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STM32 Портфолио микроконтроллеров (до Q4/2016)
Попов Роман
Бренд менеджер STMicroelectronics
Agenda 1. Введение
2. STM32 с низким потреблением
a) STM32L4, ядро Cortex-M4
b) STM32L1, ядро Cortex-M3
c) STM32L0, ядро Cortex-M0
d) ULP Benchmark
e) STM32F0 или STM32L0. Муки выбора
3. STM32 «main stream» - STM32F1/F3
4. STM32 с высокой производительностью на ядре Cortex-M4
a) STM32F4 «Dynamic Efficiency»
b) STM32F446, STM32F469
5. STM32 с высокой производительностью на ядре Cortex-M7
a) Ядро, архитектура
b) Портфолио
6. Экосистема ПО, отладочные платы
7. Ответы на вопросы, розыгрыш призов
5 reasons to select STM32 for your application
STM32 Planet 4
• ARM Cortex-Mx is new INDUSTRIAL STANDARD
• STM32 family is #1 in Cortex-Mx based MCU’s
• >700 STM32 devices with maximum compatibility
• Rich and easy to use and access Ecosystem
• Strong Technical Support (local & global)
ST MCUs portfolio new families development focus
6
Features
2 K
16 K
256K
1 M
8-bit Core
• STM8S Mainstream
• STM8AF and STM8AL Automotive
• STM8L Ultra-low-power
32-bit Core • STM32 F7 - Cortex M7
• STM32 F4 - Cortex-M4
• STM32 F3 - Cortex-M4
• STM32 F2 - Cortex-M3
• STM32 F1 - Cortex-M3
• STM32 F0 - Cortex-M0
• STM32 L0 - Cortex-M0+
• STM32 L1 - Cortex-M3
• STM32 L4 - Cortex-M4
Flash (bytes)
2 M
4K
8K
32 K
48 K
64 K
96 K
128 K
384K
512K
768K
NEW EXPANDING
7
398 CoreMark
120 MHz
150 DMIPS
608 CoreMark
180 MHz
225 DMIPS
High-performance 1 000 CoreMark
216 MHz
428 DMIPS
9 product series / 32 product lines
STM32 portfolio in details
Mainstream 106 CoreMark
48 MHz
38 DMIPS
177 CoreMark
72 MHz
61 DMIPS
245 CoreMark*
72 MHz
90 DMIPS (*) from CCM-SRAM
Cortex-M0
Cortex-M0+ Cortex-M3 Cortex-M4 Cortex-M7
Ultra-low-power 75 CoreMark
32 MHz
26 DMIPS
93 CoreMark
32 MHz
33 DMIPS
273 CoreMark
80 MHz
100 DMIPS
STM32L family
A World in Mutation 10
Million of years 100’s of years 10’s of years Few years …
192K
Low Power MCU portfolio Memory size
(Bytes)
4K
16K
64K
Dmips/MHz
(FMAX CPU)
26
(32 MHz)
4.8
(16 MHz)
2
128K
32K
256K
STM8L
8-bit
20
- to
80p
ins
STM32L1
CortexTM-M3
48-
to 1
44
pin
s
33.6
(32 MHz)
512K
20-
to 1
00
pin
s
STM32L0
CortexTM-M0+
New
STM32L4
CortexTM-M4
48-
to 1
44
pin
s
1024K
100
(80 MHz)
STM32L - complete family for ULP 12
Perfo
rman
ce
MHz
26 DMIPS
75 CoreMark
32
33 DMIPS
93 CoreMark
32
100 DMIPS
273 CoreMark
80
Wide selection of memories, packages and performance
Flash memory size (bytes)
16 K
14
1 M
25 144
32 K
512 K
384 K
256 K
128 K
64 K
48
64 100 32 20
49 63 132
192 K
8 K Pins
28 36
100+ P/N 80+ P/N
65+ P/N
LQFP
WLCSP QFN BGA TSSOP
STM32L - complete family for ULP 13
Key ingredients of ultra low power applications with STM32
Cortex®-Mx
STM32Lxxx
Ultra-low-power technology
Record breaking performance
• Wide temperature range & best in class 125°C behavior
• Well proven ULP technology
• Extensive and True Characterization
• Low Power modes consumption and fast wake-up times
• ULP-Bench results
STM32L - complete family for ULP 14
Key ingredients of ultra low power applications with STM32
Cortex®-Mx
STM32Lxxx Innovative peripherals
Smart architecture
• Analog peripherals: ADC, DAC’s, Comparators, Op-ams
• Low power peripherals: Timer, USART, I2C
• Special peripherals: Build-in LCD driver, USB 2.0
Crystal-less, Digital Filter for Sigma Delta Modulators
• Adaptive inrush current
STM32L - complete family for ULP 15
Key ingredients of ultra low power applications with STM32
Cortex®-Mx
STM32Lxxx
Full feature set
Tiny packages High Integration
• Packages from 14pins and down to 2x2mm
• Independent Vdd domains, Integrated clock sources
• Extensive in-built Security and Safety: Hardware AES
encryption, True RNG, Built-in ECC, Sector & Full Flash
Protection, Unique ID (96-bit), Tampering, Watchdogs,...
STM32L - complete family for ULP 16
Key ingredients of ultra low power applications with STM32
Cortex®-Mx
STM32Lxxx Great Investment
Competitive solution Wide portfolio
• Complete family with 250+ STM32Lxx devices
• Maximum compatibility
• Rich Ecosystem: Nucleo boards, Free development
tools, extensive libraries
STM32L4 Ultra-Low-power Series From 128KB up to 1MB of Flash
ARM CortexTM-M4 Based
STM32L4 key NEWS
Smaller derivate of STM32L4 series • Down to 32pins and 128kB flash low price
)
20
Ultra-Low-Power and Flexibility 21
STM32L4 is based on a new platform optimized to reduce power
consumption and increase flexibility
Down to 30 nA for I/O wake-up
with additional Shutdown mode
RTC available for all power modes
(from Active down to VBAT)
Down to 360 nA keeping
32 Kbytes of SRAM active
in Standby mode
Wake up MCU with any peripheral
(Communication I/Fs, analog circuits,
timers …)
External level shifter no longer needed
Separate VDD supplies (down to 1.08 V)
I/O level kept in low power modes
Optimization of system consumption
USB capable with 32 kHz crystal
oscillator
(Dedicated crystal oscillator is no
longer needed for USB function)
4 nA VBAT mode with charging
capability
Automatic switch to maintain power
for RTC and backup registers
Internal oscillator from 100 kHz to 48 MHz
(+/-0.25% int. clock accuracy over
voltage/temperature with LSE)
FlexPowerControl
1
STM32L4
22
Tamper: 3 I/Os, RTC
Wake-up sources: reset pin, 5 I/Os
Wake-up sources: + RTC, BOR, IWDG
Wake-up sources: + all I/Os, PVD, LCD,
COMPs, I²C, LPUART, LPTIM
Wake-up sources: any interrupt or event
Ultra-low-power modes
Best power consumption numbers with full flexibility
RUN at 80 MHz 112 µA / MHz
STOP 2 (full retention) 1.1 µA / 1.4 µA*
SLEEP 35 µA / MHz
STANDBY 130 nA / 430 nA*
RUN at 24 MHz 100 µA / MHz
VBAT 4 nA / 300 nA*
SHUTDOWN 30 nA / 330 nA*
STANDBY + 32 KB RAM 360 nA / 660 nA*
250 µs
14 µs
14 µs
5 µs
6 cycles
Wake-up
time
Note : * without RTC / with RTC
STOP 1 (full retention) 7.3 µA / 7.6 µA* 4 µs Wake-up sources: + all I²C, UART
1
STOP 2 (full retention) 1.1 µA / 1.4 µA*
SLEEP 35 µA / MHz
RUN at 24 MHz 100 µA / MHz
STOP 1 (full retention) 7.3 µA / 7.6 µA*
Providing more performance
• Up to 80 MHz/ 100 DMIPS with
ART Accelerator™
• Up to 273 CoreMark Result
• ARM Cortex-M4 with DSP
instructions and floating-point unit
(FPU)
• Optimized DMA (14 channels)
• SPI up to 40 Mbit/s,
USART 10 Mbit/s
Execution performance
from Flash
23
CoreMark score
CPU frequency
273
80 MHz
Linear performance
thanks to ST
ART AcceleratorTM
Do not compromise on performance with STM32L4
Competitors: impact
of wait states
Efficient run and fast wake-up 24
Ready for Launch Control ? From 0 to 48 MHz in less than 5 µs
Run
48 MHz
STOP
mode
Run
80 MHz
< 5 µs!
