-B, is a half height module that slides into the chassis in slot 7A or slot 7B. The MCM-B is the shelf controller of all the modules resident within the DTC.The functions are:
• In a multi-chassis configuration, the MCM-B in the Main Chassis controls all the chassis within the DTN (Node Controller)
• In an Expansion Chassis, the MCM-B performs shelf controller functions controlling only the modules resident within that chassis (Shelf Controller)
• Management gateway functions to the external DCN in the Main Chassis
• Contains the software, and the database for the DTN• Can be deployed in a non-redundant (single MCM) or redundant
(Active/Standby) configuration
Note: Only MCM-Bs in a Main Chassis will maintain the data-base. MCM-Bs housed in an Expansion Chassis will not contain a database.
The MCM-Bs in the Main Chassis and Expansion Chassis are interconnected through NCT ports located on the I/O Panel.
The MCM-B supports the local craft interfaces for local management access.
For high-availability, redundant MCM-Bs can be deployed in a DTC. One MCM-B actively performs the node/shelf control functions while the other MCM-B is in the standby mode. In a multi-chassis configuration, the interconnected redundant MCM-Bs provide the inter-chassis redundancy.
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Slide-16 MCM-B
Slide-17 MCM LEDs
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Note: In a Multi-Chassis configuration, the DCN and AUX portson the I/O panel of the Main Chassis are active. The DCN and AUX ports on the I/O panel of an Expansion Chassis are disabled.
The MCM has the circuit pack status LED indicators and Craft Ethernet/Serial port connectors on the front panel
The MCM-B parameters are:
• 466Mhz processor• 1G NVS• 512 SDRAM
The MCM-B can be deployed in the below configurations
• Single Chassis• Multi-Chassis• Non-redundant
• Single MCM• Redundant
• An MCM will be installed in both 7A and 7BThe MCM-B has four circuit pack level LEDs
• Power (PWR)• Node Controller (NC)• Active (ACT)• Fault (FLT)
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Slide-18 MCM Faceplate
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Note: On the ACT MCM in the Main Chassis, the PWR, NC andACT LEDs will be solid green. On the STBY MCM the PWR LED will be solid green and the ACT LED will be solid amber. On the ACT MCM in an Expansion Chassis, the PWR and ACT LEDs will be solid green. On the STBY MCM in an Expansion Chassis, the PWR LED will be green and the ACT LED will be amber.
Table 2-1: MCM Circuit Pack Level LEDs
The MCM has Craft Ethernet and Serial Ports for management purposes.
Table 2-2: MCM Craft Connectors
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Slide-19 Tributary Optical Modules
Slide-20 TOM-10G-x
TOM-10G-SR1TOM-10G-IR2TOM-10G-LR2 – 1550nmTOM-2.5G-SR1TOM-2.5G-IR1TOM-2.5G-IR2TOM-2.5G-LR2 – 1550nmTOM-2.5GMR-IR1TOM-1G-ZX – 1550nmTOM-1G-LXTOM-1G-SX – 850nm (multimode)
All TOMs have LC connectorsProvide client signal interface Client signals are fully transparentTOMs operate at 1310nm except where otherwise noted
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TRIBUTARY OPTICAL MODULES (TOMS)All TOMs convert the client optical signals to and from a serial electrical signal. All TOMs have LC connectors. The TOMs supported are:
• TOM-10G-SR1• TOM-10G-IR2• TOM-10G-LR2A - 1550nm• TOM-2.5G-SR1• TOM-2.5G-IR1• TOM-2.5G-LR2 - 1550nm• TOM-2.5GMR-IR1• TOM-1G-ZX - 1550nm• TOM-1G-LX• TOM-1G-SX - 850nm
TOM-10G-X
Has signal support for:
• OC-192• STM64• 10G Clear channel• 10G LAN• 10G WAN
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Slide-21 TOM-2.5G-x
Slide-22 TOM-2.5GMR-x
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TOM-2.5G-XHas signal support for:
• OC-48• STM16• 2.488G Clear Channel
TOM-2.5GMR-X
Has signal support for:
• OC-48• STM16• 2.488G Clear Channel• OC-12• STM4• OC-3• STM1
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Slide-23 TOM-1G-x
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TOM-1G-XHas signal support for:
• 1G Ethernet
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Slide-24 Tributary Adapter Module
Slide-25 TAM-4-2.5G
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TRIBUTARY ADAPTER MODULES (TAMS)There are four types of TAMs
• TAM-4-2.5G• TAM-4-1G• TAM-8-1G• TAM-2-10G
All TAMs:
• Create and terminate the Trib DTF, and house TOMs
TAM-4-2.5G
The 2.5G Tributary Adapter Module, referred to as the TAM-4-2.5G, maps the client optical signals into digital signals for subsequent transmission through the DLM.
• Installed in any of the sub-slots in the DLM or TEM• Each TAM-4-2.5G has four sub-slots for Tributary Optical
Modules 2.5G (TOM-2.5G)• Maps client signals into electrical signals• Maximum capacity of 10Gbps per TAM-4-2.5G 2.5Gbps per TOM
Four TOM-2.5Gs per TAM-4-2.5G
The TAM-4-2.5G has three circuit pack level LEDs
a. Power (PWR)
b. Active (ACT)
c. Fault (FLT)
Table 3: TAM-4-2.5G Circuit Pack Level LEDs
In addition to TAM circuit pack status indicators, it houses the TOM-2.5G circuit pack LEDs:
Table 4: TOM-2.5G Port Level LEDs
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Slide-26 TAM-4-1G
Any sub-slot any DLM/TEM4 portsSupports
TOM-1G-LXTOM-1G-SXTOM-1G-ZX
Circuit pack LEDsTOM port LEDs
-- Only the faceplate labeling differentiate the TAM-4-1G from the TAM-4-2.5G.
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TAM-4-1GThe Tributary Adapter Module 1G, referred to as TAM-4-1G, maps the customer client ethernet signals into internal electrical signals for subsequent transmission through the DLM. The TAM-4-1G circuit packs can be arbitrarily equipped in any of the sub-slots located on the DLM or TEM. TAM-4-1Gs provide further sub-slots to enable the insertion of TOM’s.
TAM-4-1G supports 1GbE client interfaces. It does not support 1GbE multiplexing, rather each 1GbE client signal is mapped into a 2.5G sub-channel.
The TAM-4-1G has 3 LEDs to indicate the circuit pack status.
In addition to TAM circuit pack status indicators, the TAM-4-1G houses the TOM-1G circuit pack LEDs: ACT (Active), FLT (Fault) and LOS, one set for each TOM. The significance of an illuminated LED is described in the table below.
Table 5: TAM-4-1G status LED indicators
LED Indicator Color Meaning
PWR (Power)
Green Indicates the presence (lit) or absence (dimmed) of power supply to the TAM-4-1G circuit pack
ACT (Active)
Green / Yellow
Indicates the TAM-4-1G circuit pack status: Active or Standby
FLT (Fault) Red Indicates the presence (lit) or absence (dimmed) of an alarm on the TAM-4-1G circuit pack: Critical, Major or Minor
Table 6: TOM-1G-LX status indicators
LED Color Description
ACT (Active)
Green / Yellow
Indicates the TOM status: Active, Standby or Not provisioned
FLT (Fault) Red Indicates the presence (lit) or absence (dimmed) of a fault on the TOM
LOS Red Indicates the detection of LOS signal on the TOM
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Slide-27 TAM-8-1G
Any sub-slot any DLM/TEM8 ports
4 independent port pairs1a, 1b2a, 2b3a, 3b4a, 4b
SupportsTOM-1G-LXTOM-1G-SXTOM-1G-ZX
Circuit pack LEDsTOM port LEDs
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TRIBUTARY ADAPTER MODULE 8-1G (TAM-8-1G)The Tributary Adapter Module-8-1G, referred to as TAM-8-1G, maps the customer client ethernet signals into sub-SNC internal electrical signals for subsequent transmission through the DLM. The TAM-8-1G circuit packs can be arbitrarily equipped in any of the sub-slots located on the DLM or TEM. TAM-8-1Gs provide sub-slots equipped in 4 logical port pairs to enable the insertion of TOM’s.
TAM-8-1G supports 1GbE client interfaces. It does not support 1GbE multiplexing, rather each 1GbE client sub-SNC signal pair (1a and 1b for example) is mapped into a channelized 2.5G sub-channel.
The TAM-8-1G has 3 LEDs to indicate the circuit pack status.
In addition to TAM circuit pack status indicators, the TAM-8-1G houses the TOM-1G circuit pack LEDs: ACT (Active), FLT (Fault) and LOS, one set for each TOM. The significance of an illuminated LED is described in the table below.
