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1/7 www.ni.com Opens and Shorts Testing Reference Design Overview This document will discuss the technical details of an opens and shorts test system created in PXI. To learn more about the hardware components, click . To learn more about the software here componen ts, click . here  Although opens and shorts test can be conducted for a wide range of devices, it is most common in semiconductor validation test. This paper will describe, in detail, the process of testing for opens and shorts on a CMOS chip. Before delving in to the technical details of opens and shorts test, we must first understand its relevance with regards to semiconductor validation. Semiconductor validation is generally segmented in two parts, structural and functional. Structural tests ensure that the chip has been built correctly. Functional tests determine whether the chip meets design specifications and performs as intended in its final environment. Opens and shorts test checks for faults in the protection diode circuitry of semiconducto r chips. It is therefore a structural test. The figure below represents a typical CMOS chip. As can be seen, each pin has a network of protection diodes and CMOS transistors. Figure 1: Internal Circuitry of a CMOS Chip CMOS trans istors on each inpu t pin act like switc hes by al lowing c urrent to fl ow from V (supply vo ltage for th e chip) into the D UT circuitry and from the DUT ci rcuitry to V (ground). CMOS DD SS transistors can be damaged if an overvoltage condition is induced at an input or output pin. To protect these devices, two diodes are placed at each signal pin (refer to Figure 1). The first sits betw een th e sign al pin and V and th e seco nd betwee n the s igna l pin a nd V . If a pos itiv e over volta ge gr eate r than V is app lied o n any p in, the V diod e becomes forward-biased , allo wing DD SS DD DD current to flow be tween th e signa l pin and V . Similar ly, if a negative overvoltag e greate r than V is app lied on any pin , the V diode becomes forward-bi ased, al lowing current to flow be tween DD SS SS the V and the si gnal pi n. This wa y, the pro tecti on dio des pre vent da mage to th e CMOS tra nsis tors an d DUT circ uitr y in overv olta ge cond itio ns. Both th e V and V prot ecti on diod e must be SS DD SS tested for open and short conditions to ensure their correct operation. An open condition may occur if a protection diode is missing or is functioning incorrectly. A short condition may occur if a direct connection exists: Between the pin and V DD Between the pin and V SS Between the pin and another signal pin Each of these short-circuit failure modes prevent the correct operation of the device. Opens and shorts test checks for all the aforementioned failure modes. Note: CMOS integrated circuits ar e based on FET tech nology, a nd so ofte n use the V /V terminolo gy for pos itive suppl y voltage /negative supply vo ltage (gro und). These terminals can also be DD SS do cument ed as V /Gnd. CC Section 1: Hardware Setup Test Setup The tes t set up for ope ns and shorts is sepa rate d into two ro utin es: tes ting the V protection diod e and test ing the V protection diode. DD SS Tes ting the V Protec tio n Di ode DD In ord er to det ect an op en or sh ort acr oss the V prote ctio n diod e of a sign al pin , conn ect V , V , and al l othe r signa l pins to SMU gro und an d force a minimal cur rent (i .e. 100 μ A) into t he DD SS DD signal p in. If the V protection diode op erates corr ectly, then it will be come forw ard-biased and the current wil l flow be tween the signal p in and V (see Figu re 2). DD DD : Document Type Tutorial : Yes NI Supported : Oct 10, 2011 Publish Date

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Opens and Shorts Testing Reference Design

Overview

This document will discuss the technical details of an opens and shorts test system created in PXI. To learn more about the hardware components, click . To learn more about the softwarehere

components, click .here

 Although opens and shorts test can be conducted for a wide range of devices, it is most common in semiconductor validation test. This paper will describe, in detail, the process of testing for ope

and shorts on a CMOS chip.

Before delving in to the technical details of opens and shorts test, we must first understand its relevance with regards to semiconductor validation. Semiconductor validation is generally segmente

in two parts, structural and functional. Structural tests ensure that the chip has been built correctly. Functional tests determine whether the chip meets design specifications and performs as

intended in its final environment. Opens and shorts test checks for faults in the protection diode circuitry of semiconductor chips. It is therefore a structural test.

The figure below represents a typical CMOS chip. As can be seen, each pin has a network of protection diodes and CMOS transistors.