• Thanks to our internal
oscillator (MSI) used at
start-up (programmable
from 100 kHz to 48 MHz)
• PLL wake-up time
< 15 µs
(needed to reach fMAX)
Smart peripherals
Δ Metering 25
Electricity/Gas
/Water
Smart Meter
STM32L4
FSMC External memory interface
for static memories supporting SRAM,
PSRAM, NOR and NAND
88×40 or 4×44
with step-up converter
SPI / UART/ SDIO for Wireless 3x SPIs (4x SPIs with the Quad SPI)
6x USARTs (ISO 7816, LIN, IrDA, modem)
1 x SDIO
Anti Tamper pin 3 x tamper pins
for battery domain
I/Os Up to 114 fast I/Os for buttons & relays
TNRG & AES for Security 128-/256-bit AES
key encryption hardware
accelerator
VBAT with RTC for battery backup 240 nA in VBAT mode
for RTC and
32x 32-bit backup registers
Digital Filter for Sigma
Delta Modulators 8 x parallel inputs
with up to 24-bit data
output resolution
LCD Display
Smart Peripherals
Industrial Sensors 27
STM32L4
FSMC External memory interface
for static memories supporting
SRAM, PSRAM, NOR and NAND
High temperature from -40°C
up to 125°C
8×40 or
4×44
with step-up converter
SPI / UART 3x SPIs (4x SPIs with the
Quad SPI)
6x USARTs (ISO 7816, LIN,
IrDA, modem)
I/Os Up to 114 GPIOs
CAN Bus
(2.0B Active)
Motor Control : 2x 16-bit advanced
motor-control timers
3x 12-bit ADCs: 5 MSPS,
with up to 16-bit with hardware oversampling,
200 μA/MSPS
I²C 3x I²C FM+(1 Mbit/s), SMBus/PMBus
TNRG & AES for Security 128/256-bit AES
key encryption hardware accelarator
LCD Display
Analog Smart Peripherals
• 3 x 12/16-bit ADCs (up to 5 Msps)
• Down to 20 µA (10 Ksps) with adaptive power consumption
• HW oversampling
• Single and differential inputs
• 2x Op amps with built-in PGA
• 2 x 12-bit DACs (1 Msps)
• Low-power Sample and Hold modes available in Stop mode
• 2x Comparators
• Low-power modes, works in Stop mode
• Internal voltage reference
• Programmable 2.048 or 2.5 V
• Can be used for external components
28
18 STM32L4 series
STM32L4 portfolio
5
1 M
512 K
256 K
STM32L476RC
Flash size (bytes)
Pin count
STM32L476VC
STM32L476RE STM32L476JE STM32L476VE STM32L476QE STM32L476ZE
STM32L476RG STM32L476JG STM32L476VG STM32L476QG STM32L476ZG
STM32L486RG STM32L486JG STM32L486VG STM32L486QG STM32L486ZG
STM32L476ME
STM32L476MG
64-pin 48/49-pin 32-pin 144-pin 132-pin 100-pin 72-pin 81-pin
STM32L442KC STM32L443CC STM32L443RC STM32L443VC
STM32L432KC STM32L433CC STM32L433VC STM32L433RC
Without encryption
Legend:
With 128/256-bit AES hardware encryption Available in Q2
2016
128 K STM32L432KB STM32L433CB STM32L433RB
STM32L475RC STM32L475VC
STM32L475RG STM32L475VG
STM32L471RG STM32L471VG
STM32L475RE STM32L475VE
STM32L471RE STM32L471VE
STM32L471QG STM32L471ZG
STM32L471QE STM32L471ZE
STM32L1
Линейка STM32L 33
20/06/2016 Presentation Title
STM32L151 «Ultra Low Power Line»
Cortex-M3
32 МГц
До 12 Kб EEPROM
Источник MSI 64 КГц- 4 МГц
До 48 Kб SRAM
До 384 Kб FLASH
FSMC (SRAM/PSRAM/
NOR)
До 5хUSART, 3хSPI/I2S, 2xI2C, 1xSDIO
До 9 таймеров 32/16 бит, ШИМ
Схема сброса POR/PDR, BOR + PVD
2 х Watchdogs
Датчик температуры**
До 12 каналов DMA
Аппаратные RTC
Питание, 1.65 В – 3.6 В
От -40 до + 105 С***
STM32L152 «Ultra Low Power Line»
Cortex-M3
32 МГц
До 12 Kб EEPROM
Источник MSI 64 КГц- 4 МГц
До 48 Kб SRAM
До 384 Kб FLASH
FSMC (SRAM/PSRAM/
NOR)
12 бит АЦП, 1мкс До 40 каналов
3 х ОУ 2х комп-ра
3 х ОУ 2х комп-ра
LCD 8x40
STM32L162 «Ultra Low Power Line»
Cortex-M3
32 МГц
До 12 Kб EEPROM
Источник MSI 64 КГц- 4 МГц
До 48 Kб SRAM
До 384 Kб FLASH
FSMC (SRAM/PSRAM/
NOR)
3 х ОУ 2х компаратора
AES128 LCD 8x40
+
2 х 12 бит ЦАП
USB 2.0 FS
MPU + ETM STM32L100 «Value Line» «Ultra Low Power Line»
Cortex-M3
32 МГц
До 8 Kб EEPROM
Источник MSI 64 КГц- 4 МГц
До 16 Kб SRAM
До 256 Kб FLASH
2х компаратора
LCD 8x28
** Нет в STM32L100
*** От -40 до +85 в STM32L100
** Цена с сайта ST
Voltage scalling 35
20/06/2016 Presentation Title
4
В
MГц
8
16
32
1WS
0WS
0WS
1WS
0WS
1WS
VDD 2.0 В .. 3.6 В 1.65 В .. 3.6 В
2
VCORE 1.2 В (Range 3) 1.5 В (Range 2) 1.8 В (Range 1)
Динамическое изменение напряжения оптимизирует эффективность микроконтроллера
(соотношение Производительность <----> Потребление)
Пользователь выбирает диапазон (Range) в соответствии с:
Внешним напряжением питания VDD
Необходимой производительностью DMIPS(с или без циклами Wait States)
Максимального потребления
Потребление STM32L 36
20/06/2016 Presentation Title
Ядро включено
Периферия активна
Контекст ОЗУ сохранен
Контекст backup регистров сохранен
STM32L1 new devices New proposals!
37
• 32KB to 128KB Flash STM32L1 shrink instead of Non shrink devices
• Migration guide on ST web : TN1176
• 256KB Flash RCT6/VCT6 part numbers instead of RCT6A/VCT6A
• Migration guide on ST web : TN1177
* NRND: Not recommended for new designs
NEW
PROPOSAL
STM32L1 Shrinked
Up to 128KB Flash
Up to 32KB RAM
L15x STM32L1xxVB(8/6)T6A LQFP100
Full Prod
L15x STM32L1xxVB(8/6)H6A UFBGA100
L100 L15x STM32L1xxRB(8/6)T6A LQFP64
L15x STM32L1xxRB(8/6)H6A TFBGA64
L15x STM32L1xxCB(8/6)T6A LQFP48
L100 L15x STM32L1xxCB(8/6)U6A UQFN48
PREVIOUS
PROPOSAL
STM32L1 Non Shrinked
Up to 128KB Flash
Up to 16KB RAM
L15x STM32L1xxVB(8/6)T6 LQFP100
NRND*
No PTN forecasted
L15x STM32L1xxVB(8/6)H6 UFBGA100
L100 L15x STM32L1xxRB(8/6)T6 LQFP64
L15x STM32L1xxRB(8/6)H6 TFBGA64
L15x STM32L1xxCB(8/6)T6 LQFP48
L100 L15x STM32L1xxCB(8/6)U6 UQFN48
PREVIOUS
PROPOSAL
STM32L1
256KB Flash
32KB RAM
L15x STM32L1xxVCT6A LQFP100 NRND*
No PTN forecasted L15x STM32L1xxRCT6A LQFP64
NEW
PROPOSAL
STM32L1
256KB Flash
32KB RAM
L15x L162 STM32L1xxVCT6 LQFP100 Full Prod
L100 L15x STM32L1xxRCT6 LQFP64
Reminder for all distributors/customers that STM32L1 products here mentioned
« NRND* » will NOT be terminated (No PTN).
TN1176 Migration guide Migrating from STM32L15xx6/8/B to STM32L15xx6/8/B-A
and STM32L100x6/8/B to STM32L100x6/8/B-A
38
Full migration guide on ST web : TN1176
Meet the STM32 – Apple Watch 39
STM32L0 Ultra-Low-power Series From 8KB up to 192kB of Flash
ARM CortexTM-M0+ Based
Key NEWS
Complete STM32L0 series • From 14pins 8kB flash to 100pins 192kB flash
• Full family announcement week 7/16
)
)
41
Main features of STM32L0x Series 42
• STM32® ultra-low-power DNA is now built with ARM Cortex-M0+
Ultra-low-power ADC
12/16-bit resolution
Down to 1.65V
• Ultra-low-power time counter
with 16-bit low-power timer
USB 2.0 FS Certified
Crystal-less / BCD1
• Full Flash Protection
• Sector Flash Protection
• Hardware encryption - AES
• True RNG2
• Unique ID (96-bit)
• Class B
• Built-in ECC DNA
+
• 1.71V to 3.6V 32MHz operation
• 139µA/MHz (Run 32MHz)
• 87µA/MHz (Run Optimized)
• 400nA Stop mode + Full Ram
• 3.5 µs wakeup to Run
• -40°C to +125°C range
1. Battery Charger Detection
2. True Random Number Generator
• Ultra-low-power UART
Up to 9600b in stop mode
• I2C running in STOP
Wake-up on address match
RTC: +400 nA
RTC: +400 nA
LTC: +40 nA
Neo 256K – Low Power consumption values STM32L05x - power consumption
From 25°C to 125°C (typical) 43
Wakeup time:
• Stop to Run from Flash: 5µs
• Stop to Run from Ram: 3.5µs
• Standby to Run: 50µs
Typ. current
139µA/MHz1
Dhrystone (32MHz)
87µA/MHz
While{1} (4MHz)
2804 nA 4152 nA
22 µA Flash
8.5 µA RAM
166 µA/MHz1
4.7 µA
39 µA
38 µA
20 µA
102 μA
2.94 µA
Dynamic Run
From Flash
Low-Power Run
@ 32kHz
Low-Power Sleep
@ 32kHz
Stop
(Full RAM)
Standby
(+20 bytes curent)
1. Dhrystone power consumption value executed from Flash (Prefetch off) with VDD=3.3V
2. STOP mode consumption with Full Ram data retention (RTC value given with LSE low-drive using 32,768kHz crystal)
3. LTC: Low-power Time Counter @ 100Hz with external oscillator (LSE)
4. STANDBY mode consumption with 20Byte of backup register and Power supply monitoring
105°C
25°C
31 µA
15 µA
125°C
6.3 µA
4.052 μA
9404 nA
c
Neo 256K – Low Power consumption values 44
• Max. current value at lowest power mode vs. temperature capability
Leader at high temperature
Note: Value based on competition datasheet, looking at lowest power mode with full RAM retention at VDD 3.0V.