Table 7: TAM-4-1G status LED indicators
LED Indicator Color Meaning
PWR (Power)
Green Indicates the presence (lit) or absence (dimmed) of power supply to the TAM-4-1G circuit pack
ACT (Active)
Green / Yellow
Indicates the TAM-4-1G circuit pack status: Active or Standby
FLT (Fault) Red Indicates the presence (lit) or absence (dimmed) of an alarm on the TAM-4-1G circuit pack: Critical, Major or Minor
Table 8: TOM-1G-LX status indicators
LED Color Description
ACT (Active)
Green / Yellow
Indicates the TOM status: Active, Standby or Not provisioned
FLT (Fault) Red Indicates the presence (lit) or absence (dimmed) of a fault on the TOM
LOS Red Indicates the detection of LOS signal on the TOM
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Slide-28 TAM-2-10G
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TRIBUTARY ADAPTER MODULE 10G (TAM-2-10G)a. Installed in any of the sub-slots in the DLM or TEM
b. Each TAM-2-10G has two sub-slots for Tributary Optical Modules 10G (TOM-10G)
c. FRU
d. Maps client signals into electrical signals
e. Maximum capacity of 20Gbps per TAM-2-10G
• 10Gbps per TOM• Two TOM-10Gs per TAM-2-10G
The TAM-2-10G has three circuit pack level LEDs
a. Power (PWR)
b. Active (ACT)
c. Fault (FLT)
Table 9: TAM-2-10G Circuit Pack Level LEDs
The TAM-2-10G has three port level indicators
a. Active (ACT)
b. Fault (FLT)
c. Loss of Signal (LOS)
Table 10: TAM-2-10G Port Level LEDs
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Slide-29 DLM
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DIGITAL LINE MODULE (DLM)The Digital Line Module (DLM-n-C1-A), performs the following functions:
• Provides add/drop or switching of 2.5Gb/s, 10Gb/s, or 1Gb/s signals between TAMs, wavelengths on the OCG uplink, and peered DLMs, and TEMs across the backplane
• Contains five subslots in order to house TAMs• TAM-2-10G• TAM-4-2.5G• TAM-4-1G• TAM-8-1G• Maps the client signals from the TAMs into the Line Digital
Transport Frame (Line DTF) that are transmitted and received from the OCG OUT and OCG IN links on each DLM
• Codes and decodes the Forward Error Correction (FEC) signal for each wavelength of the OCG transmitted through the Tx and Rx Photonic Integrated Circuits (PICs)
• Multiplexes the 10 individual wavelengths into an OCG through the Tx PIC
• De-multiplexes the OCG into 10 individual wavelengths through the RX PIC
• Optically connects to the appropriate BMM for transmission over the facility line side
The Digital Line Module (DLM-n-Cn-x), performs the following functions:
• Contains mechanical modifications to accommodate future double-height TAM
• Provides add/drop or switching of 2.5Gb/s, 10Gb/s, or 1Gb/s signals between TAMs, wavelengths on the OCG uplink, and peered DLMs, and TEMs across the backplane
• Contains subslots in order to house TAMs Double height TAM (future)
TAM-2-10G
TAM-4-2.5G
TAM-4-1G
TAM-8-1G
• Maps the client signals from the TAMs into the Digital Transport Frame (DTF) that are transmitted and received from the OCG OUT and OCG IN links on each DLM
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Slide-30 DLM Versions
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• Codes and decodes the Forward Error Correction (FEC) signal for each wavelength of the OCG transmitted through the Tx and Rx Photonic Integrated Circuits (PICs)• Multiplexes the 10 individual wavelengths into an OCG through the Tx PIC
• De-multiplexes the OCG into 10 individual wavelengths through the RX PIC
• Optically connects to the appropriate BMM for transmission over the facility line side
• Wider dispersion in order to increase distance between regeneration
DLM VERSIONS
Any version of the DLM can be equipped in slots 3 through 6.
Note: DLM versions must be mirrored on opposite ends of the digital link.
There are sixteen versions of the DLM supporting eight OCGs.
Table 11: DLM product details
Product Number Product Description
DLM-1-C1-A DLM, OCG 1, C-Band
DLM-1-C1-B DLM, OCG 1, C-Band
DLM-1-C2-A DLM, OCG 1, C-Band
DLM-2-C2-A DLM, OCG 2, C-Band
DLM-3-C1-A DLM, OCG 3, C-Band
DLM-3-C1-B DLM, OCG 3, C-Band
DLM-3-C2-A DLM, OCG 3, C-Band
DLM-4-C2-A DLM, OCG 4, C-Band
DLM-5-C1-A DLM, OCG 5, C-Band
DLM-5-C1-B DLM, OCG 5, C-Band
DLM-5-C2-A DLM, OCG 5, C-Band
DLM-6-C2-A DLM, OCG 6, C-Band
DLM-7-C1-A DLM, OCG 7, C-Band
DLM-7-C1-B DLM, OCG 7, C-Band
DLM-7-C2-A DLM, OCG 7, C-Band
DLM-8-C2-A DLM, OCG 8, C-Band
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Slide-31 DLM Connectors
Slide-32 DLM LEDs
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The DLM has two fiber connectors. The fiber connections are SC connectors.a. The DLM has Line IN and Line OUT connectors to the BMM
The DLM has three circuit pack level LEDs:
a. Power (PWR)
b. Active (ACT)
c. Fault (FLT)
Table 12: DLM Circuit Pack LEDs
The DLM has two port level LEDs:
a. Active (ACT)
b. LOS (Loss of Signal)
Table 13: DLM Port LEDs
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Optical Specifications for the DLMTable 14: DLM Optical Specifications
Type Parameter Specification
DLM-1 Frequency range OCG1 1548.915nm - 1563.455nm
Output power level -13.8dBm to -12.5dBm
DLM-2 Frequency range OCG2 1548.515nm - 1563.047nm
Output power level -13.8dBm to -12.5dBm
DLM-3 Frequency range OCG3 1548.115nm - 1562.640nm
Output power level -13.8dBm to -12.5dBm
DLM-4 Frequency range OCG4 1547.715nm - 1562.233nm
Output power level -13.8dBm to -12.5dBm
DLM-5 Frequency range OCG5 1531.507nm - 1545.720nm
Output power level -13.8dBm to -12.5dBm
DLM-6 Frequency range OCG6 1531.116nm - 1545.322nm
Output power level -13.8dBm to -12.5dBm
DLM-7 Frequency range OCG7 1530.334nm - 1544.526nm
Output power level -13.8dBm to -12.5dBm
DLM-8 Frequency range OCG8 1530.725nm - 1544.924nm
Output power level -13.8dBm to -12.5dBm
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Slide-33 TEM
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TAM EXTENDER MODULE (TEM)The TEM provides additional TAM slots for a DLM so the bandwidth of a DLM may be fully utilized. The application of a TEM is more visible for lower density TAM-4-2.5G and TAM-4-1G. A DLM populated with either TAM will not be able to utilize the complete OCG bandwidth of 100Gbs. Each TEM provides an additional five subslots for TAMs which will enable:
• Up to 100% add/drop of 2.5G traffic using TAM-4-2.5G per OCG• Up to 50% add/drop of 1GbE traffic using TAM-4-1G per OCG
Each TEM provides the following:
• Add/drop or cross-connect of 2.5Gbs, 10Gbs, or 1Gbs signals between TAMs, and corresponding DLMs across the backplane
• Contains subslots in order to house TAMs Double height TAM (future)
TAM-2-10G
TAM-4-2.5G
TAM-4-1G
TAM-8-1G
A TEM can be equipped in slots 3 through 6.
The TEM is designed to work with DLMs in corresponding slots. Valid slot combinations are listed in the table below.
Table 15: TEM, DLM valid slot combinations
DLM slot Valid TEM slot DLM slot Valid TEM slot
3 4, 5, 6a
a. TEM slots in bold are indirect slot configurations where a cross-connect takes two hops between DLM and TEM.
5 3, 4, 6
4 3, 5, 6 6 3, 4, 5
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Slide-34 TEM LEDs
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Circuit Pack Level LEDsThe TEM has 3 LEDs to indicate the circuit pack status. The significance of an illuminated LED is described in the table below.
Table 16: TEM status LED indicators
LED Indicator Color Meaning
PWR (Power) Green Indicates the presence (lit) or absence (dimmed) of power supply to the TEM
ACT (Active) Green / Amber Indicates the circuit pack status: Solid green (Active), blinking amber (In maintenance state), and dimmed (Locked state)
FLT (Fault) Red Indicates the presence (lit) or absence (dimmed) of an alarm on the circuit pack: Critical, Major or Minor
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Slide-35 BMM
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BAND MUX MODULE (BMM)There are 9 different BMM types that provide Optical Carrier Group (OCG) multiplexing/de-multiplexing, EDFA gain, and with/without mid-stage access. Which type of BMM will be deployed is dependent on the span loss on the transmit (TX) side.
BMM FUNCTIONAL DESCRIPTION
There is a set of BMMs that supports four OCGs in the C band with L band expansion capable.
There is another set of BMMs that supports four OCGs in the C band but with no L band expansion. These are currently at the -A revision but have the same functions as the -B version of the BMM-4-Cn.
