On the design of a very high resolution DAC at 1 kHz for space applications

Second International Workshop on AMICSA 1/28II DDSS

Integrated Systems Development S.A.

On the design of a very high resolution DAC at 1

kHz for space applications

D. Mitrovgenis, K. Makris, D. Fragopoulos, G. Tsiligiannis, C. Papadas

IIntegrated S Systems DDevelopment (ISD S.A)Athens, GreeceAthens, Greece

2/28II DDSSIntegrated Systems Development S.A.

Second International Workshop on AMICSA

Overview

Context of the project Architecture Radiation and low frequency noise Preliminary results Conclusion



Context of the project The 24-bit Digital-to-Analog data converter is

intended to be suitable for space and is designed using the 0.13um CMOS technology of STM.

The converter will be used by ESA in the Laser Interferometer Space Antenna (LISA) experiment for detecting and observing gravitational waves in the frequency range 10-4 to 10-1 Hz from massive black holes and galactic binaries. This work is supported by an ESA contract.



Key Features The core of the converter is a 3rd order ΣΔ modulator with an internal

multibit quantizer for achieving excellent dynamic performance and monotonic behavior in the range of 0.1 mHz up to 1 kHz.

It supports both serial and 24-bit parallel input format. Target SNR performance ~120 dB at full bandwidth. Programmable Oversampling Ratio for sampling rates of 6 or 12 kHz. Slave I2C for register configuration. Differential current output (0 to 5.84mA). Reference current of internal DAC may be fixed through an external

resistor. 1.2V/3.3V for the digital and analog part respectively. Separate Digital and Analog power down features. Power consumption <70 mW. Cascade of multiple DAC devices by using common biasing signals. This converter can be used as a stand alone device or embedded as an

IP core.



Specifications for radiation tolerance

LET for SEL immunity: ≥ 70 MeV/mg.cm-2

TID tolerance: ≥100 krad

Temperature range (functional) :Temperature range (functional) : -55 °C < T < 125 °C

Temperature range (full performance) :Temperature range (full performance) : 0 °C < T < 50 °C



Architecture

IRP1x2

Dynamic Element Matching

Algorithm (DWA)

I2C slave

Input interface

3rd order ΣΔ modulator

IRP2 x2

IRP3 x2

SINC x32/x16

Matrix Array of 32 current sourcesGeneration of

reference current

Biasing scheme

Differential current output

24-bitdigital input

Thermometer encoded data32

24-bit D/A



Architecture – Digital Part (1/4)

Efficient implementation of the digital interpolation implies using a multi-stage structure (reduced computational complexity) for the filtering, which is inherent in the interpolation procedure.

FIR filters have linear phase and symmetric coefficients (symmetric direct-form topology).

Interpolation filters are designed using a a MAC architecture based on a polyphase implementation, which is optimal for x2 upsampling.

Linear interpolation is achieved by a SINC Filter (x16/x32): Simple HW implementation. Medium attenuation of image replicas.

FIR Equiripple Linear Phase

(IRP1) x2

Half Band(IRP2) x2

Half Band(IRP3) x2

SINC x32 or x16

Fs OSR·Fs




3rd order ΣΔ architecture employing oversampling and quantization noise shaping.

Multi-bit quantization for stability and relaxation of the requirements of the analog post filter.

2 2 110 2

3 2 110log 2 12

N L

L

LDR OSR

L: Order of the ΣΔ modulatorN: Number of quantization bitsOSR: Oversampling Ratio



Architecture – Digital Part (3/4) The modulator under DC

excitation or with very low frequency signals may produce periodic patterns, which give rise to idle tones. The in-band tones will not be

suppressed by the post-reconstruction filter.

• A 19-bit pseudo-random signal generated by a 35-bit Linear Feedback Shift Register (LFSR) is used to break the periodicity of the tones. • This additional random noise will be shaped to higher frequencies by the ΣΔ modulator with negligible SNR degradation.




The inferior linearity of the internal DAC in multibit architectures degrades the overall performance.

The selection of elements is based on the DWA algorithm, which is used so as to suppress in-band harmonic distortion that stems from element mismatch. The DWA circuitry selects the DAC elements in a rotational way, resulting in a first-order shaping of the error due to element mismatch.

The algorithm gives good results for σE ≤ 0.1%.

3

22log

11-2

N

E N

OSRENOB



Architecture - Analog Part (1/6) Matrix of 32 PMOS differential current sources

(correspond to 5-bit DAC). Level shifter for adjustment of digital signals

from 1.2V to 3.3V. Reference current is generated internally and

can be tuned by an external resistor. Appropriate biasing scheme. Low frequency design (because of flicker

noise) is a challenge.



Architecture - Analog Part (2/6)

The Bandgap block is used for generating a stable voltage tolerant to temperature variations. The Low Pass Filter before the amplifier is used to decrease the noise bandwidth of the Bandgap

reference block. The Operational amplifier is biased by a 10uA current in order to generate a fixed reference current

IRef through transistor M1. The reference current can be fixed inside or outside by using an external resistor.