All datasheet give same value for -40°C/+25°C temperature range.
• STM32L0 platform
offers the lowest
power consumption
for the highest
temperature range.
• This capability to
control leakage
current makes
STM32L0 the
premium choice for
industrial application,
IDD (µA)
Ambient
Up to +125°C
More than just ultra-low-power 45
• Clock Security System (CSS) Automatic clock switch to internal RC
Real Time Clock
CSS
AHB Bus
MCO
CSS
MSI RC
37kHz to 4,2MHz
HSE Osc
1MHz to 48MHz
HSI RC
1MHz to 16MHz
LSE Osc
32,728Hz
LSI RC
37kHz
Design robustness is our concern
Clock Security System will ensure a very
fast switch (couple of clock pulse) between
external oscillator and internal one in case
of malfunction detection.
This unique feature will allow your
application working were other MCUs will let
you down.
4
8
12
16
24
32
1.65 1.8 2.2 2.4 2.7 3.6
STM32L0
Competitor E
Competitor R
Competitor T
• A wide range operation
Low voltage and High speed platform Why to comprise CPU speed vs. power supply ?
(V)
(MHz)
STM32L0x – Technical features (1/3)
Analog peripheral set 46
• Why is STM32L0 SMARTER ? • ADC: The lowest current consuming in the Industry – down to 1.65V
• 48 µA only at 100Ksps with 12-bit resolution (max speed: 1.14Msps - 200 µA)
• 16-bit resolution capable thanks to built-in hardware oversampling feature
• DMA capability
• DAC:
• 12-bit DAC with output buffer
• External triggers and input reference voltage capable
• DMA capability (with underrun interrupt)
• Comparator
• 2x built-in comparator ext./int. ref. voltage capable
• Stop mode wake up capable
• Window comparator mode capable
• For which application ?
Gas/Water meter Blood pressure Door lock
STM32 L0x – Product lines 47
STM32L0x3 – USB & LCD line – 32-K to 192-Kbyte Flash
Up to
192-KB
Flash1
Up to
20-KB
SRAM
Up to
6-KB
EEPROM
Main osc.
input
1-24 MHz
RTC with
32 kHz
osc.
7 ch
DMA
ADC
12-bit
1Msps
16-ch
DAC
Up to
2x 12-bit
USB2.0
Crystal
Less,
LPM, BCD
Touch
Sense
True
RNG
LCD
8x48
4x52
Common features
CortexTM-M0+ 32 MHz speed
with MPU and MUL
AES 128-bit
Firewall protection2
(Flash and RAM)
Built-in 16 MHz, 4,2MHz and 38
kHz RC oscillators
Multiple USART, SPI, I2C
Low-power UART
Multiple 16-bit timers
Low-power 16-bit timer
2x watchdogs
Reset circuitry POR/PDR
Brown Out Reset
Program Voltage Detector
2x comparators
Dynamic Voltage Scaling
STM32L0x1 – Access line - 16-K to 192-Kbyte Flash
Up to
192-KB
Flash1
Up to
20-KB
SRAM
Up to
6-KB
EEPROM
Main osc.
input
1-24 MHz
RTC with
32 kHz
osc.
4 ch
DMA
12-bit
ADC
1Msps
16-ch
STM32L0x2 – USB line - 32 to 192-Kbyte Flash
Up to
192-KB
Flash1
Up to
20-KB
SRAM
Up to
6-KB
EEPROM
Main osc.
input
1-24 MHz
RTC with
32 kHz
osc.
7 ch
DMA
12-bit
ADC
1Msps
16-ch
2xDAC
12-bit
USB2.0
Crystal
Less,
LPM, BCD
Touch
Sense
True
RNG
1. Dual bank flash with Rww feature from Flash to EEPROM (on part number STM32L07x/08x))
2. Only on STM32L0x2 and L0x3 line
STM32L0 – Ready for Mass Market 48
Flash size
(bytes)
64 K
32 K
STM32L052 LQFP/TFBGA
STM32L052 LQFP/TFBGA
STM32L053 LQFP/TFBGA
STM32L053 LQFP/TFBGA
STM32L051 LQFP/TFBGA
STM32L051 LQFP/TFBGA
STM32L052 LQFP
STM32L053 LQFP
STM32L053 LQFP
STM32L051 LQFP
STM32L052 LQFP
STM32L051/71 LQFP
STM32L052x WLCSP
STM32L051 WLCSP
STM32L052 UQFN/LQFP
STM32L052 UQFN/LQFP
STM32L051 UQFN/LQFP
STM32L051 UQFN/LQFP
STM32L0x2 - USB Line
STM32L0x3 - USB & LCD Line
STM32L0x1 - Access Line
AES option
64pins
10x10mm
5x5mm
48pins
7x7mm
49pins 36pins
Pin count
STM32L052x WLCSP
STM32L051 WLCSP
32pins
5x5mm
7x7mm
STM32L05x
Launched in 2014
16 K
20pins
3x3mm
4.4x6.5mm
28pins
4x4mm
25pins
STM32L031 LQFP
STM32L031 LQFP
STM32L031 TSSOP
STM32L031 TSSOP
STM32L031 UQFN
STM32L031 UQFN
STM32L031 UQFN.LQFP
STM32L031 UQFN.LQFP
STM32L031 WLCSP
STM32L031 WLCSP STM32L031
Available Now
8 K
14pins
4.4x5mm
STM32L011 TSSOP
STM32L011 TSSOP
STM32L011 UQFN/TSSOP
STM32L011 UQFN/TSSOP
STM32L011 UQFN
STM32L011 UQFN
STM32L011 UQFN/LQFP
STM32L011 UQFN/LQFP
STM32L011 WLCSP
STM32L011 WLCSP
STM32L011
Available Now
128 K
192 K
100pins
14x14mm
7x7mm
STM32L072x WLCSP
STM32L071 WLCSP
STM32L072x WLCSP
STM32L071 WLCSP
STM32L072x LQFP/TFBGA
STM32L073
LQFP/TFBGA
STM32L071 LQFP/TFBGA
STM32L072 LQFP/TFBGA
STM32L073 LQFP/TFBGA
STM32L071 LQFP/TFBGA
STM32L072 LQFP/UFBGA
STM32L072 LQFP/UFBGA
STM32L073 LQFP/UFBGA
STM32L073 LQFP/UFBGA
STM32L071 LQFP/UFBGA
STM32L071 LQFP/UFBGA
STM32L072 LQFP/UFBGA
STM32L073 LQFP/UFBGA
STM32L071 LQFP/UFBGA
STM32L072 LQFP
STM32L071 LQFP
STM32L072 LQFP
STM32L071 LQFP
STM32L073
LQFP
STM32L073 LQFP
STM32L072x WLCSP
STM32L071 WLCSP
STM32L072 UQFN/LQFP
STM32L072 UQFN/LQFP
STM32L071 UQFN/LQFP
STM32L071 UQFN
STM32L071 UQFN/LQFP
STM32L07x
Available Now
ULP BENCH
http://www.eembc.org/ulpbench/
EEMBC ULP score 50
STM32L476 + External DC/DC (supplying internal LDO @ 1.8v)
STM32L476 (with internal LDO @ 3.0v)
ULP Bench Measurement 51
ULPBench Energy monitor Board
Energy Monitor board :
inject 3V and measure
current
EnergyMonitor Software
Integrates measurements and plots
total energy vs time
ULP Bench Scenario 52
• MCU must be programmed with a wakeup timer based on a <50ppm crystal
• Timer must wake up the processor at 1 second intervals
• MCU executes (twice) a workload consisting of selected operations (bubble sort,
permutation, needle search, display table, DC filter, linear approximation etc)
• After 10 cycles of benchmark, energy per cycle is calculated.