A BMM performs the following functions:
Optically multiplexes up to 8 10x10Gb DWDM channels from the DLMs, known as Optical Carrier Groups (OCGs), onto the line side facility
OCGs 1-8can be optically multiplexed by the BMM
Optically de-multiplexes the OCGs from the line side facility into 10x10Gb DWDM channels, and passes them to local DLMs
OCGs 1-8 can be optically de-multiplexed by the BMM
Provides optical insertion and extraction of the 1510nm Optical Supervisory Channel by using a 1510nm optical filter
Optically amplifies the multiplexed transmitted and received OCG signals by using either an optical booster or a pre-amplifier
Provides a C/L-band splitter to support an in-service expansion of the system to enable optical transmission in the L-band (in some versions)
Provides the following Optical Spectrum Analyzer (OSA) ports for test purposes:
OSA port for the aggregate line input
OSA port for the receive EDFA output
OSA port for the aggregate line output
Provides sub-slot access for the OWM (future provision)
Accommodates mid-stage access Dispersion Compensation Fiber (DCF) (in some versions)
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Slide-36 BMM Versions
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Table 17: BMM Versions
Product Number Product Description
BMM-4-C1-B BMM, C/L band, supports span losses from 0 to 20 dB, with VOA, without mid-stage access, supports OCGs 1,3,5,and 7
BMM-4-CX1-A BMM, C band, supports span losses from 0 to 21 dB, with VOA, without mid-stage access, supports OCGs 1,3,5,and 7
BMM-8-CXH1-A BMM, high power, C band, supports span losses from 0 to 20 dB, with VOA, without mid-stage access, sup-ports OCGs 1-8
BMM-4-C2-MS-B BMM, C/L band, supports span losses from 19 dB to 26 dB, with mid-stage access, supports OCGs 1,3,5,and 7
BMM-4-CX2-MS-A BMM, C band, supports span losses from 20 dB to 27.5 dB, with mid-stage access, supports OCGs 1,3,5,and 7
BMM-8-CXH2-MS-A BMM, high power, C band, supports span losses from 19 dB to 26.5 dB, with mid-stage access, supports OCGs 1-8
BMM-4-C3-MS-B BMM, C/L band, supports span losses from 25 dB to 34 dB, with mid-stage access, supports OCGs 1,3,5,and 7
BMM-4-CX3-MS-A BMM, C band, supports span losses from 26 dB to 34 dB, with mid-stage access, supports OCGs 1,3,5,and 7
BMM-8-CXH3-MS-A BMM, high power, C band, supports span losses from 25 dB to 34 dB, with mid-stage access, supports OCGs 1-8
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Slide-37 BMM LEDs
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:The gain ranges for the different BMM types are listed belowBMM LEDS
The BMM has three circuit pack level LEDs to indicate the circuit pack status
• Power (PWR)• Active (ACT)• Fault (FLT)
Table 18: BMM Circuit Pack Level LEDs
The BMM has two port level LEDs to indicate the status of the combined optical signal
• Active (ACT)• Loss of Signal (LOS)
Table 19: BMM Line Connector LEDs
BMM Type BMM Span Loss Range (dB)
C1 0-20
CX1 0-21
CXH1 0-20
C2 19-26
CX2 20-27.5
CXH2 19-26.5
C3 25-34
CX3 26-34
CXH3 25-34
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Slide-38 BMM Connectors
Slide-39 BMM OCG Connectors
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BMM CONNECTORSThe BMM has many fiber connectors. All the fiber connections are SC connectors.
• Line connectors• Optical Spectrum Analyzer (OSA) monitor connector for line input
and output• OSA monitor port for facility output• L-Band connectors (not present on all BMMs)• Dispersion Compensation Module (DCM) connectors (not present
on all BMMs)• OCG 1 connectors• OCG 2 connectors• OCG 3 connectors• OCG 4 connectors• OCG 5 connectors• OCG 6 connectors• OCG 7 connectors• OCG 8 connectors
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Slide-40 BMM Optical Specifications
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BMM OPTICAL SPECIFICATIONS40 Channel BMM (Cn and CXn versions)• Line Side Optics Wavelength spacing
• 100GHZ Wavelength frequency range
• 1530.725-1563.455nm ITU grid80 Channel BMM (Cn and CXn versions)
• Line Side Optics Wavelength spacing
• 50GHZ Wavelength frequency range
• 1530.334-1563.455nm ITU grid
OSC (all versions)• Optical Supervisory Channel Wavelength
• 1510 nm Format
• OC-3 Throughput
• 100Mbps.
Blank Circuit PacksWhenever a circuit pack is removed, the blank space must be occupied by the corresponding blank circuit pack. Blank circuit packs serve three important functions:
Prevents exposure to hazardous voltage and currents inside the chassis
Contains any electromagnetic interference (EMI) that might dam-age other equipment
Directs the flow of cooling air through the chassis.
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Figure 1-41. DTC and Components
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DTC AND COMPONENTS• DTC• Modules MCM
TOM
TAM
DLM
TEM
BMM
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Slide-42 Optical Transport Chassis
Slide-43 OTC Components
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OPTICAL TRANSPORT CHASSIS• Functional Description Optical Transport Chassis (OTC)
Bi-directional in-line amplifier used to extend the optical reach of the DTN
Deployed where client access is not anticipated
Note: The OTC does not support multi-chassis configuration(s).
OTC COMPONENTS
• Rack Mount• Grounding• PEM• IAP• Fan Tray• Air Filter• Card Cage
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Slide-44 OTC Chassis
Slide-45 Rack Mount
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OTC CHASSIS• Weight ~ 50lbs - empty Front Cover removed
Fans removed
• ANSI compliant• ETSI compliant
Rack MountEach OTC includes front rack mounting ears as an integral part of the chassis. They are utilized to front mount the chassis in a 23” rack or 600mmx600mm ETSI rack. Separate mid-mount ears are provided to allow the chassis to mount 1”, 2”, 5”, and 6” forward from the front of the 23” rack.
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Slide-46 OTC Grounding
Slide-47 OTC PEM
Four grounding pointsRight rearLeft rearEach Side
Although there are multiple grounding points, only one should be connected to achieve proper grounding of the OTC
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GROUNDING POINTSThere are 4 grounding points
• Two on the rear of the chassis• One on each side of the chassis
Note: Although there are multiple grounding points, only one should be connected to achieve proper grounding of the OTC.
POWER ENTRY MODULE (PEM)
• Each OTC is equipped with 2 PEMs• PEM A is located on the front left• PEM B is located on the front right• PEMs supply redundant power to the OTC
Note: PEMs require a third party PDU with 10 AMP fuses per PEM.
• PEMs are configured for load sharingTechnical SpecificationsEach PEM is dual-lugged and shielded around the faceplate permitter.Electrical
• Power Consumption 20 W
• Input voltage range -40 to -60 VDC
• Operating Temperature Range Normal 5C to 40 C
Short Term -5C to 55c
PEM LEDS
The PEM has two status LEDs• Power Input• Power Fault
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Figure 1-48. I/O Alarm Panel Face Plate
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I/O Alarm Panel (IAP)The I/O Alarm panel contains the management and operations interfaces plus environmental alarm input/output contacts
• Two 10/100Mb auto-negotiating Data Communication Network (DCN) RJ-45 interfaces
• Two 10Mb Administrative Inter-LAN RJ-45 interfaces, labeled as AUX interface.
• Chassis level alarm LEDs (Critical, Major, Minor, Power)• Bay level alarm LEDs (Critical, Major, Minor)• Four inter-chassis interconnect RJ-45 interfaces referred to as Nodal
Control and Timing • Lamp Test button• ACO button• ACO LED• Craft RS232 Modem port
Note: The OTC does not support multi-chassis configuration(s). The Nodal Control and Timing RJ-45 ports are disabled on all OTCs.
The I/O Alarm panel Chassis level LEDs reflect the severities of the cur-rent outstanding alarms within the chassis.
ALARM INPUT CONTACTS
There are 20 alarm input contacts. One Alarm contact is pre-defined and the nineteen other are user configurable alarm contacts. The user configurable alarm contacts are useful for generation of customized alarms which can be triggered remotely through the network management system.
ALARM OUTPUT CONTACTS
There are 20 alarm output contacts. Ten alarm contacts are pre-defined in the system and the ten other contacts user configurable. The ten user configurable contacts can be used to monitor the environmental alarms.
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Slide-49 Fan Trays
Slide-50 Air Filter
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Fan TrayThe OTC contains two removable fan trays, one on the left and one on the right. Each fan tray consists of an individually controlled fan.• The left fan tray is Fan Shelf A• The right fan tray is Fan Shelf B.• Both fan trays are required for normal operations and are notredundant.
Each Fan Tray has two LEDs
a. Power
b. Fault
Air FilterAn air filter is located beside the right fan tray (Fan B) to filter out dust par-ticles at the air intake of the OTC. Air is filtered at 80% dust arrestance. Depending upon the operational environment, the air filter should be replaced at regular intervals, preferably once every 6 months.
Card CageThe OTC contains a single card cage that has three slots.
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Figure 1-51. OTC and Components
Slide-52 OTC Modules
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OTC ComponentsRack Mounting Ears
IAP
PEMs
Fan Trays
Air Filter
Card Cage
OTC Modules
1. Optical Management Module (OMM)2. Optical Amplifier Module (OAM)
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Slide-53 OMM
Slide-54 OMM LEDs
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Optical Management Module (OMM)a. Installed in slot 1A or 1Bb. Half height module
c. Shelf controller for all modules in the OTC
d. Each OTC must have one OMM
e. Supports redundant and non-redundant configurations
f. Contains the network element software and database
g. OMM supports the local craft interfaces for local management access
h. May be deployed in a redundant or non-redundant configuration
The OMM has four circuit pack level LEDs
a. Power (PWR)
b. Node Controller (NC)
c. Active (ACT)
d. Fault (FLT)
Note: The OTC does not support multi-chassis configuration(s). Thus, the Node Controller LED should be green (lit).
The OMM has Craft Ethernet and Craft Serial Ports for management purposes.
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Slide-55 OMM Faceplate
Slide-56 OAM
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OMM FaceplateEjector
RS232 Serial port
Ethernet port
LEDs
Optical Amplifier Module (OAM)
There are 9 different OAM types providing different EDFA gain and with/without mid-stage access. Which OAM will be deployed is dependent on the span loss on the transmit (TX) side.
OAM Functional Description
The OAM can be equipped in slot 2 and/or 3 of the OTC.
Note: Two OAMs are required in an OTC to perform bi-direc-tional optical amplification.
There is a set of OAMs that amplifies in the C band with L band expansion capable.
There is another set of OAMs that amplifies in the C band but with no L band expansion. These are currently at the -A revision but have the same functions as the -B version of the OAM-Cn.
