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7/30/2019 Productionand Manufacturing

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INTRODUCTION

Compound solid state switches such as GaAs MESFETs and PIN diodes

are widely used in microwave and millimeter wave integrated circuits (MMICs)

for telecommunications applications including signal routing, impedance

matching networks, and adjustable gain amplifiers. However, these solid-state

switches have a large insertion loss (typically 1 dB) in the on state and poor

electrical isolation in the off state. The recent developments of micro-electro-

mechanical systems (MEMS) have been continuously providing new and

improved paradigms in the field of microwave applications. Different

configured micromachined miniature switches have been reported. Among

these switches, capacitive membrane microwave switching devices present

lower insertion loss, higher isolation, better nonlinearity and zero static power

consumption. In this presentation, we describe the design, fabrication and

performance of a surface micromachined capacitive microwave switch on glass

substrate using electroplating techniques.


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RF MEMS TECHNOLOGY

Basically RF MEMS switches are of two configurations-:

RF series contact switch

RF shunt capacitive switch

Currently, both series and shunt RF MEMS switch configurations are

under development, the most common being series contact switches and

capacitive shunt switches.

RF Series Contact Switch

An RF series switch operates by creating an open or short in the

transmission line, as shown in Figure 1. The basic structure of a MEMS contact

series switch consists of a conductive beam suspended over a break in the

transmission line. Application of dc bias induces an electrostatic force on thebeam, which lowers the beam across the gap, shorting together the open ends of

the transmission line1. Upon removal of the dc bias, the mechanical spring

restoring force in the beam returns it to its suspended (up) position. Closed-

circuit losses are low (dielectric and I2R losses in the transmission line and dc

contacts) and the open-circuit isolation from the ~100 m gap is very high

through 40 GHz. Because it is a direct contact switch, it can be used in low-

frequency applications without compromising performance. An example of a

series MEMS contact switch, the Rockwell Science Center MEMS relay, is

shown in Figure 2.


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Figure 1. Circuit equivalent of RF MEMS series contact switch.

Anchor

RF line RF line

Drive capacitor

Contact

shunt

Spring

Figure 2. Structure and operation of MEMS dc series switch

i

.

RF Shunt Capacitive Switch

A circuit representation of a capacitive shunt switch is shown in Figure 3.

In this case, the RF signal is shorted to ground by a variable capacitor.

Specifically, for RF MEMS capacitive shunt switches, a grounded beam is

suspended over a dielectric pad on the transmission line (see Figure 4). When

the beam is in the up position, the capacitance of the line-dielectric-air-beam

configuration is on the order of ~50 fF, which translates to a high impedance path

to ground through the beam [IC=1/(C)]. However, when a dc voltage is applied

between the transmission line and the electrode, the induced electrostatic force

pulls the beam down to be coplanar with the dielectric pad, lowering the

Biased - ON

Unbiased - OFF


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capacitance to pF levels, reducing the impedance of the path through the beam

for high frequency (RF) signal and shorting the RF to ground. Therefore,

opposite to the operation of the series contact switch, the beam in the up position

corresponds to a low-loss RF path to the output load, while the beam in the down

position results in RF shunted to ground and no RF signal at the output load .

While the shunt configuration allows hot-switching and gives better linearity,

lower insertion loss than the MEMS series contact switch, the frequency

dependence of the capacitive reactance restricts high quality performance to high

RF signal frequencies (5-100 GHz), whereas the contact switch can be used from

dc levels.

Figure 3. Circuit equivalent of RF MEMS series contact switch.


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Figure 4 capacitive RF MEMS switch.. (Top and cross-sectional view)

SWITCH DESIGN AND OPERATION

The geometry of a capacitive MEMS switch is shown in Fig.4. The

switch consists of a lower electrode fabricated on the surface of the glass

wafer and a thin aluminum membrane suspended over the electrode. The

membrane is connected directly to grounds on either side of the electrode

while a thin dielectric layer covers the lower electrode. The air gap

between the two conductors determines the switch off-capacitance. With

no applied actuation potential, the residual tensile stress of the membrane

keeps it suspended above the RF path. Application of a DC electrostatic

field to the lower electrode causes the formation of positive and negativecharges on the electrode and membrane conductor surfaces. These charges

exhibit anattractive force which, when strong enough, causes the

suspended metal membrane to snap down onto the lower electrode and

dielectric surface, forming a low impedance RF path to ground.