• ULPMark-CP score is 1000/(Energy per cycle)
“Active”
workload “low power
mode”
1s cycle
10 cycles
COMPETITION
CortexM0 vs Cortex-M0+
Cortex-M0/0+/3 feature set comparison
Cortex-M0 Cortex-M0+ Cortex-M3
Architecture Version V6M V6M v7M
Instruction set architecture Thumb,
Thumb-2 (System
Instructions only)
Thumb,
Thumb-2 (System
Instructions only)
Thumb + Thumb-2
DMIPS/MHz 0.84/0.9 0.95 1.25
Bus interfaces 1 1+ I/0 port 3
Integrated NVIC Yes Yes Yes
Number interrupts 1-32 + NMI 1-32 + NMI 1-240 + NMI
Relocatable vector table No Yes Yes
Interrupt priorities 4 4 8-256
Breakpoints, Watchpoints 4/2/0, 2/1/0 4/2/0, 2/1/0 8/4/0, 2/1/0
Memory Protection Unit (MPU) No Yes (option) Yes (Option)
Integrated trace option (ETM) No MTB (Option) ETM (Option)
Priviledge/unpriviledged No Yes (Option) Yes (Option)
Single Cycle Multiply Yes (Option) Yes (Option) Yes
Hardware Divide No No Yes
Bit banding support No No Yes
Bus protocol AHB Lite AHB Lite, I/O AHB Lite, APB
CMSIS Support Yes Yes Yes
CORE M0 and M0+ Feature Cortex-M0 Cortex-M0+
Architecture ARMv6-M ARMv6-M
Pipeline 3-stage 2-stage
Dynamic Power (180nm*) 73 μW/MHz 52 μW/MHz
Area (gate count) 12K 12K
Bus interface AHB-lite AHB-Lite I/O Port
Data access (cycles) 2 2 1
Privileged/Unprivileged Privileged only Two levels
MPU option No Yes
Relocatable vector table No Yes
Instruction fetch activity*
(Relative for Dhrystone)
1 0.85
Performance efficiency*
(DMIPS/MHz)
0.84/0.9 0.93
Performance efficiency*
(coremark/MHz)
2.33 2.42
Energy efficiency* (DMIPS/mW) 11.5 17.9
MMS-MCD OR - Application
*ARM C compiler 5.03)
Binary compatible
30%lower power
Same size
Faster I/O
Fewer flash access
Energy efficient
STM32 F0 Product lines
STM32F030 Value line - 2.4V to 3.6V
16KB to 64KB Flash
8KB SRAM
(Parity check)
16&32
-bit
timers
2xUSART
2xSPI
2xI2C
CortexTM-M0
@ 48 MHz
Reset POR/PDR
2x Watchdogs
Hardware CRC
2x Internal RC
Crystal oscillators
PLL
Calendar RTC
1x12-bit ADC
T°C sensor
Multiple Channel DMA
USART/SPI/I2C
Single Wire Debug
Unique ID
STM32F0x2 USB line 2.0 to 3.6V
16KB to 128KB Flash
4-16KB SRAM
(Parity check)
20-byte backup data
16&32
-bit
timers
DAC
&
Comp
Touch
Sense
4xUSART
2xSPI
2xI2C
CEC
USB
Clock
free
CAN
STM32F0x8 Low Voltage line 1.8V +/- 8%
16KB to 256KB Flash
4-32KB SRAM
(Parity check)
20-byte backup data
16&32
-bit
timers
DAC
Comp
(*)
Touch
Sense
8xUSART
2xSPI
2xI2C
CEC
USB
Clock
free
(*)
STM32F0x1 Access line 2.0 to 3.6V
16KB to 256KB Flash
4-32KB SRAM
(Parity check)
20-byte backup data
16&32
-bit
timers
DAC
&
Comp
Touch
Sense
8xUSART
2xSPI
2xI2C
CEC
Main common features
042-6K SRAM
072-16K SRAM
STM32F0 Portfolio
Flash size
(bytes)
32 K
64 K
64 pins
LQFP / UFBGA
48 pins
LQFP/UFQFN
WLCSP 49
16 K
051-8K SRAM
32 pins
LQFP/UFQFN
WLCSP 36
128 K
071-16K SRAM
100 pins
LQFP / UFBGA
051-8K SRAM
071-16K SRAM
051-8K SRAM
071-16K SRAM
031-4K SRAM
031-4K SRAM
051-8K SRAM
051-8K SRAM
051-8K SRAM
28 pins UQFN
WLCSP 25
030-4K SRAM
20 pins
TSSOP
030-4K SRAM
STM32F0x1 Access Line
VDD = 2.4 to 3.6V
16KB-64KB Flash / 4KB-8KB SRAM
5x 16-bit timer including MC timer
2x SPI, 2x I2C,2x USART
12-bit ADC
85°c temperature range
LQFP package
STM32F030 Value Line
VDD = 2.0 to 3.6V
16KB-256KB Flash / 4KB-32KB SRAM
6x 16-bit timer including MC timer
1x 32-bit timer
2x SPI, 2x I2C, 8x USART, CEC,
12-bit DAC, 12-bit ADC, 2x Comp
Pin
count
STM32F0x2 USB Line
VDD = 2.0 to 3.6V
16KB-128KB Flash /6KB-16KB SRAM
10x 16-bit timer including MC timer
1x 32-bit timer
3x SPI, 2x I2C, 5x USART, CEC,CAN,
USB
12-bit DAC, 12-bit ADC, 2x Comp.
091- 32K SRAM 091-32K SRAM 091-32K SRAM
072-16K SRAM 072-16K SRAM
042-6K SRAM 042-6K SRAM 042-6K SRAM
042-6K SRAM
031-4K SRAM
030-4K SRAM
042-6K SRAM
256 K
030-8K SRAM
072-16K SRAM 072-16K SRAM
030-8K SRAM
072-16K SRAM
071-16K SRAM
098-32K SRAM
042-6K SRAM
VDD=1.8V +/- 8%
32KB-256KB Flash / 4KB-32KB SRAM
10x 16-bit timer including MC timer
1x 32-bit timer
3x SPI, 2x I2C, 8x USART, CEC,USB(*)
12-bit DAC(**), 12-bit ADC(**),Comp(**) (*) Check P/N not always present
(**)Analog with separate power supply 2.4V
STM32F0x8 1.8V
078-16K SRAM
031-4K SRAM 031-4K SRAM
058-8K SRAM
038-4K SRAM
031-4K SRAM
048-6K SRAM
058-8K SRAM
031-4K SRAM
042-6K SRAM
051-8K SRAM
051-8K SRAM
051-8K SRAM
031-4K SRAM
078-16K SRAM
058-8K SRAM
078-16K SRAM
098-32K SRAM
038-4K SRAM
091- 32K SRAM 091-32K SRAM 091-32K SRAM
098-32K SRAM
STM32L0 / STM32F0 positioning
STM32 for every application
Parameters
Low power modes consumption Eg.: STOP mode: ~8 times better in similar conditions
Dynamic efficiency in high speed Around 2 times better in similar conditions
Dynamic efficiency in low speed Mostly 6 times better on STM32L4
Price positioning
Specific peripherals & features Glass LCD,
ULP Timer, ULP USART,
EEPROM
CAN, 8xUSART, 8xTimers,
256/32kB
STM32L0 / STM32F0 positioning
STM32 for every application
Определяем требования к приложению. Больше ДА STM32L0
1) Ультра низкое потребление (RUN < 100мкА/MГц или Stop + RTC << 1мкA)
2) Быстрое пробуждение < 5мкс
3) EEPROM
4) LCD
5) Низкопотребляющие АЦП и компараторы
6) 16-бит АЦП
7) Два банка FLASH
8) Работа TMR или UART в режиме STOP
9) Дополнительные режимы LP RUN или Sleep (Бюджет по потреблению < 40мкА)
10) USB crystal less c работой в низко потребляющих режимах
11) Аппаратное шифрованиеAES 128-bit (AES 256 программно)
12) Расширенные RTC (0,5 сек точность, калибровка)
STM32L0 / STM32F0 positioning
STM32 for every application
Определяем требования к приложению. Больше ДА STM32F0
1. Агрессивная цена (не нужно низкого потребления)?
2. USB crystal less
3. FCPU > 32 МГц
4. До 256 Kб FLASH
5. SRAM с аппаратным контролем честности?
6. ЦАП или HDMI CEC
7. До 32 Кб SRAM
8. CAN
9. До 8 USART
STM32F3 family
Линейка МК STM32F1
до 16 КБ
SRAM
CPU
48 МГц до 128 КБ
FLASH
12 – бит
АЦП
(1 мкс)
USB FS
USB Access Line STM32F102
до 80 КБ
SRAM
CPU
36 МГц до 1МБ
FLASH
12 – бит
АЦП
(1 мкс)
Access Line STM32F101
до 8 КБ
SRAM
CPU
24 МГц до 128 КБ
FLASH
12 – бит
АЦП
(1.2 мкс) CEC(HDMI)
Value Line STM32F100
RTC c отдельным питанием и
внешним 32 КГц источником
тактирования
Внешние ист. тактирования
4-16МГц/4–24МГц/3-25МГц**
Встроенные RC генераторы 8
МГц и 40 КГц
Многофункциональная
периферия:
До 5 USART, 3xSPI, 2x I2C
Многофункц 16р таймеры
2 сторожевых таймера
2 канала 12 – бит ЦАП**
До 12 каналов DMA
2 – 3.6 В напряжение питания
5В толерантность портов в/в
От – 40 до +85°С или до +105°С
темпер. диапазон
FSMC
Connectivity Line STM32F105/STM32F107
до 64 КБ
SRAM
CPU
72 МГц до 256 КБ
FLASH
2x12 – бит
АЦП
(1 мкс)
USB 2.0
OTG FS
2xCAN
2.0B
2xI2S
audio
class
Ethernet*
IEEE 1588
3 фаз.