Bandgap1.2V

Iout+ Iout-

RRef

IRef

10uACurrent

Bias

LPF

Rext

LOW NOISE OPAMP

+

-

Array of current sources

M1




The Bandgap and the operational amplifier are low noise designs. The noise from the various blocks is additive and its total amount at the output of the

converter is related to the number of current sources that steer current at a given time. An I/V converter which converts the current (and each noisy component) to voltage

before the later is fed to the reconstruction filter is used in the noise calculations.

BandgapLOW NOISE

OPAMP

+

-

RRef

I/V converter

R2

1:32M2 M3

Vout

IRef Iout1.2VI2n,in

I2n,out

CurrentBias

M1

LPF




The Bandgap reference block provides 1.2V at low temperature coefficient.

Resistors with different temperature coefficient are used for generating the reference voltage.




Low noise and distortion implementation based on a two stage implementation: a differential first stage followed by a push-pull output gain stage.

Large devices are used in the input stage to achieve low noise levels.

The amplifier senses the voltage drop across RRef and fixes the current IRef by biasing appropriately transistor M1.

LOW NOISE OPAMP

+

-

IRef

RRef

M1

1.2V

10 uA Biascurrent



Architecture - Analog Part (6/6) Differential folded cascode PMOS current sources for increased output impedance controlled by a complementary 32-bit signal.

In this Regulated Cascode topology, the drain source voltage of M2 is kept stable for obtaining high overall output impedance against channel length modulation.

This is accomplished by a feedback loop consisting of an amplifier (M4 and M3) and M1 acting as a follower, Increased transistor size for high linearity and decrease of flicker noise. The layout follows the common-centroid technique to avoid systematic errors and achieving better matching.

Amplifier

Follower

M4

M3

M1

M2



For addressing the radiation (1/3)

The design of a radiation-hardened chip follows the general design flow with some manufacturing and design variations that reduce the susceptibility to high-energy subatomic particles and electromagnetic radiation, such as would be encountered in outer space, high-altitude flights or nuclear reactors.

The 0.13 um CMOS technology of STM is qualified for space applications, disposes a Radiation Hardened digital library, whereas it assures small threshold voltage drifts.

Measurements with heavy ions and protons no latchup nor hard fail occurred up to 120 MeV/mg.cm-2

High intrinsic radiation hardness measured with gamma rays. The irradiated chip functionality was 100% at 100 krad (Si) with no over-consumption.



For the digital part the robust cells from the library are used during synthesis.

Moreover: Fault masking by TMR at

FSM level. Synchronous reset.

FSM1

FSM1

FSM2

FSM3

VOTINGSCHEME

control_signal_1control_signal_3

control_signal

VOTINGSCHEME

fsm_state_next_1

fsm_state_next_2

fsm_state_next_3

fsm_state

control_signal D-flip flop




For the analog part: Surrounding each n-channel device with a p+ guard

ring, which cuts any possible radiation induced parasitic path.

Increase the W/L ratio of the transistors, which increases the capacitance and the driving power.

Adding additional capacitances to the most sensitive nodes.

Increase the distance between the p+ diffusion in the well and the n+ in the substrate.

Increase the number of the substrate and well contacts.




For reducing the flicker noise (1/2) Flicker noise is the main limiting factor and affects the

low frequency performance of the device. The flicker noise is mainly generated by the trapping and

releasing of the charge carriers whose time constant is finite and the phenomenon is maybe not accurately modeled by the circuit simulator during current source switching.

For an acceptor like trap:τe=emission timeτc =capture time

Electrical noise and RTS fluctuations in advanced CMOS devicesG. Ghibaudo, T. Boutchacha, Microelectronics Reliability 42 (2002) 573–582



Our strategy is based on: Increasing the device size. Using very low noise biasing schemes. Reducing the time slot for which the current sources

drive current in order to avoid quasi-static phenomena.

For reducing the flicker noise (2/2)



Preliminary results(1/4)

Flicker noise is dominant in low frequencies.




SNR improvement when large devices are

used (flicker noise reduces by increasing

the WL product).




By further improving the bandgap.




SNR results vs temperature at 10-4 Hz.



Output current variation vs temperature

The output current variations are in the order

of uA.



Conclusion

A high resolution Digital to Analog Converter for space application has been presented.

The DAC exhibits more than 120 dB SNR above 0.1 Hz and 80 dB in the 0.1 mHz range.

The DAC exhibits low power characteristics and has a very small footprint about 1 mm2 with pads. Suitable for stand-alone and embedded applications. Multiples instances of the same DAC.



Thank you for your attention !



External filtering considerations

Passband(kHz)

Stopband(kHz)

Stopband Attenuation

Passband Ripple

Filter type Order

1.01 45 100 dB 0.001 dB Chebyshev-II 4

1.01 45 80 dB 0.01 dB Chebyshev-II 3

1.01 45 70 dB 0.01 dB Butterworth 3

The reconstruction filtering (stop-band attenuation, ripple) is related to the content of the application.

An I/V converter should be placed before the continuous time reconstruction filter.

It is desirable for the driven load to exhibit a low pass characteristic.

Analog Part

Differential current output

I/V converterDifferential

voltage output

Low PassReconstruction

Filter

Differentialvoltage output

DAC

OUTP

OUTM

VOUTP

VOUTM

VOUTP

VOUTM

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On the design of a very high resolution DAC at 1 kHz for space applications