Figure 1: Internal Circuitry of a CMOS Chip

CMOS transistors on each input pin act like switches by allowing current to flow from V (supply voltage for the chip) into the DUT circuitry and from the DUT circuitry to V (ground). CMOSDD SS

transistors can be damaged if an overvoltage condition is induced at an input or output pin. To protect these devices, two diodes are placed at each signal pin (refer to Figure 1). The first sits

between the signal pin and V and the second between the signal pin and V . If a positive overvoltage greater than V is applied on any pin, the V diode becomes forward-biased, allowinDD SS DD DD

current to flow between the signal pin and V . Similarly, if a negative overvoltage greater than V is applied on any pin, the V diode becomes forward-biased, allowing current to flow betweDD SS SS

the V and the signal pin. This way, the protection diodes prevent damage to the CMOS transistors and DUT circuitry in overvoltage conditions. Both the V and V protection diode must beSS DD SS

tested for open and short conditions to ensure their correct operation. An open condition may occur if a protection diode is missing or is functioning incorrectly. A short condition may occur if a dir

connection exists:

• Between the pin and VDD

• Between the pin and VSS

• Between the pin and another signal pin

Each of these short-circuit failure modes prevent the correct operation of the device. Opens and shorts test checks for all the aforementioned failure modes.

Note: CMOS integrated circuits are based on FET technology, and so often use the V /V terminology for positive supply voltage /negative supply voltage (ground). These terminals can also DD SS

documented as V /Gnd.CC 

Section 1: Hardware Setup

Test Setup

The test set up for opens and shorts is separated into two routines: testing the V protection diode and testing the V protection diode.DD SS

Testing the V Protection DiodeDD

In order to detect an open or short across the V protection diode of a signal pin, connect V , V , and all other signal pins to SMU ground and force a minimal current (i.e. 100 μA) into theDD SS DD

signal pin. If the V protection diode operates correctly, then it will become forward-biased and the current will flow between the signal pin and V (see Figure 2).DD DD

:Document Type Tutorial

: YesNI Supported

: Oct 10, 2011Publish Date

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Figure 2: Testing the V DiodeDD

By measuring the voltage drop across the forward-biased V diode, we can determine whether it is functioning correctly. If the voltage measured between the signal pin and ground is close to 0DD

(or ground), then there are one or more short-circuits between the signal pin and ground through V , V , and/or another signal pin. If the voltage measured between the signal pin rails or climSS DD

to a potential that is higher than an acceptable forward-biased voltage drop, then there is an open circuit between the signal pin and ground. If the measured voltage is an acceptable

forward-biased voltage drop, then the V protection diode is operating correctly. Table 1 shows an example of V protection diode test results and the resulting pass/fail specifications.DD DD

Voltage Reading at Signal Pin Test Result

Less than +0.2 V Fail: Shorted

In between +0.2 V and +1.5 V Pass

Greater than +1.5 V Fail: Open

Table 1: V Protection Diode Test SpecificationsDD

Note: No current (other than a small amount of leakage current) flows through the V protection diode because it will be reverse-biased.SS

Note: The acceptable forward-biased voltage drop is typically dependent upon the material from which the semiconductor diode is made. However, manufacturing techniques may also be used to

lower the forward-biased voltage drop. The forward-biased voltage drop of a silicon diode is generally accepted to be 0.65 V. The exact voltage drop is dependent on the current flowing through t

diode’s p-n junction, the temperature of the junction, and several physical constants. The relationship between the forward-biased voltage drop, the applied current, and the associated variables is

shown below in Figure 3, commonly known as the diode equation:

 

Figure 3: The Diode Equation

The variables in the diode equation are described below.

ID = Diode current (A)

IS = Saturation current (A)

VD = Voltage drop across diode (V)

N = Ideality coefficient, between 1 and 2 

Vt  = Thermal voltage (V), around 25.85 mV at room temperature

The voltage between the signal pin and ground would be close to 0 V, and the test result would be Fail: Shorted.  If the other signal pins were not all grounded, current would still flow through theforward-biased V protection diode (as shown in Figure 2), and the test result would be Pass.

DD

Testing the V Protection DiodeSS

The process for testing the V diode is the same as that for testing the V diode. All pins including V and V are connected to SMU ground. This time however, a negative current of theSS DD SS DD

same value (i.e. -100 μA) is forced into the signal pin. If the V protection diode operates correctly, it will become forward-biased and current will flow between V and the signal pin (see FigurSS SS

4).