Таймер
УП
до 96 КБ
SRAM
CPU
72 МГц до 1 MБ
FLASH
2/3x12 –
бит АЦП
(1 мкс)
USB
FS
CAN
2.0B 2xI2C** SDIO**
Performance Line STM32F103
FSMC 3 фаз.
Таймер
УП
3 фаз.
Таймер
УП
Встроенная схема сброса
* только в STM32F107
** не во всех МК, более подробно в документации
Zoom on STM32 Mainstream Product compatibility
66
STM32F302
STM32F303 STM32F103
STM32F101
STM32F102
STM32F100 STM32F030
STM32F0x1
Upgraded class Budget price Foundation
Cortex-M0 Cortex-M3
Cortex-M4
STM32F0x2
STM32F301
GP Market
STM32 F3 products lines 67
Analog
Specific Segments
STM32F373
Precise
measurement Digital Power
STM32F301
High Resolution timer
(217ps)
16_bit
ADC ΣΔ
STM32F334
Memory
Pin Count
512KB
32KB
144 pins 32 pins
STM32F302
STM32F303
Power supply:
• F3x1, F3x2, F3x3: [2.0 .. 3.6V]
• F3x8: 1.8V +/-8%
You like the STM32 F1,
You will love the STM32 F3 !
• What do we offer more on F3 series ?
• More performance
• DSP and FPU instruction set (Cortex-M4 @ 72MHz)
• Routine booster (43% more performance / Flash execution)
• Higher Analog and Digital integration for a lower BOM cost and simplify board layout
• Fastest ADC (5Msps), Precise 16-Bit ADC Sigma Delta, Fast comparator (10ns), Op-Amp with
built in Gain (PGA), 144Mhz advanced PWM timer, I2S full duplex…
• Enhance safety
• SRAM with Parity Bit
• Polynomial CRC
• Lower power consumption in low power modes
• < 2µA in standby mode for energy saving
68
F3 series – Optimum integration
Results in simplified board
designs and fewer external
components
69
Op amps
Comparators
RTC
Temp sensor
DACs
MCU
Advanced
ADCs
Project cost $$$
Project cost $
The STM32 F3 series innovates in
embedded digital signal control by
combining Cortex-M4 with advanced
analog peripherals
F3
70 STM32 F3 product lines (present and future)
Part numbers with power supply 2.0 to 3.6V
Other part number available: STM32F3x8 (Power supply = 1.8v +/-8%)
GP Market
Specific Segments
71 F3 lines for GP market
STM32F3 present and to come 72
256 K
128 K
48 pins
LQFP
WLCSP 49
64 pins
LQFP
100 pins
LQFP
64 K
F303-32kB RAM
F373-32kB RAM
F373-24kB RAM
F378-32kB RAM
F373-16kB RAM
F303-32kB RAM
F303-40kB RAM
F302-32kB RAM
F302-24kB RAM
F302-32kB RAM
F302-24kB RAM
F303-40kB RAM
F303-32kB RAM
F302-32kB RAM
F302-24kB RAM
F303-40kB RAM F373-32kB RAM
F373-24kB RAM
F378-32kB RAM
F373-16kB RAM
F373-32kB RAM
F373-24kB RAM
F378-32kB RAM
F373-16kB RAM
F358-40kB RAM F358-40kB RAM F358-40kB RAM
512 K
32 K
F301-16kB RAM
F301-16kB RAM
F301-16kB RAM
F303-64kB RAM
F302-64kB RAM
F398-64kB RAM
F318-16kB RAM
F303-64kB RAM
F302-64kB RAM
F398-64kB RAM
32 pins
LQFP /
UFQFPN
F301-16kB RAM
F318-16kB RAM
F334-16kB RAM
F302-16kB RAM F302-16kB RAM F302-16kB RAM
F302-16kB RAM F302-16kB RAM F302-16kB RAM
F303-16kB RAM F303-16kB RAM F303-16kB RAM
F303-16kB RAM F303-16kB RAM F303-16kB RAM
48 pins
LQFP
WLCSP 49
64 pins
LQFP
32 pins
LQFP /
UFQFPN
F334-16kB RAM F334-16kB RAM
100 pins
LQFP/BGA
F318-16kB RAM
F328-16kB RAM F328-16kB RAM F328-16kB RAM
F303-64kB RAM
F302-64kB RAM
F398-64kB RAM
F334-16kB RAM F334-16kB RAM F334-16kB RAM
VDD=1.8V +/- 8%
32KB-512KB Flash / 4KB-20KB SRAM
10x 16-bit timer including MC timer
1x 32-bit timer
3x SPI, 2x I2C, 5x USART, CEC,USB(*)
12-bit DAC(**), 12-bit ADC(**),Comp(**) (*) Check P/N not always present
(**)Analog with separate power supply 2.4V
STM32F3*8 STM32F3*2
VDD = 2.0 to 3.6V
16KB-512KB Flash /8KB-64KB SRAM
USB FS, CAN
1x MC timer
Up to 2xADC 5Msps, 4x Comp, 2x Op-
Amp, 1xDAC
Pin
count
VDD = 2.0 to 3.6V
16KB-512KB Flash / 8KB-64KB SRAM
4k to 16KB CCM SRAM
USB FS, CAN
Up to 3x MC timer
Up to 4xADC 5Msps, 7x Comp, 4x Op-
Amp, 3xDAC
STM32F3*3 STM32F3*1
VDD = 2.0 to 3.6V
16KB-64KB Flash / 10KB-16KB SRAM
1x MC timer
Up to 1xADC 5Msps, 3x Comp, 1x Op-
Amp, 1xDAC
Flash size
(bytes)
144 pins
LQFP
F301-16kB RAM F301-16kB RAM
STM32 F3 innovations / Control loop 73
20/06/2016
SW • FPU
• Enhance dynamics
• No scaling overhead
• No saturation
• DSP (fast MAC)
• SIMD
• Parallel processing
• Low interrupt latency
• CCM-SRAM (0 wait sate)
PWM Timers * 144MHz (6.9ns)
* 217ps (4.6GHz eq.)
+
-
Set
point
Direct HW path (no latency)
• Instantaneous control load
• Protection
Cortex-M4F core & System archi.
PWM
PLANT
+
- DAC
An
alo
g fe
ed
ba
cks
Multiple fast Comparators
Dig
ita
l fe
ed
ba
ck
PGA
High BdW
Low offset
Prog. Gain
Other Timers
• Quad encoder
• Halls ensors
Comp
-
4x 12-Bit 5Msps ADC • SAR (no pipeline delay)
• Low latency (200ns)
• Low aperture time
(21ns) for snapshot
measurements
• Simultaneous sampling
on multiple ADCs
• Reduce latency
• Reduce errors in
mulitphase
Innovative and extensive peripherals (mid-2014) 74
Unit parameters STM32F303 STM32F302 STM32F301 STM32F373 STM32F334
Core, frequency ARM Cortex-M4, 72 MHz
FPU / MPU FPU / MPU FPU / MPU*
*Down to128KB only FPU FPU / MPU FPU / MPU
Flash (Up to) 512 KB 64 KB 256 KB 64 KB
SRAM (Up to) 64 KB 64KB 16 KB 32 KB 12 KB
FSMC Yes*
*Down to 256KB only
Yes* *Down to 256KB only
- - -
Routine booster
CCM-SRAM (Up to) 16 KB - - - 4 KB
ADC SAR (Up to) 4x 12-bit
5 MSPS
2x 12-bit
5 MSPS
1x 12-bit
5 MSPS
1x 12-bit
1 MSPS
2x 12-bit
5 MSPS
16-bit ∑∆ ADC
with 7 built in gains - 3 -
Comparator (Up to) 7 4 3 2 3
Op amp with 4 built-in gain
values with 1% accuracy (Up
to) 4 2 1 - 1
12-bit DAC (Up to) 3 1 1 3 3
Advanced MC timer (Up to) 3 x (144 MHz) 1x (144 MHz) 1x (144 MHz) - 1x (144 MHz)
Hi-Resolution Timer - - 10ch (217ps)
Other digital
(except SPI, USART, I²C)
1x USB FS device, 1x CAN, Touch
Sense
1x CAN, Touch
Sense
1x USB FS
device, 1x CAN,
Touch Sense
1x CAN, Touch
Sense
Meet the STM32 – Sphero BB-8 droid 75
STM32 High Performance Series
STM32F4
Performance
DNA Product
Series System HW acceleration
Advanced
Comm. Periph.
