PXT2222A - Nexperia · PXT2222A oixTiCPny9•9F;.:9SwwCPNhr(Ci(iCtia Nexperia PXT2222A NPN switching transistors All information provided in this document is subject to legal disclaimers

PXT2222ANPN switching transistors2 April 2014 Product data sheet

1. General descriptionNPN switching transistor in a medium power flat lead SOT89 (SC-62/TO-243) Surface-Mounted Device (SMD) plastic package.

PNP complement: PXT2907A

2. Features and benefits• High current: max. 600 mA• Low voltage: max. 40 V

3. Applications• Switching and linear amplification

4. Quick reference dataTable 1. Quick reference dataSymbol Parameter Conditions Min Typ Max Unit

VCEO collector-emittervoltage

open base - - 40 V

IC collector current - - 600 mA

hFE DC current gain VCE = 10 V; IC = 150 mA; Tamb = 25 °C;δ ≤ 0.02; tp ≤ 300 µs; pulsed

100 - 300

5. Pinning informationTable 2. Pinning informationPin Symbol Description Simplified outline Graphic symbol

1 E emitter

2 C collector

3 B base3 2 1

SOT89 sym123

C

E

B

© Nexperia B.V. 2017. All rights reserved

Nexperia PXT2222ANPN switching transistors

PXT2222A All information provided in this document is subject to legal disclaimers.

Product data sheet 2 April 2014 2 / 15

6. Ordering informationTable 3. Ordering information

PackageType number

Name Description Version

PXT2222A SOT89 plastic surface-mounted package; die pad for good heat transfer;3 leads

SOT89

7. MarkingTable 4. Marking codesType number Marking code

[1]

PXT2222A %1P

[1] % = placeholder for manufacturing site code

8. Limiting valuesTable 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit

VCBO collector-base voltage open emitter - 60 V

VCEO collector-emitter voltage open base - 40 V

VEBO emitter-base voltage open collector - 6 V

IC collector current - 600 mA

ICM peak collector current - 800 mA

IBM peak base current

tp ≤ 1 ms; single pulse

- 200 mA

[1] - 0.5 W

[2] - 0.8 W

Ptot total power dissipation Tamb ≤ 25 °C

[3] - 1.1 W

Tj junction temperature - 150 °C

Tamb ambient temperature -65 150 °C

Tstg storage temperature -65 150 °C

[1] Transistor mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standardfootprint.

[2] Transistor mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm2.[3] Transistor mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2.





Tamb (°C)- 75 17512525 75- 25

006aaa238

800

400

1200

1600

Ptot(mW)

0

(1)

(2)

(3)

(1) FR4 PCB; 6 cm2 mounting pad for collector.

(2) FR4 PCB; 1 cm2 mounting pad for collector.(3) FR4 PCB; standard footprint.

Fig. 1. Power derating curves

9. Thermal characteristicsTable 6. Thermal characteristicsSymbol Parameter Conditions Min Typ Max Unit

[1] - - 250 K/W

[2] - - 156 K/W

Rth(j-a) thermal resistancefrom junction toambient

in free air

[3] - - 113 K/W

Rth(j-sp) thermal resistancefrom junction to solderpoint

- - 30 K/W

[1] Transistor mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[2] Transistor mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm2.[3] Transistor mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2.





006aaa235

10-5 1010-210-4 10210-1tp (s)

10-3 1031

102

10

103

Zth(K/W)

1

duty cycle = 1

0.750.5

0.330.2

0.10.05

0.02

0.010

Mounted on FR4 PCB; standard footprint.

Fig. 2. Transient thermal impedance as a function of pulse time; typical values006aaa236

10-5 1010-210-4 10210-1tp (s)

10-3 1031

102

10

103

Zth(K/W)

1

duty cycle = 1

0.750.5

0.330.2

0.10.05

0.02

0.010

Mounted on FR4 PCB; mounting pad for collector 1 cm2.

Fig. 3. Transient thermal impedance as a function of pulse time; typical values





006aaa237

10-5 1010-210-4 10210-1tp (s)

10-3 1031

102

10

103

Zth(K/W)

1

duty cycle = 1

0.750.5

0.33

0.2

0.1 0.05

0.02

0.010

Mounted on FR4 PCB; mounting pad for collector 6 cm2.