An OAM performs the following functions:
Provides optical insertion and extraction of the 1510nm Optical Supervisory Channel by using a 1510nm optical filter
Optically amplifies the multiplexed transmitted and received signals by using either an optical booster or a pre-amplifier
Provides a C/L-band splitter to support an in-service expansion of the system to enable optical transmission in the L-band (in some versions)
Provides Optical Spectrum Analyzer (OSA) ports for test purposes:
Provides sub-slot access for the OWM (future provision)
Accommodates mid-stage access Dispersion Compensation Fiber (DCF) (in some versions)
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Slide-57 OAM Versions
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The gain ranges for the different OAM types are listed below:OAM Type OAM Module Gain Range (dB)
C1 0-20
C2 19-26
CX2, CXH2 19-26.5
C3 25-30
CX3, CXH3 25-30.5
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Slide-58 OAM LEDs
Slide-59 OAM Port LEDs
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Circuit Pack Level LEDsThe OAM has three LEDs to indicate the circuit pack status.PWR
ACT
FLT
Port IndicatorsThere are two LEDs:
ACTIVE and LOS to indicate the line port status
LOS to indicate the OSC port status
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Slide-60 OAM Connectors
Slide-61 Optical Line Amplifier and Components
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OAM ConnectorsLine
DCM (some versions)
-L-Band (Cn versions only)
OSC
OSA monitor ports
Optical Line Amplifier and Components
Rack Mounting Ears
PEMs
IAP
Fan Trays
Air filter
OMM
OAM
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Slide-62 Dispersion Management Chassis
Slide-63 Dispersion Compensation Modules
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Dispersion Management Chassis (DMC)
FUNCTIONAL DESCRIPTION
The DMC comprises of a chassis and Dispersion Compensation Modules (DCM)• It can be installed in a 23” rack as front mount and 1”, 2”, 5” and 6”
mid-mount or 600mmx600mm ETSI rack.• It accommodates up to 2 DCMs
Dispersion Compensation Module (DCM)
The Dispersion Compensation Module, referred to as DCM, is a pluggable module that slides into the Dispersion Management Chassis.• It houses Dispersion Compensation Fiber.• Supports 19 types of negative DCMs, ranging from 100 ps/nm to
1900 ps/nm in 100 ps/nm increments• Supports three types of positive DCMs, ranging from 100 ps/nm to
300 ps/nm.
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Slide-64 DTC Review
Slide-65 OTC Review
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DTC ReviewDTC HARDWARE
Rack Mounting Ears
PEMs
I/O panel
Fan Trays
Air Filter
Card cage
DTC MODULES
MCM
TOM
TAM
DLM
TEM
BMM
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Chapter Review
DTN CHASSIS
1. Functional description
a. Digital Transport Chassis (DTC)
b. Deployed as a _____________ Chassis or an __________________ chassis
c. Functions as a:
• Digital ____________(___)• __________________(___)• Digital ________________(DR)
d. ____________ bidirectional line side capacity
e. _________________________ drop capacity
f. Installed in a 23” rack or a 600mmx600mm European Telecommunication Standards Institute (ETSI) rack
g. _____________slot card cage
COMPONENTS OF THE DTC
1. Rack Mounting Ears
2. _____________ grounding points3. Two ____________________________(___)
4. Input Output (I/O) PanelThe I/O panel contains the ____________________________and operations interfaces
• _______ 10/100Mb auto-negotiating Data Communication Network (DCN) RJ-45 interfaces• Two 10Mb Administrative Inter-LAN RJ-45 interfaces, labeled as ________ interface. • Chassis level alarm LEDs (_____________________________________________)• Bay level alarm LEDs (Critical, Major, Minor)• Four inter-chassis interconnect RJ-45 interfaces referred to as Nodal Control and Timing • Lamp Test button• ACO button• ACO LED• Craft RS232 Modem port
5. Timing Alarm Panel (TAP)• The TAP provides interfaces for __________________________synchronization and
__________________________________________ alarm contacts.• The TAP provides ___________________________________ timing interfaces.• ___________________________________ is not supported in Release 1.0.LT
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6. Fan Tray • The DTC contains ____________ removable fan trays. • Each fan tray consists of ________________ individually controlledfans. • The top fan tray is Fan Shelf A• The bottom tray is Fan Shelf B.• Both fan trays are ______________________for normal operations
and are not redundant.
Each Fan Tray has two LEDs
a. Power
b. _________________________
7. Air Filter
8. Card CageThe DTC contains a single card cage that has ______________________slots.
MANAGEMENT CONTROL MODULE (MCM)
a. Installed in slot ________________________________________
b. Half height module
c. Field Replaceable Unit (FRU)
d. Shelf controller for all modules in the DTC
e. Each DTC __________________________________________ MCM
f. Contains the _________________________ and ___________________
g. MCM supports the local craft interfaces for local management access.
BAND MULTIPLEXING MODULE (BMM)
a. Installed in slot ______________________________
b. FRU
c. Optically multiplexes the 10x10Gb DWDM channels, known as __________________________________(_____), onto the line side facility
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d. Optically _________________________ the ____________into 10x10Gb DWDM channels.
e. Provides optical insertion and extraction of the 1510nm ________________________________________
f. Provides optical access points for power monitors or optical spectrum analyzers.
g. Accommodates mid-stage access_________________________________ in 9 versions of BMM
h. Provides sub-slot access for the Order Wire Module (OWM) circuit pack
i. There are _____ different BMM types providing different ______ gain and with/without _________________________________________ (for DCM)
DIGITAL LINE MODULE (DLM)
a. Up to _____________________DLMs can be in one DTC
b. Installed in slot _______________________and or _____________
c. FRU
d. Provides _____________ or ______________________ of client signals
e. Slots for up to _________Tributary Adapter Modules (TAM) or TAM blanks
f. Codes and Decodes the ______________________________________ for each lambda of the OCG
g. Maps and multiplexes the client signals from the TAM into the ______________________________________
h. Optically connects to the __________for transmitting the OCG on the facility line side
i. There are _____________versions of DLMs
TRIBUTARY ADAPTER MODULE 10G (TAM-10G)
a. Installed in any of the sub-slots in the DLM/TEM
b. Each TAM has __________sub-slots for TOM)-10G
c. FRU
d. Maps client signals into __________________signals
e. Maximum capacity of _______________________
• _______________ per TOM-10G• _____________ TOMs per TAM
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TAM-4-2.5Ga. Installed in any of the sub-slots in the DLM/_____
b. Each TAM has __________sub-slots for TOM-2.5G
c. FRU
d. Maximum capacity of _______________________
• _______________ per TOM• _____________ TOMs per TAM
TAM-4-1G
a. Installed in any of the sub-slots in the _____/______
b. Each TAM has __________sub-slots for TOM-1G-LX
c. FRU
d. Maximum capacity of _______________________
• _______________ per TOM• _____________ TOMs per TAM
TOM-10G
a. List two versions of the TOM-10G
• ________________• ________________
b. Hot-pluggable into any TAM_______ sub-slot
c. _____________ connectors
d. Converts client signals to and from a _________________________ signal
e. FRU
The TOM-10G tributary interface supports
a. SONET OC-192
b. ______________________________
c. 10G _________________ ___________________
d. 10GbE LAN
e. ____________________________________
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TOM-2.5G
a. List two versions of the TOM-2.5G
• ________________• ________________
b. Hot-pluggable into any TAM_______ sub-slot
c. _____________ connectors
d. Converts client signals to and from a _________________________ signal
e. FRU
The TOM-2.5G tributary interface supports
a. SONET OC-______
b. ______________________________
TOM-1G-X
a. Hot-pluggable into any TAM_______ sub-slot
b. _____________ connectors
c. Converts client signals to and from a _________________________ signal
d. FRU
The TOM-1G-x tributary interface supports
a. ______
OPTICAL TRANSPORT CHASSIS
1. Functional Description
a. Optical Transport Chassis (OTC)
b. Bidirectional in-line amplifier used to _______________________________of the DTN
c. Deployed where client access is _________________________________
d. Installed in a 23” rack or a 600mmx600mm European Telecommunication Standards Institute (ETSI) rack
Components of the OTC
1. Rack Mounting Ears2. __________ grounding points
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3. Two ____________________________(___)4. I/O Alarm PanelThe I/O Alarm panel contains the ________________________ and operations interfaces and _______________________________ alarm input and output contacts ________ 10/100Mb auto-negotiating Data Communication
Network (DCN) RJ-45 interfaces
Two 10Mb Administrative Inter-LAN RJ-45 interfaces, labeled as _____ interface.
Chassis level alarm LEDs (Critical, Major, Minor, Power)
Bay level alarm LEDs (Critical, Major, Minor)
_________ inter-chassis interconnect RJ-45 interfaces referred to as Nodal Control and Timing
Lamp Test button
ACO button
ACO LED
Craft RS232 Modem port
5. Fan TrayThe OTC contains ______ removable fan trays, one on the left and one on the right. Each fan tray consists of an __________________________________ controlled fan.
The __________________________ fan tray is Fan Shelf A
The ______________________________________ tray is Fan Shelf B.
Both fan trays are _______________________ for normal operations and are not redundant.
Each Fan Tray has two LEDs
a. Power
b. Fault
6. Air Filter
7. Card CageThe OTC contains a single card cage that has three slots.
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OPTICAL MANAGEMENT MODULE (OMM)
a. Installed in slot _____or _____
b. Half height module
c. Shelf ________________________________ for all modules in the OTC
d. Each OTC _______________________________ one OMM
e. Contains the ____________________________ and database
f. OMM supports the local craft interfaces for local management access.
OPTICAL AMPLIFIER MODULE (OAM)
a. Performs ____________________ in-line optical amplification of the incoming signal
b. Provides optical insertion and extraction of the 1510nm Optical Service Channel using a 1510nm optical filter
c. Optically __________________ the multiplexed transmitted and received OCG signals by using either an optical booster or a pre-amplifier
d. Provides a C/L-band splitter to enable an in-service expansion of the system to enable optical transmission in the L-band
e. Provides optical access points for power monitors or optical spectrum analyzers.
f. Accommodates ____________________________ Dispersion Compensation Fiber (DCF) in 6 versions of OAM
g. Provides sub-slot access for the Order Wire Module (OWM) circuit pack
h. ______ OAMs are required in a OTC to perform optical amplification in both directions.
DISPERSION MANAGEMENT CHASSIS (DMC)
FUNCTIONAL DESCRIPTION
The DMC comprises of a chassis and _______________________________________• It can be installed in a 23” rack as front mount and 1”, 2”, 5” and 6” mid-mount or 600mmx600mm ETSI
rack.• It accommodates up to _____ DCMs
DISPERSION COMPENSATION MODULE (DCM)
The Dispersion Compensation Module, referred to as DCM, is a pluggable module that slides into the Dispersion Management Chassis.
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• It houses Dispersion Compensation Fiber.• Supports ________ types of negative DCMs, ranging from 100 ps/nmto 1900 ps/nm in 100 ps/nm increments• Supports ________ types of positive DCMs, ranging from 100 ps/nm
to 300 ps/nm.
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Theory Of OperationsCHAPTER LEARNING OBJECTIVES
Upon successful completion of this chapter, the student should be able to:
• Describe the power feeds for the Infinera DTN• Describe the vertical cooling method used in the Infinera DTN• Describe the functions of the control plane• List the components of the control plane for the DTC and the OTC• List the components of the data plane for the DTC.• Describe the system architectures for the DTC and the OTC
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Slide-105 Power and Cooling
Slide-106 Control Plane Network Level
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Power -48V dual feedsAutomated power shutdown for under voltage condition
The DTN will attempt an automatic restart when voltage goes above -40V
The DTN breakers will trip when the applied power exceeds -72V or 70A requiring a manual reset of the breakers
Cooling
The DTN implements a vertical push pull cooling method
Control Plane
The Control Plane is a logical partition of the DTN system at both the network and node level. At a very broad level, the control plane provides:
• The ability to locally or remotely provision (configure) the network element in accordance with a specific customer application
• Performance and fault monitoring, the ability to accumulate performance statistics, and the ability to locally or remotely access the collected information
Control Plane Network Level
The Optical Supervisory Channel (OSC) provides inter-node connectivity within the network. The OSC occupies a dedicated OC3 1510NM wavelength for each span between network elements. Each network element, consisting of any combination of DTCs or an OTC is required to terminate the OSC. Management access to network elements from external systems may be provided by direct connection to those systems or through an external switched or routed Data Communications Network (DCN) infrastructure. External access is provided using the DCN ports on the network element. Additional Auxiliary ports (AUX) are provided for communications between customer end-systems. From a hardware standpoint, the AUX and DCN ports simply provide external access to the inter-network element and intra-network element Ethernet/IP infrastructure.
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Slide-107 Components of the DTN Control Plane
Slide-108 Functions of the DTN Control Plane
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Components of the DTC Control PlaneThe DTN Control Plane is made up of the MCM, TEM, DLM, and BMM modules along with the backplane
All of the connections are provided by fixed backplane interconnect. There are Ethernet switches located on each MCM and each BMM. The MCM switch provides both layer 2 switching (including address learning) and layer 3 forwarding. The layer 3 forwarding tables must be explicitly configured by the MCM processor. The switch is capable of switching and layer 3 forwarding between any combination of attached interfaces. The switch located on the BMM provides only switching (including address learning) at layer 2. Its function is to allow access to the MCM switch for the OSC. VLAN tags are passed transparently by this switch. All of the intra-chassis links shown are full-duplex, 100 Mbps Ethernet
The Control Plane links performance monitoring, provisioning, and alarm monitoring signals between the modules in slots 1-6 and the MCM
Functions of the DTC Control Plane
Is the internal communications bus within the DTN
Operates on an internal LAN within the DTN
Carries IP messaging traffic across the backplane between the MCM(s) and line modules including OSC
Provides a path for module software downloads
Provides a path for PM and Alarm retrieval and reporting
Provides a path for provisioning commands
.
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Slide-109 DTN Control Plane Block Diagram
Slide-110 DTN Redundant Control PLane
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DTN Control Plane Block DiagramThe MCM switch/router is responsible for routing all internal and external communications
The BMM switch forwards communications sent and received over the OSC Multi-Chassis Interconnect Interfaces
DTN Redundant Control Pane
The DTN redundant control plane employs an active and standby MCM
In the event the active MCM fails, the standby MCM will reboot and reestablish internal and external communications
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Slide-111 Redundant Main Non-redundant Expansion
Slide-112 Redundant Main and Redundant Expansion
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Redundant Main and Non-redundant on the ExpansionThe MCM in an Expansion Chassis communicates with the active MCM in the Main Chassis through the Nodal Control and Timing (NCT) Ethernet cables
The MCM in an Expansion Chassis does not maintain a copy of the database
Note: The DCN and AUX ports on an Expansion Chassis are dis-abled.
Redundant Main and Redundant on the Expansion
The active MCM in an Expansion Chassis communicates with the active MCM in the Main Chassis through the Nodal Control and Timing (NCT) Ethernet cables.
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Slide-113 NCT Cable Configurations
Slide-114 3 Chassis NCT Configuration
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NCT Cable ConfigurationsFor 3 to10 Chassis configurations with Main Chassis Redundancy, and non-redundant on all Expansion Chassis.
The recommended NCT port connections for a DTC system with control redundancy only at the Main Chassis. This mixed-redundancy configuration exhibits the following failure impacts:
If the active MCM fails on the Main Chassis, an activity switch to the standby MCM occurs. In this case, all other chassis are still avail-able and reachable from the Main Chassis.
A MCM fault of the Expansion Chassis isolates that chassis from the rest of the node and it will be unreachable.
3 Chassis NCT Configuration / Redundant Main Non-Redundant Expansion Chassis
Chassis 1 NCT2B to Chassis 2 NCT1A
Chassis 2 NCT2A to Chassis 3 NCT1A
Chassis 3 NCT2A to Chassis 1 NCT1A
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Slide-115 4-10 Chassis NCT Configuration
Slide-116 Optical Line Amplifier Control Plane Components
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4-10 Chassis NCT Configuration / Redundant Main Non-Redundant Expansion ChassisChassis 1 NCT2B to Chassis 2 NCT1A
Chassis 2 NCT2A to Chassis 3 NCT1A
Chassis 3 NCT2A to Chassis 4 NCT1A
Chassis 4 NCT2A to Chassis 1 NCT1A
Note: Continue the “Daisy Chain” connections for up to 10 chas-sis.
Optical Line Amplifier Control Plane Components
The Optical Line Amplifier Control Plane is made up of the OMM and OAM modules along with the backplane
The Control Plane links performance monitoring, provisioning, and alarm monitoring signals between the OAMs in slots 2-3 and the OMM
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Slide-117 Functions of the Optical Line Amplifier Control Plane
Slide-118 Optical Line Amplifier Control Plane
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Functions of the Optical Line Amplifier Control PlaneIs the internal communications bus within the OTC
Operates on an internal LAN within the OTC
Carries IP messaging traffic across the backplane between the OMM(s) and line modules including OSC
Provides a path for module software downloads
Provides a path for PM and Alarm retrieval and reporting
Optical Line Amplifier Control Plane
The OMM switch/router is responsible for routing all internal and external communications
The OAM switch forwards communications sent and received over the OSC
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Slide-119 Optical Line Amplifier Redundant Control PLane
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Optical Line Amplifier Redundant Control PlaneThe Optical Line Amplifier redundant control plane employs an active and standby OMM
In the event the active OMM fails, the standby OMM will reboot and reestablish internal and external communications
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Slide-120 DTN Data Plane
Slide-121 DTN System Data Plane TOM
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DTN Data PlaneThe DTN Data Plane is utilized to route Digital Transport Frames (DTFs) across the backplane between DLM/TEM Crosspoints.
The backplane pins for the data plane are located in slots 3, 4, 5, and 6 where cross-connects can be provisioned.
DTN System Data Plane Architecture TOM
Tributary Optical Module –TOM•
Receive –The incoming signal is converted from optical to electrical
Transmit -The outgoing signal is converted from electrical to optical
Note: Both digital and optical performance monitoring statistics are collected.
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Slide-122 DTN System Data Plane Architecture TAM
Slide-123 DTN System Data Plane Architecture Crosspoint
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DTN System data Plane Architecture TAM The incoming signal from the TOM is wrapped in the Trib DTF andperformance data is collected.
The outgoing signal to the TOM is stripped of the Trib DTF and per-formance data is collected.
DTN System data Plane Architecture Crosspoint
A Local DLM Route DTF will pass straight through to the Cross-point to the Mapper or TAM in 2.5G segments.
A DTF to or from an alternate DLM or TEM will be routed across the backplane to the appropriate DLM/TEM Crosspoint and forwarded to the Mapper or TAM in 2.5G segments.
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Slide-124 DLM Mapper
Slide-125 DLM Photonic Integrated Chip (PIC) Transmit
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DLM MapperThe DLM Mapper codes, decodes, and applies the Forward Error Correction algorithm at the DTF level
The DTF is then forwarded to the PIC or Crosspoint
DTF and FEC performance monitoring statistics are collected
DLM PIC Transmit
The DLM PIC converts the 10G Digital Channel signal from the Mapper from electrical (digital) to a ITU DWDM optical wavelength channel
The ten 10G wavelength channels are multiplexed onto a common optical path as a 100G Optical Carrier Group (OCG)
Both digital and optical performance monitoring statistics are col-lected
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Slide-126 DLM PIC Receive
Slide-127 BMM Transmit
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DLM PIC ReceiveThe DLM PIC demultiplexes the 100G OCG into ten 10G Optical Channels (OCh).
Each OCh is applied to the appropriate receiver that converts the OCh to a 10G Digital Channel.
Both digital and optical performance monitoring statistics are col-lected.
BMM Transmit
The BMM combines the eight OCGs onto a common optical path creating a 800G C Band signal.
The C Band signal is amplified by an Erbium Doped Fiber Amplifier (EDFA), the OC3 Optical Supervisory Channel (OSC) is added cre-ating the Optical Transport Signal (OTS), performance monitoring statistics are collected, and the signal is sent to the Line Out.
Both optical and digital OSC performance monitoring statistics are collected.
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Slide-128 BMM Receive
Slide-129 Add Drop Connection
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BMM Receive The 800G OTS is received at the Line In, the OC3 Optical Supervi-
sory Channel (OSC) is removed, dispersion compensation may be applied, and the C Band signal is amplified by an Erbium Doped Fiber Amplifier (EDFA).
The BMM then demultiplexes the C Band signal into eight 100G OCGs and each is sent to the appropriate OCG connector.•Both optical and digital OSC performance monitoring statistics are col-lected.
Add Drop Connection
Add/Drop Connection –Drop Direction
The 800G OTS is received at the Line In, the OSC is stripped and sent to the MCM for processing, the C Band signal is amplified by EDFA, the BMM then demultiplexes the C Band signal into eight 100G OCGs and each is sent through the appropriate OCG con-nector to the DLM
On the DLM, the PIC converts the signal from optical to electrical, the Mapper decodes and applies FEC, and then the signal is routed by the Crosspoint to the provisioned outbound DLM/TEM where the signal from the Crosspoint is sent to the provisioned TAM
On the TAM the DTF is stripped and the signal is routed to the appropriate TOM
On the TOM the signal is converted from electrical to optical and sent to the client.
Note: Add/Drop Connection –Add Direction- The flow described above is reversed
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Slide-130 Express Connection
Slide-131 Hairpin Connection
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Express ConnectionThe 800G OTS is received at the Line In, the C Band is amplified by EDFA, the BMM then demultiplexes the eight 100G OCGs and each is sent to the appropriate OCG connector.
On the DLM, the PIC converts the signal from optical to electrical, the Mapper decodes and applies FEC, and then the signal is routed by the Crosspoint to the outbound DLM
On the outbound DLM the signal comes in from the Crosspoint to the Mapper, new FEC is coded and read into the DTF, then the PIC converts the signal from electrical to optical and multiplexes the OChs into the OCG
The BMM combines the eight OCGs onto a common optical path creating the 800G C Band signal
The C Band signal is amplified by the EDFA, the OSC is added, and the OTS is sent to the Line Out
Hairpin Connection
On the TOM the signal from the client is converted from optical to electrical and sent to the TAM
On the TAM the client signal is wrapped in the DTF and sent to the DLM/TEM
On the DLM/TEM, the signal is routed by the Crosspoint to the pro-visioned outbound DLM/TEM where the signal from the Crosspoint is sent to the provisioned TAM
On the TAM the DTF is stripped and the signal is routed to the appropriate TOM
On the TOM the signal is converted from electrical to optical and sent to the client
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Slide-132 Channelized SNC
Slide-133 Digital Terminal
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Channelized SNCChannelized cross-connects, and channelized SNCs, associations, and sub-SNCs supported by the TAM-8-1G, which maps two 1GbE circuits to a single 2.5G DTF
Digital Terminal Configuration
Optical transport capacity deployable in OCG increments
Client access capacity deployed using individually pluggable TEMs, TAMs and subtending TOMs
There is no Express Traffic at a Terminal configuration
A Digital Terminal configuration terminates the incoming line side traffic and hands off the traffic to the customer equipment. The DTN can termi-nate up to 400Gbps per chassis by populating the client side interfaces as and when needed, using TAMs and TOMs.
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Slide-134 Digital Repeater
Slide-135 Digital Add Drop
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NOTES:
Digital RepeaterDigital Repeater function deployed in OCG increments
Up to 200Gbps in each fiber direction per chassis
Paired DLM’s with expressed backplane capacity
Per-channel PM & fault monitoring
There is no Add/Drop traffic at a Repeater configuration
Digital Add Drop
Add/Drop function provides per-channel manageability
Full per-channel O-E-O function with PM & fault monitoring
Deployed as DLM/TEMs with dynamically configurable switching
Adjacent slot grooming prevents channel blocking
DLM/TEM to TOM(s) provide service termination & payload moni-toring
Add/Drop, Hairpin, and Express connection capability
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Slide-136 System Data Pane Architecture
Slide-137 Multi-Chassis Configurations
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NOTES:
System Data Plane ArchitectureHairpin
Express
Add Drop
Multi-Chassis Configurations
Combining up to 24 DLMs and 6 BMMs across 10 chassis provides the user with virtually limitless possible configuration variations and directional support.
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Slide-138 Optical Line Amplifier Signal Flow
Slide-139 Optical Line Amplifier Configuration
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Optical Line Amplifier Signal Flow
Each Optical Amplifier Module (OAM) is a unidirectional amplifier
One OAM amplifies the Eastbound OTS signal
One OAM amplifies the Westbound OTS signal
The combined effect is bi-directional amplification of both East and Westbound OTS signals
Note: Signal flow through an Optical Line Amplifier is unidirec-tional.
Optical Line Amplifier Configuration
The Eastbound OTS signal arrives at the IN port, the OSC is stripped off and sent to the OMM for processing, the C Band signal is amplified by the EDFA, then new OSC is coupled onto the C Band, and the combined OTS signal is sent out Eastbound through the Out port.
The Westbound OTS signal arrives at the IN port, the OSC is stripped off and sent to the OMM for processing, the C Band signal is amplified by the EDFA, then new OSC is coupled onto the C Band, and the combined OTS signal is sent out Westbound through the Out port.
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Slide-140 Review
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Chapter ReviewTheory of Operations
Power and Cooling
Control Plane
Data Plane Architecture
System Configurations
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Chapter Review1. Power: ______________ redundant feeds2. Cooling: Vertical ____________ _________________ cooling3. Control Plane
a. Functions:
• The ability to locally or remotely ________________ (configure) the NE in accordance with a specific customer application
• _____________________ and ________________ monitoring, the ability to accumulate _________________________ statistics, and the ability to locally or remotely access the collected information
b. Components
• DTC: _________, BMM, __________• OTC: _____________, ______________
4. System Data Plane Architecture components
a. DTC: ___________, TAM, __________, ________________, ______________________
5. System Configuration
a. Digital _______________________
b. Digital Repeater
c. Digital ______________________________
d. Optical Line Amplifier
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Software OverviewChapter Learning Objectives
Upon successful completion of this chapter, the student should be able to:
• List the functions and features of the software available for the DTN/Optical Line Amplifier
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Slide-142 Graphical Node Manager
Slide-143 Accessing graphical Node Manager
G raph ica l N ode M anager
B row ser launched Java app lica tion (cache m anager)
F au lt M an agem entC onfigura tio n M anagem entS erv ice P rov is ion in gP erfo rm ance M on ito r in gS ecurity M anagem ent
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Infinera Graphical Node Manager (GNM)Infinera GNM is a node-level element management application that provides users with on-site access and control of Infinera DTNs and Infinera Optical Line Amplifiers.
GNM provides browser-based Java application (cache manager): Fault Management
Configuration Management
Service Provisioning
Performance Management
Security Management
Accessing Graphical Node Manager
Open a supported browser
• Internet Explorer• Netscape• Mozilla
Type the target network element DCN or craft IP address in the address bar
Note: The craft port may require the use of a crossover cable.
The Java applet initiates and JAR files are downloaded
• The following Java 2 Runtime Environments are supported
• JRE 1.4.2_04• JRE 1.4.2_06• JRE 1.4.2_09• JRE 1.4.2_10• JRE 1.5.0_04• JRE 1.5.0_05• JRE 1.5.0_06
Login screen will appear
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Slide-144 Login Screens
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Initial Login• Default Username - secadmin• Default password - Infinera1• Click Login
Note: Usernames and passwords are case sensitive.
Security message is displayed
• Click OK to continue
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Slide-145 Change Password
Slide-146 GNM Main View
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Changing PasswordsChange password on initial login or if password expires:
• Type current password• Type new password• Confirm new password• Click Apply
Note: Password must be alphanumeric and 6 to 10 characters long.