Graphic and
Audio
• Smart architecture for fast
data transfers: DMAs, Bus
Matrix
• Operating from 1.7 to 3.6V
• From - 40 up to 105 °C
• Rich peripheral set
including: CAN, Ethernet,
Camera interface, SDMMC,
USB OTG
• Advanced analog features
• 16-bit, 32-bit timers
• Low power Batch
Acquisition Mode (BAM)
• 2 watchdogs
• Temperature sensor
• Unique ID
• CRC
STM32F7
FPU, DSP
instructions
MPU
Execution:
ART Accelerator™
Graphics:
Chrom-ART
Accelerator™
Crypto-Hash:
coprocessor
SDRAM I/F,
Dual Quad-SPI
I/F
SPDIF, HDMI-
CEC 2xSAI
TFT LCD
STM32F4
FPU, DSP
instructions
MPU
Execution:
ART Accelerator™
Graphics:
Chrom-ART
Accelerator™
Crypto-Hash:
coprocessor
SDRAM I/F,
Dual Quad-SPI
I/F
SPDIF, HDMI-
CEC up to 2xSAI
TFT LCD I/F
MIPI DSI I/F
STM32F2 MPU
Execution:
ART Accelerator™
Crypto-Hash:
coprocessor
STM32F high performance MCUs 77
The high performance STM32 series offers up to 1082 CoreMark of performance and a rich set of peripherals
to address all developers needs
► ARM Cortex-M4 + FPU up to 180 MHz – 225 DMIPS
► From 64 KB to 2 MB Flash, up to 384 KB RAM
►Select the right F4 for your needs: from the
<<F401/F411 Access lines to the most Advanced Lines
► ARM Cortex-M7 + FPU up to 216 MHz – 462
DMIPS
► From 512 KB to 2 MB Flash, 512 KB RAM
► Very High performance from Flash and external
<<memories (including dual Quad-SPI)
► ARM Cortex-M3 at 120 MHz – 150 DMIPS
► From 128 KB to 1 MB Flash, up to 128 KB RAM
►Foundation for performance and connectivity
1082
608
398
STM32F4 - №1 по производительности
Dhrystone 1.0 results
STM32F4 и конкуренты
ART Accelerator™
Адаптивный акселератор памяти позволяет ядру Cortex-M4 достичь
максимальной производительности с 0-задержкой исполнения кода из
flash-памяти на 180 MГц
7-уровневая 32-бит матрица шин
Матрица шин (AHB)
Сжатый аудио-
поток (MP3) в 16Кб
SRAM
Декодирование
MP3 в CPU Доступ к данным
MP3 для
декодирования
Декодированный
аудио-поток в
112Кб SRAM
Передача через
DMA аудио (I2S)
Передача через
DMA графических
картин из Flash на
дисплей
STM32F4 №1 по производительности: комбинация ядра, встроенной Flash,
технологического процесса, матрицы шин и ART Accelerator
Key NEWS
• New entry level STM32F4 devices • STM32F410 with128kB flash / 32kB SRAM
• Full production already
• STM32F446 with 512kB flash / 128kB SRAM
• Full production already
• Price level as STM32F2xx
• New graphical STM32F4 devices with DSI • STM32F469 with 2MB flash / 384kB SRAM
• Full production already
82
Key NEWS 83
STM32F4 Lines
Access to the high performance platform
STM32F407 STM32F405
STM32F205 STM32F207
225
210
150
125
105
Access to high performance
Light cost, Tiniests devices
Dynamic efficiency
Connectivity
Large portfolio
Security
Enhanced Graphic
High memory density
STM32F427 STM32F429
Features
STM32F446
DMIPS
STM32F410
Access Foundation Advanced
84
STM32F411 STM32F412
STM32F401
Q3 2016
ART AcceleratorTM => Highest execution performance from Flash
• ST Adaptive Real Time (ART) Accelerator is a prefetch queue and branch cache allowing zero-wait
execution from embedded Flash. The performance of the core is then fully unleashed and
available to the user. Because it is much smaller in die size than a real cache, performance come
with high integration. Execution from the branch cache reduces the access to the Flash and
reduces power consumption
ST 90 nm process => Less dynamic power. More integration and performance
• Higher integration comes with smaller capacities inside the transistors used inside the STM32
integrated circuit. This translates into faster performance as charge and discharge timings are
reduced and into lower dynamic power
Voltage scaling => Optimum dynamic power consumption. Whatever your
performance needs
• By allowing the user to dynamically adapt the core voltage to the performance needs, the user
always gets the lowest dynamic current
Batch Acquisition Mode (BAM) => Always ON data collection, even when the core is
stopped
• DMA keeps transferring incoming data from peripherals to memory, and wakes up the core only
when needed to reach the lowest power consumption. The core can either execute first level data
processing from code stored in RAM or resume executing from Flash
STM32 Dynamic EfficiencyTM Technologies 85
STM32F4
RAM DMA
DFSDM
Cortex-M4
ART
BAM
Cortex-M4
RAM fetch
LPSD
Quiet BAM
Cortex-M4
RAM fetch
LPSD
Detected
Cortex-M4
Flash fetch
Algorithm
Processing
Voice trigger
detection
0111010100101001010101111
0011010
DFSDM
FLASH
0111011000010
Current
consumption
BAM explained Voice recognition use case
Filtering /
Decimation /
Gain control
done by HW
with DFSDM
(STM32F41x)
86
Dynamic RUN Mode* STOP
Mode
Vbat Mode
w/o or w/ RTC
Measurement conditions:
VDD = 1.8V
Typical process
Room temperature
STM32F4 Access Lines Power consumption figures
STM32F401xC
Cu
rre
nt
Legend: *Run mode Conditions: Coremark executed from Flash, peripherals OFF
STM32F411 STM32F401xE
88
STM32F41x*
<1µA
<1µA
<1µA
<1µA
100µA/MHz
128µA/MHz
136µA/MHz
89µA/MHz
112µA/MHz
STM32F410
10µA Wake up time: 113μs
42µA Wake up time: 21μs
10µA Wake up time: 113μs
43.1µA Wake up time: 21μs
10µA Wake up time: 113μs
42µA Wake up time: 21μs
6µA Wake up time: 113μs
14µA Wake up time: 21μs
18µA Wake up time: 113μs
50µA Wake up time: 21μs
Standby Mode
w/o and w/ RTC
1.8µA
2.4µA Wake up time: 314μs
1.8µA
2.4µA Wake up time: 314μs
1.8µA
2.6µA Wake up time: 314μs
1.8µA
2.4µA Wake up time: 314μs
1.8µA
2.6µA Wake up time: 314μs
<1µA
STM32L4 / STM32F4 positioning 92
STM32 for every application
Parameters
Low power modes consumption Eg.: STOP mode: 6 – 15 times depending on line
Dynamic efficiency in high speed Nearly the same values in similar conditions
Dynamic efficiency in low speed Mostly 6 times better on STM32L4
Price positioning
Specific peripherals & features
Glass LCD, OpAmps, DAC,
ULP Timer, ULP USART,
USB crystal-less,
RC 1%, MSI, 125°C
STM32F4 Dynamic efficiency line:
F401, F410, F411, F412
High-performance platform 93
DMIPS
STM32F407 STM32F405
STM32F205 STM32F207
Access Foundation Advanced
225
210
150
125
105
Dynamic efficiency
Access to high
performance with light
cost
Connectivity
Large porfolio
Security
Enhanced Graphic
High memory density
STM32F427 STM32F429 STM32F446 STM32F469
Features
In production
STM32F746 400+
STM32F401
STM32
F411
STM32
F410 STM32
F41x
Production
H1’16
STM32F76x
F446 Cost effective high performance MCU
with SDRAM and Quad SPI
94
Dynamic efficiency
Light cost STM32F401 STM32F411
Access
Extended Connectivity
and Features
Security
STM32F407 STM32F405 STM32F205 STM32F207 STM32F446
Foundation
Enhanced Graphic
High memory density
Security
STM32F427 STM32F429 STM32F469
Advanced
95
Линейка STM32F207 и STM32F217
До 128
Kб SRAM
До 1Mб
FLASH
2xCAN
2.0B
Ethernet
IEEE 1588
Интерфейс
камеры
Crypto/Hash
сопроцессор*
Cortex-M3
120MГц
Семейство STM32F2/F4 Все варианты включают:
До 6xUSART, до 3xSPI, до
3xI2C, до 2хI2S
До 16 каналов DMA
2 x Watchdogs
16-бит и 32-бит
таймеры
Датчик температуры
Встроенные 16 МГц RC
и 32 КГц RC