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The switch is built on coplanar waveguide (CPW) transmission

lines, which have an impedance of 50 that matches the impedance of the

system. The width of the transmission line is 160 m and the gap between

the ground line and signal line is 30 m. The insertion loss is dominated

by the resistive loss of the signal line and the coupling between the signal

line and the membrane when the membrane is in the up position. To

minimize the resistive loss, a thick layer of metal needs be used to build

the transmission line. The thicker metal layer results in a bigger gap that

reduces the coupling between signal and ground yet also requires higher

voltage to actuate the switch. To achieve a reasonable actuation voltage, a4-m-thick copper is used as the transmission line. The glass wafer is

chosen for the RF switch over a semi-conductive silicon substrate since

typical silicon wafer is too lossy for RF signal.

When the membrane is in the down position, the electrical isolation

of the switch mainly depends on the capacitive coupling between the

signal line and ground lines. The dielectric layer plays a key role for the

electrical isolation. The smaller the thickness and the smoother the surface

of the dielectric layer, the better isolation of the switch is. But there is

another trade-off here. When the membrane is pulled down, the biased

voltage is directly applied across the dielectric layer. Since this layer is

very thin, the electric field within the dielectric layer is very high. The

thickness of the dielectric layer should be chosen such that the electric

field will never exceed the breakdown electric field of the dielectric

material. The silicon nitride film has breakdown electric field as high as

several mega-volts per centimeter and can be utilized as dc block

dielectric layer. In this project, the thickness of the silicon nitride layer is

chosen as 0.2 m to accomplish the dc block and RF coupling purpose.

FABRICATION


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The switches were fabricated by surface micro-machining

techniques with a total of four masking level. No critical overlay

alignment was required. Fig. shows the essential process steps:

1. Ti/Cu seed layer deposition: The starting substrate was a 2-inch glass

wafer. A layer of titanium (0.05 m) and copper (0.15m) was sputtered

on the substrate as seed layer for electroplating.

2. Silicon nitride deposition: A layer of siliconnitride (0.2m) was

deposited and patterned as DC block by using PECVD and reactive ion

etch (RIE).

3. Copper electroplating: A photoresist layer was spin coated and

patterned to define the electroplatingarea. Then, a 4-m-thick copper

layer was electroplated to define the coplanar waveguide and the posts for

the membranes.

4. Aluminum deposition: A layer of aluminum (0.4m) was deposited by

using electron beam evaporation and patterned to form the top electrode in

the actuation capacitor structure.5. Release: The photoresist sacrificial layer was removed to finalize the

switch structure.


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TEST RESULTS AND DISCUSSIONS

The probe station and network analyzer (HP 8510C) were used to

characterize the capacitive MEMS switch. Fig. 3 shows the micrograph of a

switch under test. When the switch is unactuated and the membrane is on the up


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position, the switch is called in off-state. When the switch is actuated and the

membrane is pulled down, the switch is called in on-state.

The major characteristics of the switch are the insertion loss when the

signals pass through and the isolation when signals are rejected. In the off-state

the RF signal passes underneath the membrane without much loss. In the on-

state, between the central signal line and coplanar waveguide grounds exists a

low impedance path through the bended membrane. The RF signal will be

reflected by the switch.

The resonant frequency of 23.4 GHz was observed when the membranewas in the down position. This means that the switch can be equivalently

modeled as a capacitor, inductor and resistor connected in series between the

signal and ground lines. Since the switch has a better isolation around the

resonant frequency, it can be designed such that the desired frequency overlaps

with the resonant frequency by adjusting the geometry of the switch.