GNM Main View
On a successful login to the target network element, the GNM Main View is displayed.The GNM Main View provides access to:
a. Equipment
b. Facilities
c. Tools used to control and monitor the target network element
d. Graphical representation of the network element
GNM Main View
a. Main Menu
b. Equipment Tree
c. Equipment View
d. Workspace Area
e. Quick View Browser
f. Alarm Manager
g. Status Bar
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Slide-147 File and Fault management Menus
Slide-148 Configuration Menu
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Infinera GNM Interface ComponentsFile Menu
Contains the drop-down menus.
a. Exit
Fault management
Contains the drop-down menus.
a. Alarm Manager
b. Event Log
c. Export all Alarms to file
d. Export all Events to file
e. Export Current View of Alarms to File
f. Export Current View of Events to File
g. Alarm Severity Profile Settings
Configuration
Contains the drop-down menus.
a. Network Element
b. Create Chassis
c. Create Protection group
d. Equipment Manager
e. Facility Manager
f. Protection Group Manager
g. Link Manager
h. Back Plane Link Manager
i. Static Route Manager
j. Default Templates
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Slide-149 Provisioning
Slide-150 Security
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ProvisioningContains the drop-down menus.
a. Cross-Connect Manager
b. Circuit Manager
c. Create Cross-Connect
d. Create Circuit
Security
Contains the drop-down menus.
a. Change Password
b. NE Security Administration
c. Active User Sessions
d. NE-Wide Security Settings
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Slide-151 Tools Window and Help Menus
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ToolsContains the following drop down menus
a. SW-DB Manager
b. SW-DB Upload Download Manager
c. PM Upload Scheduler
d. Connectivity Verification Tools
e. TL-1 Session
f. View
Window
Contains the following drop down menus
a. Cascade
b. Node
Help
Contains the following drop down menus
a. Contents
b. Technical Support
c. About
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Slide-152 BMM Drop Down Menu
Slide-153
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The user can right click on any module to access associated drop down menusBMM Menu
a. Properties
b. Show Alarms
c. Show Facilities
d. Admin State
e. Alarm Reporting
f. Delete
g. Reset
h. GMPLS Link
i. OSC
j. Span
k. Optical Carrier Group
l. Connectivity Verification Tools
DLM Menu
a. Properties
b. Show Alarms
c. Show Facilities
d. Protection Group Manager
e. Admin State
f. Alarm Reporting
g. Delete
h. Reset
i. Provisioning
j. Optical Carrier Group
k. Optical Channels
l. Line DTF Path
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Slide-154 MCM Menu
Slide-155 TOM Menu
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MCM Menua. Properties
b. Show Alarms
c. Admin State
d. Alarm Reporting
e. Delete
f. Reset
g. Switch over
h. Make Standby
TOM Menu
a. Properties
b. Show Alarms
c. Show Facilities
d. Protection Group Manager
e. Admin State
f. Alarm Reporting
g. Delete
h. Provisioning
i. Trib DTF Path
j. Trib Port
k. Client trib termination point
l. Create Protection group
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Slide-156 Quick View Browser
Slide-157 Equipment Tree
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Quick View BrowserThe Quick View Browser provides summary information about the equipment last selected in the Equipment Tree or the Equipment View.
Equipment Tree
The Equipment Tree provides a hierarchical view of all the equipment contained within the target network element. The Equipment Tree also lists all other nodes in the same signaling domain through the Network Neighborhood.
The Equipment Tree displays a tree structure of the following:
a. Current Network Element View
• The Current Network Element View displays the target network element and it’s sub-equipment. It lists the network element’s chassis and other contained equipment in hierarchical format.
b. Network Neighborhood View
• The Network Neighborhood View lists the network elements within the same signaling domain of the target network element.
When the user selects an item in the Equipment Tree, it is highlighted in the Equipment View by a black outline. Right-clicking an item displays a shortcut menu.
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Slide-158 GNM Help
Slide-159 Online Troubleshooting Assistance
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NOTES:
GNM HelpContext sensitive
Search Capable
Print capable
GNM User Guide and Maintenance and Troubleshooting Guide
Access from any screen
GNM Online Troubleshooting Assistance
Double click an alarm or right click and alarm and select Details
Click Troubleshoot
Associated alarm clearing procedure is displayed
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Slide-160 Infinera DNA
Slide-161 DNA Components
Browser launched Java application (cache manager)
Fault ManagementEquipment ConfigurationService ProvisioningPerformance MonitoringSecurity Administration
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Infinera Digital Network Administrator (DNA)The Infinera DNA is a scalable, robust, carrier class element management application based on ITU-T TMN and Telcordia standards.
Infinera DNA provides browser based Java application (cache manager):
a. Fault Management
b. Configuration Management
c. Service Provisioning
d. Performance Management
e. Security Management
DNA provides advanced features:
a. Network wide real-time fault management and monitoring, including current alarm summary, historical event logs, and threshold crossing alerts
b. Physical and Provisioning topological views, topology updates, auto-discovery and network synchronization
c. Network equipment inventory reporting with comprehensive manufacturing information
d. Scheduling network element configuration backup and manual restoration
e. Historical performance monitoring collection, archiving and viewing
The DNA has the following two main components:
a. DNA Server
b. DNA Client
DNA supports Operations, Administration, Maintenance and Provisioning (OAM&P) functions.
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Slide-162 DNA Main View
Slide-163 DNA Views
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DNA Main ViewOn a successful login to the DNA Client, the DNA Main View is displayed. The DNA Main View displays a graphical representation of the network and provides a access to the following:
a. Main Menu
b. Equipment Tree
c. Workspace Area
d. Quick View Browser
e. Alarm Manager
f. Status Bar
DNA Views
Topographical View
Provisioning View
Physical View
Quick View Browser
Equipment Tree
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Slide-164 Digital Link and Channel Map Viewers
Slide-165 TL1 Interface
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Channel Map and Digital Link ViewerDNA provides exceptional span analysis and performance monitoring tools with the Channel Map Viewer and Digital Link Viewer.
TL1 Interface
Transaction Language 1 (TL1) is an industry-recognized common language protocol for messages exchanged between network elements and an Operating System (OS). The TL1 Interface uses the common language protocol to eliminate the need to support vendor-specific interfaces.
The TL1 Interface on the network element allows an operations system to perform the following functions:
a. Fault Management
b. Equipment Configuration
c. Service Provisioning
d. Performance Monitoring
e. Security Administration
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Chapter Review INFINERA GRAPHICAL NODE MANAGER (GNM) OVERVIEW
Infinera GNM is a ____________________element management application that provides users with on-site access and control of Infinera DTN Digital Nodes (DTN) and Infinera Optical Line Amplifiers (Optical Line Amplifier).
GNM INTERFACE COMPONENTS
1. Main Menu2. Equipment Tree3. ______________________________ View4. Workplace Area5. __________________________ Browser6. Alarm Manager7. ____________________________________
INFINERA DNA INTERFACE COMPONENTS
1. Main Menu2. Equipment Tree3. _______________________________________________4. Quickview Browser5. Status Bar
TL1 INTERFACE
The TL1 Interface on the network element allows operations system to perform the following functions:
a. Fault Management
b. ________________________ Configuration
c. Service Provisioning
d. ____________________________ Monitoring
e. Security Administration
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Appendix A
Acronyms
Table A-1 List of Acronyms
Abbreviation Description
AACLI application command line interface
ACO alarm cutoff
ACT active
AD add/drop
ADM add/drop multiplexer
ADPCM adaptive differential pulse code modulation
AGC automatic gain control
AID access identifier
AINS administrative inservice
AIS alarm indication signal
ALS automatic laser shutdown
AMP amplifier
ANSI American National Standards Institute
AO autonomous output
APD avalanche photo diode
API application programming interface
APS automatic protection switching
ARC alarm reporting control
ARP address resolution protocol
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ASAP alarm severity assignment profile
ASE amplified spontaneous emission
ASIC application-specific integrated circuit
ATM asynchronous transfer mode
AU administrative unit
AUX auxiliary port
AWG array waveguide gating
AWG american wire gauge
BBDFB battery distribution fuse bay
BDI backward defect indication
BDI backward defect indication
BEI backward error indication
BER bit error rate
BERT bit error rate testing
BGA ball grid array
BIP-8 bit interleaved parity
BITS building-integrated timing supply
BLSR bi-directional line switched ring
BMM-C Band Mux Module - C band
BNC Bayonet Niell-Concelman; British Naval Connector
BOL beginning of life
BOM bill of material
BOOTP bootstrap protocol
bps bits per second
BPV bipolar violations
CC Celsius
CCITT Consultative Committee on International Telegraph and Telephone
CCLI commissioning command line interface
CDE chromatic dispersion equalizer
CDR clock and data recovery
CDRH Center for Devices and Radiological Health
Table A-1 List of Acronyms
Abbreviation Description
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CFR code for federal regulations
CH/Ch/ch channel
CID circuit identifier
CIT craft interface terminal
CLEI common language equipment identifier
CLI command line interface
CO central office
CODEC coder and decoder
COM communication
CORBA common object request broker architecture
CPC common processor complex
CPE customer premises equipment
CPLD complex programmable logic device
CPU central processing unit
CRC cyclic redundancy check
CSPF constraint-based shortest path first algorithm