Fig. 4. Transient thermal impedance as a function of pulse time; typical values





10. CharacteristicsTable 7. CharacteristicsSymbol Parameter Conditions Min Typ Max Unit

VCB = 60 V; IE = 0 A; Tamb = 25 °C - - 10 nAICBO collector-base cut-offcurrent VCB = 60 V; IE = 0 A; Tj = 125 °C - - 10 µA

IEBO emitter-base cut-offcurrent

VEB = 5 V; IC = 0 A; Tamb = 25 °C - - 10 nA

VCE = 10 V; IC = 0.1 mA; Tamb = 25 °C 35 - -

VCE = 10 V; IC = 1 mA; Tamb = 25 °C 50 - -

VCE = 10 V; IC = 10 mA; Tamb = 25 °C 75 - -

VCE = 10 V; IC = 10 mA; Tj = -55 °C 35 - -

VCE = 1 V; IC = 150 mA; tp ≤ 300 µs;δ ≤ 0.02; Tamb = 25 °C; pulsed

50 - -


100 - 300

hFE DC current gain


40 - -

IC = 150 mA; IB = 15 mA; Tamb = 25 °C - - 300 mVVCEsat collector-emittersaturation voltage IC = 500 mA; IB = 50 mA; Tamb = 25 °C - - 1 V

IC = 150 mA; IB = 15 mA; Tamb = 25 °C 0.6 - 1.2 VVBEsat base-emitter saturationvoltage IC = 500 mA; IB = 50 mA; Tamb = 25 °C - - 2 V

td delay time - - 15 ns

tr rise time - - 20 ns

ton turn-on time - - 35 ns

ts storage time - - 200 ns

tf fall time - - 60 ns

toff turn-off time

IC = 150 mA; IBon = 15 mA;IBoff = -15 mA; Tamb = 25 °C

- - 250 ns

CC collector capacitance VCB = 10 V; IE = 0 A; ie = 0 A;f = 1 MHz; Tamb = 25 °C

- - 8 pF

CE emitter capacitance VEB = 500 mV; IC = 0 A; ic = 0 A;f = 1 MHz; Tamb = 25 °C

- - 25 pF

fT transition frequency VCE = 10 V; IC = 20 mA; f = 100 MHz;Tamb = 25 °C

300 - - MHz

NF noise figure VCE = 5 V; IC = 200 µA; RS = 2 kΩ;f = 1 kHz; B = 200 Hz; Tamb = 25 °C

- - 4 dB





aaa-011462

200

400

600

hFE

0

IC (mA)10-1 1031021 10

(1)

(2)

(3)

VCE = 10 V(1) Tamb = 150 °C(2) Tamb = 25 °C(3) Tamb = −55 °C

Fig. 5. DC current gain as a function of collectorcurrent; typical values

VCE (V)0 1084 62

aaa-011463

0.4

0.2

0.6

0.8

IC(A)

0

IB = 13 mA

1.3

2.6

3.9

5.26.5

7.89.111.7

10.4

Tamb = 25 °C

Fig. 6. Collector current as a function of collector-emitter voltage; typical values

aaa-011464

0.4

0.8

1.2

VBE(V)

0

IC (mA)10-1 1031021 10

(1)

(2)

(3)

VCE = 1 V(1) Tamb = −55 °C(2) Tamb = 25 °C(3) Tamb = 150 °C

Fig. 7. Base-emitter voltage as a function of collectorcurrent; typical values

aaa-011465

0.6

0.8

0.4

1.0

1.2VBEsat

(V)

0.2

IC (mA)10-1 1031021 10

(1)

(2)

(3)

IC/IB = 10(1) Tamb = −55 °C(2) Tamb = 25 °C(3) Tamb = 150 °C

Fig. 8. Base-emitter saturation voltage as a function ofcollector current; typical values





aaa-011466

IC (mA)10-1 1031021 10

10-1

1

VCEsat(V)

10-2

(1)

(2)

(3)

IC/IB = 10(1) Tamb = 150 °C(2) Tamb = 25 °C(3) Tamb = −55 °C

Fig. 9. Collector-emitter saturation voltage as a function of collector current; typical values





11. Test information

006aaa003

IBon (100 %)

IB

input pulse(idealized waveform)

IBoff

90 %

10 %

IC (100 %)

