• Panelists presented their companies CURRENT capabilities and highlighted challenges that still need to be addressed

• Audience asked primarily IC design related questions !

• 2.5/3D technology with TSV interconnects allows integration of

entire systems --- as soon as the 2.5/3D Ecosystem is in place: - Standards, die-level building blocks, bottoms-up & top down design flows - Clearly defined hand-off points in manufacturing, COST-effective flows