CSV comma separated value
CTAG correlation tag
CTP channel termination point
CTTP client tributary termination point
CTS clear to send
CV coding violation
CV-L coding violation-line
CV-P coding violation-path
CV-S coding violation-section
DDA digital amplifier
DAWN Digital Amplified Wavelength Network
dB decibel
DB database
DCC data communications channel
DCE data communications equipment
DCF dispersion compensation fiber
DCM dispersion compensation module
Table A-1 List of Acronyms
Abbreviation Description
Infinera Proprietary and Confidential Release 3.0 Product OverviewInfinera Corporation
Page A-4Page A-4
DCN data communication network
DEMUX de-multiplexing
DFB distributed feedback
DFE decision feedback equalizer
DGE dynamic gain equalization
DHCP dynamic host configuration protocol
DLM digital line module
DMC dispersion management chassis
DPG datapath protection group
DR digital repeater
DSF dispersion shifted fiber
DT digital terminal
DTC digital transport chassis
DTE data terminal equipment
DTF digital transport frame
DTL digital transport line
DTMF dual tone multi frequency
DTP digital transport path
DTS digital transport section
DWDM dense wavelength division multiplexing
EEDFA erbium doped fiber amplifier
EEPROM electrically-erasable programmable read only memory
EMC electromagnetic compatibility
EMI electro-magnetic interference
EMS element management system
EOL end-of-life
ESD electrostatic discharge; electrostatic-sensitive device
ES-L line-errored seconds
ES-P path-errored seconds
ES-S section-errored seconds
ETS IEEE european test symposium
ETSI European Telecommunications Standards Institute
Table A-1 List of Acronyms
Abbreviation Description
Infinera CorporationRelease 3.0 Product Overview Infinera Proprietary and Confidential
Page A-5
FF fahrenheit
FA frame alignment
FAS frame alignment signal
FC fiber channel; failure count
FCAPS fault management, configuration management, accounting, performance monitor-ing, and security administration
FCC Federal Communications Commission (USA)
FDA Food and Drug Administration
FDI forward defect indication
FEC forward error correction
FIFO first-in-first-out
FIT failure in time
FLT fault
FPGA field programmable gate array
FRU field replaceable unit
FTP file transfer protocol
GGbE gigabit ethernet
Gbps gigabits per second
GCC general communication channel
GFP general framing protocol
GHz gigahertz
GMPLS generalized multi protocol label switching
GNE gateway network element
GNM graphical node manager
GUI graphical user interface
H/IHTML hypertext markup language
HTTP hypertext transfer protocol
IAP input, output and alarm panel
ICG invalid code group
ID identification
Table A-1 List of Acronyms
Abbreviation Description
Infinera Proprietary and Confidential Release 3.0 Product OverviewInfinera Corporation
Page A-6Page A-6
IDF invalid data flag
IEC International Electrical Commission
I/O Input/Output
IOP input output panel
IP Internet protocol
IQ see IQ NOS
IQ NOS Infinera IQ network operating system
IR intermediate reach
IS in-service
ITU-T International Telecommunications Union - Telecommunications
J/K/LJabber Jabber is the transmission of a packet on a computer network that is larger than the
network's MTU
JDK Java Development Kit
JRE Java Runtime Environment
JS jabber seconds
LAN local area network
LBC laser bias current
LC fiber optic cable connector type
LCK locked
LED light-emitting diode
Linear ADM linear add/drop multiplexer
LOF loss of frame
LOL loss of light
LOP loss of pointer
LOS loss of signal
LR long reach
LSB least significant bit
LTE line-terminating equipment
LVDS low voltage differential signaling
MMA monitoring access
MAC media access control
MB megabyte
Table A-1 List of Acronyms
Abbreviation Description
Infinera CorporationRelease 3.0 Product Overview Infinera Proprietary and Confidential
Page A-7
Mb/s megabits per second
MIB management information base
MCM management and control module
MEMS micro electro mechanical systems
MFAS multi frame alignment signal
MIB management information base
MMF multimode fiber
MS multiplex section
MSA multi source agreement
MSB most significant bit
MSOH multiplex section overhead
MTBF mean time between failure
MTU maximum transmission unit
MX multiplex, multiplexer, multiplexing
NNA network administrator
NAND flash type
NC normally closed; node controller
NCC node controller chassis
NCT nodal control and timing
NDSF non zero dispersion shifted fiber
NE network engineer
NEBS network equipment building system
NECG net electrical coding gain
NEPA national fire protection association
NJO negative justification opportunity
nm nanometer
NML network management layer
NMS network management system
NNI network-to-network interface
NO normally open
NSA non-service affecting
NTP network time protocol
NVRAM nonvolatile random access memory
Table A-1 List of Acronyms
Abbreviation Description
Infinera Proprietary and Confidential Release 3.0 Product OverviewInfinera Corporation
Page A-8Page A-8
OOAM optical amplification module
OAM&P operation, administration, maintenance and provisioning
OC-12 optical carrier signal at 622.08 mb/s
OC-192 optical carrier signal at 9.95328 gb/s
OC-3 optical carrier signal at 155.52 mb/s
OC-48 optical carrier signal at 2.48832 gb/s
OCG optical carrier group
Och Optical channel
OCI open connection indication
ODU optical channel data unit
OEO optical-electrical-optical conversion
OFC open fiber control
OH overhead
OIF optical internetworking forum
OLA optical line amplifier
OMM optical management module
OMS optical multiplex section
OOS out-of-service
OOS-MT out-of-service maintenance
OPR optical power received
OPT optical power transmitted
OPU optical channel payload unit
ORL optical return loss
OS operating system
OSA optical spectrum analyzer
OSC optical supervisory channel
OSNR optical signal-to-noise ratio
OSPF open shortest path first
OSS operations support system
OTC optical transport chassis
OTDR optical time domain reflectometer
OTN optical transport network
OTS optical transport section
Table A-1 List of Acronyms
Abbreviation Description
Infinera CorporationRelease 3.0 Product Overview Infinera Proprietary and Confidential
Page A-9
OTU optical channel transport unit
OW orderwire
OWM orderwire module
P/QPC personal computer
PCPM per channel power monitoring
PDU protocol data unit; power distribution unit
PEM power entry module
PF partial failure
PG protection group
PHY physical
PIC photonic integrated circuit
PID protocol identifier
PIN positive-intrinsic negative
PJO positive justification opportunity
PLD programmable logic device
PLL phase locked loop
PM performance monitoring
PMD polarization mode dispersion
POH path overhead
POP point-of-presence
PPM part per million
PPP point-to-point protocol
PR provisioning
PRBS pseudo random binary sequence
ps pico second (unit of measure for dispersion)
PSC protection switch completion; protection switch count
PSD protection switch duration
PSTN public switched telephone network
PT parallel telemetry
PTP physical termination point; point-to-point
PWR power
QOS quality of service
Table A-1 List of Acronyms
Abbreviation Description
Infinera Proprietary and Confidential Release 3.0 Product OverviewInfinera Corporation
Page A-10Page A-10
RRAM random access memory
RDI remote defect indication
REI-L remote error indication-line
REI-P remote error indication-path
RFI remote failure indication
ROM read-only memory
RS regenerator section; reed solomon
RSOH regenerator section overhead
RTC real time clock
RTN return lead
RTS ready to send
RU rack unit
Rx receiver; receive
Rx Q receiver quality
SSA service affecting; security administrator
SAPI source access point identifier
SC square shaped fiber optic cable connector
SD signal degrade
SDH synchronous digital hierarchy
SDRAM synchronized dynamic random access memory
SEF severely errored frame
SEFS severely errored frame second
SELV safety extra low voltage
SERDES serializer and deserializer
SES severely errored seconds
SF signal fail
SFP small form factor plug
SID source identifier; system identifier
SMF single-mode fiber
SML service management layer
SNC subnetwork connection
Table A-1 List of Acronyms
Abbreviation Description
Infinera CorporationRelease 3.0 Product Overview Infinera Proprietary and Confidential
Page A-11
SNCP subnetwork connection protection
SNE subtending network element
SNMP simple network management protocol
SNR signal-to-noise ratio
SOH section overhead
SOL start of life
SONET synchronous optical network
SPE synchronous payload envelope
SQ signal quality
SR short reach
SSH Secure Shell
SSHv2 Secure Shell version 2
SSL secure sockets layer
STE section terminating equipment
STM synchronous transfer mode
STM-1 SDH signal at 155.52 Mb/s
STM-16 SDH signal at 2.48832 Gb/s
STM-4 SDH signal at 622.08 Mb/s
STM-64 SDH signal at 10 Gb/s
STM-n synchronous transport module of level n (for example, STM-64, STM-16)
STS synchronous transport signal
STS-n synchronous transport signal of level n (for example, STS-12, STS-48)
SW software
T/U/VTAM tributary adapter module
TAP timing and alarm panel
TCA Threshold Crossing Alert
TCP transmission control protocol
TE traffic engineering
TEC thermo-electric cooler
TEM TAM Extender Module
TERM terminal
TFTP trivial file transfer protocol
TID target identifier
Table A-1 List of Acronyms
Abbreviation Description
Infinera Proprietary and Confidential Release 3.0 Product OverviewInfinera Corporation
Page A-12Page A-12
TIM trace identifier mismatch
TL1 transaction language 1
TMN telecommunications management network
TOM tributary optical module
TP termination point
TR transceiver
TT test and turn-up
TTI trail trace identifier
Tx Transmitter; Transmit
UA unavailable seconds
UART universal asynchronous receiver transmitter
UAS unavailable seconds
UAS-L unavailable seconds, near-end line
UAS-P unavailable seconds, near-end STS path
UDP user datagram protocol
UPSR unidirectional path switched ring
URL universal resource locator
UTC Coordinated Universal Time
V volt
VGA variable gain amplifier
VLAN virtual local area network
VOA variable optical attenuator
VPN virtual private network
VSR very short reach
W/X/Y/ZWAN wide area network
WDM wavelength division multiplexing
XC cross-connect
XFP name of a small form factor 10 Gbps optical transceiver
XML extensible markup language
MISC1R re-amplification
2R re-amplification, re-shape
Table A-1 List of Acronyms
Abbreviation Description
Infinera CorporationRelease 3.0 Product Overview Infinera Proprietary and Confidential
Page A-13
3R re-amplification, re-shape, re-time
4R re-amplification, re-shape, re-time, re-code
Table A-1 List of Acronyms
Abbreviation Description
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Infinera CorporationRelease 3.0 Product Overview Infinera Proprietary and Confidential