IC

tdton

90 %

10 %

tr

output pulse(idealized waveform)

tf

t

tstoff

Fig. 10. BISS transistor switching time definition

RC

R2

R1

DUT

mlb826

Vo

RB(probe)450 Ω

(probe)450 Ω

oscilloscope oscilloscope

VBB

VI

VCC

Fig. 11. Test circuit for switching times





12. Package outline

06-08-29Dimensions in mm

4.64.41.81.4

1.61.4

1.20.8

31.5

0.480.35

0.440.23

0.530.40

2.62.4 4.25

3.75

1 2 3

Fig. 12. Package outline SOT89

13. Soldering

solder lands

solder resist

occupied area

solder paste

sot089_fr

1.21.9

2

2.25

4.75

1(3×)

0.7(3×)

0.6(3×)

1.1(2×)

1.2

0.85 0.2

0.5

1.7

4.85

3.95

4.6

1.51.5

Dimensions in mm

Fig. 13. Reflow soldering footprint for SOT89





solder lands

solder resist

occupied area

preferred transport direction during soldering

sot089_fw

0.7

5.3

6.6

2.4

3.5

0.5

1.8(2×)

1.5(2×)

7.6

1.9 1.9

Dimensions in mm

Fig. 14. Wave soldering footprint for SOT89





14. Revision historyTable 8. Revision historyData sheet ID Release date Data sheet status Change notice Supersedes

PXT2222A v.5 20140402 Product data sheet - PXT2222A v.4

Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.• General description: updated.• Quick refernce data: added.• Thermal characteristics: Figure 2 to 4 updated.• Limiting values: values of IC, ICM and IBM parameters corrected.• Characteristics: Figures 5 to 9 added.• Soldering information: added.• Legal information: updated.

PXT2222A v.4 20041122 Product specification - PXT2222A v.3



PXT2222A v.1 19940901 Product specification - -





15. Legal information

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Productstatus [3]

Definition

Objective[short] datasheet

Development This document contains data fromthe objective specification for productdevelopment.

Preliminary[short] datasheet

Qualification This document contains data from thepreliminary specification.

Product[short] datasheet

Production This document contains the productspecification.

[1] Please consult the most recently issued document before initiating orcompleting a design.

[2] The term 'short data sheet' is explained in section "Definitions".[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nexperia.com.

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Short data sheet — A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet isintended for quick reference only and should not be relied upon to containdetailed and full information. For detailed and full information see therelevant full data sheet, which is available on request via the local Nexperiasales office. In case of any inconsistency or conflict with theshort data sheet, the full data sheet shall prevail.

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Quick reference data — The Quick reference data is an extract of theproduct data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes norepresentation or warranty that such applications will be suitable for thespecified use without further testing or modification.

Customers are responsible for the design and operation of theirapplications and products using Nexperia products, and Nexperiaaccepts no liability for any assistance with applications orcustomer product design. It is customer’s sole responsibility to determinewhether the Nexperia product is suitable and fit for thecustomer’s applications and products planned, as well as for the plannedapplication and use of customer’s third party customer(s). Customers shouldprovide appropriate design and operating safeguards to minimize the risksassociated with their applications and products.

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Limiting values — Stress above one or more limiting values (as defined inthe Absolute Maximum Ratings System of IEC 60134) will cause permanentdamage to the device. Limiting values are stress ratings only and (proper)operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant orrepeated exposure to limiting values will permanently and irreversibly affectthe quality and reliability of the device.

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In the event that customer uses the product for design-in and use inautomotive applications to automotive specifications and standards,customer (a) shall use the product without Nexperia’s warrantyof the product for such automotive applications, use and specifications, and(b) whenever customer uses the product for automotive applications beyondNexperia’s specifications such use shall be solely at customer’sown risk, and (c) customer fully indemnifies Nexperia for anyliability, damages or failed product claims resulting from customer design anduse of the product for automotive applications beyond Nexperia’sstandard warranty and Nexperia’s product specifications.

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15.4 TrademarksNotice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.





16. Contents1 General description ............................................... 12 Features and benefits ............................................13 Applications ........................................................... 14 Quick reference data ............................................. 15 Pinning information ...............................................16 Ordering information .............................................27 Marking ................................................................... 28 Limiting values .......................................................29 Thermal characteristics .........................................310 Characteristics .......................................................611 Test information ..................................................... 912 Package outline ................................................... 1013 Soldering .............................................................. 1014 Revision history ...................................................1215 Legal information .................................................1315.1 Data sheet status ............................................... 1315.2 Definitions ...........................................................1315.3 Disclaimers .........................................................1315.4 Trademarks ........................................................ 14

© Nexperia B.V. 2017. All rights reservedFor more information, please visit: http://www.nexperia.comFor sales office addresses, please send an email to: [email protected] Date of release: 02 April 2014