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Figure 4: Testing the V DiodeSS

Note: No current (other than a small amount of leakage current) flows through the V protection diode because it will be reverse-biased.DD

By measuring the voltage drop across the forward-biased V diode, we can determine whether it is functioning correctly. Table 2 shows the test parameters for the V protection diode.DD SS

Voltage Reading at Signal PinTest Result

Greater than -0.2 VFail: Shorted

In between -0.2 V and -1.5 VPass

Less than -1.5 VFail: Open

Table 2: V Diode Test SpecificationsSS

Automated Test Setup

 An external switching system front end and programmable source measure unit can be utilized to automate the V and V protection diode testing. The switching system can scan throughDD SS

pre-configured states, creating the required current and ground paths to the V , V , and signal pins of the semiconductor device. The source measure unit can force the required currents andDD SS

measure the resulting voltages from each signal pin to ground (see Figure 5).

Figure 5: Opens and Shorts Automated Test Setup

The following steps outline the process for conducting opens and shorts test using the automated test equipment shown above:

Step 1: Ground All Pins

In order to connect the SMU to the DUT through the FET switch, a matrix topology is used with pins from the SMU connected to rows in the matrix and pins from the chip connected to columns.

Grounding all pins on the DUT is accomplished by closing all the connections on the matrix that route the ground of the PXI-4130 SMU to the pins on the DUT. Connections from the PXI-4130 S

Low pin to V and V is done directly through a cable instead of through the switch. This is because V and V pins are always connected to the SMU Low pin. While all signal pins areDD SS DD SS

initially connected to SMU Low, they are sequentially connected to the SMU measurement channel and are therefore connected to the SMU through the matrix switch.

It is important to not only connect V and V to ground. All other signal pins should be connected to ground before testing the protection diodes. Grounding all the other signal pins ensures thSS DD

any signal pin-to-signal pin short-circuits is detected. See Figure 6 for further explanation. When a short is detected between two signal pins, the voltage between the pin under test and SMU low

should be outside the acceptable range listed in tables 1 and 2 (ideally 0V) and the test should fail. If the other signal pins were not all grounded, current would still flow through the forward-biase

V protection diode and the test result would be Pass. See Figure 6 below.DD

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Figure 6: Grounding pins is essential for detecting shorts

Step 2: Set a Voltage Clamp on the SMU at 3 V

In order to the limit voltage produced during open circuit conditions, an upper limit voltage clamp is set on the SMU. If no clamp is set and the circuit is open, the SMU will measure a very high

voltage value. This can damage the chip circuitry. On the PXI-4130, the voltage clamp level is set in software to a value of 3 V. 3 V is an acceptable value because it is above the test limit for 

detecting open circuits (1.5V) and is within the specifications of most CMOS chips.

Step 3: Force ±100uA from SMU and Measure the Resulting Voltage

The SMU forces ±100 µA of current into each signal pins’ diodes one at a time and measures the resulting voltage. Each pin is sequentially connected to the SMU via the matrix switch. For this t

a voltage of approximately ±0.65 V (the voltage drop across a forward-biased diode) is expected. The voltage resulting from the forced current is measured and compared to the test specification

tables in order to determine the final test results.

Section 2: Software Setup

The software for this opens and shorts system is developed using NI LabVIEW and NI Switch Executive. LabVIEW is used as the primary Application Development Environment (ADE) while Swit

Executive is used to configure routes on the high-density matrix.

The following software versions were used to implement the Opens and Shorts Semiconductor Test:

LabVIEW 8.5 Graphical Programming Environment

Switch Executive 2.1.1 Switch Management Software

The LabVIEW code described in this document can be downloaded from the link at the end of this document.

Note: Functional blocks in the LabVIEW graphical programming language are known as ‘Virtual Instruments’ or ‘VIs’. The acronym ‘VI’ will therefore be used when describing procedures in this

section.

 As stated previously, the Opens and Shorts Test can be separated into two routines, a) testing the V protection diode, and b) testing the V protection diode. Both routines can be performedDD SS

using the same hardware connections, and the only difference in programming the routines can be as simple as changing the direction of the SMU’s forced current. Due to these similarities, this

document simply outlines an example demonstrating how to test the V protection diode. This test routine can be duplicated and slightly altered to test the V protection diode. Details onSS DD

necessary alterations are provided at the end of the document.