генераторы
RTC
3 х АЦП 12-бит(0.5мкс)
2 х ЦАП 12-бит
2 таймера управления
двигателями
Контроллер LCD и
статической памяти
FSMC
1 x USB 2.0 OTG FS
1 x USB 2.0 OTG FS/HS
Встроенный генератор
случайных чисел
До 128
Kб SRAM
До 1Mб
FLASH
2xCAN
2.0B
Crypto/Hash
сопроцессор*
Cortex-M3
120MГц
Линейка STM32F205 и STM32F215
* Только в STM32F217/215
SDIO интерфейс для SD
Абсолютно такая же линейка на
Cortex-M4 c частотой до 168 МГц,
192 Кб SRAM, до 2Мб FLASH и
100% pin-to-pin
STM32F407/417 и STM32F405/415
STM32F446 96
• Features
• Cortex-M4 with DSP and FPU;
180MHz/225 DMIPS
• Improved ADC accuracy
• Dual Quad SPI, SDRAM I/F, 2xSAI
,3xI2S half duplex, SPDIF IN, CEC,
USB dedicated supply for 1.8V
support
• Power efficiency: <100uA STOP
• Packages
• WLSCP
• LQFP64, LQFP100, LQFP144
• BGA144 (0.5 & 0.8)
• Memory size:
• 256-Kbyte Flash/ 128-Kbyte SRAM
• 512-Kbyte Flash/ 128-Kbyte SRAM
STM32F446 line
STM32F446RC
64 pins
LQFP
81 pins
CSP
100 pins
LQFP
144 pins
LQFP
BGA pitch 0.8
BGA pitch 0.5
512 KB
256 KB
Flash
Pin count
STM32F446MC STM32F446VC STM32F446ZC
STM32F446RE STM32F446ME STM32F446VE STM32F446ZE
• Packages
• WLSCP
• LQFP64, LQFP100, LQFP144
• BGA144 pitch 0.5, BGA 144 pitch 0.8
• Memory size:
• 256-Kbyte Flash/ 128-Kbyte SRAM
• 512-Kbyte Flash/ 128-Kbyte SRAM
High-performance platform 102
DMIPS
STM32F407 STM32F405
STM32F205 STM32F207
Access Foundation Advanced
225
210
150
125
105
Dynamic efficiency
Access to high
performance with light
cost
Connectivity
Large porfolio
Security
Enhanced Graphic
High memory density
STM32F427 STM32F429 STM32F446 STM32F469
Features
In production
STM32F746 400+
STM32F401
STM32
F411
STM32
F410 STM32
F41x
Production
H1’16
STM32F76x
STM32F4 103
20.06.2016 STM32 short roadmap
STM32F469 block diagram
• ARM Cortex-M4 Core @180MHz min, 225DMIPS
• 2MB dual –bank Flash, 384KB SRAM
• SDRAM interface, dual Quad SPI
• Display interface:
• MIPI: Display Serial Interface (DSI)
• TFT LCD controller
• Audio interface:
• 1xSAI, 2xI2S full duplex,
• USB dedicated supply for 1.8V support
• Packages :
• WLCSP169, BGA169, LQFP208, BGA216,
• LQFP 176
104
F469 Features benefits 105
• MIPI® DSI controller
• Advanced Animation and Graphical usere interfaces
• Aligned on mobile industry standards
• Opening the door to next generation displays with higher pixel density
• Only 2 pins for each Lane are requested to interface with the display panels
• Availibility even on small packages => BOM cist saving
• Lower power consumption and less electromagnetic interference
• TFT LCD controller
• Advanced animations and graphical user interfaces
• Drives displays without embedded controllers BOM cost saving
Display interfaces with STM32F469 108
20/06/2016 Presentation Title
DSI Host
RAM FMC Flash
LCD-TFT
CTRL
DPI Cortex-M4
ART
Chrom-ART
Serial high speed interface
Up to 6 pins
Up to 720p 30Hz resolution
eDPI
PPI D-PHY
DSI Display W or W/O
controller and GRAM
DP
I D
BI
Parallel interface
Up to 22 pins
Up to VGA/WQVGA resolution
Parallel interface
Up to 28 pins
Up to XGA resolution
Parallel interface LCD Display Without controller and GRAM
Parallel interface LCD Display With controller and GRAM
DBI
Supported resolutions without external RAM using TFT controller
109
bpp ↓
resolution→
BUFFER SIZES (Kbytes) ↘
CGA (320x200)
QVGA (320x240)
WQVGA (480x272)
VGA (640x480)
WVGA (800x480)
SVGA (800x600)
XGA (1024x768)
1 (2 colors) 7.8 9.4 15.9 37.5 46.9 58.6 96.0 2 (4 colors) 15.6 18.8 31.9 75.0 93.8 117.2 192.0
4(16 colors) 31.3 37.5 63.8 150.0 187.5 234.4 384.0
8 (256 colors) 62.5 75.0 127.5 300.0 375.0 468.8 768.0 16 (high color) 125.0 150.0 255.0 600.0 750.0 937.5 1536.0
24 (true color) 187.5 225.0 382.5 900.0 1125.0 1406.3 X 32 (deep color) 250.0 300.0 510.0 1200.0 1500.0 X X
STM32F469
STM32F469
TFT
or
DSI
Frame
buffer 1
Frame
buffer 2
Display Chrom-
ART
111
bpp ↓
resolution→
BUFFER SIZES (Kbytes) ↘
CGA (320x200)
QVGA (320x240)
WQVGA (480x272)
VGA (640x480)
WVGA (800x480)
SVGA (800x600)
XGA (1024x768)
1 (2 colors) 7.8 9.4 15.9 37.5 46.9 58.6 96.0 2 (4 colors) 15.6 18.8 31.9 75.0 93.8 117.2 192.0
4(16 colors) 31.3 37.5 63.8 150.0 187.5 234.4 384.0
8 (256 colors) 62.5 75.0 127.5 300.0 375.0 468.8 768.0 16 (high color) 125.0 150.0 255.0 600.0 750.0 937.5 1536.0
24 (true color) 187.5 225.0 382.5 900.0 1125.0 1406.3 X 32 (deep color) 250.0 300.0 510.0 1200.0 1500.0 X X
Supported resolutions with external RAM using TFT interface
SDRAM
STM32F469
TFT
or
DSI
Frame
buffer 1
Display
Frame
buffer 2
16/32 bits F
M
C
Chrom-
ART
F469
back
A choice of advanced graphical stacks taking the full
advantage of Chrom-ART graphics Hardware
acceleration
113 STM32F469 Ecosystem
Семейство STM32 F7
Key NEWS
• Bigger brother in STM32F7 series • STM32F7xx with 2MB flash / 512kB SRAM
• JPEG HW accel., 3xCAN’s, DFSDM, ….
• Sampling to alpha CTM’s, MP in May
• Announcement week 3’16
115
Ядро
ARM CORTEX-M7
116
DSP
• Архитектура ARMv7E-M
• Гарвардская архитектура, конвейер 6 - уровней
• Супер скалярная архитектура!
• Поддержка деления, инструкций SIMD
• Модуль защиты памяти (MPU)
• Модуль плавающей точки (FPU, двойной)
• Включен во все STM32 на ядрах ARM Cortex-M4 и Cortex-M7
Ядро Cortex-M7 118
На один шаг ближе к DSP На один шаг ближе к процессорам
реального времени
Выполнение операций загрузки/выгрузки
параллельно с арифметическими операциями
Прямой доступ ядра к 2 областям оперативной
памяти
Операции ветвления без задержек Кеш память для внешней памяти ( шина AXI-M)
12-тактов задержки ISR
Cortex-M7 → параллельное выполнение 119
1
Fetch Decode Issue Prefetch
DATA PROCESSING UNIT
(+ FPU)
LOAD/STORE
UNIT
PREFETCH
UNIT
#1 DECODE #2 DECODE
64-бит за 1 такт
Load/Store 1
Load/Store 2
ALU 1 (Main)
ALU 2
MAC (32b x 32b + 64b)
FPU
2 3 4
32-бит
32-бит
Execute
BTAC 64-entry
X 64 bits
BRANCH
(2x 32b)
Память данных
NVIC
DPU
Операции математики и load/store
• Cortex-M4
• Единичные операции load/store занимают 2 такта
• N последовательных операций load/store занимают N+1 тактов
• Cortex-M7
• Операции load/store выполняются параллельно
с арифметическими
• Доступ к памяти без задержек!
120
Работа компилятора!
Выборка Декодиро
вание
Результат
#1 DECODE #2 DECODE
Load/Store 1
Load/Store 2
ALU 1 (Main)
ALU 2
32-бит (2x 32b)
32-бит
Выполнение
Группировка команд
Параллельное
выполнение команд
Архитектура STM32F7
121
DSP
DMA1 DMA2 ETH
DMA
USB
HS
DMA L1-Cache
4/16KB I/D
AXI to Multi-
AHB
LCD-
TFT
DMA
Chrom-
ART
SRAM
240/368 KB
SRAM
16 KB
AHB1
Peripheral
AHB2
Peripheral
FMC
QuadSPI
ITCM RAM
16 KB
DTCM RAM
64/128 KB
AX
IM
AH
BS
ITC
M
DT
CM
APB1
Peripheral
APB2
Peripheral
FLASH
1/2 MB
AH
BP
DM
A_M
EM
1
DM
A_M
EM
2
DM
A_P
1
DM
A_P
2
ART
Шина ITCM
Шина DTCM
Шина AXIM
Шина AHBS
Гибкая архитектура STM32F7x6 122
64-b
it
Bu
sM
atr
ix 32-бит матрица шин
Cortex-M7
Выполнение кода возможно из:
Flash ITCM с ART Accelerator
или
Flash AXI с L1-cache
или
Внешняя память с L1-cache
Архитектура ядра 123
DATA PROCESSING
UNIT
(+ FPU)
NVIC
LOAD/STORE
UNIT
STORE
BUFFER
BUS INTERFACE
UNIT
MPU
AXI-M
AHBS
for DMAs
AHBP (периферия)