The actuation voltage of the MEMS switch is about 50V. The spring

constant of the membrane and the distance between the membrane and the

bottom electrode determines the actuation voltage of the switch. The spring

constant of the membrane is mainly determined by the membrane material

properties, the membrane geometry, and the residual stress in the membrane.

PRODUCTIONAND MANUFACTURING ISSUES

Packaging

The primary production issue at this time is the lack of low-cost packaging

options. The hermeticity requirement for RF MEMS switch packaging leaves


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only high-cost, military- or space-grade traditional packaging methods as

appropriate for high reliability assurance. Expensive packaging precludes the

large-scale production needed for extensive reliability testing and the low risk

statistics for widespread commercial sales.

Beyond the design and production phases, reliability concerns can be

introduced in post-production (such as release stiction fails) and, most

importantly, in packaging. Several factors must be considered before choosing a

package for RF MEMS switches. First and foremost, RF MEMS performance

will quickly degrade in the presence of contaminants and humidity. Therefore,

the initial package criterion is hermeticity.

A traditional approach would involve dicing the wafer, releasing the

device, attaching the substrate to the package base, and attaching the lid with a

hermetic seal, incorporating baking and vacuum conditions as necessary to

ensure no outgassing after seal. With the many options available for

microelectronics packaging, a suitable hermetic package can be found that

minimizes thermal-mismatch induced stresses and provides low-loss RF

electrical connections. Although it is possible to successfully package MEMS

RF switches in this manner, it is impractical for two reasons: its prohibitively

expensive for large-scale production and manipulating released devices is

tedious. In response to these difficulties, the current trend is toward wafer-level

packaging, which reduces cost and mitigates the structural fragility by bonding

the package around the released switch in the production phase, before dicing

and subsequent handling. Wafer-level packaging for RF MEMS is a topic of

intense study. Work is currently underway to find a suitable bonding method

that provides adequate hermetic seal without outgassing contaminants into the

body of the package or thermally damaging the delicate MEMS structures.


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Available Vendors

Significant manufacturing hurdles have the following repercussions for

spacecraft systems MEMS technology insertion. First, there are few availablevendors and limited in-stock product. Second, and most importantly, much

reliability testing remains to be completed and what has been done isnt widely

available due to commercial proprietary concerns. For space flight applications,

this means that if one can find switches to purchase, the knowledge of their

physics of failure and, consequently, the ability to predict what conditions may

trigger them, is severely compromised. In-house performance characterization

and reliability testing, and the resulting database of MEMS RF switch failure

mechanisms, will enable accelerated MEMS technology insertion.


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GENERAL RELIABILITY CONCERNS

Metal Contact Resistance (Series Contact Switches)

Series contact switches tend to fail in the open circuit state with wear.

Even though the bridge is collapsing and making contact with the transmission

line, the conductivity of the contact metallization area decreases until

unacceptable levels of power loss are achieved. These out-of-spec increases in

resistivity of the metal contact layer over cycling time may be attributed to

frictional wear, pitting, hardening, non-conductive skin formation, and/or

contamination of the metal. Pitting and hardening can be reduced by decreasing

the contact force during actuation. But tailoring the design to minimize the effect

involves balancing operational conditions (contact force, current, and

temperature), plastic deformation properties, metal deposition method, and

switch mechanical design. In other cases, the resistivity of the contact increases

with use due to the formation of a thin dielectric layer on the surface of the metal.

While this has been documented, the underlying physical mechanisms are notcurrently well understood. As the RF power level is raised above 100 mW, the

aforementioned failures are exacerbated by the increased temperature at the

contact area and, under hot-switching conditions, arcing and microwelding

between the metal layers.

Dielectric Breakdown (Shunt Capacitive Switches)

Shunt capacitive switches often fail due to charge trapping, both at the

surface and in the bulk states of the dielectric. Surface charge transfer from the

beam to the dielectric surface results in the bridge getting stuck in the up position

(increased actuation voltage). Bulk charge trapping, on the other hand, creates


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image charges in the bridge metallization and increases the holding force of the

bridge to a value above its spring restoring force. There are several actions that

can be taken to mitigate dielectric charging in the design phase, including

choosing better dielectric material and designing peripheral pull-down electrodes

to decouple the actuation from the dielectric behavior at the contact. Unlike

series contact switches, capacitive shunt switches do not experience hard failures

at RF power levels > 100 mW, as long as the bridge contact metallization is thick

enough to handle the high current densities. However, RF power may be limited

in some cases by a recoverable failure, self-actuation. While not yet fully

understood, it has been observed that a capacitive shunt switch will self-actuate

at 4W of RF power (cold-switching failure) and experience latch-up (stuck indown position) in hot-switching mode at 500 mW. Even though these failures

are recoverable the switch operates normally if the RF power is decreased

below the latch-up value of 500 mW they still illustrate a lifetime consideration

for high power applications.

Radiation and Other Effects

There are some areas of RF MEMS reliability research that have not been

investigated in detail and are in need of immediate attention. For example, RF

MEMS series contact switches were thought to be immune to radiation effects

until JPLs total dose gamma irradiation experiments on the RSC MEMS contact

switch showed design-dependent charge separation effects in the pull-down

electrode dielectric material, which noticeably decreased the actuation voltage of

the device. This immediately begs the question of how radiation effects will

accelerate the dielectric material failure mechanisms of capacitive switches,

which have known dielectric failure mechanisms, or other series switches that

utilize dielectric material in their electrode structures.


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Power Handling

As outlined above, reliable operation of RF MEMS switches at power

levels above 500 mW cannot be guaranteed at this time. Capacitive shunt

switches experience recoverable failures at this level, while series contact

switches may permanently fail in the short circuit configuration if hot switched

above 100 mW. Hot-switching series contact switches at any power is not

recommended. Thermal dissipation precautions in packaging are unnecessary, as

RF MEMS do not generate sufficient thermal energy.

Technology evolution in near term

The fundamental architecture for RF MEMS switches, both contact series

and capacitive shunt, is stable and likely to persist through commercial insertion.

Design subtleties will be adjusted to optimize performance (i.e. more robust

metal contact) and increase reliability, but will likely be considered revisions

rather than a new design. Since there is no set packaging method, the end-

product has yet to be fully realized.


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COMPARISION OF MEMS SWITCHES WITH SOLID

STATE SWITCHES

RF switches are used in a wide array of commercial, aerospace, and

defense application areas, including satellite communications systems, wireless

communications systems, instrumentation, and radar systems. In order to choose

an appropriate RF switch for each of the above scenarios, one must first consider

the required performance specifications, such as frequency bandwidth, linearity,

power handling, power consumption, switching speed, signal level, and

allowable losses.

Traditional electromechanical switches, such as waveguide and coaxial

switches, show low insertion loss, high isolation, and good power handling

capabilities but are power-hungry, slow, and unreliable for long-life applications.

Current solid-state RF technologies (PIN diode- and FET- based) are utilized for

their high switching speeds, commercial availability, low cost, and ruggedness.

Their inherited technology maturity ensures a broad base of expertise across the

industry, spanning device design, fabrication, packaging, applications system

insertion and, consequently, high reliability and well-characterized performance

assurance. Some parameters, such as isolation, insertion loss, and power

handling, can be adjusted via device design to suit many application needs, but at

a performance cost elsewhere. For example, some commercially available RF

switches can support high power handling, but require large, massive packages

and high power consumption.

In spite of this design flexibility, two major areas of concern with solid-

state switches persist: breakdown of linearity and frequency bandwidth upper

limits. When operating at high RF power, nonlinear switch behavior leads to

spectral regrowth, which smears the energy outside of its allocated frequency


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band and causes adjacent channel power violations (jamming) as well as signal to

noise problems. The other strong driving mechanism for pursuing new RF

technologies is the fundamental degradation of insertion loss and isolation at

signal frequencies above 1-2 GHz.

By utilizing electromechanical architecture on a miniature- (or micro-)

scale, MEMS RF switches combine the advantages of traditional

electromechanical switches (low insertion loss, high isolation, extremely high

linearity) with those of solid-state switches (low power consumption, low mass,

long lifetime). shows a comparison of MEMS, PIN-diode and FET switch

parameters. While improvements in insertion loss (40 dB),

linearity (third order intercept point>66 dBm), and frequency bandwidth (dc 40

GHz) are remarkable, RF MEMS switches are slower and have lower power

handling capabilities. All of these advantages, together with the potential for

high reliability long lifetime operation make RF MEMS switches a promising

solution to existing low-power RF technology limitations.

PARAMETER RF MEMS PIN-DIODE FET

Voltage 20 80 3 5 3 5

Current (mA) 0 0 20 0

Power Consumption (mW) 0.5 1 5 100 -.5 0.1

Switching 1 300 s 1 100 ns 1 100 ns

Cup (series) (fF) 1 6 40 80 70 140

Rs (series) () 0.5 2 2 4 4 6

Capacitance Ratio 40 500 10 n/a

Cutoff Freq. (THz) 20 80 1 4 0.5 2

Isolation (1 10 GHz) Very high High Medium

Isolation (10 40 GHz) Very high Medium Low

Isolation (60 10 GHz) High Medium None

Loss (1 100 GHz) (dB) 0.05 0.2 0.3 1.2 0.4 2.5

Power Handling (W)


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CONCLUSION

Low power consumption ,low insertion loss,high isolation,excellent

linearty and the ability to be integrated with other electronics all make MEMS

switches an attractive alternative to mechanical and solid state switches.these

switches will have applications in phase antenna arrays ,in MEMS impedance

matching networks,and in communications applications.


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REFERENCES

1. S.Majumdar,J.lampen,R.Morrison,andJ.Maciel,MEMS SWITCHES,IEE

instrumentation and measurement magazine,march 2003.

2. Gabriel M.Rebeiz,Hoboken,NJ,John Wiley &sons,RF MEMS

THEORY,DESIGN &TECHNOLOGY,January 2003.

3. Gopinath,A and Ranklin.JB,IEEE Transaction on electronic development

,GaAs FET RF switches ,VOL ED-32.

4. Cavery.R.H, DISTORTION OF OFF-STATE ARSENIDE MESFET

SWITCHES,IEEE Transaction,VOL.41,NO.8,august 1993.


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CONTENTS

1. INTRODUCTION

2. RF MEMS TECHNOLOGY

3. RF SERIES CONTACT SWITCH

4. RF SHUNT CAPACITIVE SWITCH

5. SWITCH DESIGN AND OPERATIONS

6. FABRICATION

7. TEST RESULT AND DISCUSSIONS

8. PRODUCTION AND MANUFACTURING ISSUES

9. GENERAL RELIABILITY CONCERNS

10. COMPARISON OF MEMS SWITCHES WITH SOLID-STATE

SWITCHES

11.CONCLUSION

12.REFERENCES


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ACKNOWLEDGEMENT

I extend my sincere gratitude towards Prof . P.Sukumaran Head of

Department for giving us his invaluable knowledge and wonderful technical

guidance

I express my thanks to Mr. Muhammed kutty our group tutor and

also to our staff advisor Ms. Biji Paul for their kind co-operation and

guidance for preparing and presenting this seminar.

I also thank all the other faculty members of AEI department and my

friends for their help and support.


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ABSTRACT

Microelectromechanical system (MEMS) micro switches are receiving

increasing attention ,particularly in the RF community. Low power

consumption, low insertion loss, high isolation,excellent linearity, and the ability

to be integrated with other electronic circuits all make micro switches an

attractive alternative to other mechanical and solid state switches.

MEMS switches can be used in a variety of RF applications, including cell

phones, phase shifters, and smart antennas ,as well as in lower frequency

applications, such as automatic test equipment and industrial and medical

instrumentation. MEMS switches combine the advantages of traditional

electromechanical switches with those of solid state switches.

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