The steps to test the V protection diode are the following:SS

1. Initialize the SMU, configure, and enable the output of the SMU

2. Initialize the switching hardware and connect all DUT pins to ground

3. Iterate through the signal pins using the 544 crosspoint FET matrix:

a. Disconnect the signal pin under test from ground

b. Connect the SMU to the signal pin under test

c. Measure the voltage between the signal pin under test and ground

d. Conduct analysis on voltage measured to determine test result

e. Disconnect the SMU from the signal pin under test

f. Reconnect the signal pin under test to ground

4. Disable the output of the SMU and close the SMU session handle

5. Disconnect all signal pins from the switching hardware and close the NISE session handle

 

Initialize the SMU, configure, and enable the output of the SMU

Initialize, configure, and enable the output of the PXI-4130 SMU using the NI-DCPower API in LabVIEW. Refer to Figure 7 for a picture of the block diagram code.

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Figure 7: Initializing, Configuring, and Enabling the SMU Output in LabVIEW

The SMU’s resource name is fed to the Initialize VI to initialize the SMU and to provide a SMU session handle. The SMU session handle is then passed to all subsequent NI-DCPower VIs. Next

channel 1 of the SMU is configured for DC Current, which is what it will be sourcing to conduct the test. The NI-DCPower configuration VIs can be wired in any order, as long as all the parameters

are set before enabling the SMU output. The parameters that are required to be fed include the current level, the current level range, the voltage limit, and the voltage limit range.

The step following the Initialize VI is the niDCPower property node. This step instructs the SMU to automatically determine and set current level and voltage limit ranges based on the current leve

and voltage limit inputs. The VI following the property node confirms that the SMU is to be used in DC Current mode. Next, the current level is set to -100 μA (to test the V protection diode,SS

channel 1 is configured such that the current flows into the SMU and the V protection diode is forward-biased), and the voltage limit, or voltage clamp, is set to 3 V (equivalent to ±3 V).SS

Lastly, a Boolean true inputted to the Configure Output Enabled VI enables the output of the SMU, committing the configuration parameters to the device and commencing the -100 μA flow of 

current through channel 1 of the SMU.

Initialize the switching hardware and connect all DUT pins to ground

Initialize the switching hardware and set it to a state where V , V , and all the DUT’s signal pins are connected to ground. There are multiple ways to control switches using LabVIEW, but theDD SS

best way to program switching hardware as a system is with the NI Switch Executive API. Refer to Figure 8 for a picture of the block diagram code.

Figure 8: Initialize the Switching Hardware and Connect all the DUT Pins to Ground

The NI Switch Executive (NISE) Virtual Device Name is inputted to the Open Session VI to open session handles to all the switches in the system. NI Switch Executive stores these session

handles in one NISE session handle that is passed to all subsequent NISE VIs. The ‘Disconnect All’ VI disconnects all connections on every switch device managed by the NI Switch Executive

session, thereby setting the switch system configuration in a known state where no switch routes are connected. Lastly, all routes in the GND to DUT route group are connected, which results in

the switching hardware being set to a state where V , V , and all the DUT’s signal pins are connected to ground.DD SS

To learn more about what an NI Switch Executive Virtual Device is and how to create one, view the 7-minute NI Switch Executive demo which is linked at the end of this document.

Iterate through the signal pins, testing one at a time

Iterate through the DUT signal pins using a LabVIEW ‘For Loop’. Within the ‘For Loop’, use NI Switch Executive VIs to disconnect the DUT signal pin under test from ground and to connect the

DUT signal pin under test to channel 1 of the SMU. Use NI-DCPower VIs to measure the voltage from each DUT signal pin to ground. Before moving on to the next iteration of the For Loop,

disconnect the DUT signal pin under test from channel 1 of the SMU and reconnect it to ground (see Figure 9).

Figure 9: Disconnect GND, Connect SMU, Measure, Disconnect SMU, and Reconnect GND

In the above figure, we:

a. Disconnect the signal pin under test from ground

b. Connect the SMU to the signal pin under test

c. Measure the voltage between the signal pin under test and ground

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d. Determine test result based on the voltage measurement

e. Disconnect the SMU from the DUT signal pin under test

f. Reconnect the DUT signal pin under test to ground

The process of disconnecting and reconnecting of DUT signal pins is done using route groups which are created in NI Switch Executive. Route Groups are used to put the switch matrix in to a

desired state. To learn more about what a route group is and how to create one view the 7-minute NI Switch Executive demo linked at the end of this document. The first route group contains

routes connecting the DUT signal pins to ground, and the second route group contains routes connecting the DUT signal pins to channel 1 of the SMU (see Figure 10).

Figure 10: Set up Route Groups to Simplify Indexing the Correct DUT Signal Pin

Next, the NI Switch Executive configuration API in LabVIEW, which provides full programmatic access to all NI Switch Executive features, is used to extract individual route names from all route

groups. The result will be two string arrays comprised of the routes from Route Group 1 and Route Group 2 (see Figure 11).

Figure 11: Array Output Using NI Switch Executive Configuration API

Passing these arrays into a For Loop will automatically index the arrays. For example, on the first iteration of the loop, the indexed routes to be connected and disconnected inside the loop are

and . On the second iteration of the loop, the indexed routes are andDUT_Signal_Pin0_to_GND DUT_Signal_Pin0_to_SMU_Channel1 DUT_Signal_Pin1_to_GND

. This will continue until the arrays have indexed each element. You are not restricted to this naming scheme. You can enter your specific array names in DUT_Signal_Pin1_to_SMU_Channel1

the ‘Route Group 1’ and ‘Route Group 2’ control fields of the ‘Switch Exec for OS’ VI.

Based on the pass/fail specifications of the DUT, determine if the voltage measurement indicates the V protection diode on the DUT signal pin under test has passed, failed open, or failedSS

because of a short-circuit (see Figure 12).

Figure 12: Determine Test Result Based on the Voltage Measurement

 After making the voltage measurement and determining the test result, disconnect channel 1 of the SMU from the DUT signal pin under test and reconnect the pin under test to ground.

Disable the output of the SMU and close the SMU session handle

Use NI-DCPower VIs to disable the output of the SMU and close the SMU session handle. Refer to Figure 13 for a picture of the block diagram code.

Figure 13: Disable the SMU Output and Close the SMU Session Handle

 A Boolean false inputted to the Configure Output Enabled VI disables the output of the SMU, ceasing the -100 μA flow of current through channel 1. The Close VI closes the SMU session handle

and reallocates the SMU resources that were previously reserved.

Note: If power output is still enabled when you call the Close VI, channel 1 will remain in its current state and continue sinking current.

Disconnect all signal pins from the switching hardware and close the NISE session handle

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Use NI Switch Executive VIs to disconnect V , V , and the remainder of the signal pins from the switching hardware and close the NISE session handle. Refer to Figure 14 for a picture of theDD SS

block diagram code.

Figure 14: Disconnect All Signal Pins and Close the NISE Session Handle

The Disconnect All VI once again disconnects all connections on every switch device managed by the NI Switch Executive session, thereby setting the switch system configuration in a known sta

where no switch routes are connected. The Close Session VI closes session handles to all the switches in the system. Although not required, it is often helpful to include an error handler. If an er

occurs, the VI returns a description of the error and optionally displays a dialog box with the error information.

Modifying the Code to Test the V protection diodeDD

To modify the V protection diode test, the SMU must first be disabled, and then the configuration should be changed to force 100 μA instead of -100 μA on channel 1 before re-enabling theSS

SMU. The For Loop can perform the exact same connections and disconnections, taking measurements and determining the test results.

Combining the V and V protection diode testsSS DD

Determining the final result for each DUT signal pin can be done by combining the results of the V and V protection diode tests. A final result of pass can only be determined if both protectSS DD

diodes pass their respective tests. There are multiple methods to display test results, including but not limited to a) passing Booleans into an LED array, and b) formatting and displaying string

clusters in an array.

Links:

1. DC Parametric Semiconductor Test Reference Design

2. Opens and Shorts Testing: Hardware Components

3. Opens and Shorts Testing: Software Components

4. NI PXI-4130 Power SMU

5. NI PXI-2535 FET Switch

6. Switch Executive demonstration video

Downloads

opens_shorts_solution.zip

 

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