Прерывания
TIGHTLY COUPLED MEMORY UNIT SQ
ARM® Cortex®-M7
ITCM DTCM
DEBUG ETM/ITM trace
Отладка
AHBD
PREFETCH
UNIT
AXI to Multi-AHB
Внешняя память Внутренняя память
I-Cache D-Cache
ART
FLASH
64-бит
64-бит
256-бит
Резюме
1. Супер скалярная архитектура
→ 2 инструкции за 1 такт
2. Ветвление за 1 такт
3. Система кэш менеджмента для
работы с медленной памятью
4. Развитая архитектура для
работы с большими объемами
данных
124
1000 CoreMark
Семейство STM32F7
126
Портфолио STM32F7 (1/2) 3/7
STM32 F7 1MB block diagram 127
• NEW core: ARM Cortex-M7
• Up to 216 MHz, 428 DMIPS/1000 CoreMark
• Twice more DSP performance vs Cortex-M4 core
• New generation of Peripherals
• 2xSAI, 3xI2S half duplex, USB dedicated supply for
1.8 V operation, CEC, Quad SPI,SPDIF input, 4xI2C.
• Same packages as F429
• WLCSP143
• LQFP100,144,176,208
• BGA 176, 216
ARM Cortex-M7
216 MHz
128
• Cortex-M7 with double precision FPU
• 216 MHz, 462 DMIPS/
1082 CoreMark
• 2MB Flash / 512KB SRAM
• Twice more DSP performance vs
Cortex-M4 core
• New generation of peripherals
• 2xSAI, 3xI2S half duplex, Dedicated
supply for 1.8 V operation for USB and
SDMMC, CEC, Dual mode Q-SPI,SPDIF
input, 4xI2C, 2 SDIO I/F, 3 CAN, MIPI
DSI, JPEG H/W codec, MDIO slave
• Same packages as F429 • WLCSP180(168 active) pitch 0,4mm
• LQFP100,144,176,208
• BGA176, 216
STM32 F7 2MB block diagram
ARM Cortex-M7
216 MHz
LQFP100
TFGBA100 (F7x6, F745) only
WLCSP143 LQFP176
UFBGA176 LQFP208 TFBGA216
512 K
1 M
Flash size (byte)
STM32F746VG STM32F746ZG STM32F746IG STM32F746BG STM32F746NG
STM32F746VE STM32F746ZE STM32F746IE STM32F746BE STM32F746NE
STM32F756VG STM32F756ZG STM32F756IG STM32F756BG STM32F756NG
Legend: without HW crypto/Hash coprocessor with HW crypto/Hash coprocessor
Pin count
STM32F745VE STM32F745IE
STM32F745VG STM32F745IG
RAM size (byte)
2 M
STM32F769AG STM32F769BG STM32F769NG
STM32F767VG STM32F767IG STM32F767BG STM32F767NG
1 M
LQFP144
STM32F746ZG
STM32F746ZE
STM32F756ZG
STM32F745ZE
STM32F745ZG
STM32F777VI
STM32F767VI
STM32F769AI*
STM32F779AI*
STM32F767ZG
STM32F777ZI
STM32F767ZI
STM32F769IG LQFP only
STM32F779II LQFP only
STM32F767II
STM32F769II LQFP only
STM32F777II
STM32F769BI
STM32F779BI
STM32F767BI
STM32F777BI
STM32F769NI
STM32F777NI
STM32F767NI
STM32F779NI
320K
+ 16K ITCM +
4K Backup
320K
+ 16K ITCM +
4K Backup
512K
+ 16K ITCM +
4K Backup
512K
+ 16K ITCM +
4K Backup
STM32 F7 portfolio with short term roadmap
WLCSP168
129
STM32F765VI STM32F765ZI STM32F765II STM32F765BI STM32F766NI
STM32F765VG STM32F765ZG STM32F765IG STM32F765BG STM32F766NG
(*) : exist in Vreg_OFF version (resp. STM32F778AIY6TR and STM32F768AIY6TR)
Отладочные платы 130
STM32746G-EVAL
STM32756G-EVAL
STM32F746G-DISCO
• 216 МГц STM32F756NGH6 или STM32F746NGH6
• SAI аудио ЦАП, стерео audio jack, микрофон
• SDRAM 8Mx32 SDRAM, 1Mx16 бит SRAM, 8Mx16
бит NOR FLASH и 512 Mбит QuadSPI NOR FLASH
• Цветной 5.7’ 640 x 480 TFT LCD сенсорный экран
• Ethernet EEE-802.3-2002
• USB OTG HS/FS, разъем micro-AB
• CAN 2.0A/B
• Модуль камеры
• 216 МГц STM32F746NGH6, 1 Mб Flash, 340 Kб RAM
• Цветной 4.3’ 480x272 LCD-TFT сенсорный экран
• 128-Mбит Quad-SPI Flash, 128-Mбит SDRAM
• Ethernet IEEE-802.3-2002
• USB OTG HS/FS, разъем micro-AB
• SAI аудио кодек, стерео выход
• Два МЭМС микрофона
• Модуль камеры
• Поддержка VCP, MS и отладочного порта
STM32 Ecosystem
Multi-IDE support
STM32 open development platform HW SW Expansion
STM32 Cube expansion SW
STM32 Nucleo expansion boards
(Nucleo shields) STM32
Cube
SW library
STM32
Nucleo
development
boards
Key NEWS
• Introducing STM32 Nucleo-32 • Module like approach addressing smallest STM32’s
• Compatible with Arduino Nano
• Same price as Nucleo-64
• Preparing STM32 Nucleo-144 • Addressing bigger STM32’s
• Following Ardunio Uno
• Announcement week 4’16
134
Key NEWS
• STM32 Cube Low Layer • Simple and efficient libraries (snippets like)
• Available today for STM32L4, next to come in 2016
• STM32 toolset running under Linux • Linux drivers for ST-Link
• Linux version of STM32CubeMx
• Linux version of SW4STM32 by AC6
• Announcement week 5’16
135
STM32L0x – Ecosystem 136
Evaluation Discovery Nucleo Q1’15 Available Available
• Evaluate, Discover and Play
• STM32CubeMX Software: Optimize your design layout, configure MCU
usage and estimate power consumption
• STM32CubeL0: Embedded Software,
from Hardware Abstraction Layer (HAL)
easing migration from any STM32 and
middleware offer like FreeRTOS and USB
library
• STM32L0 Snippets: 70+ free highly
optimized C code examples. Reach lowest
consumption, best performance and a
minimum of memory footprint. CMSIS-
compliant direct register access reduces
code overhead to a minimum.
• Software offer
GCC
based
toolchains
• Feel free to choose your IDE
Free Keil IDE for STM32 Cortex M0/M0+ (no flash size limitation)
Nucleo-32
STM32 with
32 pins
Introducing STM32 Nucleo-144
Nucleo-144
STM32 with
144 pins
Nucleo-64
STM32 with
64 pins
STM32 Nucleo-32 features
Integrated ST-Link/V2-1:
drag & drop device flash programming
138
Push button, 2 color Leds
Arduino Nano extension connectors :
easy access to add-ons
One STM32 MCU flavor with 32 pins
Flexible board power supply :
through USB or external source
Much smaller size for more choice
STM32 Nucleo-144 features
Integrated ST-Link/V2-1:
drag & drop device flash programming
139
Ethernet & USB OTG (optional)
Arduino Uno & ST Zio connectors :
easy access to add-ons
One STM32 MCU flavor with 144 pins
Flexible board power supply :
through USB or external source
More choice to make connections
ST morpho extension :
direct access to all mcu I/Os
STM32 Nucleo portfolio 140
STM32 Nucleo exposes the whole family of STM32
microcontrollers
More Nucleo expansion boards
BLE
Motion & Environmental
sensors
Dynamic NFC
tag
Audio Microphones Proximity & Light
sensor
Motor driver LED driver
WiFi 802.11 b/g/n
Sub-1GHz
Security
User code
Middleware
RTOS, USB, TCP/IP, Graphics...
Hardware abstraction layer
STM32Cube Embedded software
Software Development – STM32Cube
• Get configuration code generated* from a tool with STM32Cube and
focus on your added-value software !
• 4 configuration wizards: pinout, clock, peripherals & middleware, power consumption
• Portable Hardware Abstraction layer, from one series to another
• Middleware with RTOS, USB, TCP/IP, File System, Graphics
142
STM32CubeMX Configuration tool on PC
Initialization C code
generation
depending on user choices
143 STM32Cube - Embedded software Architecture and user entry points
STM32Cube HAL
(Hardware Abstraction Layer)
TCP/
IP
FAT
File
Sys.
Gfx
USB
Host /
Device
STM32Cube Middleware level
RTOS
STM32Cube Embedded Software packages
Touch
STM32Cube LL
(Low-Layer APIs)
User Application Code
STM32
• Three entry points for the user
application:
• Middleware stacks
• HAL API
• LL APIs
• Possible concurrent usage of
HAL and LL
ST Embedded software offer – Comparison
Offer Portability Optimization
(Memory & Mips) Easy Readiness
Hardware
coverage
STM32Snippets +++ +
Standard Peripheral Library ++ ++ + ++ +++
STM32
Cube
HAL API +++ + ++ +++ +++
LL APIs + +++ + ++ ++
145
EMBEDDED SOFTWARE
• STM32L4 Hardware Abstraction Layer (HAL) portable APIs
• High-performance, light-weight Low Layer (LL) APIs
• High coverage for most STM32 peripherals
• Production Ready and fully qualified
• Dozens of usage examples
• Open source BSD license
STM32CubeL1 Hardware Abstraction Layer
CMSI
S
STM32CubeF0 Hardware Abstraction Layer
CMSI
S
STM32CubeF3 Hardware Abstraction Layer
CMSI
S
STM32CubeF2 Hardware Abstraction Layer
CMSI
S
STM32CubeF4 Hardware Abstraction Layer
CMSI
S
STM32CubeF1 Hardware Abstraction Layer
CMSI
S
STM32CubeL4 Low level drivers
CMSIS
STM32CubeL4 Middleware
User Code
• USB Host and Device library from ST
• STemWin graphical stack library from ST and Segger
• Open-source FAT file system (FatFs)
• Open-source real-time OS (FreeRTOS)
• Numerous examples
STM32L4 ecosystem
Monitor Generate Code Compile & Debug
STM32
CubeMX Partners IDEs STMStudio
… with comprehensive choice of free IDEs
FREE
IDE’s