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1 http://ewh.ieee.org/r10/malaysia/cpmt/
2 36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
Program Highlights 5 technical courses offered by industry
leaders on 3D advanced packaging,
package reliability and mechanics,
advanced failure analysis techniques,
embedded technologies, power electronics
and high temperature power module design.
9 keynotes covering latest technology and
industry trend in electronics packaging
A panelist forum titled “IoT: Roles of
Packaging and Industry Trends”, will
touch on packaging cost and its margin in
product; 18” wafer investment versus
Panel/FOWLP; SiP versus SoC; and low cost
innovation.
Technical paper presentation tracks featuring
>90 technical papers & posters from around
the industry and academia
More than 15 exhibitors from the renowned microelectronics industries and supply chain
3 36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
4
11 NOVEMBER 2014, TUESDAY
0800-0830 Registration at Secretariat (Level 2)
0830-1200
Course 1 Meeting Room 2
Introduction to
Mechanics based Quality and Reliability
Assessment Methodology
by Dr. Sane Sandeep & Shubhada
Sahasrabudhe
Course 2 Meeting Room 3
Failure Analysis
on Modern Logic and
Mixed-Signal IC’s: Tools and
Methods by Christian
Burmer
Course 3 Meeting Room 5
Power Electronics and Embedding
Technologies
by Rolf Aschenbrenner
1200-1330 Lunch
1330-1700
Cont.’ Course 4 Meeting Room 3
Advanced
Stacked Die Packaging
Technology: More than 2D
by Dr John Yuanlin Xie
Course 5 Meeting Room 5
High-
Temperature Packaging with
Emphasis on Power Electronic
Module by Prof. Simon S.
Ang
1800-2200 VIP Dinner
36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
12 NOVEMBER 2014, WEDNESDAY
0730-1730 Registration at Secretariat (Level 2)
0815-0830 Welcome Speech
Grand Ballroom by Prof. Mohd. Nasir Tamin, IEMT2014 General Chair
0830-0910
Conference Opening Address “Panel Level Packaging Technologies as Enabler for
Innovative Mobile Devices” by Mr. Rolf Aschenbrenner,
Fraunhofer Institute for Reliability and Microintegration
0910-0950
Keynote Address I “Packaging and Interconnection Trend”
by Mr. Xavier Baraton, VP of Packaging & Test Manufacturing, STMicroelectronics
0950-1045 Coffee Break / Exhibition / Poster Session I
1045-1125
Keynote Address II “Automotive Power Packaging – Trends and Challenges”
by Dr. Andreas Knoblauch, Director, Package Development Automotive Power,
Infineon Technologies AG
1125-1205
Keynote Address III “Packaging Technology Challenges for Mobile
Computing Electronics” by Mr. Sow Yeek Kooi
Director, Technology Enabling and Start-up, Intel Malaysia
1205-1330 Lunch
5 36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
6
12 NOVEMBER 2014, WEDNESDAY
1330–1510
Session A1 Ballroom 1
Advanced Packaging Co-Chairs:
Session B1 Ballroom 2
Characterization & Test I Co-Chairs:
Session C1 Ballroom 3
Materials
Co-Chairs:
Session D1 Ballroom 4
Process
Co-Chairs:
1510–1545 Coffee Break / Exhibition
1545–1725
Session A2 Ballroom 1
Advanced Materials Co-Chairs:
Session B2 Ballroom 2
Design
Co-Chairs:
Session C2 Ballroom 3
Pb-free
Technology Co-Chairs:
Session D2 Ballroom 4
Wirebond
Co-Chairs:
1830–2200 Dinner & Cultural Show
1830–1930
PANELIST FORUM IoT: Role of packaging and industry trends Panelists: Mr. Rolf Aschenbrenner, Dr. John Xie, Prof.
Mr. Xavier Baraton, Dr. Byeong Cheon Koh Moderator: Dr. Chee Choong Kooi
1930–1945 BANQUET DINNER ADDRESS
by Dr. Siow Kim Shyong Chairman, IEEE-CPMT Malaysia Chapter
36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
7
13 NOVEMBER 2014, THURSDAY
0815-0855
Keynote Address IV “Innovation in Low Cost Packaging”
by Dr John Yuanlin Xie, Director, Packaging Technology R&D,
Altera Corporation
0855–0935
Keynote Address V “Challenges and Solutions in Modeling of Ultra-Fine
Pitch Microelectronics Packages” by Prof. Andrew A O Tay,
Department of Mechanical Engineering, National University of Singapore
0935–1000 Coffee Break / Exhibition
1020–1200
Session A3 Ballroom 1
Process II
Co-Chairs:
Session B3 Ballroom 2
Characterizati
on & Test II Co-Chairs:
Session C3 Ballroom 3
Wirebond II
Co-Chairs:
Session D3 Ballroom 4
Reliability
Co-Chairs:
1200–1300 Lunch
36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
8
13 NOVEMBER 2014, THURSDAY
1300 – 1420 Session A4 Ballroom 1
Copper Wire
Co-Chairs:
Session B4 Ballroom 2
Interconnect
Co-Chairs:
Session C4 Ballroom 3
Materials II
Co-Chairs:
Session D4 Ballroom 4
Modeling Co-Chairs:
1420 – 1500 Coffee Break / Exhibition / Poster Session II
1500 – 1540 Keynote Address VI “Review of New MEMS Devices and their
Manufacturing Technologies” by Dr. Koh Byeong Cheon ,
Senior Executive Vice President (Retired), Samsung Electro-Mechanics
1540 – 1620 Keynote Address VII “Test Point Selection Method for Mixed Signal
Testing” by Prof. Simon S. Ang,
High Density Electronics Center, University of Arkansas
1620 – 1700 Conference Closing Address “It’s a Small World After All: Recent Advances on Nano-materials and Technologies for Advanced Electronic, Photonics and MEMS Applications”
by Prof. Chin Ping Wong, Dean of the Faculty of Engineering,
The Chinese University of Hong Kong
1700 – 1730 Award Ceremony
36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
9 36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
HOTEL LAYOUT
10 36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
11 36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
12 36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
SEE YOU IN JOHOR BAHRU!
13
Further enquiry, please contact: • Fadzilatul Husna Adnan
([email protected] ), Secretariat • Dr. Tze Yang Hin ([email protected]), Program Chair
36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia